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KR880003427A - 반도체 장치 및 그에 사용되는 리드프레임 - Google Patents

반도체 장치 및 그에 사용되는 리드프레임 Download PDF

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Publication number
KR880003427A
KR880003427A KR870005275A KR870005275A KR880003427A KR 880003427 A KR880003427 A KR 880003427A KR 870005275 A KR870005275 A KR 870005275A KR 870005275 A KR870005275 A KR 870005275A KR 880003427 A KR880003427 A KR 880003427A
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KR
South Korea
Prior art keywords
stage portion
lead
semiconductor devices
semiconductor element
extending
Prior art date
Application number
KR870005275A
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English (en)
Other versions
KR900004721B1 (ko
Inventor
후미오 구라이시
Original Assignee
미쓰노브 다게기오
신고오덴기 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰노브 다게기오, 신고오덴기 고오교오 가부시끼가이샤 filed Critical 미쓰노브 다게기오
Publication of KR880003427A publication Critical patent/KR880003427A/ko
Application granted granted Critical
Publication of KR900004721B1 publication Critical patent/KR900004721B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

반도체장치 및 그에 사용되는 리드 프레임
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 리드 프레임의 실시예를 나타내는 부분평면도.
제2도는 본 발명의 리드 프레임을 사용한 수지봉지형 반도체 장치의 일예를 나타낸 단면도.

Claims (2)

  1. 히이트 스프레더를 뻗어내어 형성시킨 스테이지부에 반도체 소자를 고정시킴과 더불어 이 반도체 소자와 내부 리드는 회로패턴 형성 필름에 의해서 연결되어 수지봉지되는 것을 특징으로 하는 반도체 장치.
  2. 반도체 소자를 고정시키는 스테이지부와 이 스테이지부에 대향하는 내부 리드를 갖는 리드 프레임에 있어서 이 내부 리드와 상기 스테이지부와의 사이에 이 스테이지부로부터 뻗어나오는 히이트 스프레더를 설비한 것을 특징으로 하는 리드 프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870005275A 1986-08-12 1987-05-27 반도체장치 및 그에 사용되는 리드 프레임 KR900004721B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61189262A JPH0815193B2 (ja) 1986-08-12 1986-08-12 半導体装置及びこれに用いるリードフレーム
JP189262 1986-08-12
JP61-189262 1986-08-12

Publications (2)

Publication Number Publication Date
KR880003427A true KR880003427A (ko) 1988-05-17
KR900004721B1 KR900004721B1 (ko) 1990-07-05

Family

ID=16238361

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870005275A KR900004721B1 (ko) 1986-08-12 1987-05-27 반도체장치 및 그에 사용되는 리드 프레임

Country Status (3)

Country Link
US (1) US4809053A (ko)
JP (1) JPH0815193B2 (ko)
KR (1) KR900004721B1 (ko)

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US4987475A (en) * 1988-02-29 1991-01-22 Digital Equipment Corporation Alignment of leads for ceramic integrated circuit packages
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
DE3912893A1 (de) * 1989-04-19 1990-10-25 Siemens Ag Als mikropack montierte halbleiteranordnung
US5146310A (en) * 1989-10-16 1992-09-08 National Semiconductor Corp. Thermally enhanced leadframe
US5025114A (en) * 1989-10-30 1991-06-18 Olin Corporation Multi-layer lead frames for integrated circuit packages
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
USRE37707E1 (en) 1990-02-22 2002-05-21 Stmicroelectronics S.R.L. Leadframe with heat dissipator connected to S-shaped fingers
JP2816244B2 (ja) * 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
US5491362A (en) * 1992-04-30 1996-02-13 Vlsi Technology, Inc. Package structure having accessible chip
JP3322429B2 (ja) * 1992-06-04 2002-09-09 新光電気工業株式会社 半導体装置
JP2861725B2 (ja) * 1993-04-07 1999-02-24 住友金属鉱山株式会社 半導体装置及びそのリードフレーム
SG68542A1 (en) * 1993-06-04 1999-11-16 Seiko Epson Corp Semiconductor device and manufacturing method thereof
JP3329073B2 (ja) * 1993-06-04 2002-09-30 セイコーエプソン株式会社 半導体装置およびその製造方法
JP2556294B2 (ja) * 1994-05-19 1996-11-20 日本電気株式会社 樹脂封止型半導体装置
KR0128164B1 (ko) * 1994-06-21 1998-04-02 황인길 반도체 패키지용 범용 히트스프레더
US5532905A (en) * 1994-07-19 1996-07-02 Analog Devices, Inc. Thermally enhanced leadframe for packages that utilize a large number of leads
US5519576A (en) * 1994-07-19 1996-05-21 Analog Devices, Inc. Thermally enhanced leadframe
JPH0878605A (ja) * 1994-09-01 1996-03-22 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
US5596485A (en) * 1995-03-16 1997-01-21 Amkor Electronics, Inc. Plastic packaged integrated circuit with heat spreader
JPH09116083A (ja) * 1995-10-16 1997-05-02 Nec Kyushu Ltd リードフレーム及び半導体装置
KR100201380B1 (ko) * 1995-11-15 1999-06-15 김규현 Bga 반도체 패키지의 열방출 구조
US5869883A (en) * 1997-09-26 1999-02-09 Stanley Wang, President Pantronix Corp. Packaging of semiconductor circuit in pre-molded plastic package
US6670207B1 (en) * 1999-03-15 2003-12-30 Gentex Corporation Radiation emitter device having an integral micro-groove lens
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
JP4889147B2 (ja) * 2000-12-14 2012-03-07 富士通セミコンダクター株式会社 半導体装置
TW490830B (en) * 2001-03-12 2002-06-11 Siliconware Precision Industries Co Ltd Heat sink with a shrinking mechanism and semiconductor device having the heat sink
JP2006201109A (ja) * 2005-01-24 2006-08-03 Nec Tokin Corp 圧電振動ジャイロ
JP5022576B2 (ja) * 2005-07-08 2012-09-12 株式会社ジャパンディスプレイイースト 表示パネルおよび表示装置

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US3930115A (en) * 1971-05-19 1975-12-30 Philips Corp Electric component assembly comprising insulating foil bearing conductor tracks
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
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US4701363A (en) * 1986-01-27 1987-10-20 Olin Corporation Process for manufacturing bumped tape for tape automated bonding and the product produced thereby

Also Published As

Publication number Publication date
US4809053A (en) 1989-02-28
JPH0815193B2 (ja) 1996-02-14
KR900004721B1 (ko) 1990-07-05
JPS6344749A (ja) 1988-02-25

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