KR20240061139A - Laser Soldering Device and Laser Soldering Method Using the Same - Google Patents

Abstract

The present invention relates to a laser soldering device in which a laser is fixed at a predetermined position and a panel and chip for bonding are transferred to a predetermined bonding position for bonding, and a laser soldering method using the same. The laser soldering device of the present invention includes a panel loading unit, a panel fixing unit, a panel unloading unit, a chip loading unit, a chip pickup unit, a chip transfer unit, a laser unit, a panel transfer unit, and a chip transfer unit.

Description

Laser soldering device and laser soldering method using the same {Laser Soldering Device and Laser Soldering Method Using the Same}

The present invention relates to a laser soldering device and a laser soldering method using the same. More specifically, a laser soldering device in which a laser is fixed at a predetermined position and a panel and chip for bonding are transferred to a predetermined bonding position for bonding, and laser soldering using the same. It's about method.

In general, electronic circuit boards are made up of semiconductor chips or active and passive components attached to a circuit board, and are increasingly required to be multifunctional, miniaturized, and highly integrated. In order to respond to this demand, many soldering methods using lasers are being attempted to solder unusual parts or ultra-small parts with different heat capacities that cannot be solved by the existing reflow (hot air soldering) method.

This laser soldering method has the advantage of selectively heating only the devices for bonding, eliminating the risk of defects due to warping of the entire board, and enabling high-speed bonding with a heating time of about a few seconds. Accordingly, it is preferred as a method that can solve both the substrate warpage problem and the productivity problem at the same time.

However, there was a problem that a cumbersome and complicated structure was needed to transport the workpiece to the correct location and irradiate the laser light at the correct angle.

The present invention is intended to solve the above-mentioned problems, and its purpose is to provide a laser soldering device equipped with a relatively simple structure and transfer process and a laser soldering method using the same.

Additionally, the purpose of the present invention is to provide a laser soldering device capable of accurate bonding by transporting and aligning the panel and chip around a fixed laser center, and a laser soldering method using the same.

The laser soldering device according to the present invention includes a panel loading unit for transferring panels supplied from the outside, a panel fixing unit for fixing the panels transferred from the panel loading unit by vacuum adsorption, and a panel fixing unit for fixing the panels transferred from the panel fixing unit to the outside. A chip pickup including a panel unloading unit for transferring, a chip loading unit for moving and fixing a tray containing at least one chip, a pickup gripper for gripping any one chip stored in the tray, and a gripper rotating unit for rotating the pickup gripper. A unit, including a bonding gripper that receives and grips the chip attached to the pickup gripper, a chip transfer unit that transfers the chip gripped by the bonding gripper to a dipping pot, is fixed to the upper part of the panel fixing unit, and uses a laser. A laser unit that irradiates and bonds the panel and the chip, a panel moving unit that corrects the position of the panel so that the center of the laser matches the reference point marked on the panel, and moves the chip to the reference point and presses it to the panel. It includes a chip transfer unit.

Additionally, the chip moving unit may include a main body portion having a hollow space through which light emitted from the laser can pass, and a rotation axis portion that moves while correcting distortion of the chip.

Additionally, the panel loading unit, the panel fixing unit, and the panel unloading unit are arranged sequentially in the X-axis direction, the laser unit is arranged to be spaced apart from the panel fixing unit in the Z-axis direction, the chip loading unit, the The chip pickup unit and the chip transfer unit may be disposed on one side of the laser unit in the Y-axis direction.

Additionally, the chip loading unit may include a tray fixing unit that fixes the tray in a predetermined position and a tray vision unit that checks the solder ball provided on the chip to determine the location of the chip in the tray.

Additionally, the pickup gripper grips one side of the chip by vacuum suction, and the gripper rotation unit can rotate the pickup gripper 180 degrees so that the other side of the chip faces upward.

Additionally, the bonding gripper grips the other side of the chip by vacuum suction, and the chip transfer unit applies flux contained in the dipping pot to one side of the chip and moves it to the panel fixing unit.

Meanwhile, the laser soldering method according to the present invention includes fixing the inserted panel by vacuum suction, moving and fixing a tray containing at least one chip, and gripping any one chip contained in the tray through a pick-up gripper, Rotate the pick-up gripper to transfer the chip to the bonding gripper and grip it, apply flux to the chip gripped by the bonding gripper, move it toward the panel, and position the panel so that the center of the laser coincides with the reference point marked on the panel. It includes the steps of correcting, moving the chip to the reference point, pressing it to the panel, and irradiating the laser to bond the panel and the chip.

In addition, the panel is transferred in the X-axis direction, the chip is transferred in the Y-axis direction, the laser, the chip, and the panel are sequentially arranged in the Z-axis direction, and the chip and the panel are This can be bonded.

In addition, the upper part of the panel where the reference point is located and the lower part of the chip can be aligned with the center of the laser, the chip can be pressed toward the panel, and real-time temperature compensation can be performed using a thermal imaging camera.

In addition, in order to determine the position of the chip contained in the tray, move the tray to the position of the pickup gripper, and deliver the chip to the bonding gripper located at the top, the pickup gripper grips the chip and rotates 180 degrees. It can be.

The laser soldering device and the laser soldering method using the same of the present invention have the advantage of increasing work efficiency by simplifying the transfer path and transfer process of panels and chips.

In addition, the laser soldering device and the laser soldering method using the same of the present invention have the advantage of increasing bonding accuracy and minimizing the defect rate by fixing the laser at a predetermined position and aligning the panel and chip.

1 to 4 are diagrams showing a laser soldering device according to an embodiment of the present invention.
5 to 8 are diagrams schematically showing a laser soldering method according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, the spirit of the present invention is not limited to the presented embodiments, and those skilled in the art who understand the spirit of the present invention may add, change, or delete other components within the scope of the same spirit, or create other degenerative inventions or this invention. Other embodiments that are included within the scope of the invention may be easily proposed, but this will also be included within the scope of the invention of the present invention.

1 to 4 are diagrams showing a laser soldering device 1 according to an embodiment of the present invention. In detail, Figures 1 and 2 are perspective views showing the laser soldering device 1 from different directions, Figure 3 is a top view showing the laser soldering device 1 from above, and Figure 4 is a view showing the laser soldering device 1 from above. This is an enlarged perspective view showing a part of the soldering device 1.

The laser soldering device 1 of the present invention corresponds to a device that uniformly irradiates the laser 100 only to selected areas and performs bonding using absorbed and converted heat energy. In particular, the laser 100 is fixed at a predetermined position and corresponds to a device that transfers the panel (P) and chip (C) for bonding to a predetermined bonding position and bonds them.

Therefore, the laser soldering device 1 of the present invention largely includes a laser unit 10, units 20, 22, 24, 26 for transporting the panel P to the bonding position, and the chip C to the bonding position. It can be divided into transfer units 30, 32, 34, and 36. At this time, the panel (P) is transferred in the sorted in direction.

The laser soldering device 1 includes a panel loading unit 20, a panel fixing unit 22, and a panel unloading unit 24.

The panel loading unit 20 transports the panel P supplied from outside. In particular, the panel (P) can be separated from the magazine into single sheets and introduced into the panel loading unit (20).

The panel fixing unit 22 fixes the panel P transferred from the panel loading unit 20 by vacuum suction. For example, the panel fixing unit 22 is provided with a porous chuck, so that the panel P can be fixed with minimal bending or warpage. And, bonding by the laser unit 10 can be performed with the panel P positioned on the panel fixing unit 22.

The panel unloading unit 24 transfers the panel P transferred from the panel fixing unit 22 to the outside. At this time, the panel P transferred to the panel unloading unit 24 has a predetermined chip C attached by the laser unit 10. That is, the panel P on which bonding has been completed can be discharged from the panel unloading unit 24.

At this time, the panel loading unit 20, the panel fixing unit 22, and the panel unloading unit 24 are sequentially arranged in the X-axis direction. Additionally, the panel P can be transported in a horizontal state in the X-axis direction along each unit.

The laser soldering device 1 includes a chip loading unit 30, a chip pickup unit 32, and a chip transfer unit 34.

The chip loading unit 30 moves and fixes the tray 40 containing at least one chip C. The chip loading unit 30 includes a tray fixing part 300 that fixes the tray 40 in a predetermined position and a tray vision part 302 that determines the position of the chip C within the tray 40. may include.

For example, an operator may place chips of various sizes and numbers requiring bonding on the tray 40. Then, the operator places the tray 40 containing at least one chip on the chip loading unit 30. The tray fixing unit 300 can move the tray 40 on the X-Y plane and align it to a predetermined position.

The tray vision unit 302 can determine the location by inspecting the solder ball provided on the chip (C). At this time, the chip C can be placed on the tray 40 with the solder ball facing upward, and the tray vision unit 302 can be inspected by moving the upper part of the tray 40.

The chip pickup unit 32 includes a pickup gripper 320 that grips one chip C accommodated in the tray 40 and a gripper rotation unit 322 that rotates the pickup gripper 320. For example, the chip pickup unit 32 is movable on the X-Y plane and can move to the position of the chip C inspected in the tray vision unit 302.

The pickup gripper 320 can grip one surface of the chip C by vacuum suction. That is, the pickup gripper 320 can grip the chip C in a non-contact manner. At this time, a solder ball may be formed on one surface of the chip C held by the pickup gripper 320.

The gripper rotating unit 322 rotates the pickup gripper 320 by 180 degrees so that the other side of the chip C faces upward. That is, the pickup gripper 320 may move to the upper part of the chip C accommodated in the tray 40 and grip it, and may be rotated 180 degrees so that the chip C is positioned at the upper side.

The chip transfer unit 34 includes a bonding gripper 340 that receives and grips the chip C attached to the pickup gripper 320. The bonding gripper 340 can grip the other surface of the chip C by vacuum suction.

For example, like the pickup gripper 320, the bonding gripper 340 can adsorb the chip C using a vacuum and grip it in a non-contact manner. Therefore, the bonding gripper 340 vacuum-sucks the chip C and releases the vacuum of the pickup gripper 320, so that the chip C is transferred from the pickup gripper 320 to the bonding gripper 340. It can be.

Additionally, the chip transfer unit 34 transfers the chip held by the bonding gripper 340 to the dipping pot 50. In detail, the chip transfer unit 34 applies flux contained in the dipping pot 50 to one surface of the chip C and moves to the panel fixing unit 22.

At this time, the chip transfer unit 34 inspects and recognizes the chip C held by the pickup gripper 320 and corrects the position and angle of the chip C delivered to the bonding gripper 340. It may further include. In particular, the chip transfer unit 34 can correct the position of the chip C along the R axis and transfer the position-corrected chip C to the dipping pot 50.

At this time, the chip loading unit 30, the chip pickup unit 32, and the chip pickup unit 34 are disposed on one side of the laser unit 10 in the Y-axis direction. In addition, the chip loading unit 30, the chip pickup unit 32, and the chip pickup unit 34 include the panel loading unit 20, the panel fixing unit 22, and the panel unloading unit 24. It is placed on one side of the Y-axis direction. And, the chip C can be transported in the Y-axis direction along each unit.

The laser unit 10 is fixed to the upper part of the panel fixing unit 22. That is, the laser unit 10 is arranged to be spaced apart from the panel fixing unit 22 in the Z-axis direction. In detail, the laser 100 may be arranged to irradiate laser light in the Z-axis direction.

In addition, the laser unit 10 may further include a beam inspection unit that monitors the state of the laser 100. When a bonding process is performed, the beam inspection unit can be moved to the side and positioned, and when checking the beam state, it can be moved to the center of the laser 100 to perform the inspection.

The laser soldering device 1 includes a panel movement unit 26 and a chip movement unit 36. The panel moving unit 26 and the chip moving unit 36 can be understood as a component that moves the panel P and the chip C for bonding.

The panel movement unit 26 corrects the position of the panel P so that the center of the laser 100 matches the reference point displayed on the panel P. In addition, the panel movement unit 26 can move the upper part of the panel P and the lower part of the chip C to coincide with the center of the laser 100. At this time, the fiduxial mark is previously marked on the top of the panel P and indicates the position of the chip C for bonding.

The panel movement unit 26 may include a vision unit that recognizes the reference point and acquires a position correction value. For example, the panel movement unit 26 can recognize the reference point and detect the bonding center. In addition, when there are multiple chips to be bonded, multiple bonding centers can be individually stored.

The chip moving unit 36 moves the chip C to the reference point and presses it to the panel P. In detail, the chip moving unit 36 moves the chip C to the top of the panel P and performs bonding by slowly pressing it in the Z-axis direction.

In addition, the chip moving unit 36 includes a main body portion 360 having a hollow portion 362 through which light emitted from the laser 100 can pass, and a rotation axis portion that moves while correcting the distortion of the chip C. Includes (364). Accordingly, the laser 100, the chip C, and the panel P can be sequentially arranged and bonded in the Z-axis direction. In addition, it is possible to prevent twisting that may occur when the chip (C) is pressed to the panel (P).

In addition, the laser soldering device 1 may further include a thermal imaging camera mounted behind the position where bonding is performed. Accordingly, temperature compensation can be performed in real time while bonding is performed.

The laser soldering method using the laser soldering device 1 described above will be described in detail.

5 to 8 are diagrams schematically showing a laser soldering method according to an embodiment of the present invention.

As shown in FIG. 5, the panel P is transported and fixed (S10). As described above, the panel P can be introduced into the panel loading unit 20 from the outside, transported horizontally in the X-axis direction, and fixed to the panel fixing unit 22.

Then, the tray 40 containing the chip C is moved and fixed (S20). At this time, the tray 40 can accommodate at least one chip (C) to be bonded to the panel (P). One chip C is gripped by the pickup gripper 320 (S30). At this time, the position of the chip C accommodated in the tray 40 can be determined and the tray 40 can be moved to the position of the pickup gripper 320.

Then, the chip C is transferred from the pickup gripper 320 to the bonding gripper 340 (S40). At this time, as shown in FIG. 6, the pickup gripper 320 grips the chip C (a) and rotates 180 degrees by the gripper rotation unit 322 to position the chip C on the upper side. Do it (b).

And, as shown in FIG. 7, the pickup gripper 320 grips the chip C by vacuum suction and positions it on the upper side (a), and the bonding gripper 340 grips the chip C on the upper side (a). It is located in and holds the chip (C) by vacuum suction, and the pickup gripper 320 releases the vacuum (b).

Flux is applied to the chip C held by the bonding gripper 340 and moved (S50). At this time, the transfer (S10) of the panel (P) and the transfer (S20, S30, S40, S50) of the chip (C) may be performed simultaneously or sequentially. In particular, the panel P may be transferred in the X-axis direction and the chip C may be transferred simultaneously or sequentially in the Y-axis direction.

Then, the position of the panel P is corrected so that the center of the laser 100 matches the reference point marked on the panel P (S60). Additionally, the chip C is moved and compressed to the reference point (S70), and bonding is performed by irradiating the laser 100 (S80). In particular, the laser 100, the chip C, and the panel P are arranged sequentially in the Z-axis direction, and the above processes (S60, S70, S80) can be performed simultaneously or sequentially to complement each other. .

As shown in FIG. 8, the chip C held by the bonding gripper 340 overlaps the panel P and is pressed in the Z-axis direction. In particular, the upper part of the panel (P), where the reference point is located, and the lower part of the chip (C) can be aligned with the center of the laser 100, and the chip (C) can be pressed toward the panel (P). . Additionally, bonding can be performed while performing real-time temperature compensation using a thermal imaging camera.

In the above, an embodiment of the present invention has been described in detail, but the scope of the present invention is not limited thereto, and various modifications and variations are possible without departing from the technical spirit of the present invention as set forth in the claims. This will be self-evident to those skilled in the art.

1: Laser soldering device
10: Laser unit
20: Panel loading unit
22: Panel fixing unit
24: Panel unloading unit
26: Panel movement unit
30: Chip loading unit
32: Chip pickup unit
34: Chip transfer unit
36: Chip transfer unit

Claims (10)

A panel loading unit that transfers panels supplied from outside;
a panel fixing unit that secures the panel transferred from the panel loading unit by vacuum suction;
a panel unloading unit that transfers the panel transferred from the panel fixing unit to the outside;
a chip loading unit that moves and fixes a tray containing at least one chip;
a chip pickup unit including a pickup gripper for gripping any one chip accommodated in the tray and a gripper rotating portion for rotating the pickup gripper;
a chip transfer unit including a bonding gripper that receives and grips the chip attached to the pickup gripper, and transferring the chip gripped by the bonding gripper to a dipping pot;
a laser unit fixed to the upper part of the panel fixing unit and irradiating a laser to bond the panel and the chip;
a panel movement unit that corrects the position of the panel so that the center of the laser coincides with a reference point displayed on the panel; and
A laser soldering device including a chip moving unit that moves the chip to the reference point and presses it to the panel. According to paragraph 1,
The chip transfer unit,
a main body portion having a hollow space through which light emitted from the laser can pass; and
A laser soldering device comprising a rotation axis unit that moves while correcting distortion of the chip. According to paragraph 1,
The panel loading unit, the panel fixing unit, and the panel unloading unit are sequentially arranged in the X-axis direction,
The laser unit is arranged to be spaced apart from the panel fixing unit in the Z-axis direction,
A laser soldering device, wherein the chip loading unit, the chip pickup unit, and the chip transfer unit are disposed on one side of the laser unit in the Y-axis direction. According to paragraph 1,
The chip loading unit,
a tray fixing unit that fixes the tray in a predetermined position; and
A laser soldering device comprising a tray vision unit that inspects solder balls provided on the chip to determine the location of the chip within the tray. According to paragraph 1,
The pickup gripper grips one side of the chip by vacuum suction, and the gripper rotation unit rotates the pickup gripper 180 degrees so that the other side of the chip faces upward. According to clause 5,
The bonding gripper vacuum-adsorbs and grips the other side of the chip,
The chip transfer unit applies flux contained in the dipping pot to one surface of the chip and moves it to the panel fixing unit. The inserted panel is fixed by vacuum adsorption,
Moving and fixing a tray containing at least one chip,
Gripping any one chip accommodated in the tray through a pick-up gripper,
Rotate the pickup gripper to transfer the chip to the bonding gripper and grip it,
Apply flux to the chip held by the bonding gripper and move toward the panel,
Correcting the position of the panel so that the center of the laser coincides with the reference point marked on the panel,
Move the chip to the reference point and press it to the panel,
A laser soldering method of bonding the panel and the chip by irradiating the laser. In clause 7,
The panel is transported in the X-axis direction,
The chip is transported in the Y-axis direction,
A laser soldering method, wherein the laser, the chip, and the panel are sequentially arranged in the Z-axis direction, and the chip and the panel are bonded by irradiation of the laser. In clause 7,
Align the upper part of the panel where the reference point is located and the lower part of the chip with the center of the laser,
A laser soldering method characterized by pressing the chip toward the panel and performing real-time temperature compensation using a thermal imaging camera. In clause 7,
Determine the position of the chip contained in the tray and move the tray to the position of the pickup gripper,
In order to transfer the chip to the bonding gripper located at the top, the pickup gripper grips the chip and is rotated 180 degrees.