KR20230074594A - Tumbling protector for cathodes, and method for compensating for tumbling of cathodes - Google Patents

Abstract

A tumbling protector and method are provided for compensating for tumbling of a cathode as it rotates about an axis of rotation. The tumbling protector may include a protector centering element, which is configured to be mounted spaced apart from the cathode to provide a distance A between the protector centering element and the cathode.

Description

Tumbling protector for cathodes, and method for compensating for tumbling of cathodes

[0001] Embodiments described herein relate to rotatable sputter cathodes, eg, cylindrical sputter cathodes that rotate during sputtering. Embodiments described herein also relate to a tumbling protector for compensating for tumbling of a cathode as it rotates about an axis of rotation. In particular, embodiments of the present disclosure relate to a protector centering element configured to be mounted remotely from a cathode.

[0002] Several methods are known for depositing materials on a substrate. For example, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, or a plasma enhanced chemical vapor deposition (PECVD) process or the like. The process is performed in a process apparatus or process chamber where the substrate to be coated is located. An evaporation material is provided to the device. A plurality of materials, and also oxides, nitrides or carbides thereof, may be used for deposition on a substrate.

[0003] In the case of the PVD process, the deposition material may exist in a solid phase as a target. By striking the target with energetic particles, atoms of the target material, ie the material to be deposited, are ejected from the target. Atoms of the target material are deposited on the substrate to be coated. In a PVD process, the sputter material, ie the material to be deposited on the substrate, can be arranged in different ways. For example, a rotatable target may be used, wherein the target is connected to a rotating shaft, for example a rotating cathode.

[0004] A rotating shaft or rotating cathode and/or target may have specific geometries, dimensions and designs. In particular, cathodes are generally long and have a length of about 2 meters or more. The cathode is further rotated by driving the end of the cathode, for example its driven end, using the cathode drive unit. For example, the other end, ie the end opposite the driven end of the cathode, may be free, eg not supported, held or secured by mechanical fastening elements. This is due to any contact, for example mechanical contact with the free end of the cathode, for example, in the form of intersecting particles, due to the frictional forces acting between them, which can contaminate the material sputtering process, This is because attrition and/or abrasion occurs. Particles can negatively affect the material deposition process. Contact with the free end of the cathode should be avoided or at least reduced.

[0005] However, another problem that arises is due to the length of the cathode. Since the free end of the cathode is not supported during rotation, the cathode may or may undergo a tumbling motion, for example tilting away from the axis of rotation. This tumbling motion of the cathode results in an uneven, non-uniform, and/or irregular deposition process, resulting in different thicknesses on the substrate. Also, this can result in contact with the anode where particles are created that can negatively affect the material deposition process. Thus, the tumbling motion of the cathode can also negatively affect the sputtering process.

[0006] Accordingly, it would be advantageous to provide an apparatus and method for reducing and/or canceling the tumbling motion of the cathode during rotation.

[0007] In view of the above, a method for compensating tumbling or tumbling motion of a cathode while rotating about a rotational axis, a tumbling protector, and a material deposition apparatus are provided. Further aspects, advantages and features are apparent from the dependent claims, detailed description and accompanying drawings.

[0008] According to one embodiment, a tumbling protector is provided for compensating for tumbling of a cathode rotating about a rotational axis. The tumbling protector includes a protector centering element configured to be mounted spaced apart from the cathode. The protector centering element may be mounted to provide a distance between the protector centering element and the cathode.

[0009] According to one embodiment, a method for compensating for tumbling of a cathode rotating about an axis of rotation is provided. The method includes rotating the cathode about an axis of rotation. The method further includes centering the cathode on the axis of rotation with a protector centering element spaced apart from the cathode for at least a first period of time.

[0010] According to one embodiment, a deposition apparatus is provided. The deposition apparatus includes at least one cathode, the at least one cathode having a first end that is a free end of the cathode and a second end opposite the first end, the second end being the driven end of the cathode. The deposition apparatus further includes at least one cathode drive unit for rotating the at least one cathode about the axis of rotation and a tumbling protector for compensating for tumbling of the at least one cathode during rotation about the axis of rotation.

[0011] In such a manner that the above-listed features of the present disclosure may be understood in detail, a more detailed description of the present disclosure briefly summarized above may be made with reference to the embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below:
1 shows a schematic diagram of a deposition apparatus according to embodiments described herein having at least one cathode, a cathode drive unit and a tumbling protector according to embodiments described herein.
2A shows a schematic diagram of a portion of a rotatable cathode including a tumbling protector in a non-tilted position according to embodiments of the present disclosure.
2B shows a schematic diagram of a portion of a rotatable cathode including a tumbling protector in a tilted position according to embodiments of the present disclosure.
3 shows a schematic diagram of a portion of a rotatable cathode that includes another tumbling protector according to embodiments of the present disclosure.
4 shows a flow diagram of a method according to embodiments described herein.
5 shows a flow diagram of a method according to embodiments described herein.

[0012] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. In general, only differences for individual embodiments are described. Each example is provided by way of explanation of the present disclosure and is not meant to be limiting of the present disclosure. Also, features illustrated or described as part of one embodiment may be used on or in conjunction with other embodiments to yield a still further embodiment. This description is intended to cover such modifications and variations.

[0013] The drawings are schematic drawings that are not drawn to scale. Some elements in the drawings may have exaggerated dimensions for clarity of presentation and/or for the purpose of highlighting aspects of the disclosure.

[0014] Embodiments described herein relate to material deposition using a cathode and/or target. For example, the cathode and/or target are driven at one end of the cathode to cause rotational movement about a rotational axis. The end located opposite the driven end may be free, eg not supported by mechanical fixing elements. Due to the length of the cathode, such as, for example, 2 meters or more, or even 3 meters or more, the cathode may or may undergo a tumbling motion, eg, tilting/swinging/pivoting away from the axis of rotation. can This tumbling motion of the cathode results in an uneven, non-uniform, and/or irregular deposition process, resulting in different thicknesses on the substrate. Also, this can lead to contact with the anode, in particular where particles are created that can negatively affect the material deposition process.

[0015] As noted above, contact, eg, mechanical contact, with the free end of the cathode, for example, causes friction, abrasion, and/or abrasion, resulting in unwanted particles contaminating the material deposition process. Additionally, tumbling that occurs due to a combination of both the rotational speed of the cathode and the length of the cathode may result in a material deposition process that is non-uniform, uneven, and/or irregular. This can result in different thicknesses of the deposited material.

[0016] Accordingly, it would be advantageous to provide systems, apparatuses and methods that provide protection against such tumbling, in particular tumbling protection to compensate for tumbling of a cathode rotating about an axis of rotation. It is also advantageous if the tumbling protection is provided in a non-contact manner, for example to avoid unnecessary rubbing, abrasion and/or abrasion contaminating the sputtering process. Additionally or alternatively, the tumbling protector may be provided in an encapsulated manner, for example by a labyrinth seal, if roller guides or sliding guides are provided for tumbling protection. can be provided.

[0017] A deposition apparatus 100 according to embodiments described herein may be configured for vacuum deposition and is exemplarily shown in FIG. 1 . The deposition apparatus 100 may include a processing chamber, eg, a vacuum chamber 116, or a housing, particularly a chamber configured to have a vacuum within the chamber. The chamber may be a vacuum chamber. At least one cathode 104 as described herein, or at least a component or portion of a cathode, may be arranged in a processing chamber, eg, vacuum chamber 116 .

[0018] 1 shows a cross-section of a deposition apparatus 100 according to embodiments described herein. A cross-sectional view of the deposition apparatus 100 is shown in a direction parallel to the axis of rotation 101 of the cathode 104 .

[0019] The deposition apparatus 100 according to the embodiments described herein may be a sputtering deposition apparatus. At least one cathode 104 is provided. At least one cathode 104 may be configured to receive a target. Cathode 104 may also be referred to as a cathode assembly to describe the target.

[0020] Throughout this disclosure, it should be understood that when "cathode" is referred to, reference is also provided to the cathode assembly, ie the cathode assembly comprising the target. As such, the terms "cathode" and "cathode assembly comprising a target" may be used interchangeably. The cathode and/or target may be rotatable about the axis of rotation 101 . Cathode 104 may have a curved, eg, substantially cylindrical surface. The cathode assembly may include a magnet assembly (not shown) that may be arranged within the cathode.

[0021] According to some embodiments, the cathode may be a cantilevered cathode. The cathode may have a free or unsupported end, eg a first end, and a driven end, eg a second end. The cathode drive unit 103 may be configured to supply power to the cathode 104 and rotate the cathode 104 about the axis of rotation 101 . If more than one cathode is used, a corresponding number of cathode drive units 103 may be used to independently drive each cathode 104 . The cathode drive unit may include or be coupled to a power supply for supplying power to the cathode 104 . Additionally or alternatively, the cathode drive unit 103 may be configured to supply water or coolant to the cathode and/or coolant receiving enclosure. Cathode drive unit 103 may include or be connected to a water or coolant supply for supplying water or coolant to the cathode. As described above, the cathode drive unit 103 is configured to rotate or drive the cathode and/or target at the second end 106 of the cathode 104 about the axis of rotation 101 . The cathode drive unit 103 as described herein may be referred to as an end block or cathode drive block that engages the driven end 106 of the cathode 104 .

[0022] As indicated by arrow 11 in Figure 1, material from the target is sputtered towards the substrate. A substrate may be supported by a carrier 120 . Carrier 120 may be moved into and out of vacuum chamber 130 by transport system 140 . For example, transport system 140 may be a roller base transport system, where a carrier is supported by rollers in vacuum chamber 116 . As shown in FIG. 1 , transport system 140 is magnetic levitation having, for example, a drive unit 119 and a levitation unit 118 for moving a carrier 120 through a vacuum chamber. can be a system. As shown in FIG. 1 , the transport system 140 may be arranged to be above the carrier and the drive unit may be arranged to be below the carrier. However, depending on the magnetic levitation system and further arrangements of the system, the levitation unit 118 may be above, below, or to the side of the carrier. Additionally or alternatively, the drive unit 119 may be above, below or on the side of the carrier.

[0023] The deposition apparatus 100 of FIG. 1 is depicted as a deposition apparatus for depositing on vertically oriented substrates. The term "vertically oriented" may include substrates arranged at slight deviations from exact verticality, for example an angle of up to 10° or even 15° between the substrate and the exact vertical orientation. can exist A deposition apparatus according to embodiments described herein may be configured to deposit on large area substrates. According to some embodiments, which can be combined with other embodiments described herein, the deposition apparatus can be configured to process vertically oriented substrates. Alternatively, the deposition apparatus may be configured to process horizontally oriented substrates.

[0024] The term “substrate” as used herein refers in particular to substantially non-flexible substrates, for example wafers, slices of transparent crystal such as sapphire, or glass plates ( plate) will be included. In particular, the substrates may be glass substrates and/or transparent substrates. The present disclosure is not limited thereto, and the term “substrate” may also include flexible substrates such as a web or foil. The term "substantially non-flexible" is understood to be distinct from "flexible". Specifically, a substantially non-flexible substrate, for example a glass plate having a thickness of 0.5 mm or less, may have some degree of flexibility, where the flexibility of the substantially non-flexible substrate is relative to flexible substrates. small compared to

[0025] In the example of FIG. 1 , deposition apparatus 100 shows one cathode 104 . However, a deposition apparatus according to embodiments described herein may include one or more cathodes 104, particularly a plurality of cathodes suitable for use as a cathode in a coating process such as a sputter deposition process. As can be seen in FIG. 1 , the cathode 104 is provided in a cantilever arrangement, i.e. it extends vertically and is supported at one end, for example, the driven end 106 of the cathode 104, while thus The end opposite to the , i.e. the free end 102 of the cathode 104 is unsupported. When a plurality of cathodes are used, each cathode may be arranged in a cantilever arrangement.

[0026] A material deposition apparatus according to embodiments described herein may also include one or more anodes 108 . One or more anodes 108 may be arranged next to one or more cathodes, in particular parallel to the cathodes with respect to the axis of rotation 101 . For example, one or more cathodes 104 can be arranged with a plurality of anodes 108 such that one cathode 104 is arranged between, eg adjacent to, two anodes 108. do. The anode 108 shown in FIG. 1 is shown “in front” or spatially in front of the cathode for illustrative purposes. However, another anode 108 may be arranged spatially behind the cathode 104 (not shown). A cathode 104 arranged between two anodes 108 as described above is shown in more detail in the embodiments of FIGS. 2A and 2B .

[0027] A deposition apparatus for large area substrates may include a plurality of cathodes 104 and a plurality of anodes 108 . For example, more than 4, for example more than 6 or even more than 10 cathodes and/or anodes may be provided.

[0028] The material deposition apparatus 100 of FIG. 1 includes a cathode driving unit 103 . The cathode drive unit 103 is configured to rotate the cathode 104 about the axis of rotation 101 at the second end of the cathode 104 . The second end 106 may be referred to as the driven end 106 of the cathode 104 .

[0029] The material deposition apparatus may further include shields 112 and 114 for confining or defining a material sputtering area. The material sputtering region may be considered the area of space between the first shield 112 and the second shield 114 or the first shield portion and the second shield portion, respectively. For example, the shields prevent material 11 from a target being sputtered onto a substrate from contaminating chamber components, for example the floating unit 118 and drive unit 119 of the transport system 140. will prevent The dimensions of the shields and material sputtering area may vary depending on the type of material deposition apparatus and the number of cathodes used.

[0030] The material deposition apparatus 100 shown in FIG. 1 may further include a tumbling protector 110 configured to be mounted spaced apart from the cathode 104 . As shown, the tumbling protector 110 is mounted such that a gap, gap or distance is provided between the tumbling protector 110 and the cathode 104 . As shown, the spacing may be provided in the longitudinal direction of the cathode (eg, the rotational shaft 101). In this case, the tumbling protector 110 may be considered spatially arranged “above” or “in front of” the cathode 104 . As discussed further below, spacing may also be provided in the radial direction of the cathode (eg, substantially perpendicular to the axis of rotation 101 ). Spacing may also be provided by a combination of radial and longitudinal directions.

[0031] As used herein, the terms “over” or “in front” can be understood in that the tumbling protector 110 is arranged spaced apart from the cathode 104 in the direction of the axis of rotation 101 . For example, the cathode 104 of the material deposition apparatus 100 shown in FIG. 1 is depicted as the material deposition apparatus 100 with the cathode 104 arranged parallel to the cross section of the material deposition apparatus 100 . However, for a material deposition apparatus 100 having a cathode 104 arranged substantially perpendicular to the cross-section of the material deposition apparatus 100, the expression “over” or “in front of” the cathode 104 does not refer to the cathode 104. ) can be replaced with "next to" or "adjacent to" spatially. Regardless of whether a vertically or horizontally arranged cathode 104 is used, the tumbling protector 110 will ensure that the distance, gap, or spacing between the cathode 104 and the tumbling protector 110, i.e., in the longitudinal direction of the cathode and / or provided in the radial direction of the cathode, for example arranged so that the cathode and the tumbling protector 110 do not contact or touch each other.

[0032] FIG. 2A shows an enlarged portion of the free end 102 of the cathode 104 illustrated in FIG. 1 with an exemplary tumbling protector 210 in accordance with some embodiments. In FIG. 2A, only a portion of the cathode 104 of FIG. 1 is shown. A tumbling protector 210 is arranged spaced apart from the free end 102 of the cathode 104 . As shown in FIG. 2A , a gap, interval or distance A is provided. In this non-limiting example, the spacing or distance A is provided in the longitudinal direction of the cathode. In FIG. 2A , the tumbling protector 210 may be considered to be arranged “over” the cathode.

[0033] The tumbling protector 210 includes a protector centering element 214 . As used throughout this disclosure, the term “protector centering element” can be understood as any device, element, unit or device capable of providing centering for the cathode 104 on the axis of rotation 101. there is. Centering may also be provided during rotation of the cathode 104 .

[0034] The term “centering” or “centered” as used throughout this disclosure with respect to the cathode 104 can be understood to hold the cathode 104 close to its axis of rotation, particularly during rotation. For example, centering the cathode 104 on an axis of rotation may include rotation of the cathode within small, eg, spatial and/or angular deviations therefrom. For example, an acceptable deviation from the axis of rotation 101 of the cathode may be an angular deviation of up to eg 0.05° or 0.1°. For example, at a cathode length of 3000 mm, the radial deviation at the top of the cathode would be 3000 mm * 0.05° = 2.6 mm radial deviation from the axis of rotation 101 . This deviation may be referred to as a tumbling, tumbling motion, wobbling motion or at least an asymmetrical rotation of the cathode 104 , for example an elliptical rotation with respect to the axis of rotation 101 . For example, a cathode 104 that is “centered” on a rotational axis is one in which no tumbling motion occurs, i.e., a cathode that remains on a rotational axis or at least a tumbling motion of the cathode 104 is acceptable, for example, a rotational axis 101. It should be understood that the cathode 104 is within a spatial and/or angular range/deviation from

[0035] As shown in the example of FIG. 2A , the tumbling protector 210 further includes a cathode centering element 204 . The cathode centering element 204 is configured to be mounted to the first end 102 of the cathode 104, where the first end 102 of the cathode 104 is the free end 102 of the cathode. The first end 102 is opposite the second end 106 of the cathode 104 shown in FIG. 1 . The second end 106 is the driven end of the cathode 104.

[0036] As used throughout this disclosure, the term "cathode centering element" can be understood as any apparatus, element, unit or device capable of providing centering of the cathode 104 on the axis of rotation 101 during rotation. .

[0037] For example, the cathode centering element 204 is a protector during rotation of the cathode 104 to counteract, reduce, and/or dampen the tumbling motion of the cathode so that rotation of the cathode is centered and/or maintained on the axis of rotation 101. It may be configured to interact with, cooperate with, and/or engage with the centering element 214 . As can be seen in the example of FIG. 2A , the protector centering element 214 and the cathode centering element 204 are arranged spaced apart from each other, for example separated by a distance A. In this non-limiting example, the protector centering element 214 is spaced apart from the cathode centering element 204 in the longitudinal direction of the cathode. The protector centering element 214 may also be arranged spaced apart from the cathode centering element 204 in a radial direction of the cathode (eg, substantially perpendicular to the axis of rotation) or a combination of longitudinal and radial directions as noted above. there is.

[0038] The interaction between the protector centering element and the cathode centering element can include any interaction that can center the cathode 104 during rotation. For example, interaction may be provided through forces such as magnetic forces and/or mechanical forces. The force can be applied either permanently or temporarily, as described further below.

[0039] As shown in the example of FIG. 2A , the cathode centering element 204 may include a first magnet assembly 206 having magnet poles 206A and 206B. The first magnet assembly provides a first magnetic field B1. The protector centering element 214 may include a second magnet assembly 216 having poles 216A and 216B. The second magnet assembly provides a second magnetic field B2.

[0040] As shown in the example of FIG. 2A , the cathode centering element 204 including the first magnet assembly 206 is spaced apart from the protector centering element 214 including the second magnet assembly 216 so that the cathode centering element Provides a distance A between 204 and the protector centering element 214. The distance A between the magnetic assemblies generally depends on the number of magnets used and the strength of the magnetic field provided. As can be seen, the distance A is provided in the direction of the axis of rotation 101, for example in the longitudinal direction of the cathode, so that the protector centering element 214 is arranged “above” the cathode centering element 104, For example, they share the same axis of rotation 101. The distance A may also be provided in a direction substantially perpendicular to the axis of rotation 101 , for example in the radial direction of the cathode 104 , so that the protector centering element is the cathode centering element 204 , for example Radially encircle, surround, enclose, and/or overwrap. In such cases, the protector centering element 214 has a substantially “U” shaped cross-section that radially surrounds, surrounds, wraps, and/or encloses the cathode centering element 204 to provide spacing A. Alternatively, it may be formed to have a profile. For example, a “U” shaped protector centering element 214 is provided on opposite sides thereof such that the cathode centering element 204 is located between, for example, two magnets of the protector centering element 214. For example, it may contain two magnets. For example, the magnets of the "U-shaped" protector centering element may radially, eg concentrically, surround the cathode centering element. Alternatively the magnets of the protector centering element may be ring-shaped, for example to enclose the cathode centering element radially, for example concentrically. For example, a first distance A1 may be provided between the first magnet of the protector centering element and the cathode centering element in the radial direction of the cathode, and for example, the second magnet of the protector centering element and the cathode in the radial direction of the cathode. A second spacing A2 (eg opposite to the first spacing A1) may be provided between the centering elements.

[0041] For example, the distance A between the first and second magnet assemblies can be less than 20 mm, preferably less than 10 mm, and the magnetic field B1 provided by the first magnet assembly 206 is at least 0.2 T, and/or the magnetic field B2 provided by the second magnet assembly 216, to provide sufficient centering of the cathode 104 on the axis of rotation 101 and/or tumbling of the cathode 104. It may be at least 0.2 T to reduce motion.

[0042] 2A also shows an exemplary mounting of a tumbling protector 210 to provide a gap, spacing, and/or distance A. In particular, the protector centering element 214 is provided between two exemplary anodes 108 to provide a distance A over the free end 102 of the cathode 104, for example in the longitudinal direction of the cathode 104. may be mounted on, attached to, or installed on. It should be understood that this mounting of the protector centering element 214 is merely an example. In particular, different mountings may be selected so long as they can at least provide for a gap, spacing, and/or distance A between the protector centering element 214 and the cathode centering element 204 . As noted above, mounting may also be provided such that the gap, spacing, and/or distance A is provided in the radial direction of the cathode or a combination of longitudinal and radial directions. As can be seen in FIG. 2A , the cathode centering element 204 can be mounted to the free end 102 of the cathode 104 . The centering element 204 is eg at the same rotational speed, eg above 2 revolutions per minute (rpm) and/or below 30 rpm, in particular above 5 revolutions per minute (rpm) and/or below 20 rpm. It rotates with the cathode 104.

[0043] The distance A between the protector centering element 214 and the cathode centering element 204 is such that the cathode 104 and/or cathode centering element 204 rotate while the protector element is stationary, eg non-rotating. and/or remain non-moving.

[0044] The interaction between the first magnetic field B1 and the second magnetic field B2 may provide centering of the cathode 104 on the axis of rotation 101 through attraction. Since the protector centering element 214 is spaced a distance A from the cathode centering element 204, eg mechanical contact between these elements is prevented, preventing friction, abrasion, and/or wear. Since the force is applied magnetically, ie contactlessly, no additional (mechanical) contact is provided that could cause abrasion or abrasion, thus negative effects on the deposition process can be avoided. The magnetic force may be provided permanently, constantly, and/or continuously during rotation of the cathode 104, for example. Magnetic force may also be controllably or tunably provided, for example by using electromagnets or electromagnetic permanent magnets to set, adjust, and/or select a specific or predefined value for the magnetic field. It should be understood that this applies to all elements capable of providing a magnetic field. The magnetic field B of each of the magnets and/or magnetic assemblies may be adapted, changed, tuned, set, updated and/or otherwise customized. Using adjustable magnets can be useful, for example, in situations where heat causes expansion of the target, for example in a spatial direction, so that the gap, spacing, and/or distance A becomes smaller or It gets shorter. In such cases, the magnetic field may be readjusted, changed or corrected to account for the change in length, for example. The magnetic force causes a more stable rotational movement of the cathode 104. The tumbling motion is counteracted, reduced, minimized, avoided, or at least attenuated.

[0045] The tumbling protector 210 shown in FIG. 2A may further include at least one shield 220 . The at least one shield may have a curved, eg substantially cylindrical cross section or surface that surrounds/surrounds one or more of the protector centering element 214 and at least a portion of the cathode centering element 204 . The at least one shield allows to reduce material deposition on the tumbling protector. Additionally or alternatively, the shield may be configured to shield the magnetic fields of the tumbling protector, for example magnetic fields B1 and B2. Thus, the influence of the magnetic fields of the tumbling protector on the sputtering process, eg a magnetron sputtering process, can be reduced or avoided.

[0046] 2A shows the tumbling protector 210 in an untilted position at distance A above the cathode. In particular, the protector centering element 214 according to embodiments described herein is configured to be removably or tiltably mounted relative to the axis of rotation 101, the cathode 104 and/or the cathode centering element 204. . Removable or tiltable mounting of the protector centering element 214 to the cathode 104 and/or the cathode centering element 204 may include the cathode 104, the cathode centering element 204 and/or the protector centering element 214 ) may be individually and/or independently of one another replaced. This also allows to provide additional space/area for maintenance, for example to replace the cathode or target after material use.

[0047] As used throughout this disclosure, the terms “movable,” “movable,” “tiltable,” or “tilted” refer to, for example, that the protector centering element 214 spatially rotates around an axis ( 101) can be understood as a movement of at least the protector centering element 214 spatially away from the axis of rotation 101, the cathode 104 and/or the cathode centering element 204, so as to be moved out of or away from the axis of rotation. Tilting is in a direction perpendicular to the axis of rotation, for example radially away from the cathode 104, in a direction parallel to the axis of rotation, for example by shifting space and/or combinations thereof from the protector centering element ( 214) may be included. In particular, any movement of at least the protector centering element 214 away from the axis of rotation 101 may be considered a “tiltable” mounting or a “movable mounting”.

[0048] The example of FIG. 2B shows the tumbling protector 210 of FIG. 2A in a tilted position. In particular, the protector centering element 214 is illustrated as tilted, tipped, tilted or moved away from the axis of rotation 101 in a direction D, such as clockwise for example. This tilting movement of the protector centering element 214 causes the cathode 104, the cathode centering element 204, the magnet assembly 206 and, for maintenance, at least one shield 220, the second magnet assembly 216 and Provides access to the protector centering element 214. This allows access to replace one or more of these elements individually and/or independently of each other.

[0049] FIG. 3 shows an enlarged portion of the free end 102 of the cathode 104 of FIG. 1 , with an exemplary tumbling protector 310 in accordance with some embodiments. The tumbling protector is arranged spaced a gap, gap or distance A from the free end 102 of the cathode 104 . The tumbling protector 310 includes a protector centering element 214 .

[0050] As shown in the example of FIG. 3 , the tumbling protector 210 further includes a cathode centering element 204 . The cathode centering element 204 is configured to be mounted to the first end 102 of the cathode 104, the first end 102 of the cathode 104 being the free end of the cathode. The first end 102 is opposite the second end 106 of the cathode 104 as depicted in FIG. 1 .

[0051] As shown in the example of FIG. 3 , cathode centering element 204 and protector centering element 214 define a pin and bushing combination. The pin 205 can have a first diameter D1, the bushing can include an aperture 215, and the aperture 215 has a second diameter D2. A pin and bushing combination is depicted in FIG. 3 where the pin 205 is located or mounted to the cathode centering element 204 while the bushing and/or opening 215 of the bushing is to the protector centering element 214. Depicted as being located or mounted. However, the locations of the pins and bushings may also be switched, in that the protector centering element 214 may include a pin and the cathode centering element 204 may include a bushing.

[0052] The first diameter (D1) of the pin 205 is the second diameter ( ( D2) may be smaller. As can be seen in the example of FIG. 3, the bushing is spatially mounted over the pin to provide a gap, spacing or distance A. Thus, the mounting can be considered to be non-contact. The opening 215 of the bushing at least partially surrounds or encloses the pin 205 eg concentrically, where another gap, spacing or distance B is provided. This distance B is referred to as the revolving gap provided concentrically between the pin and bushing combination, in particular between the pin 205 and the opening 215 of the bushing. As can be seen in the example of FIG. 3 , the gap, spacing or distance B of the revolving gap is provided substantially perpendicular to the distance or spacing A between the protector centering element 214 and the cathode centering element 204 do. In particular, distance B may be provided radially from cathode 104 .

[0053] The term "revolving gap" as used throughout this disclosure is the gap, distance, spacing, or gap between the openings of a pin and bushing such that the pin and bushing are spaced apart from each other, eg, do not contact or touch each other. It can be understood as clearance (B).

[0054] In FIG. 3 , the revolving gap is provided concentrically, since both the openings of the pin and bushing may have a curved, eg substantially cylindrical, cross-section or surface. However, other shapes, dimensions and/or cross-sections are possible. For example, the opening 215 of the bushing need not have a cylindrical cross section, eg its inner wall 217 may not be continuous. Rather, the inner wall 217 of the opening 215 of the bushing may be interrupted, for example having one or more gaps provided therein. The number of gaps and their lengths or dimensions depend on the opening 215 being used. The gap in the inner wall 217 of the bushing may also be used to arrange or position the tumbling protector away from the cathode, for example by shifting, pivoting or tilting the protector element radially away from the cathode.

[0055] The distance B of the revolving gap allows the bushing and pin combination to remain in a non-contact state as the cathode 104 rotates about the axis of rotation 101 . That is, the pin and bushing do not touch each other, ie the pin and bushing avoid mechanical contact. When the tumbling or tumbling motion of the cathode 104 occurs, the spacing or distance B provided by the revolving gap B decreases as the cathode 104 or pin 205 approaches the bushing. Upon mechanical contact, e.g. touch, the bushing engages with a pin to center the cathode on the axis of rotation 101, i.e. when the tumbling motion of the cathode 104 exceeds the distance B defined by the revolving gap. will interact or interlock. When the distance B is exceeded, i.e. when the pin touches the bushing, a mechanical force is provided that opposes the tumbling motion of the cathode 104 and counteracts it. The tumbling motion is limited as well as reduced. In particular, the cathode 104 is prevented or restricted from moving further away from the axis of rotation 101 . Accordingly, the distance B of the revolving gap defines the distance, eg, the maximum distance at which a tumbling motion of the cathode 104 is allowed to occur and a non-contact interaction between the pin and the bushing is maintained. Upon exceeding the distance B, the mechanical interaction is such that the cathode 104 is centered on the axis of rotation 101 and the tumbling motion of the cathode 104 is reduced, canceled, minimized, avoided, and/or weakened. is initiated

[0056] The distance B defined by the revolving gap may preferably be less than 9 mm, preferably less than 5 mm or even less than 3 mm. The spacing or distance A between the pin and bushing of the pin and bushing combination is preferably less than 20 mm, preferably less than 10 mm. However, other values for the distances A and B may be selected, for example depending on the cross-section, dimension, shape, and/or shape of the pin and bushing combination or depending on the length of the cathode. The distances A and B may also be chosen depending on the used magnetic field values B, eg adjustable or controllable, and vice versa. In particular, the pins and bushings or their openings may not necessarily have a curved, eg substantially cylindrical, cross-section or surface. Rather, other shapes and forms that achieve the effect of applying a mechanical force that counteracts and/or reduces tumbling of the cathode 104 when the distance of the revolving gap B is exceeded are sufficient.

[0057] As can be seen in the example of FIG. 3 , the tumbling protector may further include one or more bearings 330 and 332 to support the bushing. One or more bearings may be used so that the bushing can be rotated as the cathode 104 rotates, in particular around the axis of rotation 101 at the same (rotational) speed as the cathode centering element 204 .

[0058] Additional wear due to the fact that on contact, i.e. when the distance B of the revolving gap is minimized and the pin engages the bushing, e.g. touching the bushing, the bushing rotates at the same speed as the cathode 104 or attrition may be reduced. The mechanical contact counteracts the tumbling motion of the cathode 104, where the cathode 104 is forced to remain centered on the axis of rotation 101. Mechanical contact, for example when the bushing touches the cathode, can dampen the tumbling motion that causes the cathode 104 to move back towards the axis of rotation 101 . The distance B of the revolving gap will again increase or expand, restoring the non-contact interaction between pin and bushing. Thus, mechanical contact between the pin and the bushing is only established for a short period of time, eg only temporarily or as necessary to counteract the tumbling of the cathode 104 . This may allow to prevent abrasion and/or wear by only applying force for times exceeding a maximum distance B defined by the revolving gap B.

[0059] As further seen in the example of FIG. 3 , the tumbling protector 310 is mounted to the housing or vacuum chamber 116 of the deposition apparatus 100 . The mounting structure 340 allows the protector centering element 214 to be pivoted away from the axis of rotation 101 , for example in a direction perpendicular to it or in a radial direction of the cathode 104 . This allows the protector centering element to be slidably, shiftably or pushably mounted to a housing, for example vacuum chamber 116 . For example, a tumbling protector can be mounted to the shield 112 shown in FIG. 1 . Thus, the protector element is pushed directly over, ie spaced apart from, the cathode centering element and/or the cathode 104 in a direction perpendicular to the axis of rotation 101 , for example in the radial direction of the cathode 104 . ), placed, or inserted. As mentioned above, this fixation allows the protector centering element to be moved away from the cathode centering element and/or cathode so that the cathode, cathode centering element, and/or protector centering element can be replaced individually and/or independently of each other. . Mounting structure 340 may also be pivotable.

[0060] According to embodiments that can be combined with any other embodiments described herein, a method 400 for compensating for tumbling of a cathode rotating about an axis of rotation 101 is provided.

[0061] In operation 402 , the cathode is rotated about rotational axis 101 . In operation 404 , the cathode is centered on the axis of rotation 101 with the protector centering element 214 spaced apart from the cathode 104 for at least a first period of time. In operation 406, a non-contact force is applied between the cathode centering element and the protector centering element mounted to the free end of the cathode to center the cathode. This force may be applied permanently, continuously, and/or constantly during rotation of the cathode 104 .

[0062] At operation 406, the cathode 104 is fixed, centered, or stabilized on an axis of rotation during rotation of the cathode by a non-contact force to counteract and/or reduce the tumbling motion of the cathode, where the force is applied magnetically. all.

[0063] According to embodiments that can be combined with any other embodiments described herein, a method 500 for compensating for tumbling of a cathode rotating about a rotational axis 101 is provided.

[0064] In operation 502 , the cathode is rotated about rotational axis 101 . In operation 504 , the cathode is centered on the axis of rotation 101 with the protector centering element 214 spaced apart from the cathode 104 for at least a first period of time. In operation 506, a contact force between a cathode centering element and a protector centering element mounted to the free end of the cathode is applied to center the cathode. This force may be applied during at least a second period of time during which the protector centering element engages/interacts with the cathode centering element.

[0065] In operation 508, the cathode is fixed, centered, or stabilized on an axis of rotation during rotation of the cathode by a contact force applied during a second period of time to counteract and/or reduce the tumbling motion of the cathode, where the force is applied mechanically.

[0066] While the foregoing relates to embodiments of the present disclosure, other and additional embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, the scope of which is set forth in the following claims. is determined by

Claims (21)

As a tumbling protector for compensating for tumbling of a cathode rotating about an axis of rotation,
Includes a protector centering element,
Wherein the protector centering element is configured to be mounted spaced apart from the cathode to provide a distance between the protector centering element and the cathode.
Tumbling protector. According to claim 1,
a cathode centering element configured to be mounted to a first end of the cathode, the first end being a free end of the cathode;
the first end is opposite the second end of the cathode, and the second end is the driven end of the cathode;
Tumbling protector. According to claim 2,
wherein the protector centering element is configured to interact/engage with the cathode centering element during rotation of the cathode to counteract a tumbling motion of the cathode such that rotation of the cathode is centered on the axis of rotation.
Tumbling protector. According to claim 2 or 3,
the cathode centering element comprises a first magnet assembly having one or more magnets, the first magnet assembly providing a first magnetic field;
the protector centering element comprises a second magnet assembly having one or more magnets, the second magnet assembly providing a second magnetic field;
Tumbling protector. According to any one of claims 1 to 4,
the distance between the first magnet assembly and the second magnet assembly is less than 20 mm, preferably less than 10 mm;
The magnetic field provided by the first magnet assembly is at least 0.2 T, and/or
the magnetic field provided by the second magnet assembly is at least 0.2 T;
Tumbling protector. According to any one of claims 1 to 5,
The protector centering element is configured to maintain a non-rotational state during rotation of the cathode and during rotation of the cathode centering element about the axis of rotation, the protector centering element being configured to maintain the cathode, the cathode centering element, and/or the cathode centering element. configured to be tiltably mounted relative to the cathode centering element so that the protector centering elements can be replaced individually and/or independently of each other;
Tumbling protector. According to any one of claims 1 to 3,
The cathode centering element and the protector centering element are a pin and bushing combination,
wherein the pin has a first diameter and the bushing includes an aperture having a second diameter;
a first diameter of the pin being smaller than a second diameter of an opening in the bushing to enable the bushing to at least partially receive and/or at least concentrically surround/enclose the pin;
Tumbling protector. According to claim 7,
A revolving gap is provided concentrically between the pin and bushing combination, and the pins and bushings of the pin and bushing combination are spaced apart from each other,
Tumbling protector. According to claim 7 or 8,
The revolving gap defines a distance at which the tumbling motion of the cathode is allowed to occur and a non-contact interaction between the pin and the bushing is maintained.
Tumbling protector. According to claim 9,
wherein the bushing is configured to engage the pin to center the cathode to the axis of rotation when a tumbling motion of the cathode exceeds the distance defined by the revolving gap.
Tumbling protector. According to any one of claims 7 to 10,
the distance defined by the revolving gap is less than 7 mm, preferably less than 5 mm, and/or the spacing between the pin and bushing of the pin and bushing combination is less than 20 mm, preferably less than 10 mm;
Tumbling protector. According to any one of claims 7 to 11,
The protector centering element supports the bushing or the pin and allows the bushing or the pin to rotate according to the rotation of the cathode, in particular to rotate about the axis of rotation at the same speed as the cathode centering element. Further comprising the above bearings,
Tumbling protector. As a method for compensating for tumbling of a cathode rotating about an axis of rotation,
rotating the cathode around the axis of rotation; and
centering the cathode on the axis of rotation with a protector centering element spaced apart from the cathode for at least a first period of time.
A method for compensating for tumbling of a cathode rotating about an axis of rotation. According to claim 13,
centering the cathode by applying a non-contact force between a cathode centering element mounted on a free end of the cathode and the protector centering element, wherein the force is permanently applied during rotation of the cathode;
A method for compensating for tumbling of a cathode rotating about an axis of rotation. According to claim 14,
centering the cathode on the axis of rotation during rotation of the cathode by the non-contact force to counteract and/or reduce the tumbling motion of the cathode, wherein the force is applied magnetically.
A method for compensating for tumbling of a cathode rotating about an axis of rotation. According to claim 13,
Centering the cathode by applying a contact force between a cathode centering element mounted on a free end of the cathode and the protector centering element, wherein the force is such that the protector centering element engages/interacts with the cathode centering element applied for at least a second period of time to act,
A method for compensating for tumbling of a cathode rotating about an axis of rotation. According to claim 16,
centering the cathode on the axis of rotation during rotation of the cathode by the contact force applied during the second period of time to counteract and/or reduce a tumbling motion of the cathode, the force being mechanically applied,
A method for compensating for tumbling of a cathode rotating about an axis of rotation. As a deposition device,
at least one cathode, the at least one cathode having a first end that is the free end of the cathode and a second end opposite the first end, the second end being the driven end of the cathode;
a cathode drive unit for rotating the at least one cathode about a rotation axis; and
Comprising a tumbling protector according to any one of claims 1 to 12,
deposition device. According to claim 18,
wherein the at least one cathode is configured to receive a target, the target configured to sputter material toward a substrate;
deposition device. According to claim 18 or 19,
two or more cathodes comprising individual drive units; and
Further comprising a corresponding number of anodes for each cathode,
The cathodes are arranged in a cantilever arrangement,
deposition device. According to claim 20,
The deposition apparatus is a sputtering deposition apparatus,
deposition device.

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