KR20220125046A - Flexible printed circuits board and electronic device including the same - Google Patents

Abstract

A flexible circuit board according to an embodiment of the present disclosure may comprise: a dielectric layer; a first conductive layer disposed on an upper part of the dielectric layer; a second conductive layer disposed on a lower part of the dielectric layer; and a plurality of air pockets formed in the dielectric layer. Therefore, the present invention is capable of reducing a transmission loss.

Description

Flexible printed circuit board and electronic device including same

Various embodiments of the present disclosure relate to a flexible printed circuit board and an electronic device including the same.

Electronic devices are pursuing thinness, weight reduction, miniaturization, and multifunctionality. To this end, electronic devices include a transmission line in which various components are mounted and signals (eg, radio frequency (RF) signals) can be transmitted. can do. As an example, as a transmission line, a printed circuit board (eg, printed circuit board (PCB), printed board assembly (PBA), rigid-flexible PCB (R-FPCB), flexible printed circuit board (FPCB) and/or FRC ( A flexible printed circuit board type RF (radio frequency) cable) can be applied.

A typical transmission line may have a structure including a dielectric layer between two parallel conductors (eg, an RF signal line and a ground line), or a structure including a dielectric layer between three parallel conductors. In such a transmission line, transmission loss may be determined by conductor loss and dielectric loss, and the higher the frequency of a transmitted signal, the greater the effect of dielectric loss. Transmission loss can be reduced by changing the physical properties of the dielectric of the transmission line. However, for materials such as liquid crystal polymer (LCP) or modified polyimide, the Dk (dielectric constant) and Df (dissipation factor) values reach the limit values and thus no longer lose transmission loss. There is a problem that cannot be improved.

Recently, a foldable electronic device or a slideable electronic device capable of extending a display has been developed. The foldable electronic device is configured such that the flexible display can be folded or unfolded, and the slideable electronic device is configured so that the screen can be expanded and contracted by moving the flexible display in a sliding manner. In a foldable electronic device, a flexible printed circuit board (eg, FRC) is folded and unfolded in a folding area in which a display is folded when folded, but the flexible circuit board may be damaged due to repeated folding and unfolding. In the slideable electronic device, a screen is expanded when a slide is opened, and a screen is reduced when a slide is closed. When the screen of the slideable electronic device is expanded or reduced, the flexible printed circuit board (eg, FRC) is folded and unfolded in the hinge structure area.

An embodiment of the present disclosure provides a flexible circuit board capable of reducing transmission loss by forming an air pocket in a dielectric layer to lower a dielectric constant (Dk) and a dissipation factor (Df).

An embodiment of the present disclosure provides a flexible printed circuit board with improved bending characteristics that is not damaged even when repeatedly folded and unfolded (eg, opened and closed) of an electronic device.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which this document belongs from the description below. have.

A flexible circuit board according to an embodiment of the present disclosure includes a dielectric layer, a first conductive layer disposed on the dielectric layer, a second conductive layer disposed under the dielectric layer, and a plurality of air pockets formed in the dielectric layer. can do.

In an electronic device including a flexible circuit board, an electronic device according to an embodiment of the present disclosure includes a hinge structure, a flexible display that is folded or unfolded by the hinge structure, and is close to each other facing each other when folded by the hinge structure. and a first part and a second part spaced apart from each other when unfolded, a first circuit board disposed on the first part, a second circuit board disposed on the second part, and the first circuit board and the It may include a flexible circuit board electrically connecting the second circuit board. The flexible printed circuit board may include a dielectric layer, a first conductive layer disposed on the dielectric layer, a second conductive layer disposed under the dielectric layer, and a plurality of air pockets formed in the dielectric layer.

The flexible circuit board according to various embodiments of the present disclosure may reduce transmission loss by forming an air pocket in a dielectric layer to lower a dielectric constant (Dk) and a dissipation factor (Df).

In the flexible printed circuit board according to an embodiment of the present disclosure, by including an air pocket in the dielectric layer, elasticity and repulsion are improved, thereby improving flexural characteristics, and folding and unfolding of an electronic device (eg: opening and closing) can be prevented from being damaged.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a diagram illustrating an unfolded (eg, opened) state of an electronic device according to various embodiments of the present disclosure;
3 is a diagram illustrating a folded (eg, closed) state of an electronic device according to various embodiments of the present disclosure;
4 is a diagram illustrating an electronic device according to various embodiments of the present disclosure;
5 is a diagram illustrating a flexible printed circuit board (eg, a flexible printed circuit board type RF cable (FRC)) according to various embodiments of the present disclosure.
6 is a diagram illustrating a flexible circuit board according to various embodiments of the present disclosure.
7 is a diagram illustrating an air pocket formed in a flexible printed circuit board according to various embodiments of the present disclosure;
8A is a diagram illustrating a cross-section of a flexible printed circuit board according to various embodiments of the present disclosure;
8B is a diagram illustrating a cross-section of a flexible printed circuit board according to various embodiments of the present disclosure.
9 is a diagram illustrating an arrangement structure of air pockets formed on a flexible printed circuit board according to various embodiments of the present disclosure;
10 is a diagram illustrating an arrangement structure of another air pocket formed on a flexible printed circuit board according to various embodiments of the present disclosure;
11 is a diagram illustrating an arrangement structure of another air pocket formed on a flexible printed circuit board according to various embodiments of the present disclosure;
12 is a diagram illustrating an arrangement structure of another air pocket formed on a flexible printed circuit board according to various embodiments of the present disclosure;
13A to 13E are views illustrating a method of manufacturing a flexible printed circuit board according to various embodiments of the present disclosure;
14A to 14D are diagrams illustrating another method of manufacturing a flexible printed circuit board according to various embodiments of the present disclosure;
15 is a diagram illustrating that transmission efficiency is improved when a flexible circuit board according to various embodiments of the present disclosure is applied to an electronic device.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as a part of another functionally related component (eg, camera module 180 or communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module is a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a specified high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of the present document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

According to an embodiment, the display module 160 shown in FIG. 1 may include a display configured to be folded or unfolded. In an electronic device including a display, a flexible circuit board (eg, FRC) may be folded and unfolded in a folding area in which the display is folded when folded.

According to an embodiment, the display module 160 shown in FIG. 1 may include a display that is slidably disposed to provide a screen (eg, a display screen).

For example, the display area of the electronic device 101 is an area that is visually exposed to output an image, and the electronic device 101 adjusts the display area according to the movement of the sliding plate (not shown) or the movement of the display. can be adjusted A rollable electronic device configured to selectively expand a display area by at least partially slidably operating at least a part (eg, a housing) of the electronic device 101 is such a display module ( 160) may be an example. For example, the display module 160 may be referred to as a slide-out display or an expandable display.

2 is a diagram illustrating an unfolded (eg, opened) state of the electronic device 101 according to various embodiments of the present disclosure. 3 is a diagram illustrating a folded (eg, closed) state of the electronic device 101 according to various embodiments of the present disclosure.

2 and 3 , the electronic device 101 includes a housing 300 , a hinge cover 330 covering a foldable portion of the housing 300 , and a space formed by the housing 300 . It may include an arranged flexible or foldable display 200 (hereinafter, abbreviated as “display” 200 ). In this document, the surface on which the display 200 is disposed is defined as the first surface or the front surface of the electronic device 101 . In addition, the opposite surface of the front surface is defined as the second surface or the rear surface of the electronic device 101 . In addition, a surface surrounding the space between the front surface and the rear surface is defined as the third surface or the side surface of the electronic device 101 . For example, the electronic device 101 may be folded or unfolded in the X-axis direction with respect to the folding area 203 .

In one embodiment, the housing 300 includes a first housing structure 310 , a second housing structure 320 including a sensor region 324 , a first rear cover 380 , and a second rear cover ( 390) may be included. The housing 300 of the electronic device 101 is not limited to the shape and combination shown in FIGS. 2 and 3 , and may be implemented by a combination and/or combination of other shapes or parts. For example, in another embodiment, the first housing structure 310 and the first rear cover 380 may be integrally formed, and the second housing structure 320 and the second rear cover 390 may be integrally formed. can be formed.

In the illustrated embodiment, the first housing structure 310 and the second housing structure 320 may be disposed on both sides about the folding axis A, and may have an overall symmetrical shape with respect to the folding axis A. have. As will be described later, the angle or distance between the first housing structure 310 and the second housing structure 320 varies depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. can In the illustrated embodiment, the second housing structure 320, unlike the first housing structure 310, further includes the sensor area 324 in which various sensors are disposed, but in other areas, the shape is symmetrical to each other. can have

In an embodiment, the first housing structure 310 and the second housing structure 320 may together form a recess for accommodating the display 200 . In the illustrated embodiment, due to the sensor area 324 , the recess may have two or more different widths in a direction perpendicular to the folding axis A. As shown in FIG.

For example, the recess is the first portion 310a of the first housing structure 310 and the second housing structure 320 formed at the edge of the sensor region 324 of the second housing structure 320 . It may have a first width W1 between the first portions 320a. The recess corresponds to the second portion 310b of the first housing structure 310 parallel to the folding axis A of the first housing structure 310 and the sensor area 324 of the second housing structure 320 . It may have a second width W2 formed by the second portion 320b of the second housing structure 320 parallel to the folding axis A while not doing so. In this case, the second width W2 may be formed to be longer than the first width W1 . In other words, the first portion 310a of the first housing structure 310 and the first portion 320a of the second housing structure 320 having a mutually asymmetric shape form a first width W1 of the recess. can do. The second portion 310b of the first housing structure 310 and the second portion 320b of the second housing structure 320 having a mutually symmetrical shape may form a second width W2 of the recess. . In an embodiment, the first portion 320a and the second portion 320b of the second housing structure 320 may have different distances from the folding axis A. The width of the recess is not limited to the illustrated example. In various embodiments, the recess may have a plurality of widths due to the shape of the sensor region 324 or the portion having the asymmetric shape of the first housing structure 310 and the second housing structure 320 .

In an embodiment, at least a portion of the first housing structure 310 and the second housing structure 320 may be formed of a metal material or a non-metal material having a rigidity of a size selected to support the display 200 .

In an embodiment, the sensor area 324 may be formed to have a predetermined area adjacent to one corner of the second housing structure 320 . However, the arrangement, shape, and size of the sensor area 324 are not limited to the illustrated example. For example, in other embodiments, the sensor area 324 may be provided at another corner of the second housing structure 320 or any area between the top and bottom corners. In an embodiment, components for performing various functions embedded in the electronic device 101 are electronically provided through the sensor area 324 or through one or more openings provided in the sensor area 324 . It may be exposed on the front side of the device 101 . In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, and a proximity sensor.

The first rear cover 380 is disposed on one side of the folding axis A on the rear surface of the electronic device, and may have, for example, a substantially rectangular periphery, and a first housing structure 310 . ) may be wrapped around the edge. Similarly, the second rear cover 390 may be disposed on the other side of the folding axis A on the rear surface of the electronic device, and an edge thereof may be surrounded by the second housing structure 320 .

In the illustrated embodiment, the first rear cover 380 and the second rear cover 390 may have a substantially symmetrical shape with respect to the folding axis A. However, the first back cover 380 and the second back cover 390 do not necessarily have symmetrical shapes, and in another embodiment, the electronic device 101 includes the first back cover 380 and the A second rear cover 390 may be included. In another embodiment, the first rear cover 380 may be integrally formed with the first housing structure 310 , and the second rear cover 390 may be integrally formed with the second housing structure 320 . have.

In an embodiment, the first back cover 380 , the second back cover 390 , the first housing structure 310 , and the second housing structure 320 may include various components of the electronic device 101 (eg: A printed circuit board, or a battery) may form a space in which it may be disposed. In an embodiment, one or more components may be disposed or visually exposed on the rear surface of the electronic device 101 . For example, at least a portion of the sub-display 290 may be visually exposed through the first rear region 382 of the first rear cover 380 . In another embodiment, one or more components or sensors may be visually exposed through the second back area 392 of the second back cover 390 . In various embodiments, the sensor may include at least one of a proximity sensor, a fingerprint sensor, and/or a rear camera.

The hinge cover 330 may be disposed between the first housing structure 310 and the second housing structure 320 to cover an internal component (eg, a hinge structure). In one embodiment, the hinge cover 330 includes the first housing structure 310 and the second housing structure ( 320), or may be exposed to the outside.

For example, as shown in FIG. 2 , when the electronic device 101 is in an unfolded state, the hinge cover 330 may not be exposed because it is covered by the first housing structure 310 and the second housing structure 320 . . For example, as shown in FIG. 3 , when the electronic device 101 is in a folded state (eg, a fully folded state), the hinge cover 330 is configured to include the first housing structure 310 and the second housing. It may be exposed to the outside between the structures 320 . For example, when the first housing structure 310 and the second housing structure 320 are in an intermediate state that is folded with a certain angle, the hinge cover 330 is the first housing structure It may be partially exposed to the outside between the 310 and the second housing structure 320 . However, in this case, the exposed area may be smaller than in the fully folded state. In one embodiment, the hinge cover 330 may include a curved surface.

The display 200 may be disposed on a space formed by the housing 300 . For example, the display 200 is seated on a recess formed by the housing 300 and may constitute most of the front surface of the electronic device 101 .

Accordingly, the front surface of the electronic device 101 may include the display 200 and a partial area of the first housing structure 310 and a partial area of the second housing structure 320 adjacent to the display 200 . In addition, the rear surface of the electronic device 101 has a first rear cover 380 , a partial region of the first housing structure 310 adjacent to the first rear cover 380 , a second rear cover 390 , and a second rear cover and a portion of the second housing structure 320 adjacent to 390 .

The display 200 may refer to a display in which at least a partial area can be deformed into a flat surface or a curved surface. In an embodiment, the display 200 has the folding area 203 and the first area 201 disposed on one side (the -X direction of the folding area 203 shown in FIG. 2 ) with respect to the folding area 203 . and a second region 202 disposed on the other side (in the X direction of the folding region 203 shown in FIG. 2 ). The display 200 may include a polarizing film (or a polarizing layer), a window glass (eg, ultra-thin glass (UTG) or a polymer window), and an optical compensation film (eg, OCF: optical compensation film). may include

The division of regions of the display 200 is exemplary, and the display 200 may be divided into a plurality (eg, four or more or two) regions according to a structure or function. For example, in the embodiment shown in FIG. 2 , the region of the display 200 may be divided by the folding region 203 or the folding axis A extending parallel to the y-axis, but in another embodiment, the display 200 ) may be divided based on another folding area (eg, a folding area parallel to the x-axis) or another folding axis (eg, a folding axis parallel to the x-axis).

The first area 201 and the second area 202 may have an overall symmetrical shape with respect to the folding area 203 . However, unlike the first region 201 , the second region 202 may include a cut notch according to the presence of the sensor region 324 , but in other regions, the first region 201 may include the first region 201 . The region 201 may have a symmetrical shape. In other words, the first region 201 and the second region 202 may include a portion having a shape symmetrical to each other and a portion having a shape asymmetric to each other.

Hereinafter, the operation of the first housing structure 310 and the second housing structure 320 and the display 200 according to the state of the electronic device 101 (eg, a flat state and a folded state) Describe each area of

In an embodiment, when the electronic device 101 is in a flat state (eg, FIG. 2 ), the first housing structure 310 and the second housing structure 320 form an angle of about 180 degrees and are in the same direction. It can be arranged to face. The surface of the first area 201 and the surface of the second area 202 of the display 200 form about 180 degrees with each other and may face the same direction (eg, the front direction of the electronic device). The folding area 203 may form the same plane as the first area 201 and the second area 202 .

In an embodiment, when the electronic device 101 is in a folded state (eg, FIG. 3 ), the first housing structure 310 and the second housing structure 320 may be disposed to face each other. The surface of the first area 201 and the surface of the second area 202 of the display 200 may face each other while forming a narrow angle (eg, between 0 and 10 degrees). At least a portion of the folding area 203 may be formed of a curved surface having a predetermined curvature.

In an embodiment, when the electronic device 101 is in a half folded state, the first housing structure 310 and the second housing structure 320 may be disposed at a certain angle to each other. have. The surface of the first region 201 and the surface of the second region 202 of the display 200 may form an angle greater than that in the folded state and smaller than that of the unfolded state. At least a portion of the folding area 203 may be formed of a curved surface having a predetermined curvature, and the curvature at this time may be greater than that in a folded state. However, the present invention is not limited thereto, and at least a portion of the folding area 203 may be formed of a curved surface having a predetermined curvature, and the curvature may be smaller than that in a folded state.

4 is a diagram illustrating an electronic device 400 (eg, the electronic device 101 of FIG. 2 ) according to various embodiments of the present disclosure.

Referring to FIG. 4 , an electronic device 400 (eg, the electronic device 101 of FIG. 2 ) according to various embodiments of the present disclosure may be a foldable device. The electronic device 400 may include a hinge structure 480 disposed in a fold position. For example, the electronic device 400 may be folded or unfolded in the y-axis direction based on the fold position (eg, the x-axis) using the hinge structure 480 . The electronic device 400 (eg, the electronic device 101 of FIG. 2 ) has a first portion 401 and a second portion of the electronic device 400 (eg, the electronic device 101 of FIG. 2 ) based on a folded position when folded. Portions 402 may be adjacent to each other facing each other.

According to an embodiment, the electronic device 400 is formed on the first part 401 , the second part 402 , the first circuit board 460 disposed on the first part 401 , and the second part 402 . It may include an arranged second circuit board 470 , a plurality of antenna modules, and a flexible printed circuit board 500 (eg, a flexible printed circuit board type RF cable (FRC)). A modem 466 , a transceiver 468 , and a plurality of front-end modules 467 may be disposed on the first circuit board 460 . An antenna feeding unit 472 connected to at least one antenna module may be disposed on the second circuit board 470 . The flexible circuit board 500 may electrically connect the first circuit board 460 of the first part 401 and the second circuit board 470 of the second part 402 .

The plurality of antenna modules include a first antenna module 410 (first main antenna module), a second antenna module 415, a second main antenna module, a third antenna module 420, a sub-first antenna module), and a fourth antenna module (425, eg: sub 2 antenna module), fifth antenna module 430 (eg, sub 3 antenna module), sixth antenna module (435, eg: sub 4 antenna module), seventh antenna module 440, eg: 5 sub antenna module), an eighth antenna module 445 (eg, a sub 6 antenna module), a first WiFi antenna module 450 , and a second WiFi antenna module 455 . According to an embodiment, the Wi-Fi module is a Wi-Fi circuit supporting Wi-Fi communication as an example, but is not limited thereto. For example, it may include a Bluetooth circuit supporting Bluetooth communication.

5 is a diagram illustrating a flexible printed circuit board 500 (eg, a flexible printed circuit board type RF cable (FRC)) according to various embodiments of the present disclosure.

4 and 5 , the flexible circuit board 500 (eg, FRC) may include a first connector 501 , a second connector 502 , and wiring units 510 and 520 . The wiring units 510 and 520 include a first region 510 (eg, a bent portion) that is bent by folding and unfolding of the electronic device (eg, the electronic device 101 of FIG. 2 and the electronic device 400 of FIG. 4 ). and a second region 520 that is not bent (eg, a non-bend portion). As an example, the flexible circuit board 500 (eg, FRC) is manufactured to correspond to a fold position of an electronic device (eg, the electronic device 101 of FIG. 2 and the electronic device 400 of FIG. 4 ). One region 510 (eg, a curved portion) may be formed.

As an example, when the electronic device 400 is in a folded state, the first part 401 and the second part 402 may be adjacent to or in contact with each other based on a fold position. In order to prevent the flexible printed circuit board 500 from being damaged or disconnected at the portion where the electronic device 400 is folded (eg, a folded position), the first region 510 of the flexible printed circuit board 500 is the portion where the electronic device 400 is folded. (eg fold position). For example, the first region 510 of the flexible printed circuit board 500 may be disposed to at least overlap the hinge structure 480 .

Also, when the electronic device 400 is in an unfolded state, the first part 401 and the second part 402 may be unfolded based on a fold position to be spaced apart from each other. To prevent the flexible printed circuit board 500 from being damaged or disconnected at a portion where the electronic device 400 is folded and then unfolded (eg, a folded position), the first region 510 of the flexible printed circuit board 500 is formed in the electronic device 400 . ) may be disposed on the unfolding part (eg, the fold position). For example, the first region 510 of the flexible printed circuit board 500 may be disposed to at least overlap the hinge structure 480 .

According to one embodiment, the flexible circuit board 500 (eg, FRC) may be formed to a thickness of about 50 ~ 70um. As an example, the first region 510 (eg, a curved portion) and the second region 520 (eg, a non-curved portion) may be formed to have substantially the same thickness. As an example, the first region 510 (eg, a curved portion) and the second region 520 (eg, a non-curved portion) may be formed to have different thicknesses.

According to an embodiment, a first connector 501 connected to the connector 462 of the first circuit board 460 may be formed on the first side of the flexible circuit board 500 (eg, FRC). A second connector 502 connected to the connector 464 of the second circuit board 470 may be formed on the second side of the flexible circuit board 500 (eg, FRC). The first circuit board 460 of the first part 401 and the second circuit board 470 of the second part 402 may be electrically connected by the flexible circuit board 500 (eg, FRC). The control signal and/or RF signal may be transmitted/received between the first part 401 and the second part 402 by the flexible circuit board 500 (eg, FRC).

6 is a diagram illustrating a flexible circuit board 600 according to various embodiments of the present disclosure. 7 is a view illustrating an air pocket 618 formed in the flexible printed circuit board 600 according to various embodiments of the present disclosure. 8A is a diagram illustrating a cross-section of a flexible printed circuit board 600 according to various embodiments of the present disclosure. FIG. 8A shows a cross-section of the flexible printed circuit board 600 taken along the line I-I' shown in FIG. 6 . The flexible printed circuit board 600 (eg, the flexible printed circuit board 500 of FIG. 5 ) according to various embodiments may include all or part of the configuration and/or functions of the flexible printed circuit board 500 of FIGS. 4 and 5 . can

6 to 8A , the flexible printed circuit board 600 (eg, the flexible printed circuit board 500 of FIG. 5 ) according to various embodiments of the present disclosure includes a dielectric layer 610 and a first conductive layer 620 ( For example, an RF signal wire), and a second conductive layer 630 (for example, a ground wire) may be included.

According to an embodiment, the dielectric layer 610 may be composed of a single layer or a plurality of layers. As an example, the dielectric layer 610 may include a first dielectric layer 612 , a second dielectric layer 614 , and a third dielectric layer 616 .

As an example, the first dielectric layer 612 , the second dielectric layer 614 , and/or the third dielectric layer 616 may be formed of polyimide (PI).

As an example, the second dielectric layer 614 may be disposed under the first dielectric layer 612 . A third dielectric layer 616 may be disposed on the first dielectric layer 612 .

As an example, the first dielectric layer 612 and the second dielectric layer 614 may be formed to have different thicknesses. As an example, the first dielectric layer 612 and the third dielectric layer 616 may be formed to have different thicknesses. As an example, the first dielectric layer 612 may be formed to be thicker than the second dielectric layer 614 and/or the third dielectric layer 616 . As an example, the second dielectric layer 614 and the third dielectric layer 616 may be formed to have substantially the same thickness. The present invention is not limited thereto, and the second dielectric layer 614 and the third dielectric layer 616 may be formed to have different thicknesses. The present invention is not limited thereto, and the first dielectric layer 612 , the second dielectric layer 614 , and the third dielectric layer 616 may be formed to have substantially the same thickness.

As an example, the first dielectric layer 612 , the second dielectric layer 614 , and the third dielectric layer 616 may be bonded to form one dielectric layer 610 .

As an example, the dielectric layer 610 may include a plurality of air pockets 618 . Specifically, a plurality of air pockets 618 may be formed in the first dielectric layer 612 . The plurality of air pockets 618 may be uniformly formed over the entire area of the flexible printed circuit board 600 . However, the present invention is not limited thereto, and the plurality of air pockets 618 may be formed non-uniformly over the entire area of the flexible printed circuit board 600 .

A plurality of air pockets 618 may be formed by about 30 to 70% of the total area of the flexible printed circuit board 600 . When the plurality of air pockets 618 are formed, elasticity and/or repulsive force of the flexible printed circuit board 600 may be improved, thereby improving flexural properties. It is possible to prevent the flexible printed circuit board 600 from being damaged even when the electronic device is folded and unfolded (eg, opened and closed) due to the improved bending characteristics. Here, the rigidity may be weakened due to the formation of the plurality of air pockets 618 . The second dielectric layer 614 is disposed under the first dielectric layer 612 , and the first dielectric layer 612 is disposed on the upper portion of the first dielectric layer 612 . The third dielectric layer 616 may be disposed to reinforce the rigidity of the flexible printed circuit board 600 .

As an example, the plurality of air pockets 618 may have a first width w1 and may be formed to have substantially the same height h1 as the first dielectric layer 612 .

As an example, the plurality of air pockets 618 may be formed to have a cylindrical cross-section.

As an example, a plurality of holes are formed by drilling the first dielectric layer 612 in a first direction (eg, a z-axis direction) through a micro-drill and/or a laser, and the plurality of holes are formed in the second dielectric layer 614 , and A plurality of air pockets 618 may be formed by sealing with the third dielectric layer 616 .

As an example, when the plurality of air pockets 618 are formed with a laser, the plurality of air pockets 618 may be formed to have a width of about 50 μm to 100 μm.

As an example, when the plurality of air pockets 618 are formed with a micro drill, the plurality of air pockets 618 may be formed to have a width of about 100 to 300 μm.

According to an embodiment, a first conductive layer 620 (eg, an RF signal line) may be disposed on the dielectric layer 610 . As an example, a first conductive layer 620 (eg, an RF signal line) may be disposed on the third dielectric layer 616 . The first conductive layer 620 (eg, RF signal wiring) may include one material or an alloy including at least two of copper (Cu), aluminum (Al), silver (Ag), and/or gold (Au). can be formed with It is not limited thereto, and the dielectric layer 610 may include a region in which the first conductive layer 620 is disposed on the third dielectric layer 616 and a region in which the first conductive layer 620 is not disposed on the third dielectric layer 616 . Other areas may be included.

According to an embodiment, a second conductive layer 630 (eg, a ground wire) may be disposed under the dielectric layer 610 . As an example, a second conductive layer 630 (eg, a ground wire) may be disposed under the second dielectric layer 614 . The second conductive layer 630 (eg, a grounded wiring) may include one material or an alloy including at least two of copper (Cu), aluminum (Al), silver (Ag), and/or gold (Au). can be formed with

As an embodiment, although not shown in FIG. 8A , a coverlay may be disposed above the first conductive layer 620 and below the second conductive layer 630 .

As an example, the flexible circuit board 600 according to an embodiment of the present disclosure includes a dielectric layer 610 , a plurality of air pockets 618 , a first conductive layer 620 , and a second conductive layer 630 . It may include a flexible copper clad laminate (FCCL) signal line that includes.

As an example, as an example, the flexible printed circuit board 600 according to an embodiment of the present disclosure includes a dielectric layer 610 , a plurality of air pockets 618 , a first conductive layer 620 , and a second conductive layer. It may include an about 50 ohm (ohm) transmission line (eg, a co-planar wave guide (CPW), or a strip line) including the 630 .

8B is a diagram illustrating a cross-section of a flexible printed circuit board 600 according to various embodiments of the present disclosure. FIG. 8B shows a cross-section of the flexible printed circuit board 600 taken along the line I-I' shown in FIG. 6 .

Referring to FIG. 8B , for bonding of the first dielectric layer 612 , the second dielectric layer 614 , and the third dielectric layer 616 during the manufacturing process of the dielectric layer 610 , the polyimide (PI) is subjected to a predetermined process. do. The shape of the polyimide PI may be deformed so that upper and lower portions of the plurality of air pockets 619 having a cylindrical shape have a predetermined curvature during a predetermined process. Through this, a plurality of air pockets 619 may be formed so that the upper and lower portions have a cylindrical shape having a predetermined curvature.

9 is a diagram illustrating an arrangement structure of an air pocket 918 formed on a flexible printed circuit board 900 according to various embodiments of the present disclosure.

Referring to FIG. 9 , the flexible printed circuit board 900 (eg, the flexible printed circuit board 500 of FIG. 5 ) according to various embodiments of the present disclosure includes a dielectric layer 910 , a plurality of air pockets 918 , and a first It may include a conductive layer 920 (eg, an RF signal wiring) and a second conductive layer (eg, the second conductive layer 630 of FIG. 6 ) (eg, a ground wiring).

According to an embodiment, the plurality of air pockets 918 may include a plurality of first air pockets 918a and a plurality of second air pockets 918b having substantially the same shape and/or area. . The plurality of first air pockets 918a and the plurality of second air pockets 918b may be formed to have substantially the same first width w1 when viewed from above.

As an example, the plurality of first air pockets 918a and second air pockets 918b may be formed in a circular shape when viewed from above, and a cross-section may be formed in a cylindrical shape.

As an example, the plurality of first air pockets 918a and second air pockets 918b are formed in an oval, rectangular, or square shape when viewed from above, and have a cylindrical or quadrangular cross-section, the upper and lower portions are constant. It may be formed in the shape of an arch-shaped column of curvature.

As an example, since the shape of the air pockets 918 may vary, the shape when viewed from above is not limited to a circular, oval, rectangular, or square shape, and the shape of the cross-section is a cylinder or a square pillar, an upper and the lower part are not limited to the arch-shaped column shape of a certain curvature.

As an example, at least a portion of the plurality of first air pockets 918a may be disposed so as not to overlap the first conductive layer 920 .

As an example, at least a portion of the plurality of second air pockets 918b may be disposed to overlap the first conductive layer 920 .

10 is a diagram illustrating an arrangement structure of an air pocket 1018 formed in the flexible printed circuit board 1000 according to various embodiments of the present disclosure.

Referring to FIG. 10 , the flexible printed circuit board 1000 (eg, the flexible printed circuit board 500 of FIG. 5 ) according to various embodiments of the present disclosure includes a dielectric layer 1010 , a plurality of air pockets 1018 , and a first It may include a conductive layer 1020 (eg, an RF signal wire) and a second conductive layer (eg, the second conductive layer 630 of FIG. 6 ) (eg, a ground wire).

According to an embodiment, the plurality of air pockets 1018 may include a plurality of first air pockets 1018a and a plurality of second air pockets 1018b having different shapes and/or areas. The plurality of first air pockets 1018a may be formed to have a first width w1 when viewed from above. The plurality of second air pockets 1018b may be formed to have a second width w2 wider than the first width w1 when viewed from above.

As an example, the plurality of first air pockets 1018a may be formed in a circular shape when viewed from above, and may have a cylindrical cross-section.

As an example, the plurality of second air pockets 1018b are formed in an oval, rectangular, or square shape when viewed from above, and have a cross-section of a cylinder or a square pillar, and an arch-shaped pillar having a certain curvature at the top and bottom. can be formed.

As an example, since the shape of the air pockets 1018 may be varied, the shape when viewed from above is not limited to a circular, oval, rectangular, or square shape, and the shape of the cross-section is a cylinder or a square pillar, an upper and the lower part are not limited to the arch-shaped column shape of a certain curvature.

As an example, at least a portion of the plurality of first air pockets 1018a may be disposed so as not to overlap the first conductive layer 1020 .

As an example, at least a portion of the plurality of second air pockets 1018b may be disposed to overlap the first conductive layer 1020 .

11 is a diagram illustrating an arrangement structure of an air pocket 1118 formed on a flexible printed circuit board 1100 according to various embodiments of the present disclosure.

Referring to FIG. 11 , the flexible printed circuit board 1100 (eg, the flexible printed circuit board 500 of FIG. 5 ) according to various embodiments of the present disclosure includes a dielectric layer 1110 , a plurality of air pockets 1118 , and a first It may include a conductive layer 1120 (eg, an RF signal wire) and a second conductive layer (eg, the second conductive layer 630 of FIG. 6 ) (eg, a ground wire).

According to an embodiment, the plurality of air pockets 1118 may be formed to have substantially the same shape and area. The plurality of air pockets 1118 may be formed to have substantially the same first width w1 when viewed from above.

As an example, the plurality of air pockets 1118 may be formed in a circular shape when viewed from above, and a cross-section may be formed in a cylindrical shape.

As an example, the plurality of air pockets 1118 are formed in an elliptical, rectangular, or square shape when viewed from above, a cross-section of a cylinder or a square pillar, and the upper and lower portions of the air pockets 1118 are formed in the shape of an arch-shaped column of a certain curvature. can

As an example, since the shape of the air pockets 1118 may vary, the shape when viewed from above is not limited to a circular, oval, rectangular, or square shape, and the shape of the cross-section is a cylinder or a square pillar, an upper portion and the lower part are not limited to the arch-shaped column shape of a certain curvature.

As an example, the plurality of air pockets 1118 may be disposed so as not to overlap the first conductive layer 1120 . For example, the plurality of air pockets 1118 may not be formed under the first conductive layer 1120 .

12 is a diagram illustrating an arrangement structure of an air pocket 1218 formed on a flexible printed circuit board 1200 according to various embodiments of the present disclosure.

Referring to FIG. 12 , the flexible printed circuit board 1200 (eg, the flexible printed circuit board 500 of FIG. 5 ) according to various embodiments of the present disclosure includes a dielectric layer 1210 , a plurality of air pockets 1218 , and a first It may include a conductive layer 1220 (eg, an RF signal wire) and a second conductive layer (eg, the second conductive layer 630 of FIG. 6 ) (eg, a ground wire).

According to an embodiment, the plurality of air pockets 1218 may be formed to have substantially the same shape and/or area. The plurality of air pockets 1218 may be formed to have substantially the same third width w3 when viewed from above. Here, the third width w3 may be narrower than the first width w1 of the plurality of air pockets 1118 illustrated in FIG. 11 .

As an example, the plurality of air pockets 1218 may be formed in a circular shape when viewed from above, and may have a cylindrical cross-section.

As an example, the plurality of air pockets 1218 are formed in an oval, rectangular, or square shape when viewed from above, and are formed in the shape of a cylindrical or rectangular column in cross section, and an arch-shaped column in which the upper and lower portions have a certain curvature. can be

As an example, since the shape of the air pockets 1218 may be varied, the shape when viewed from above is not limited to a circular, oval, rectangular, or square shape, and the shape of the cross-section is a cylinder or a square pillar, an upper and the lower part are not limited to the arch-shaped column shape of a certain curvature.

As an example, the plurality of air pockets 1218 may be disposed so as not to overlap the first conductive layer 1220 . For example, the plurality of air pockets 1218 may not be formed under the first conductive layer 1220 .

Dk = 3.0 to 4.0 of a general dielectric, and Df = 0.03 to 0.004, which is close to Dk = 1 and Df = 0 of air. A plurality of air pockets (eg, in FIG. 8A ) in a dielectric layer (eg, the dielectric layer 610 of FIG. 6 ) like the flexible circuit board (eg, the flexible circuit board 600 of FIG. 6 ) according to various embodiments of the present disclosure By forming the air pockets 618 and the air pockets 619 of FIG. 8B ), the average dielectric constant Dk and/or the loss Df of the flexible printed circuit board 600 may be lowered. Due to the lowered dielectric losses Dk and Df, it is possible to form a wide line width of the wiring in a condition of about 50 ohms, and thus conductor loss may be improved.

In one embodiment, a plurality of air pockets 618 , 619 , 918 , 1018 , 1118 , 1218 are formed in the dielectric layers 610 , 910 , 1010 , 1110 , and 1210 , so that the flexible circuit boards 500 , 600 , 900 , The modulus of elasticity of 1000, 1100, and 1200 may be lowered, for example, elasticity and repulsive force may be lowered, thereby improving flexural properties.

13A to 13E are views illustrating a method of manufacturing a flexible printed circuit board according to various embodiments of the present disclosure;

Referring to FIG. 13A , the first dielectric layer 612 may be formed of a dielectric material (eg, polyimide). A plurality of holes 618a may be formed by drilling the first dielectric layer 612 in a first direction (eg, a z-axis direction) through a micro-drill or laser.

Referring to FIG. 13B , a first dielectric film 614a (eg, a polyimide film) may be disposed under the first dielectric layer 612 . Here, for bonding of the first dielectric film 614a (eg, polyimide film) of the dielectric layer 612 , the first dielectric layer 612 and the first dielectric film 614a (eg, polyimide film) are interposed between the first dielectric film 614a (eg, polyimide film). An adhesive layer 613 may be disposed.

Referring to FIG. 13C , a second dielectric film 616a (eg, a polyimide film) may be disposed on the first dielectric layer 612 . Here, for bonding the first dielectric layer 612 and the second dielectric film 616a (for example, a polyimide film), the second dielectric layer 612 and the second dielectric film 616a (for example, a polyimide film) are disposed between the second dielectric layer 612 and the second dielectric film 616a (for example, a polyimide film). An adhesive layer 615 may be disposed.

Referring to FIG. 13D , heat and/or pressure is applied to the first dielectric layer 612 , the first dielectric film 614a (eg, a polyimide film), and the second dielectric film 616a (eg, a polyimide film). to form a second dielectric layer 614 on a lower portion of the first dielectric layer 612 (eg, in the -z-axis direction) and a third dielectric layer 616 on an upper portion of the first dielectric layer 612 (eg, in the z-axis direction). can form.

As an example, a plurality of air pockets 618 may be formed in the first dielectric layer 612 by sealing the plurality of holes 618a with the second dielectric layer 614 and the third dielectric layer 616 .

As an embodiment, the plurality of air pockets 618 may be formed substantially uniformly over the entire area of the flexible printed circuit board 600 . However, the present invention is not limited thereto, and the plurality of air pockets 618 may be formed non-uniformly over the entire area of the flexible printed circuit board 600 .

As an example, the plurality of air pockets 618 may have a first width and may be formed to have substantially the same height as the first dielectric layer 612 .

As an example, the plurality of air pockets 618 may be formed to have a cylindrical cross-section.

As an example, when forming a plurality of air pockets 618 by drilling a plurality of holes (eg, a plurality of holes 618a in FIG. 13A ) with a laser, the plurality of air pockets 618 is about 50 μm to 100 μm. may be formed to have a width of

As an example, in the case of forming a plurality of air pockets 618 by drilling a plurality of holes (eg, a plurality of holes 618a in FIG. 13A ) with a micro-drill, the plurality of air pockets 618 is about 100~ It may be formed to have a width of 300um.

According to an embodiment, the dielectric layer 610 is composed of a first dielectric layer 612, a second dielectric layer 614, and a third dielectric layer 616, but a first dielectric layer 612, a second dielectric layer 614, and the third dielectric layer 616 may be formed and bonded with the same material to constitute a single layer.

As an example, when the first dielectric layer 612 , the second dielectric layer 614 , and the third dielectric layer 616 are formed of different materials from each other, the first dielectric layer 612 , the second dielectric layer 612 constituting the dielectric layer 610 , the second The dielectric layer 614 and the third dielectric layer 616 may be divided into different layers.

Referring to FIG. 13E , a first conductive layer 620 (eg, an RF signal line) may be formed on the dielectric layer 610 (eg, in the z-axis direction). As an example, the first conductive layer 620 (eg, RF signal wiring) may be formed on the third dielectric layer 616 (eg, in the z-axis direction). The first conductive layer 620 (eg, RF signal wiring) may include one material or an alloy including at least two of copper (Cu), aluminum (Al), silver (Ag), and/or gold (Au). can be formed with

According to an embodiment, the second conductive layer 630 (eg, a ground wire) may be formed under the dielectric layer 610 (eg, in the -z-axis direction). As an example, the second conductive layer 630 (eg, a ground wire) may be formed under the second dielectric layer 614 (eg, in the -z-axis direction). The second conductive layer 630 (eg, a grounded wiring) may include one material or an alloy including at least two of copper (Cu), aluminum (Al), silver (Ag), and/or gold (Au). can be formed with

As an embodiment, although not shown in the drawing, a coverlay may be formed on the upper portion of the first conductive layer 620 and the lower portion of the second conductive layer 630 .

A plurality of air pockets 618 may be formed by about 30 to 70% of the total area of the flexible printed circuit board 600 . When the plurality of air pockets 618 are formed, elasticity and/or repulsive force of the flexible printed circuit board 600 may be improved, thereby improving flexural properties. It is possible to prevent the flexible printed circuit board 600 from being damaged even when the electronic device is folded and unfolded (eg, opened and closed) due to the improved bending characteristics. Here, the rigidity may be weakened due to the formation of the plurality of air pockets 618 , and the second dielectric layer 614 is disposed under the first dielectric layer 612 (eg, in the -z-axis direction), and the second dielectric layer 614 is disposed. A third dielectric layer 616 may be disposed on the first dielectric layer 612 (eg, in the z-axis direction) to reinforce the rigidity of the flexible printed circuit board 600 .

14A to 14D are views illustrating a method of manufacturing a flexible printed circuit board according to various embodiments of the present disclosure.

Referring to FIG. 14A , the first dielectric layer 1412 may be formed of a dielectric material (eg, polyimide). A plurality of grooves 1418a may be formed by excavating the first dielectric layer 1412 by a predetermined depth in the first direction (eg, the z-axis direction) through a micro-drill or laser. Here, the plurality of grooves 1418a may be formed by digging a substantially constant depth in the first direction (eg, the z-axis direction) without penetrating the first dielectric layer 1412 and leaving a substantially constant thickness d. have.

Referring to FIG. 14B , a first dielectric film 1416a (eg, a polyimide film) may be disposed on the dielectric layer 612 (eg, in the z-axis direction). Here, for bonding the dielectric layer 1412 and the first dielectric film 1416a (eg, a polyimide film), a first adhesive layer ( 1415) can be placed.

Referring to FIG. 14C , heat and/or pressure is applied to the dielectric layer 1412 and the first dielectric film 1416a (eg, a polyimide film) to form a second layer on the first dielectric layer 1412 (eg, in the z-axis direction). Two dielectric layers 1416 may be formed.

As an example, a plurality of air pockets 1418 may be formed in the first dielectric layer 1412 by sealing the plurality of grooves 1418a with the second dielectric layer 1416 .

Referring to FIG. 14D , a first conductive layer 1420 (eg, an RF signal line) may be formed on the dielectric layer 1410 (eg, in the z-axis direction). As an example, the first conductive layer 1420 (eg, RF signal wiring) may be formed on the second dielectric layer 1416 (eg, in the z-axis direction). The first conductive layer 1420 (eg, RF signal wiring) may include one material or an alloy including at least two of copper (Cu), aluminum (Al), silver (Ag), and/or gold (Au). can be formed with

According to an embodiment, a second conductive layer 1430 (eg, a ground wire) may be formed under the dielectric layer 1410 (eg, in the -z-axis direction). The second conductive layer 1430 (eg, a ground wire) is formed of one material or an alloy including at least two materials of copper (Cu), aluminum (Al), silver (Ag), and/or gold (Au). can be formed.

As an embodiment, although not shown in the drawings, a coverlay may be formed on the upper portion of the first conductive layer 1420 and the lower portion of the second conductive layer 1430 .

As an embodiment, the plurality of air pockets 1418 may be formed substantially uniformly over the entire area of the flexible printed circuit board 1400 . However, the present invention is not limited thereto, and the plurality of air pockets 1418 may be formed non-uniformly over the entire area of the flexible printed circuit board 1400 .

As an example, the plurality of air pockets 1418 may have a first width w1 and may be formed to have a height h2 lower than a height h1 of the first dielectric layer 1412 .

As an example, the plurality of air pockets 1418 may be formed to have a cylindrical cross-section.

As an example, when a plurality of grooves (eg, a plurality of grooves 1418a of FIG. 14A ) are drilled with a laser to form a plurality of air pockets 1418, the plurality of air pockets 1418 are about 50 μm to 100 μm. may be formed to have a width of

As an example, in the case of forming a plurality of air pockets 1418 by drilling a plurality of grooves (eg, a plurality of grooves 1418a in FIG. 14A ) with a micro-drill, the plurality of air pockets 1418 is about 100~ It may be formed to have a width of 300um.

According to one embodiment, the dielectric layer 1410 is composed of the first dielectric layer 1412 and the second dielectric layer 1416, but the first dielectric layer 1412 and the second dielectric layer 1416 are formed and bonded with the same material to form a single It may consist of layers.

As an example, when the first dielectric layer 1412 and the second dielectric layer 1616 are formed of different materials, the first dielectric layer 1412 and the second dielectric layer 1416 constituting the dielectric layer 1410 are different layers from each other. may be divided into

A plurality of air pockets 1418 may be formed by about 30 to 70% of the total area of the flexible printed circuit board 1400 . When the plurality of air pockets 1418 are formed, elasticity and/or repulsive force of the flexible printed circuit board 1400 may be improved, so that bending characteristics may be improved. It is possible to prevent the flexible printed circuit board 1400 from being damaged even when the electronic device is folded and unfolded (eg, opened and closed) due to the improved bending characteristics. Here, the rigidity may be weakened due to the formation of the plurality of air pockets 1418 , and the second dielectric layer 1416 is disposed on the first dielectric layer 1412 (eg, in the z-axis direction), so that the flexible printed circuit board. The rigidity of (1400) can be reinforced.

15 is a view 1500 illustrating that transmission efficiency is improved when a flexible circuit board according to various embodiments of the present disclosure is applied to an electronic device.

15 , in a communication frequency band (eg, about 800 MHz to 20 GHz), the transmission efficiency 1510 of the flexible circuit board according to the embodiment of the present disclosure and the transmission efficiency of the comparative example (transmission line to which the air pocket is not applied) (1520) was compared. In the flexible circuit board according to an embodiment of the present disclosure, it can be seen that the transmission loss is improved by about 30% in the entire communication frequency band (eg, about 800 MHz to 20 GHz) compared to a general transmission line by including a plurality of air pockets.

The flexible circuit board according to various embodiments of the present disclosure may reduce transmission loss by forming an air pocket in a dielectric layer to lower a dielectric constant (Dk) and/or a dissipation factor (Df).

In the flexible printed circuit board according to an embodiment of the present disclosure, by including an air pocket in the dielectric layer, elasticity and/or repulsion are improved to improve flexural characteristics, and fold and unfold ( It can be prevented from being damaged even by opening/closing).

A flexible circuit board according to an embodiment of the present disclosure (eg, the flexible circuit board 600 of FIG. 6 , the flexible circuit board 900 of FIG. 9 , the flexible circuit board 1000 of FIG. 10 , the flexible circuit board of FIG. 11 ( 1100), the flexible circuit board 1200 of FIG. 12) includes a dielectric layer (eg, the dielectric layer 910 of FIG. 9, the dielectric layer 1010 of FIG. 10, and the dielectric layer 1210 of FIG. 12), the dielectric layer (eg, FIG. A first conductive layer (eg, the first conductive layer 620 of FIG. 6 ) disposed on top of the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ), the dielectric layer ( Example: a second conductive layer (eg, the second conductive layer 630 of FIG. 6 ) disposed under the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ); and a plurality of air pockets (eg, air pockets 618 of FIG. 8A ) formed in the dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ). may include

According to an embodiment, the dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ) may include the plurality of air pockets (eg, the air pocket of FIG. 8A ). (618)) disposed on a first dielectric layer (eg, first dielectric layer 612 in FIG. 8A), and a second dielectric layer disposed under the first dielectric layer (eg, first dielectric layer 612 in FIG. 8A)). (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ) and the first dielectric layer (eg, the first dielectric layer 612 of FIG. 8A ). a third dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ).

According to an embodiment, the second dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , the dielectric layer 1210 of FIG. 12 ) and the third dielectric layer (eg, the dielectric layer of FIG. 9 ) 910), the dielectric layer 1010 of FIG. 10, and the dielectric layer 1210 of FIG. 12) may seal the air pocket (eg, the air pocket 618 of FIG. 8A).

According to an embodiment, at least some of the plurality of air pockets (eg, the air pockets 618 of FIG. 8A ) overlap the second conductive layer (eg, the second conductive layer 630 of FIG. 6 ). can be placed.

According to an embodiment, the plurality of air pockets (eg, the air pockets 618 of FIG. 8A ) may be disposed not to overlap the second conductive layer (eg, the second conductive layer 630 of FIG. 6 ). have.

According to an embodiment, the plurality of air pockets (eg, the air pockets 618 of FIG. 8A ) may have the same shape.

According to an embodiment, the plurality of air pockets (eg, the air pockets 618 of FIG. 8A ) may be formed to have the same width when viewed from above.

According to an embodiment, the plurality of air pockets (eg, the air pockets 618 of FIG. 8A ) are a plurality of first air pockets (eg, the air pockets 618 of FIG. 8A ) having a first shape when viewed from above. )) and a plurality of second air pockets (eg, air pockets 618 of FIG. 8A ) having a second shape different from the first shape when viewed from above.

According to an embodiment, the plurality of first air pockets (eg, the air pockets 618 of FIG. 8A ) are disposed not to overlap the first conductive layer (eg, the first conductive layer 620 of FIG. 6 ). can be

According to an embodiment, the plurality of first air pockets (eg, the air pockets 618 of FIG. 8A ) may have a circular shape when viewed from above, and may have a cylindrical cross-section.

According to an embodiment, the plurality of second air pockets (eg, the air pockets 618 of FIG. 8A ) may be disposed to overlap the first conductive layer (eg, the first conductive layer 620 of FIG. 6 ). can

According to an embodiment, the plurality of second air pockets (eg, the air pockets 618 of FIG. 8A ) are formed in an elliptical, rectangular, or square shape when viewed from above, and have a cylindrical or quadrangular prism, upper and The lower portion may be formed in the shape of an arch-shaped column having a predetermined curvature.

According to an embodiment, the first conductive layer (eg, the first conductive layer 620 of FIG. 6 ) includes an RF signal wire for transmitting a radio frequency (RF) signal, and the second conductive layer (eg: The second conductive layer 630 of FIG. 6 may include a ground wire.

According to an embodiment, a first region (eg, the first region 510 of FIG. 5 ) that is curved according to the deformation of the shape of the electronic device, the first region (eg, the first region 510 of FIG. 5 ) It may include a second region (eg, the second region 520 of FIG. 5 ) positioned around the . The first portion and the second portion may be formed to have different thicknesses. The first area (eg, the first area 510 of FIG. 5 ) may at least partially overlap the folding position of the electronic device.

The electronic device (eg, the electronic device 101 of FIG. 2 and the electronic device 400 of FIG. 4 ) according to an embodiment of the present disclosure includes a flexible circuit board (eg, the flexible circuit board 600 of FIG. 6 , FIG. 9 ). In an electronic device including the flexible circuit board 900 of FIG. 10, the flexible circuit board 1000 of FIG. 10, the flexible circuit board 1100 of FIG. 11, and the flexible circuit board 1200 of FIG. 12), a hinge structure (eg, : The hinge structure 480 of FIG. 4) and the flexible display (eg, the display module 160 of FIG. 1, FIG. 2) folded or unfolded by the hinge structure (eg, the hinge structure 480 of FIG. 4) When folded by the display 200) and the hinge structure (eg, the hinge structure 480 of FIG. 4), face and close to each other, and when unfolded, the first part (eg, the first part ( 401)) and a second part (eg, the second part 402 of FIG. 4 ), and a first circuit board (eg, the first circuit board 401 of FIG. 4 ) disposed in the first part (eg, the first part 401 of FIG. 4 ) The first circuit board 460 of 4) and the second circuit board (eg, the second circuit board 470 of FIG. 4) disposed on the second part (eg, the second part 402 of FIG. 4)) and a flexible circuit board electrically connecting the first circuit board (eg, the first circuit board 460 of FIG. 4 ) and the second circuit board (eg, the second circuit board 470 of FIG. 4 ). (Example: The flexible circuit board 600 of FIG. 6 , the flexible circuit board 900 of FIG. 9 , the flexible circuit board 1000 of FIG. 10 , the flexible circuit board 1100 of FIG. 11 , the flexible circuit board of FIG. 12 ( 1200)) may be included. The flexible circuit board (eg, the flexible circuit board 600 of FIG. 6 , the flexible circuit board 900 of FIG. 9 , the flexible circuit board 1000 of FIG. 10 , the flexible circuit board 1100 of FIG. The flexible circuit board 1200) includes a dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ), and the dielectric layer (eg, the dielectric layer 910 of FIG. 9 ). ), a first conductive layer (eg, the first conductive layer 620 of FIG. 6 ) disposed on top of the dielectric layer 1010 of FIG. 10 and the dielectric layer 1210 of FIG. 12 ), and the dielectric layer (eg, FIG. 9 ) A second conductive layer (eg, the second conductive layer 630 of FIG. 6 ) disposed under the dielectric layer 910 of FIG. 10 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ) and the dielectric layer (eg : A plurality of air pockets (eg, air pockets 618 of FIG. 8A ) formed in the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ) may be included.

According to an embodiment, the dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ) may include the plurality of air pockets (eg, the air pocket of FIG. 8A ). (618)) disposed on a first dielectric layer (e.g., first dielectric layer 612 in Fig. 8A), a second dielectric layer (e.g., first dielectric layer 612 in Fig. 8A) disposed below the first dielectric layer (e.g., first dielectric layer 612 in Fig. 8A); Example: dielectric layer 910 of FIG. 9 , dielectric layer 1010 of FIG. 10 , dielectric layer 1210 of FIG. 12 ), and the first dielectric layer (eg, first dielectric layer 612 of FIG. 8A ) disposed on top A third dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , and the dielectric layer 1210 of FIG. 12 ) may be included.

According to an embodiment, the second dielectric layer (eg, the dielectric layer 910 of FIG. 9 , the dielectric layer 1010 of FIG. 10 , the dielectric layer 1210 of FIG. 12 ) and the third dielectric layer (eg, the dielectric layer of FIG. 9 ) 910), the dielectric layer 1010 of FIG. 10, and the dielectric layer 1210 of FIG. 12) may seal the air pocket (eg, the air pocket 618 of FIG. 8A).

According to an embodiment, at least some of the plurality of air pockets (eg, the air pockets 618 of FIG. 8A ) overlap the second conductive layer (eg, the second conductive layer 630 of FIG. 6 ). can be placed.

According to an embodiment, the plurality of air pockets (eg, the air pockets 618 of FIG. 8A ) may be disposed not to overlap the second conductive layer (eg, the second conductive layer 630 of FIG. 6 ). have.

600: flexible circuit board
610: dielectric layer
618: air pocket
620: first conductor layer
630: second conductor layer

Claims (20)

In the flexible circuit board,
dielectric layer;
a first conductive layer disposed on the dielectric layer;
a second conductive layer disposed under the dielectric layer; and
a plurality of air pockets formed in the dielectric layer;
flexible circuit board. The method according to claim 1,
The dielectric layer is
a first dielectric layer in which the plurality of air pockets are disposed;
a second dielectric layer disposed under the first dielectric layer; and
a third dielectric layer disposed on top of the first dielectric layer;
flexible circuit board. The method according to claim 1,
sealing the air pocket with the second dielectric layer and the third dielectric layer;
flexible circuit board. The method according to claim 1,
At least some of the plurality of air pockets are disposed to overlap the second conductive layer,
flexible circuit board. The method according to claim 1,
The plurality of air pockets are disposed so as not to overlap the second conductive layer,
flexible circuit board. The method according to claim 1,
The plurality of air pockets have the same shape,
flexible circuit board. 7. The method of claim 6,
The plurality of air pockets are formed to have the same width when viewed from above,
flexible circuit board. The method according to claim 1,
The plurality of air pockets,
a plurality of first air pockets having a first shape when viewed from above;
a plurality of second air pockets having a second shape different from the first shape when viewed from above;
flexible circuit board. 9. The method of claim 8,
The plurality of first air pockets are disposed not to overlap the first conductive layer,
flexible circuit board. 10. The method of claim 9,
The plurality of first air pockets are formed in a circular shape when viewed from above, and the cross section is formed in the shape of a cylinder,
flexible circuit board. 9. The method of claim 8,
wherein the plurality of second air pockets are disposed to overlap the first conductive layer;
flexible circuit board. 12. The method of claim 11,
The plurality of second air pockets are formed in an oval, rectangular, or square shape when viewed from above, and are formed in the shape of a cylindrical or rectangular column in cross section, and an arch-shaped column in which the upper and lower portions have a certain curvature,
flexible circuit board. 12. The method of claim 11,
The first conductive layer includes an RF signal wire for transmitting a radio frequency (RF) signal,
The second conductive layer includes a ground wire. 12. The method of claim 11,
a first region curved according to the deformation of the shape of the electronic device;
Including; a second area located on the periphery of the first area;
the first part and the second part are formed to have different thicknesses,
wherein the first area overlaps at least a portion of a folding position of the electronic device;
flexible circuit board. An electronic device including a flexible circuit board, comprising:
hinge structure;
a flexible display that is folded or unfolded by the hinge structure; and
a first part and a second part facing and close to each other when folded by the hinge structure and spaced apart from each other when unfolded;
a first circuit board disposed on the first part;
a second circuit board disposed on the second part;
a flexible circuit board electrically connecting the first circuit board and the second circuit board;
The flexible circuit board,
dielectric layer;
a first conductive layer disposed on the dielectric layer;
a second conductive layer disposed under the dielectric layer; and
a plurality of air pockets formed in the dielectric layer;
electronic device. 16. The method of claim 15,
The dielectric layer is
a first dielectric layer in which the plurality of air pockets are disposed;
a second dielectric layer disposed under the first dielectric layer; and
a third dielectric layer disposed on top of the first dielectric layer;
electronic device. 16. The method of claim 15,
sealing the air pocket with the second dielectric layer and the third dielectric layer;
electronic device. 16. The method of claim 15,
At least some of the plurality of air pockets are disposed to overlap the second conductive layer,
electronic device. 16. The method of claim 15,
The plurality of air pockets are disposed so as not to overlap the second conductive layer,
electronic device. 16. The method of claim 15,
The plurality of air pockets have the same shape,
electronic device.

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