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KR950026319A - 혼성집적회로 장치 - Google Patents

혼성집적회로 장치 Download PDF

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Publication number
KR950026319A
KR950026319A KR1019950002243A KR19950002243A KR950026319A KR 950026319 A KR950026319 A KR 950026319A KR 1019950002243 A KR1019950002243 A KR 1019950002243A KR 19950002243 A KR19950002243 A KR 19950002243A KR 950026319 A KR950026319 A KR 950026319A
Authority
KR
South Korea
Prior art keywords
integrated circuit
hybrid integrated
circuit device
opening
ring
Prior art date
Application number
KR1019950002243A
Other languages
English (en)
Other versions
KR0171460B1 (ko
Inventor
가쓰노리 다나카
Original Assignee
기타오카 다카시
미쓰비시덴키 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 기타오카 다카시, 미쓰비시덴키 가부시기가이샤 filed Critical 기타오카 다카시
Publication of KR950026319A publication Critical patent/KR950026319A/ko
Application granted granted Critical
Publication of KR0171460B1 publication Critical patent/KR0171460B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

혼성집적회로장치는, 집적회로기판에 실장된 기능소자를 둘러싸고 있는 링에 보호용수지를 주입함으로, 그리고 보호용수지를 덮기위한 열린덮개로서 링의 개구보에 각종형의 개구를 구비한 천정틀을 설치함으로 구성되었다.

Description

혼성집적회로 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 실시예1에 의한 혼성집적회로장치를 나타내는 외관사시도,
제5도는 제4도의 종단측면도,
제6도는 이 발명의 실시예2에 의한 혼성집적회로장치를 나타내는 외관사시도,
제11도는 이 발명의 실시예 3에 의한 혼성집적회로장치를 나타내는 외관사시도,
제13도는 이 발명의 실시예4을 나타내는 레규러케이스(reqularcase)의 정면도.

Claims (7)

  1. 외부단자를 배치하고, 기능소자를 장치한 집적회로기판과, 이 집적회로기판상에 상기 기능소자를 둘러싸도록 설치한 링과, 기능소자를 덮도록 상기 링내에 충전된 보호용 수지로된 혼성집적회로장치에 있어서, 상기 링의개구부에 열린덮개를 구비한 것을 특징으로한 혼성집적회로장치.
  2. 제1항에 있어서, 상기 열린덮개는 복수의 다각형개구가 있는 천정틀인것을 특징으로 하는 혼성집적회로장치.
  3. 제2항에 있어서, 상기 다각형개구는 삼각형개구인 것을 특징으로 하는 혼성집적회로장치.
  4. 제2항에 있어서, 상기 다각형개구는 직사각형개구인 것을 특징으로 하는 혼성집적회로장치.
  5. 제1항에 있어서, 상기 열린덮개는 복수의 원형 또는 타원형개구로 구성된 천정틀인것을 특징으로 하는 혼성집적회로장치.
  6. 제1항에 있어서, 상기 열린덮개는 상기 링과 일체로 형성된 것을 특징으로 하는 혼성집적회로장치.
  7. 제1항에 있어서, 상기 장치는 차량용전압조정기의 케이스에 수지로 밀봉된 것을 특징으로 하는 혼성집적회로장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950002243A 1994-02-16 1995-02-08 혼성집적회로장치 KR0171460B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-019435 1994-02-16
JP6019435A JPH07231176A (ja) 1994-02-16 1994-02-16 混成集積回路装置

Publications (2)

Publication Number Publication Date
KR950026319A true KR950026319A (ko) 1995-09-18
KR0171460B1 KR0171460B1 (ko) 1999-05-01

Family

ID=11999217

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950002243A KR0171460B1 (ko) 1994-02-16 1995-02-08 혼성집적회로장치

Country Status (3)

Country Link
US (1) US5473191A (ko)
JP (1) JPH07231176A (ko)
KR (1) KR0171460B1 (ko)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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JP3575110B2 (ja) * 1995-06-06 2004-10-13 株式会社デンソー 車両用交流発電機
US5744860A (en) * 1996-02-06 1998-04-28 Asea Brown Boveri Ag Power semiconductor module
JPH10136697A (ja) * 1996-10-29 1998-05-22 Mitsubishi Electric Corp 車両用発電機の制御装置
US6137671A (en) * 1998-01-29 2000-10-24 Energenius, Inc. Embedded energy storage device
GB9818474D0 (en) * 1998-08-26 1998-10-21 Hughes John E Multi-layer interconnect package for optical devices & standard semiconductor chips
JP3395164B2 (ja) * 1998-11-05 2003-04-07 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体装置
US7130198B2 (en) * 2001-12-06 2006-10-31 Rohm Co., Ltd. Resin-packaged protection circuit module for rechargeable batteries and method of making the same
US7629674B1 (en) 2004-11-17 2009-12-08 Amkor Technology, Inc. Shielded package having shield fence
US7342303B1 (en) 2006-02-28 2008-03-11 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
US7898066B1 (en) 2007-05-25 2011-03-01 Amkor Technology, Inc. Semiconductor device having EMI shielding and method therefor
JP2009009957A (ja) * 2007-06-26 2009-01-15 Nec Electronics Corp 半導体装置
US7745910B1 (en) 2007-07-10 2010-06-29 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
US8008753B1 (en) 2008-04-22 2011-08-30 Amkor Technology, Inc. System and method to reduce shorting of radio frequency (RF) shielding
US7915715B2 (en) * 2008-11-25 2011-03-29 Amkor Technology, Inc. System and method to provide RF shielding for a MEMS microphone package
US8129824B1 (en) 2008-12-03 2012-03-06 Amkor Technology, Inc. Shielding for a semiconductor package
US8102032B1 (en) 2008-12-09 2012-01-24 Amkor Technology, Inc. System and method for compartmental shielding of stacked packages
US8012868B1 (en) 2008-12-15 2011-09-06 Amkor Technology Inc Semiconductor device having EMI shielding and method therefor
US7851894B1 (en) 2008-12-23 2010-12-14 Amkor Technology, Inc. System and method for shielding of package on package (PoP) assemblies
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8093691B1 (en) 2009-07-14 2012-01-10 Amkor Technology, Inc. System and method for RF shielding of a semiconductor package
US8362598B2 (en) * 2009-08-26 2013-01-29 Amkor Technology Inc Semiconductor device with electromagnetic interference shielding
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
US8946886B1 (en) 2010-05-13 2015-02-03 Amkor Technology, Inc. Shielded electronic component package and method
US8508023B1 (en) 2010-06-17 2013-08-13 Amkor Technology, Inc. System and method for lowering contact resistance of the radio frequency (RF) shield to ground
US9196588B2 (en) * 2011-11-04 2015-11-24 Invensas Corporation EMI shield
JP6228526B2 (ja) * 2014-09-29 2017-11-08 株式会社クボタ 電子制御装置、並びにその取り付け方法とその製造方法
US10177095B2 (en) 2017-03-24 2019-01-08 Amkor Technology, Inc. Semiconductor device and method of manufacturing thereof
US10497650B2 (en) 2017-04-13 2019-12-03 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1549762A (en) * 1975-05-21 1979-08-08 Tba Industrial Products Ltd Unsaturated polyester resin compositions
JPS63117454A (ja) * 1986-11-06 1988-05-21 Fujitsu Ltd 混成集積回路

Also Published As

Publication number Publication date
US5473191A (en) 1995-12-05
KR0171460B1 (ko) 1999-05-01
JPH07231176A (ja) 1995-08-29

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