KR20230160664A - Display device, electric device having the same and method for manufacturing the same - Google Patents

Abstract

The present invention discloses a display device, an electronic device, and a method of manufacturing the display device. The present invention includes a substrate, a display unit disposed on the substrate, and an encapsulation member disposed on the display unit, wherein the substrate includes a first inclined surface inclined with respect to one surface of the substrate, the first inclined surface and It is connected and disposed at a predetermined angle from the first inclined surface, and includes a first side having a surface roughness different from that of the first inclined surface.

Description

Display device, electronic device including the same, and method for manufacturing the display device {Display device, electric device having the same and method for manufacturing the same}

Embodiments of the present invention relate to devices and methods, and more particularly, to display devices, electronic devices, and methods of manufacturing display devices.

Electronic devices based on mobility are widely used. In addition to small electronic devices such as mobile phones, tablet PCs have recently been widely used as mobile electronic devices.

Such mobile electronic devices include display devices to support various functions and provide visual information such as images or videos to users. Recently, as other components for driving display devices have become smaller, the proportion of display devices in electronic devices is gradually increasing, and structures that can be bent to a predetermined angle in a flat state are also being developed.

When manufacturing a display device, the substrate of the display device can be separated in various ways. At this time, when dividing the substrate into multiple pieces, if the substrate is bent or a physical force is applied to the substrate, cracks may occur on the cut surface of the substrate if the substrate is too thick or the substrate is not cut cleanly. In this case, cracks occurring in the substrate may shorten the lifespan of the display device or cause malfunction or failure of the display device. Embodiments of the present invention provide a display device, an electronic device, and a method of manufacturing a display device that reduce cracks in the substrate that occur during separation of the substrates by reducing the thickness of the substrate and simultaneously separating the substrates from each other.

One embodiment of the present invention includes a substrate, a display portion disposed on the substrate, and an encapsulation member disposed on the display portion, wherein the substrate includes a first inclined surface inclined with respect to one surface of the substrate, and the second inclined surface. Disclosed is a display device including a first side connected to an inclined surface, disposed at a predetermined angle from the first inclined surface, and having a surface roughness different from that of the first inclined surface.

In this embodiment, the surface roughness of one surface of the substrate connected to the first inclined surface may be different from the surface roughness of the first inclined surface.

In this embodiment, the substrate may further include a second inclined surface connected to the first side and inclined with respect to one side of the substrate.

In this embodiment, the angle of the first inclined surface with respect to one surface of the substrate and the angle of the second inclined surface with respect to the other surface of the substrate may be different from each other.

In this embodiment, a first angle between one surface of the substrate and the first inclined surface, a second angle between the first inclined surface and the first side, and the other surface of the substrate opposite to the one surface of the substrate and the The sum of the third angles between the second slopes may be less than 450 degrees.

The height from one surface of the substrate to the end of the first inclined surface may be less than half the thickness of the substrate.

In this embodiment, the sealing member may be a thin film sealing layer.

In this embodiment, the sealing member may include an encapsulation substrate disposed to face the substrate, and a sealing portion disposed between the substrate and the encapsulation substrate to seal the display unit.

In this embodiment, the encapsulation substrate may include a third inclined surface inclined with respect to one surface of the encapsulation substrate, and a second side connected to the third inclined surface and disposed at a predetermined angle from the third inclined surface. .

In this embodiment, the second side may have a surface roughness that is different from the surface roughness of the third inclined surface.

In this embodiment, the surface roughness of one surface of the encapsulation substrate connected to the third inclined surface may be different from the surface roughness of the third inclined surface.

In this embodiment, the encapsulation substrate may further include a fourth inclined surface connected to the second side and inclined with respect to one side of the encapsulation substrate.

In this embodiment, the angle of the third inclined surface with respect to the second side and the angle of the fourth inclined surface with respect to the second side may be different from each other.

A fourth angle between one surface of the encapsulation substrate and the third inclined surface, a fifth angle between the third inclined surface and the second side, and the fourth inclined surface and the other surface of the encapsulation substrate opposite to one surface of the encapsulation substrate. The sum of the sixth angles may be less than 450 degrees.

In this embodiment, the height from one surface of the encapsulation substrate to the end of the third inclined surface may be less than half the thickness of the encapsulation substrate.

In this embodiment, the third inclined surface may include a plurality of inclined surfaces having different angles with respect to one surface of the encapsulation substrate.

In this embodiment, the first inclined surface may include a plurality of inclined surfaces having different angles with respect to one surface of the substrate.

Another embodiment of the present invention discloses an electronic device including a cover member, a cover coupled to the cover member, and the display device described above and disposed inside the cover member and the cover.

In another embodiment of the present invention, a laser is irradiated to the first surface of a base substrate having a first surface on which a plurality of display units are arranged and a second surface facing the first surface in the thickness direction of the base substrate. forming a cut surface, attaching a film member to the first surface, and dividing the base substrate into a plurality of substrates along the cut surface by spraying an etchant on the second surface. A method of manufacturing a device is disclosed.

In this embodiment, the step of irradiating the laser to the base substrate along an edge of each display unit so as to be spaced apart from the edge of each display unit may be further included.

In this embodiment, the step of reducing the thickness of the base substrate by spraying the etchant on the second surface may be further included.

In this embodiment, the step of forming a first inclined surface inclined with respect to the cutting surface while meeting the cutting surface may be further included.

In this embodiment, the step of connecting the cut surface to the first surface and forming a second inclined surface inclined with respect to the cut surface may be further included.

In this embodiment, the first angle formed by the second surface and the first inclined surface, the second angle formed by the first inclined surface and the cutting surface, and the third angle formed by the second inclined surface and the second surface. The sum of the angles may be less than 450 degrees.

In this embodiment, the distance from one surface of the substrate to a portion where the first inclined surface and the cutting surface are connected may be less than half the thickness of the substrate.

In this embodiment, the step of forming a thin film encapsulation layer on each display unit may be further included.

In this embodiment, the first inclined surface may include a plurality of inclined surfaces having different angles with respect to one surface of the substrate.

Another embodiment of the present invention includes forming a plurality of display units on a base substrate, arranging a sealing unit around the edge of the display unit to shield each display unit, and attaching an encapsulation base substrate to the sealing unit; forming a cutting surface on at least one of the one surface of the base substrate and the one surface of the encapsulating base substrate by irradiating a laser to at least one surface of the base substrate and the encapsulation base substrate; and spraying an etchant on one surface of at least one of the encapsulation base substrates to separate the base substrate on which the cut surface is disposed and at least one of the encapsulation base substrates into a plurality of pieces.

In this embodiment, the cut surface may be disposed on at least one of one side of the base substrate and one side of the encapsulation base substrate facing each other.

In this embodiment, the step of supplying an etchant to at least one of the base substrate and the encapsulation base substrate on which the cut surface is disposed to form a first inclined surface inclined with respect to the cut surface may be further included.

In this embodiment, a second inclined surface disposed to face the first inclined surface, connected to the cutting surface, and inclined with respect to the cutting surface may be formed on at least one of the base substrate and the encapsulation base substrate. You can.

In this embodiment, the sum of the angle formed by one surface of the base substrate and the first inclined surface, the angle formed by the cutting surface and the first inclined surface, and the angle formed by the other surface of the base substrate and the second inclined surface. may be less than 450 degrees.

In this example, the angle formed by one surface of the encapsulation base substrate and the first inclined surface, the angle formed by the cutting surface and the first inclined surface, and the angle formed by the other surface of the encapsulation base substrate and the second inclined surface. The sum of may be less than 450 degrees.

In this embodiment, the first thickness of at least one of the base substrate and the encapsulation base material substrate is greater than the second thickness, which is the thickness from one surface of at least one of the base substrate and the encapsulation base material substrate to the first inclined surface and the cut surface. It can be big.

In this embodiment, the first inclined surface may include a plurality of inclined surfaces having different angles with respect to one surface of the base substrate or one surface of the encapsulation base substrate.

In this embodiment, the etching solution may be supplied to the entire surface of at least one of the base substrate and the encapsulation base substrate to reduce the thickness of at least one of the base substrate and the encapsulation base substrate.

Other aspects, features and advantages in addition to those described above will become apparent from the following drawings, claims and detailed description of the invention.

These general and specific aspects may be practiced using any system, method, computer program, or combination of any system, method, or computer program.

Display devices and electronic devices according to embodiments of the present invention can not only provide clear images but also reduce impact applied to the corners of the substrate.

The manufacturing method of the display device according to the embodiments of the present invention can smoothly separate the substrate into different parts. Additionally, the display device manufacturing method according to the embodiments of the present invention can shorten the manufacturing time and cost of the display device.

1 is a plan view schematically showing a display device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line BB′ shown in FIG. 1.
3A and 3B are circuit diagrams schematically showing the circuit of the display panel of the display device shown in FIG. 1.
FIG. 4 is a cross-sectional view taken along line AA′ of FIG. 1.
FIGS. 5A to 5C are enlarged cross-sectional views of portion C of FIG. 4.
FIG. 6A is a plan view schematically showing the procedure for manufacturing the display panel shown in FIG. 4.
FIGS. 6B to 6F are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 4.
Figure 7 is a cross-sectional view schematically showing a display panel of a display device according to another embodiment of the present invention.
FIGS. 8A to 8D are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 7 .
9 is a cross-sectional view schematically showing a portion of a display panel of a display device according to another embodiment of the present invention.
FIGS. 10A to 10D are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 4 .
FIGS. 11A to 11D are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 7 .
Figure 12 is a perspective view schematically showing an electronic device according to an embodiment of the present invention.
FIG. 13 is an exploded perspective view schematically showing the electronic device shown in FIG. 12.
FIG. 14 is a cross-sectional view schematically showing a portion of the electronic device shown in FIG. 12.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and redundant description thereof will be omitted. .

In the following embodiments, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.

In the following examples, singular terms include plural terms unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have mean that the features or components described in the specification exist, and do not exclude in advance the possibility of adding one or more other features or components.

In the following embodiments, when a part of a film, region, component, etc. is said to be on or on another part, it is not only the case where it is directly on top of the other part, but also when another film, region, component, etc. is interposed between them. Also includes cases where there are.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system, but can be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

In cases where an embodiment can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to that in which they are described.

1 is a plan view schematically showing a display device according to an embodiment of the present invention.

Referring to FIG. 1 , the display device 1 may include a display panel DP, a display circuit board 51, a display driver 52, and a touch sensor driver 53. The display panel DP may be a light emitting display panel including a light emitting element. For example, the display panel DP includes an organic light emitting display panel using an organic light emitting diode including an organic light emitting layer, a micro light emitting diode display panel using a micro LED, and a quantum dot light emitting layer. It may be a quantum dot light emitting display panel using a quantum dot light emitting diode, or an inorganic light emitting display panel using an inorganic light emitting device containing an inorganic semiconductor.

The display panel DP may be transparent so that objects or backgrounds placed on the bottom of the display panel DP can be seen from the top of the display panel DP. Alternatively, the display panel DP may be a reflective display panel capable of reflecting an object or background on the upper surface of the display panel DP.

The display panel DP as described above may include a display area DA representing an image and a peripheral area PA arranged to surround the display area DA. Separate driving circuits, pads, etc. may be placed in this peripheral area (PA).

A display circuit board 51 may be attached to one edge of the display panel DP.

The display driver 52 may be placed in various locations. For example, the display driver 52 may be disposed on the substrate of the display panel DP. As another example, the display driver 52 may be disposed on the flexible film 54. As another embodiment, the display driver 52 may be disposed on the display circuit board 51. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the display driver 52 is disposed on the flexible film 54.

It can be placed on top. The display driver 52 may receive control signals and power voltages, generate and output signals and voltages for driving the display panel DP. The display driver 52 may be formed as an integrated circuit (IC).

The display circuit board 51 may be attached to the display panel DP. At this time, the display circuit board 51 and the display panel DP may be attached to each other using a flexible film 54. In this case, the flexible film 54 may be connected to the display panel DP and the display circuit board 51 through an anisotropic conductive film. The display circuit board 51 includes both a flexible printed circuit board (FPCB) that can be bent, or a rigid printed circuit board (PCB) that is hard and does not bend easily, and a flexible printed circuit board. It may be a composite printed circuit board that

As another embodiment, one side of the display circuit board 51 may be directly attached to one edge of the display panel DP using an anisotropic conductive film. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the display circuit board 51 and the display panel DP are connected through the flexible film 54.

A touch sensor driver 53 may be disposed on the display circuit board 51. The touch sensor driver 53 may be formed as an integrated circuit. The touch sensor driver 53 may be attached to the display circuit board 51 . The touch sensor driver 53 may be electrically connected to touch electrodes of the touch screen layer of the display panel DP through the display circuit board 51 .

The touch screen layer of the display panel DP can detect a user's touch input using at least one of various touch methods, such as a resistive touch method and a capacitive touch method. For example, when the touch screen layer of the display panel DP detects the user's touch input in a capacitive manner, the touch sensor driver 53 applies driving signals to the driving electrodes among the touch electrodes, and applies driving signals to the touch electrodes. By detecting voltages charged in mutual capacitance (hereinafter referred to as “mutual capacitance”) between the driving electrodes and the sensing electrodes through the sensing electrodes, it is possible to determine whether the user has touched the device. The user's touch may include contact touch and proximity touch. Contact touch refers to when an object such as a user's finger or pen directly contacts a cover member disposed on the touch screen layer. A close touch refers to an object, such as a user's finger or a pen, being positioned close to the cover member, such as hovering. The touch sensor driver 53 transmits sensor data to the main processor according to the sensed voltages, and the main processor analyzes the sensor data to calculate the touch coordinates where the touch input occurred.

A power supply unit for supplying driving voltages for driving the pixels of the display panel DP, the scan driver, and the display driver 52 may be additionally disposed on the display circuit board 51 . Alternatively, the power supply unit may be integrated with the display driver 52, and in this case, the display driver 52 and the power supply unit may be formed as one integrated circuit.

FIG. 2 is a cross-sectional view taken along line B-B′ shown in FIG. 1.

Referring to FIG. 2 , the display panel DP may include a display portion D and an encapsulation member (not shown). At this time, the display unit D may include a substrate 10, a buffer layer 11, a circuit layer (not shown), and a display element layer (not shown). The display unit D may include at least one pixel. At this time, the display unit D may correspond to the display area DA shown in FIG. 1. Additionally, a plurality of pixels may be provided, and the plurality of pixels may be arranged to have columns and rows. Through this, the display unit D can display images to the outside according to the operation of the plurality of pixels.

The encapsulation member may have various forms. For example, the encapsulation member may include a thin film encapsulation layer. As another embodiment, the sealing member may include a sealing portion and an sealing substrate.

The substrate 10 may be made of an insulating material such as glass and/or quartz. The substrate 10 may be a rigid substrate.

The buffer layer 11 is located on the substrate 10 and can reduce or block penetration of foreign substances, moisture, or external air from the lower part of the substrate 10 and provide a flat surface on the substrate 10. The buffer layer 11 may include an inorganic material such as oxide or nitride, an organic material, or an organic-inorganic composite, and may have a single-layer or multi-layer structure of an inorganic material and an organic material. A barrier layer (not shown) that blocks penetration of external air may be further included between the substrate 10 and the buffer layer 11. In some embodiments, the buffer layer 11 may be made of silicon oxide (SiO ₂ ) or silicon nitride (SiN _x ). The buffer layer 11 may be provided by stacking a first buffer layer 11a and a second buffer layer 11b.

The circuit layer is disposed on the buffer layer 11, and includes a pixel circuit (PC), a first gate insulating layer 12, a second gate insulating layer 13, an interlayer insulating layer 15, and a planarization layer 17. may include. The pixel circuit (PC) may include a thin film transistor (TFT) and a storage capacitor (Cst).

A thin film transistor (TFT) may be disposed on the buffer layer 11. The thin film transistor (TFT) may include a first semiconductor layer (A1), a first gate electrode (G1), a first source electrode (S1), and a first drain electrode (D1). A thin film transistor (TFT) can be connected to an organic light emitting diode (OLED) to drive the organic light emitting diode (OLED).

The first semiconductor layer A1 is disposed on the buffer layer 11 and may include polysilicon. In another embodiment, the first semiconductor layer A1 may include amorphous silicon. In another embodiment, the first semiconductor layer (A1) is indium (In), gallium (Ga), stanium (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), and germanium. It may include an oxide of at least one material selected from the group including (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The first semiconductor layer A1 may include a channel region, a source region doped with impurities, and a drain region.

A first gate insulating layer 12 may be provided to cover the first semiconductor layer A1. The first gate insulating layer 12 is made of silicon oxide (SiO ₂ ), silicon nitride (SiN _x ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), and tantalum oxide (Ta). ₂ O ₅ ), hafnium oxide (HfO ₂ ), and/or zinc oxide (ZnO _x ), etc. may include inorganic insulating materials. At this time, zinc oxide (ZnO _x ) may be zinc oxide (ZnO) and/or zinc peroxide (ZnO ₂ ). The first gate insulating layer 12 may be a single layer or a multilayer containing the above-described inorganic insulating material.

A first gate electrode (G1) is disposed on the first gate insulating layer (12) to overlap the first semiconductor layer (A1). The first gate electrode (G1) contains molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc. and may be made of a single layer or multiple layers. For example, the first gate electrode G1 may be a single layer of Mo.

The second gate insulating layer 13 may be provided to cover the first gate electrode (G1). The second gate insulating layer 13 is made of silicon oxide (SiO ₂ ), silicon nitride (SiN _x ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), and tantalum oxide (Ta). ₂ O ₅ ), hafnium oxide (HfO ₂ ), and/or zinc oxide (ZnO _x ), etc. may include inorganic insulating materials. At this time, zinc oxide (ZnO _x ) may be zinc oxide (ZnO) and/or zinc peroxide (ZnO ₂ ). The second gate insulating layer 13 may be a single layer or a multilayer containing the above-described inorganic insulating material.

The first upper electrode (CE2) of the storage capacitor (Cst) may be disposed on the second gate insulating layer 13.

In the display area DA, the first upper electrode CE2 may overlap the first gate electrode G1 below it. The first gate electrode (G1) and the first upper electrode (CE2) overlapping with the second gate insulating layer 13 therebetween may form a storage capacitor (Cst). The first gate electrode (G1) may be the first lower electrode (CE1) of the storage capacitor (Cst).

The first upper electrode (CE2) is made of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), and iridium ( Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and may be a single layer or multiple layers of the foregoing materials. You can.

The interlayer insulating layer 15 may be formed to cover the first upper electrode CE2. The interlayer insulation layer 15 is made of silicon oxide (SiO2), silicon nitride (SiN _x ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), and tantalum oxide (Ta ₂ O ₅₎ . ), hafnium oxide (HfO ₂ ), and/or zinc oxide (ZnO _x ). At this time, zinc oxide (ZnO _x ) may be zinc oxide (ZnO) and/or zinc peroxide (ZnO ₂ ). The interlayer insulating layer 15 may be a single layer or a multilayer containing the above-described inorganic insulating material.

The first source electrode (S1) and the first drain electrode (D1) are disposed on the interlayer insulating layer (15). The first source electrode (S1) and the first drain electrode (D1) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and the above materials It may be formed as a multi-layer or single layer containing. For example, the first source electrode (S1) and the first drain electrode (D1) may have a multilayer structure of Ti/Al/Ti.

The planarization layer 17 may be disposed to cover the first source electrode (S1) and the first drain electrode (D1). The planarization layer 17 may have a flat top surface so that the pixel electrode 21 disposed on it can be formed flat.

The planarization layer 17 may include an organic material or an inorganic material and may have a single-layer structure or a multi-layer structure. This planarization layer 17 is made of general-purpose polymers such as BCB (Benzocyclobutene), polyimide, HMDSO (Hexamethyldisiloxane), Polymethylmethacrylate (PMMA), and polystyrene, polymer derivatives with phenolic groups, acrylic polymers, and imide-based polymers. It may include polymers, aryl ether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, and/or vinyl alcohol-based polymers.

Meanwhile, the planarization layer 17 is made of silicon oxide (SiO ₂ ), silicon nitride (SiN _x ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), and tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), and/or zinc oxide (ZnO _x ) may include an inorganic insulating material. At this time, zinc oxide (ZnO _x ) may be zinc oxide (ZnO) and/or zinc peroxide (ZnO ₂ ). When forming the planarization layer 17, chemical and mechanical polishing may be performed on the top surface of the layer to provide a flat top surface after forming the layer.

The planarization layer 17 has a via hole that exposes either the first source electrode (S1) or the first drain electrode (D1) of the thin film transistor (TFT), and the pixel electrode 21 exposes the first source electrode through this via hole. It may be electrically connected to the thin film transistor (TFT) by contacting the electrode (S1) or the first drain electrode (D1).

The pixel electrode 21 is made of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In ₂ O ₃ ), and indium. It may include a conductive oxide such as gallium oxide (IGO) or aluminum zinc oxide (AZO). The pixel electrode 21 is made of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), and iridium (Ir). , may include a reflective film containing chromium (Cr) or a compound thereof. For example, the pixel electrode 21 may have a structure having films formed of ITO, IZO, ZnO, or In2O3 above and below the above-described reflective film. In this case, the pixel electrode 21 may have a laminated structure of ITO/Ag/ITO.

The pixel defining film 19 covers the edges of the pixel electrode 21 on the planarization layer 17 and may have a first opening OP1 exposing the central portion of the pixel electrode 21. The size and shape of the light emitting area of the organic light emitting diode (OLED), that is, the subpixel (Pm), are defined by the first opening (OP1).

The pixel definition film 19 prevents arcs, etc. from occurring at the edge of the pixel electrode 21 by increasing the distance between the edge of the pixel electrode 21 and the counter electrode 23 on the top of the pixel electrode 21. can play a role. The pixel defining film 19 is made of an organic insulating material such as polyimide, polyamide, acrylic resin, benzocyclobutene, HMDSO (hexamethyldisiloxane), and/or phenol resin, and may be formed by a method such as spin coating.

Inside the first opening OP1 of the pixel defining layer 19, light emitting layers 22b formed to correspond to the pixel electrodes 21 are disposed. The light-emitting layer 22b may include a high-molecular material or a low-molecular material, and may emit red, green, blue, or white light.

An organic functional layer 22e may be disposed on and/or below the light emitting layer 22b. The organic functional layer 22e may include a first functional layer 22a and/or a second functional layer 22c. The first functional layer 22a or the second functional layer 22c may be omitted.

The first functional layer 22a may be disposed below the light emitting layer 22b. The first functional layer 22a may be a single layer or a multi-layer made of organic material. The first functional layer 22a may be a hole transport layer (HTL) with a single-layer structure. Alternatively, the first functional layer 22a may include a hole injection layer (HIL) and a hole transport layer (HTL). The first functional layer 22a may be formed integrally with the organic light emitting diodes (OLEDs) included in the display area DA.

The second functional layer 22c may be disposed on the light emitting layer 22b. The second functional layer 22c may be a single layer or a multi-layer made of organic material. The second functional layer 22c may include an electron transport layer (ETL) and/or an electron injection layer (EIL). The second functional layer 22c may be formed integrally with the organic light emitting diodes (OLEDs) included in the display area DA.

A counter electrode 23 is disposed on the second functional layer 22c. The counter electrode 23 may include a conductive material with a low work function. For example, the counter electrode 23 is made of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), and iridium ( It may include a (semi) transparent layer containing Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof. Alternatively, the counter electrode 23 may further include a layer such as ITO, IZO, ZnO, or In ₂ O ₃ on the (semi) transparent layer containing the above-mentioned material. The counter electrode 23 may be formed integrally with the organic light emitting diodes (OLEDs) included in the display area DA.

The layers from the pixel electrode 21 to the counter electrode 23 formed in the display area DA may form an organic light emitting diode (OLED).

An upper layer 50 containing an organic material may be formed on the counter electrode 23. The upper layer 50 may be a layer provided to protect the counter electrode 23 and increase light extraction efficiency. The upper layer 50 may include an organic material with a higher refractive index than the counter electrode 23. Alternatively, the upper layer 50 may be provided by stacking layers with different refractive indices. For example, the upper layer 50 may be provided by stacking a high refractive index layer/low refractive index layer/high refractive index layer. At this time, the refractive index of the high refractive index layer may be 1.7 or more, and the refractive index of the low refractive index layer may be 1.3 or less.

The upper layer 50 may additionally include LiF. Alternatively, the upper layer 50 may additionally include an inorganic insulating material such as silicon oxide (SiO ₂ ) or silicon nitride (SiN _x ). This upper layer 50 can also be omitted if necessary. However, for convenience of explanation, hereinafter, the detailed description will focus on the case where the upper layer 50 is disposed on the counter electrode 23.

Although not shown in the drawing, the display panel DP as described above may include the encapsulation member that shields the upper layer 50.

3A and 3B are circuit diagrams schematically showing the circuit of the display panel of the display device shown in FIG. 1.

Referring to FIGS. 3A and 3B, the pixel circuit (PC) is connected to the light emitting element (ED) to emit light from the subpixels. For example, the light emitting device (ED) may be the organic light emitting diode (OLED) described in FIG. 2. The pixel circuit (PC) includes a driving thin film transistor (T1), a switching thin film transistor (T2), and a storage capacitor (Cst). The switching thin film transistor (T2) is connected to the scan line (SL) and the data line (DL), and the data signal ( Dm) is transmitted to the driving thin film transistor (T1).

The storage capacitor (Cst) is connected to the switching thin film transistor (T2) and the driving voltage line (PL), and corresponds to the difference between the voltage received from the switching thin film transistor (T2) and the driving voltage (ELVDD) supplied to the driving voltage line (PL). Stores the voltage.

The driving thin film transistor (T1) is connected to the driving voltage line (PL) and the storage capacitor (Cst), and provides a driving current flowing from the driving voltage line (PL) to the light emitting element (ED) in response to the voltage value stored in the storage capacitor (Cst). You can control it. The light emitting device (ED) can emit light with a predetermined brightness by driving current.

Although FIG. 3A illustrates the case where the pixel circuit (PC) includes two thin film transistors and one storage capacitor, the present invention is not limited to this.

Referring to Figure 3b, the pixel circuit (PC) includes a driving thin film transistor (T1), a switching thin film transistor (T2), a compensation thin film transistor (T3), a first initialization thin film transistor (T4), an operation control thin film transistor (T5), It may include a light emission control thin film transistor (T6) and a second initialization thin film transistor (T7).

Figure 3b shows the case where each pixel circuit (PC) is provided with signal lines (SL, SL-1, SL+1, EL, DL), initialization voltage line (VL), and driving voltage line (PL). The present invention is not limited to this. As another embodiment, at least one of the signal lines (SL, SL-1, SL+1, EL, DL) and/or the initialization voltage line (VL) may be shared by neighboring pixel circuits.

The drain electrode of the driving thin film transistor T1 may be electrically connected to the light emitting element ED via the light emission control thin film transistor T6. The driving thin film transistor T1 receives the data signal Dm according to the switching operation of the switching thin film transistor T2 and supplies a driving current to the light emitting element ED.

The gate electrode of the switching thin film transistor (T2) is connected to the scan line (SL), and the source electrode is connected to the data line (DL). The drain electrode of the switching thin film transistor (T2) is connected to the source electrode of the driving thin film transistor (T1) and can be connected to the driving voltage line (PL) via the operation control thin film transistor (T5).

The switching thin-film transistor (T2) is turned on according to the scan signal (Sn) received through the scan line (SL) and transfers the data signal (Dm) transmitted through the data line (DL) to the source electrode of the driving thin-film transistor (T1). Performs a switching operation that transmits

The gate electrode of the compensation thin film transistor T3 may be connected to the scan line SL. The source electrode of the compensation thin film transistor T3 may be connected to the drain electrode of the driving thin film transistor T1 and may be connected to the pixel electrode of the light emitting element ED via the emission control thin film transistor T6. The drain electrode of the compensation thin film transistor (T3) may be connected to one electrode of the storage capacitor (Cst), the source electrode of the first initialization thin film transistor (T4), and the gate electrode of the driving thin film transistor (T1). The compensation thin film transistor (T3) is turned on according to the scan signal (Sn) received through the scan line (SL) and connects the gate electrode and drain electrode of the driving thin film transistor (T1) to each other to form a driving thin film transistor ( T1) is connected with a diode.

The gate electrode of the first initialization thin film transistor T4 may be connected to the previous scan line SL-1. The drain electrode of the first initialization thin film transistor T4 may be connected to the initialization voltage line VL. The source electrode of the first initialization thin film transistor (T4) may be connected to one electrode of the storage capacitor (Cst), the drain electrode of the compensation thin film transistor (T3), and the gate electrode of the driving thin film transistor (T1). The first initialization thin film transistor (T4) is turned on according to the previous scan signal (Sn-1) received through the previous scan line (SL-1) and applies the initialization voltage (Vint) to the gate electrode of the driving thin film transistor (T1). An initialization operation can be performed to initialize the voltage of the gate electrode of the driving thin film transistor T1.

The gate electrode of the operation control thin film transistor T5 may be connected to the emission control line EL. The source electrode of the operation control thin film transistor T5 may be connected to the driving voltage line PL. The drain electrode of the operation control thin film transistor (T5) is connected to the source electrode of the driving thin film transistor (T1) and the drain electrode of the switching thin film transistor (T2).

The gate electrode of the emission control thin film transistor T6 may be connected to the emission control line EL. The source electrode of the emission control thin film transistor T6 may be connected to the drain electrode of the driving thin film transistor T1 and the source electrode of the compensation thin film transistor T3. The drain electrode of the light emission control thin film transistor T6 may be electrically connected to the pixel electrode of the light emitting element ED. The operation control thin film transistor (T5) and the light emission control thin film transistor (T6) are simultaneously turned on according to the light emission control signal (En) received through the light emission control line (EL), and the driving voltage (ELVDD) is applied to the light emitting element (ED). is transmitted, and the driving current flows to the light emitting element (ED).

The gate electrode of the second initialization thin film transistor T7 may then be connected to the scan line SL+1. The source electrode of the second initialization thin film transistor T7 may be connected to the pixel electrode of the light emitting device ED. The drain electrode of the second initialization thin film transistor T7 may be connected to the initialization voltage line VL. The second initialization thin film transistor T7 is then turned on according to the scan signal Sn+1 after being transmitted through the scan line SL+1 to initialize the pixel electrode of the light emitting device ED.

In Figure 3b, a case where the first initialization thin film transistor T4 and the second initialization thin film transistor T7 are connected to the previous scan line (SL-1) and the subsequent scan line (SL+1), respectively, is shown. However, the present invention It is not limited to this. As another embodiment, the first initialization thin film transistor T4 and the second initialization thin film transistor T7 are both connected to the previous scan line (SLn-1) and can be driven according to the previous scan signal (Sn-1). .

The other electrode of the storage capacitor (Cst) may be connected to the driving voltage line (PL). One electrode of the storage capacitor Cst may be connected to the gate electrode of the driving thin film transistor T1, the drain electrode of the compensation thin film transistor T3, and the source electrode of the first initialization thin film transistor T4.

The opposing electrode (eg, cathode) of the light emitting element (ED) is provided with a common voltage (ELVSS). The light emitting element (ED) receives a driving current from the driving thin film transistor (T1) and emits light.

The pixel circuit (PC) is not limited to the number and circuit design of thin film transistors and storage capacitors described with reference to FIGS. 3A and 3B, and the number and circuit design can be changed in various ways.

FIG. 4 is a cross-sectional view taken along line A-A′ in FIG. 1.

Referring to FIG. 4 , the display panel DP may include a substrate 10, a display portion D, and a thin film encapsulation layer 60. At this time, the substrate 10 and the display unit D may be the same or similar to those described in FIG. 2 above. The substrate 10 as described above may include a first surface 10a on which the display unit D is not disposed and a second surface 10b on which the display unit D is disposed. At this time, the edges of the substrate 10 may be partially bent. For example, the edge between the side surface 10-1 and the first surface 10a of the substrate 10 may be formed to be inclined. At this time, the inclined surface 10-2 may connect the first surface 10a and the side surface 10-1 of the substrate 10. As another embodiment, the edge between the side surface 10-1 and the second surface 10b of the substrate 10 may be inclined. In another embodiment, the edge between the side surface 10-1 and the first surface 10a of the substrate 10 and the edge between the side surface 10-1 and the second surface 10b of the substrate 10 are inclined. You can lose. In the above case, the side surface 10 - 1 of the substrate 10 may be at least a portion of the edge of the display panel DP in the plan view shown in FIG. 1 . That is, the cross section shown in FIG. 4 refers to a cross section taken along line A-A′ of FIG. 1, but is a cross section taken based on the direction of line B-B′ of FIG. 1 (for example, the X-axis direction of FIG. 1). It may refer to cross-sections taken in various directions in FIG. 1, such as cross-sections taken based on a line passing between the X-axis and Y-axis. Hereinafter, for convenience of explanation, the side 10-1 of the substrate 10 will be described in detail, focusing on the entire border of the display panel DP. A thin film encapsulation layer 60 may be disposed on the display unit D. At this time, the thin film encapsulation layer 60 may be placed in direct contact with the upper layer 50. At this time, the thin film encapsulation layer 60 covers a portion of the display area DA and the peripheral area NDA to prevent penetration of external moisture and oxygen. The thin film encapsulation layer 60 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Hereinafter, for convenience of explanation, the thin film encapsulation layer 60 will be described in detail focusing on the case where it includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer sequentially stacked on the upper surface of the upper layer 50. do.

In the above case, the first inorganic encapsulation layer covers the counter electrode 23 or the upper layer 50 shown in FIG. 2, and may include silicon oxide, silicon nitride, and/or silicon oxynitride. Since the first inorganic encapsulation layer is formed along the structure below it, the upper surface of the inorganic encapsulation layer is not flat. The organic encapsulation layer covers the first inorganic encapsulation layer, and unlike the first inorganic encapsulation layer, its upper surface can be substantially flat. Specifically, the organic encapsulation layer may have a substantially flat upper surface in a portion corresponding to the display area. The organic encapsulation layer may include one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. The second inorganic encapsulation layer covers the organic encapsulation layer and may include silicon oxide, silicon nitride, and/or silicon oxynitride.

A touch screen layer may be disposed on the thin film encapsulation layer as described above.

FIGS. 5A to 5C are enlarged cross-sectional views of portion C of FIG. 4.

Referring to FIG. 5A, a first inclined surface 10-2 may be disposed between the first surface 10a and the side surface 10-1 of the substrate 10. At this time, the first inclined surface 10-2 may form a certain angle with respect to the first surface 10a.

The surface roughness of the side 10-1 of the substrate 10 as described above may be different from the surface roughness of the first side 10a. For example, the surface roughness of the side surface 10-1 of the substrate 10 may be greater than the surface roughness of the first surface 10a. The surface roughness of the side surface 10-1 of the substrate 10 may be different from the roughness of the second surface 10b. For example, the surface roughness of the side surface 10-1 of the substrate 10 may be greater than the surface roughness of the second surface 10b.

The surface roughness of the side surface 10-1 of the substrate 10 may be different from the surface roughness of the first inclined surface 10-2. For example, the surface roughness of the side surface 10-1 of the substrate 10 may be smaller than the surface roughness of the first inclined surface 10-2. At this time, the surface roughness of the first inclined surface 10-2 may be greater than that of the first surface 10a.

The surface roughness of the side surface 10-1 of the substrate 10 as described above may vary depending on each part. For example, the side surface 10-1 of the substrate 10 may include a first area 1A, a second area 2A, and a third area 3A. At this time, one of the surface roughness of the first area (1A), the surface roughness of the second area (2A), and the surface roughness of the third area (3A) is the surface roughness of the first area (1A) and the surface roughness of the second area (2A). The surface roughness of may be different from the other one of the roughness of the third area 3A. For example, the surface roughness of the first area 1A may be similar to that of the second area 2A. The surface roughness of the first area 1A may be greater than the surface roughness of the third area 3A. Additionally, the surface roughness of the second area 2A may be greater than that of the third area 3A. Specifically, the surface roughness of the first area 1A and the second area 2A may be 400 to 500 nm, and the surface roughness of the third area 3A may be 300 nm or less. In this case, the surface roughness of each area can mean the average surface roughness (Ra) of the center line between the highest and lowest points.

In the above case, as shown in FIG. 5B, the first thickness from the first surface 10a to the point where the first inclined surface 10-2 and the side 10-1 of the substrate 10 are connected in FIG. 5A. (L1) may be less than 1/2 of the second thickness (L2), which is the entire thickness of the substrate 10. At this time, when the first thickness is more than 1/2 of the second thickness (L2), the length of the first slope (10-2) becomes too long, so that the first surface (10a) and the first slope (10-2) meet. The point may stick out too much.

Meanwhile, although not shown in the drawing, the boundary between the first surface 10a and the first slope 10-2, the border between the first slope 10-2 and the side 10-1, and the side 10-1 The boundary between and the second surface 10b may be rounded as shown in FIG. 5C, which will be described later.

Referring to FIG. 5B, a first inclined surface 10-2 may be disposed between the first surface 10a and the side surface 10-1 of the substrate 10. Additionally, a second inclined surface 10-3 may be disposed between the second surface 10b and the side surface of the substrate 10.

In the above case, the surface roughness of the side surface 10-1 of the substrate 10 may be different from the surface roughness of the first surface 10a. For example, the surface roughness of the side surface 10-1 of the substrate 10 may be greater than the surface roughness of the first surface 10a. The surface roughness of the side surface 10-1 of the substrate 10 may be different from the surface roughness of the second surface 10b. For example, the surface roughness of the side surface 10-1 of the substrate 10 may be greater than the surface roughness of the second surface 10b. In this case, the surface roughness of the side surface 10-1 may have a form similar to that described in FIG. 5A.

The surface roughness of the side surface 10-1 of the substrate 10 may be different from the surface roughness of the first inclined surface 10-2. For example, the surface roughness of the side surface 10-1 of the substrate 10 may be smaller than the surface roughness of the first inclined surface 10-2. At this time, the surface roughness of the first inclined surface 10-2 may be greater than the surface roughness of the first surface 10a. Additionally, the surface roughness of the first inclined surface 10-2 and the surface roughness of the second inclined surface 10-3 may be the same or similar to each other. In this case, the surface roughness of the side surface 10-1 of the substrate 10 may be similar to that described in FIG. 5A.

In the above case, the first thickness L1 from the first surface 10a to the point where the first inclined surface 10-2 and the side 10-1 of the substrate 10 are connected is the entire substrate 10. It may be less than 1/2 of the second thickness (L2).

In the above case, the first angle θ1 formed by the first inclined surface 10-2 and the side surface 10-1 of the substrate 10, the side surface 10-1 of the substrate 10 and the second inclined surface ( The sum of the second angle θ2 formed by 10-3) and the third angle θ3 formed by the second inclined surface 10-3 and the second surface 10b may be less than 450°. At this time, the first angle (θ1) and the third angle (θ3) may be different from each other.

In the above case, the first slope 10-2 and the second slope 10-3 may be different from each other. For example, in cross section, the first length W1 of the first inclined surface 10-2 may be greater than the second length W2 of the second inclined surface 10-3. In addition, the first thickness L1 from the first surface 10a to the tip of the first slope 10-2 is the third thickness from the second surface 10b to the tip of the second slope 10-3. It can be larger than (L3).

Referring to FIG. 5C, the edge edge of the substrate 10 may include a first inclined surface 10-2 or may include a first inclined surface 10-2 and a second inclined surface 10-3. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the edge edge of the substrate 10 includes the first inclined surface 10-2 and the second inclined surface 10-3.

In the above case, the first inclined surface 10-2 may include at least two inclined surfaces. In this case, at least two inclined surfaces may have different angles with respect to the first surface 10a or the second surface 10b.

For example, the first slope 10-2 may include a 1-1 slope 10-2a and a 1-2 slope 10-2b. In this case, the 1-1 inclined surface 10-2a and the 1-2 inclined surface 10-2b may have different angles with respect to the first surface 10a or the second surface 10b. In particular, the angle formed by the 1-1 inclined surface 10-2a with the first surface 10a may be larger than the angle formed by the 1-2 inclined surface 10-2b with the first surface 10a. In the above case, the first slope 10-2 is not limited to the above and includes two or more slopes, and one of the two or more slopes and the other one of the two or more slopes are the first surface 10a or the second slope. This may include all cases where the two surfaces 10b are formed at different angles. In addition, in the above case, as shown in FIG. 5A, the first area, the second area, and the third area may each correspond to two or more slopes included in the first slope 10-2. As another embodiment, one of the first area, the second area, and the third area is disposed on the first slope 10-2, and the other one of the first area, the second area, and the third area is disposed on the side, Another one of area 1, area 2, and area 3 may also be placed on the second slope (10-3).

In the above case, the first point (10a-1) where the 1-1 slope (10-2a) and the first surface (10a) meet, the 1-1 slope (10-2a) and the 1-2 slope (10) The second point (10-2c) where -2b) meets, the third point (10-1a) where the 1-2 slope (10-2b) and the side (10-1) meet, the side (10-1) and the third point (10-1a) At least one of the fourth point (10-1b) where the second slope (10-3) meets and the fifth point (10b-1) where the second slope (10-3) and the second surface (10b) meet is rounded. It can be.

Although not shown in the drawing, the first side 10-1 may also include at least one inclined surface. In this case, the slope disposed on the first side 10-1 may be connected to the 1-2 slope 10-2b, and the slope disposed on the first side 10-1 may be connected to the first side 10-1 (10-1). The angle formed with 10a) may be larger than the angle formed with the first surface 10a and the 1-2 inclined surface 10-2b.

Although not shown in the drawing, each of the first inclined surface 10-2 and the first side 10-1 may include a plurality of inclined surfaces. In this case, each of the plurality of inclined surfaces may be connected to each other, and the angle formed between each inclined surface and the first surface 10a may gradually increase, ultimately forming about 90°.

In the above case, the angle formed between each inclined surface and the first surface 10a may be an acute angle measured with respect to the first surface 10a.

FIG. 6A is a plan view schematically showing the procedure for manufacturing the display panel shown in FIG. 4. FIGS. 6B to 6F are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 4.

Referring to FIG. 6A , when manufacturing a display panel, a display portion D may first be formed on the mother substrate MS and then a thin film encapsulation layer 60 may be formed on the display portion D. At this time, a cutting line (or cutting surface, CL), which will be described below, may be formed along the outer edge of the display unit D.

Referring to FIG. 6B, a protective film (PF) can be attached to one side of the mother substrate (MS) on which the display portion (D) and the thin film encapsulation layer 60 are formed. At this time, the protective film (PF) may include a chemical-resistant material.

In the above case, the laser irradiation unit (LS) can irradiate the laser to the other side of the mother substrate (MS) to which the protective film (PF) is not attached. At this time, the laser may be in the form of a Bessel laser. The above laser can form the first cutting line CL-1 on the other side of the mother substrate MS. At this time, the laser irradiation unit LS may form the first cutting line CL-1 while moving to correspond to the cutting line CL shown in FIG. 6A.

In the above case, although not shown in the drawing, it is possible for the laser irradiation unit (LS) to irradiate a laser to the mother substrate (MS) without attaching a protective film (PF).

Referring to FIG. 6C, after the first cutting line CL-1 is formed, the etching solution can be sprayed on the other side of the mother substrate MS through the nozzle NS. At this time, the etchant can uniformly etch the mother substrate MS from the other side of the mother substrate MS in the thickness direction of the mother substrate MS.

As described above, when the etching liquid etch the mother substrate (MS), the mother substrate (MS) may gradually decrease in thickness from the initial thickness (T1). In this case, the protective film (PF) can prevent the display portion (D) from being damaged by the etching solution or one side of the mother substrate (MS) on which the display portion (D) is disposed from being etched.

Referring to FIG. 6D, the mother substrate MS, which has an initial thickness T1, is etched with an etchant, and the thickness gradually decreases, and then the distance between the first cutting line CL-1 and the other side of the mother substrate MS decreases. When a certain range is reached, the etchant can form a second cutting line (CL-2) that meets the first cutting line (CL-1) by mainly etching the first cutting line (CL-1). In another embodiment, when the mother substrate (MS) is etched by the etching liquid and the first cutting line (CL-1) meets the other side of the mother substrate (MS), the etching liquid is used to cut a portion of the first cutting line (CL-1) and the mother substrate (MS). The second cutting line CL-2 can be formed by etching a portion of the other side of the substrate MS. Additionally, the thickness of the mother substrate MS processed using the etching solution may be a processing thickness T2 that is smaller than the initial thickness T1.

Referring to FIG. 6e, when the second cutting line (CL-2) is formed as above, the second cutting line (CL-2) is connected to the first cutting line (CL-1) to form the cutting line (CL). It can be formed, and the mother substrate (MS) can be separated into a plurality of pieces. Through this, a plurality of display panels can be created based on the display portions D that are spaced apart from each other.

Additionally, in the above case, a side surface 10-1 and a first inclined surface 10-2 may be formed on the substrate 10. As another embodiment, although not shown in the drawing, when the etchant flows between the first cutting lines CL-1, in addition to the first inclined surface 10-2, a second inclined surface 10-3 is formed as shown in FIG. 5B. It is also possible to form

Therefore, in the above case, when the mother substrate MS is separated into a plurality of pieces, damage to the substrate 10 of the manufactured display panel can be prevented by not applying physical force. Additionally, in the case of a manufactured display panel, the corners of the substrate 10 are formed to be inclined, so that damage to the substrate 10 can be reduced even when an impact is applied to the corners of the substrate 10. The lifespan of the display device 1 can be increased by minimizing microcracks when the substrate 10 is separated.

Meanwhile, the above operation is not limited to that shown in FIGS. 6A to 6E, and is arranged so that one side of the mother substrate (MS) on which the display portion D is not disposed faces downward with respect to FIGS. 6A to 6E. It is also possible to perform this with the laser irradiation unit (LS) and the nozzle (NS) disposed at the bottom of the mother substrate (MS).

Figure 7 is a cross-sectional view schematically showing a display panel of a display device according to another embodiment of the present invention.

Referring to FIG. 7 , the display panel DP may include a substrate 10, a display portion D, and an encapsulation member 60b. At this time, since the substrate 10 and the display unit D are the same or similar to those described in FIG. 2, detailed description will be omitted.

The encapsulation member 60b may include a sealing portion 60b-1 and an encapsulation substrate 60b-2. The sealing portion 60b-1 may be disposed between the substrate 10 and the encapsulation substrate 60b-2 to connect the substrate 10 and the encapsulation substrate 60b-2. The encapsulation substrate 60b-2 may include the same or similar material as the substrate 10, and may be arranged to face the substrate 10. At this time, the sealing portion 60b-1 may be combined with the encapsulation substrate 60b-2 and the substrate 10 to block the display portion D from the outside. In this case, the sealing portion 60b-1 may be arranged to surround the outside of the display portion D. For example, the sealing portion 60b-1 may be disposed on the outside of the display portion D similar to the cutting line CL shown in FIG. 6A. In this case, the sealing portion 60b-1 may be disposed between the cutting line CL in FIG. 6A and the outer edge of the display portion D.

At least one of the substrate 10 and the encapsulation substrate 60b-2 as described above may have an inclined corner. Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the edges of both the substrate 10 and the encapsulation substrate 60b-2 are formed to be inclined.

The substrate 10 may include a first side 10-1 and a first inclined surface 10-2 disposed between the first side 10-1 and the first surface. At this time, since the first slope 10-2 and the first side 10-1 are the same or similar to those described in FIG. 5A, detailed description will be omitted. The encapsulation substrate 60b-2 may include a second side surface 60b-2a and a third inclined surface 60b-2b. At this time, in the above case, the relationship between the second side (60b-2a) and the third slope (60b-2b) is the relationship between the first side (10-1) and the first slope (10-2) described above. It may be similar.

In the above case, the display panel has an inclined surface formed on the encapsulation substrate 60b-2 and the substrate 10, so that the encapsulation substrate is damaged by an impact applied from the corner of at least one of the encapsulation substrate 60b-2 and the substrate 10. (60b-2) Alternatively, damage to the substrate 10 can be reduced.

Although not shown in the drawing, the boundary between each inclined surface and the side surface of the substrate 10 and the encapsulation substrate 60b-2 as described above may be formed to be rounded similar to that shown in FIG. 5C.

FIGS. 8A to 8D are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 7 .

Referring to FIG. 8A , when manufacturing the display panel DP, at least two display portions D may be formed on the mother substrate MS-1 to be spaced apart from each other. Additionally, the sealing portion 60b-1 may be disposed on the mother substrate MS-1. At this time, the sealing portion 60b-1 may be arranged to surround the outer edge of the display portion D on the plane shown in FIG. 6A. Thereafter, the sealing ledger substrate (MS-2) can be placed to face the mother substrate (MS-1) and the sealing ledger substrate (MS-2) can be connected to the sealing portion (60b-1). In this case, the sealing unit 60b-1 provides a sealing material to the mother substrate MS-1 or the encapsulating ledger substrate MS-2 through a nozzle, etc., and the encapsulating ledger substrate is applied to the sealing part 60b-1. After placing (MS-2) or mother substrate (MS-1), it can be fixed to the sealing portion (60b-1) by hardening the sealing portion (60b-1) using ultraviolet rays or the like. As another embodiment, the sealing portion 60b-1 may be disposed on the encapsulation mother substrate MS-2 rather than on the mother substrate MS-1 and then attached to the substrate 10.

After fixing the mother substrate (MS-1) and the sealing ledger substrate (MS-2) to the sealing portion (60b-1), cutting lines are formed on the mother substrate (MS-1) and the sealing ledger substrate (MS-2), respectively. can do. For example, a first cutting line (CL-1) can be formed by irradiating a laser on one side of the mother substrate (MS-1) through the laser irradiation unit (LS). At this time, the first cutting line CL-1 may be arranged along the circumference of the display unit D to surround the display unit D. In addition, the first cutting line CL-1 may be arranged to be further away from the display portion D than the area where the sealing portion 60b-1 is disposed. That is, the first cutting line CL-1 may be formed to surround the edge of the display unit D to correspond to the cutting line CL shown in FIG. 6A.

Referring to FIG. 8B, after the first cutting line (CL-1) is formed on the mother substrate (MS-1), the laser irradiation portion (LS) is moved to face the encapsulation mother substrate (MS-2) or the mother substrate (MS-1) is formed. By rotating the sealing ledger substrate (MS-1) and the sealing ledger substrate (MS-2), the sealing ledger substrate (MS-2) can be placed so that the sealing ledger substrate (MS-2) faces the laser irradiation portion (LS).

The laser irradiated from the laser irradiation unit (LS) can form a third cutting line (CL-3) on the sealing base board (MS-2).

Referring to FIG. 8C, a nozzle (NS) is applied to the mother substrate (MS-1) on which the first cutting line (CL-1) is formed and the encapsulation mother substrate (MS-2) on which the third cutting line (CL-3) is formed. The etching solution can be sprayed through. At this time, methods of spraying the etching solution may vary. For example, in one embodiment, as shown in FIG. 8C, the nozzle NS is arranged to face the mother substrate MS-1 and the encapsulation mother substrate MS-2, respectively, and Etching solution can be sprayed on each encapsulation substrate (MS-2). In another embodiment, the nozzle NS is disposed to face either the mother substrate MS-1 or the encapsulation ledger substrate MS-2. Etching solution can be sprayed on. Afterwards, the nozzle (NS) moves or the mother board (MS-1) and the encapsulation ledger board (MS-2) rotate, so that the nozzle (NS) and the mother board (MS-1) or the encapsulation ledger board (MS-2) are connected to each other. After the nozzles NS are arranged to face each other, it is possible to spray the etching solution on either the mother substrate MS-1 or the encapsulation mother substrate MS-2. As another embodiment, although not shown in the drawing, when the nozzle NS is arranged to face either the mother substrate MS-1 or the encapsulation ledger substrate MS-2, the mother substrate MS-1 or the encapsulation ledger substrate MS-2 The protective film (PF) shown in FIG. 6C is disposed on the other of the substrates (MS-2), and the nozzle (NS) applies an etchant to either the mother substrate (MS-1) or the encapsulation mother substrate (MS-2). Spraying is also possible. After removing the protective film (PF), the nozzle (NS) is placed to face the other one of the mother board (MS-1) or the encapsulated mother board (MS-2), and the nozzle (NS) is placed against the mother board (MS-1). ) or the other of the encapsulation substrate (MS-2).

Referring to FIG. 8D, when the etchant is sprayed on the mother substrate (MS-1) and the encapsulation mother substrate (MS-2), the first cutting line (CL-1) is the second cutting line similar to that shown in FIG. 6D. It can be connected to the line (CL-2). In addition, although not shown in the drawing, the third cutting line CL-3 may be connected to the fourth cutting line CL-4 extending to the surface of the encapsulation ledger substrate MS-2. At this time, the thickness of each of the mother substrate (MS-1) and the sealing mother substrate (MS-2) may be smaller than the initial thickness. The method of connecting the first cutting line (CL-1) and the second cutting line (CL-2) may be similar to that described in FIG. 6D. In addition, the method by which the third cutting line (CL-3) and the fourth cutting line (CL-4) are connected is the same as the method by which the first cutting line (CL-1) and the second cutting line (CL-2) are connected. It may be similar.

Referring to FIG. 8E, the first cutting line (CL-1) and the second cutting line (CL-2) are connected as above, and the third cutting line (CL-3) and the fourth cutting line (CL-4) are connected. ) is connected, the mother board (MS-1) and the encapsulation mother board (MS-2) can each be divided into a plurality of pieces based on the display portion (D). At this time, one display portion D may be surrounded by the substrate 10, the sealing portion 60b-1, and the encapsulation substrate 60b-2 and cut off from the outside.

In the above case, the substrate 10 may be provided with a first side 10-1 and a first inclined surface 10-2, and the encapsulation substrate 60b-2 may have a second side 60b-2a and a first inclined surface 10-2. It can be provided with 3 slopes (60b-2b). At this time, although not shown in the drawing, the substrate 10 may further include a second inclined surface (not shown), or the encapsulation substrate 60b-2 may further include a fourth inclined surface (not shown).

Therefore, the display device manufacturing method can reduce or prevent damage to at least one of the substrate 10 and the encapsulation substrate 60b-2 when manufacturing the display panel. Additionally, the display device manufacturing method can not only shorten the manufacturing time of the display panel but also simplify the process.

In the display panel, the edge of at least one of the substrate 10 and the encapsulation substrate 60b-2 is formed to be inclined, thereby reducing damage to the substrate 10 and the encapsulation substrate 60b-2. Additionally, the lifespan of the display panel can be increased by reducing damage to the substrate 10 and the encapsulation substrate 60b-2.

The above operation is not limited to the above, and after forming the third cutting line (CL-3) on the sealing mother substrate (MS-2), the first cutting line (CL-1) is formed on the mother substrate (MS-1). ) is also possible to form and perform.

9 is a cross-sectional view schematically showing a portion of a display panel of a display device according to another embodiment of the present invention.

Referring to FIG. 9 , a display panel (not shown) may include a substrate 10, a display unit (not shown), and an encapsulation member (not shown). At this time, since the substrate 10 and the display unit are the same or similar to those described in FIG. 2, detailed description will be omitted.

The encapsulation member may include a sealing portion (not shown) and an encapsulation substrate 60b-2. At this time, the sealing part may be the same or similar to that described in FIG. 7. Additionally, the encapsulation substrate 60b-2 may be similar to that described in FIG. 7.

The substrate 10 has a side surface 10-1, a first inclined surface 10-2 disposed between the side surface 10-1 and the first surface 10a, a second surface 10b, and a first side surface 10. It may include a second slope (10-3) disposed between -1). At this time, in the above case, the first angle θ1, the second angle θ2, and the third angle θ3 formed on the substrate 10 may be the same or similar to those described in FIG. 5B. In addition, the relationship between the first length (W1) and the second length (W2) and the relationship between the first thickness (L1), the second thickness (L2), and the third thickness (L3) are the same as those described in FIG. 5b. Or it may be similar.

Similar to the substrate 10, the encapsulation substrate 60b-2 has a first encapsulation substrate surface 60b-2d, a second side 60b-2a, a third inclined surface 60b-2b, and a fourth inclined surface 60b- 2c) and a second encapsulation substrate surface 60b-2e. In the above case, the encapsulation substrate 60b-2 has a fourth angle θ4 and a fifth angle similar to the first angle θ1, second angle θ2, and third angle θ3 of the substrate 10, respectively. It may include (θ5) and the sixth angle (θ6). That is, the sum of the fourth angle (θ4), the fifth angle (θ5), and the sixth angle (θ6) may be less than 450 degrees. Additionally, the third distance W3 of the third slope 60b-2b and the fourth distance W4 of the fourth slope 60b-2c may be different from each other. For example, the third distance W3 may be greater than the fourth distance W4. The fourth thickness (L4), which is the total thickness of the encapsulation substrate (60b-2), the fifth thickness (L5) from the first encapsulation substrate surface (60b-2d) to the border of the third inclined surface (60b-2b), and the second The sixth thickness (L6) from the encapsulation substrate surface (60b-2e) to the border of the fourth inclined surface (60b-2c) is the first thickness (L1), second thickness (L2), and third thickness (L3) described above. ) may be similar to the relationship between The fourth angle θ4 refers to the angle between the first encapsulation substrate surface 60b-2d and the third inclined surface 60b-2b, and the fifth angle θ5 refers to the angle between the third inclined surface 60b-2b and the third inclined surface 60b-2b. It refers to the angle between the two sides (60b-2a), and the sixth angle may refer to the angle between the second encapsulation substrate surface (60b-2e) and the fourth inclined surface (60b-2c).

In the above case, the relationship between the second side (60b-2a) and the third slope (60b-2b) may be similar to the relationship between the side (10-1) and the first slope (10-2) described in Figure 5b. there is. Additionally, the relationship between the second side 60b-2a and the fourth slope 60b-2c may be similar to the relationship between the side 10-1 and the second slope 10-3 described in FIG. 5B.

In the above case, the fourth slope 60b-2c and the second slope 10-3 may be arranged to face each other. Additionally, the first inclined surface 10-2 and the third inclined surface 60b-2b may be disposed on the outside of the display device 1.

In the above case, the display panel has an inclined surface formed on the encapsulation substrate 60b-2 and the substrate 10, so that the encapsulation substrate is damaged by an impact applied from the corner of at least one of the encapsulation substrate 60b-2 and the substrate 10. (60b-2) Alternatively, damage to the substrate 10 can be reduced.

In the above case, although not shown in the drawing, the point where the first surface (10a) and the first slope (10-2) connect, and the point where the first slope (10-2) and the first side (10-1) connect At least one of the points, the point where the first side (10-1) and the second slope (10-3) connect, and the point where the second slope (10-3) and the second side (10b) are connected forms a lounge crab. Alternatively, at least one of the first inclined surface 10-2 and the first side 10-1 may include a plurality of inclined surfaces. In addition, the point where the first encapsulation substrate surface 10 and the third inclined surface 60b-2b are connected, the point where the third inclined surface 60b-2b and the second side 60b-2a are connected, and the second side ( At least one of the points where 60b-2a) and the fourth inclined surface 60b-2d are connected and the fourth inclined surface 60b-2d and the second encapsulation substrate surface 60b-2e is formed to be round or At least one of the three inclined surfaces 60b-2b and the second encapsulation substrate surface 60b-2e may include a plurality of inclined surfaces.

FIGS. 10A to 10D are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 4 .

Referring to FIG. 10A, the laser irradiation unit LS is arranged to face one side of the mother substrate MS-1, so it is possible to irradiate the laser to one side of the mother substrate MS-1. In this case, the laser irradiation portion LS may form a first cutting line CL-1 on one surface. At this time, one side of the mother substrate (MS-1) may be the side where the display portion (D) is disposed. In the above case, the laser irradiation unit (LS) is shown as being disposed at the bottom of the mother substrate (MS-1) with reference to FIG. 10A, but this is not limited. It is placed on top of (MS-1) and can irradiate a laser to one side of the mother substrate (MS-1). In this case, the display unit D may be arranged to face upward with respect to FIG. 10A. However, for convenience of explanation, hereinafter, the detailed description will focus on the case where the laser irradiation unit LS is arranged as shown in FIG. 10A.

Referring to Figure 10b, after irradiating the laser, the protective film (PF) can be placed to cover the first cutting line (CL-1). Afterwards, the etching solution can be sprayed on the other side of the mother substrate (MS-1) through the nozzle (NS). The etchant can etch the other side of the mother substrate (MS-1), and if the other side of the mother substrate (MS-1) is etched over a certain distance, the etchant may etch at the portion corresponding to the first cutting line (CL-1). Two cutting lines (CL-2) can be formed. In the above case, the nozzle NS may be placed below the mother substrate MS-1 instead of above, as shown in FIG. 10B. At this time, the other side of the mother substrate (MS-1) on which the display portion (D) is not disposed may be disposed to face downward.

Referring to FIG. 10C, the second cutting line CL-2 may be connected to the first cutting line CL-1 to form a cutting line CL. At this time, the thickness of the mother substrate MS-1 may be smaller than the initial thickness, and the display portions D may be separated from each other. Additionally, a portion of the mother substrate MS-1 adjacent to the display portion D disposed at the outermost portion of the mother substrate MS-1 may be removed.

Referring to FIG. 10D, the mother substrate MS-1 on which each display portion D is disposed as described above may be separated from each other to form one display panel DP. In this case, the substrate 10 of the display panel includes a side surface 10-1 and a first slope 10-2, or the side surface 10-1, the first slope 10-2, and the second slope 10- 3) may include.

Although not shown in the drawings, the substrate 10 may include an inclined surface of the same or similar form as that described in FIGS. 5B to 5C.

FIGS. 11A to 11D are cross-sectional views schematically showing the procedure for manufacturing the display panel shown in FIG. 7 .

Referring to FIG. 11a, after combining the mother substrate (MS-1) and the sealing mother substrate (MS-2) with the sealing portion (60b-1), a third ray is applied to the sealing mother substrate (MS-2) using the laser irradiation portion (LS). A cutting line (CL-3) can be formed. In this case, the laser irradiation unit LS may be disposed on the top of the mother substrate MS-1. Although not shown in the drawing, the laser irradiation unit LS is disposed at the bottom with respect to FIG. 11A, and it is also possible to arrange the mother substrate MS-1 to face the laser irradiation unit LS.

Referring to FIG. 11b, after the third cutting line (CL-3) is formed, the mother substrate (MS-1) and the encapsulation mother substrate (MS-2) are reversed to place the mother substrate (MS-1) in the laser irradiation section (LS). After being arranged to face each other, a first cutting line (CL-1) can be formed on the mother substrate (MS-1).

Referring to FIG. 11C, after forming the first cutting line (CL-1) and the third cutting line (CL-3) on the mother substrate (MS-1) and the encapsulation mother substrate (MS-2), respectively, the nozzle (NS) ), the etching solution can be sprayed on one side of the mother substrate (MS-1) and one side of the encapsulation mother substrate (MS-2).

In the case above, the etching solution is supplied to the mother substrate (MS-1) and the encapsulating mother substrate (MS-2) at the same time, or to either the mother substrate (MS-1) or the encapsulating mother substrate (MS-2) first and then to the mother substrate (MS-1). It is also possible to supply to either the substrate (MS-1) or the encapsulation substrate (MS-2).

Referring to FIG. 11D, when the etching solution is supplied as described above, the first cutting line (CL-1) and the third cutting line (CL-3) are connected to other cutting lines as described in FIG. 8D, thereby forming the mother substrate (MS). -1) and the encapsulation substrate (MS-2) are separated from each other into a plurality of display panels (DP) including the substrate 10, the encapsulation substrate 60b, the display portion D, and the sealing portion 60b-1. can be separated.

Although not shown in the drawings, the substrate 10 and the encapsulation substrate 60b may include inclined surfaces of the same or similar shape as those described in FIGS. 7 and 9 .

Figure 12 is a perspective view schematically showing an electronic device according to an embodiment of the present invention. FIG. 13 is an exploded perspective view schematically showing the electronic device shown in FIG. 12. FIG. 14 is a cross-sectional view schematically showing a portion of the electronic device shown in FIG. 12.

12 to 14, the electronic device (EA) is a device that displays moving images or still images, such as a mobile phone, smart phone, tablet personal computer, or mobile communication terminal. , portable electronic devices such as electronic notebooks, e-books, PMP (portable multimedia player), navigation, and UMPC (Ultra Mobile PC), as well as various devices such as televisions, laptops, monitors, billboards, and the Internet of Things (IOT). It may include electronic devices used as display screens for products. Additionally, the electronic device (EA) can be used in wearable devices such as smart watches, watch phones, glasses-type displays, and head mounted displays (HMDs). In addition, electronic devices (EA) include a car's dashboard, a CID (Center Information Display) placed on the car's center fascia or dashboard, a room mirror display that replaces a car's side mirror, It can be used as entertainment for the backseat of a car and as a display placed on the back of the front seat. Below, a detailed explanation will be given focusing on the case where the electronic device (EA) is a smart phone.

The electronic device EA includes a cover window 500, a display device 1, a bracket 600, a main circuit board 700, a battery 800, and a lower cover 900.

In this specification, “upper” refers to the direction in which the cover window 500 is disposed relative to the display panel DP, that is, the +z direction, and “lower” refers to the lower cover 900 relative to the display panel DP. Indicates the direction in which is placed, the -z direction. Additionally, “left”, “right”, “top”, and “bottom” indicate the direction when the display panel DP is viewed from a plane. For example, "left" refers to the -x direction, "right" refers to the +x direction, "up" refers to the +y direction, and "down" refers to the -y direction.

The electronic device (EA) may have a rectangular shape in plan. For example, the electronic device EA may have a rectangular planar shape with a short side in the first direction (x-direction) and a long side in the second direction (y-direction) as shown in FIG. 1 . The corner where the short side in the first direction (x-direction) and the long side in the second direction (y-direction) meet may be rounded to have a predetermined curvature or may be formed at a right angle. The planar shape of the electronic device EA is not limited to a rectangle, but may be formed into other polygonal, oval, or irregular shapes.

The cover window 500 may be disposed on the top of the display panel DP of the display device 1 to cover the top surface of the display panel DP. Because of this, the cover window 500 may function to protect the top surface of the display panel DP.

The cover window 500 may include a transparent cover part DA50 corresponding to the display panel DP and a light blocking cover part NDA50 corresponding to an area other than the display panel DP. The light blocking cover part NDA50 may include an opaque material that blocks light. The light blocking cover part NDA50 may include a pattern that can be shown to the user when an image is not displayed.

The display panel DP may be disposed below the cover window 500 . The display panel DP may overlap the transparent cover portion DA50 of the cover window 500.

The display panel DP may include a display area as shown in FIG. 1 . The display area may be an area where an image is displayed. In another embodiment, the display panel DP may include a main display area and a component area, although not shown in the drawing. Both the main display area and the component area are areas where images are displayed, and the component area may be an area below which components such as sensors and cameras that use visible light, infrared light, or sound are placed. In one embodiment, the component area may be an area with higher light transmittance and/or sound transmittance than the main display area. In one embodiment, when light transmits through the component area, the light transmittance is about 25% or more, 30% or more, more preferably 50% or more, 75% or more, 80% or more, 85% or more, or 90% or more. It may be more than %.

The display panel DP may be transparent so that objects or backgrounds placed on the bottom of the display panel DP can be seen from the top of the display panel DP. Alternatively, the display panel DP may be a reflective display panel capable of reflecting an object or background on the upper surface of the display panel DP.

A flexible film 54 may be attached to one edge of the display panel DP. Additionally, the display driver 52 may be disposed on the flexible film 54 .

The display circuit board 51 may be attached to the other side of the flexible film 54 . A touch sensor driver 53 may be disposed on the display circuit board 51.

The touch screen layer of the display panel DP can detect a user's touch input using at least one of various touch methods, such as a resistive touch method and a capacitive touch method. For example, when the touch screen layer of the display panel DP detects the user's touch input in a capacitive manner, the touch sensor driver 53 applies driving signals to the driving electrodes among the touch electrodes, and applies driving signals to the touch electrodes. By detecting voltages charged in mutual capacitance (hereinafter referred to as “mutual capacitance”) between the driving electrodes and the sensing electrodes through the sensing electrodes, it is possible to determine whether the user has touched the device. The user's touch may include contact touch and proximity touch. Contact touch refers to direct contact of an object such as a user's finger or pen to the cover window 50 disposed on the touch screen layer. A close touch refers to an object, such as a user's finger or a pen, being placed close to the cover window 50, such as hovering.

A power supply unit for supplying driving voltages for driving the pixels of the display panel DP, the scan driver, and the display driver 52 may be additionally disposed on the display circuit board 51 . Alternatively, the power supply unit may be integrated with the display driver 52, and in this case, the display driver 52 and the power supply unit may be formed as one integrated circuit.

A bracket 600 may be disposed below the display panel DP to support the display panel DP. The bracket 600 may include plastic, metal, or both plastic and metal. The bracket 600 includes a first camera hole (CMH1) into which the camera device 731 is inserted, a battery hole (BH) into which the battery 800 is placed, and a cable through which the cable 35 connected to the display circuit board 51 passes. A hole (CAH) may be formed. Additionally, the bracket 600 may further include a component hole (not shown) that overlaps a portion of the display panel DP. In this case, the component hole may overlap components of the main circuit board 700 in the third direction (z direction). Accordingly, one area of the display panel DP may overlap components of the main circuit board 700 in the third direction (z direction).

The above components may be provided in plural numbers. For example, the plurality of components may each be equipped with a proximity sensor, an illumination sensor, an iris sensor, and a camera (or image sensor). In this case, one area of the display panel (DP) corresponding to each component may have a predetermined light transmittance, and a proximity sensor using infrared rays can detect objects placed close to the upper surface of the electronic device (EA). The illuminance sensor can detect the brightness of light incident on the top surface of the electronic device (EA). Additionally, the iris sensor can photograph the iris of a person placed on the top surface of the electronic device (EA), and the camera can photograph an object placed on the top surface of the electronic device (EA). The above components may not be limited to proximity sensors, illumination sensors, iris sensors, and cameras.

A main circuit board 700 and a battery 800 may be placed below the bracket 600. The main circuit board 700 may be a printed circuit board or a flexible printed circuit board.

The battery 800 may be arranged so as not to overlap the main circuit board 700 in the third direction (z direction). The battery 800 may overlap the battery hole (BH) of the bracket 600.

The lower cover 900 may be placed below the main circuit board 700 and the battery 800. The lower cover 900 may be fastened to the bracket 600 and fixed. The lower cover 900 may form the lower surface of the electronic device (EA). The lower cover 900 may include plastic, metal, or both plastic and metal.

A second camera hole (CMH2) exposing the lower surface of the camera device 731 may be formed in the lower cover 900. The position of the camera device 731 and the positions of the first and second camera holes CMH1 and CMH2 corresponding to the camera device 731 are not limited to the embodiment shown in FIG. 13.

The display panel DP may include a substrate 10, a display layer (DISL) including a display unit (not shown), a touch screen layer (TSL), an optical functional layer (OFL), and a panel protection member (PB). there is.

A display layer (DISL) including a display unit may be disposed on the substrate 10 . The display layer (DISL) includes pixels and may be a layer that displays an image. The display layer (DISL) may include a circuit layer provided with thin film transistors, a display element layer in which display elements are arranged, and a sealing member for sealing the display element layer. In this case, the display unit as described above may be the same or similar to that described in FIG. 2 above.

The display layer (DISL) can be divided into a display area (DA) and a peripheral area (NDA). The display area DA may be an area where pixels are arranged to display an image. The peripheral area NDA may be an area disposed outside the display area DA and does not display an image. The peripheral area NDA may be arranged to surround the display area DA. The peripheral area NDA may be an area from the outside of the display area DA to the edge of the display panel DP. In the display area DA, not only pixels but also pixel circuits that drive the pixels, scan wires connected to the pixel circuits, data wires, power wires, etc. may be disposed. In the peripheral area NDA, a scan driver for applying scan signals to the scan lines, fan-out lines for connecting the data lines and the display driver 52, etc. may be disposed.

A touch screen layer (TSL) may be disposed on the display layer (DISL). The touch screen layer (TSL) includes touch electrodes and may be a layer for detecting whether a user touches the touch screen. The touch screen layer (TSL) may be formed directly on the sealing member of the display layer (DISL). Alternatively, the touch screen layer (TSL) may be formed separately and then bonded to the sealing member of the display layer (DISL) through an adhesive layer such as an optically clear adhesive (OCA).

An optical functional layer (OFL) may be disposed on the touch screen layer (TSL). The optical functional layer (OFL) may include an anti-reflection layer. The anti-reflection layer can reduce the reflectance of light (external light) incident on the display device 1 from the outside.

In some embodiments, the anti-reflection layer may be provided as a polarizing film. Polarizing film is a linear polarizer and /May include a phase retardation film such as a quarter-wave plate. The phase retardation film may be disposed on the touch screen layer (TSL), and the linear polarizer may be disposed on the phase retardation film.

In some embodiments, the anti-reflection layer may include a filter layer including a black matrix and color filters. Color filters may be arranged taking into account the color of light emitted from each pixel of the display device 1. For example, the filter layer may include red, green, or blue color filters.

In some embodiments, the anti-reflective layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may interfere destructively, and thus the external light reflectance may be reduced.

A cover window 500 may be disposed on the optical functional layer (OFL). The cover window 500 may be attached to the optical functional layer (OFL) by a transparent adhesive member such as an optically clear adhesive (OCA) film.

A panel protection member (PB) may be disposed below the display panel (DP). The panel protection member PB may be attached to the lower surface of the display panel DP through an adhesive member. The adhesive member may be a pressure sensitive adhesive (PSA). The panel protection member (PB) includes at least one of a light absorption layer for absorbing light incident from the outside, a cushion layer for absorbing shock from the outside, and a heat dissipation layer for efficiently dissipating heat from the display panel (DP). It can be included.

The light absorption layer may be disposed below the display panel DP. The light absorption layer blocks the transmission of light and prevents components disposed below the light absorption member, such as the display circuit board 51, from being visible from the top of the display panel DP. The light absorption layer may include a light absorption material such as black pigment or black dye.

The cushion layer may be disposed below the light absorbing member. The cushion layer absorbs external shock and prevents the display panel DP from being damaged. The cushion layer may be made of a single layer or multiple layers. For example, the cushion layer is formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or is foam-molded from rubber, a urethane-based material, or an acrylic-based material. It may be made of an elastic material such as a sponge.

The heat dissipation layer may be disposed below the cushion layer. The heat dissipation layer may include a first heat dissipation layer containing graphite, carbon nanotubes, etc., and a second heat dissipation layer formed of a metal thin film such as copper, nickel, ferrite, or silver, which can shield electromagnetic waves and has excellent thermal conductivity.

A flexible film 54 may be disposed in the peripheral area NDA of one edge of the display panel DP. The flexible film 54 may be bent toward the lower portion of the display panel DP, and the display circuit board 51 may be disposed on the lower surface of the panel protection member PB. The display circuit board 51 may be attached and fixed to the lower surface of the panel protection member PB through the first adhesive member 59. The first adhesive member 59 may be a pressure sensitive adhesive.

As such, the present invention has been described with reference to an embodiment shown in the drawings, but this is merely an example, and those skilled in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

10: substrate
60: Thin film encapsulation layer
60b: Encapsulation member
60b-1: Sealing part
60b-2: Encapsulation substrate

Claims (36)

Board;
a display unit disposed on the substrate; and
It includes; a sealing member disposed on the display unit,
The substrate is,
a first inclined surface inclined with respect to one surface of the substrate; and
A display device comprising: a first side connected to the first inclined surface, disposed at a predetermined angle from the first inclined surface, and having a surface roughness different from that of the first inclined surface. According to claim 1,
A display device wherein the surface roughness of one surface of the substrate connected to the first inclined surface is different from the surface roughness of the first inclined surface. According to claim 1,
The substrate is
The display device further includes a second inclined surface connected to the first side and inclined with respect to one surface of the substrate. According to claim 3,
A display device wherein an angle of the first inclined surface with respect to one surface of the substrate and an angle of the second inclined surface with respect to the other surface of the substrate are different from each other. According to claim 3,
A first angle between one surface of the substrate and the first inclined surface, a second angle between the first inclined surface and the first side, and an angle between the second inclined surface and the other surface of the substrate opposite to the one surface of the substrate. A display device where the sum of three angles is less than 450 degrees. According to claim 1,
A display device whose height from one surface of the substrate to an end of the first inclined surface is less than half the thickness of the substrate. According to claim 1,
A display device wherein the encapsulation member is a thin film encapsulation layer. According to claim 1,
The sealing member is,
an encapsulation substrate disposed to face the substrate; and
A display device comprising: a sealing portion disposed between the substrate and the encapsulation substrate to seal the display portion. According to claim 8,
The encapsulation substrate is,
a third inclined surface inclined with respect to one surface of the encapsulation substrate; and
A display device including a second side connected to the third inclined surface and disposed at a predetermined angle from the third inclined surface. According to clause 9,
The display device wherein the second side has a surface roughness different from that of the third inclined surface. In clause 9
A display device wherein the surface roughness of one surface of the encapsulation substrate connected to the third inclined surface is different from the surface roughness of the third inclined surface. According to clause 9,
The encapsulation substrate is,
The display device further includes a fourth inclined surface connected to the second side and inclined with respect to one surface of the encapsulation substrate. According to claim 12,
The display device wherein the angle of the third inclined surface with respect to the second side and the angle of the fourth inclined surface with respect to the second side are different from each other. According to claim 12,
A fourth angle between one surface of the encapsulation substrate and the third inclined surface, a fifth angle between the third inclined surface and the second side, and the fourth inclined surface and the other surface of the encapsulation substrate opposite to one surface of the encapsulation substrate. A display device in which the sum of the sixth angles is less than 450 degrees. According to clause 9,
A display device wherein the height from one surface of the encapsulation substrate to the end of the third inclined surface is less than half the thickness of the encapsulation substrate. According to clause 9,
The third inclined surface is a display device including a plurality of inclined surfaces having different angles with respect to one surface of the encapsulation substrate. According to claim 1,
The first inclined surface includes a plurality of inclined surfaces having different angles with respect to one surface of the substrate. Absence of cover;
a cover coupled to the cover member;
It includes: a display device disposed inside the cover member and the cover,
The display device is an electronic device according to any one of claims 1 to 17. Forming a cutting surface in the thickness direction of the base substrate by irradiating a laser to the first surface of the base substrate having a first surface on which a plurality of display units are arranged and a second surface facing the first surface;
attaching a film member to the first surface; and
Spraying an etchant on the second surface to divide the base substrate into a plurality of substrates along the cut surface. According to claim 19,
The method of manufacturing a display device further comprising irradiating the laser to the base substrate along an edge of each display unit so as to be spaced apart from the edge of each display unit. According to claim 19,
The method of manufacturing a display device further comprising: reducing the thickness of the base substrate by spraying the etchant on the second surface. According to claim 19,
The method of manufacturing a display device further comprising: forming a first inclined surface that meets the cut surface and is inclined with respect to the cut surface. According to claim 22,
Connecting the cut surface to the first surface and forming a second inclined surface inclined with respect to the cut surface. According to claim 23,
The sum of the first angle formed by the second surface and the first inclined surface, the second angle formed by the first inclined surface and the cutting surface, and the third angle formed by the second inclined surface and the second surface is 450 degrees. A method of manufacturing a display device that is less than. According to claim 22,
A method of manufacturing a display device wherein the distance from one surface of the substrate to a portion where the first inclined surface and the cut surface are connected is less than half the thickness of the substrate. According to clause 22,
A method of manufacturing a display device, wherein the first inclined surface includes a plurality of inclined surfaces having different angles with respect to one surface of the substrate. According to claim 19,
A method of manufacturing a display device further comprising forming a thin film encapsulation layer on each display unit. forming a plurality of display units on a base substrate, arranging a sealing part around an edge of the display unit to shield each display unit, and attaching an encapsulation base substrate to the sealing part;
Forming a cutting surface on at least one of the one side of the base substrate and the one side of the encapsulation base substrate by irradiating a laser to at least one side of the base substrate and the encapsulation base substrate; and
Spraying an etchant on one surface of at least one of the base substrate and the encapsulation base substrate on which the cut surface is disposed to separate at least one of the base substrate and the encapsulation base substrate on which the cut surface is disposed into a plurality of pieces. Method of manufacturing the device. According to clause 28,
The method of manufacturing a display device, wherein the cut surface is disposed on at least one of one side of the base substrate and one side of the encapsulation base substrate facing each other. According to clause 28,
Supplying an etchant to at least one of the base substrate and the encapsulation base substrate on which the cut surface is disposed to form a first inclined surface inclined with respect to the cut surface. According to claim 30,
A method of manufacturing a display device further comprising forming a second inclined surface disposed to face the first inclined surface, connected to the cutting surface, and inclined with respect to the cutting surface, on at least one of the base substrate and the encapsulation base substrate. . According to claim 31,
A display device in which the sum of the angle formed by one surface of the base substrate and the first inclined surface, the angle formed by the cutting surface and the first inclined surface, and the angle formed by the other surface of the base substrate and the second inclined surface is less than 450 degrees. Manufacturing method. According to claim 31,
The sum of the angle formed by one surface of the encapsulation base substrate and the first inclined surface, the angle formed by the cutting surface and the first inclined surface, and the angle formed by the other surface of the encapsulating base substrate and the second inclined surface is less than 450 degrees. Method of manufacturing a display device. According to claim 30,
A method of manufacturing a display device in which the first thickness of at least one of the base substrate and the encapsulation base substrate is greater than a second thickness that is a thickness from one surface of at least one of the base substrate and the encapsulation base substrate to the first inclined surface and the cut surface. . According to claim 30,
The first inclined surface includes a plurality of inclined surfaces having different angles with respect to one surface of the base substrate or one surface of the encapsulation base substrate. According to clause 28,
The etchant is supplied to the entire surface of at least one of the base substrate and the encapsulation base substrate to reduce the thickness of at least one of the base substrate and the encapsulation base substrate.

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