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KR960005967A - 세라믹기판제조용 소결체, 세라믹기판 및 그 제조방법 - Google Patents

세라믹기판제조용 소결체, 세라믹기판 및 그 제조방법 Download PDF

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KR960005967A
KR960005967A KR1019950017531A KR19950017531A KR960005967A KR 960005967 A KR960005967 A KR 960005967A KR 1019950017531 A KR1019950017531 A KR 1019950017531A KR 19950017531 A KR19950017531 A KR 19950017531A KR 960005967 A KR960005967 A KR 960005967A
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sintered body
ceramic substrate
manufacturing
axis
metal
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KR1019950017531A
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KR0185462B1 (ko
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미찌오 호리우찌
유끼하루 타께우찌
요이찌 하라야마
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이노우에 사다오
신꼬오 덴기 고오교오 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

[목적] 바이어의 위치 정밀가 좋고, 기판의 휨등을 해소할 수 가 있으며, 또 생산성이 우수한 세라믹 기판제조용 소결체 및 세라믹 기판을 제공한다
[구성]기둥형상의 소결체(26)로서 내부에 그 축선에 평행한 금속배선체 (12)를 갖는 것을 특징으로 하고 있다.
또 이 금속 배선체(12)는 상기 소결체(26)의 소결처리 온도보다도 낮은 융점을 갖는 금속으로 된 것을 특징으로 하고 있다.

Description

세라믹기판제조용 소결체, 세라믹기판 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예1의 미소성체 성형방법을 나타내는 설명도이다.
제2도는 상기 성형체의 금속선재 절단후 카버용 슬러리를 가한 상태의 설명도이다.
제3도는 또 다른 단며에도 세라막 미소성물로 피복한 미소성체의 설명도이다.
제4도는 상기 미소성체를 소성하여 얻어진 세라믹 기판제조용 소결체의 설명도이다.

Claims (12)

  1. 기둥형상의 소결체로서 내부에 그 축선에 평행한 금속배선체를 갖는 것을 특징으로 하는 세라믹기판제조용 소결체.
  2. 제1항에 있어서, 축선에 평행한 관통구멍을 갖는 것을 특징으로 하는 세라믹기판제조용 소결체.
  3. 제1항 또는 제2항에 있어서, 금속배선체는 상기 소결체의 소성온도보다도 낮은 융점을 갖는 금속으로 된 것을 특징으로 하는 세라믹기판제조용 소결체.
  4. 제1항,제2항 또는 제3항에 있어서, 금속배선체는 상기 소결체의 표면에 노출되지 않은 것을 특징으로 하는 세라믹기판제조용 소결체.
  5. 제1항,제2항,제3항, 또는 제4항에 있어서, 금속배선체는 동, 금, 은, 알루미늄 또는 이들중의 어느것 1종 이상을 주성분으로 하는 것을 특징으로 하는 세라믹기판제조용 소결체.
  6. 제1항,제2항,제3항,제4항 또는 제5항에 있어서, 기둥형상의 소결체는 원기둥형상 또는 각기둥형상을 갖는 것을 특징으로 하는 세라믹기판제조용 소결체.
  7. 제1항,제2항,제3항,제4항, 제5항 또는 제6항에 있어서, 기둥형상의 소결체는 아루미나세라믹, 질화알루미늄세라믹, 뮤라이트세라믹, 저온소성세라믹중의 어느 세라믹으로 된 것을 특징으로 하는 세라믹기판제조용 소결체.
  8. 제1항,제2항,제3항,제4항, 제5항,제6항 또는 제7항의 세라믹기판제조용 소결체를 그 축선에 수직한 방향으로 부터 필요한 두께로 절단형 표면에 금속배선체가 노출되는 판상으로 형성한 것을 특징으로 한 세라믹기판.
  9. 세라믹으로 된 소결체의 소성온도보다도 낮은 융점을 갖는 금속으로 된 금속선재를 내부에 그 축선에 평행하게 매설한 기둥형상의 미소성체를 성형하고, 이 미소성체를 소성하여 소결체로 한 후, 이 소결체를 그 축선에 수직한 방향으로부터 필요한 두께로 절단하는 것을 특징으로 하는 세라믹기판의 제조방법.
  10. 세라믹으로 된 소결체의 소성온도보다도 낮은 융점을 갖는 금속으로 된 금속선재를 내부에 그 축선에 평행하게 매설함과 동시에, 상기 축선에 평행하게 관통구멍을 형성한기둥형상의 미소성체를 성형하고, 이 미소성체를 소성하여 소결체로 한 후, 이 소결체를 그 축선에 수직한 방향으로부터 필요한 두께로 절단하는 것을 특징으로 하는 세라믹기판의 제조방법.
  11. 제9항 또는 제10항에 있어서, 미소성체를 유기바인더를 사용하지 않은 세라믹 슬러리에 의해 성형하는 것을 특징으로 하는 세라믹기판의 제조방법.
  12. 제9항 또는 제10항에 있어서, 금속선재가 알루미늄 또는 알루미늄을 주성분으로 한 금속으로 된 미소성체를 대기중에서 소성하는 것을 특징으로 하는 세라믹기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950017531A 1994-07-01 1995-06-26 세라믹기판 제조용 소결체, 세라믹기판 및 그 제조방법 KR0185462B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP15082594 1994-07-01
JP94-150825 1994-07-01
JP03350895A JP3483012B2 (ja) 1994-07-01 1995-02-22 セラミック基板製造用焼結体、セラミック基板およびその製造方法
JP95-033508 1995-02-22

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KR960005967A true KR960005967A (ko) 1996-02-23
KR0185462B1 KR0185462B1 (ko) 1999-03-20

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Country Link
US (1) US5997999A (ko)
EP (2) EP0690505B1 (ko)
JP (1) JP3483012B2 (ko)
KR (1) KR0185462B1 (ko)
DE (1) DE69526286T2 (ko)

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KR100482960B1 (ko) * 2002-07-27 2005-04-18 난야 플라스틱스 코오퍼레이션 탄성을 지닌 극세 섬유 텍스쳐드 얀의 제조 방법
KR100616188B1 (ko) * 2000-07-26 2006-08-25 주식회사 휴비스 폴리에스테르 공중합체 및 그 제조방법
KR20210117123A (ko) * 2020-03-13 2021-09-28 홍 추앙 어플라이드 테크놀로지 컴퍼니 리미티드 질화알루미늄 웨이퍼의 제조 방법 및 그 질화알루미늄 웨이퍼

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US7480988B2 (en) * 2001-03-30 2009-01-27 Second Sight Medical Products, Inc. Method and apparatus for providing hermetic electrical feedthrough
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JP2012019108A (ja) * 2010-07-08 2012-01-26 Seiko Instruments Inc ガラス基板の製造方法及び電子部品の製造方法
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JP2012238841A (ja) 2011-04-27 2012-12-06 Taiyo Yuden Co Ltd 磁性材料及びコイル部品
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JP5048155B1 (ja) 2011-08-05 2012-10-17 太陽誘電株式会社 積層インダクタ
JP5082002B1 (ja) 2011-08-26 2012-11-28 太陽誘電株式会社 磁性材料およびコイル部品
JP6012960B2 (ja) 2011-12-15 2016-10-25 太陽誘電株式会社 コイル型電子部品
JP7378210B2 (ja) * 2019-01-17 2023-11-13 新光電気工業株式会社 セラミック部材の製造方法
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DE69526286T2 (de) 2002-10-10
JP3483012B2 (ja) 2004-01-06
US5997999A (en) 1999-12-07
EP0690505A2 (en) 1996-01-03
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EP1005088A1 (en) 2000-05-31

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