KR920007575B1 - Mold-shaping material and production of forming mold using said material - Google Patents
Mold-shaping material and production of forming mold using said material Download PDFInfo
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- KR920007575B1 KR920007575B1 KR1019890008412A KR890008412A KR920007575B1 KR 920007575 B1 KR920007575 B1 KR 920007575B1 KR 1019890008412 A KR1019890008412 A KR 1019890008412A KR 890008412 A KR890008412 A KR 890008412A KR 920007575 B1 KR920007575 B1 KR 920007575B1
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- mold
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- molding
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- 239000000463 material Substances 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000007493 shaping process Methods 0.000 title description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 41
- 238000000465 moulding Methods 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 229910052697 platinum Inorganic materials 0.000 claims description 22
- 239000000843 powder Substances 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 125000001931 aliphatic group Chemical group 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims 1
- 150000003058 platinum compounds Chemical class 0.000 claims 1
- -1 polysiloxane Polymers 0.000 description 46
- 229920002379 silicone rubber Polymers 0.000 description 20
- 239000004945 silicone rubber Substances 0.000 description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 14
- 229920001971 elastomer Polymers 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 239000005060 rubber Substances 0.000 description 14
- 229920001296 polysiloxane Polymers 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000000926 separation method Methods 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 description 7
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 6
- 238000007259 addition reaction Methods 0.000 description 6
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- 239000008096 xylene Substances 0.000 description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 229910021485 fumed silica Inorganic materials 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001976 improved effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 239000005051 trimethylchlorosilane Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 206010058314 Dysplasia Diseases 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004965 Silica aerogel Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- DQHHMLPTUUXNRT-UHFFFAOYSA-N but-3-ynyl(trimethyl)silane Chemical compound C[Si](C)(C)CCC#C DQHHMLPTUUXNRT-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002978 dental impression material Substances 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical class P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- PIZSEPSUZMIOQF-UHFFFAOYSA-N platinum;2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound [Pt].C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 PIZSEPSUZMIOQF-UHFFFAOYSA-N 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Catalysts (AREA)
Abstract
내용 없음.No content.
Description
본 발명은 형틀 재료 및 이것을 사용한 성형틀의 제조 방법에 관한 것으로 보다 자세히 말하면 뛰어난 이형성을 갖는 성형틀의 성형용형틀 재료 및 이것을 사용한 성형틀의 제조 방법에 관한 것이다. 폴리오르가노실록산을 베이스폴리머로 하는 고무모양의 특성체, 즉 실리콘 고무는 뛰어난 내열성, 전기적 특성, 내한성, 내구성으로 여러 분야에 널리 사용되고 있다. 실리콘 고무의 용도로는 포팅이나 코팅, 피복등을 들수 있지만 주된용도중 하나는 형틀내에서 경화시켜 성형물로 하는 용도가 있다. 이렇게 얻어진 성형물은 예를 들면 TV의 아노드캡, 자동차의 오일실링등과 같은 내구소비재인 고무부품, 젖병꼭지, 안경의 코걸이와 같은 일급소비재, 수지성형용의 고무틀과 같은 생산재로 여러분야에서 사용되고 있다. 이러한 실리콘 고무를 대별하면 비교적 높은 중합도의 베이스폴리머와 무기질충전제로 이루어지는 고형조성물을 유기과산화물등으로 가교, 경화해서 기계적 특성이 강한 고무형 탄성체를 얻는 미러블 고무와 비교적 낮은 중합도의 액상 베이스의 폴리머를 사용해 각종의 가교 기구로 경화하는 비교적 기계적 특성이 약한 액상고무가 있는데 모두 형틀재료로 사용해 왔다. 이러한 실리콘 고무의 가교 반응으로는 유기과산화물을 사용하는 래디컬 반응, 가수분해성 실란 화합물과 실란올기 함유 폴리머간의 축합반응, 규소원자에 결합된 불포화 탄화수소기와 Si-H기 사이의 부가반응등을 들 수 있다.The present invention relates to a mold material and a method for producing a mold using the same, and more particularly, to a mold material for molding a mold having excellent mold release property and a method for manufacturing a mold using the same. Rubber-like properties based on polyorganosiloxane, that is, silicone rubber, have been widely used in various fields for their excellent heat resistance, electrical properties, cold resistance, and durability. The use of silicone rubber may include potting, coating, coating, etc. One of the main uses is to form a molded product by curing in a mold. The moldings thus obtained are produced in the field of production, such as rubber parts for durable consumer goods such as anode caps of TVs, oil seals of automobiles, first-class consumer goods such as bottle nipples, nose rings of glasses, and rubber molds for resin molding. It is used. The silicone rubber can be roughly classified into a mirrorable rubber and a liquid polymer having a relatively low polymerization degree by crosslinking and curing a solid composition composed of a relatively high degree of polymerization of a base polymer and an inorganic filler with an organic peroxide. There are liquid rubbers with relatively low mechanical properties, which are hardened by various crosslinking mechanisms. Examples of the crosslinking reaction of silicone rubbers include radical reactions using organic peroxides, condensation reactions between hydrolyzable silane compounds and silanol group-containing polymers, and addition reactions between unsaturated hydrocarbons and Si—H groups bonded to silicon atoms. .
이들은 각각 장.단점이 있지만 모두 부가반응을 이용해서 경화시키는 것은 경화성의 조정이 용이하며 특히 약간의 가열로 단시간에 경화시킬 수 있고 성형품의 경화후 수축률이 작으며 또 경화시에 부산물이 생기지 않는 장점이 있다.Although each of them has advantages and disadvantages, curing by addition reaction is easy to adjust the curability, in particular, it can be cured in a short time by slight heating, shrinkage rate after curing of the molded product is small, and by-products do not occur during curing. There is this.
이같은 부가반응에 의한 경화기구는 액상고무에도 미러블 고무에도 채용되며 또 성형용 재료로도 사용되고 있다.The curing mechanism by such an addition reaction is employed in liquid rubber and mirrorable rubber and is also used as a molding material.
이러한 부가 반응형 폴리오르가노실록산 조성물은 이것이 시장에 나온 뒤 형틀 재료로도 사용되왔지만 그 용도는 불도구, 미술공에품등 수공업적 색채가 강한 분야에서 였다.This addition-reactive polyorganosiloxane composition has been used as a template material since it came out on the market, but its use has been in the field of strong industrial color such as fire tools and art works.
그런데 최근 프로토타이프 성형이라고 하는 분야에서 이것이 많이 사용되고 있다. 전기전자산업이나 자동차 산업등에서는 플라스틱(ABS 수지가 많음)성형체를 많이 사용하나 열가소성수지이므로 금형에 의한 성형이 이루어지고 있다. 이들 플라스틱 성형체는 제품의 갱신 개량때 새로운 형으로 되지만 이 때문에 이러한 성형체의 시작품을 수십개 만들어 검토할 필요가 있다. 이러한 시작품을 만드는 것을 프로토타이프 성형이라 하고 있다.In recent years, however, this is widely used in the field of prototype molding. In the electrical and electronics industry and the automobile industry, many plastic (molded ABS resin) moldings are used, but since they are thermoplastic resins, molding by molding is performed. These plastic molded articles are in a new form when the product is renewed and improved. Therefore, dozens of prototypes of such molded articles need to be examined. Prototype molding is what makes this prototype.
이것을 만드는 방법으로는 새로 금형을 떠서 성형하거나 판재를 깍아 조립해 만드는 방법이 있지만 모두 비용이나 시간이 매우 많이 들어 개선이 요망되었다. 모형을 한 개 만들어 이것을 2포장형 실온 경화성 폴리오르가노 실록산 조성물을 형틀재료로 사용해 고무틀을 만들어 여기에 열경화성수지를 주입해 경화시켜 복제품을 얻는다는 프로토타이프 성형이 최근 발전되고 있다. 이로써 비용, 소요시간 모두 큰 개선을 보이고 있다. 이 방법이 보금된 것은 열경화성 수지의 물성이 개량되어 플라스틱물성에 가까워졌기 때문이기도 하다. 또 이같은 부가형의 액상고무에 대해 대량으로 가해도 계의 외관상의 점도가 과도하게 상승하지 않으므로 기계적 강도를 높이는 데에 유리한, 표면을 고도로 처리한 충전제가 사용되며 또 폴리실록산 사슬을 약간 양호하게 해서 분기형 폴리실록산을 병용함으로써 미러블 실리콘 고무에 필적하는 기계적 강도를 액상고무의 경화성 형품에 주는 것이 가능해져 유동성이 있는 부가형 성형을 실리콘 고무를 사용해 사출 성형용으로 단시간에 용이하게 성형품을 얻을 수 있게 되었다.The way to make this is to create a new mold by shaping it, or to cut and assemble the plate, but all are very costly and time-consuming. Prototype molding has recently been developed, in which a model is made and a two-packed room-temperature-curable polyorganosiloxane composition is used as a mold material, and a rubber mold is made therein, and a thermosetting resin is injected and cured to obtain a replica. As a result, both cost and turnaround time show a big improvement. This method is also due to the improved physical properties of the thermosetting resin, which is closer to the plastic properties. In addition, since the apparent viscosity of the system does not excessively increase even when applied in a large amount to the liquid rubber of such an additional type, a highly surface-treated filler is used, which is advantageous for increasing mechanical strength. By using polysiloxane together, the mechanical strength comparable to the mirrorable silicone rubber can be given to the curable molded article of the liquid rubber, and the molded article can be easily obtained in a short time for injection molding using the silicone rubber for flowable additive molding.
이처럼 부가반응을 이용하는 실리콘 고무는 성형용재료로써 적당한 경화특성을 갖고 있지만 틀로부터의 이형성이 떨어지는 난점이 있다. 예를 들면 부가형 액상 실리콘 고무로 성형한 경우, 틀에 밀착이 쉽고 고무틀 제작에 있어 열선장치가 필요하다. 아울러 예를 들면 프로토타이프성형용에 우레탄이나 에폭시수지 재료의 기계적 물성이 개량됨에 따라 실리콘 고무틀로부터 이들 수지의 이형성이 더욱 악화되는 경향이 나타나고 있다.As described above, the silicone rubber using the addition reaction has a suitable curing property as a molding material, but has a difficulty in that releasability from the mold is poor. For example, in the case of molding with an additive liquid silicone rubber, it is easy to adhere to the mold and a heating device is required for manufacturing the rubber mold. In addition, for example, as the mechanical properties of urethane or epoxy resin materials are improved for prototyping, there is a tendency that the releasability of these resins from the silicone rubber mold is further deteriorated.
또 사출성형으로 성형품의 생산성을 향상시키기 위해 경화된 성형품을 금형으로부터 용이하게 꺼내는 것이 필요조건의 하나로 들 수 있지만 전술한 고강도 부가형의 액상 실리콘 고무를 사출성형할 때 성형금형으로 박리성이 뛰어난 크롬도금금형을 사용해도 가열 성형시에 성형품이 금형에 점착되기 쉬워 성형품을 꺼내는 데 난점이 있어 그 생산성이 저해된다. 이러한 부가형 실리콘 고무틀로부터의 이형성이 좋지 않음은 작업가능시간을 연장시키기위해 경화지연제를 많이 사용하거나 또는 이러한 계로 비교적 저온에서 경화시킬때에 특히 현저하다. 이러한 문제를 해결하기 위해 형틀은 표면에 불소등의 이형제를 도포하고 있다.In order to improve the productivity of the molded product by injection molding, one of the requirements is to easily take out the cured molded product from the mold. However, when injecting the above-described high-strength additive-type liquid silicone rubber into an injection mold, the molding mold has excellent peelability. Even if the mold is used, the molded article tends to adhere to the mold during the heat molding, and there is a difficulty in taking out the molded article, and the productivity thereof is hindered. The poor releasability from these additional silicone rubber molds is particularly noticeable when using a curing retardant in order to prolong working time or when curing at relatively low temperatures with this system. In order to solve this problem, the mold is applying a release agent such as fluorine on the surface.
성형재료로의 실리콘 고무에 대해서는 내부이형제로 실리콘박등의 첨가가 이루어지지만 이것은 성형물의 특성에도 여러 가지 영향을 미치는 일이 많고 또 효과도 충분하지 않다. 일본특개소 58-19357호 공보에는 특정한 폴리오르가노하이드로겐 폴리시록산을 사용하는 것이 나타나 있는데 꽤 이형성의 향상효과가 있지만 아직도 많은 향상이 요망되고 있다.As for the silicone rubber as a molding material, silicone foil or the like is added as an internal mold release agent, but this often affects the properties of the molded article in various ways and is not sufficient. Japanese Patent Application Laid-Open No. 58-19357 shows the use of a specific polyorganohydrogen polysiloxane, which has a considerable effect of improving the release property, but much improvement is still desired.
그리고 일본특개소 55-7217호 공보에는 부가형 실론 경화성 폴리 오르가노실록산 조성물에 금속팔라듐 또는 그 합금의 미세한 분말을 배합한 치과용 인상 재료가 나타나 있다.Japanese Patent Application Laid-Open No. 55-7217 discloses a dental impression material in which a fine powder of a metal palladium or an alloy thereof is blended with an addition-type silon-curable polyorganosiloxane composition.
그러나 이것은 금속 팔라듐 혹은 그 합금의 분말에 의해 경화시 발생하는 수소 가스를 흡착시켜 인상 채취시 즉 형틀을 뜰 때 수소가스의 기포에 따른 정밀인상의 결함을 방지하는 것을 목적으로 하는 것으로 본 발명에 관계되는 주 입수지에 대한 이형성의 개선이라는 생각은 나타나 있지는 않다.However, this is for the purpose of adsorbing hydrogen gas generated during hardening by powder of metal palladium or alloy thereof to prevent defects of precision impression due to bubbles of hydrogen gas when pulling up, i.e., forming a mold. The idea of an improvement in dysplasia of the main source of income does not appear.
본 발명은 모형으로부터의 이형성 및 형을 떠서 얻어지는 성형체와의 이형성이 뛰어난 성형틀의 성형용형틀재료, 그리고 이것을 이용한 수지주형용의 성형틀 제조방법을 제공하는 것을 목적으로 한다.An object of the present invention is to provide a molding die material for a molding die having excellent mold release properties from a mold and a mold release obtained from a mold, and a molding die manufacturing method for a resin mold using the same.
본 발명자들은 부가형실은 경화성 폴리오르가노실록산 조성물의 이형성을 개선해 프로토타이프성형용으로 적절한 형틀 재료를 얻어 모형틀과 성형틀과의 이형성 및 성형틀과 그로부터 얻는 성형체와의 이형성을 향상시키는 방법에 대해 전술한 기존의 방법과는 다른 별도의 방법으로 예의 검토한 결과 특정의 금속을 배합함으로써 수지에 대한 이형성을 향사시키는 것을 발견해 본 발명에 이르렀다.The present inventors have described the method of improving the mold release property of the curable polyorganosiloxane composition to obtain a mold material suitable for prototyping, thereby improving the mold release property between the mold and the mold and the mold release property from the mold. As a result of a thorough examination by a method different from one conventional method, the present inventors have found that compounding a specific metal enhances the release property to the resin.
본 발명은 즉The present invention is
A 규소원자에 결합된 불포화지방족 탄화수소기를 1분자중에 2개이상 갖는 폴리오르가노실록산.A polyorganosiloxane having at least two unsaturated aliphatic hydrocarbon groups bonded to a silicon atom in one molecule.
B 규소원자에 결합된 수소원자를 1분자중에 3개이상 갖는 폴리오르가노 하이드로겐 실록산 : A 성분중의 불포화지방족탄화수소기 1개에 대해 규소원자에 결합된 수소원자의 수가 0.5-5개가 되도록 한 양.Polyorganohydrogen siloxane having three or more hydrogen atoms in one molecule bonded to silicon atoms of B: For each unsaturated aliphatic hydrocarbon group in component A, the number of hydrogen atoms bonded to silicon atoms is 0.5-5. amount.
C 백금 착화합물 촉매 : A,B 성분의 합계량에 대해 백금원소족등으로 0.2-1,000ppm.C Platinum Complex Catalyst: 0.2-1,000ppm based on platinum element relative to the total amount of A and B components.
D 팔라듐, 로듐, 백금등으로 이루어지는 무리에서 선택되는 금속 및 그 합금의 분말 혹은 이들을 담체로 담지(擔持)시킨 것 : A 및 B 성분의 합계량에 대해 금속원소의 환산으로 5-1000ppm으로 이루어지는 것을 특징으로 하는 형틀 재료 및 전술한 형틀 재료를 성형해 경화시키는 것을 특징으로 하는 성형틀의 성형 방법에 관한 것이다.D Metal selected from the group consisting of palladium, rhodium, platinum and the like or powders of alloys thereof supported on them: consisting of 5-1000 ppm in terms of metal elements relative to the total amount of A and B components The mold material characterized by the above-mentioned, and the above-mentioned mold material is molded and hardened.
본 발명에 사용되는 A 성분의 폴리오르가노실록산은 본 발명의 형틀 재료인 베이스 폴리머로 되는 성분이다. 이러한 A 성분의 규소원자에 직결된 불포화지방족 탄화수소기를 1분자중에 2개이상 가지며 부가반응에 의해 망상구조를 형성하는 것이 가능한 것으로 전부터 부가형 경화성 폴리오르가노실록산 조성물의 한성분으로 사용되고 있는 것이면 어떤 것이라도 좋다. 불포화지방족 탄화수서기로는 비닐기, 아릴기, 1-부테닐기, 1-헥세닐기등이 예시되지만 합성이 용이하다고 하는 점에서 비닐기가 가장 유리하다.The polyorganosiloxane of A component used for this invention is a component which becomes the base polymer which is a mold material of this invention. Any one having at least two unsaturated aliphatic hydrocarbon groups directly linked to the silicon atom of the component A can form a network structure by an addition reaction, so long as it has been used as a component of the addition type curable polyorganosiloxane composition. good. Examples of the unsaturated aliphatic hydrocarbon group include vinyl group, aryl group, 1-butenyl group, 1-hexenyl group and the like, but the vinyl group is most advantageous in view of ease of synthesis.
실록산 단위의 규소원자에 결합된 다른 유기물로는 메틸기, 에틸기, 프로필기, 부틸기, 펜틸기, 헥실기, 옥틸기, 데실기, 도데실기등의 알킬기; 페닐기와 같은 아릴기; 벤질기, 2-페닐에틸기, 2-페닐프로필기등의 아랄킬기; 클로로메틸기, 클로로페닐기, 2-시아노에틸기, 3,3,3-트리플루오로 프로필기등의 치환탄화수소기가 예시된다.Other organic substances bonded to the silicon atom of the siloxane unit include alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, octyl group, decyl group and dodecyl group; Aryl groups such as phenyl groups; Aralkyl groups such as benzyl, 2-phenylethyl and 2-phenylpropyl; Substituted hydrocarbon groups, such as a chloromethyl group, a chlorophenyl group, 2-cyanoethyl group, and a 3,3,3- trifluoro propyl group, are illustrated.
이들중 합성이 용이하며 기계적 강도 및 경화전의 유동성등의 특성 밸런스가 뛰어난 점에서 메틸기가 가장 적절하다. 불포화지방족 탄화수소기는 폴리오르가노실록산의 분자 사슬의 말단 또는 도중의 어디에 존재해도 또는 그 쌍방에 존재해도 좋지만 경화물에 뛰어난 기계적 성질을 주기 위해서는 적어도 그 양말단에 존재하는 것이 적절하다. 또 실록산 골격은 직쇄상이어도 분기상이어도 좋다.Among them, the methyl group is most suitable in view of ease of synthesis and excellent balance of properties such as mechanical strength and fluidity before curing. The unsaturated aliphatic hydrocarbon group may be present at or at the end or in the middle of the molecular chain of the polyorganosiloxane, but is preferably present at least at the sock end to give the cured product excellent mechanical properties. The siloxane skeleton may be linear or branched.
본 발명에서는 직쇄상의 화합물과 분기상의 화합물을 혼합해서 사용하는 것도 가능하다.In this invention, it is also possible to mix and use a linear compound and a branched compound.
이들 혼합물을 사용하는 경우, 경화물의 기계적 강도나 탄성율을 높이기 위해서는 폴리오르가노실록산 성분으로는 R3SiO단위, R2SiO 1/2단위 및 SiO2단위(R은 전술한 유기기를 나타내며 한 분자중 적어도 2개는 불포화지방족 탄화수소기이다)로 이루어지는 분기상 폴리오르가노실록산이 2-50중량% 배합되며 나머지는 직쇄상의 양말단 불포화 지방족 탄화수소기로 봉쇄된 폴리오르가노실록산으로 이루어지는 혼합물을 사용하는 것이 적절하다.In the case of using these mixtures, in order to increase the mechanical strength or elastic modulus of the cured product, as the polyorganosiloxane component, R 3 SiO unit, R 2 SiO 1/2 unit, and SiO 2 unit (R represents the aforementioned organic group, 2-50% by weight of a branched polyorganosiloxane composed of at least two unsaturated aliphatic hydrocarbon groups) and the remainder of the mixture consisting of a polyorganosiloxane sealed with a linear sockdan unsaturated aliphatic hydrocarbon group. proper.
A 성분의 중합도는 특별히 한정되지는 않지만 경화전에 양호한 유동성, 작업성을 가지며 경화후에도 적절한 탄성을 갖기위해서는 중합도가 40-2,000인 것이 적절하고 100-1,000인 것이 특히 바람직하다.Although the polymerization degree of A component is not specifically limited, In order to have favorable fluidity | liquidity and workability before hardening, and to have suitable elasticity after hardening, it is suitable that it is suitable that it is 40-2,000 and it is especially preferable that it is 100-1,000.
본 발명에 사용되는 B 성분의 폴리오르가노 하이드로겐 실록산은 A 성분의 가교제로 작용하는 화합물이며 경화물을 망상화하기위해 규소원자에 결합된 수소원자를 적어도 3개 가져야 한다.The polyorgano hydrogen siloxane of component B used in the present invention is a compound which acts as a crosslinking agent of component A and must have at least three hydrogen atoms bonded to silicon atoms in order to resemble the cured product.
실록산 단위의 규소원자에 결합된 유기기로는 전술한As the organic group bonded to the silicon atom of the siloxane unit,
A 성분의 기와 같은 것이 예시되며 그들중에도 합성이 용이하다는 점에서 메틸기가 가장 적절하다.Examples of the group A component are exemplified, and among them, methyl group is most suitable in view of ease of synthesis.
B 성분의 실록산 골격은 직쇄상, 분기상 및 환상등 어느 것이어도 좋다.The siloxane skeleton of the B component may be any of linear, branched and cyclic.
또 본 발명에서도 이들 혼합물을 사용해도 좋다.Moreover, you may use these mixture also in this invention.
B 성분의 중합도는 특별히 한정되지는 않지만 동일한 규소원자에 2개이상의 수소원자가 결합된 화합물은 합성이 곤란하므로 3개이상의 실록산 단위로 이루어지는 것이 적절하다.Although the polymerization degree of B component is not specifically limited, Since the compound which combines two or more hydrogen atoms with the same silicon atom is difficult to synthesize | combined, it is suitable to consist of three or more siloxane units.
B 성분의 구체예로는 이하의 화합물이 예시된다.Specific examples of the component B include the following compounds.
a. (CH3)2HSiO 1/2 단위와 SiO2단위로 이루어지는 분기상 폴리오르가노하이드로겐 실로산a. Branched polyorganohydrogen siloic acid consisting of (CH 3 ) 2 HSiO 1/2 unit and SiO 2 unit
b. 다음식:b. Formula:
(단, p는 3-100, p는 0-100의 정수를 나타낸다)로 표시되는 직쇄상 폴리오르가노 하이드로겐 실록산(Wherein p represents an integer of 3-100, p represents an integer of 0-100), and is a linear polyorgano hydrogen siloxane
c. 다음식c. Formula
(단, p는 3-100, p는 0-100의 정수를 나타낸다)로 표시되는 직쇄상 폴리오르가노 하이드로겐 실록산 B 성분의 배합량은 A 성분중의 불포화 지방족탄화수소기 1개에 대해 B성분중의 규소원자에 결합된 수소원자가 0.5-5개, 적절하게는 1-3개가 되는 양이다.The compounding amount of the linear polyorganohydrogen siloxane B component represented by (wherein p represents 3-100 and p represents an integer of 0-100) is contained in the B component for one unsaturated aliphatic hydrocarbon group in the A component. The amount of hydrogen atoms bonded to the silicon atoms of is 0.5-5, preferably 1-3.
수소원자가 0.5개미만인 경우에는 경화가 완전히 끝나지 않으므로 성형틀이나 틀을 떠서 얻어지는 성형체가 점착성을 가지므로 형틀 분리성, 이형성이 저하된다. 역으로 수소원자가 5개를 넘는 경우에는 경화시에 발포가 일어나기 쉬우며 이것이 모형과 성형틀의 계면 및 성형틀과 형을 떠서 얻는 성형체의 계면에 모여 표면상태가 좋지 않은 성형틀이나 성형체가 될 뿐만 아니라 얻어진 성형틀이나 성형체는 취약해져 수지의 주형회수 즉 형틀 수명의 저하를 가져와 기계적인 강도가 저하된다.If the hydrogen atom is less than 0.5, the curing is not completely completed, and thus the mold separation properties and mold release properties are lowered because the mold obtained by floating the mold or the mold has adhesiveness. On the contrary, when there are more than five hydrogen atoms, foaming is likely to occur during curing, and this forms a mold or a molded body having poor surface conditions by gathering at the interface between the mold and the mold and the mold obtained by floating the mold and the mold. However, the obtained mold or molded body becomes brittle, and the mold recovery of the resin, that is, the mold life, is lowered and the mechanical strength is lowered.
본 발명에 사용되는 C 성분의 백금착화합물 촉매는 A 성분의 불포화지방족 탄화수소기와 B성분의 하이드로시릴기와의 사이의 부가반응을 촉진시키기 위한 촉매로 상온부근에서 경화반응의 촉매 능력이 양호하다는 점에서 뛰어나다. 백금착화합물로는 염화 백금산, 염화백금산과 알콜의 반응 생성물, 백금-올레핀 착화합물, 백금 비닐실록산착화합물, 백금 포스핀착화합물 등이 예시된다.이중 A 및 B 성분에로의 용해성이나 촉매활성이 양호하다는 점에서 염화백금산과 알콜의 반응 생성물 및 백금비닐실록산착화합물등이 적절하다. C 성분의 배합량은 A,B 성분의 합계량에 대해 백금원소의 환산으로 0.2-1,000ppm 혹은 1-100ppm이다.The C-platinum complex catalyst used in the present invention is a catalyst for promoting the addition reaction between the unsaturated aliphatic hydrocarbon group of the component A and the hydrosyryl group of the component B and is excellent in that the curing ability is good at or near room temperature. . Examples of the platinum complex include chloroplatinic acid, reaction products of chloroplatinic acid and alcohols, platinum-olefin complexes, platinum vinylsiloxane complexes, platinum phosphine complexes, and the like. Among them, they have good solubility and catalytic activity in A and B components. Reaction products of chloroplatinic acid and alcohols and platinum vinylsiloxane complexes are suitable. The compounding quantity of C component is 0.2-1,000 ppm or 1-100 ppm in conversion of a platinum element with respect to the total amount of A, B component.
0.2ppm미만인 경우는 경화속도가 느리고 경화가 완전히 종료되지 않으므로 성형틀이나 틀을 떠서 얻어지는 성형체가 점착성을 띠어 이형성이 저하된다. 1,000ppm을 초과하면 경화속도가 지나치게 빨라지므로 각 성분의 배합후의 작업성이 훼손되어 비경제적이다.If the content is less than 0.2 ppm, the curing speed is slow and the curing is not completely completed. Therefore, the molded product obtained by floating the mold or the mold exhibits adhesiveness and the releasability is lowered. If the content exceeds 1,000 ppm, the curing speed becomes too fast, and thus the workability after the compounding of each component is impaired, which is uneconomical.
본 발명에서 사용되는 D 성분은 본 발명의 형틀재료의 최대특징을 이루는 성분이다. 이 D 성분은 경화되어 얻어진 성형틀의 모형으로 부터의 이형성 및 이 성형틀에 수지를 주입해 경화시킴으로써 얻어지는 복제품의, 성형틀로부터의 이형성을 향상시키는 작용 및 경화해서 얻어진 성형체의 틀로부터의 이형성을 향상시키는 작용을 갖는 성분이다.D component used in this invention is a component which comprises the maximum characteristic of the mold material of this invention. This component D exhibits the releasability from the mold of the mold obtained by curing and the effect of improving the releasability from the mold of the replica obtained by injecting and curing the resin into the mold, and the mold releasability from the mold of the molded article obtained by curing. It is a component having an action of improving.
D 성분으로는 팔라듐, 로듐, 백금으로 이루어지는 무리에서 선택된 금속 및 그 합금의 분말, 혹은 이들을 각종담체에 담지시킨 것이 사용된다. 이러한 담체로는 탄소, 알루미나, 실리카등이 예시된다. 이 3종의 금속중 이형성의 향상효과가 큰 백금이 가장 좋다. 또 금속중량당의 이형성의 향상효과가 크다고 하는 점에서는 금속 분말보다는 담체에 담지시킨 것이 좋다.As the D component, a metal selected from the group consisting of palladium, rhodium and platinum and powders of alloys thereof, or those supporting them on various carriers are used. Examples of such a carrier include carbon, alumina, silica and the like. Among these three metals, platinum having the greatest effect of improving releasability is the best. In addition, it is preferable that the carrier is supported on the carrier rather than the metal powder in that the effect of improving the releasability per weight of metal is large.
D 성분의 배합량은 A,B 성분의 합계량에 대해 금속원소의 환산으로 5-1,000ppm 바람직하게는 10-500ppm이다.The blending amount of the D component is 5-1,000 ppm, preferably 10-500 ppm in terms of metal elements relative to the total amount of the A and B components.
5ppm 이하인 경우는 이형성향상의 효과가 거의 나타나지 않는다. 한편 1,000ppm 이상 첨가해도 이 이상의 박형성의 향상은 바랄 수 없어 비경제적이다. 본 발명의 형틀재료는 성형체의 기계적 강도를 높이기 위해 무기질 충전제를 배합해도 좋다. 무기질 충전제로는 연무질 실리카, 침전 실리카, 실리카 에어로겔, 소설실리카, 연무질산화티탄과 같은 보강성 충전제, 분쇄석영, 규조토, 알루미노규산, 아스베스토스(asbestos), 분말마이카, 알루미나, 산화아연, 산화철, 탄산칼슘과 같은 비 보강성충전제가 예시되며 이들은 트리메틸클로로실라, 폴리디메틸실록산, 헥사메틸디실라잔과 같은 유기 규소 화합물로 표면을 처리해서 사용해도 좋다.In the case of 5 ppm or less, the effect of improving the release property is hardly seen. On the other hand, even if it is added 1,000 ppm or more, improvement of this thinness cannot be desired and it is uneconomical. The mold material of the present invention may contain an inorganic filler in order to increase the mechanical strength of the molded body. Inorganic fillers include fumed silica, precipitated silica, silica aerogels, novel silica, reinforcing fillers such as titanium oxide, fumed crushed quartz, diatomaceous earth, aluminosilicate, asbestos, powdered mica, alumina, zinc oxide, iron oxide, carbonate Non-reinforcing fillers such as calcium are exemplified and these may be used by treating the surface with organosilicon compounds such as trimethylchlorosila, polydimethylsiloxane, hexamethyldisilazane.
또 본 발명에 사용되는 형틀재료의 실온에서의 경화시간을 연장하기 위해 아세틸렌 화합물, 말레인산디아릴, 트리아릴이소아눌레이트, 니트릴 화합물 또는 유기과산화물과 같은 경화지연제를 배합해도 좋다. 그밖에 필요에 따라 안료, 가소재등을 배합해도 좋다.Moreover, in order to extend the hardening time at room temperature of the mold material used for this invention, you may mix | blend hardening retarders, such as an acetylene compound, a diaryl maleic acid, a triaryl isocyanurate, a nitrile compound, or an organic peroxide. In addition, you may mix | blend a pigment, a plastic material, etc. as needed.
본 발명의 형틀재료는 통상 B성분과 C성분 및 D성분을 포함하는 성분을 별개로 보존해 두고 사용직전에 양성분을 균일하게 혼합한 뒤 사용하지만 반응 지연제의 존재하에 모든 성분을 동일한 용기내에 보존하는 것도 가능하다.The mold material of the present invention is generally used after the components containing the B component, C component and D component are separately stored and uniformly mixed with the positive components just before use, but all components in the same container in the presence of the reaction retardant are used. It is also possible to preserve.
본 발명의 성형틀의 제조 방법은 예를 들면 형틀재료를 소망하는 모형내에서 경화시키는 방법, 적당한 용기내의 모형을 설치해 전술한 용기내에 형틀재료를 부은후 경화시키는 방법등이 적용된다. 경화온도는 실온 혹은 그 이상의 임의의 온도로도 되지만 틀을 뜨는 성형체의 용도나 형틀에로의 주입방법등에 따라 적절하게 정해진다.The manufacturing method of the molding die of the present invention is, for example, a method of curing the mold material in a desired model, a method of installing the model in a suitable container, and then pouring the mold material into the container described above and curing the mold material. The curing temperature may be any room temperature or higher, but is appropriately determined according to the use of the molded body to be cast or the injection method into the mold.
예를 들면 사출 성형에 의한 경우 경화온도로는 50-250℃가 적절하다. 50℃ 미만에서는 경화가 느려 성형사이클에 긴 시간을 요한다. 역으로 250℃를 넘으면 성형체의 기계적 특성이 떨어진다.For example, in the case of injection molding, a curing temperature of 50-250 ° C. is appropriate. Below 50 ° C., curing is slow and requires a long time for the molding cycle. On the contrary, if it exceeds 250 degreeC, the mechanical property of a molded object will fall.
본 발명의 형틀재료는 뛰어난 이형성을 나타내며 또 모형에 대해 이형성이 뛰어난 성형품을 얻을 수 있다.The mold material of the present invention exhibits excellent mold release properties, and a molded article excellent in mold release properties with respect to a model can be obtained.
이러한 형틀재료로 얻어지는 성형틀은 각종의 주형 재료에 대해 뛰어난 이형성을 나타내며 이같은 틀을 프로토타이프성형의 분야에서 극히 유용하다. 또 본 발명의 제조 방법으로 성형틀의 생산성이 크게 향상되며 특히 경화지연제를 사용한 작업가능시간이 길어 부가반응형 조성물의 틀형성에 특히 유용하며 예를 들면 사출성형에 다른 각종 고무부품의 제조가 프로토타이프 성형등에서 사용되는 실리콘 고무틀의 제조에 적용된다.Molding molds obtained from such mold materials exhibit excellent release properties for various mold materials and are extremely useful in the field of prototyping. In addition, the production method of the present invention greatly improves the productivity of the molding die, in particular, the long working time using the curing retardant is particularly useful for the mold forming of the addition-reactive composition, for example, the production of various rubber parts for injection molding It is applied to the manufacture of silicone rubber molds used in prototyping molding.
이하 본 발명을 실시예로 나타낸다. 여기에서 부는 전부 중량부를 나타내며 점도등의 물성값은 전부 25℃경우의 값이다.Hereinafter, the present invention is shown by examples. Herein, all parts are parts by weight, and all physical property values such as viscosity are the values at 25 ° C.
[실시예 1]Example 1
점도 98,000cP의 양말단이 비닐기로 봉쇄된 폴리디메틸실록산 770부, 트리메틸실록시단위, 디메틸비닐실록시 단위 및 SiO2단위(몰비 5:1:7)로 이루어지는 크실렌가용 비닐폴리실록산 축합물 180부, 점도 20cP인 메틸하이드로겐 폴리실록산(Si-H기 0.9중량% 함유) 50부, 5%의 백금을 알루미나 분말에 담지시킨 것 1부, 염화 백금산 옥탄올착화합물(백금으로 2중량% 함유) 1.5부를 균일해지도록 혼합해 형틀재료를 얻었다. 이것의 점도는 63,000cP로 틀에 쉽게 집어 넣을 수 있었다.180 parts of xylene soluble vinyl polysiloxane condensates composed of 770 parts of polydimethylsiloxane, trimethylsiloxy unit, dimethylvinylsiloxy unit and SiO 2 units (molar ratio 5: 1: 7) in which the sock end having a viscosity of 98,000 cP, 50 parts of methylhydrogen polysiloxane having a viscosity of 20 cP (containing 0.9% by weight of Si-H group), 1 part of 5% platinum supported on alumina powder, and 1.5 parts of chloroplatinic acid octanol complex (containing 2% by weight of platinum) uniformly Mixing was carried out to obtain a mold material. Its viscosity was 63,000 cP and could easily be put into the mold.
또 이것을 두께 2mm의 금형에 부어넣어 실온에서 24시간 방치해서 시트모양의 경화물을 얻었다. 이 시트모양의 경화물을 150℃에서 30분간 가열해 완전히 경화시켰다. 이것의 물성은 아래와 같다. 경도 43(JIS A), 인장강도 22kg.f/㎠, 신축성 280% 당김파열강도 12kg.f/㎝(JIS A). 다음에 서로 8㎝, 가로 15㎝, 높이 5㎝의 용기중에 ABS 수지제의 모형을 두고 여기에 형틀재료를 부어넣어 실온에서 24시간 방치하고 그 뒤 60℃에서 4시간 가열했다.Moreover, it poured into the metal mold | die of thickness 2mm, it was left to stand at room temperature for 24 hours, and the sheet-like hardened | cured material was obtained. This sheet-like hardened | cured material was heated at 150 degreeC for 30 minutes, and it hardened completely. Its physical properties are as follows. Hardness 43 (JIS A), tensile strength 22 kg.f / cm 2, stretch 280% pull rupture strength 12 kg.f / cm (JIS A). Next, a mold made of ABS resin was placed in a container having a width of 8 cm, a width of 15 cm, and a height of 5 cm, and the mold material was poured therein, and allowed to stand at room temperature for 24 hours, followed by heating at 60 ° C for 4 hours.
경화물에서 모형을 꺼내어 실리콘 고무틀을 얻었다. 이 실리콘 고무틀을 사용해 이형성을 시험했다. 즉 실리콘 고무틀에 대해 그 포장형 우레탄 수지하이 캐스트 3075(상품명, 고꾸사이케미컬(주) 사이)를 주입해 경화시켜 복제품을 얻었다. 이 복제품제조를 계속해 가면 36번째 틀이탈이 강하게 보이며 44번째에서 일부가 접착되어 고무틀의 부분파괴가 보였다.The model was taken out of the cured product to obtain a silicone rubber mold. The release property was tested using this silicone rubber frame. That is, the packaged urethane resin high cast 3075 (trade name, between Kokusai Chemical Co., Ltd.) was injected into the silicone rubber mold and cured to obtain a replica. Continuing the manufacture of this replica, the 36th mold outlining was seen as strong, and the 44th part was glued to show the partial destruction of the rubber mold.
또 주입수지로써 2포장형 에폭시수지인 CEP-5(상품명, 고꾸사이케미컬(주) 사이)를 사용한 경우는 12번째에서 틀분리가 심하게 느껴졌고 15번째에서는 일부가 접착되어 고무틀의 부분 파손 현상이 나타났다.In addition, when the CEP-5 (trade name, Koku Chemical Co., Ltd.), a two-package epoxy resin, was used as the injection resin, the mold separation was severely felt in the 12th, and in the 15th part, the part was adhered and the rubber frame was partially broken. appear.
[실시예 2-7, 비교예 1]Example 2-7, Comparative Example 1
실시예 1의 형틀재료에서 5%의 백금담지 알루미나분말 1부 대신에 표 1에 나타내는 종류의 금속 분말 및 첨가량에 의해 재료를 얻었다. 이 형틀 재료를 사용해 실시예 1과 같은 에폭시 수지 CEP-5에 대한 형틀시험을 했다. 결과를 표 1에 나타낸다.In the mold material of Example 1, the material was obtained by the metal powder of the kind shown in Table 1, and addition amount instead of 1 part of 5% platinum supporting alumina powder. Using this mold material, a mold test was carried out for the same epoxy resin CEP-5 as in Example 1. The results are shown in Table 1.
[표 1]TABLE 1
[실시예 8]Example 8
점도 9,500cP의 양말단이 비닐기로 봉쇄된 폴리디메틸실록산 725부, 트리메틸실록시단위, 디메틸비닐실록시 단위 및 SiO2단위(몰비 5:1:7)로 이루어지는 크실렌가용 비닐폴리실록산 축합물 80부, 표면을 트리메틸클로로실란으로 처리한 연무질 실리카 170부, 점도 20cP인 메틸하이드로겐 폴리실록산(Si-H기 0.9중량% 함유) 25부, 5%의 백금 담지 알루미나분말 1부, 백금-테트라메틸테트라비닐사이클로테트라 실록산착화합물(백금으로 2중량% 함유) 1.4부를 균일하게 혼합해 형틀재료를 얻었다.80 parts of xylene soluble vinyl polysiloxane condensates composed of 725 parts of polydimethylsiloxane, a trimethylsiloxy unit, a dimethylvinylsiloxy unit, and a SiO 2 unit (molar ratio 5: 1: 7) of a sock end having a viscosity of 9,500 cP, 170 parts of fumed silica treated with trimethylchlorosilane, 25 parts of methylhydrogen polysiloxane having a viscosity of 20 cP (containing 0.9 wt% of Si-H group), 1 part of 5% platinum-supported alumina powder, platinum-tetramethyltetravinylcyclo 1.4 parts of tetrasiloxane complex compounds (containing 2 weight% of platinum) were uniformly mixed to obtain a mold material.
이것의 점도는 51,000cP로, 형틀에 쉽게 부어넣을 수 있었다. 또 이것을 두께 2mm의 금형에 부어넣어 실온에서 24시간 방치해서 시트모양의 경화물을 얻었다. 이 시트모양의 경화물을 100℃에서 1시간 가열해 완전히 경화시켰다. 이것의 물성은 아래와 같다.Its viscosity was 51,000 cP and could be easily poured into the mold. Moreover, it poured into the metal mold | die of thickness 2mm, it was left to stand at room temperature for 24 hours, and the sheet-like hardened | cured material was obtained. This sheet-like hardened | cured material was heated at 100 degreeC for 1 hour, and it hardened completely. Its physical properties are as follows.
경도 40(JIS A), 인장강도 52kg.f/㎠, 신축성 330% 당김파열강도 20kg.f/㎝(JIS A). 이 형틀재료를 사용해 실시예 1과 같이해서 형틀시험을 했더니 우레탄수지의 하이캐스트(3075)에 대해서는 38번째에서 틀분리가 심하게 느껴지고 45번째에서 접착이 눈에 띄었다. 에폭시수지의 CEP-5에 대해서는 10번째에서 형분리가 심하게 느껴졌고 16번째에서 접착이 눈에 띄었다.Hardness 40 (JIS A), tensile strength 52 kg.f / cm 2, stretch 330% pull rupture strength 20 kg.f / cm (JIS A). When the mold test was carried out in the same manner as in Example 1 using this mold material, mold separation was severely felt at the 38th time for high cast (3075) of urethane resin, and adhesion was noticeable at the 45th time. For CEP-5 of epoxy resin, mold separation was severe at 10th and adhesion was noticeable at 16th.
[비교예 2]Comparative Example 2
실시예 8의 형틀재료에서 5% 백금 담지 알루미나 분말을 전혀 첨가하지 않은 것을 사용해 실시예 1과 같은 형틀 시험을 했다. 그 결과 우레탄수지의 하이캐스트(3075)에 대해서는 12번째에서 틀 분리가 심하게 느껴졌고 18번째에서 접착 형상 현상이 나타났다. 에폭시수지인 CEP-5에 대해서는 첫 번째부터 틀 분리가 매우 심했고 7번째에서 이미 접착 현상이 나타났다.In the mold material of Example 8, the same mold test as in Example 1 was conducted using no addition of 5% platinum-supported alumina powder. As a result, the mold separation was severely felt in the 12th for high cast (3075) of urethane resin, and the adhesive shape phenomenon appeared in the 18th. For epoxy resin CEP-5, mold separation was very severe from the first, and adhesion phenomenon was already seen in the seventh.
[비교예 3]Comparative Example 3
실시예 3의 조성물에서 5% 백금 담지 알루미나 분말을 전혀 첨가하지 않고 대신에 점도 50cP의 디메틸폴리 실록산 50부를 첨가한 것을 사용해 실시예 1과 같은 형틀 시험을 했다. 그 결과 우레탄 수지인 하이캐스트(3075)에 대해서 24번째에서 틀분리가 심했고 29번째에서 접착 현상이 나타났다. 또 얻어진 복제물에 아크릴계 도료를 칠했더니 부분적으로 튀김 현상이 나타났다. 에폭시수지의 CEP-5에 대해서는 첫 번째에서부터 틀 분리는 매우 심했고 11번째에서 접착 현상이 나타났다.In the composition of Example 3, the mold test was carried out as in Example 1 using no 5% platinum-supported alumina powder and 50 parts of dimethylpolysiloxane having a viscosity of 50 cP. As a result, the mold separation was severe at the 24th and the adhesion at the 29th for the high cast urethane resin (3075). Moreover, when the obtained replica was coated with acrylic paint, the frying phenomenon appeared partially. For CEP-5 of epoxy resin, mold separation was very severe from the first and adhesion phenomenon occurred in the 11th.
[비교예 4][Comparative Example 4]
실시예 8의 형틀 재료에서 5% 백금 담지 알루미나 분말을 전혀 사용하지 않고 똑같은 형틀 재료를 제조해 실시예 8과 똑같은 사출 성형을 했다. 경화 성형물은 금형에 대해 밀착된 듯했으며 잘벗겨지지 않았다.In the mold material of Example 8, the same mold material was prepared without using any 5% platinum-supported alumina powder, and the same injection molding as in Example 8 was performed. The cured moldings appeared to be in close contact with the mold and did not peel off.
[실시예 9]Example 9
점도 98,000cP의 양말단이 비닐기로 봉쇄된 폴리디메틸실록산 650부, 트리메틸실록시단위, 디메틸비닐실록시 단위 및 SiO2단위(몰비 5:1:7)로 이루어지는 크실렌가용 비닐폴리실록산 축합물 280부, 점도 20cP인 메틸하이드로겐 폴리실록산(Si-H기 0.9중량% 함유) 70부, 5%의 백금 담지 알루미나분말 1부, 백금-테트라비닐테트라메틸사이클로테트라 실록산착화합물(백금으로 2중량% 함유) 0.2부, 비스(1,1-디메틸 프로파르길옥시)(1,1-dimethylpropargyloxy) 디메틸실란 0.3부를 균일하게 혼합해 형틀재료를 얻었다. 이것의 점도는 72,000cP로, 25℃에서 8시간 방치해도 그 점도는 103,000cP로 그다지 상승되지는 않았다. 이것을 두께 2mm의 표면을 크롬 도금한 금형에 150℃에서 15분간 프레스 성형을해 시트 모양의 경화물을 얻었다. 이것의 물성은 다음과 같았다.280 parts of xylene soluble vinyl polysiloxane condensate consisting of 650 parts of polydimethylsiloxane, trimethylsiloxy unit, dimethylvinylsiloxy unit and SiO 2 unit (molar ratio 5: 1: 7) in which the sock end of viscosity 98,000 cP is sealed with vinyl group, 70 parts of methylhydrogen polysiloxane having a viscosity of 20 cP (containing 0.9% by weight of Si-H group), 1 part of 5% platinum-supported alumina powder, and 0.2 parts of platinum-tetravinyltetramethylcyclotetrasiloxane complex (containing 2% by weight of platinum) 0.3 parts of bis (1,1-dimethylpropargyloxy) (1,1-dimethylpropargyloxy) dimethylsilane were mixed uniformly to obtain a mold material. Its viscosity was 72,000 cP, and even if it was left at 25 ° C. for 8 hours, the viscosity was not increased to 103,000 cP. This was press-molded at 150 degreeC for 15 minutes to the metal mold | die which chrome-plated the surface of thickness 2mm, and the sheet-like hardened | cured material was obtained. Its physical properties were as follows.
경도(JIS A) 58, 인장강도 59kg.f/㎠, 신축성 310% 당김파열(JIS A) 16kg.f/㎝. 이 형틀재료를 사출성형기로 표면을 크롬도금한 긴 직경 20mm, 짧은 직경 10mm, 두께 2mm의 타원 판자형의 시험편 16개들이 금형에 250kg.f/cm2의 압력으로 사출해 110℃에서 250초 가열해서 경화시킨뒤 금형에 꺼냈다. 경화성 형물의 금형으로부터의 이형성은 양호해 용이하게 꺼낼 수 있었다.Hardness (JIS A) 58, tensile strength 59 kg.f / cm 2, stretch 310% pull rupture (JIS A) 16 kg.f / cm. 16 pieces of test specimens of 20 mm long, 10 mm short and 2 mm thick oval planks chrome-plated on the surface of the mold were injected into the mold at a pressure of 250 kg.f / cm 2 and heated at 110 ° C for 250 seconds. After curing, the mold was taken out. The release property from the metal mold | die of curable molding was favorable, and it was easy to take out.
[실시예 10-15, 비교예 4, 5][Examples 10-15 and Comparative Examples 4 and 5]
실시예 9의 형틀 재료에서 5%의 백금담지 알루미나 분말 1부 대신에 표 2에 나타내는 종류 및 첨가량의 금속 분말을 사용해 형틀 재료를 얻었다. 이러한 형틀 재료를 사용해 실시예 8과 같은 사출성형을 해서 성형물의 금형으로부터의 이형성을 관찰했다. 결과를 표 2에 나타낸다.The mold material was obtained using the metal powder of the kind and addition amount shown in Table 2 instead of 1 part of 5% platinum supporting alumina powder in the mold material of Example 9. Injection molding was carried out in the same manner as in Example 8 using this mold material, and the release property from the mold of the molded product was observed. The results are shown in Table 2.
[표 2]TABLE 2
[실시예 16]Example 16
점도 40,500cP의 양말단이 비닐기로 봉쇄된 폴리디메틸실록산 880부, 트리메틸실록시단위, 디메틸비닐실록시 단위 및 SiO2단위(몰비 5:1:7)로 이루어지는 크실렌 가용비닐폴리실록산 축합물 100부, 점도 20cP인 메틸하이드로겐 폴리실록산(Si-H기 0.9중량% 함유) 20부, 표면이 트리메틸클로로실란으로 처리된 비표면적 200㎡/g의 연무질 실리카 300부, 염화 백금산 옥탄올착화합물(백금으로 2중량% 함유) 0.15부, 5%의 백금을 알루미나 분말에 담지시킨 것 1부, 비스(1,1-디메틸프로파르길옥시)디메틸실란 0.4부를 균일하도록 혼합해 형틀재료를 얻었다. 이것을 두께 2mm의 표면을 크롬 도금한 금형에 넣어 170℃에서 15분간 프레스 성형에 시트 모양의 경화물을 얻었다.100 parts of xylene soluble vinyl polysiloxane condensate composed of 880 parts of polydimethylsiloxane, a trimethylsiloxy unit, a dimethylvinylsiloxy unit and a SiO 2 unit (molar ratio 5: 1: 7) in which the sock end having a viscosity of 40,500 cP, 20 parts of methylhydrogen polysiloxane having a viscosity of 20 cP (containing 0.9 wt% of Si-H group), 300 parts of fumed silica having a specific surface area of 200 m 2 / g treated with trimethylchlorosilane, and a chloroplatinic acid octanol complex compound (2 weight of platinum) %)) 0.15 parts, 5 parts of platinum supported on an alumina powder, and 1 part of bis (1,1-dimethylpropargyl) dimethylsilane were mixed uniformly to obtain a mold material. This was put into the metal mold | die which chrome plated the surface of thickness 2mm, and the sheet-shaped hardened | cured material was obtained by press molding at 170 degreeC for 15 minutes.
시트모양의 경화물을 쉽게 금형에서 꺼낼 수 있었다. 이것의 물성은 다음과 같다. 경도(JIS A) 38, 인장강도 90kg.f/㎠, 신축성 650% 당김파열강도(JIS A) 35kg.f/㎝. 이 형틀재료를 사출성형기로 표면을 크롬도금한 직경 120mm, 두께 5mm인 원판형의 시험편 4개들이 금형에 1.5t/㎠의 압력으로 사출하고 160℃로 80초 가열해서 경화시킨 뒤 금형에서 꺼냈다. 경화 성형물의 금형에서의 이형성은 양호해 용이하게 꺼낼 수 있었다.The sheet-shaped hardened | cured material could be easily taken out from the metal mold | die. Its physical properties are as follows. Hardness (JIS A) 38, tensile strength 90kg.f / cm2, stretch 650% pull rupture strength (JIS A) 35kg.f / cm. Four die-shaped test specimens of 120 mm in diameter and 5 mm in thickness, which were chrome plated on the surface of the mold material, were injected into the mold at a pressure of 1.5 t / cm 2, heated at 160 ° C. for 80 seconds, and cured. The release property in the metal mold | die of the hardened molding was favorable, and it was easy to take out.
[비교예 6]Comparative Example 6
실시예 8의 형틀 재료에서 5% 백금 담지 알루미나 분말을 전혀 사용하지 않는 것 외에는 같은 방법으로 형틀재료를 제조하고 사출 성형을 했다. 경화생성물은 금형에 대해 밀착된 듯 했고 잘 벗겨지지 않았다.The mold material was produced and injection-molded in the same manner except that no 5% platinum-supported alumina powder was used in the mold material of Example 8. The hardening product appeared to adhere closely to the mold and did not peel off well.
[실시예 17]Example 17
점도 9,500cP의 양말단이 비닐기로 봉쇄된 폴리디메틸실록산 725부, 트리메틸실록시단위, 디메틸비닐실록시 단위 및 SiO2단위(몰비 5:1:7)로 이루어지는 크실렌 가용비닐폴리실록산 축합물 80부, 점도 20cP인 메틸하이드로겐 폴리실록산(Si-H기 0.9중량% 함유) 25부, 표면을 트리메틸클로로실란으로 처리한 비표면적 200㎡/g의 연무질 실리카 170부, 5% 백금 담지 알루미나 분말 1부, 백금-테트라 비닐 테트라메틸 사이클로테트라실록산 착화합물(백금 2.0중량% 함유) 1.4부, 비스(1,1-디메틸 프로파르길옥시)디메틸실란 5.5부를 균일하게 혼합해 형틀재료를 얻었다. 이것의 점도는 51,000cP로 형틀에 쉽게 부을 수 있었다.80 parts of xylene soluble vinyl polysiloxane condensate composed of 725 parts of polydimethylsiloxane, a trimethylsiloxy unit, a dimethylvinylsiloxy unit, and a SiO 2 unit (molar ratio 5: 1: 7) of a sock end having a viscosity of 9,500 cP, 25 parts of methylhydrogen polysiloxane having a viscosity of 20 cP (containing 0.9 wt% of Si-H group), 170 parts of fumed silica having a specific surface area of 200 m 2 / g treated with trimethylchlorosilane, 1 part of 5% platinum-supported alumina powder, platinum -1.4 parts of tetravinyl tetramethyl cyclotetrasiloxane complex (containing 2.0 wt% platinum) and 5.5 parts of bis (1,1-dimethyl propargyloxy) dimethylsilane were uniformly mixed to obtain a mold material. Its viscosity was 51,000 cP and could be easily poured into the mold.
이것을 30℃에서 24시간 방치해도 점도는 53,000cP로 그다지 변화가 없었다. 이것을 두께 2mm의 표면을 크롬 도금한 금형에 넣고 150℃에서 15분간 프레스 성형에 시트모양의 경화물을 얻었다.Even if it was left to stand at 30 degreeC for 24 hours, the viscosity did not change very much to 53,000 cP. This was put in the metal mold | die which chrome-plated the surface of thickness 2mm, and the sheet-shaped hardened | cured material was obtained by press molding at 150 degreeC for 15 minutes.
시트모양의 경화물을 쉽게 금형에서 꺼낼 수 있었다. 이것의 물성은 다음과 같았다.The sheet-shaped hardened | cured material could be easily taken out from the metal mold | die. Its physical properties were as follows.
경도42(JIS A), 인장강도 55kg.f/㎠, 신축성 310% 당김파열강도 18kg.f/㎝(JIS A). 다음에 세로 45㎝, 가로 20mm, 높이 60mm인 화장합판제의 용기중에 ABS 수지제의 모형을 고정하고 여기에 형틀 재료를 부어 넣어 60℃로 13시간 방치해 경화시켰다. 그 뒤 화장합판제 용기를 떠어내고 이어서 메스로 절개해서 ABS 수지제 모형을 꺼내어 실리콘 고무형을 얻었다. 실리콘 고무형은 ABS 수지제 모형으로부터 용이하게 떠어낼 수 있었다.Hardness 42 (JIS A), tensile strength 55 kg.f / cm 2, stretch 310% pull burst strength 18 kg.f / cm (JIS A). Next, a model made of ABS resin was fixed in a container made of a plywood having a length of 45 cm, a width of 20 mm, and a height of 60 mm, the mold material was poured therein, and left at 60 ° C. for 13 hours to cure. Then, the makeup plywood container was taken out, and then cut out with a scalpel to take out a model made of ABS resin to obtain a silicone rubber mold. The silicone rubber mold was easily removed from the ABS resin model.
[비교예 7]Comparative Example 7
실시예 9의 형틀 재료에서 5% 백금 담지 알루미나 분말을 전혀 사용하지 않은 외에는 같은 방법으로 실리콘 고무형의 성형을 했다.The silicone rubber mold was molded in the same manner except that no 5% platinum-supported alumina powder was used in the mold material of Example 9.
그 결과 실리콘 고무형은 ABS수지제의 모형에 강하게 접착되어 있는 부분이 있어 무리하게 벗겨 냈더니 고무형틀의 일부가 찢어져 떨어졌다.As a result, there was a part that the silicone rubber was strongly adhered to the model made of ABS resin, and when peeled off forcibly, part of the rubber mold was torn off.
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP88-166823 | 1988-07-06 | ||
JP63166823A JPH0218453A (en) | 1988-07-06 | 1988-07-06 | Mold-shaping material and production of forming mold using said material |
JP166823 | 1988-07-06 |
Publications (2)
Publication Number | Publication Date |
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KR900001794A KR900001794A (en) | 1990-02-27 |
KR920007575B1 true KR920007575B1 (en) | 1992-09-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890008412A KR920007575B1 (en) | 1988-07-06 | 1989-06-16 | Mold-shaping material and production of forming mold using said material |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0218453A (en) |
KR (1) | KR920007575B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4405245A1 (en) * | 1994-02-18 | 1995-08-24 | Wacker Chemie Gmbh | Heat-stable silicone rubber resulting addition-crosslinking compositions |
US5684060A (en) * | 1996-04-09 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Compositions containing inorganic, organic and organometallic palladium hydrogen scavengers |
JP4787128B2 (en) * | 2006-10-18 | 2011-10-05 | 信越化学工業株式会社 | Room temperature curable thermally conductive silicone rubber composition |
-
1988
- 1988-07-06 JP JP63166823A patent/JPH0218453A/en active Pending
-
1989
- 1989-06-16 KR KR1019890008412A patent/KR920007575B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR900001794A (en) | 1990-02-27 |
JPH0218453A (en) | 1990-01-22 |
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