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Priority to KR870009301ApriorityCriticalpatent/KR890003992A/en
Publication of KR890003992ApublicationCriticalpatent/KR890003992A/en
반도체 팩케이지 리드부분의 납땜 또는 도금 공정의 전 처리를 하기 위한 조성물Composition for pretreatment of soldering or plating process of semiconductor package lead part
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
Claims (1)
본문에서 설명한 바와같이 인산나트륨 4-8%, 염화나트륨 4-8%, 질산나트륨 3-7%, 계면활성제 1-3%, 황산 4-15%를 물에 용해시켜 제조한 반도체 팩케이지 리드부분의 납땜 또는 도금공정의 전 처리를 하기 위한 조성물.As described in the text, 4-8% of sodium phosphate, 4-8% of sodium chloride, 3-7% of sodium nitrate, 1-3% of surfactant, and 4-15% of sulfuric acid are dissolved in water. Composition for pretreatment of soldering or plating process.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR870009301A1987-08-261987-08-26
Composition for pretreatment of soldering or plating process of semiconductor package lead part
KR890003992A
(en)