[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

KR830005394A - 금속 탈거 조성물 - Google Patents

금속 탈거 조성물 Download PDF

Info

Publication number
KR830005394A
KR830005394A KR1019810001248A KR810001248A KR830005394A KR 830005394 A KR830005394 A KR 830005394A KR 1019810001248 A KR1019810001248 A KR 1019810001248A KR 810001248 A KR810001248 A KR 810001248A KR 830005394 A KR830005394 A KR 830005394A
Authority
KR
South Korea
Prior art keywords
stripping composition
metal stripping
metal
composition
polyacrylamide
Prior art date
Application number
KR1019810001248A
Other languages
English (en)
Other versions
KR880001457B1 (ko
Inventor
엘 이라이아스 모네
케이 사아 나렌드라
Original Assignee
에이취 아이 제어코부
다아트 인더스트리이즈 인코포레이팃드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이취 아이 제어코부, 다아트 인더스트리이즈 인코포레이팃드 filed Critical 에이취 아이 제어코부
Publication of KR830005394A publication Critical patent/KR830005394A/ko
Application granted granted Critical
Publication of KR880001457B1 publication Critical patent/KR880001457B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

내용 없음

Description

금성 탈거 조성믈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 약 0.5%부터 약 35%까지의 과산화수소와 약 5%부터 약 50%까지의 암모니아와 히드로플루오르산이나 염의 반응성의 조성과 약 0.01%부터 약 10%까지의 폴리아크릴아마이드를 포함한 탈거 수용액.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019810001248A 1980-04-17 1981-04-13 구리 기질로 부터 땜납을 제거하는 조성물 KR880001457B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/141,013 US4297257A (en) 1980-04-17 1980-04-17 Metal stripping composition and method
US141,013 1980-04-17
US141013 1993-10-26

Publications (2)

Publication Number Publication Date
KR830005394A true KR830005394A (ko) 1983-08-13
KR880001457B1 KR880001457B1 (ko) 1988-08-10

Family

ID=22493763

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810001248A KR880001457B1 (ko) 1980-04-17 1981-04-13 구리 기질로 부터 땜납을 제거하는 조성물

Country Status (12)

Country Link
US (1) US4297257A (ko)
JP (1) JPS56158875A (ko)
KR (1) KR880001457B1 (ko)
CA (1) CA1130181A (ko)
CH (1) CH660029A5 (ko)
DE (1) DE3115323A1 (ko)
FR (1) FR2480793A1 (ko)
GB (1) GB2074103B (ko)
IT (1) IT1169243B (ko)
MX (1) MX154651A (ko)
MY (1) MY8600343A (ko)
NL (1) NL8101830A (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164984A (en) * 1981-04-06 1982-10-09 Metsuku Kk Exfoliating solution for tin or tin alloy
USRE32555E (en) * 1982-09-20 1987-12-08 Circuit Chemistry Corporation Solder stripping solution
US4397753A (en) * 1982-09-20 1983-08-09 Circuit Chemistry Corporation Solder stripping solution
CA1221896A (en) * 1983-06-06 1987-05-19 Norvell J. Nelson Aqueous process for etching copper and other metals
US4632727A (en) * 1985-08-12 1986-12-30 Psi Star Copper etching process and solution
JPS62218585A (ja) * 1985-10-31 1987-09-25 Hoya Corp フオトマスクの製造方法
US4713144A (en) * 1986-08-01 1987-12-15 Ardrox Inc. Composition and method for stripping films from printed circuit boards
DE3738307A1 (de) * 1987-11-11 1989-05-24 Ruwel Werke Gmbh Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen
US4957653A (en) * 1989-04-07 1990-09-18 Macdermid, Incorporated Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy
US4944851A (en) * 1989-06-05 1990-07-31 Macdermid, Incorporated Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
US4921571A (en) * 1989-07-28 1990-05-01 Macdermid, Incorporated Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
US5017267A (en) * 1990-07-17 1991-05-21 Macdermid, Incorporated Composition and method for stripping tin or tin-lead alloy from copper surfaces
US5741432A (en) * 1995-01-17 1998-04-21 The Dexter Corporation Stabilized nitric acid compositions
US5663474A (en) * 1996-03-07 1997-09-02 Alliedsignal Inc. Alkylation process using hydrogen fluoride-containing alkylation catalysts
US5632966A (en) * 1996-03-07 1997-05-27 Alliedsignal Inc. Process for hydrogen fluoride separation
US6177058B1 (en) 1996-03-07 2001-01-23 Alliedsignal Inc. Hydrogen fluoride compositions
US5705717A (en) * 1996-03-07 1998-01-06 Alliedsignal Inc. Fluorination process using hydrogen fluoride-containing fluorinating agents
US6238743B1 (en) * 2000-01-20 2001-05-29 General Electric Company Method of removing a thermal barrier coating
US6960370B2 (en) 2003-03-27 2005-11-01 Scimed Life Systems, Inc. Methods of forming medical devices
CN109652806B (zh) * 2019-01-29 2020-12-25 鹤壁市正华有色金属有限公司 一种以紫铜或黄铜为基材的亮锡汽车零部件的退镀液和退镀工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1133382A (en) * 1965-06-17 1968-11-13 W E Zimmie A G Method of preventing corrosion in water systems
US3898037A (en) * 1972-06-01 1975-08-05 Betz Laboratories Acrylamido-sulfonic acid polymers and their use
US3888778A (en) * 1973-03-13 1975-06-10 Merton Beckwith Bright dip composition for tin/lead
US3926699A (en) * 1974-06-17 1975-12-16 Rbp Chemical Corp Method of preparing printed circuit boards with terminal tabs
US4004956A (en) * 1974-08-14 1977-01-25 Enthone, Incorporated Selectively stripping tin or tin-lead alloys from copper substrates
US3990982A (en) * 1974-12-18 1976-11-09 Rbp Chemical Corporation Composition for stripping lead-tin solder
US4009299A (en) * 1975-10-22 1977-02-22 Motorola, Inc. Tin strip formulation for metal to glass seal diodes

Also Published As

Publication number Publication date
MX154651A (es) 1987-11-12
FR2480793A1 (fr) 1981-10-23
GB2074103A (en) 1981-10-28
GB2074103B (en) 1984-02-15
JPS56158875A (en) 1981-12-07
US4297257A (en) 1981-10-27
KR880001457B1 (ko) 1988-08-10
CH660029A5 (de) 1987-03-13
JPS6354077B2 (ko) 1988-10-26
CA1130181A (en) 1982-08-24
MY8600343A (en) 1986-12-31
DE3115323C2 (ko) 1990-10-04
IT8121191A0 (it) 1981-04-15
NL8101830A (nl) 1981-11-16
IT1169243B (it) 1987-05-27
FR2480793B1 (ko) 1984-02-24
DE3115323A1 (de) 1982-02-04

Similar Documents

Publication Publication Date Title
KR830005394A (ko) 금속 탈거 조성물
KR850007208A (ko) 약산성욕 염조성물
ES2061432T3 (es) Nuevas amidas de acido acrilico.
KR850001020A (ko) 탈산소제
KR830004801A (ko) 분산가능한 크산탄검 조성물
KR830006286A (ko) 빈카민 사카리내이트의 제조방법
KR870003994A (ko) 도파민-β-하이드록시라제 억제제
KR830006143A (ko) 가성물질성 추출에 의한 아세토니트릴의 정제방법
KR850002397A (ko) 팬테레인-s-술폰산을 함유하는 화장품
ES503481A0 (es) Procedimiento para suprimir el potencial corrosivo de soluciones acuosas de alcanolaminas que contienen azufre.
KR840000871A (ko) 함수제(含嗽劑) 조성물
KR830010091A (ko) 구연산 나프티드로푸릴의 제조방법
KR860002421A (ko) 2가(價) 3가 철염(鐵鹽)배합물 및 그 제조법
KR830007545A (ko) 프로스타글란딘의 제조방법
KR830001282A (ko) 빈데신 설페이트의 제조방법
SU724561A1 (ru) Антистатическа добавка к мазуту
KR840002237A (ko) 화장품
KR860001864A (ko) 방수제의 제조방법
KR870002247A (ko) 무공해 세정제(洗淨劑)의 조성물
KR840001651A (ko) 폴리올레핀 모노필라멘트의 제조방법
KR850008098A (ko) 피부 청정용 화장료
KR850001312A (ko) 산화알미늄 섬유 및 필름
KR850007241A (ko) 인분을 주재로 한 고단위 비료 제법
KR850005777A (ko) 신포접화합물의 제조방법
KR910006434A (ko) 잉크 조성물