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KR930000703B1 - Thermal recording element - Google Patents

Thermal recording element Download PDF

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Publication number
KR930000703B1
KR930000703B1 KR1019900005590A KR900005590A KR930000703B1 KR 930000703 B1 KR930000703 B1 KR 930000703B1 KR 1019900005590 A KR1019900005590 A KR 1019900005590A KR 900005590 A KR900005590 A KR 900005590A KR 930000703 B1 KR930000703 B1 KR 930000703B1
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South Korea
Prior art keywords
integrated circuit
thin film
circuit board
wiring
printed circuit
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KR1019900005590A
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Korean (ko)
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KR910019179A (en
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홍은탁
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삼성전자 주식회사
정용문
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Priority to KR1019900005590A priority Critical patent/KR930000703B1/en
Publication of KR910019179A publication Critical patent/KR910019179A/en
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Publication of KR930000703B1 publication Critical patent/KR930000703B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/32—Circuits or arrangements for control or supervision between transmitter and receiver or between image input and image output device, e.g. between a still-image camera and its memory or between a still-image camera and a printer device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electronic Switches (AREA)

Abstract

The compact thermal head comprises a thin film layer (64) composing of a heating resistor (61), connector (62), and common line (63), ICS (67) driving the heating resistor, and PCB (65). The thin film layer and the PCB are placed on the top of a heat sink (66). The ICs are formed in row on the PCB to connect between the input electrode pad of the IC and the connector pad of the PCB with gold wires (69-71).

Description

감열기록소자의 조립방법Assembly method of thermal recording element

제1도는 감열기록소자의 전기적 등가 회로도.1 is an electrical equivalent circuit diagram of a thermal recording element.

제2도는 종래의 조립방법에 따른 감열기록소자의 단면도.2 is a cross-sectional view of a thermal recording element according to a conventional assembly method.

제3도는 본 발명에 따른 감열기록소자의 단면도.3 is a cross-sectional view of a thermal recording element according to the present invention.

제4도는 본 발명에 따른 감열기록소자의 사시도.4 is a perspective view of a thermal recording element according to the present invention.

본 발명은 감열기록소자의 조립 방법에 관한 것으로 특히 상기 감열기록소자를 구동시키기 위한 구동직접회로와 신호와 전력을 공급하기 위한 인쇄회로기판사이의 조립 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling a thermal recording element, and more particularly, to an assembly method between a driving direct circuit for driving the thermal recording element and a printed circuit board for supplying signals and power.

감열기록소자는 감열 및 열전사기록등에 사용되는 소자로서, 유리질이 도포된 알루미나 절연기판 또는 세라믹 기판상에 발열저항체열과 배선부를 구비하여 완성된 박막공정품과 신호와 전력을 공급하기 위한 인쇄회로기판을, 열을 방출하기 위한 방열판 상부면에 접착시키고, 상기 인쇄회로기판 상부면 또는 상기 박막공정품 상부면에 상기 발열저항체열을 구동시키기 위한 구동집적회로(Driver IC)를 탑재한 후 상기 박막공정품과 인쇄회로기판 및 구동집적회로 사이에 전기적인 연결을 함으로써 완성된다.The thermosensitive recording element is a device used for thermosensitive and thermal transfer recording. It is a thin film process product and a printed circuit board for supplying signals and power by providing a heating resistor string and wiring on a glass-coated alumina insulating substrate or ceramic substrate. Is bonded to an upper surface of a heat sink for dissipating heat, and a driver IC is mounted on the upper surface of the printed circuit board or the upper surface of the thin film process product to mount the driver IC. The electrical connection between the original product and the printed circuit board and the driving integrated circuit is completed.

상기 감열기록소자는 인쇄회로기판으로 입력되는 신호에 의해 상기 구동집적회로가 선택적인 스위칭(switching) 동작을 하여 상기 발열저항체열중의 선택된 발열저항체를 발열시키고, 상기 발열저항체로 부터 발생된 열이 감열지를 검게 변색시킴으로써 인쇄가 이루어지도록 하는 것이고, 발열저항체에서 발생하는 열을 매개로 하여 디지탈 신호를 화상신호화하는 소자이다.The thermal recording element generates a selected heating resistor in the heating resistor circuit by selectively switching the driving integrated circuit by a signal input to a printed circuit board, and generates heat generated by the heating resistor. Is a device for printing a digital signal by converting the color into black and converting a digital signal into an image signal through heat generated by the heat generating resistor.

감열기록소자의 보다 상세한 동작 설명을 위해 전기적 등가회로를 참조하여 살펴보기로 한다.For a more detailed description of the operation of the thermal recording element, it will be described with reference to an electrical equivalent circuit.

제1도는 감열기록소자의 전기적 등가회로도이다.1 is an electrical equivalent circuit diagram of a thermal recording element.

상기 제1도에서 보는 바와 같이 발열저항체열(1)과, 상기 발열저항체열을 구동시키기 위한 구동집적회로(2)를 구비하는 박막공정품부분(3)과, 상기 구동집적회로 (2)와 상기 발열저항체열(1)에 각각 신호와 전력을 공급하기 위한 인쇄회로기판 부분 (4)으로 구성되어 있다.As shown in FIG. 1, a thin film process part 3 having a heat generating resistor column 1, a drive integrated circuit 2 for driving the heat generating resistor column, the drive integrated circuit 2, And a printed circuit board portion 4 for supplying signals and power to the heat generating resistor columns 1, respectively.

상기 인쇄회로기판(4)에 인가되는 전원과 디지탈 신호(5)는 상기 인쇄회로기판 (4) 내부의 배선연결에 따라 각각의 구동집적회로(2)로 분배되고, 상기 박막공정품(3)의 공통배선(7)으로는 24V의 전원(6)이 인가되어지므로, 상기 각각의 발열저항체(1)는 모두 24V의 전원이 인가되어지게 한다. 그러나 상기 구동집적회로(2)의 스위칭 동작에 의해 선택된 비트에 연결된 발열저항체만 구동되어 발열되게 됨에 따라 상기 발열된 위치에 대응되는 감열지상에 인쇄가 이루어진다.The power applied to the printed circuit board 4 and the digital signal 5 are distributed to the respective driving integrated circuits 2 according to the wiring connection inside the printed circuit board 4, and the thin film process product 3 Since the power supply 6 of 24V is applied to the common wiring 7, the power supply of 24V is supplied to each of the heating resistors 1. However, as only the heating resistor connected to the selected bit is driven by the switching operation of the driving integrated circuit 2 to generate heat, printing is performed on the thermal paper corresponding to the generated heat.

상기 제1도에서와 같이 구동집적회로를 박막공정품에 탑재할 경우, 박막공정품의 평활도가 뛰어나 구동집적회로의 실장 수율이 증가하고, 상기 구동집적회로의 실장수율과 직접적으로 연관되는 금선연결의 공정수율도 증가한다.As shown in FIG. 1, when the driving integrated circuit is mounted on the thin film process product, the flatness of the thin film process product is excellent, thereby increasing the mounting yield of the driving integrated circuit and directly connecting the mounting yield of the driving integrated circuit. The process yield also increases.

상기 제1도의 A-A선을 절단한 단면도를 살펴보기로 한다.A cross-sectional view taken along line A-A of FIG. 1 will be described.

제2도는 종래의 조립방법에 따른 감열기록소자의 단면도이다.2 is a cross-sectional view of a thermal recording element according to a conventional assembly method.

상기 제2도에서 보는 바와 같이 종래의 감열기록소자는, 열을 방출하기 위한 방열판(20) 상부면에 알루미나 절연기판(21)과 박막 인쇄회로기판(film PCB)을 지지하기 위한 기판(22)이 탑재되어 있고, 상기 알루미나 절연기판(21) 상부 전면에는 유리질층(23)과 저항막(24)과 배선막(25)을 순차적으로 형성한 후 상기 배선막(25)의 소정 영역을 식각하여 발열저항체(36)를 형성함과 동시에 구동집적회로가 탑재될 소정영역 (35)을, 상기 유리질층(23)이 드러날때까지 식각한다. 그 다음 상기 발열저항체(36)의 노출된 상부면과, 상기 발열저항체(36)와 인접한 배선막(25) 상부면에 보호막(26)을 도포하고, 상기 보호막(26)이 도포되지 않은 배선막(25) 상부면에는 상기 배선막(25)을 보호하기 위한 솔더 레지스터(Solder Resist)(27)를 도포한다. 그리고 상기 소정 영역(35)에 구동집적회로(28)를 탑재한 후 상기 구동집적회로(28)의 입.출력 전극패드와 상기 배선부(25)사이의 전기적 연결을 위해 와이어 본딩(wire bonding ; 금선연결) (29)을 하고 나서 상기 구동집적회로(28)와 와이어 본딩에 의한 금선을 보호하기 위해 1차 수지(Resin)(30)와 2차 수지(31)를 순차적으로 형성한 다음, 상기 구동집적회로 (28)의 입력 배선이 형성된 배선막(25)의 가장자리에 연결되는 박막 인쇄회로기판 (film PCB)(32)을 형성한 후, 상기 배선막(25)의 가장자리(33)와 박막 인쇄회로기판 (32)을 납땜하여, 상기 구동집적회로와 발열저항체 사이를 전기적으로 연결함으로써 완성된다.As shown in FIG. 2, the conventional thermal recording element includes a substrate 22 for supporting an alumina insulating substrate 21 and a thin film printed circuit board (PCB) on an upper surface of a heat sink 20 for dissipating heat. And a glassy layer 23, a resistance film 24, and a wiring film 25 are sequentially formed on the entire upper surface of the alumina insulating substrate 21, and then a predetermined region of the wiring film 25 is etched. While forming the heat generating resistor 36, the predetermined region 35 on which the driving integrated circuit is to be mounted is etched until the vitreous layer 23 is exposed. Then, a protective film 26 is applied to the exposed upper surface of the heating resistor 36 and the upper surface of the wiring film 25 adjacent to the heating resistor 36, and the wiring film on which the protective film 26 is not coated. (25) A solder resist 27 is applied to the upper surface to protect the wiring layer 25. A wire bonding for mounting the drive integrated circuit 28 in the predetermined region 35 and for electrical connection between the input / output electrode pads of the drive integrated circuit 28 and the wiring unit 25; (29) and then sequentially forming a primary resin (30) and a secondary resin (31) in order to protect the driving integrated circuit (28) and the gold wire by wire bonding. After forming a thin film PCB 32 connected to an edge of the wiring film 25 on which the input wiring of the driving integrated circuit 28 is formed, the edge 33 and the thin film of the wiring film 25 are formed. The soldering of the printed circuit board 32 is completed by electrically connecting the drive integrated circuit and the heat generating resistor.

상기 배선막(25)의 가장자리(33)의 막 인쇄회로기판 상부에 납땜 대신 압력을 가함으로써 접착시켜 전기적 연결을 구현하는 방법도 있다. 그러나 후자의 방법에 의한 감열기록소자의 구조도 상기 제2도와 동일하다.There is also a method of making an electrical connection by applying pressure instead of soldering to the upper portion of the printed circuit board of the edge 33 of the wiring film 25. However, the structure of the thermal recording element by the latter method is also the same as in FIG.

상술한 바와 같은 종래의 조립방법에 의한 감열기록소자는 박막공정품(37)상의 구동집적회로(28)와 인쇄회로기판(32) 사이의 연결을 위해 2중의 패드(38,33)가 필요하게 되어, 상기 박막공정품(37)의 크기가 폭방향으로 커진다. 따라서 감열기록소자의 소형화를 구현하는데에 어려움이 따른다.The thermal recording element according to the conventional assembly method as described above requires double pads 38 and 33 for connection between the driving integrated circuit 28 and the printed circuit board 32 on the thin film process product 37. Thus, the size of the thin film process product 37 is increased in the width direction. Therefore, it is difficult to realize miniaturization of the thermal recording element.

또한 2중 패드를 형성해야 하므로 그만큼 공정이 복잡해지고, 제작 가격이 상승하는 문제점이 발생한다.In addition, since the double pad must be formed, the process becomes complicated and the production cost increases.

따라서 본 발명의 목적은 감열기록소자의 조립방법에 있어서 감열기록소자의 소형화를 구현할 수 있는 감열기록소자의 조립방법을 제공함에 있다.Accordingly, an object of the present invention is to provide a method of assembling a thermal recording element, which can realize miniaturization of the thermal recording element in a method of assembling a thermal recording element.

이하 본 발명을 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

제3도는 본 발명에 따른 감열기록소자의 단면도이다.3 is a cross-sectional view of the thermal recording element according to the present invention.

상기 제3도에서 보는 바와 같이, 본 발명의 감열기록소자는 알루미나 절연기판 또는 세라믹 절연기판(40) 상부면에 균일한 두깨의 유리질층(41)을 도포한 후 스파터링(sputtering)법으로 박막의 발열저항막(42)과 배선역할을 하는 박막의 배선막(43)을 순차적으로 형성한 다음, 상기 배선막의 소정 부위를 식각하여 발열저항체(44)를 형성함과 동시에, 상기 발열저항체(44)와 소정 거리 이격된 곳의 배선막(43)과 발열저항막(42)을 식각하여 구동집적회로 탑재영역(45)을 형성하고, 상기 기판(40) 왼쪽 끝단의 상기 배선막(43)상부면에, 각 발열저항체에 균일한 전압을 인가하기 위한 공통배선 (46)을 형성하고 나서 상기 공통배선부(46) 상부에서 상기 배선막의 소정 부위까지의 발열저항체(44)와 배선부(43,46)를 보호하기 위해 스파터링법으로 보호막(47)을 형성하고, 상기 보호막(47)이 형성되지 않은 배선막을 보호하기 위해 스크린 프린팅법으로 솔더 레지스터(Solder Resist)막(48)을, 상기 보호막(47)과 일정 영역 겹쳐지도록 형성함으로써 박막공정품(50)을 완성한다.As shown in FIG. 3, the thermosensitive recording device of the present invention applies a uniform thickness of the glass layer 41 to the upper surface of the alumina insulating substrate or the ceramic insulating substrate 40, and then thins the thin film by sputtering. The heat generating resistor film 42 and the thin film wiring film 43 serving as a wiring are sequentially formed, and then a predetermined portion of the wiring film is etched to form the heat generating resistor 44 and the heat generating resistor 44. ) Is formed by etching the wiring film 43 and the heating resistor film 42 spaced apart from each other by a predetermined distance to form a driving integrated circuit mounting region 45, and is disposed on the wiring film 43 at the left end of the substrate 40. On the surface, the common wiring 46 for applying a uniform voltage to each of the heating resistors is formed, and then the heating resistor 44 and the wiring portion 43 from the upper portion of the common wiring 46 to a predetermined portion of the wiring film. In order to protect 46, a protective film 47 is formed by a sputtering method. In order to protect the wiring film on which the protective film 47 is not formed, the solder resist film 48 is formed by screen printing so as to overlap the protective film 47 by a predetermined region, thereby completing the thin film process product 50. .

상기 완성된 박막공정품(50)과, 신호와 전력을 공급하기 위한 별도의 인쇄회로기판(51)을, 열을 방출하기 위한 방열판(52) 상부면에 접착시킨 후 상기 구동집적회로 탑재영역(45) 상부면에 구동집적회로(53)를 탑재한다. 이때 상기 구동집적회로 탑재영역(45)과 상기 구동집적회로(53) 사이에 전사형 에폭시(Epoxy)를 매개로 하여 본딩하여, 고온에서 건조시킴으로써 강한 접착력을 가지도록 했다.After bonding the completed thin film process product 50 and a separate printed circuit board 51 for supplying signals and power to the upper surface of the heat sink 52 for dissipating heat, the driving integrated circuit mounting area ( 45) The drive integrated circuit 53 is mounted on the upper surface. At this time, the driving integrated circuit mounting region 45 and the driving integrated circuit 53 were bonded to each other through a transfer type epoxy and dried at a high temperature to have a strong adhesive force.

상기 구동집적회로(53)를 탑재한 후, 상기 배선막(43)과 구동집적회로(53), 상기 구동집적회로와 인쇄회로기판(51) 사이를 직접 와이어 본딩(금선 연결)(54)한 다음 상기 금선과 구동집적회로를 보호하기 위해 점도가 높은 1차 수지(Resin)(55)로 약 1mm 두께의 테두리를 형성하고, 상기 1차 수지를 형성한 테두리(55) 내부에 점도가 낮은 2차 수지(56)로 충진시킨다.After the driving integrated circuit 53 is mounted, direct wire bonding (gold wire connection) 54 is performed between the wiring film 43, the driving integrated circuit 53, and the driving integrated circuit and the printed circuit board 51. Next, in order to protect the gold wire and the driving integrated circuit, an edge having a thickness of about 1 mm is formed with a high viscosity primary resin (Resin) 55, and 2 having a low viscosity inside the edge 55 having the primary resin formed thereon. It is filled with the primary resin (56).

제4도는 본 발명에 따른 감열기록소자의 사시도이다.4 is a perspective view of a thermal recording element according to the present invention.

상기 제4도에서 보는 바와 같이 유리질이 도포된 알루미나 절연기판 또는 세라믹 절연기판(60)상에 발열저항체열(61)과 배선부(62) 및 공통 배선(63)을 형성하여 완성된 박막공정품(64)과, 신호와 전력을 공급하기 위한 별도의 인쇄회로기판(65)을, 열을 방출하기 위한 방열판(66)의 상부면에 탑재하고, 상기 박막공정품(64)의 인쇄회로기판(65)쪽 가장자리에 구동집적회로(67)를 탑재한다. 또한 상기 인쇄회로기판 (65) 양쪽하부에는 각각 신호 또는 전원을 공급하기 위한 커넥터(connector)를 장착하며, (68)은 그중 하나이다.As shown in FIG. 4, the thin film process product is formed by forming the heating resistor string 61, the wiring part 62, and the common wiring 63 on the glass-coated alumina insulating substrate or ceramic insulating substrate 60. 64 and a separate printed circuit board 65 for supplying signals and power to the upper surface of the heat sink 66 for dissipating heat, and the printed circuit board of the thin film process product 64 The drive integrated circuit 67 is mounted on the edge 65. In addition, a lower portion of both sides of the printed circuit board 65 is equipped with a connector for supplying a signal or power, respectively, and 68 is one of them.

여기서 상기 구동집적회로(67)는 편방향(단방향)의 금선연결용 구동집적회로이고, 상기 발열저항체열(61)에 연결된 배선부의 패드와 상기 구동집적회로(67)의 출력 전극 패드부 사이, 상기 구동집적회로(67)의 입력 전극 패드부와 인쇄회로기판 사이, 상기 박막공정품상에 형성된 공통 배선부(63)와 인쇄회로기판(65) 사이에는 전기적 연결을 위해 금선연결(69,70,71)이 되어 있다.Here, the driving integrated circuit 67 is a driving integrated circuit for one-way (unidirectional) gold wire connection, between the pad of the wiring portion connected to the heat generating resistor column 61 and the output electrode pad portion of the driving integrated circuit 67, Gold wire connections 69 and 70 for electrical connection between the input electrode pad portion of the driving integrated circuit 67 and the printed circuit board, and between the common wiring portion 63 and the printed circuit board 65 formed on the thin film process product. , 71).

상술한 바와 같이 본 발명은 감열기록소자의 조립방법에 있어서 구동집적회로와 인쇄회로기판 사이를 직접 금선 연결함으로써 종래와 같은 2중 패드가 필요없게 되어 감열기록소자의 소형화를 구현할 수 있다.As described above, in the method of assembling the thermal recording element, the present invention eliminates the need for a conventional double pad by directly connecting the driving integrated circuit and the printed circuit board to realize miniaturization of the thermal recording element.

또한 본 발명은 종래의 2중 패드를 형성하는 공정이 없어짐에 따라 공정이 용이하고, 제작 가격도 저렴해 진다.In addition, according to the present invention, the process of forming a conventional double pad is eliminated, and the process is easy, and the manufacturing cost is also low.

또한 본 발명은 독립 알루미늄 랜드의 표면과 에폭시, 에폭시와 구동집적회로의 하부면과 접착력이 뛰어나 상기 구동 집적회로의 공정이 용이하고 쉽게 떨어지지 않으므로 신뢰성을 확보할 수 있다.In addition, the present invention has excellent adhesive strength with the surface of the independent aluminum land and the epoxy, epoxy, and the lower surface of the driving integrated circuit, so that the process of the driving integrated circuit is easy and does not easily fall, thereby ensuring reliability.

Claims (1)

발열저항체와 배선부와 공통 배선이 형성된 박막공정품과, 입.출력 전극 패드를 구비하여 상기 발열저항체를 구동하기 위한 구동집적회로와, 배선 패드를 구비하여 상기 박막공정품과 상기 구동집적회로에 전력과 신호를 공급하기 위한 인쇄회로기판을 구비하는 감열기록소자의 조립방법에 있어서, 상기 박막공정품과, 상기 인쇄회로기판을 방열판 상부면에 서로 이웃하도록 탑재하고, 상기 박막공정품상에 편방향의 구동집적회로를 상기 인쇄회로기판과 이웃한 가장자리에 가로방향으로 일렬로 장착하여 상기 구동집적회로의 입력 전극 패드와 상기 인쇄회로기판의 배선 패드 사이를 금선으로 연결함을 특징으로 하는 감열기록소자의 조립방법.A thin film process product having a heat generating resistor and a wiring portion and common wiring, an input / output electrode pad including a driving integrated circuit for driving the heat generating resistor, and a wiring pad provided to the thin film process product and the driving integrated circuit. A method of assembling a thermosensitive recording device comprising a printed circuit board for supplying power and a signal, comprising: mounting the thin film process product and the printed circuit board to be adjacent to each other on an upper surface of a heat sink, Thermally recording a drive integrated circuit in a horizontal direction on the printed circuit board and adjacent edges in a row in a horizontal direction to connect the input electrode pad of the drive integrated circuit and the wiring pad of the printed circuit board with a gold line; Assembly method of device.
KR1019900005590A 1990-04-20 1990-04-20 Thermal recording element KR930000703B1 (en)

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