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KR860003302A - 광중합 조성물 - Google Patents

광중합 조성물 Download PDF

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Publication number
KR860003302A
KR860003302A KR1019850007902A KR850007902A KR860003302A KR 860003302 A KR860003302 A KR 860003302A KR 1019850007902 A KR1019850007902 A KR 1019850007902A KR 850007902 A KR850007902 A KR 850007902A KR 860003302 A KR860003302 A KR 860003302A
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KR
South Korea
Prior art keywords
acrylate
composition
methacrylate
weight
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019850007902A
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English (en)
Other versions
KR910006958B1 (ko
Inventor
가즈요시 나와따 (외 2)
Original Assignee
사까노 쓰네가즈
닛뽄 가야꾸 가부시기 가이샤
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Application filed by 사까노 쓰네가즈, 닛뽄 가야꾸 가부시기 가이샤 filed Critical 사까노 쓰네가즈
Publication of KR860003302A publication Critical patent/KR860003302A/ko
Application granted granted Critical
Publication of KR910006958B1 publication Critical patent/KR910006958B1/ko
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

내용 없음

Description

광중합 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 폴리-N-비닐피롤리돈(A), 일반식(Ⅰ)
    로 나타낸 화합물(B), 여기서 R1, R2및 R3각각은 수소원자 또는 메틸기를 나타내며, 일반식(Ⅱ)
    로 나타낸 산 아미드(C), 여기서 R4는 수소원자 또는 메틸기를 나타내며, 분자내에 아크리로일기 또는 메타아크릴로일기를 갖는 단량체 화합물(D), 또한 선택적으로 과중합-개시제(E), 로 이루어지는 것을 특징으로 하는 광중합 조성물.
  2. 제1항에 있어서, 상기 조성물의 성분(A),(B),(C),(D) 및 (E) 총량중의 각 성분 (A),(B),(C),(D) 및 (E)의 양은 각각 0.5 내지 20중량부, 55 내지 85중량부, 5 내지 20중량부, 5 내지 20중량부 및 0 내지 10중량부인 것을 특징으로 하는 광중합 조성물.
  3. 제2항에 있어서, 상기 조성물의 성분(A) 내지 (E) 총량중의 성분(E)의 양은 1 내지 10중량% 인것을 특징으로 하는 광중합 조성물.
  4. 제1항, 제2항 또는 제3항에 있어서, 상기 폴리-N-비닐피롤리돈(A)의 분자량은 10,000 내지 1,000,000의 범위인 것을 특징으로 하는 광중합 조성물.
  5. 제1항, 제2항 또는 제3항에 있어서, 분자내에 아크릴로일기 또는 메타아크릴로일기를 갖는 상기 단량체(D)는 카르비톨 아크릴레이트, 카르비톨메타아크릴레이트, 테트라히드로, 푸르푸릴 아크릴레이트, 테트라히드로 푸르푸릴 메타아크릴레이트, 2-히드록시 에틸 아크릴레이트, 2-히드록시프로필메타아크릴레이트, 메틸아크릴레이트, 메틸메타아크릴레이트, 에틸아크릴레이트, 에틸메타아크릴레이트, 프로필아크릴레이트, 프로필메타아크릴레이트, 부틸아크릴레이트, 부틸메타 아크릴레이트, 2-에틸헥실 아크릴레이트, 2-에틸헥실 메타아크릴레이트, 페녹시에틸 아크릴레이트 및 페녹시에틸 메타아크릴레이트로부터 선택된 화합물 또는 두가지 화합물 이상의 혼합물인 것을 특징으로 하는 광중합 조성물.
  6. 제1항, 제2항 또는 제3항에 있어서, 내식성 잉크를 제조하기 위한 광중합 조성물.
  7. 제4항에 있어서, 내식성 잉크를 제조하기 위한 광중합 조성물.
  8. 제5항에 있어서, 내식성 잉크를 제조하기 위한 광중합 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850007902A 1984-10-30 1985-10-25 광중합 조성물 Expired KR910006958B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59-226928 1984-10-30
JP84-226928 1984-10-30
JP59226928A JPS61106613A (ja) 1984-10-30 1984-10-30 光重合性組成物

Publications (2)

Publication Number Publication Date
KR860003302A true KR860003302A (ko) 1986-05-23
KR910006958B1 KR910006958B1 (ko) 1991-09-14

Family

ID=16852797

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850007902A Expired KR910006958B1 (ko) 1984-10-30 1985-10-25 광중합 조성물

Country Status (5)

Country Link
US (1) US4636534A (ko)
EP (1) EP0180466B1 (ko)
JP (1) JPS61106613A (ko)
KR (1) KR910006958B1 (ko)
DE (1) DE3569749D1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5145884A (en) * 1986-11-13 1992-09-08 Menicon Co., Ltd. Ultraviolet-hardenable adhesive
US4942001A (en) * 1988-03-02 1990-07-17 Inc. DeSoto Method of forming a three-dimensional object by stereolithography and composition therefore
US5344747A (en) * 1988-04-15 1994-09-06 Tokyo Ohka Kogyo Co., Ltd. Photopolymerizable compositions
JPH01263645A (ja) * 1988-04-15 1989-10-20 Tokyo Ohka Kogyo Co Ltd 光重合性組成物
JP2649716B2 (ja) * 1988-12-06 1997-09-03 日本化薬株式会社 光重合性組成物
AU634214B2 (en) * 1989-03-14 1993-02-18 Robert Koch Procaine double salt complexes
US5225315A (en) * 1991-09-19 1993-07-06 Dymax Corporation Water soluble formulation for masking and the like, and method utilizing the same
US7208334B2 (en) * 2004-03-31 2007-04-24 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device, acid etching resistance material and copolymer
WO2013148957A1 (en) * 2012-03-28 2013-10-03 Becton, Dickinson And Company Hydrogel adhesion to molded polymers
EP3000853B1 (en) 2014-09-29 2020-04-08 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
US11407913B2 (en) * 2018-03-02 2022-08-09 Agfa-Gevaert Nv Inkjet inks for manufacturing printed circuit boards

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953214A (en) * 1974-05-24 1976-04-27 Dynachem Corporation Photopolymerizable screen printing inks and use thereof
JPS528303A (en) * 1975-04-11 1977-01-22 Hitachi Chemical Co Ltd Filmmlike laminated body
DE2728780A1 (de) * 1976-07-05 1978-01-19 Ciba Geigy Ag Photohaertbare lack- und druckfarben
GB1599281A (en) * 1977-01-10 1981-09-30 Ici Ltd Photopolymerisable composition
JPS5928350B2 (ja) * 1977-12-19 1984-07-12 大日本塗料株式会社 熱硬化性高固形分塗料用組成物
JPS5713444A (en) * 1980-06-27 1982-01-23 Tamura Kaken Kk Photosensitive composition
US4514271A (en) * 1981-07-02 1985-04-30 Gaf Corporation Stable dispersion of alkylated polyvinylpyrrolidone and vinyl pyrrolidone
JPS58149040A (ja) * 1982-03-02 1983-09-05 Mitsui Toatsu Chem Inc 紫外線硬化パタ−ン形成用組成物
JPS58153930A (ja) * 1982-03-09 1983-09-13 Mitsui Toatsu Chem Inc 紫外線硬化パタ−ン形成用組成物
JPS5929246A (ja) * 1982-08-12 1984-02-16 Mitsui Toatsu Chem Inc 紫外線硬化パタ−ン形成用の組成物
JPS6026065A (ja) * 1983-07-22 1985-02-08 Yokohama Rubber Co Ltd:The シリコ−ン変性アクリルワニス
US4588664A (en) * 1983-08-24 1986-05-13 Polaroid Corporation Photopolymerizable compositions used in holograms

Also Published As

Publication number Publication date
DE3569749D1 (en) 1989-06-01
US4636534A (en) 1987-01-13
EP0180466B1 (en) 1989-04-26
KR910006958B1 (ko) 1991-09-14
JPH0437848B2 (ko) 1992-06-22
EP0180466A2 (en) 1986-05-07
JPS61106613A (ja) 1986-05-24
EP0180466A3 (en) 1987-04-01

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