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KR920011002A - 본딩방법 및 그 장치 - Google Patents

본딩방법 및 그 장치 Download PDF

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Publication number
KR920011002A
KR920011002A KR1019910021728A KR910021728A KR920011002A KR 920011002 A KR920011002 A KR 920011002A KR 1019910021728 A KR1019910021728 A KR 1019910021728A KR 910021728 A KR910021728 A KR 910021728A KR 920011002 A KR920011002 A KR 920011002A
Authority
KR
South Korea
Prior art keywords
parts
detection
bonding
detection device
bonding apparatus
Prior art date
Application number
KR1019910021728A
Other languages
English (en)
Other versions
KR950009924B1 (ko
Inventor
간지 오자와
소노다유끼다까
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라이 가즈오, 가부시끼가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR920011002A publication Critical patent/KR920011002A/ko
Application granted granted Critical
Publication of KR950009924B1 publication Critical patent/KR950009924B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/28—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with deflection of beams of light, e.g. for direct optical indication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

내용 없음

Description

본딩방법 및 그 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예를 예시하는 외관사시도, 제2도는 제1도의 정면도, 제3도는 광학계의 설명도.

Claims (5)

  1. 하나의 부품을 다른 부품의 윗쪽 또는 아래쪽에 이송하는 이송공정과, 상기 2개의 부품패턴을 검출하는 검출공정과, 이 검출공정의 검출결과에 의거하여 어느 한쪽의 부품을 기준으로 하여 2개의 부품을 위치정합시키는 위치정합공정과, 이 위치정합된 2개의 부품을 본딩하는 본딩공정을 가지는 본딩방법에 있어서, 상기 검출공정은 하나의 부품이 이송되어서 다른 부품의 윗쪽 또는 아래쪽으로 이송된 상태에서 상하에 검출구를 가지는 검출장치를 상기 2개의 부품사이에 위치시켜서 2개의 부품의 상대적인 위치어긋남을 검출하는 것을 특징으로 하는 본딩방법.
  2. 하나의 부품을 유지하여 다른 부품의 윗쪽 또는 아래쪽에 이송하여 위치정합시키고, 2개의 부품을 본딩하는 본딩장치에 있어서, 상하에 검출구를 가지고 하나의 부품 윗쪽 또는 아래쪽에 다른 부품이 위치하게 된 상태에서, 이 2개의 부품사이에 이동하게 되어서 상기 상하의 검출구에서 각각 상하부품의 패턴을 검출하는 검출장치를 구비한 것을 특징으로 하는 본딩장치.
  3. 제2항에 있어서, 상기 검출장치는 XY방향으로 이동가능한 XY스테이지에 부착되어 있는 것을 특징으로 하는 본딩장치.
  4. 제2항에 있어서, 상기 검출장치는 상하의 2개 부품의 패턴을 전환하여 카메라에 공급하기 위하여, 각각의 광학계의 경로도중에 셔터 수단을 가지고 있는 것을 특징으로 하는 본딩장치.
  5. 제2항, 3항 또는 제4항에 있어서, 상기 검출장치는 이 검출장치의 열적경시변위를 보상하기 위하여, 주위 온도에 가깝게 가열해두는 가열수단을 가지는 것을 특징으로 하는 본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910021728A 1990-11-30 1991-11-29 본딩장치 KR950009924B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-336610 1990-11-30
JP33661090A JP2789387B2 (ja) 1990-11-30 1990-11-30 ボンディング装置

Publications (2)

Publication Number Publication Date
KR920011002A true KR920011002A (ko) 1992-06-27
KR950009924B1 KR950009924B1 (ko) 1995-09-01

Family

ID=18300942

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910021728A KR950009924B1 (ko) 1990-11-30 1991-11-29 본딩장치

Country Status (3)

Country Link
US (1) US5225026A (ko)
JP (1) JP2789387B2 (ko)
KR (1) KR950009924B1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5383118A (en) * 1992-09-23 1995-01-17 At&T Corp. Device alignment methods
US5407519A (en) * 1993-07-07 1995-04-18 Interserv Corp. Apparatus for manufacturing liquid crystal display screens
JP2941658B2 (ja) * 1994-07-08 1999-08-25 株式会社三協精機製作所 電子部品表面実装装置
US5699448A (en) * 1995-07-05 1997-12-16 Universal Instruments Corporation Split field optics for locating multiple components
JP3756580B2 (ja) * 1995-11-07 2006-03-15 セイコープレシジョン株式会社 多層基板の製造方法及びその製造装置
NL1003357C2 (nl) * 1996-06-17 1997-12-19 Fico Bv Overzetinrichting en samenstel van overzetinrichting en verwarming.
JPH11218412A (ja) * 1998-02-02 1999-08-10 Shinkawa Ltd ボンディング装置
JP2002093858A (ja) * 2000-09-14 2002-03-29 Toray Eng Co Ltd チップ実装装置及びそれにおけるキャリブレーション方法
US20080152919A1 (en) * 2006-12-22 2008-06-26 Magna International Inc. Resistive implant welding for structural bonds in automotive applications
EP2343165A1 (en) * 2010-01-07 2011-07-13 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO System and method for picking and placement of chip dies
JP6382390B2 (ja) * 2016-05-10 2018-08-29 ハンミ セミコンダクター カンパニー リミテッド ビジョン検査装置
JP7149453B2 (ja) * 2018-05-14 2022-10-07 パナソニックＩｐマネジメント株式会社 ボンディング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182718A (ja) * 1982-04-20 1983-10-25 Datsuku Eng Kk 位置合わせ装置
JPH0226379A (ja) * 1988-07-14 1990-01-29 Fuji Technica Inc 電磁ソレノイドバルブ
US5133603A (en) * 1988-10-18 1992-07-28 Canon Kabushiki Kaisha Device for observing alignment marks on a mask and wafer
US5044072A (en) * 1990-04-13 1991-09-03 Air-Vac Engineering Company, Inc. Vision system apparatus and method for component/pad alignment

Also Published As

Publication number Publication date
JP2789387B2 (ja) 1998-08-20
KR950009924B1 (ko) 1995-09-01
US5225026A (en) 1993-07-06
JPH04206746A (ja) 1992-07-28

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E902 Notification of reason for refusal
G160 Decision to publish patent application
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Payment date: 20070801

Year of fee payment: 15

LAPS Lapse due to unpaid annual fee