KR20220149895A - display panel and display apparatus - Google Patents

Abstract

The present invention provides a display panel which comprises: a substrate including an opening area, a display area at least partially surrounding the opening area, and an middle area between the opening area and the display area; a light emitting diode disposed on the display area and including a first electrode, a second electrode, and a functional layer between the first electrode and the second electrode; a first dam part located in the middle area; a crack detection layer located between the display area and the first dam part; and a planarization layer disposed on the crack detection layer.

Description

Display panel and display apparatus

Embodiments of the present invention relate to a display panel and a display device including the same.

2. Description of the Related Art In recent years, display devices have diversified their uses. In addition, the thickness of the display device is thin and the weight is light, and the range of its use is widening.

While the area occupied by the display area of the display device is increasing, various functions grafted or linked to the display device are being added. As a method for adding various functions while increasing the area, research on a display device capable of arranging various components in a display area is being conducted.

The present invention can provide a display panel having an opening area in which various types of components can be arranged in the display area, and a display device including the same. However, these problems are exemplary, and the scope of the present invention is not limited thereto.

According to one aspect of the present invention, there is provided a substrate comprising: a substrate including an opening region, a display region surrounding at least a portion of the opening region, and an intermediate region between the opening region and the display region; a light emitting diode disposed on the display area and including a first electrode, a second electrode, and a functional layer between the first electrode and the second electrode; a first dam located in the middle region; a crack sensing layer positioned between the display area and the first dam; and a planarization layer disposed on the crack sensing layer.

In this embodiment, a second dam portion positioned between the first dam portion and the opening region may be further included.

In the present embodiment, a metal layer overlapping at least one of the first dam portion and the second dam portion may be further included.

In this embodiment, the metal layer overlaps at least a portion of an upper surface of the first dam part and a side surface of the first dam part adjacent to the second dam part, and the metal layer includes an upper surface of the second dam part and adjacent to the first dam part. A first side surface of the second dam unit and a second side surface of the second dam unit adjacent to the opening region may at least partially overlap.

In this embodiment, the metal layer may include an opening overlapping at least one of the upper surface of the second dam part, the first side surface of the second dam part, and the second side surface of the second dam part.

In this embodiment, the metal layer may include a first metal layer and a second metal layer, and the first metal layer and the second metal layer may overlap at least partially.

In this embodiment, the planarization layer may cover the second metal layer.

In this embodiment, it may further include an input sensing layer disposed on the light emitting diode, the input sensing layer including a first touch insulating layer, a first conductive layer, a second touch insulating layer and a second conductive layer sequentially stacked. have.

In this embodiment, the first touch insulating layer and the second touch insulating layer extend from the display area to the intermediate area, and the metal layer is disposed on the first touch insulating layer or the second touch insulating layer can be

In this embodiment, the first metal layer may be disposed on the first touch insulating layer, and the second metal layer may be disposed on the second touch insulating layer.

In this embodiment, the planarization layer may have a thickness of 16,000 angstroms (Å) to 150,000 angstroms (Å).

In this embodiment, the planarization layer may be directly disposed on the crack sensing layer.

In this embodiment, the crack sensing layer may at least partially overlap the first dam part.

In this embodiment, the crack sensing layer includes a first crack sensing layer and a second crack sensing layer, wherein the first crack sensing layer is located between the display area and the opening area, and the second crack sensing layer may be positioned between the first crack sensing layer and the opening region.

In this embodiment, the width between the first crack sensing layer and the second crack sensing layer may be 2㎛ or more.

In this embodiment, the first crack sensing layer and the second crack sensing layer may be provided integrally.

In this embodiment, the crack sensing layer may be directly disposed on the first touch insulating layer or the second touch insulating layer.

In the present embodiment, the second electrode may extend from the display area to the intermediate area, and the second electrode may include a hole corresponding to the opening area.

In the present exemplary embodiment, the functional layer may extend from the display area to the intermediate area, and the functional layer may include at least one opening positioned in the intermediate area.

In this embodiment, at least one inorganic insulating layer disposed on the substrate may be further included, and at least one opening of the functional layer may be located on the at least one inorganic insulating layer.

In the present embodiment, the at least one opening includes a first opening, a second opening, and a third opening, the first opening is located between the display area and the first dam part, and the second opening is the It may be positioned between the first dam part and the second dam part, and the third opening may be positioned between the second dam part and the opening area.

In this embodiment, it may further include an encapsulation layer disposed on the light emitting diode, the encapsulation layer including a first inorganic film layer, an organic film layer, and a second inorganic film layer sequentially stacked.

In the present embodiment, the encapsulation layer may extend from the display area to the intermediate area, and the encapsulation layer may overlap at least one opening of the functional layer.

In this embodiment, an alignment mark positioned between the display area and the crack sensing layer may be further included.

According to another aspect of the present invention, there is provided a display panel comprising: a display panel including an opening region, a display region surrounding at least a portion of the opening region, and an intermediate region between the opening region and the display region; and a component disposed on a lower surface of the display panel and at least partially overlapping the opening area, wherein the display panel is disposed on the display area and includes a first electrode, a second electrode, and the first electrode; a light emitting diode including a functional layer between the second electrodes; a first dam located in the middle region; a crack sensing layer positioned between the display area and the first dam; and a planarization layer disposed on the crack sensing layer.

In the present embodiment, a second dam positioned between the first dam part and the opening area may be further included.

In this embodiment, at least one overlapping metal layer of the first dam portion and the second dam portion may be further included.

In this embodiment, the metal layer may include a first metal layer and a second metal layer, and the first metal layer and the second metal layer may overlap at least partially.

In this embodiment, the planarization layer may cover the second metal layer.

In this embodiment, the component may include an imaging device or a sensor.

According to another aspect of the present invention, there is provided a substrate comprising: a substrate including an opening region, a display region surrounding at least a portion of the opening region, and an intermediate region between the opening region and the display region; a light emitting diode disposed on the display area and including a first electrode, a second electrode, and a functional layer between the first electrode and the second electrode; a first dam located in the middle region; a crack sensing layer positioned between the display area and the first dam portion and at least partially overlapping the first dam portion; and a second dam portion positioned between the first dam portion and the opening region.

In the present embodiment, a third dam portion positioned between the second dam portion and the opening region may be further included.

In this embodiment, the first dam portion may have a first height, and the second dam portion may have a second height equal to the first height.

In this embodiment, the third dam portion may have a third height that is smaller than the first height.

In the present embodiment, an inorganic insulating layer disposed on the substrate may be further included, and a groove may be defined in the inorganic insulating layer.

In the present embodiment, the groove may be positioned between the third dam part and the opening area.

In the present exemplary embodiment, the functional layer may extend from the display area to the intermediate area, and the functional layer may include at least one opening positioned in the intermediate area.

In the present embodiment, the at least one opening includes a first opening, a second opening, a third opening, and a fourth opening, wherein the first opening is located between the display area and the first dam part, and A second opening is positioned between the first dam part and the second dam part, the third opening is positioned between the second dam part and the third dam part, and the fourth opening is between the third dam part and the opening area. can be located

In the present exemplary embodiment, a metal layer disposed on the intermediate region and overlapping at least one of the first dam part, the second dam part, and the third dam part may be further included.

In this embodiment, the metal layer may at least partially overlap the fourth opening.

Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

In the display panel according to the exemplary embodiments of the present invention, external impurities such as moisture may be prevented from damaging the display elements centered on the opening region, and the level of crack detection generated in the intermediate region around the opening region may be improved. . However, such an effect is exemplary, and the effect according to the embodiments will be described in detail below.

1 is a perspective view schematically illustrating a display device according to an exemplary embodiment.
FIG. 2 is a schematic cross-sectional view of a display device according to an exemplary embodiment, and is a cross-sectional view taken along line II′ of FIG. 1 .
3 is a plan view schematically illustrating a display panel according to an exemplary embodiment.
4 is an equivalent circuit diagram schematically illustrating a light emitting diode and a circuit connected to the light emitting diode according to an embodiment.
5 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment.
6 is a cross-sectional view of a display panel according to an exemplary embodiment, and corresponds to a cross-section taken along line II-II′ of FIG. 5 .
7 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment.
8 is a cross-sectional view of a display panel according to an exemplary embodiment, which corresponds to a cross-section taken along line III-III′ of FIG. 7 .
9 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment.
10 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment, and is an enlarged view of portion A of FIG. 9 .
11 is a cross-sectional view of a display panel according to an exemplary embodiment, which corresponds to a cross-section taken along line IV-IV' of FIG. 9 .
12 is a cross-sectional view schematically illustrating a portion of a display panel according to an exemplary embodiment.
13A to 13C are cross-sectional views schematically illustrating a portion of a display panel.
14A to 14C are cross-sectional views schematically illustrating a portion of a display panel.
15A to 15C are cross-sectional views schematically illustrating a portion of a display panel.
16A to 16C are cross-sectional views schematically illustrating a portion of a display panel.
17A to 17C are cross-sectional views schematically illustrating a portion of a display panel.
18A to 18C are cross-sectional views schematically illustrating a portion of a display panel.
19A to 19C are cross-sectional views schematically illustrating a portion of a display panel.
20 is a cross-sectional view schematically illustrating a portion of a display panel according to an exemplary embodiment.
21 is a cross-sectional view schematically illustrating a portion of a display panel according to an exemplary embodiment.
22A to 22C are cross-sectional views schematically illustrating a portion of a display panel.
23A to 23C are cross-sectional views schematically illustrating a portion of a display panel.
24A to 24C are cross-sectional views schematically illustrating a portion of a display panel.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method for achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from another, not in a limiting sense.

In the following examples, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have means that the features or components described in the specification are present, and the possibility of adding one or more other features or components is not excluded in advance.

In the following embodiments, when it is said that a part such as a film, region, or component is on or on another part, not only when it is directly on the other part, but also another film, region, component, etc. is interposed therebetween. Including cases where there is

In the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

As used herein, "A and/or B" refers to A, B, or A and B. In addition, in the present specification, "at least one of A and B" refers to A, B, or A and B.

In the following embodiments, the meaning of the wiring "extending in the first direction or the second direction" includes not only extending linearly, but also extending in a zigzag or curved manner along the first or second direction .

In the following embodiments, when "on a plane", it means when the target part is viewed from above, and when "in cross-section", it means when viewed from the side in a cross-section obtained by cutting the target part vertically. In the following examples, when referring to "overlap", it includes "on a plane" and "on a cross-section" overlap.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and the same or corresponding components are given the same reference numerals when described with reference to the drawings.

1 is a perspective view schematically illustrating a display device according to an exemplary embodiment.

Referring to FIG. 1 , a display device 1 is a device that displays a moving image or still image, and includes a mobile phone, a smart phone, a tablet personal computer (PC), a mobile communication terminal, and an electronic notebook. , e-book, PMP (portable multimedia player), navigation, UMPC (Ultra Mobile PC), etc., as well as portable display devices such as televisions, laptops, monitors, billboards, display of various products such as Internet of Things (IOT) It can be used as a screen. In addition, the display device 1 according to an embodiment is a wearable device such as a smart watch, a watch phone, a glasses-type display, and a head mounted display (HMD). can be used In addition, the display device 1 according to an embodiment includes a dashboard of a vehicle, a center information display (CID) disposed on a center fascia or dashboard of the vehicle, and a rearview mirror display ( room mirror display), as entertainment for the rear seat of a car, can be used as a display placed on the back of the front seat. 1 illustrates that the display device 1 according to an exemplary embodiment is used as a smart phone for convenience of description.

The display device 1 may have a rectangular shape in plan view. For example, the display device 1 may have a rectangular planar shape having a short side in an x-direction and a long side in the y-direction as shown in FIG. 1 . An edge where the short side in the x direction and the long side in the y direction meet may be rounded to have a predetermined curvature or may be formed at a right angle. The planar shape of the display device 1 is not limited to a rectangular shape, and may be formed in other polygonal, elliptical, or irregular shapes.

In an embodiment, the display device 1 may include an opening area OA, or a first area, and a display area DA, or a second area, which at least surrounds the opening area OA. The display device 1 includes an intermediate area MA or a third area positioned between the opening area OA and the display area DA, and an outer side of the display area DA, for example, surrounding the display area DA. It may include an outer area (PA, or a fourth area). The intermediate area MA may have a closed-loop shape completely surrounding the opening area OA on a plane.

The opening area OA may be located inside the display area DA. In an exemplary embodiment, the opening area OA may be disposed at an upper center of the display area DA as shown in FIG. 1 . Alternatively, the opening area OA may be disposed in various ways, such as disposed on the upper left side of the display area DA or disposed on the right side of the display area DA. 1 illustrates that one opening area OA is disposed, but in an exemplary embodiment, a plurality of opening areas OA may be provided.

FIG. 2 is a schematic cross-sectional view of a display device according to an exemplary embodiment, and is a cross-sectional view taken along line II′ of FIG. 1 .

Referring to FIG. 2 , the display device 1 may include a display panel 10 and a component 70 . In an embodiment, the component 70 may be disposed under (or under) the display panel 10 , and the component 70 may at least partially overlap the opening area OA. The display panel 10 and the component 70 may be accommodated in the housing HS.

The display panel 10 may include an image generating layer 20 , an input sensing layer 40 , an optical function layer 50 , and a cover window 60 .

The image generating layer 20 may include display elements (or light emitting elements) that emit light to display an image. The display element may include a light emitting diode, for example, an organic light emitting diode including an organic light emitting layer. In one embodiment, the light emitting diode may be an inorganic light emitting diode including an inorganic material. The inorganic light emitting diode may include a PN diode including inorganic semiconductor-based materials. When a voltage is applied to the PN junction diode in a forward direction, holes and electrons are injected, and energy generated by recombination of the holes and electrons is converted into light energy to emit light of a predetermined color. The above-described inorganic light emitting diode may have a width of several to several hundred micrometers, or several to several hundred nanometers. In one embodiment, the image generating layer 20 may include a quantum dot light emitting diode. For example, the emission layer of the image generating layer 20 may include an organic material, an inorganic material, a quantum dot, an organic material and a quantum dot, or an inorganic material and a quantum dot.

The input sensing layer 40 may acquire coordinate information according to an external input, for example, a touch event. The input sensing layer 40 may include a sensing electrode or a touch electrode and trace lines connected to the sensing electrode. The input sensing layer 40 may be disposed on the image generating layer 20 . The input sensing layer 40 may sense an external input using a mutual cap method and/or a self-cap method.

The input sensing layer 40 may be directly formed on the image generating layer 20 or may be separately formed and then coupled through an adhesive layer such as an optically transparent adhesive. For example, the input sensing layer 40 may be formed continuously after the process of forming the image generating layer 20 . In this case, the adhesive layer may not be interposed between the input sensing layer 40 and the image generating layer 20 . can Although FIG. 2 shows that the input sensing layer 40 is interposed between the image generating layer 20 and the optical functional layer 50 , in one embodiment, the input sensing layer 40 is disposed on the optical functional layer 50 . may be placed.

The optical function layer 50 may include an anti-reflection layer. The anti-reflection layer may reduce reflectance of light (external light) incident toward the display panel 10 from the outside through the cover window 60 . The anti-reflection layer may include a retarder and a polarizer. In an embodiment, the anti-reflection layer may include a black matrix and color filters. The color filters may be arranged in consideration of the color of light emitted from each of the light emitting diodes of the image generating layer 20 . In one embodiment, the optical function layer 50 may be provided with a thickness of about 100㎛.

In order to improve the transmittance of the opening area OA, the display panel 10 may include an opening 10OP passing through some of the layers constituting the display panel 10 . The opening 10OP may include openings 20OP, 40OP, and 50OP penetrating the image generating layer 20 , the input sensing layer 40 , and the optical function layer 50 , respectively. The opening 20OP of the image generating layer 20 , the opening 40OP of the input sensing layer 40 , and the opening 50OP of the optical function layer 50 overlap to form an opening 10OP of the display panel 10 . can do.

The cover window 60 may be disposed on the optical function layer 50 . The cover window 60 may be coupled through an adhesive layer such as an optical clear adhesive (OCA) interposed between the cover window 60 and the optical functional layer 50 . The cover window 60 may cover the first opening 20OP of the image generating layer 20 , the second opening 40OP of the input sensing layer 40 , and the third opening 50OP of the optical function layer 50 . can Although not shown, the optically transparent adhesive and/or the cover window 60 may also include an opening. In one embodiment, the optically transparent adhesive may be provided with a thickness of about 100㎛, the cover window 60 may be provided with a thickness of about 660㎛.

The cover window 60 may include a glass material or a plastic material. The glass material may include ultra-thin glass. The plastic material may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate.

The opening area OA may be a kind of component area (eg, a sensor area, a camera area, a speaker area, etc.) in which the component 70 for adding various functions to the display device 1 is located.

Component 70 may include electronic components. For example, the component 70 may be an electronic element using light or sound. For example, the electronic element is a sensor that uses light, such as an infrared sensor, a camera that captures an image by receiving light, a sensor that measures a distance or recognizes a fingerprint by outputting and sensing light or sound, a small lamp that outputs light, or , a speaker outputting sound, and the like. Electronic elements using light may use light of various wavelength bands, such as visible light, infrared light, ultraviolet light, and the like. The opening area OA corresponds to an area through which light output from the component 70 or traveling toward the electronic element from the outside can pass.

3 is a plan view schematically illustrating a display panel according to an exemplary embodiment.

Referring to FIG. 3 , the display panel 10 may include an opening area OA, a display area DA, an intermediate area MA, and an outer area PA. For example, it may be understood that the substrate 100 included in the display panel 10 includes an opening area OA, a display area DA, an intermediate area MA, and an outer area PA.

The display panel 10 includes a plurality of sub-pixels P disposed in the display area DA, and the display panel 10 may display an image using light emitted from each sub-pixel P. . Each sub-pixel P may emit red, green, or blue light using a light emitting diode. The light emitting diode of each sub-pixel may be electrically connected to the scan line SL and the data line DL.

A scan driver 2100 providing a scan signal to each sub-pixel P and a data driver 2200 providing a data signal to each sub-pixel P may be disposed in the outer area PA. Also, a first main power line (not shown) and a second main power line (not shown) for providing the first power voltage and the second power voltage may be disposed in the outer area PA. The scan drivers 2100 may be disposed on both sides of the display area DA therebetween. In this case, the sub-pixel P disposed on the left side with respect to the opening area OA is connected to the scan driver 2100 disposed on the left side, and the sub-pixel P disposed on the right side with the opening area OA as the center. may be connected to the scan driver 2100 disposed on the right side.

In an embodiment, the intermediate area MA may surround the opening area OA. The middle area MA is an area where a display element such as a light emitting diode is not disposed. In the middle area MA, a signal is provided to the sub-pixels P provided around the opening area OA. Lines can pass. For example, the data lines DL and/or the scan lines SL cross the display area DA, and some of the data lines DL and/or the scan lines SL cross the open area OA. It may be bypassed in the intermediate area MA along the edge of the opening 10OP of the display panel 10 formed in the display panel 10 . In an exemplary embodiment, FIG. 3 shows data lines DL crossing the display area DA along the y-direction while some data lines DL partially surround the opening area OA in the middle area MA. Detour shows. The scan lines SL may cross the display area DA along the x-direction and may be spaced apart from each other with the opening area OA interposed therebetween. That is, the scan lines SL arranged in the same row may be disconnected (or disconnected or separated) with the opening area OA interposed therebetween.

3 illustrates that the data driver 2200 is disposed adjacent to one side of the substrate 100 . In an embodiment, the data driver 2200 is electrically connected to a pad disposed at one side of the display panel 10 . may be disposed on a printed circuit board connected to the The circuit board may have flexibility, and a portion of the circuit board may be bent to be positioned under the rear surface of the substrate 100 .

4 is an equivalent circuit diagram schematically illustrating a light emitting diode and a circuit connected to the light emitting diode according to an embodiment.

Referring to FIG. 4 , the sub-pixel P described with reference to FIG. 3 may emit light through a light emitting diode LED, and the light emitting diode may be electrically connected to the pixel circuit PC.

The pixel circuit PC includes a first transistor T1 , a second transistor T2 , a third transistor T3 , a fourth transistor T4 , a fifth transistor T5 , a sixth transistor T6 , and a seventh transistor T6 . It may include a transistor T7 and a storage capacitor Cst.

The second transistor T2 is a switching thin film transistor, is connected to the scan line SL and the data line DL, and is a data line based on a switching voltage (or a switching signal, Sn) input from the scan line SL. The data voltage (or data signal, Dm) input from DL may be transferred to the first transistor T1 . The storage capacitor Cst is connected to the second transistor T2 and the driving voltage line PL, and the voltage received from the second transistor T2 and the first power voltage ELVDD supplied to the driving voltage line PL. It is possible to store the voltage corresponding to the difference of .

The first transistor T1 is a driving thin film transistor, which is connected to the driving voltage line PL and the storage capacitor Cst, and is supplied from the driving voltage line PL to the light emitting diode ( The driving current flowing through the LED) can be controlled. The light emitting diode (LED) may emit light having a predetermined luminance by a driving current. The second electrode (eg, the cathode) of the light emitting diode LED may receive the second power voltage ELVSS.

The third transistor T3 is a compensation thin film transistor, and a gate electrode of the third transistor T3 may be connected to the scan line SL. The source electrode (or drain electrode) of the third transistor T3 is connected to the drain electrode (or the source electrode) of the first transistor T1 , and the light emitting diode LED is connected via the sixth transistor T6. It may be connected to the first electrode (eg, an anode). The drain electrode (or source electrode) of the third transistor T3 is any one electrode of the storage capacitor Cst, the source electrode (or drain electrode) of the fourth transistor T4, and the first transistor T1. It may be connected to the gate electrode. The third transistor T3 is turned on according to the scan signal Sn received through the scan line SL to connect the gate electrode and the drain electrode of the first transistor T1 to each other to connect the first transistor ( T1) is diode-connected.

As the initialization thin film transistor of the fourth transistor T4 , the gate electrode may be connected to the previous scan line SL-1. The drain electrode (or the source electrode) of the fourth transistor T4 may be connected to the initialization voltage line VL. The source electrode (or drain electrode) of the fourth transistor T4 includes any one electrode of the storage capacitor Cst, the drain electrode (or source electrode) of the third transistor T3 and the first transistor T1. It may be connected to the gate electrode. The fourth transistor T4 is turned on according to the previous scan signal Sn-1 received through the previous scan line SL-1 to transmit the initialization voltage Vint to the gate electrode of the first transistor T1. An initialization operation for initializing the voltage of the gate electrode of the first transistor T1 may be performed.

The fifth transistor T5 is an operation control thin film transistor, and a gate electrode may be connected to the emission control line EL. A source electrode (or a drain electrode) of the fifth transistor T5 may be connected to the driving voltage line PL. The drain electrode (or source electrode) of the fifth transistor T5 is connected to the source electrode (or drain electrode) of the first transistor T1 and the drain electrode (or source electrode) of the second transistor T2 , have.

The sixth transistor T6 is an emission control thin film transistor, and a gate electrode may be connected to the emission control line EL. The source electrode (or drain electrode) of the sixth transistor T6 may be connected to the drain electrode (or source electrode) of the first transistor T1 and the source electrode (or drain electrode) of the third transistor T3 . have. The drain electrode (or source electrode) of the sixth transistor T6 may be electrically connected to the first electrode of the light emitting diode LED. The fifth transistor T5 and the sixth transistor T6 are simultaneously turned on according to the light emission control signal En received through the light emission control line EL, and the driving voltage ELVDD is transmitted to the light emitting diode LED. , a driving current flows through the light emitting diode (LED).

The seventh transistor T7 may be an initialization thin film transistor that initializes the first electrode of the light emitting diode LED. The gate electrode of the seventh transistor T7 may then be connected to the scan line SL+1. The source electrode (or drain electrode) of the seventh transistor T7 may be connected to the first electrode of the light emitting diode LED. A drain electrode (or a source electrode) of the seventh transistor T7 may be connected to the initialization voltage line VL. After being transmitted through the scan line SL+1, the seventh transistor T7 may be turned on according to the scan signal Sn+1 to initialize the first electrode of the light emitting diode LED.

In FIG. 4 , the fourth transistor T4 and the seventh transistor T7 are respectively connected to the previous scan line SL-1 and the subsequent scan line SL+1. However, in one embodiment, the fourth transistor T7 Both the transistor T4 and the seventh transistor T7 are connected to the previous scan line SLn-1 to be driven according to the previous scan signal Sn-1.

One electrode of the storage capacitor Cst may be connected to the driving voltage line PL. The other electrode of the storage capacitor Cst is the gate electrode of the first transistor T1 , the drain electrode (or source electrode) of the third transistor T3 , and the source electrode (or drain electrode) of the fourth transistor T4 . electrodes) can be connected together.

The second electrode of the light emitting diode LED may receive the common voltage ELVSS. The light emitting diode LED may receive a driving current from the first transistor T1 to emit light.

In an embodiment, all of the plurality of transistors T1 to T7 may include a semiconductor layer including silicon. However, the present invention is not limited thereto.

In an embodiment, at least one of the plurality of transistors T1 to T7 may include a semiconductor layer including an oxide, and the other transistors may include a semiconductor layer including silicon. Specifically, in the case of the first transistor T1 , which directly affects the brightness of the display panel 10 , it is configured to include a silicon semiconductor made of polycrystalline silicon having high reliability. can be implemented

On the other hand, since the oxide semiconductor has high carrier mobility and low leakage current, the voltage drop is not large even if the driving time is long. That is, since the color change of the image according to the voltage drop is not large even during low-frequency driving, low-frequency driving is possible. As described above, in the case of the oxide semiconductor, since the leakage current is small, at least one of the third transistor T3 and the fourth transistor T4 connected to the gate electrode of the first transistor T1 is used as an oxide semiconductor. 1 It is possible to prevent leakage current flowing to the gate electrode of the transistor T1 and reduce power consumption. In this case, a signal line and/or a voltage line may be added to the pixel circuit PC of FIG. 4 . In addition, transistors other than the third transistor T3 and the fourth transistor T4 may include a semiconductor layer including an oxide. For example, the seventh transistor T7 may include a semiconductor layer including an oxide semiconductor.

5 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment.

Referring to FIG. 5 , the sub-pixels P may be disposed in the display area DA. An intermediate area MA may be positioned between the opening area OA and the display area DA. The subpixels P adjacent to the opening area OA may be disposed to be spaced apart from each other with respect to the opening area OA on a plane. On the plane of FIG. 5 , the sub-pixels P may be vertically spaced apart from each other with respect to the opening area OA, or may be disposed left and right with the opening area OA as the center. As described above with reference to FIGS. 3 and 4 , each sub-pixel P uses red, green, and blue light emitted from a light emitting diode, so the positions of the sub-pixels P shown in FIG. 5 emit light, respectively. It corresponds to the position of the diodes. Accordingly, the fact that the sub-pixels P are spaced apart from each other with respect to the opening area OA on a plane may indicate that the light emitting diodes are spaced apart from each other about the opening area OA on a plane. For example, on a plane, the light emitting diodes may be disposed to be vertically spaced apart from each other with respect to the opening area OA, or may be disposed to be spaced apart from each other in the left and right directions based on the opening area OA.

Among the signal lines supplying signals to the pixel circuit connected to the light emitting diode of each sub-pixel P, signal lines adjacent to the opening area OA may bypass the opening area OA and/or the opening 10OP. Some of the data lines DL among the data lines DL passing through the display area DA provide a data signal to the sub-pixels P respectively disposed above and below the opening area OA therebetween. It extends in the y-direction, and may be bypassed along the edge of the opening area OA and/or the opening 10OP in the intermediate area MA.

The bypass portion DL-C of at least one data line DL among the data lines DL may be formed on a different layer from the extension portion DL-L crossing the display area DA, The bypass portion DL-C and the extension portion DL-L of the data line DL may be connected through the contact hole CNT. However, the present invention is not limited thereto. The bypass portion DL-C of the at least one data line DL among the data lines DL may be disposed on the same layer as the extension portion DL-L and may be integrally formed.

The scan line SL may be separated or disconnected based on the opening area OA, and the scan line SL disposed on the left side with respect to the opening area OA is the display area as described above with reference to FIG. 3 . A signal may be received from the scan driver 2100 disposed on the left side with respect to the DA, and the scan line SL disposed on the right side of the opening area OA is the display area DA shown in FIG. 3 . A signal may be received from the scan driver 2100 disposed on the right side. However, the present invention is not limited thereto. Some of the scan lines SL passing through the display area DA provide scan signals to the sub-pixels P respectively disposed on the left and right sides with the opening area OA interposed therebetween. It extends in the ±x direction, and may be bypassed along the edge of the opening area OA and/or the opening 10OP in the intermediate area MA.

6 is a cross-sectional view of a display panel according to an exemplary embodiment, and corresponds to a cross-section taken along line II-II′ of FIG. 5 .

Referring to FIG. 6 , the display panel 10 includes a substrate 100 , an inorganic insulating layer (IIL), an organic insulating layer (OIL), a pixel circuit (PC), a connection electrode (CM), an organic light emitting diode (OLED), It may include a pixel defining layer 118 , a spacer 119 , and an encapsulation layer 300 . That is, on the display area DA of the display panel 10 , the substrate 100 , the inorganic insulating layer IIL, the organic insulating layer OIL, the pixel circuit PC, the connection electrode CM, and the organic light emitting diode OLED ), a pixel defining layer 118 , a spacer 119 , and an encapsulation layer 300 may be disposed.

The substrate 100 may include a first base layer 100a, a first barrier layer 100b, a second base layer 100c, and a second barrier layer 100d. In an embodiment, the first base layer 100a, the first barrier layer 100b, the second base layer 100c, and the second barrier layer 100d may be sequentially stacked.

At least one of the first base layer 100a and the second base layer 100c may include polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, and polyethylene. It may include a polymer resin such as polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, cellulose acetate propionate, and the like. have.

The first barrier layer 100b and the second barrier layer 100d are barrier layers for preventing penetration of external foreign substances, and include silicon nitride (SiN _X ), silicon oxide (SiO ₂ ), and/or silicon oxynitride (SiON). It may be a single layer or a multilayer including an inorganic material such as

The inorganic insulating layer IIL may be disposed on the substrate 100 . The inorganic insulating layer IIL may include a buffer layer 111 , a first gate insulating layer 112 , a second gate insulating layer 113 , and an interlayer insulating layer 114 . A pixel circuit PC may be disposed in the display area DA. The pixel circuit PC may include a thin film transistor TFT and a storage capacitor Cst.

The buffer layer 111 may be disposed on the substrate 100 . The buffer layer 111 may include an inorganic insulating material such as silicon nitride (SiN _X ), silicon oxynitride (SiON), and silicon oxide (SiO ₂ ), and may be a single layer or a multi-layer including the aforementioned inorganic insulating material.

The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. The semiconductor layer Act may be disposed on the buffer layer 111 . The semiconductor layer Act may include polysilicon. Alternatively, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region and a drain region and a source region respectively disposed on both sides of the channel region.

The gate electrode GE may overlap the channel region. The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc. have.

The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE is formed of silicon oxide (SiO ₂ ), silicon nitride (SiN _X ), silicon oxynitride (SiON), and aluminum oxide (Al ₂ O ₃ ). ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or an inorganic insulating material such as zinc oxide (ZnO).

The second gate insulating layer 113 may be provided to cover the gate electrode GE. The second gate insulating layer 113 is silicon oxide (SiO ₂ ), silicon nitride (SiN _X ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), tantalum oxide (Ta) ₂ O ₅ ), hafnium oxide (HfO ₂ ), or an inorganic insulating material such as zinc oxide (ZnO) may be included.

An upper electrode CE2 of the storage capacitor Cst may be disposed on the second gate insulating layer 113 . The upper electrode CE2 may overlap the gate electrode GE below it. In this case, the gate electrode GE and the upper electrode CE2 overlapping with the second gate insulating layer 113 interposed therebetween may form the storage capacitor Cst. That is, the gate electrode GE may function as the lower electrode CE1 of the storage capacitor Cst.

As described above, the storage capacitor Cst and the thin film transistor TFT may be overlapped. However, the present invention is not limited thereto. For example, the storage capacitor Cst may be formed not to overlap the thin film transistor TFT.

The upper electrode CE2 includes aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), and iridium (Ir). , chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and may be a single layer or multiple layers of the aforementioned materials. .

The interlayer insulating layer 114 may cover the upper electrode CE2 . The interlayer insulating layer 114 is silicon oxide (SiO ₂ ), silicon nitride (SiN _X ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O) ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO). The interlayer insulating layer 114 may be a single layer or a multilayer including the aforementioned inorganic insulating material.

The drain electrode DE and the source electrode SE may be respectively positioned on the interlayer insulating layer 114 . The drain electrode DE and the source electrode SE are respectively connected to the semiconductor layer Act through contact holes provided in the first gate insulating layer 112 , the second gate insulating layer 113 , and the interlayer insulating layer 114 . can be connected with The drain electrode DE and the source electrode SE may include a material having good conductivity. The drain electrode DE and the source electrode SE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and a multilayer including the above material. Alternatively, it may be formed as a single layer. In an embodiment, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti/Al/Ti.

The organic insulating layer OIL may be disposed on the inorganic insulating layer IIL. The organic insulating layer OIL may include a first organic insulating layer 115 and a second organic insulating layer 116 . The first organic insulating layer 115 may be disposed to cover the drain electrode DE and the source electrode SE. The first organic insulating layer 115 is a general-purpose polymer such as Polymethylmethacrylate (PMMA) or Polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide-based polymer, an arylether-based polymer, an amide-based polymer, and a fluorine-based polymer. , p-xylene-based polymers, vinyl alcohol-based polymers, and organic insulators such as blends thereof.

The connection electrode CM may be disposed on the first organic insulating layer 115 . In this case, the connection electrode CM may be connected to the drain electrode DE or the source electrode SE through the contact hole of the first organic insulating layer 115 . The connection electrode CM may include a material having good conductivity. The connection electrode CM may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and may be formed as a multi-layer or a single layer including the above material. have. In an embodiment, the connection electrode CM may have a multilayer structure of Ti/Al/Ti.

The second organic insulating layer 116 may be disposed to cover the connection electrode CM. The second organic insulating layer 116 is a general-purpose polymer such as Polymethylmethacrylate (PMMA) or Polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide-based polymer, an arylether-based polymer, an amide-based polymer, and a fluorine-based polymer. , p-xylene-based polymers, vinyl alcohol-based polymers, and organic insulators such as blends thereof.

A light emitting diode may be disposed on the second organic insulating layer 116 . For example, an organic light emitting diode (OLED) may be disposed on the second organic insulating layer 116 . Alternatively, although not shown, an inorganic light emitting diode may be disposed on the second organic insulating layer 116 .

The organic light emitting diode OLED may be disposed on the second organic insulating layer 116 . The organic light emitting diode (OLED) may emit red, green, or blue light, or may emit red, green, blue, or white light. The organic light emitting diode (OLED) may include a first electrode 211 , an emission layer 212b , a functional layer 212f , a second electrode 213 , and a capping layer 215 . The first electrode 211 may be a pixel electrode (eg, an anode) of the organic light emitting diode (OLED), and the second electrode 213 may be a counter electrode (eg, a cathode) of the organic light emitting diode (OLED).

The first electrode 211 may be disposed on the second organic insulating layer 116 . The first electrode 211 may be electrically connected to the connection electrode CM through a contact hole defined in the second organic insulating layer 116 . The first electrode 211 includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In ₂ O ₃ : indium oxide), It may include a conductive oxide such as indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In an embodiment, the first electrode 211 may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), or neodymium (Nd). ), iridium (Ir), chromium (Cr), or a reflective film including a compound thereof. In an embodiment, the first electrode 211 may further include a film formed of ITO, IZO, ZnO, or In ₂ O ₃ above/under the above-described reflective film. For example, the first electrode 211 may have a multilayer structure of ITO/Ag/ITO.

A pixel defining layer 118 having an opening exposing at least a portion of the first electrode 211 may be disposed on the first electrode 211 . The opening of the pixel defining layer 118 may define an emission region of light emitted from the organic light emitting diode (OLED). For example, the width of the opening may correspond to the width of the light emitting region.

The pixel defining layer 118 may include an organic insulator. Alternatively, the pixel defining layer 118 may include an inorganic insulating material such as silicon nitride, silicon oxynitride, or silicon oxide. Alternatively, the pixel defining layer 118 may include an organic insulating material and an inorganic insulating material. In an embodiment, the pixel defining layer 118 includes a light blocking material and may be provided in black. The light-blocking material may include carbon black, carbon nanotubes, a resin or paste containing black dye, metal particles such as nickel, aluminum, molybdenum, and alloys thereof, metal oxide particles (eg, chromium oxide) or metal nitride particles (eg, , chromium nitride) and the like. When the pixel defining layer 118 includes a light blocking material, reflection of external light by the metal structures disposed under the pixel defining layer 118 may be reduced.

A spacer 119 may be disposed on the pixel defining layer 118 . The spacer 119 may include an organic insulating material such as polyimide. Alternatively, the spacer 119 may include an inorganic insulating material such as silicon nitride (SiN _X ) or silicon oxide (SiO ₂ ), or may include an organic insulating material and an inorganic insulating material.

In an embodiment, the spacer 119 may include the same material as the pixel defining layer 118 . In this case, the pixel defining layer 118 and the spacer 119 may be formed together in a mask process using a half-tone mask or the like. In an embodiment, the spacer 119 and the pixel defining layer 118 may include different materials.

The emission layer 212b may be disposed in the opening of the pixel defining layer 118 . The light emitting layer 212b may include a polymer or a low molecular weight organic material that emits light of a predetermined color.

The functional layer 212f is at least one of a first functional layer 212a between the first electrode 211 and the light emitting layer 212b and a second functional layer 212c between the light emitting layer 212b and the second electrode 213 . may include any one. For example, a first functional layer 212a may be disposed between the first electrode 211 and the emission layer 212b, and a second functional layer 212c may be disposed between the emission layer 212b and the second electrode 213. This may be omitted. In one embodiment, the first functional layer 212a between the first electrode 211 and the light emitting layer 212b is omitted, and the second functional layer 212c is formed between the light emitting layer 212b and the second electrode 213 . can be placed. In an embodiment, the first functional layer 212a is disposed between the first electrode 211 and the light emitting layer 212b , and the second functional layer 212c is disposed between the light emitting layer 212b and the second electrode 213 . can be placed. Hereinafter, the case in which the first functional layer 212a and the second functional layer 212c are respectively disposed will be described in detail.

The first functional layer 212a may include, for example, a hole transport layer (HTL) or a hole transport layer and a hole injection layer (HIL). The second functional layer 212c may include an electron transport layer (ETL) and/or an electron injection layer (EIL). The first functional layer 212a and/or the second functional layer 212c may be a common layer formed to completely cover the substrate 100 like the second electrode 213 to be described later.

The second electrode 213 may be made of a conductive material having a low work function. For example, the second electrode 213 may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), and iridium. (Ir), chromium (Cr), lithium (Li), calcium (Ca), or may include a (semi) transparent layer containing an alloy thereof. Alternatively, the second electrode 213 may further include a layer such as ITO, IZO, ZnO, or In ₂ O ₃ on the (semi)transparent layer including the above-described material.

In an embodiment, a capping layer 215 may be disposed on the second electrode 213 . The capping layer 215 may include LiF, an inorganic material, and/or an organic material.

The encapsulation layer 300 may cover the organic light emitting diode (OLED). The encapsulation layer 300 may be disposed on the second electrode 213 and/or the capping layer 215 . In an embodiment, the encapsulation layer 300 may include at least one inorganic layer and at least one organic layer. 6 illustrates that the encapsulation layer 300 includes a first inorganic layer 310 , an organic layer 320 , and a second inorganic layer 330 sequentially stacked.

The first inorganic layer 310 and the second inorganic layer 330 may include at least one inorganic material among aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. have. The first inorganic layer 310 and the second inorganic layer 330 may be a single layer or a multilayer including the above-described materials. The organic layer 320 may include a polymer-based material. The polymer-based material may include an acrylic resin, an epoxy-based resin, polyimide, polyethylene, and the like. In an embodiment, the organic layer 320 may include an acrylate.

The thickness of the first inorganic layer 310 and the second inorganic layer 330 may be different from each other. The thickness of the first inorganic layer 310 may be greater than the thickness of the second inorganic layer 330 . Alternatively, the thickness of the second inorganic layer 330 may be greater than the thickness of the first inorganic layer 310 , or the thickness of the first inorganic layer 310 and the second inorganic layer 330 may be the same.

An input sensing layer 40 may be disposed on the encapsulation layer 300 . The input sensing layer 40 includes a first touch insulating layer 410 , a second touch insulating layer 420 , a first conductive layer 430 , a third touch insulating layer 440 , a second conductive layer 450 , and a planarization layer 460 .

In an embodiment, the first touch insulating layer 410 may be disposed on the second inorganic layer 330 , and the second touch insulating layer 420 may be disposed on the first touch insulating layer 410 . have. In an embodiment, the first touch insulating layer 410 and the second touch insulating layer 420 may include an inorganic insulating material and/or an organic insulating material. For example, the first touch insulating layer 410 and the second touch insulating layer 420 may include an inorganic insulating material such as silicon oxide, silicon nitride, and/or silicon oxynitride.

In an embodiment, at least one of the first touch insulating layer 410 and the second touch insulating layer 420 may be omitted. For example, the first touch insulating layer 410 may be omitted. In this case, the second touch insulating layer 420 may be disposed on the second inorganic layer 330 , and the first conductive layer 430 may be disposed on the second touch insulating layer 420 .

A first conductive layer 430 may be disposed on the second touch insulating layer 420 , and a third touch insulating layer 440 may be disposed on the first conductive layer 430 . In an embodiment, the third touch insulating layer 440 may include an inorganic insulating material and/or an organic insulating material. For example, the third touch insulating layer 440 may include an inorganic insulating material such as silicon oxide, silicon nitride, and/or silicon oxynitride.

A second conductive layer 450 may be disposed on the third touch insulating layer 440 . The touch electrode TE of the input sensing layer 40 may include a structure in which the first conductive layer 430 and the second conductive layer 450 are connected. Alternatively, the touch electrode TE may be formed on any one of the first conductive layer 430 and the second conductive layer 450 , and may include a metal line provided in the corresponding conductive layer. Each of the first conductive layer 430 and the second conductive layer 450 may include at least one of aluminum (Al), copper (Cu), titanium (Ti), molybdenum (Mo), and indium tin oxide (ITO). and may be formed of a single layer or multiple layers including the above-mentioned material. For example, the first conductive layer 430 and the second conductive layer 450 may each have a three-layer structure of a titanium layer/aluminum layer/titanium layer.

In an embodiment, the planarization layer 460 may cover the second conductive layer 450 . The planarization layer 460 may include an organic insulator.

7 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment. The data line DL and the scan line SL shown in FIG. 5 may also be disposed on the display panel of FIG. 7 , but are omitted for convenience of description.

Referring to FIG. 7 , a first dam part DP1 and a second dam part DP2 may be disposed in the intermediate area MA. Each of the first dam part DP1 and the second dam part DP2 may have a closed loop shape surrounding the opening area OA on a plan view. Also, on a plan view, the first dam part DP1 and the second dam part DP2 may be arranged to be spaced apart from each other.

In an embodiment, the first dam part DP1 may be positioned between the display area DA and the opening area OA, and the second dam part DP2 is between the first dam part DP1 and the opening area OA. can be located in That is, the second dam part DP2 may be disposed (or positioned) closer to the opening area OA than the first dam part DP1 .

Although it is shown in FIG. 7 that the two dam parts DP1 and DP2 are disposed in the middle area MA, the present invention is not limited thereto. Various modifications are possible, such as one dam unit may be disposed in the intermediate area MA, and two or more dam units may be disposed in the intermediate area MA.

8 is a cross-sectional view of a display panel according to an exemplary embodiment, which corresponds to a cross-section taken along line III-III′ of FIG. 7 . Specifically, FIG. 8 is a view for explaining the components disposed on the intermediate area MA. In FIG. 8, the same reference numerals as those of FIG. 6 mean the same members, and the redundant description will be omitted. do.

Referring to FIG. 8 , in one embodiment, the first base layer 100a , the first barrier layer 100b , the second base layer 100c , and the second barrier layer 100d may be continuously disposed. . For example, the first base layer 100a , the first barrier layer 100b , the second base layer 100c , and the second barrier layer 100d are separated from the display area DA ( FIG. 6 ) in the opening area OA. ) can be arranged consecutively in the direction of

In an embodiment, an inorganic insulating layer (IIL) may be disposed on the substrate 100 . The inorganic insulating layer IIL is disposed on the display area DA ( FIG. 6 ), and the inorganic insulating layer IIL may extend from the display area DA to the intermediate area MA. As described above with reference to FIG. 6 , the inorganic insulating layer IIL includes the buffer layer 111 ( FIG. 6 ), the first gate insulating layer 112 ( FIG. 6 ), the second gate insulating layer 113 ( FIG. 6 ), and interlayer insulation. layer 114 (FIG. 6). However, in the intermediate region MA, at least one of the buffer layer 111 , the first gate insulating layer 112 , the second gate insulating layer 113 , and the interlayer insulating layer 114 may be omitted.

An organic insulating layer OIL may be disposed on the inorganic insulating layer IIL. The organic insulating layer OIL is disposed on the display area DA ( FIG. 6 ), and the organic insulating layer OIL may extend from the display area DA to the intermediate area MA. 6 , the organic insulating layer OIL may include a first organic insulating layer 115 and a second organic insulating layer 116 . In an embodiment, the second organic insulating layer 116 may cover a side surface of the first organic insulating layer 115 . However, the present invention is not limited thereto. For example, the second organic insulating layer 116 may expose a side surface of the first organic insulating layer 115 .

Also, a pixel defining layer 118 may be disposed on the second organic insulating layer 116 . The pixel defining layer 118 is disposed on the display area DA ( FIG. 6 ), and the pixel defining layer 118 may extend from the display area DA to the intermediate area MA.

As described above in FIG. 7 , the first dam part DP1 and the second dam part DP2 may be disposed (or positioned) on the intermediate area MA. The first dam part DP1 and the second dam part DP2 may be disposed on the upper surface of the inorganic insulating layer IIL. For example, the first dam part DP1 and the second dam part DP2 may be disposed on the upper surface of the interlayer insulating layer 114 ( FIG. 6 ). However, the present invention is not limited thereto. In one embodiment, the first dam part DP1 and the second dam part DP2 are the upper surface of the buffer layer 111 ( FIG. 6 ), the upper surface of the first gate insulating layer 112 ( FIG. 6 ), or the second gate insulating layer ( 113 (Fig. 6) may be disposed on the upper surface.

In an embodiment, the first dam part DP1 and the second dam part DP2 may be provided by stacking a plurality of layers. The first dam part DP1 may include a second organic pattern layer 116a, a third organic pattern layer 118a, and a fourth organic pattern layer 119a, and the second dam part DP2 includes a first organic pattern layer 119a. It may include a pattern layer 115a, a second organic pattern layer 116a, a third organic pattern layer 118a, and a fourth organic pattern layer 119a. In FIG. 8 , the first dam part DP1 is illustrated as including the second organic pattern layer 116a, but the present invention is not limited thereto. The first dam portion DP1 may include the first organic pattern layer 115a.

In one embodiment, since the first dam part DP1 is provided with three organic pattern layers, and the second dam part DP2 is provided with four organic pattern layers, the height of the second dam part DP2 is equal to the height of the first dam part ( It may be provided higher than the height of DP1). That is, the height of the second dam portion DP2 from the upper surface of the inorganic insulating layer IIL may be higher than that of the first dam portion DP1 .

The first organic pattern layer 115a may be provided separately from the first organic insulating layer 115 . The first organic pattern layer 115a may include the same material as the first organic insulating layer 115 .

The second organic pattern layer 116a may be provided separately from the second organic insulating layer 116 . The second organic pattern layer 116a may include the same material as the second organic insulating layer 116 .

The third organic pattern layer 118a may be disposed on the second organic pattern layer 116a. In an embodiment, the third organic pattern layer 118a may be disposed on the upper surface of the second organic pattern layer 116a. The third organic pattern layer 118a may be disposed separately from the pixel defining layer 118 . The third organic pattern layer 118a may include the same material as the pixel defining layer 118 .

The fourth organic pattern layer 119a may be disposed on the third organic pattern layer 118a. The fourth organic pattern layer 119a may be disposed separately from the spacer 119 . The fourth organic pattern layer 119a may include the same material as the spacer 119 .

The functional layer 212f may be disposed on the intermediate region MA. The functional layer 212f is disposed on the display area DA ( FIG. 6 ), and at least a portion of the functional layer 212f may extend from the display area DA to the intermediate area MA. The functional layer 212f may include at least one of the first functional layer 212a and the second functional layer 212c described above with reference to FIG. 6 .

In an embodiment, the functional layer 212f may be disconnected from the intermediate region MA. That is, the functional layer 212f may include at least one opening 212fOP1 , 212fOP2 , and 212fOP3 positioned in the intermediate area MA.

Although not shown, a process of forming a sacrificial layer on the inorganic insulating layer (IIL), forming a functional layer 212f on the sacrificial layer, and then irradiating a laser from the back surface of the substrate 100 to remove the sacrificial layer The functional layer 212f formed on the sacrificial layer may also be removed to form openings 212fOP1, 212fOP2, and 212fOP3 in the functional layer 212f.

At least one opening 212fOP1 , 212fOP2 , and 212fOP3 of the functional layer 212f may be disposed on the inorganic insulating layer IIL. For example, the functional layer 212f is disposed on the upper surface of the inorganic insulating layer IIL, and the upper surface of the inorganic insulating layer IIL is formed through at least one opening 212fOP1, 212fOP2, and 212fOP3 defined in the functional layer 212f. may be exposed.

In an embodiment, the functional layer 212f may include a first opening 212fOP1 , a second opening 212fOP2 , and a third opening 212fOP3 . In an exemplary embodiment, the first opening 212fOP1 may be positioned between the display area DA ( FIG. 7 ) and the first dam portion DP1 , and the second opening 212fOP2 may include the first dam portion DP1 and the second dam portion DP1 . It may be positioned between the dam part DP2 , and the third opening 212fOP3 may be positioned between the second dam part DP2 and the opening area OA. However, the present invention is not limited thereto. The first opening 212fOP1 and the second opening 212fOP2 may be positioned between the display area DA ( FIG. 7 ) and the first dam part DP1 , and the third opening 212fOP3 may be positioned between the second dam part DP2 and the second dam part DP2 . It may be located between the opening areas OA. Also, the first opening 212fOP1 may be positioned between the display area DA ( FIG. 7 ) and the first dam part DP1 , and the second opening 212fOP2 and the third opening 212fOP3 may be positioned between the second dam part DP2 . ) and the opening area OA, and various modifications are possible.

In addition, although it is illustrated that three openings are defined in the functional layer 212f in FIG. 8 , one opening, two openings, or four or more openings may be defined in the functional layer 212f. Various modifications are possible.

In an embodiment, at least one opening 212fOP1 , 212fOP2 , and 212fOP3 is defined in the functional layer 212f , so that oxygen or moisture in the vicinity of the opening area OA permeates into the light emitting diode of the display area DA (or, diffusion) can be prevented or minimized.

The second electrode 213 and the capping layer 215 may be disposed on the intermediate region MA. The second electrode 213 and the capping layer 215 are disposed on the display area DA ( FIG. 6 ), and at least a portion of the second electrode 213 and the capping layer 215 is in the middle from the display area DA. It may extend to the area MA.

In an embodiment, the second electrode 213 and the capping layer 215 may be disconnected from the intermediate region MA. The second electrode 213 and the capping layer 215 disposed on the intermediate area MA may include holes 213H and 215H corresponding to the opening area OA. Holes 213H and 215H defined in the second electrode 213 and the capping layer 215 may be located in the intermediate region MA. At least a portion of the functional layer 212f and/or the inorganic insulating layer IIL may be exposed through the holes 213H and 215H defined in the second electrode 213 and the capping layer 215 .

7 and 8 , the area of the hole 213H defined in the second electrode 213 may be larger than the area of the opening area OA. The hole 213H defined in the second electrode 213 is provided to be larger than the area of the open area OA, so that oxygen or moisture near the open area OA penetrates (or, diffusion) can be prevented or minimized.

Also, the area of the hole 215H defined in the capping layer 215 may be larger than the area of the opening area OA. The hole 215H defined in the capping layer 215 is provided to be larger than the area of the open area OA, so that oxygen or moisture in the vicinity of the open area OA penetrates (or diffuses) into the light emitting diode of the display area DA. ) can be prevented or minimized.

The encapsulation layer 300 may be disposed on the intermediate area MA. The encapsulation layer 300 is disposed on the display area DA ( FIG. 6 ), and at least a portion of the encapsulation layer 300 may extend from the display area DA to the intermediate area MA. In an embodiment, the encapsulation layer 300 may include a first inorganic layer 310 , an organic layer 320 , and a second inorganic layer 330 that are sequentially stacked. Each of the first inorganic layer 310 , the organic layer 320 , and the second inorganic layer 330 may extend from the display area DA to the middle area MA.

The organic layer 320 is formed by applying a monomer and then curing it. The flow of the monomer forming the organic layer 320 may be controlled by the dams DP1 and DP2. That is, by disposing the first dam portion DP1 and/or the second dam portion DP2 in the intermediate area MA, the flow of the monomer forming the organic layer 320 toward the opening area OA can be prevented or minimized. have. For example, an end of the organic layer 320 may be positioned at one side of the first dam part DP1 and/or the second dam part DP2 .

The end of the organic layer 320 is located on one side of the first dam part DP1 and/or the second dam part DP2, and the first inorganic layer 310 and the second inorganic layer 330 are formed on the first dam part ( DP1) and/or the upper surface of the second dam part DP2 may be in direct contact.

The encapsulation layer 300 may overlap at least one opening 212fOP1 , 212fOP2 , and 212fOP3 defined in the functional layer 212f . The first inorganic layer 310 , the organic layer 320 , and the second inorganic layer 330 of the encapsulation layer 300 may overlap the first opening 212fOP1 defined in the functional layer 212f .

In one embodiment, the first inorganic layer 310 is disposed directly on (or in contact with) the upper surface of the inorganic insulating layer IIL, at least a portion of which is exposed by the first opening 212fOP1 defined in the functional layer 212f. can be In addition, in an embodiment, the first inorganic layer 310 is formed of an inorganic insulating layer (IIL) at least partially exposed by the second openings 212fOP2 and the third openings 212fOP3 defined in the functional layer 212f. It may be disposed (or contacted) directly on the upper surface.

The input sensing layer 40 may be disposed on the intermediate area MA. The input sensing layer 40 is disposed on the display area DA ( FIG. 6 ), and at least a portion of the input sensing layer 40 may extend from the display area DA to the intermediate area MA. In an embodiment, the input sensing layer 40 is formed by sequentially stacking the first touch insulating layer 410 , the second touch insulating layer 420 , the third touch insulating layer 440 , and the planarization layer 460 . Each of the first touch insulating layer 410 , the second touch insulating layer 420 , the third touch insulating layer 440 , and the planarization layer 460 is formed from the display area DA to the middle area MA ) can be extended. However, the first touch insulating layer 410 and/or the second touch insulating layer 420 may be omitted.

An alignment mark 470 may be disposed on the second touch insulating layer 420 of the intermediate area MA. In an embodiment, the alignment mark 470 may be formed of the same material as that of the first conductive layer 430 ( FIG. 6 ) described above in FIG. 6 . However, the present invention is not limited thereto. For example, the alignment mark 470 may be formed of the same material as that of the second conductive layer 450 ( FIG. 6 ).

In an embodiment, the alignment mark 470 may be positioned between the display area DA and the first dam portion DP1 . By performing the laser process using the alignment mark 470 positioned between the display area DA and the first dam part DP1, the laser process accuracy can be improved, and cutting defects can be prevented or minimized. have.

The first organic insulating layer 115 and the second organic insulating layer 116 are disposed on the display area DA, while the first organic insulating layer 115 and the second organic insulating layer 116 are disposed in a portion of the middle area MA. Layer 116 may not be disposed. Accordingly, a step may exist between the display area DA and the intermediate area MA.

The planarization layer 460 may be located in the intermediate area MA. The planarization layer 460 may planarize the intermediate area MA. That is, the planarization layer 460 may prevent or minimize a step difference between the display area DA and the intermediate area MA. The planarization layer 460 may be disposed on the third touch insulating layer 440 . The planarization layer 460 may cover the structure provided thereunder.

In an embodiment, the planarization layer 460 may have a thickness of 16,000 angstroms (Å) to 150,000 angstroms (Å). When the thickness of the planarization layer 460 is less than 16,000 angstroms (Å), bubbles may be generated between the planarization layer 460 and the optical functional layer 50 due to the step difference between the display area DA and the intermediate area MA. . On the other hand, when the thickness of the planarization layer 460 is greater than 150,000 angstroms (Å), the thickness distribution of the planarization layer 460 may increase, and the step difference between the display area DA and the intermediate area MA may increase. can Accordingly, since the planarization layer 460 has a thickness of 16,000 angstroms (Å) to 150,000 angstroms (Å), it is possible to prevent or minimize a step difference between the display area DA and the intermediate area MA.

In an embodiment, the difference in height between the display area DA and the intermediate area MA may be reduced by adjusting the thickness of the planarization layer 460 disposed in the display area DA and the intermediate area MA, respectively, and planarization may be performed. After applying the material forming the layer 460, the step difference between the display area DA and the intermediate area MA can be reduced by adjusting the waiting time, adding surface treatment, or performing multiple exposures. have.

In an embodiment, the thickness of the planarization layer 460 disposed on the intermediate area MA may be greater than or equal to the thickness of the planarization layer 460 disposed on the display area DA. Also, a height difference between the top surface of the planarization layer 460 disposed on the intermediate area MA and the top surface of the planarization layer 460 disposed on the display area DA may be 2 μm or less.

Referring to the opening area OA of FIG. 8 , the display panel 10 may include an opening 10OP. The opening 10OP of the display panel 10 may include openings of components constituting the display panel 10 . For example, the opening 10OP of the display panel 10 may include the opening 100OP of the substrate 100 , the opening 460OP of the planarization layer 460 , and the like.

The openings of the components constituting the display panel 10 may be simultaneously formed. Accordingly, the inner surface 100IS of the substrate 100 defining the opening 100OP of the substrate 100 and the inner surface 460IS of the planarization layer 460 defining the opening 460OP of the planarization layer 460 are They may be located on the same vertical line.

9 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment. The data line DL and the scan line SL shown in FIG. 5 may be disposed on the display panel of FIG. 9 , and the first dam part DP1 and the second dam part DP2 shown in FIG. 7 may be disposed. However, it is omitted for convenience of description.

Referring to FIG. 9 , a crack sensing layer 510 may be disposed on the intermediate area MA. In an embodiment, the crack sensing layer 510 may be disposed along the periphery of the opening area OA. The crack sensing layer 510 may serve to detect cracks occurring in the opening area OA and/or the intermediate area MA around the opening area OA. The crack sensing layer 510 may be connected to a pad (or a pad part) provided on one side of the display panel 10 .

In an embodiment, the crack sensing layer 510 may include a first crack sensing layer 511 and a second crack sensing layer 513 . In an embodiment, the first crack sensing layer 511 may be positioned between the opening area OA and the display area DA, and the second crack sensing layer 513 may be disposed between the opening area OA and the first crack. It may be located between the sensing layers 511 . That is, the second crack sensing layer 513 may be located closer to the opening area OA than the first crack sensing layer 511 . In one embodiment, the first crack sensing layer 511 and the second crack sensing layer 513 may be provided integrally.

10 is a plan view schematically illustrating a portion of a display panel according to an exemplary embodiment, and is an enlarged view of portion A of FIG. 9 .

Referring to FIG. 10 , the crack sensing layer 510 may include a first crack sensing layer 511 and a second crack sensing layer 513 , and the first crack sensing layer 511 has a first width W1 . ), and the second crack sensing layer 513 may be provided with a second width W2.

In one embodiment, both the first width W1 of the first crack sensing layer 511 and the second width W2 of the second crack sensing layer 513 may be greater than or equal to 1 μm. In an embodiment, the first width W1 of the first crack sensing layer 511 and the second width W2 of the second crack sensing layer 513 may be the same. Alternatively, in an embodiment, the first width W1 of the first crack sensing layer 511 and the second width W2 of the second crack sensing layer 513 may be different from each other. For example, the second width W2 of the second crack sensing layer 513 may be greater than the first width W1 of the first crack sensing layer 511 , and the second width W2 of the first crack sensing layer 511 is One width W1 may be greater than the second width W2 of the second crack sensing layer 513 .

In an embodiment, the first crack sensing layer 511 and the second crack sensing layer 513 may be spaced apart by a third width W3. At this time, the third width W3 between the first crack sensing layer 511 and the second crack sensing layer 513 is the minimum between the first crack sensing layer 511 and the second crack sensing layer 513 closest to each other. It can mean width. In an embodiment, the third width W3 between the first crack sensing layer 511 and the second crack sensing layer 513 may be 2 μm or more. That is, the first crack sensing layer 511 and the second crack sensing layer 513 may be spaced apart from each other by 2 μm or more and located on the intermediate region MA.

11 is a cross-sectional view of a display panel according to an exemplary embodiment, which corresponds to a cross-section taken along line IV-IV' of FIG. 9 . The embodiment of FIG. 11 is different from the embodiment of FIG. 8 in that the crack sensing layer 510 is disposed on the third touch insulating layer 440 . In FIG. 11 , the same reference numerals as those of FIG. 8 mean the same members, and repeated descriptions will be omitted.

Referring to FIG. 11 , a crack sensing layer 510 may be disposed on the intermediate area MA. The crack sensing layer 510 may include a first crack sensing layer 511 and a second crack sensing layer 513 . In an embodiment, the crack sensing layer 510 may be positioned between the display area DA and the first dam part DP1. In an embodiment, the crack sensing layer 510 may at least partially overlap the first dam portion DP1. For example, the second crack sensing layer 513 of the crack sensing layer 510 may at least partially overlap the first dam portion DP1.

Specifically, the crack sensing layer 510 may at least partially overlap the upper surface DP1a of the first dam portion DP1. Also, the crack sensing layer 510 may at least partially overlap the first side surface DP1b of the first dam part DP1 adjacent to the display area DA.

Also, although not shown, the crack sensing layer 510 may at least partially overlap the second side surface DP1c of the first dam part DP1 adjacent to the second dam part DP2, and At least partially overlapping the upper surface DP2a, at least partially overlapping with the first side surface DP2b of the second dam portion DP2 adjacent to the first dam portion DP1, and at least partially overlapping the second dam portion DP1 adjacent to the opening area OA The second side surface DP2c of the dam part DP2 may at least partially overlap.

In an embodiment, the crack sensing layer 510 may be disposed on the third touch insulating layer 440 . For example, the crack sensing layer 510 may be directly disposed on the upper surface of the third touch insulating layer 440 . When the crack sensing layer 510 is disposed directly on the upper surface of the third touch insulating layer 440 , the crack sensing layer 510 may be provided on the same layer as the second conductive layer 450 ( FIG. 6 ) and made of the same material. have.

However, the present invention is not limited thereto. The crack sensing layer 510 may be disposed on the first touch insulating layer 410 or the second touch insulating layer 420 . For example, the crack sensing layer 510 may be directly disposed on the upper surface of the first touch insulating layer 410 or the second touch insulating layer 420 .

In an embodiment, a planarization layer 460 may be disposed on the crack sensing layer 510 . For example, the planarization layer 460 may cover the crack sensing layer 510 . The planarization layer 460 may be provided as an organic insulating layer.

When the organic insulating layer (or planarization layer) is disposed on the inorganic insulating layer (or the touch insulating layer) and the crack sensing layer 510 is disposed on the organic insulating layer (or the planarization layer), the organic insulating layer (or, the thickness of the planarization layer) may increase the distance between the point at which a crack occurs and the crack sensing layer 510, so that the crack sensing sensitivity of the crack sensing layer 510 may be reduced. In one embodiment, the crack sensing layer 510 is disposed on the inorganic insulating layer (or the touch insulating layer), and the organic insulating layer (or the planarization layer) is disposed on the crack sensing layer 510 , so that cracks are prevented. Since the distance between the occurrence point and the crack sensing layer 510 is reduced, the crack sensing sensitivity of the crack sensing layer 510 may be improved. That is, the crack sensing level of the crack sensing layer 510 may be improved.

12 is a cross-sectional view schematically illustrating a portion of a display panel according to an exemplary embodiment. The embodiment of FIG. 12 is different from the embodiment of FIG. 11 in that a plurality of crack sensing layers 510 are provided. In FIG. 12 , the same reference numerals as those of FIG. 11 mean the same members, and repeated descriptions will be omitted.

Referring to FIG. 12 , a plurality of crack sensing layers 510 may be disposed on the intermediate area MA. A plurality of crack sensing layers 510 may be disposed on the third touch insulating layer 440 . Each crack sensing layer 510 may include a first crack sensing layer 511 and a second crack sensing layer 513 . Although it is shown in FIG. 12 that the four crack sensing layers 510 are positioned on the intermediate area MA, the present invention is not limited thereto. Two, three, or five or more crack sensing layers 510 may be provided.

In one embodiment, the crack detection layer 510 may be disposed between the display area DA and the first dam part DP1, and may be disposed between the first dam part DP1 and the second dam part DP2, , may be disposed on the second dam part DP2 , and may be disposed on the second dam part DP2 and the opening area OA.

Specifically, the crack sensing layer 510 may be positioned between the display area DA and the first dam part DP1. In this case, the crack sensing layer 510 may at least partially overlap the top surface DP1a of the first dam part DP1 and/or the first side surface DP1b of the first dam part DP1. However, the present invention is not limited thereto.

The crack sensing layer 510 may be positioned between the first dam part DP1 and the second dam part DP2 . In this case, the crack sensing layer 510 may at least partially overlap the top surface DP1a of the first dam part DP1 and/or the second side surface DP1c of the first dam part DP1. However, the present invention is not limited thereto.

The crack sensing layer 510 may be located on the second dam portion DP2. In this case, the crack sensing layer 510 is formed of the top surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. At least one may overlap at least partially. However, the present invention is not limited thereto.

The crack sensing layer 510 may be positioned between the second dam part DP2 and the opening area OA. In this case, the crack sensing layer 510 may at least partially overlap the opening 212fOP3 defined in the functional layer 212f. However, the present invention is not limited thereto.

13A to 13C are cross-sectional views schematically illustrating a portion of a display panel. 13A to 13C are different from the embodiment of FIG. 11 in that the metal layer 520 is disposed in the intermediate area MA. In FIGS. 13A to 13C , the same reference numerals as those of FIG. 11 mean the same members, and thus a redundant description will be omitted.

13A to 13C , a metal layer 520 may be disposed on the intermediate area MA. In an embodiment, the metal layer 520 may overlap at least one of the first dam part DP1 and the second dam part DP2 . For example, the metal layer 520 may overlap the first dam part DP1 and the second dam part DP2 . Alternatively, the metal layer 520 may cover at least one of the first dam part DP1 and the second dam part DP2 .

In an embodiment, the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . In one embodiment, as shown in FIG. 13A , the metal layer 520 may include a first metal layer 521 and a second metal layer 523, and the first metal layer 521 is a second touch insulating layer ( It may be disposed on the 420 , and the second metal layer 523 may be disposed on the third touch insulating layer 440 . In one embodiment, the first metal layer 521 may be provided on the same layer as the aforementioned first conductive layer 430 ( FIG. 6 ) and made of the same material, and the second metal layer 523 is the aforementioned second conductive layer ( 450 (FIG. 6) may be provided in the same layer and the same material. In an embodiment, the first metal layer 521 and the second metal layer 523 may at least partially overlap.

In an embodiment, the metal layer 520 may at least partially overlap the upper surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1 adjacent to the second dam part DP2. and may overlap at least partially. Specifically, the first metal layer 521 and the second metal layer 523 may at least partially overlap the upper surface DP1a of the first dam part DP1, and the first dam part DP1 adjacent to the second dam part DP2. may at least partially overlap the second side surface DP1c of the . Alternatively, the metal layer 520 may at least partially cover the upper surface DP1a of the first dam unit DP1 and may at least partially cover the second side surface DP1c of the first dam unit DP1 adjacent to the second dam unit DP2. can Specifically, the first metal layer 521 and the second metal layer 523 may at least partially cover the upper surface DP1a of the first dam part DP1, At least a part of the second side surface DP2c may be covered.

Also, the metal layer 520 may be disposed between the first dam part DP1 and the second dam part DP2 . Specifically, the first metal layer 521 and the second metal layer 523 may be disposed between the first dam part DP1 and the second dam part DP2 .

In an embodiment, the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2, and the first side surface DP2b of the second dam part DP2 adjacent to the first dam part DP1. may at least partially overlap with the second side surface DP2c of the second dam portion DP2 adjacent to the opening area OA. Specifically, the first metal layer 521 and the second metal layer 523 may at least partially overlap the upper surface DP2a of the second dam portion DP2, and may overlap the first side surface DP2b of the second dam portion DP2 and It may at least partially overlap, and may at least partially overlap the second side surface DP2c of the second dam part DP2. Alternatively, the metal layer 520 may at least partially cover the upper surface DP2a of the second dam unit DP2 and may at least partially cover the first side surface DP2b of the second dam unit DP2 adjacent to the first dam unit DP1. In addition, at least a portion of the second side surface DP2c of the second dam portion DP2 adjacent to the opening area OA may be covered. Specifically, the first metal layer 521 and the second metal layer 523 may at least partially cover the upper surface DP2a of the second dam part DP2 and at least cover the first side surface DP2b of the second dam part DP2. It may partially cover, and at least a portion of the second side surface DP2c of the second dam part DP2 may be covered.

In an embodiment, the metal layer 520 may be disconnected from the intermediate region MA. That is, the metal layer 520 may include an opening 521OP 523OP overlapping the second dam portion DP2 . For example, the opening 521OP 523OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam portion DP2.

In an embodiment, the first metal layer 521 may be disconnected from the intermediate region MA. That is, the first metal layer 521 may include an opening 521OP overlapping the second dam portion DP2 . For example, the opening 521OP defined in the first metal layer 521 may at least partially overlap the upper surface DP2a of the second dam portion DP2.

In an embodiment, the second metal layer 523 may be disconnected from the intermediate region MA. That is, the second metal layer 523 may include an opening 523OP overlapping the second dam portion DP2 . For example, the opening 523OP defined in the second metal layer 523 may at least partially overlap the upper surface DP2a of the second dam part DP2.

Since the first metal layer 521 and the second metal layer 523 include openings 521OP and 523OP overlapping the second dam portion DP2, respectively, the opening area OA and/or the middle of the periphery of the opening area OA. It is possible to prevent or minimize cracks generated in the area MA from being transmitted (or propagated) to the light emitting diodes of the display area DA.

When the metal layer is not formed on the first touch insulating layer 410 and the second touch insulating layer 420 , a residual film is formed on the top or side surfaces of the dam parts DP1 and DP2 due to the height of the dam parts DP1 and DP2 . There were cases where defects occurred.

Since the metal layer 520 is provided to overlap the first dam part DP1 and the second dam part DP2, the generation of a residual film overlapping the first dam part DP1 and the second dam part DP2 can be prevented or minimized. And it can prevent or minimize the occurrence of stringer phenomenon.

Specifically, the first metal layer 521 includes an upper surface DP1a of the first dam part DP1 , a second side surface DP2c of the first dam part DP1 , an upper surface DP2a of the second dam part DP2 , and a second The first side surface DP2b of the dam portion DP2 and the second side surface DP2c of the second dam portion DP2 are provided to overlap at least partially, so that during the process of forming the first conductive layer 430 ( FIG. 6 ), the first conductive layer 430 ( FIG. 6 ) is formed. It is possible to prevent or minimize the occurrence of a residual film at a position adjacent to the first dam part DP1 and the second dam part DP2 , and it is possible to prevent or minimize the occurrence of a stringer phenomenon.

In addition, the second metal layer 523 includes an upper surface DP1a of the first dam part DP1, a second side surface DP2c of the first dam part DP1, an upper surface DP2a of the second dam part DP2, and a second dam part. The first side surface DP2b of the DP2 and the second side surface DP2c of the second dam part DP2 are provided to overlap at least partially, so that during the process of forming the second conductive layer 450 ( FIG. 6 ), the first It is possible to prevent or minimize the occurrence of a residual film at a position adjacent to the dam part DP1 and the second dam part DP2 , and it is possible to prevent or minimize the occurrence of a stringer phenomenon.

In addition, the metal layer (eg, the first metal layer 521 and the second metal layer 523 ) is disposed to overlap the top and side surfaces of the dam parts DP1 and DP2, so that the opening area OA and/or the opening area OA is formed. It is possible to prevent or minimize the propagation (or propagation) of cracks generated in the surrounding intermediate area MA to the light emitting diodes of the display area DA, and absorb some of the energy of the cracks and cause the cracks to form the display area DA. ) to prevent or minimize damage to the light emitting diode.

In an embodiment, as shown in FIG. 13B , the metal layer 520 may be disposed only on the second touch insulating layer 420 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 .

In an embodiment, as shown in FIG. 13C , the metal layer 520 may be disposed only on the third touch insulating layer 440 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 .

14A to 14C are cross-sectional views schematically illustrating a portion of a display panel. The embodiments of FIGS. 14A to 14C are different from the embodiments of FIGS. 13A and 13C in that the metal layer 520 is integrally provided. In FIGS. 14A to 14C , the same reference numerals as those of FIGS. 13A to 13C mean the same member, and a duplicate description will be omitted.

14A to 14C , the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . Alternatively, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an embodiment, the metal layer 520 may completely overlap the top surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1. Specifically, the first metal layer 521 and the second metal layer 523 may completely overlap the upper surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1. Alternatively, the metal layer 520 may completely cover the upper surface DP1a of the first dam portion DP1 and the second side surface DP1c of the first dam portion DP1 . Specifically, the first metal layer 521 and the second metal layer 523 may completely cover the upper surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1 .

In addition, the metal layer 520 may completely overlap the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. can Specifically, the first metal layer 521 and the second metal layer 523 are formed on the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second dam part DP2. It may completely overlap the second side surface DP2c. Alternatively, the metal layer 520 may completely cover the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. have. Specifically, the first metal layer 521 and the second metal layer 523 are formed on the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second dam part DP2. The second side surface DP2c may be completely covered.

That is, the metal layer 520 may not include the openings 521OP and 523OP located on the upper surface DP2a of the second dam part DP2 . The metal layer 520 is provided integrally, the upper surface DP1a of the first dam portion DP1, the second side surface DP1c of the first dam portion DP1, the upper surface DP2a of the second dam portion DP2, the second The first side surface DP2b of the dam portion DP2 and the second side surface DP2c of the second dam portion DP2 may completely overlap.

That is, the first metal layer 521 is integrally provided, and the integrally provided first metal layer 521 includes the upper surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1. , may completely overlap the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second side surface DP2c of the second dam part DP2 . In addition, the second metal layer 523 is integrally provided, and the integrally provided second metal layer 523 includes the upper surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1. , may completely overlap the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second side surface DP2c of the second dam part DP2 .

In an embodiment, as shown in FIG. 14B , the metal layer 520 may be disposed only on the second touch insulating layer 420 . Also, in one embodiment, as shown in FIG. 14C , the metal layer 520 may be disposed only on the third touch insulating layer 440 .

15A to 15C are cross-sectional views schematically illustrating a portion of a display panel. The embodiments of FIGS. 15A to 15C are different from the embodiments of FIGS. 13A to 13C in that the metal layer 520 does not overlap the first dam portion DP1. In FIGS. 15A to 15C , the same reference numerals as those of FIGS. 13A to 13C mean the same member, and thus a redundant description will be omitted.

15A to 15C , the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . Alternatively, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an embodiment, the metal layer 520 may not overlap the first dam portion DP1 and may overlap the second dam portion DP2 . That is, the metal layer 520 may not be disposed on the first dam part DP1 , but may be disposed only on the second dam part DP2 . Alternatively, the metal layer 520 may cover the second dam portion DP2 without covering the first dam portion DP1 .

In detail, the first metal layer 521 and the second metal layer 523 may at least partially overlap the second dam part DP2 , and the first metal layer 521 and the second metal layer 523 may overlap the first dam part DP1 . ) may not overlap. For example, the first metal layer 521 and the second metal layer 523 may at least partially overlap the upper surface DP2a of the second dam part DP2, and at least partially overlap the first side surface DP2b of the second dam part DP2. It may partially overlap, and may at least partially overlap the second side surface DP2c of the second dam portion DP2. Also, the first metal layer 521 and the second metal layer 523 may include openings 521OP and 523OP that overlap the upper surface DP2a of the second dam part DP2, respectively.

In one embodiment, as shown in FIG. 15B , the metal layer 520 may be disposed only on the second touch insulating layer 420 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 .

In an embodiment, as shown in FIG. 15C , the metal layer 520 may be disposed only on the third touch insulating layer 440 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 .

16A to 16C are cross-sectional views schematically illustrating a portion of a display panel. The embodiments of FIGS. 16A to 16C are different from the embodiments of FIGS. 15A to 15C in that the metal layer 520 is integrally provided. In FIGS. 16A to 16C , the same reference numerals as those of FIGS. 15A to 15C mean the same member, and thus a redundant description will be omitted.

16A to 16C , the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . Alternatively, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an exemplary embodiment, the metal layer 520 includes the upper surface DP1a of the second dam portion DP2, the first side surface DP2b of the second dam portion DP2, and the second side surface DP2c of the second dam portion DP2. can be completely overlapped with That is, the metal layer 520 is provided integrally, the upper surface DP1a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2 of the second dam part DP2. DP2c) can be completely overlapped. Alternatively, the metal layer 520 may completely cover the upper surface DP1a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. can

Specifically, the first metal layer 521 is integrally provided, and the integrally provided first metal layer 521 includes the upper surface DP1a of the second dam part DP2 and the first side surface DP2b of the second dam part DP2. ) and the second side surface DP2c of the second dam part DP2 may be completely overlapped. In addition, the second metal layer 523 is provided integrally, and the integrally provided second metal layer 523 includes the upper surface DP1a of the second dam part DP2 and the first side surface DP2b of the second dam part DP2. , and may completely overlap the second side surface DP2c of the second dam part DP2.

In an embodiment, as shown in FIG. 16B , the metal layer 520 may be disposed only on the second touch insulating layer 420 . Also, in one embodiment, as shown in FIG. 16C , the metal layer 520 may be disposed only on the third touch insulating layer 440 .

17A to 17C are cross-sectional views schematically illustrating a portion of a display panel. The embodiments of FIGS. 17A to 17C are different from the embodiments of FIGS. 13A to 13C in that the metal layer 520 does not overlap the first side surface DP2b of the second dam part DP2. In FIGS. 17A to 17C , the same reference numerals as those of FIGS. 13A to 13C mean the same member, and a duplicate description will be omitted.

17A to 17C , the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . Alternatively, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an embodiment, the metal layer 520 includes the upper surface DP1a of the first dam part DP1, the second side surface DP1c of the first dam part DP1, the upper surface DP2a of the second dam part DP2, and the second The second dam portion DP2 may at least partially overlap the second side surface DP2c, but may not overlap the first side surface DP2b of the second dam portion DP2. Alternatively, the metal layer 520 may include an upper surface DP1a of the first dam part DP1, a second side surface DP1c of the first dam part DP1, an upper surface DP2a of the second dam part DP2, and a second dam part DP1a. At least a portion of the second side surface DP2c of the DP2 may be covered, and the first side surface DP2b of the second dam portion DP2 may not be covered.

Specifically, the first metal layer 521 and the second metal layer 523 are formed on the upper surface DP1a of the first dam part DP1, the second side surface DP1c of the first dam part DP1, and the second dam part DP2. At least partially overlapping the upper surface DP2a and the second side surface DP2c of the second dam portion DP2, but may not overlap the first side surface DP2b of the second dam portion DP2. Alternatively, the first metal layer 521 and the second metal layer 523 may be formed on the top surface DP1a of the first dam part DP1 , the second side surface DP1c of the first dam part DP1 , and the top surface of the second dam part DP2 . At least a portion of the DP2a and the second side surface DP2c of the second dam unit DP2 may be covered, but the first side surface DP2b of the second dam unit DP2 may not be covered.

In an embodiment, the first metal layer 521 and the second metal layer 523 overlap at least a portion of the upper surface DP2a of the second dam part DP2 and the first side surface DP2b of the second dam part DP2, respectively. and openings 521OP and 523OP.

In one embodiment, as shown in FIG. 17B , the metal layer 520 may be disposed only on the second touch insulating layer 420 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 and the first side surface DP2b of the second dam part DP2.

In one embodiment, as shown in FIG. 17C , the metal layer 520 may be disposed only on the third touch insulating layer 440 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 and the first side surface DP2b of the second dam part DP2.

18A to 18C are cross-sectional views schematically illustrating a portion of a display panel. The embodiments of FIGS. 18A to 18C are different from the embodiments of FIGS. 17A to 17C in that the metal layer 520 does not overlap the first dam portion DP1. In FIGS. 18A to 18C , the same reference numerals as those of FIGS. 17A to 17C mean the same member, and a duplicate description will be omitted.

18A to 18C , the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . Alternatively, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an embodiment, the metal layer 520 may not overlap the first dam portion DP1 and may overlap the second dam portion DP2 . That is, the metal layer 520 may not be disposed on the first dam part DP1 , but may be disposed only on the second dam part DP2 . Alternatively, the metal layer 520 may cover the second dam portion DP2 without covering the first dam portion DP1 .

In detail, the first metal layer 521 and the second metal layer 523 may at least partially overlap the second dam part DP2 , and the first metal layer 521 and the second metal layer 523 may overlap the first dam part DP1 . ) may not overlap. For example, the first metal layer 521 and the second metal layer 523 may at least partially overlap the upper surface DP2a of the second dam part DP2, and at least partially overlap the second side surface DP2c of the second dam part DP2. Some may overlap. In addition, the first metal layer 521 and the second metal layer 523 have openings overlapping with at least a portion of the upper surface DP2a of the second dam portion DP2 and the first side surface DP2b of the second dam portion DP2, respectively. 521OP, 523OP).

In an embodiment, as shown in FIG. 18B , the metal layer 520 may be disposed only on the second touch insulating layer 420 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 and the first side surface DP2b of the second dam part DP2.

In an embodiment, as shown in FIG. 18C , the metal layer 520 may be disposed only on the third touch insulating layer 440 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam part DP2 and the first side surface DP2b of the second dam part DP2.

19A to 19C are cross-sectional views schematically illustrating a portion of a display panel. 19A to 19C show that the metal layer 520 overlaps the first side surface DP2b of the second dam unit DP2 and does not overlap the second side surface DP2c of the second dam unit DP2. is different from the embodiments of FIGS. 18A to 18C . In FIGS. 19A to 19C , the same reference numerals as those of FIGS. 18A to 18C mean the same member, and a duplicate description will be omitted.

19A to 19C , the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . Alternatively, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an embodiment, the metal layer 520 may overlap the first side surface DP2b of the second dam unit DP2 and may not overlap the second side surface DP2c of the second dam unit DP2. Alternatively, the metal layer 520 may cover at least a portion of the first side surface DP2b of the second dam portion DP2 and may not cover the second side surface DP2c of the second dam portion DP2 .

Specifically, the first metal layer 521 and the second metal layer 523 may at least partially overlap the upper surface DP2a of the second dam portion DP2, and may overlap the first side surface DP2b of the second dam portion DP2 and At least some overlap. In addition, the first metal layer 521 and the second metal layer 523 have openings overlapping with at least a portion of the upper surface DP2a of the second dam portion DP2 and the second side surface DP2c of the second dam portion DP2, respectively. 521OP, 523OP).

In an embodiment, as shown in FIG. 19B , the metal layer 520 may be disposed only on the second touch insulating layer 420 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam portion DP2 and the second side surface DP2c of the second dam portion DP2 .

In an embodiment, as shown in FIG. 19C , the metal layer 520 may be disposed only on the third touch insulating layer 440 , and at least a portion of the metal layer 520 may be cut off in the intermediate region MA. have. That is, the metal layer 520 may include an opening 520OP overlapping the second dam portion DP2 . For example, the opening 520OP defined in the metal layer 520 may at least partially overlap the upper surface DP2a of the second dam portion DP2 and the second side surface DP2c of the second dam portion DP2 .

20 is a cross-sectional view schematically illustrating a portion of a display panel according to an exemplary embodiment. The embodiment of FIG. 20 is different from the embodiment of FIG. 13A in that the first metal layer at least partially overlaps the first dam portion and the second metal layer at least partially overlaps the second dam portion. In FIG. 20 , the same reference numerals as those of FIG. 13A mean the same members, and a duplicate description will be omitted.

Referring to FIG. 20 , a metal layer 520 may be disposed on the intermediate region MA. In an embodiment, the metal layer 520 may overlap at least one of the first dam part DP1 and the second dam part DP2 .

The metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . For example, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an embodiment, the first metal layer 521 may at least partially overlap the first dam portion DP1 , and the second metal layer 523 may at least partially overlap the second dam portion DP2 . Specifically, the first metal layer 521 may at least partially overlap the top surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1, and the second metal layer 523 may The upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2 may at least partially overlap.

In an embodiment, the second metal layer 523 may be disconnected from the intermediate region MA. That is, the second metal layer 523 may include an opening 523OP overlapping the second dam portion DP2 . For example, the opening 523OP defined in the second metal layer 523 may at least partially overlap the upper surface DP2a of the second dam part DP2.

21 is a cross-sectional view schematically illustrating a portion of a display panel according to an exemplary embodiment. The embodiment of FIG. 21 is different from the embodiment of FIG. 13A in that the first metal layer at least partially overlaps the second dam portion and the second metal layer at least partially overlaps the first dam portion. In FIG. 21 , the same reference numerals as those of FIG. 13A mean the same members, and a redundant description will be omitted.

Referring to FIG. 21 , a metal layer 520 may be disposed on the intermediate area MA. In an embodiment, the metal layer 520 may overlap at least one of the first dam part DP1 and the second dam part DP2 .

The metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . For example, the metal layer 520 may include a first metal layer 521 and a second metal layer 523 , and the first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second The metal layer 523 may be disposed on the third touch insulating layer 440 .

In an embodiment, the first metal layer 521 may at least partially overlap the second dam portion DP2 , and the second metal layer 523 may at least partially overlap the first dam portion DP1 . Specifically, the first metal layer 521 includes the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. At least a portion of the second metal layer 523 may overlap the upper surface DP1a of the first dam portion DP1 and the second side surface DP1c of the first dam portion DP1 at least partially.

In an embodiment, the first metal layer 521 may be disconnected from the intermediate region MA. That is, the first metal layer 521 may include an opening 521OP overlapping the second dam portion DP2 . For example, the opening 521OP defined in the first metal layer 521 may at least partially overlap the upper surface DP2a of the second dam portion DP2.

When a groove is formed in the substrate 100 or the organic insulating layer OIL to prevent oxygen or moisture near the opening area OA from penetrating (or diffusing) into the light emitting diode of the display area DA, the groove An organic insulating layer may be required to fill the . In this case, the process for filling the groove may be performed between the process of forming the first touch insulating layer 410 and the second touch insulating layer 420 .

Since the display panel 10 according to an exemplary embodiment has a structure in which there is no groove in the substrate 100 or the organic insulating layer OIL, a process for filling the groove is not required, so that the manufacturing process of the display panel can be simplified. have. Also, a step difference between the display area DA and the intermediate area MA may be minimized by using the planarization layer 460 formed on the second conductive layer 450 .

22A to 22C are cross-sectional views schematically illustrating a portion of a display panel. In FIGS. 22A to 22C , the same reference numerals as those of FIGS. 14A to 14C mean the same member, and a duplicate description will be omitted.

22A to 22C , the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . The metal layer 520 may include a first metal layer 521 and a second metal layer 523 . The first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second metal layer 523 may be disposed on the third touch insulating layer 440 .

In an exemplary embodiment, the metal layer 520 includes a top surface DP1a of the first dam part DP1, a first side surface DP1b of the first dam part DP1, and a second side surface DP1c of the first dam part DP1. may overlap (or completely overlap) with Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP1a of the first dam part DP1 , the first side surface DP1b of the first dam part DP1 , and the first dam part DP1 . ) may overlap (or completely overlap) the second side surface DP1c.

In other words, the metal layer 520 forms the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the second side surface DP1c of the first dam part DP1. It can be covered (or completely covered). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP1a of the first dam part DP1 , the first side surface DP1b of the first dam part DP1 , and the first dam part DP1 . ) may cover (or completely cover) the second side surface DP1c.

In addition, the metal layer 520 overlaps with the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. or completely overlapping). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second dam part DP2 . ) may overlap (or completely overlap) the second side surface DP2c.

In other words, the metal layer 520 forms the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. It can be covered (or completely covered). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second dam part DP2 . ) may cover (or completely cover) the second side surface DP2c.

That is, the metal layer 520 may be integrally provided to overlap (or completely overlap) the first dam part DP1 and the second dam part DP2 . For example, the metal layer 520 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the second side surface DP1c of the first dam part DP1. , may overlap (or completely overlap) the upper surface DP2a of the second dam portion DP2, the first side surface DP2b of the second dam portion DP2, and the second side surface DP2c of the second dam portion DP2 have. Specifically, each of the first metal layer 521 and the second metal layer 523 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the first The second side surface DP1c of the dam part DP1, the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2 ) and (or completely overlapping).

In other words, the metal layer 520 may be integrally provided to cover (or completely cover) the first dam part DP1 and the second dam part DP2 . For example, the metal layer 520 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the second side surface DP1c of the first dam part DP1. , the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2 may be covered (or completely covered). . Specifically, each of the first metal layer 521 and the second metal layer 523 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the first The second side surface DP1c of the dam part DP1, the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2 ) can be covered (or completely covered).

In an embodiment, as shown in FIG. 22B , the metal layer 520 may be disposed only on the second touch insulating layer 420 . Also, in one embodiment, as shown in FIG. 22C , the metal layer 520 may be disposed only on the third touch insulating layer 440 .

In an embodiment, as shown in FIGS. 22A to 22C , the crack sensing layer 510 may include a first crack sensing layer 511 and a second crack sensing layer 513 . The crack sensing layer 510 may be positioned between the first opening 212fOP1 defined in the functional layer 212f and the first dam portion DP1.

23A to 23C are cross-sectional views schematically illustrating a portion of a display panel. Specifically, FIGS. 23A to 23C are diagrams for explaining components disposed on the intermediate area MA. In FIGS. 23A to 23C , the same reference numerals as those of FIG. 6 mean the same members, and thus a redundant description will be omitted.

23A to 23C , in an embodiment, the substrate 100 includes a first base layer 100a, a first barrier layer 100b, a second base layer 100c, and a second barrier layer 100d. ) may be included. The first base layer 100a , the first barrier layer 100b , the second base layer 100c , and the second barrier layer 100d may be continuously disposed. For example, the first base layer 100a , the first barrier layer 100b , the second base layer 100c , and the second barrier layer 100d are separated from the display area DA ( FIG. 6 ) in the opening area OA. ) can be arranged consecutively in the direction of

In an embodiment, an inorganic insulating layer (IIL) may be disposed on the substrate 100 . The inorganic insulating layer IIL may include a buffer layer 111 , a first gate insulating layer 112 , a second gate insulating layer 113 , and an interlayer insulating layer 114 . However, in the intermediate region MA, at least one of the buffer layer 111 , the first gate insulating layer 112 , the second gate insulating layer 113 , and the interlayer insulating layer 114 may be omitted.

An organic insulating layer OIL may be disposed on the inorganic insulating layer IIL. The organic insulating layer OIL may include a first organic insulating layer 115 and a second organic insulating layer 116 . In an embodiment, the second organic insulating layer 116 may cover a side surface of the first organic insulating layer 115 . However, the present invention is not limited thereto. For example, the second organic insulating layer 116 may expose a side surface of the first organic insulating layer 115 . Also, a pixel defining layer 118 may be disposed on the second organic insulating layer 116 .

As described above in FIG. 7 , the first dam part DP1 and the second dam part DP2 may be disposed (or positioned) on the intermediate area MA. Also, the third dam part DP3 may be disposed (or positioned) on the intermediate area MA. Among the first dam part DP1, the second dam part DP2, and the third dam part DP3, the first dam part DP1 may be positioned closest to the display area DA ( FIG. 7 ), and the third dam part ( The DP3 may be positioned closest to the opening area OA, and the second dam part DP2 may be positioned between the first dam part DP1 and the third dam part DP3. 23A shows that three dam parts DP1, DP2, and DP3 are provided on the intermediate area MA, but the present invention is not limited thereto. Various numbers of dam units such as one, two, four, etc., may be provided in the intermediate area MA.

The first dam part DP1 , the second dam part DP2 , and the third dam part DP3 may be disposed on the inorganic insulating layer IIL. For example, the first dam part DP1 , the second dam part DP2 , and the third dam part DP3 may be disposed on the upper surface of the interlayer insulating layer 114 . However, the present invention is not limited thereto. In an exemplary embodiment, the first dam part DP1 , the second dam part DP2 , and the third dam part DP3 may include a top surface of the buffer layer 111 , a top surface of the first gate insulating layer 112 , and a second gate insulation It may be disposed on one of the top surfaces of the layer 113 .

In an embodiment, the first dam part DP1 and the second dam part DP2 may be provided by stacking a plurality of layers. The first dam part DP1 and the second dam part DP2 may include a second organic pattern layer 116a , a third organic pattern layer 118a , and a fourth organic pattern layer 119a . For example, the first dam part DP1 and the second dam part DP2 may be provided in a structure in which the second organic pattern layer 116a, the third organic pattern layer 118a, and the fourth organic pattern layer 119a are stacked. can The second organic pattern layer 116a may include the same material as the second organic insulating layer 116 and may be formed by the same process. The third organic pattern layer 118a may include the same material as the pixel defining layer 118 and may be formed by the same process. The fourth organic pattern layer 119a may include the same material as the spacers 119 ( FIG. 6 ) described above with reference to FIG. 6 , and may be formed by the same process.

However, although not shown, each of the first dam portion DP1 and the second dam portion DP2 may include the same material as the first organic insulating layer 115, and may include a first organic pattern layer formed in the same process, and a first organic pattern layer formed in the same process. Two or more layers of the organic pattern layer 116a, the third organic pattern layer 118a, and the fourth organic pattern layer 119a may be included.

In an embodiment, the first dam part DP1 and the second dam part DP2 may be provided at the same height. For example, the first height h1 of the first dam part DP1 and the second height h2 of the second dam part DP2 may be equal to each other. However, the present invention is not limited thereto. The first height h1 of the first dam portion DP1 may be greater or smaller than the second height h2 of the second dam portion DP2. In this case, the height may be a length from the upper surface of the inorganic insulating layer IIL to the upper surface of the dam part.

In an embodiment, the third dam part DP3 may be provided at a height lower than that of the first dam part DP1 and/or the second dam part DP2 . For example, the third height h3 of the third dam part DP3 may be lower than the first height h1 of the first dam part DP1 and/or the second height h2 of the second dam part DP2.

The functional layer 212f may be disposed on the intermediate area MA. The functional layer 212f is disposed on the display area DA, and at least a portion of the functional layer 212f may extend from the display area DA to the intermediate area MA. The functional layer 212f may include at least one of the first functional layer 212a ( FIG. 6 ) and the second functional layer 212c ( FIG. 6 ) described above with reference to FIG. 6 .

In an embodiment, the functional layer 212f may be disconnected from the intermediate region MA. That is, the functional layer 212f may include at least one opening 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 positioned in the intermediate area MA.

Although not shown, a process of forming a sacrificial layer on the inorganic insulating layer (IIL), forming a functional layer 212f on the sacrificial layer, and then irradiating a laser from the back surface of the substrate 100 to remove the sacrificial layer The functional layer 212f formed on the heavy sacrificial layer may also be removed to form openings 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 in the functional layer 212f .

At least one opening 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 defined in the functional layer 212f may be positioned on the inorganic insulating layer IIL. For example, the functional layer 212f is disposed on the upper surface of the inorganic insulating layer IIL, and through at least one opening 212fOP1, 212fOP2, 212fOP3, and 212fOP4 defined in the functional layer 212f. The upper surface may be exposed.

In an embodiment, the functional layer 212f may include a first opening 212fOP1 , a second opening 212fOP2 , a third opening 212fOP3 , and a fourth opening 212fOP4 . In an exemplary embodiment, the first opening 212fOP1 may be positioned between the display area DA ( FIG. 7 ) and the first dam portion DP1 , and the second opening 212fOP2 may include the first dam portion DP1 and the second dam portion DP1 . It may be positioned between the dam parts DP2 , the third opening 212fOP3 may be positioned between the second dam part DP2 and the third dam part DP3 , and the fourth opening 212fOP4 may be positioned between the third dam part DP3 . ) and the opening area OA. However, the present invention is not limited thereto.

In an embodiment, at least one opening 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 is defined in the functional layer 212f , so that oxygen or moisture in the vicinity of the opening area OA penetrates into the light emitting diode of the display area DA ( Or, diffusion) can be prevented or minimized.

The second electrode 213 and the capping layer 215 may be disposed on the intermediate region MA. The second electrode 213 and the capping layer 215 are disposed on the display area DA, and at least a portion of the second electrode 213 and the capping layer 215 extends from the display area DA to the middle area MA ) can be extended.

In an embodiment, the second electrode 213 and the capping layer 215 may be disconnected from the intermediate region MA. Each of the second electrode 213 and the capping layer 215 disposed on the intermediate area MA may include holes 213H and 215H corresponding to the opening area OA. Holes 213H and 215H defined in each of the second electrode 213 and the capping layer 215 may be located in the intermediate region MA. At least a portion of the functional layer 212f and/or the inorganic insulating layer IIL may be exposed through the holes 213H and 215H defined in the second electrode 213 and the capping layer 215 , respectively.

The encapsulation layer 300 may be disposed on the intermediate area MA. The encapsulation layer 300 is disposed on the display area DA ( FIG. 6 ), and at least a portion of the encapsulation layer 300 may extend from the display area DA to the intermediate area MA. In an embodiment, the encapsulation layer 300 may include a first inorganic layer 310 , an organic layer 320 , and a second inorganic layer 330 that are sequentially stacked. Each of the first inorganic layer 310 , the organic layer 320 , and the second inorganic layer 330 may extend from the display area DA to the middle area MA.

The organic layer 320 is formed by applying a monomer and then curing it. The flow of the monomer forming the organic layer 320 may be controlled by the dams DP1 and DP2. That is, by disposing the first dam portion DP1 and/or the second dam portion DP2 in the intermediate area MA, the flow of the monomer forming the organic layer 320 toward the opening area OA can be prevented or minimized. have. For example, an end of the organic layer 320 may be positioned at one side of the first dam part DP1 and/or the second dam part DP2 .

The end of the organic layer 320 is located on one side of the first dam part DP1 and/or the second dam part DP2, and the first inorganic layer 310 and the second inorganic layer 330 are formed on the first dam part ( DP1) and/or the upper surface of the second dam part DP2 may be in direct contact.

In addition, a third dam part DP3 may be additionally provided between the second dam part DP2 and the opening area OA, and the third dam part DP3 also controls the flow of monomers forming the organic layer 320 . can do. Accordingly, since the third dam portion DP3 is additionally provided, it is possible to prevent or minimize the flow of the monomer forming the organic layer 320 toward the opening area OA.

The encapsulation layer 300 may overlap at least one opening 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 defined in the functional layer 212f . The first inorganic layer 310 , the organic layer 320 , and the second inorganic layer 330 of the encapsulation layer 300 may overlap the first opening 212fOP1 defined in the functional layer 212f .

In one embodiment, the first inorganic layer 310 is disposed directly on (or in contact with) the upper surface of the inorganic insulating layer IIL, at least a portion of which is exposed by the first opening 212fOP1 defined in the functional layer 212f. can be In addition, in an embodiment, the first inorganic layer 310 is at least partially exposed by the second opening 212fOP2 , the third opening 212fOP3 , and the fourth opening 212fOP4 defined in the functional layer 212f . It may be directly disposed on (or in contact with) the upper surface of the inorganic insulating layer (IIL).

The input sensing layer 40 may be disposed on the intermediate area MA. The input sensing layer 40 is disposed on the display area DA ( FIG. 6 ), and at least a portion of the input sensing layer 40 may extend from the display area DA to the intermediate area MA. In an embodiment, the input sensing layer 40 is formed by sequentially stacking the first touch insulating layer 410 , the second touch insulating layer 420 , the third touch insulating layer 440 , and the planarization layer 460 . Each of the first touch insulating layer 410 , the second touch insulating layer 420 , the third touch insulating layer 440 , and the planarization layer 460 is formed from the display area DA to the middle area MA ) can be extended. However, the first touch insulating layer 410 and/or the second touch insulating layer 420 may be omitted.

An alignment mark 470 may be disposed on the second touch insulating layer 420 of the intermediate area MA. In an embodiment, the alignment mark 470 may be formed of the same material as that of the first conductive layer 430 ( FIG. 6 ) described above in FIG. 6 . However, the present invention is not limited thereto. For example, the alignment mark 470 may be formed of the same material as that of the second conductive layer 450 ( FIG. 6 ).

The planarization layer 460 may be located in the intermediate area MA. The planarization layer 460 may planarize the intermediate area MA. That is, the planarization layer 460 may prevent or minimize a step difference between the display area DA and the intermediate area MA. The planarization layer 460 may be disposed on the third touch insulating layer 440 . The planarization layer 460 may cover the structure provided thereunder.

The display panel 10 may include an opening 10OP. The opening 10OP of the display panel 10 may include openings of components constituting the display panel 10 . For example, the opening 10OP of the display panel 10 may include the opening 100OP of the substrate 100 , the opening 460OP of the planarization layer 460 , and the like.

In an embodiment, a crack sensing layer 510 may be disposed on the intermediate area MA. The crack sensing layer 510 may include a first crack sensing layer 511 and a second crack sensing layer 513 . In an embodiment, the crack sensing layer 510 may be positioned between the display area DA and the first dam part DP1. Also, the crack sensing layer 510 may be positioned between the first opening 212fOP1 defined in the functional layer 212f and the first dam portion DP1. In an embodiment, the crack sensing layer 510 may at least partially overlap the first dam portion DP1. For example, the second crack sensing layer 513 of the crack sensing layer 510 may at least partially overlap the first dam portion DP1. Also, the crack sensing layer 510 may not overlap the first opening 212fOP1 .

The crack sensing layer 510 may be disposed on the third touch insulating layer 440 . However, the present invention is not limited thereto. The crack sensing layer 510 may be disposed on the first touch insulating layer 410 or the second touch insulating layer 420 .

In an embodiment, a metal layer 520 may be disposed on the intermediate region MA. In an embodiment, the metal layer 520 may overlap at least one of the first dam part DP1 , the second dam part DP2 , and the third dam part DP3 . In other words, the metal layer 520 may cover at least one of the first dam part DP1 , the second dam part DP2 , and the third dam part DP3 .

In an embodiment, the metal layer 520 may be disposed on the second touch insulating layer 420 and/or the third touch insulating layer 440 . The metal layer 520 may include a first metal layer 521 and a second metal layer 523 . The first metal layer 521 may be disposed on the second touch insulating layer 420 , and the second metal layer 523 may be disposed on the third touch insulating layer 440 .

In this specification, the first side surface DP1b of the first dam unit DP1 may mean a side adjacent to the display area DA among the side surfaces of the first dam unit DP1, and the second side surface of the first dam unit DP1 (DP1c) may mean a side adjacent to the second dam part DP2 among the side surfaces of the first dam part DP1. Also, the first side surface DP2b of the second dam part DP2 may mean a side adjacent to the first dam part DP1 among the side surfaces of the second dam part DP2, and the second side surface of the second dam part DP2 (DP2c) may mean a side adjacent to the third dam part DP3 among the side surfaces of the second dam part DP2. Also, the first side surface DP3b of the third dam unit DP3 may mean a side adjacent to the second dam unit DP2 among the side surfaces of the third dam unit DP3, and the second side surface of the third dam unit DP3 DP3c may mean a side adjacent to the opening area OA among side surfaces of the third dam part DP3 .

In an embodiment, the metal layer 520 may at least partially overlap the upper surface DP1a of the first dam portion DP1 and the second side surface DP1c of the first dam portion DP1. Specifically, each of the first metal layer 521 and the second metal layer 523 may at least partially overlap the upper surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1. .

In other words, the metal layer 520 may at least partially cover the upper surface DP1a of the first dam portion DP1 and the second side surface DP1c of the first dam portion DP1 . Specifically, each of the first metal layer 521 and the second metal layer 523 may at least partially cover the upper surface DP1a of the first dam part DP1 and the second side surface DP1c of the first dam part DP1 .

In addition, the metal layer 520 overlaps with the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. or completely overlapping). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second dam part DP2 . ) may overlap (or completely overlap) the second side surface DP2c.

In other words, the metal layer 520 forms the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. It can be covered (or completely covered). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second dam part DP2 . ) may cover (or completely cover) the second side surface DP2c.

In addition, the metal layer 520 overlaps the upper surface DP3a of the third dam portion DP3, the first side surface DP3b of the third dam portion DP3, and the second side surface DP3c of the third dam portion DP3 ( or completely overlapping). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP3a of the third dam part DP3 , the first side surface DP3b of the third dam part DP3 , and the third dam part DP3 . ) may overlap (or completely overlap) the second side surface DP3c.

In other words, the metal layer 520 forms the upper surface DP3a of the third dam part DP3, the first side surface DP3b of the third dam part DP3, and the second side surface DP3c of the third dam part DP3. It can be covered (or completely covered). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP3a of the third dam part DP3 , the first side surface DP3b of the third dam part DP3 , and the third dam part DP3 . ) may cover (or completely cover) the second side surface DP3c.

That is, the metal layer 520 may be integrally provided and may at least partially overlap the first dam part DP1 , the second dam part DP2 , and the third dam part DP3 . For example, the metal layer 520 is provided integrally with the upper surface DP1a of the first dam portion DP1, the second side surface DP1c of the first dam portion DP1, the upper surface DP2a of the second dam portion DP2, and the second 2 The first side surface DP2b of the dam unit DP2, the second side surface DP2c of the second dam unit DP2, the upper surface DP3a of the third dam unit DP3, and the first side surface DP3 of the third dam unit DP3 DP3b) and the second side surface DP3c of the third dam part DP3 may at least partially overlap. Specifically, each of the first metal layer 521 and the second metal layer 523 is provided integrally to the upper surface DP1a of the first dam part DP1, the second side surface DP1c of the first dam part DP1, and the second The top surface DP2a of the dam part DP2, the first side surface DP2b of the second dam part DP2, the second side surface DP2c of the second dam part DP2, the top surface DP3a of the third dam part DP3, The first side surface DP3b of the third dam unit DP3 and the second side surface DP3c of the third dam unit DP3 may at least partially overlap.

In other words, the metal layer 520 may be integrally provided to at least partially cover the first dam part DP1 , the second dam part DP2 , and the third dam part DP3 . For example, the metal layer 520 is provided integrally with the upper surface DP1a of the first dam portion DP1, the second side surface DP1c of the first dam portion DP1, the upper surface DP2a of the second dam portion DP2, and the second 2 The first side surface DP2b of the dam unit DP2, the second side surface DP2c of the second dam unit DP2, the upper surface DP3a of the third dam unit DP3, and the first side surface DP3 of the third dam unit DP3 DP3b) and the second side surface DP3c of the third dam part DP3 may be partially covered. Specifically, each of the first metal layer 521 and the second metal layer 523 is provided integrally to the upper surface DP1a of the first dam part DP1, the second side surface DP1c of the first dam part DP1, and the second The top surface DP2a of the dam part DP2, the first side surface DP2b of the second dam part DP2, the second side surface DP2c of the second dam part DP2, the top surface DP3a of the third dam part DP3, At least a portion of the first side surface DP3b of the third dam unit DP3 and the second side surface DP3c of the third dam unit DP3 may be covered.

In an embodiment, as shown in FIG. 23B , the metal layer 520 may be disposed only on the second touch insulating layer 420 . Also, in one embodiment, as shown in FIG. 23C , the metal layer 520 may be disposed only on the third touch insulating layer 440 .

In an embodiment, the inorganic insulating layer IIL has a groove (for preventing cracks generated in the opening area OA and/or the intermediate area MA around the opening area OA from being transmitted to the display area DA). IILs) can be defined. At least a portion of the inorganic insulating layer IIL may be removed to form the grooves IILs. For example, at least a portion of the first gate insulating layer 112 , the second gate insulating layer 113 , and the interlayer insulating layer 114 may be removed to form the grooves IILs. At least a portion of the upper surface of the buffer layer 111 may be exposed through the grooves IILs defined in the first gate insulating layer 112 , the second gate insulating layer 113 , and the interlayer insulating layer 114 . However, the present invention is not limited thereto. At least a portion of the buffer layer 111 may be removed together to form grooves IILs in the buffer layer 111 .

In an embodiment, the grooves IILs may be positioned between the third dam part DP3 and the opening area OA. However, the present invention is not limited thereto. The grooves IILs defined in the inorganic insulating layer IIL may be positioned between the first dam part DP1 and the second dam part DP2 or between the second dam part DP2 and the third dam part DP3. have. In an embodiment, the grooves IILs may be disposed along the circumference of the opening area OA.

In one embodiment, the functional layer 212f, the first inorganic layer 310, the second inorganic layer 330, the first touch insulating layer 410, and the second touch insulating layer 420 in the grooves IILs. , and at least one of the third touch insulating layer 440 may be disposed.

As the grooves IILs are defined in the inorganic insulating layer IIL disposed in the intermediate area MA, cracks generated in the open area OA and/or the intermediate area MA around the open area OA are formed in the display area ( DA) can be prevented or minimized.

24A to 24C are cross-sectional views schematically illustrating a portion of a display panel. Specifically, FIGS. 24A to 24C are diagrams for explaining components disposed on the intermediate area MA. In FIGS. 24A to 24C , the same reference numerals as those of FIGS. 23A to 23C mean the same member, and a duplicate description will be omitted.

24A to 24C , the first dam part DP1 and the second dam part DP2 may be disposed (or positioned) on the intermediate area MA. The first dam part DP1 of the first dam part DP1 and the second dam part DP2 may be located near the display area DA ( FIG. 7 ), and the second dam part DP2 may be located near the opening area OA ( FIG. 7 ). 7) can be located close to Although it is illustrated that two dam parts DP1 and DP2 are provided on the intermediate area MA in FIG. 24A , the present invention is not limited thereto. Various numbers of dams, such as one, three, four, etc., may be provided in the intermediate area MA.

In an embodiment, the first dam part DP1 and the second dam part DP2 may be provided at the same height. For example, the first height h1 of the first dam part DP1 and the second height h2 of the second dam part DP2 may be equal to each other. However, the present invention is not limited thereto. The first height h1 of the first dam portion DP1 may be greater or smaller than the second height h2 of the second dam portion DP2.

In an embodiment, a crack sensing layer 510 may be disposed on the intermediate area MA. The crack sensing layer 510 may include a first crack sensing layer 511 and a second crack sensing layer 513 . In an embodiment, the crack sensing layer 510 may be positioned between the display area DA and the first dam part DP1. Also, the crack sensing layer 510 may be positioned between the first opening 212fOP1 defined in the functional layer 212f and the first dam portion DP1.

In an embodiment, a metal layer 520 may be disposed on the intermediate region MA. In an embodiment, the metal layer 520 may overlap at least one of the first dam part DP1 and the second dam part DP2 . In other words, the metal layer 520 may cover at least one of the first dam part DP1 and the second dam part DP2 .

In an embodiment, the metal layer 520 includes the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the second side surface DP1c of the first dam part DP1. They may overlap (or completely overlap). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the first dam part DP1. It may overlap (or completely overlap) the second side surface DP1c of .

In other words, the metal layer 520 may cover the top surface DP1a of the first dam part DP1 , the first side surface DP1b of the first dam part DP1 , and the second side surface DP1c of the first dam part DP1 . (or completely covered). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the first dam part DP1. It may cover (or completely cover) the second side surface DP1c of

In addition, the metal layer 520 overlaps with the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. or completely overlapping). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second dam part DP2 . ) may overlap (or completely overlap) the second side surface DP2c.

In other words, the metal layer 520 forms the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2. It can be covered (or completely covered). Specifically, each of the first metal layer 521 and the second metal layer 523 includes the upper surface DP2a of the second dam part DP2 , the first side surface DP2b of the second dam part DP2 , and the second dam part DP2 . ) may cover (or completely cover) the second side surface DP2c.

That is, the metal layer 520 may be integrally provided to overlap (or completely overlap) the first dam part DP1 and the second dam part DP2 . For example, the metal layer 520 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the second side surface DP1c of the first dam part DP1. , may overlap (or completely overlap) the upper surface DP2a of the second dam portion DP2, the first side surface DP2b of the second dam portion DP2, and the second side surface DP2c of the second dam portion DP2 have. Specifically, each of the first metal layer 521 and the second metal layer 523 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the first The second side surface DP1c of the dam part DP1, the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2 ) and (or completely overlapping).

In other words, the metal layer 520 may be integrally provided to cover (or completely cover) the first dam part DP1 and the second dam part DP2 . For example, the metal layer 520 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the second side surface DP1c of the first dam part DP1. , the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2 may be covered (or completely covered). . Specifically, each of the first metal layer 521 and the second metal layer 523 is provided integrally to the upper surface DP1a of the first dam part DP1, the first side surface DP1b of the first dam part DP1, and the first The second side surface DP1c of the dam part DP1, the upper surface DP2a of the second dam part DP2, the first side surface DP2b of the second dam part DP2, and the second side surface DP2c of the second dam part DP2 ) can be covered (or completely covered).

In an embodiment, as shown in FIG. 24B , the metal layer 520 may be disposed only on the second touch insulating layer 420 . Also, in one embodiment, as shown in FIG. 24C , the metal layer 520 may be disposed only on the third touch insulating layer 440 .

In an embodiment, the inorganic insulating layer IIL has a groove (for preventing cracks generated in the opening area OA and/or the intermediate area MA around the opening area OA from being transmitted to the display area DA). IILs1, IILs2) may be defined. At least a portion of the inorganic insulating layer IIL may be removed to form grooves IILs1 and IILs2 . For example, at least a portion of the first gate insulating layer 112 , the second gate insulating layer 113 , and the interlayer insulating layer 114 may be removed to form a first groove IILs1 and a second groove IILs2 . have. At least a portion of the upper surface of the buffer layer 111 may be exposed through the grooves IILs1 and IILs2 defined in the first gate insulating layer 112 , the second gate insulating layer 113 , and the interlayer insulating layer 114 . . However, the present invention is not limited thereto. At least a portion of the buffer layer 111 may be removed together to form grooves IILs1 and IILs2 in the buffer layer 111 .

In an embodiment, the first groove IILs1 and the second groove IILs2 may be positioned between the second dam part DP2 and the opening area OA. However, the present invention is not limited thereto. The first groove IILs1 and the second groove IILs2 defined in the inorganic insulating layer IIL may be positioned between the first dam part DP1 and the second dam part DP2 . In an embodiment, the first groove IILs1 and the second groove IILs2 may be disposed along the periphery of the opening area OA.

In an embodiment, the first organic pattern layer 115a may be disposed on the inorganic insulating layer IIL. The first organic pattern layer 115a may include the same material as the first organic insulating layer 115 and may be formed by the same process.

In an embodiment, the first organic pattern layer 115a may fill the first and second grooves IILs1 and IILs2 defined in the inorganic insulating layer IIL. For example, the first organic pattern layer 115a may be disposed in the first groove IILs1 and the second groove IILs2 defined in the inorganic insulating layer IIL.

Grooves IILs1 and IILs2 are defined in the inorganic insulating layer IIL disposed in the intermediate area MA, and the first organic pattern layer 115a is disposed in the grooves IILs1 and IILs2, thereby forming the opening area OA. And/or the cracks generated in the intermediate area MA around the opening area OA may be prevented or minimized from being transmitted to the display area DA.

In an embodiment, the functional layer 212f may be disconnected from the intermediate region MA. That is, the functional layer 212f may include at least one opening 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 positioned in the intermediate area MA.

At least one opening 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 defined in the functional layer 212f may be positioned on the inorganic insulating layer IIL. For example, the functional layer 212f is disposed on the upper surface of the inorganic insulating layer IIL, and through at least one opening 212fOP1, 212fOP2, 212fOP3, and 212fOP4 defined in the functional layer 212f. The upper surface may be exposed.

In an embodiment, the functional layer 212f may include a first opening 212fOP1 , a second opening 212fOP2 , a third opening 212fOP3 , and a fourth opening 212fOP4 . In an exemplary embodiment, the first opening 212fOP1 may be positioned between the display area DA ( FIG. 7 ) and the first dam portion DP1 , and the second opening 212fOP2 may include the first dam portion DP1 and the second dam portion DP1 . It may be positioned between the dam part DP2 , the third opening 212fOP3 may be positioned between the second dam part DP2 and the first organic pattern layer 115a , and the fourth opening 212fOP4 may be positioned between the first organic pattern layer 115a . It may be positioned between the pattern layer 115a and the opening area OA. However, the present invention is not limited thereto.

In an embodiment, at least one opening 212fOP1 , 212fOP2 , 212fOP3 , and 212fOP4 is defined in the functional layer 212f , so that oxygen or moisture in the vicinity of the opening area OA penetrates into the light emitting diode of the display area DA ( Or, diffusion) can be prevented or minimized.

Although the present invention has been described with reference to the embodiment shown in the drawings, which is only exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

1: display device
10: display panel
460: planarization layer
510: crack detection layer
520: metal layer

Claims (40)

a substrate including an opening region, a display region surrounding at least a portion of the opening region, and an intermediate region between the opening region and the display region;
a light emitting diode disposed on the display area and including a first electrode, a second electrode, and a functional layer between the first electrode and the second electrode;
a first dam located in the middle region;
a crack sensing layer positioned between the display area and the first dam; and
a planarization layer disposed on the crack sensing layer;
A display panel comprising a. According to claim 1,
The display panel of claim 1 , further comprising a second dam part positioned between the first dam part and the opening area. 3. The method of claim 2,
and a metal layer overlapping at least one of the first dam part and the second dam part. 4. The method of claim 3,
the metal layer overlaps at least partially with an upper surface of the first dam part and a side surface of the first dam part adjacent to the second dam part;
The metal layer at least partially overlaps a top surface of the second dam part, a first side surface of the second dam part adjacent to the first dam part, and a second side surface of the second dam part adjacent to the opening area. 5. The method of claim 4,
The metal layer includes an opening overlapping at least one of the top surface of the second dam part, the first side surface of the second dam part, and the second side surface of the second dam part. 5. The method of claim 4,
The metal layer includes a first metal layer and a second metal layer, and the first metal layer and the second metal layer at least partially overlap. 7. The method of claim 6,
The planarization layer covers the second metal layer. 7. The method of claim 6,
and an input sensing layer disposed on the light emitting diode, the input sensing layer including a first touch insulating layer, a first conductive layer, a second touch insulating layer, and a second conductive layer sequentially stacked. 9. The method of claim 8,
The first touch insulating layer and the second touch insulating layer extend from the display area to the intermediate area, and the metal layer is disposed on the first touch insulating layer or the second touch insulating layer. 9. The method of claim 8,
The first metal layer is disposed on the first touch insulating layer, and the second metal layer is disposed on the second touch insulating layer. According to claim 1,
The planarization layer has a thickness of 16,000 angstroms (Å) to 150,000 angstroms (Å). According to claim 1,
and the planarization layer is disposed directly on the crack detection layer. According to claim 1,
The crack sensing layer at least partially overlaps the first dam portion. According to claim 1,
The crack sensing layer includes a first crack sensing layer and a second crack sensing layer,
The first crack detecting layer is positioned between the display area and the opening area, and the second crack detecting layer is positioned between the first crack detecting layer and the opening area. 15. The method of claim 14,
A width between the first crack sensing layer and the second crack sensing layer is 2 μm or more. 15. The method of claim 14,
and the first crack sensing layer and the second crack sensing layer are integrally provided. 10. The method of claim 9,
The crack sensing layer is disposed directly on the first touch insulating layer or the second touch insulating layer. According to claim 1,
The second electrode extends from the display area to the intermediate area, and the second electrode includes a hole corresponding to the opening area. 3. The method of claim 2,
The functional layer extends from the display area to the intermediate area, and the functional layer includes at least one opening positioned in the intermediate area. 20. The method of claim 19,
It further comprises at least one inorganic insulating layer disposed on the substrate,
The at least one opening of the functional layer is located on the at least one inorganic insulating layer. 21. The method of claim 20,
the at least one opening comprises a first opening, a second opening and a third opening;
The first opening is positioned between the display area and the first dam part, the second opening is positioned between the first dam part and the second dam part, and the third opening is between the second dam part and the opening area. Located in the display panel. 20. The method of claim 19,
The display panel further comprising: an encapsulation layer disposed on the light emitting diode, the encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer that are sequentially stacked. 23. The method of claim 22,
The encapsulation layer extends from the display area to the intermediate area, and the encapsulation layer overlaps at least one opening of the functional layer. According to claim 1,
and an alignment mark positioned between the display area and the crack sensing layer. a display panel including an opening area, a display area surrounding at least a portion of the opening area, and an intermediate area between the opening area and the display area; and
a component disposed on a lower surface of the display panel and overlapping at least a part of the opening area;
to provide
The display panel is
a light emitting diode disposed on the display area and including a first electrode, a second electrode, and a functional layer between the first electrode and the second electrode;
a first dam located in the middle region;
a crack sensing layer positioned between the display area and the first dam; and
a planarization layer disposed on the crack sensing layer;
A display device comprising: 26. The method of claim 25,
and a second dam portion positioned between the first dam portion and the opening region. 27. The method of claim 26,
and a metal layer overlapping at least one of the first dam part and the second dam part. 28. The method of claim 27,
The metal layer includes a first metal layer and a second metal layer, and the first metal layer and the second metal layer at least partially overlap. 29. The method of claim 28,
The planarization layer covers the second metal layer. 26. The method of claim 25,
wherein the component comprises an imaging element or a sensor. a substrate including an opening region, a display region surrounding at least a portion of the opening region, and an intermediate region between the opening region and the display region;
a light emitting diode disposed on the display area and including a first electrode, a second electrode, and a functional layer between the first electrode and the second electrode;
a first dam located in the middle region;
a crack sensing layer positioned between the display area and the first dam portion and at least partially overlapping the first dam portion; and
a second dam part positioned between the first dam part and the opening area;
A display panel comprising a. 32. The method of claim 31,
and a third dam portion positioned between the second dam portion and the opening region. 33. The method of claim 32,
The first dam portion has a first height, and the second dam portion has a second height equal to the first height. 34. The method of claim 33,
The third dam portion has a third height that is smaller than the first height. 33. The method of claim 32,
Further comprising an inorganic insulating layer disposed on the substrate,
A display panel, wherein a groove is defined in the inorganic insulating layer. 36. The method of claim 35,
The groove is positioned between the third dam part and the opening area. 36. The method of claim 35,
the functional layer extends from the display area to the intermediate area;
and the functional layer includes at least one opening positioned in the intermediate region. 38. The method of claim 37,
the at least one opening comprises a first opening, a second opening, a third opening and a fourth opening;
The first opening is positioned between the display area and the first dam part, the second opening is positioned between the first dam part and the second dam part, and the third opening is the second dam part and the third dam part. and the fourth opening is positioned between the third dam part and the opening area. 39. The method of claim 38,
and a metal layer disposed on the intermediate region and overlapping at least one of the first dam part, the second dam part, and the third dam part. 40. The method of claim 39,
The metal layer at least partially overlaps the fourth opening.

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