KR20230108947A - apparatus for transferring circuit board and manufacturing device of circuit board using the same - Google Patents

Abstract

Provided is a circuit board transfer apparatus comprising: a jig unit mounting a circuit board; and a transfer roller device unit provided on a lower portion of the jig unit to transfer the jig unit. The jig unit includes: a vertical jig frame having a rectangular shape; a plurality of upper clamps mounted on an upper frame of the vertical jig frame to elastically grip and fix the upper end of the circuit board; a plurality of lower clamps mounted on a lower frame of the vertical jig frame to elastically grip and fix a lower end of the circuit board; and a base plate supporting a lower side of the vertical jig frame. The transfer roller device unit includes: a plurality of rotating roller units installed on the lower surface of the base plate of the jig unit, having guide protrusions formed on both ends thereof to protrude and guide both end surfaces of the base plate, having a plurality of seating grooves formed around the cylindrical surface of a body, and having a plurality of circular rings (221, 222) mounted on the seating grooves; rotating shafts connected to the rotation centers of the rotating roller units to rotate the rotating roller units; and driving wheels rotating the rotating shafts. Therefore, the circuit board transfer apparatus can prevent damage to the circuitry of a thin circuit board when transferring the thin circuit board.

Description

Circuit board transfer device and circuit board manufacturing device including the same {apparatus for transferring circuit board and manufacturing device of circuit board using the same}

The present invention relates to a circuit board transportation device and a circuit board manufacturing device including the same.

A circuit board, such as a printed circuit board (PCB), is formed of a hard material, and the circuit board is plated with a copper foil layer having excellent conductivity on the surface of the circuit board, and then printed with the necessary patterns, and then mounted with the necessary components. Manufactured through the process of completion.

In the process of manufacturing such a hard circuit board, a copper alloy is plated on the surface of a substrate provided in the form of a film to form a copper foil film, and then parts other than the circuit pattern are removed to print the pattern, A step of surface mounting various components on the surface thereof is included.

The manufacturing process of the circuit board may include a process such as a lithography process. After completion of such a process or before moving to the next process, for example, a process of treating photosensitive resist present on the surface of the circuit board is included.

The photosensitive resist treatment process includes a process of removing the resist pattern according to a set pattern by performing a shower process with an alkaline chemical by dividing a part receiving light and a part not receiving light when light is applied thereto.

According to Korean Patent Laid-open Publication No. 10-2014-0113114, a resist removal agent containing ammonium hydroxide, dimethyl sulfoxide, glycol ether-based organic solvent, alkylhydroxylamine, alkylamine, alkanolamine salt and water A detergent composition for removing color resist has been disclosed.

After the photosensitive resist treatment process, an etching (etching) process for forming a circuit or a process for plating the surface to improve circuit characteristics is followed.

In order to move during or during this process, it is moved by a circuit board transfer device.

In the trend of increasingly thinner printed circuit boards (e.g., 0.030 mm) and higher integration (e.g., 10 μm circuit, 12 μm space), the circuit board itself, which is a conventional manufacturing method, is contacted with a roller and conveyed When transporting, foreign substances are deposited or circuits are damaged, which limits the circuit board production.

In particular, since the photosensitive resist has a possibility of re-electrodeposition, foreign substances may be electrodeposited or circuit damage may occur when the circuit board is transported by a contact method (for example, a roll driving method).

As an improvement measure for this, a non-contact jig broadcast method in which the circuit board is fixed to a specific jig frame and conveyed and a conveyance method in which the circuit board is erected and transferred vertically have been developed.

In the case of carrying the jig frame upright, a method of widening the lower pedestal or conveying the upper part using a guide device may be adopted.

Republic of Korea Patent Registration No. 10-2248854 discloses a circuit board transfer device capable of transferring a circuit board in a vertical state.

In the case of ultra-thin circuit boards, in order to increase product precision on the front and back sides, chemicals must be applied uniformly on the circuit board surface, and accurate position maintenance is required during transportation of the circuit board. It is more distributed on the lower side to form an upper and lower deviation, and a case in which the circuit board is shaken from side to side or tilted to one side during transport may cause corrosion deviation between the front and rear surfaces.

Republic of Korea Patent Registration No. 10-2248854 Republic of Korea Patent Publication No. 10-2014-0113114

An object of the present invention is to provide a circuit board conveying device capable of stably conveying and preventing left and right shaking of a circuit board according to conveyance of the circuit board during the circuit board manufacturing process, and a circuit board manufacturing device including the same.

According to one aspect of the present invention, a circuit board transfer device includes a jig unit for mounting the circuit board and a transfer roller unit for transferring the jig unit at a lower portion of the jig unit, wherein the jig unit has a rectangular shape. vertical jig frame; a plurality of upper side clamps mounted on the upper side frame of the vertical jig frame to elastically hold and fix the upper end of the circuit board; a plurality of lower side clamps mounted on the lower side frame of the vertical jig frame to elastically hold and fix the lower end of the circuit board; and a base plate supporting a lower side of the vertical jig frame, wherein the transfer roller unit is installed on a lower surface of the base plate of the jig unit, and has guide protrusions for guiding end surfaces of both sides of the base plate. A plurality of rotating roller units formed to protrude from both ends, a plurality of seating grooves are formed around the cylindrical surface of the body portion, and a plurality of circular rings 221 and 222 are installed, mounted in the seating grooves; a rotational shaft that is connected to the rotational center of the rotational roller unit and rotates the rotational roller unit; and a driving wheel for rotating the rotating shaft. It is characterized in that it includes.

In addition, the circular ring is characterized in that made of rubber or synthetic rubber material having elasticity.

In addition, the guide protrusion is characterized in that formed to protrude more than 2mm from both ends of the cylindrical surface of the body of the rotating roller unit.

In addition, an upper guide rail having a seating groove formed in an upper space of the jig unit is formed, and the jig unit further includes a guide bar extending upward from the upper side frame and inserted into the seating groove. do.

According to another aspect of the present invention, in the circuit board manufacturing apparatus including any one of the circuit board conveying apparatus, the circuit board manufacturing apparatus includes a chemical for spraying a chemical for resist processing to the front and rear surfaces of the jig unit. It is characterized in that the injection tubes are arranged in a plurality of rows along the vertical surface of the upper side from the lower side, and the intervals of the drug injection tubes on the upper side are sequentially formed narrower than the intervals of the drug injection tubes on the lower side.

In addition, it is characterized in that the distance between the upper side of the drug injection pipe is arranged so as to be formed narrower at a rate of 2.5% sequentially than the distance between the lower side of the drug injection pipe.

In addition, the arrangement structure of the chemical injection tubes is characterized in that each two rows of drug injection pipes are arranged at equal intervals, and the interval on the upper side is narrower than the interval between the drug injection pipes on the immediately preceding lower side with a difference of 5%. to be

In addition, in the arrangement structure of the chemical injection pipe, the distance (d1) between the first row chemical injection pipe 411 and the second row chemical injection pipe 412 from the bottom is 100 mm, and the second row chemical injection pipe 412 and The distance d2 between the third row chemical injection pipes 413 and the distance d3 between the third row chemical injection pipes 413 and the fourth row chemical injection pipes 414 are 95 mm, and the fourth row chemical injection pipes ( 414) and the 5th row chemical injection pipe 415 (d4) and the 5th row chemical injection pipe 415 and the 6th row chemical injection pipe 416 (d5) are 90 mm, The distance (d6) between the pipe 416 and the 7th row chemical injection pipe 417 and the distance (d7) between the 7th row chemical injection pipe 417 and the 8th row chemical injection pipe 418 are arranged at 85.0 mm. characterized by

In addition, one or more of a pressure sensor and a flow sensor is installed in each chemical injection pipe to transmit a sensing signal to a control unit in real time, and the control unit determines the sensing signal to determine a pressure value or a flow rate value within a 5% range. If it is determined that it is exceeded, it is characterized in that the rotation speed of the drug pump for supplying the drug to the drug injection pipe is controlled to always maintain a constant pressure and injection amount in the range of 95% to 105% of the set value.

In addition, the set value of the injection pressure of the chemical injection pipe is characterized in that it is set to any one value in the range of 1.2 ~ 2.2 Kgf / cm 2.

The conveying device according to an embodiment of the present invention transfers the circuit board 10 in a non-contact method in which the circuit board 10 is fixed to the jig unit 100 and conveyed, thereby transferring the circuit board circuit when the thin circuit board is transferred. of damage can be prevented.

In addition, the transfer device according to an embodiment of the present invention is a jig by the rotation roller unit 210 having guide protrusions 251 for guiding both ends of the base plate 160 to prevent left and right movement during transfer. It is possible to stably maintain the position of the unit 100 and prevent it from shaking left and right during transport.

In addition, by mounting a plurality of circular rings 221 and 222 having elasticity so as to be in close contact with the lower surface of the base plate 160, it has elastic adhesion to the lower surface of the base plate 160 and stably The jig unit 100 can be transferred in a rotational direction.

In the resist processing process according to an embodiment of the present invention, by making the arrangement structure of the spray tubes on the upper side narrower than the spacing between the spray tubes on the lower side, the solution injected from the upper part flows and the lower injection amount Even if it is added together, it can have the effect of uniformly applying the chemical through the entire circuit board.

1 shows a front structure of a circuit board transfer device according to an embodiment of the present invention.
Figure 2 shows the structure of one side of the circuit board transfer device according to an embodiment of the present invention.
3 shows the structure of a circuit board transfer device according to another embodiment of the present invention.
4 illustrates an example of a resist processing process in a method of manufacturing a circuit board using a transfer device according to an embodiment of the present invention.
5 illustrates an arrangement structure of chemical injection tubes in a process of resist processing by a transfer device according to an embodiment of the present invention.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this application, when a certain component is said to "include", it means that it may further include other components without excluding other components unless otherwise stated.

In addition, terms such as "...unit", "...unit", "module", and "device" described in the specification mean a unit that processes at least one function or operation, which is hardware or software, or a combination of hardware and software. can be implemented as

Also, terms such as first and second may be used in describing components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being 'connected', 'coupled' or 'connected' to another element, the element may be directly connected, coupled or connected to the other element, but not between the element and the other element. It should be understood that another component may be 'connected', 'coupled' or 'connected' between elements.

Hereinafter, a circuit board transportation device and a circuit board manufacturing device including the same according to an embodiment of the present invention will be described in detail through an embodiment.

In one embodiment of the present invention, to provide a circuit board transport device and a circuit board manufacturing device including the same to solve the problem of shaking the circuit board during the transport process of the conventional transport device and the occurrence of corrosion deviation during the resist treatment process characterized by

1 shows a front structure of a circuit board transfer device according to an embodiment of the present invention.

Figure 2 shows the structure of one side of the circuit board transfer device according to an embodiment of the present invention.

Referring to FIGS. 1 and 2 , the transfer device according to an embodiment of the present invention includes a jig unit 100 for mounting a circuit board 10 and the jig unit 100 at the bottom of the jig unit 100. It includes a conveying roller unit 200 for conveying. The jig unit 100 includes a rectangular vertical jig frame 110 and a plurality of upper side clamps mounted on the upper frame of the vertical jig frame 110 to grip and fix the upper end of the circuit board with elasticity ( 151, to 154), a plurality of lower side clamps 161 to 164 mounted on the lower side frame of the vertical jig frame 110 to hold and fix the lower end of the circuit board with elasticity, and the vertical jig frame 100 ) Includes a base plate 160 supporting the lower side of.

The transfer roller unit 200 is installed on the lower surface of the base plate 160 of the jig unit 100, and guide protrusions 251 guiding both end surfaces of the base plate 160 protrude from both ends. A plurality of rotating roller parts 210-1, ..., 210 formed to be formed to be, a plurality of seating grooves are formed around the cylindrical surface of the body, and a plurality of circular rings 221, 222 are installed, mounted in the seating grooves -n), a rotation shaft 290 connected to the rotation center of the rotation roller unit 210 to rotate the rotation roller unit 210 and a driving wheel 280 to rotate the rotation shaft 290.

The plurality of circular rings 221 and 222 according to an embodiment of the present invention are characterized in that they are made of rubber or synthetic rubber material having elasticity.

The guide protrusions 251 of the rotating roller units 210-1, ...210-n according to an embodiment of the present invention are base plates 160 at both ends of the body of the rotating roller units 210-1, ... 210-n. ) is formed so as to protrude more than 2mm from both ends of the cylindrical surface of the body to prevent separation.

In addition, the driving wheel 280 of the transfer roller unit 200 may be connected to a driving unit including a driving motor through a conveyor or a driving belt.

The conveying device according to an embodiment of the present invention transfers the circuit board 10 in a non-contact method in which the circuit board 10 is fixed to the jig unit 100 and conveyed, thereby transferring the circuit board circuit when the thin circuit board is transferred. of damage can be prevented. In addition, the transfer device according to an embodiment of the present invention is a jig by the rotation roller unit 210 having guide protrusions 251 for guiding both ends of the base plate 160 to prevent left and right movement during transfer. It is possible to stably maintain the position of the unit 100 and prevent it from shaking left and right during transport.

In addition, by mounting a plurality of rubber rings 221 and 222 having elasticity so as to be in close contact with the lower surface of the base plate 160, it has elastic adhesion to the lower surface of the base plate 160 and stably The jig unit 100 can be transferred in a rotational direction.

3 shows the structure of a circuit board transfer device according to another embodiment of the present invention.

Referring to FIG. 3 , in a circuit board transport device according to another embodiment of the present invention, an upper guide rail 380 having a seating groove formed in an upper space of the jig unit 100 in the transport device of FIGS. 1 and 2 is formed, the jig unit 100 is characterized in that it further comprises a guide bar 170 extending from the upper side frame of the jig frame 110 to the top and inserted into the seating groove.

In the circuit board transfer device according to FIG. 3, the upper guide rail 380 is installed along the transfer trajectory, and the guide bar 170 slides on the upper guide rail 380 to move in the seating groove of the upper guide rail 380. It can have the effect of preventing the shaking of.

4 illustrates an example of a resist processing process in an apparatus for manufacturing a circuit board using a transfer apparatus according to an embodiment of the present invention.

In the resist treatment process, photosensitive resist is applied to a circuit board, light is projected through a mask formed in a pattern set on the applied photosensitive resist, and then a shower process is performed with an alkaline chemical to separate the light-receiving part and the non-light-receiving part. The resist pattern is removed according to the separately set pattern.

Referring to FIG. 4 , in the process of resist processing, chemical injection tubes 411 to 418 for spraying chemicals for resist processing are disposed in a plurality of rows along the vertical surface from the bottom to the top on the front and rear surfaces of the jig unit 100 . In addition, chemical injection nozzles 418-1...418-n are formed in the chemical injection tubes 411 to 418 at regular intervals and spray toward the circuit board 10.

In the case of ultra-thin circuit boards, chemicals must be uniformly applied to the circuit board surface in order to increase product precision on the front and back sides.

In one embodiment of the present invention, one or more of a pressure sensor and a flow sensor are installed in each of the chemical injection pipes 411 to 418 to transmit a sensing signal to the control unit in real time, and the control unit determines the sensing signal to set the pressure. If it is determined that the value or flow rate exceeds a certain range (eg, 5% range), the number of rotations of the chemical pump for supplying the chemical to the chemical injection pipes 411 to 418 is always constant within the set range. The pressure and injection amount can be maintained.

For example, in one embodiment of the present invention, it is possible to always maintain a constant pressure and injection amount in the range of 95% to 105% of the set value.

The set value of the injection pressure of the chemical injection pipes 411 to 418 according to an embodiment of the present invention may be set to any one value in the range of 1.2 to 2.2 Kgf/cm 2 .

For example, when the thickness of the printed circuit board is 0.030 mm, the setting value of the injection pressure of the preferred chemical injection pipes 411 to 418 may be set to 1.20 Kgf/cm 2 . In this case, the control unit determines the sensing signal, and when the sensed pressure value is less than 1.14 Kgf/cm 2 , the supply pressure of the pump is increased by increasing the number of revolutions of the chemical pump supplying the chemical to the chemical injection pipes 411 to 418, , When the sensed pressure value exceeds 1.26 Kgf/cm 2 , the rotation speed of the chemical pump for supplying the chemical to the chemical injection pipes 411 to 418 is lowered to reduce the supply pressure of the pump. In the range of 95% to 105%, constant pressure and injection amount can be maintained at all times.

In addition, even when the pressure and injection amount of each of the chemical injection pipes 411 to 418 are uniform, when the chemical is sprayed onto the circuit board surface using the vertical jig unit 100, a portion of the chemical solution sprayed on the upper part is transferred to the lower part. Since it flows to the side and gathers, a deviation between the corrosion pattern of the lower side and the corrosion pattern of the upper side may occur.

According to an embodiment of the present invention, in order to prevent the occurrence of the above-described upper and lower corrosion deviation and to uniformly apply the chemical, the chemical injection pressure of each chemical injection pipe is maintained uniformly, and the upper injection pipe It is characterized in that the arrangement interval is narrower than the arrangement interval of the injection pipe on the lower side at a predetermined rate.

For example, by making the arrangement interval of the injection tubes on the upper side narrower than the arrangement interval of the injection tubes on the lower side, even if the solution injected from the top flows and is added to the injection amount of the lower part, the amount of chemicals applied can be uniformed through the entire circuit board. can

As a result of various experiments, when the chemical injection tubes on the upper side are sequentially formed narrower at a rate of 2.5% than the interval of the lower side, the resist is developed uniformly as a whole during the resist processing process. analyzed.

5 illustrates an arrangement structure of chemical injection tubes in a process of resist processing by a transfer device according to an embodiment of the present invention.

Referring to FIG. 5, the chemical injection pipe is characterized in that it is arranged to be formed narrower at a rate of 2.5% than the interval of the immediately lower chemical injection pipe (d1>d2> d3>d4> d5>d6>d7).

For example, in the resist processing process according to an embodiment of the present invention, the arrangement structure of the chemical injection tubes for uniformly developing the resist as a whole is a first heat chemical injection pipe 411 and a second heat chemical injection pipe from the bottom When the distance (d1) of 412 is 100 mm, the distance (d2) between the second row chemical injection pipe 412 and the third row chemical injection pipe 413 is 97.5 mm, and the third row chemical injection pipe 413 ) and the fourth row chemical injection pipe 414 (d3) is 95.0mm, the fourth row chemical injection pipe 414 and the fifth row chemical injection pipe 415 (d4) is 92.5mm, The distance (d5) between the thermal chemical injection pipe 415 and the sixth row chemical injection pipe 416 is 90.0 mm, and the distance (d6) between the sixth row chemical injection pipe 416 and the seventh row chemical injection pipe 417 is 87.5mm, and the distance d7 between the 7th row chemical injection pipe 417 and the 8th row chemical injection pipe 4187 is 85.05mm.

In another embodiment, as a method of arranging the chemical injection tubes so that the resist is uniformly developed as a whole, the chemical injection tubes of each two rows are arranged at equal intervals, and the interval is 5% higher than the interval of the chemical injection tubes on the immediately lower side. It can be narrowly arranged with the difference of .

For example, in the resist processing process according to an embodiment of the present invention, in the arrangement structure of the chemical injection tubes, the distance d1 between the first row chemical injection pipe 411 and the second row chemical injection pipe 412 from the bottom is 100mm, the distance (d2) between the second row chemical injection pipe 412 and the third row chemical injection pipe 413 and the distance (d3) between the third row chemical injection pipe 413 and the fourth row chemical injection pipe 414 ) is 95 mm, the distance d4 between the fourth row chemical injection pipe 414 and the fifth row chemical injection pipe 415 and the distance between the fifth row chemical injection pipe 415 and the sixth row chemical injection pipe 416 The distance d5 is 90 mm, the distance d6 between the 6th row chemical injection pipe 416 and the 7th row chemical injection pipe 417 and the 7th row chemical injection pipe 417 and the 8th row chemical injection pipe 4187 ) is characterized in that the interval d7 is disposed at 85.0 mm.

In this way, in the resist processing process according to an embodiment of the present invention, by making the arrangement structure of the spray tubes on the upper side narrower than the arrangement interval of the spray tubes on the lower side, the solution sprayed from the top flows, Even if it is added up with the lower injection amount, it can have the effect of uniformly applying the chemical through the entire circuit board.

10: circuit board
100: jig unit
110: jig frame
151 to 154, 164 to 164: clamp
160: base plate
170: guide bar
200: transfer roller unit
201-1, … 201-n: rotating roller unit
221, 222: circular ring
251: Guide wing protrusion
280: driven wheel
290: axis of rotation
380: guide rail
411-418: Chemical injection pipe
411 to 418: Chemical injection nozzles

Claims (10)

In the circuit board conveying device,
The circuit board transport device,
A jig unit for mounting the circuit board and a transfer roller unit for transferring the jig unit at a lower portion of the jig unit,
The jig unit,
a rectangular vertical jig frame;
a plurality of upper side clamps mounted on the upper side frame of the vertical jig frame to elastically hold and fix the upper end of the circuit board;
a plurality of lower side clamps mounted on the lower side frame of the vertical jig frame to elastically hold and fix the lower end of the circuit board; and
And a base plate supporting the lower side of the vertical jig frame,
The conveying roller device unit,
It is installed on the lower surface of the base plate of the jig unit, guide protrusions for guiding both end surfaces of the base plate are formed to protrude from both ends, and a plurality of seating grooves are formed around the cylindrical surface of the body, and the seating Mounted in the groove, a plurality of rotating roller units in which a plurality of circular rings are installed;
a rotational shaft that is connected to the rotational center of the rotational roller unit and rotates the rotational roller unit; and
a driving wheel for rotating the rotating shaft; A circuit board transfer device comprising a. According to claim 1,
The circuit board transport device, characterized in that the circular ring is made of rubber or synthetic rubber material having elasticity. According to claim 1,
The guide protrusion is formed to protrude 2 mm or more from both ends of the cylindrical surface of the body of the rotating roller unit. According to claim 1,
Further comprising an upper guide rail having a seating groove formed in the upper space of the jig unit,
The jig unit further comprises a guide bar extending upward from the upper side frame and inserted into the seating groove.
In the circuit board manufacturing apparatus including the circuit board transport apparatus according to any one of claims 1 to 4,
The circuit board manufacturing apparatus,
Chemical injection pipes for spraying chemicals for resist processing are arranged in a plurality of rows along the vertical surface from the bottom to the top on the front and rear of the jig unit,
The circuit board manufacturing apparatus, characterized in that the distance between the upper side of the chemical injection pipe is sequentially formed narrower than the distance between the lower side of the chemical injection pipe. According to claim 5,
The circuit board manufacturing apparatus, characterized in that the interval of the upper side of the chemical injection pipe is arranged to be formed narrower at a rate of 2.5% sequentially than the interval of the lower side of the chemical injection pipe. According to claim 5,
The arrangement structure of the drug injection pipe,
A circuit board manufacturing apparatus characterized in that the two rows of chemical injection pipes are arranged at equal intervals and the upper side spacing is narrower than the interval of the immediately preceding lower side chemical injection pipes with a difference of 5%. According to claim 5,
The arrangement structure of the drug injection pipe,
The distance (d1) between the first row chemical injection pipe 411 and the second row chemical injection pipe 412 from the bottom is 100 mm, and the distance between the second row chemical injection pipe 412 and the third row chemical injection pipe 413 (d2) and the distance (d3) between the third row chemical injection pipe 413 and the fourth row chemical injection pipe 414 is 95 mm, the fourth row chemical injection pipe 414 and the fifth row chemical injection pipe 415 ) and the distance d5 between the 5th row chemical injection pipe 415 and the 6th row chemical injection pipe 416 is 90 mm, and the 6th row chemical injection pipe 416 and the 7th row chemical injection pipe The circuit board manufacturing apparatus, characterized in that the distance (d6) of (417) and the distance (d7) between the 7th row chemical injection pipe 417 and the 8th row chemical injection pipe 418 are arranged at 85.0 mm. According to claim 5
At least one of a pressure sensor and a flow sensor is installed in each chemical injection pipe to transmit a sensing signal to the control unit in real time.
The control unit judges the sensing signal and when it is determined that the set pressure value or flow rate value exceeds the range of 5%, controls the number of rotations of the medicine pump for supplying the medicine to the medicine injection pipe to reach 95% to 95% of the set value. Circuit board manufacturing apparatus characterized in that to always maintain a constant pressure and injection amount in the 105% range. According to claim 9
Circuit board manufacturing apparatus, characterized in that the setting value of the injection pressure of the chemical injection pipe is set to any one value in the range of 1.2 ~ 2.2 Kgf / cm 2.

Images