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KR930020629A - 프로우브 장치 - Google Patents

프로우브 장치 Download PDF

Info

Publication number
KR930020629A
KR930020629A KR1019930004495A KR930004495A KR930020629A KR 930020629 A KR930020629 A KR 930020629A KR 1019930004495 A KR1019930004495 A KR 1019930004495A KR 930004495 A KR930004495 A KR 930004495A KR 930020629 A KR930020629 A KR 930020629A
Authority
KR
South Korea
Prior art keywords
optical system
contact means
contact
system member
image
Prior art date
Application number
KR1019930004495A
Other languages
English (en)
Korean (ko)
Inventor
시게오키 모리
게이이치 요코다
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR930020629A publication Critical patent/KR930020629A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1019930004495A 1992-03-23 1993-03-23 프로우브 장치 KR930020629A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP92-95908 1992-03-23
JP9590892 1992-03-23
JP92-290787 1992-10-05
JP29078792A JP3173676B2 (ja) 1992-03-23 1992-10-05 プローブ装置

Publications (1)

Publication Number Publication Date
KR930020629A true KR930020629A (ko) 1993-10-20

Family

ID=14150396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930004495A KR930020629A (ko) 1992-03-23 1993-03-23 프로우브 장치

Country Status (3)

Country Link
JP (1) JP3173676B2 (ja)
KR (1) KR930020629A (ja)
TW (1) TW247967B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4713763B2 (ja) * 2000-05-18 2011-06-29 株式会社アドバンテスト プローブの位置ずれ検出方法・プローブの位置決定方法・プローブの位置ずれ検出装置・プローブの位置決定装置
WO2007032077A1 (ja) * 2005-09-15 2007-03-22 Advantest Corporation Ｔｃｐハンドリング装置
JP4606319B2 (ja) * 2005-12-19 2011-01-05 日東電工株式会社 復旧支援装置
JP2011075450A (ja) * 2009-09-30 2011-04-14 Hitachi High-Tech Instruments Co Ltd 特性検査装置及びテーピング装置
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI674413B (zh) * 2018-10-31 2019-10-11 致茂電子股份有限公司 探針對準設備
JP7218909B2 (ja) * 2019-05-09 2023-02-07 株式会社昭和真空 プローブピン位置合せ装置及びプローブピン位置合せ装置を使用した電子デバイスの製造方法
US11262401B2 (en) * 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station
US11821912B2 (en) * 2020-05-29 2023-11-21 Formfactor, Inc. Methods of producing augmented probe system images and associated probe systems
JP7477393B2 (ja) * 2020-08-03 2024-05-01 株式会社日本マイクロニクス 検査用接続装置
JP2023097019A (ja) * 2021-12-27 2023-07-07 東京エレクトロン株式会社 検査装置及び検査方法

Also Published As

Publication number Publication date
TW247967B (ja) 1995-05-21
JPH05326675A (ja) 1993-12-10
JP3173676B2 (ja) 2001-06-04

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application