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KR910016854A - 반도체 봉지용 에폭시 수지 조성물 - Google Patents

반도체 봉지용 에폭시 수지 조성물 Download PDF

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Publication number
KR910016854A
KR910016854A KR1019910004610A KR910004610A KR910016854A KR 910016854 A KR910016854 A KR 910016854A KR 1019910004610 A KR1019910004610 A KR 1019910004610A KR 910004610 A KR910004610 A KR 910004610A KR 910016854 A KR910016854 A KR 910016854A
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KR
South Korea
Prior art keywords
group
integer
alkyl group
carbon atoms
epoxy
Prior art date
Application number
KR1019910004610A
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English (en)
Other versions
KR950001316B1 (ko
Inventor
히로미 이또오
이찌로우 다까바시
히로조우 가네가에
Original Assignee
시기 모리야
미쓰비시뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR910016854A publication Critical patent/KR910016854A/ko
Priority to KR1019940027713A priority Critical patent/KR950001317B1/ko
Application granted granted Critical
Publication of KR950001316B1 publication Critical patent/KR950001316B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체 봉지용 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. (1) 일반식(Ⅰ):
    식중, R1~R3은 각각 2가의 유기기, R4~R10은 각각 탄소수 1~10의 알킬기, 탄소수 1~10의 알코키시기, 탄소수 1~10의 히드록시키기 알킬기, 페닐기 또는 탄소수 1~10의 불소치환 알킬기, a는 5~300의 정수, b는 0~10의 정수, 단 0≤〔b/(a+)〕≤0.32)로 표시되는 히드록키시 페닐기를 가지는 변성 실리콘오일과, 일반식(Ⅱ):
    (식중, R11~R13은 각각 2가의 유기기, R14~R20은 각각 탄소수 1~10의 알킬기, 탄소수 1~10의 알코키시기, 탄소수 1~10의 히드로키시기 알킬기, 페닐기 또는 탄소수 1~10의 불소치환 알킬기, c는 5~300의 정수, d는 0~10의 정수, 단, 0≤〔d/(c+d)〕≤0.32)로 표시되는 에폭시기를 가지는 변성 실리콘 오일 및 (또는) 일반식(Ⅲ):
    (식중, R21, R22는 각각 직접결합 또는 2가의 유기기, e는 0~20의 정수를 표시하는, 벤젠고리의 수소원자는 치환되어 있어도 좋다)로 표시되는 양단말에 에폭시기를 가지는 에폭시 수지와의 공중합체(共重合體)로 이루어지는 말단 및(또는) 내부 히드로키시 페닐기 함유실리콘의 가요화제(可僥化劑)로서 함유하고, 에폭시수지, 경화제, 경화촉진제, 충진제, 이형제, 착색제 및 표면처리제를 함유하여 이루어지는 반도체 봉지용 에폭시수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910004610A 1990-03-23 1991-03-23 반도체 봉지용 에폭시수지 조성물 KR950001316B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940027713A KR950001317B1 (ko) 1990-03-23 1994-10-27 반도체 봉지용 에폭시수지 조성물

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7512890 1990-03-23
JP2-75128 1990-03-23
JP2-198272 1990-07-24
JP2198272A JP2723348B2 (ja) 1990-03-23 1990-07-24 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR910016854A true KR910016854A (ko) 1991-11-05
KR950001316B1 KR950001316B1 (ko) 1995-02-17

Family

ID=26416269

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910004610A KR950001316B1 (ko) 1990-03-23 1991-03-23 반도체 봉지용 에폭시수지 조성물

Country Status (4)

Country Link
US (1) US5114994A (ko)
JP (1) JP2723348B2 (ko)
KR (1) KR950001316B1 (ko)
BE (1) BE1006505A5 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100343376B1 (ko) * 1993-12-31 2002-11-23 고려화학 주식회사 반도체소자봉지용경화제의제조방법및이를함유하는반도체소자봉지용수지조성물

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US5844053A (en) * 1995-03-14 1998-12-01 Nagase-Ciba, Ltd. Organo-polysiloxane derivartives
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
KR101159050B1 (ko) * 2003-12-26 2012-06-22 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 이의 경화물
DE102005060860A1 (de) * 2005-12-20 2007-06-28 Robert Bosch Gmbh Elektronikkomponente mit Vergussmasse
JP6106931B2 (ja) * 2012-03-14 2017-04-05 日立化成株式会社 相容化樹脂、及びこれを用いた熱硬化性樹脂組成物、プリプレグ、積層板
EP3173434B1 (en) * 2014-07-24 2019-11-20 Mitsubishi Chemical Corporation Thermosetting resin composition and molded body thereof
JP6657566B2 (ja) * 2015-02-24 2020-03-04 三菱ケミカル株式会社 低粘度樹脂組成物
KR102146994B1 (ko) * 2017-12-29 2020-08-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

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JPS564647A (en) * 1979-06-25 1981-01-19 Toshiba Corp Heat-resistant resin composition
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JPS5958024A (ja) * 1982-09-29 1984-04-03 Toshiba Corp 半導体封止用エポキシ樹脂組成物の製造方法
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JPS59226066A (ja) * 1983-06-08 1984-12-19 Sumitomo Deyurezu Kk エポキシ樹脂粉体塗料組成物
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
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JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100343376B1 (ko) * 1993-12-31 2002-11-23 고려화학 주식회사 반도체소자봉지용경화제의제조방법및이를함유하는반도체소자봉지용수지조성물

Also Published As

Publication number Publication date
BE1006505A5 (nl) 1994-09-13
US5114994A (en) 1992-05-19
KR950001316B1 (ko) 1995-02-17
JP2723348B2 (ja) 1998-03-09
JPH03277619A (ja) 1991-12-09

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