KR20220069877A - Photocurable resin composition for electronic devices - Google Patents

Abstract

An object of this invention is to provide the photocurable resin composition for electronic devices which is excellent in applicability|paintability and sclerosis|hardenability, and has a low dielectric constant. This invention is a photocurable resin composition for electronic devices containing curable resin and a polymerization initiator, The said curable resin contains a monofunctional cationically polymerizable compound and a polyfunctional cationically polymerizable compound, The said monofunctional cation The polymerizable compound contains at least any one of a monofunctional aliphatic cationically polymerizable compound and a monofunctional cationically polymerizable compound having an optionally substituted phenoxy group, and the dielectric constant measured at 25 ° C. and 100 kHz is, It is the photocurable resin composition for electronic devices which are 3.5 or less.

Description

Photocurable resin composition for electronic devices

The present invention relates to a photocurable resin composition for electronic devices that is excellent in coating properties and curability and has a low dielectric constant.

In recent years, as a curable resin composition for electronic devices used for the adhesive agent for touch panels, the soldering resist for circuit boards, etc., it has a moderate viscosity, is excellent in applicability|paintability, and the material which has photocurability is calculated|required.

BACKGROUND ART Touch panels are used in electronic devices such as mobile phones, smart phones, car navigation systems, and personal computers. Among them, the capacitive touch panel is rapidly spreading because it is excellent in functionality.

Generally, a capacitive touch panel is comprised by laminating|stacking a cover panel, an adhesive bond layer, and a board|substrate. It is calculated|required by the said adhesive bond layer that it is excellent in transparency and adhesive force with respect to a to-be-adhered body. As such an adhesive bond layer, the adhesive layer containing the (meth)acrylic-type polymer obtained by superposing|polymerizing a specific monomer component is disclosed by patent document 1, for example.

On the other hand, a circuit board generally has a circuit by a wiring pattern formed on a base material made of an insulating material, and the outermost surface is coated with a protective film called a solder resist for the purpose of protection of the circuit, insulation from the outside of the circuit, etc. have. Moreover, when mounting a component or performing connection with respect to external wiring by using a soldering resist, the solder bridge which solder adheres between wiring and short-circuits can be prevented. Curable resin composition which has photosensitivity is used for a soldering resist, for example, in order to form a pattern as it is disclosed by patent document 2.

Japanese Patent Laid-Open No. 2014-034655 Japanese Patent Laid-Open No. Hei 08-259663

In recent years, in order not to reduce the response speed of a touchscreen with thickness reduction and enlargement of a capacitive touch panel, in curable resin composition used for the above-mentioned adhesive bond layer, a low dielectric constant, a low dielectric loss tangent and It is required to have the same dielectric properties.

On the other hand, the curable resin used for the curable resin composition as disclosed in Patent Document 2 has a polar group such as an acid group in order to impart photosensitivity, so that the dielectric constant and dielectric loss tangent are high, and as a result, a high-frequency voltage is applied to the circuit. There was a problem that propagation delay or signal loss occurred when applied to the . Moreover, as a method of forming a fine soldering resist pattern easily and efficiently, the method of forming a soldering resist pattern by a printing method is implemented, but the applicability|paintability suitable for the printing method by the conventional curable resin composition especially the inkjet method etc. is implemented. In the case of having a , there is a problem that it becomes difficult to lower the dielectric constant and the dielectric loss tangent.

An object of this invention is to provide the photocurable resin composition for electronic devices which is excellent in applicability|paintability and sclerosis|hardenability, and has a low dielectric constant.

This invention is a photocurable resin composition for electronic devices containing curable resin and a polymerization initiator, The said curable resin contains a monofunctional cationically polymerizable compound and a polyfunctional cationically polymerizable compound, The said monofunctional cation The polymerizable compound contains at least any one of a monofunctional aliphatic cationically polymerizable compound and a monofunctional cationically polymerizable compound having an optionally substituted phenoxy group, and the dielectric constant measured at 25 ° C. and 100 kHz is, It is the photocurable resin composition for electronic devices which are 3.5 or less.

Hereinafter, the present invention will be described in detail.

MEANS TO SOLVE THE PROBLEM The present inventors are excellent in applicability|paintability and sclerosis|hardenability and also have a low dielectric constant by using the monofunctional cationically polymerizable compound which has a specific structure, and polyfunctional cationically polymerizable compound in combination as curable resin. It discovered that the photocurable resin composition for fusion|melting was obtained, and came to complete this invention.

The photocurable resin composition for electronic devices of this invention contains curable resin.

The said curable resin contains a monofunctional cationically polymerizable compound.

The monofunctional cationically polymerizable compound is a monofunctional aliphatic cationically polymerizable compound, and a monofunctional cationically polymerizable compound having an optionally substituted phenoxy group (hereinafter, “phenoxy group-containing monofunctional cationically polymerizable compound”) ), including at least any of By containing at least any one of a monofunctional aliphatic cationically polymerizable compound and a phenoxy group-containing monofunctional cationically polymerizable compound as said monofunctional cationically polymerizable compound, the photocurable resin composition for electronic devices of this invention is apply|coating It is excellent in performance and also has a low dielectric constant.

The said monofunctional cationically polymerizable compound has one cationically polymerizable group in 1 molecule.

As a cationically polymerizable group which the said monofunctional cationically polymerizable compound has, an epoxy group, oxetanyl group, vinyl ether group, etc. are mentioned, for example. Especially, an epoxy group and oxetanyl group are preferable.

The said monofunctional aliphatic cationically polymerizable compound has an aliphatic skeleton.

The monofunctional aliphatic cationically polymerizable compound may have, as the aliphatic skeleton, only a linear or branched aliphatic skeleton, or may have a cyclic aliphatic skeleton.

In the said phenoxy group-containing monofunctional cationically polymerizable compound, as a substituent when the said phenoxy group is substituted, For example, a linear or branched C1-C18 alkyl group, a linear type or a branched chain alkenyl group having 2 or more and 18 or less carbon atoms.

Specifically, the said monofunctional cationically polymerizable compound is a compound represented by a following formula (1-1), a compound represented by a following formula (1-2), a compound represented by a following formula (1-3), a following formula ( A compound represented by 1-4), a compound represented by the following formula (1-5), a compound represented by the following formula (1-6), a compound represented by the following formula (1-7), a compound represented by the following formula (1-8) It is preferable to contain at least 1 sort(s) chosen from the group which consists of a compound and a compound represented by following formula (1-9).

[Formula 1]

The minimum with preferable content of the said monofunctional cationically polymerizable compound in 100 weight part of said curable resins is 20 weight part, and a preferable upper limit is 90 weight part. When content of the said monofunctional cationically polymerizable compound is this range, while maintaining the sclerosis|hardenability excellent in the photocurable resin composition for electronic devices obtained to be obtained, it is excellent in applicability|paintability and becomes a thing with a lower dielectric constant. A more preferable minimum of content of the said monofunctional cationically polymerizable compound is 30 weight part, and a more preferable upper limit is 70 weight part.

The said curable resin contains a polyfunctional cationically polymerizable compound.

By containing the said polyfunctional cationically polymerizable compound, the photocurable resin composition for electronic devices of this invention becomes the thing excellent in sclerosis|hardenability.

The said polyfunctional cationically polymerizable compound has a 2 or more cationically polymerizable group in 1 molecule.

As a cationically polymerizable group which the said polyfunctional cationically polymerizable compound has, the thing similar to the cationically polymerizable group which the above-mentioned monofunctional cationically polymerizable compound has is mentioned. Especially, an epoxy group and oxetanyl group are preferable.

The said polyfunctional cationically polymerizable compound is a polyfunctional alicyclic epoxy compound which does not have a silicone skeleton, since the photocurable resin composition for electronic devices obtained is a thing excellent in sclerosis|hardenability while maintaining a low dielectric constant, a silicone skeleton It is preferable to contain at least 1 sort(s) selected from the group which consists of a polyfunctional aliphatic glycidyl ether compound which does not have a polyfunctional aliphatic glycidyl ether compound, a polyfunctional oxetane compound which does not have a silicone skeleton, and a silicone compound which has two or more cationically polymerizable groups.

The polyfunctional alicyclic epoxy compound (hereinafter also simply referred to as a "polyfunctional alicyclic epoxy compound") which does not have the said silicone skeleton has an alicyclic epoxy group.

The said polyfunctional alicyclic epoxy compound may have two or more said alicyclic epoxy groups in 1 molecule, and may have one said alicyclic epoxy group and 1 or more non-alicyclic epoxy groups in 1 molecule.

As said alicyclic epoxy group, an epoxycyclohexyl group etc. are mentioned.

Specific examples of the polyfunctional alicyclic epoxy compound include a compound represented by the following formula (2-1), a compound represented by the following formula (2-2), a compound represented by the following formula (2-3); The compound represented by following formula (2-4), 1,2,8,9- diepoxylimonene, etc. are mentioned. Among them, the group consisting of a compound represented by the following formula (2-1), a compound represented by the following formula (2-2), a compound represented by the following formula (2-3), and a compound represented by the following formula (2-4) At least one selected from is preferable, a compound represented by the following formula (2-1) is more preferable, and 3,4,3',4'-diepoxybicyclohexane is still more preferable.

[Formula 2]

In formula (2-1), R ¹ to R ¹⁸ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may be the same as each other. , may be different.

In formula (2-2), R ¹⁹ to R ³⁰ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may be the same as each other. , may be different.

In formula (2-3), R ³¹ to R ⁴⁸ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may be the same as each other. , may be different.

In formula (2-4), R ⁴⁹ to R ⁶⁶ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may each be the same. , may be different.

The compound represented by the formula (2-1), the compound represented by the formula (2-2), the compound represented by the formula (2-3), and the compound represented by the formula (2-4) are, for example, Patent No. 5226162, Patent No. 5979631, etc. can be manufactured by the method disclosed.

As what is marketed among the compounds represented by the said Formula (2-1), Celoxide 8000 (made by Daicel) etc. is mentioned, for example.

As what is marketed among the compounds represented by said Formula (2-2), THI-DE (made by JXTG Energy Corporation) etc. are mentioned, for example.

As what is marketed among the compounds represented by the said Formula (2-3), DE-102 (made by JXTG Energy Corporation) etc. are mentioned, for example.

As what is marketed among the compounds represented by the said Formula (2-4), DE-103 (made by JXTG Energy Corporation) etc. are mentioned, for example.

The polyfunctional aliphatic glycidyl ether compound having no silicone skeleton (hereinafter also simply referred to as "polyfunctional aliphatic glycidyl ether compound") has an aliphatic skeleton.

The polyfunctional aliphatic glycidyl ether compound may have, as the aliphatic skeleton, only a linear or branched aliphatic skeleton, or may have a cyclic aliphatic skeleton.

Specific examples of the polyfunctional aliphatic glycidyl ether compound include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, cyclohexanedimethanol diglycidyl ether, Tricyclodecanediol diglycidyl ether etc. are mentioned.

Specific examples of the polyfunctional oxetane compound having no silicone skeleton (hereinafter also simply referred to as "polyfunctional oxetane compound") include, for example, 3-ethyl-3-(((3-ethyloxetane-3). -yl)methoxy)methyl)oxetane, 1,4-bis(((3-ethyloxetan-3-yl)methoxy)methyl)benzene, isophthalic acid bis((3-ethyloxetan-3-yl) ) methyl) and the like.

Examples of the silicone compound having two or more cationically polymerizable groups include a compound represented by the following formula (3), a compound represented by the following formula (4), and a compound represented by the following formula (5).

[Formula 3]

In formula (3), R ⁶⁷ each independently represents an alkyl group having 1 to 10 carbon atoms, R ⁶⁸ each independently represents a bond or an alkylene group having 1 to 6 carbon atoms, and X is an epoxy group The group containing the group, the group containing the oxetanyl group, or the group containing the vinyl ether group are shown, and n shows the integer of 0 or more and 1000 or less.

[Formula 4]

In formula (4), R ⁶⁹ each independently represents an alkyl group having 1 to 10 carbon atoms, R ⁷⁰ represents a bond or an alkylene group having 1 to 6 carbon atoms, R ⁷¹ is each independently, An alkyl group having 1 to 10 carbon atoms, a group containing an epoxy group, a group containing an oxetanyl group, or a group containing a vinyl ether group, X is a group containing an epoxy group, a group containing an oxetanyl group, or vinyl A group containing an ether group is shown. l represents an integer of 0 or more and 1000 or less, and m represents an integer of 1 or more and 100 or less. However, when R ⁷¹ is an alkyl group having 1 or more and 10 or less carbon atoms, m represents an integer of 2 or more and 100 or less.

[Formula 5]

In formula (5), R ⁷² each independently represents an alkyl group having 1 to 10 carbon atoms, a group containing an epoxy group, a group containing an oxetanyl group, or a group containing a vinyl ether group, among 2k R ⁷² , at least two R ⁷² represents a group containing an epoxy group, a group containing an oxetanyl group, or a group containing a vinyl ether group. k represents an integer of 3 or more and 6 or less.

As the group containing the epoxy group in X in the formula (3), R ⁷¹ and X in the formula (4), and R ⁷² in the formula (5), the following formula (6-1) or (6) The group represented by -2) is preferable.

As the group containing the oxetanyl group in X in the formula (3), R ⁷¹ and X in the formula (4), and R ⁷² in the formula (5), a group represented by the following formula (7) desirable.

As the group containing the vinyl ether group in X in the formula (3), R ⁷¹ and X in the formula (4), and R ⁷² in the formula (5), a group represented by the following formula (8) is preferable. do.

[Formula 6]

In formulas (6-1) and (6-2), R ⁷³ represents a bond or an alkylene group having 1 to 6 carbon atoms which may have a bond or an oxygen atom, and * represents a bonding position.

[Formula 7]

In formula (7), R ⁷⁴ represents a bond or an alkylene group having 1 to 6 carbon atoms which may have a bond or an oxygen atom, R ⁷⁵ represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and * is , indicates the binding position.

[Formula 8]

In formula (8), R ⁷⁶ represents a bond or an alkylene group having 1 to 6 carbon atoms which may have an oxygen atom, and * represents a bonding position.

The said polyfunctional cationically polymerizable compound is the compound represented by the said Formula (2-1), the compound represented by the said Formula (2-2), the compound represented by the said Formula (2-3), the said Formula (2-4) It is preferable to contain at least 1 sort(s) selected from the group which consists of a compound represented by, the compound represented by said Formula (3), the compound represented by said Formula (4), and the compound represented by said Formula (5). In particular, since the photocurable resin composition for electronic devices obtained can make a dielectric constant more low, and also become a thing excellent also in low outgassing property, the said polyfunctional cationically polymerizable compound is represented by said Formula (3) It is preferable to contain at least 1 sort(s) selected from the group which consists of a compound, the compound represented by the said Formula (4), and the said Formula (5).

The minimum with preferable content of the said polyfunctional cationically polymerizable compound in 100 weight part of said curable resins is 10 weight part, and a preferable upper limit is 80 weight part. When content of the said polyfunctional cationically polymerizable compound is this range, sclerosis|hardenability becomes more excellent, maintaining the outstanding applicability|paintability and low dielectric constant of the photocurable resin composition for electronic devices obtained. A more preferable minimum of content of the said polyfunctional cationically polymerizable compound is 30 weight part, and a more preferable upper limit is 70 weight part.

The ratio of the monofunctional cationically polymerizable compound to the polyfunctional cationically polymerizable compound (monofunctional cationically polymerizable compound: polyfunctional cationically polymerizable compound) is, by weight, 1:9 to 9:1 desirable. When the ratio of the monofunctional cationically polymerizable compound and the polyfunctional cationically polymerizable compound is within this range, the resulting resin composition for electronic devices maintains a low dielectric constant while suppressing damage to members, etc. and generation of outgas, It becomes more excellent in reliability. As for the ratio of the said monofunctional cationically polymerizable compound and the said polyfunctional cationically polymerizable compound, it is more preferable that it is 3:7-7:3.

The said curable resin, in addition to the said monofunctional cationically polymerizable compound and the said polyfunctional cationically polymerizable compound, for the purpose of the improvement of applicability|paintability by viscosity adjustment, etc., in the range which does not impair the objective of this invention, You may contain outside curable resin.

As said other curable resin, a (meth)acrylic compound etc. are mentioned.

In addition, in this specification, the said "(meth)acryl" means acryl or methacryl, "(meth)acryl compound" means a compound having a (meth)acryloyl group, and "(meth)acryl" "loyl" means acryloyl or methacryloyl.

Examples of the (meth)acrylic compound include glycidyl (meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and dicyclo Pentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, benzyl (meth) acrylate, trimethylolpropane tri (meth) arylate, 1,12- dodecanediol di(meth)acrylate, lauryl (meth)acrylate, (meth)acrylic modified silicone oil, etc. are mentioned.

These (meth)acryl compounds may be used independently and may be used in combination of 2 or more type.

In addition, in this specification, the said "(meth)acrylate" means an acrylate or a methacrylate.

The minimum with preferable content of the said other curable resin in 100 weight part of said curable resins is 5 weight part, and a preferable upper limit is 30 weight part. When content of said other curable resin is this range, the effect of improving applicability|paintability becomes more excellent, without worsening the dielectric characteristic of the photocurable resin composition for electronic devices obtained etc. A more preferable minimum of content of said other curable resin is 10 weight part, and a more preferable upper limit is 20 weight part.

The photocurable resin composition for electronic devices of this invention contains a polymerization initiator.

As said polymerization initiator, a photocationic polymerization initiator is used preferably. Moreover, when containing the said (meth)acrylic resin as said other curable resin, you may use together the said photocationic polymerization initiator and an optical radical polymerization initiator as said polymerization initiator. Moreover, you may use a thermal cationic polymerization initiator and a thermal radical polymerization initiator in the range which does not impair the objective of this invention.

The said photocationic polymerization initiator will not be specifically limited if it generate|occur|produces a protonic acid or a Lewis acid by light irradiation, An ionic photo-acid generating type may be sufficient, and a nonionic photo-acid generating type may be sufficient as it.

As the anion moiety of the photocationic polymerization initiator of the ionic photoacid generating type, for example, BF ₄ ^- , PF ₆ ^- , SbF ₆ ^- , (BX ₄ ) ^- (provided that X is at least two or more represents a phenyl group substituted with a fluorine or trifluoromethyl group); and the like. Examples of the anion moiety include PF _m (C _n F _2n+1 ) _6-m ^- (provided that m is an integer of 0 or more and 5 or less, and n is an integer of 1 or more and 6 or less).

As said ionic photo-acid generating type photocationic polymerization initiator, For example, the aromatic sulfonium salt, aromatic iodonium salt, aromatic diazonium salt, aromatic ammonium salt, (2,4-cyclopentadiene which has the said anion moiety) -1-yl)((1-methylethyl)benzene)-Fe salt and the like.

Examples of the aromatic sulfonium salt include bis(4-(diphenylsulfonio)phenyl)sulfidebishexafluorophosphate, bis(4-(diphenylsulfonio)phenyl)sulfidebishexafluoro Rhoantimonate, bis(4-(diphenylsulfonio)phenyl)sulfidebistetrafluoroborate, bis(4-(diphenylsulfonio)phenyl)sulfidetetrakis(pentafluorophenyl)borate , Diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- (phenylthio) phenylsulfonium hexafluoroantimonate, diphenyl-4- (phenylthio) phenylsulfonium tetra Fluoroborate, diphenyl-4-(phenylthio)phenylsulfoniumtetrakis(pentafluorophenyl)borate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium Tetrafluoroborate, triphenylsulfoniumtetrakis(pentafluorophenyl)borate, bis(4-(di(4-(2-hydroxyethoxy))phenylsulfonio)phenyl)sulfidebishexafluoro Phosphate, bis(4-(di(4-(2-hydroxyethoxy))phenylsulfonio)phenyl)sulfidebishexafluoroantimonate, bis(4-(di(4-(2-hydroxyl) Roxyethoxy))phenylsulfonio)phenyl)sulfidebistetrafluoroborate, bis(4-(di(4-(2-hydroxyethoxy))phenylsulfonio)phenyl)sulfidetetrakis( pentafluorophenyl) borate, tris(4-(4-acetylphenyl)thiophenyl)sulfoniumtetrakis(pentafluorophenyl)borate, etc. are mentioned.

Examples of the aromatic iodonium salt include diphenyl iodonium hexafluorophosphate, diphenyl iodonium hexafluoroantimonate, diphenyl iodonium tetrafluoroborate, diphenyl iodonium tetrakis (pentafluoro Phenyl) borate, bis(dodecylphenyl)iodonium hexafluorophosphate, bis(dodecylphenyl)iodonium hexafluoroantimonate, bis(dodecylphenyl)iodoniumtetrafluoroborate, bis(dodecylphenyl) ) iodonium tetrakis (pentafluorophenyl) borate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexafluorophosphate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexafluoro Roantimonate, 4-methylphenyl-4-(1-methylethyl)phenyliodoniumtetrafluoroborate, 4-methylphenyl-4-(1-methylethyl)phenyliodoniumtetrakis(pentafluorophenyl)borate, etc. can be heard

Examples of the aromatic diazonium salt include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, and phenyldiazonium tetrakis(pentafluorophenyl)borate. and the like.

Examples of the aromatic ammonium salt include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, and 1-benzyl-2-cyano. Pyridinium tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetrakis (pentafluorophenyl) borate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluorophosphate, 1- (naph Tylmethyl) -2-cyanopyridinium hexafluoroantimonate, 1- (naphthylmethyl) -2-cyanopyridinium tetrafluoroborate, 1- (naphthylmethyl) -2-cyanopyridinium Tetrakis (pentafluorophenyl) borate, etc. are mentioned.

As the (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe salt, for example, (2,4-cyclopentadien-1-yl)((1- Methylethyl)benzene)-Fe(II)hexafluorophosphate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II)hexafluoroantimonate, ( 2,4-Cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II)tetrafluoroborate, (2,4-cyclopentadien-1-yl)((1-methylethyl )benzene)-Fe(II)tetrakis(pentafluorophenyl)borate, and the like.

Examples of the nonionic photoacid generating type photocationic polymerization initiator include nitrobenzyl esters, sulfonic acid derivatives, phosphoric acid esters, phenolsulfonic acid esters, diazonaphthoquinone, and N-hydroxyimide sulfonate. .

As what is marketed among the said photocationic polymerization initiators, For example, the photocationic polymerization initiator by Midori Chemical, the photocationic polymerization initiator by Union Carbide, the photocationic polymerization initiator by the ADEKA, 3M company The photocationic polymerization initiator by manufacture, the photocationic polymerization initiator by the BASF company, the photocationic polymerization initiator by the Rhodia company, etc. are mentioned.

As a photocationic polymerization initiator by the said Midori Chemical company, DTS-200 etc. are mentioned, for example.

UVI6990, UVI6974 etc. are mentioned as said Union Carbide photocationic polymerization initiator, for example.

As a photocationic polymerization initiator by the said ADEKA company, SP-150, SP-170, etc. are mentioned, for example.

As a photocationic polymerization initiator by the said 3M company, FC-508, FC-512, etc. are mentioned, for example.

As said BASF photocationic polymerization initiator, IRGACURE261, IRGACURE290, etc. are mentioned, for example.

As a photocationic polymerization initiator by the said Rhodia company, PI2074 etc. are mentioned, for example.

As the radical photopolymerization initiator, for example, a benzophenone-based compound, an acetophenone-based compound, an acylphosphine oxide-based compound, a titanocene-based compound, an oxime ester-based compound, a benzoin ether-based compound, benzyl, a thioxanthone-based compound A compound etc. are mentioned.

As what is marketed among the said radical photopolymerization initiators, the photoradical polymerization initiator by the BASF company, the radical photopolymerization initiator by the Tokyo Chemical Industry, etc. are mentioned, for example.

Examples of the radical photopolymerization initiator manufactured by BASF include IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACURE OXE01, and Lucirin TPO.

As said Tokyo Chemical Industry Co., Ltd. product radical photopolymerization initiator, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, etc. are mentioned, for example.

As the thermal cationic polymerization initiator, the anion moiety is BF ₄ ^- , PF ₆ ^- , SbF ₆ ^- , or (BX ₄ ) ^- (provided that X is a phenyl group substituted with at least two or more fluorine or trifluoromethyl groups) ), sulfonium salts, phosphonium salts, ammonium salts, and the like are mentioned. Among them, sulfonium salts and ammonium salts are preferable.

As said sulfonium salt, triphenylsulfonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, etc. are mentioned.

Examples of the phosphonium salt include ethyltriphenylphosphonium hexafluoroantimonate and tetrabutylphosphonium hexafluoroantimonate.

Examples of the ammonium salt include dimethylphenyl (4-methoxybenzyl)ammonium hexafluorophosphate, dimethylphenyl (4-methoxybenzyl)ammonium hexafluoroantimonate, dimethylphenyl (4-methoxybenzyl) Ammoniumtetrakis(pentafluorophenyl)borate, dimethylphenyl(4-methylbenzyl)ammonium hexafluorophosphate, dimethylphenyl(4-methylbenzyl)ammonium hexafluoroantimonate, dimethylphenyl(4-methylbenzyl)ammonium Hexafluorotetrakis(pentafluorophenyl)borate, methylphenyldibenzylammonium hexafluorophosphate, methylphenyldibenzylammoniumhexafluoroantimonate, methylphenyldibenzylammoniumtetrakis(pentafluorophenyl)borate, phenyltribenzyl Ammonium tetrakis (pentafluorophenyl) borate, dimethylphenyl (3,4-dimethylbenzyl) ammonium tetrakis (pentafluorophenyl) borate, N,N-dimethyl-N-benzylanilinium hexafluoroantimonate, N,N-diethyl-N-benzylanilinium tetrafluoroborate, N,N-dimethyl-N-benzylpyridinium hexafluoroantimonate, N,N-diethyl-N-benzylpyridinium trifluoro Methanesulfonic acid etc. are mentioned.

As what is marketed among the said thermal cationic polymerization initiators, the thermal cationic polymerization initiator by Sanshin Chemical Industries, Ltd., the thermal cationic polymerization initiator by King Industries, etc. are mentioned, for example.

As said Sanshin Chemical Industry Co., Ltd. product thermal cationic polymerization initiator, San-Aid SI-60, San-Aid SI-80, San-Aid SI-B3, San-Aid SI-B3A, San-Aid SI-B4 etc. are mentioned, for example. can

As a thermal cationic polymerization initiator by the said King Industries, CXC1612, CXC1821, etc. are mentioned, for example.

As said thermal radical polymerization initiator, what consists of an azo compound, an organic peroxide, etc. is mentioned, for example.

As said azo compound, 2,2'- azobis (2, 4- dimethylvaleronitrile), azobisisobutyronitrile, etc. are mentioned, for example.

Examples of the organic peroxide include benzoyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkylperoxide, peroxyester, diacylperoxide, peroxydicarbonate, and the like.

As what is marketed among the said thermal radical polymerization initiators, For example, VPE-0201, VPE-0401, VPE-0601, VPS-0501, VPS-1001, V-501 (all are made by FUJIFILM Wako Pure Pharmaceutical Co., Ltd.) etc. can be heard

As for content of the said polymerization initiator, with respect to 100 weight part of said curable resin, a preferable lower limit is 0.01 weight part, and a preferable upper limit is 10 weight part. When content of the said polymerization initiator is 0.01 weight part or more, the photocurable resin composition for electronic devices obtained becomes a thing more excellent in sclerosis|hardenability. When content of the said polymerization initiator is 10 weight part or less, hardening reaction of the photocurable resin composition for electronic devices obtained does not become quick too much, workability|operativity becomes more excellent, and hardened|cured material can be made into a more uniform thing. A more preferable lower limit of content of the said polymerization initiator is 0.05 weight part, and a more preferable upper limit is 5 weight part.

The photocurable resin composition for electronic devices of this invention may contain a sensitizer. The said sensitizer improves the polymerization initiation efficiency of the said polymerization initiator more, and has a role which accelerates|stimulates the hardening reaction of the photocurable resin composition for electronic devices of this invention more.

Examples of the sensitizer include thioxanthone compounds, 2,2-dimethoxy-1,2-diphenylethan-1-one, benzophenone, 2,4-dichlorobenzophenone, o-benzoylbenzoic acid methyl, 4,4'-bis(dimethylamino)benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, etc. are mentioned.

As said thioxanthone type compound, 2, 4- diethyl thioxanthone etc. are mentioned, for example.

As for content of the said sensitizer, with respect to 100 weight part of said curable resin, a preferable minimum is 0.01 weight part, and a preferable upper limit is 3 weight part. When content of the said sensitizer is 0.01 weight part or more, a sensitizing effect is exhibited more. When content of the said sensitizer is 3 weight part or less, absorption does not become large too much, and light can be transmitted to a deep part. A more preferable minimum of content of the said sensitizer is 0.1 weight part, and a more preferable upper limit is 1 weight part.

The photocurable resin composition for electronic devices of this invention may contain a thermosetting agent in the range which does not impair the objective of this invention.

Examples of the thermal curing agent include hydrazide compounds, imidazole derivatives, acid anhydrides, dicyandiamide, guanidine derivatives, modified aliphatic polyamines, and addition products of various amines and epoxy resins.

Examples of the hydrazide compound include 1,3-bis(hydrazinocarbonoethyl)-5-isopropylhydantoin, dihydrazide sebacate, isophthalic acid dihydrazide, adipic acid dihydrazide, and malon. acid dihydrazide; and the like.

Examples of the imidazole derivative include 1-cyanoethyl-2-phenylimidazole, N-(2-(2-methyl-1-imidazolyl)ethyl)urea, 2,4-diamino -6-(2'-Methylimidazolyl-(1'))-ethyl-s-triazine, N,N'-bis(2-methyl-1-imidazolylethyl)urea, N,N'- (2-methyl-1-imidazolylethyl)-adipamide, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, etc. can be heard

As said acid anhydride, tetrahydro phthalic anhydride, ethylene glycol bis (anhydro trimellitate), etc. are mentioned, for example.

These thermosetting agents may be used independently and may be used in combination of 2 or more type.

As what is marketed among the said thermosetting agents, the thermosetting agent by the Otsuka Chemical company, the thermosetting agent by the Ajinomoto Fine Techno company, etc. are mentioned, for example.

SDH, ADH, etc. are mentioned as said Otsuka Chemical Co., Ltd. product thermosetting agent, for example.

As said thermosetting agent by the said Ajinomoto Fine Techno company, Amicure VDH, Amicure VDH-J, Amicure UDH, etc. are mentioned, for example.

As for content of the said thermosetting agent, with respect to 100 weight part of said curable resin, a preferable minimum is 0.5 weight part, and a preferable upper limit is 30 weight part. When content of the said thermosetting agent is this range, thermosetting property becomes more excellent, maintaining the storage stability excellent in the photocurable resin composition for electronic devices obtained. A more preferable lower limit of content of the said thermosetting agent is 1 weight part, and a more preferable upper limit is 15 weight part.

The photocurable resin composition for electronic devices of this invention may contain a silane coupling agent further. The said silane coupling agent has a role of improving the adhesiveness of the photocurable resin composition for electronic devices of this invention, a board|substrate, etc.

Examples of the silane coupling agent include 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, and the like. can be heard These silane compounds may be used independently and 2 or more types may be used together.

As for content of the said silane coupling agent, with respect to 100 weight part of said curable resin, a preferable minimum is 0.1 weight part, and a preferable upper limit is 10 weight part. When content of the said silane coupling agent is this range, the effect of improving the adhesiveness of the photocurable resin composition for electronic devices obtained suppresses the bleed-out by an excess silane coupling agent becomes a more excellent thing. A more preferable lower limit of content of the said silane coupling agent is 0.5 weight part, and a more preferable upper limit is 5 weight part.

The photocurable resin composition for electronic devices of this invention may contain a hardening retarder. By containing the said curing retarder, the pot life of the photocurable resin composition for electronic devices obtained can be lengthened.

As said curing retarder, a polyether compound etc. are mentioned, for example.

As said polyether compound, polyethyleneglycol, polypropylene glycol, polytetramethylene glycol, a crown ether compound etc. are mentioned, for example. Especially, a crown ether compound is preferable.

As for content of the said hardening retarder, with respect to 100 weight part of said curable resin, a preferable lower limit is 0.05 weight part, and a preferable upper limit is 5.0 weight part. A delay effect can be exhibited more, suppressing generation|occurrence|production of the outgas at the time of hardening the photocurable resin composition for electronic devices obtained because content of the said hardening retarder is this range. A more preferable lower limit of the content of the curing retarder is 0.1 parts by weight, and a more preferable upper limit thereof is 3.0 parts by weight.

The photocurable resin composition for electronic devices of this invention is a range which does not impair the objective of this invention further. WHEREIN: You may contain a surface modifier. By containing the said surface modifier, the flatness of a coating film can be provided to the photocurable resin composition for electronic devices of this invention.

As said surface modifier, surfactant, a leveling agent, etc. are mentioned, for example.

As said surface modifier, things, such as a silicone type, an acryl type, a fluorine type, are mentioned, for example.

As what is marketed among the said surface modifiers, the surface modifier by the Big Chemical Japan company, the surface modifier by the AGC Semi-Chemical company, etc. are mentioned, for example.

BYK-340, BYK-345, etc. are mentioned as said surface modifier by the said Big Chemie Japan company, for example.

As a surface modifier by the said AGC Semi-Chemical company, Suflon S-611 etc. are mentioned, for example.

The photocurable resin composition for electronic devices of this invention may contain the compound or ion exchange resin which reacts with the acid which generate|occur|produced in the composition in the range which does not impair the objective of this invention.

Examples of the compound reacting with the acid generated in the composition include a substance neutralizing the acid, for example, a carbonate or hydrogen carbonate of an alkali metal or alkaline earth metal. Specifically, for example, calcium carbonate, calcium hydrogen carbonate, sodium carbonate, sodium hydrogen carbonate and the like are used.

As said ion exchange resin, although any of a cation exchange type, an anion exchange type, and both ion exchange type can be used, In particular, the cation exchange type or both ion exchange type which can adsorb|suck chloride ion is preferable.

Moreover, the photocurable resin composition for electronic devices of this invention may contain well-known various additives, such as a reinforcing agent, a softener, a plasticizer, a viscosity modifier, a ultraviolet absorber, and antioxidant, as needed.

As a method of manufacturing the photocurable resin composition for electronic devices of the present invention, for example, using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and three rolls, the curable resin and and the method of mixing additives, such as a polymerization initiator and the silane coupling agent added as needed, etc. are mentioned.

The upper limit of the dielectric constant of the photocurable resin composition for electronic devices of this invention measured on 25 degreeC and 100 kHz conditions is 3.5. When the said dielectric constant is 3.5 or less, the photocurable resin composition for electronic devices of this invention can be used suitably for adhesive agents for electronic devices, such as an adhesive agent for touch panels and a solder resist for circuit boards, a coating agent for electronic devices, etc. A preferable upper limit of the dielectric constant is 3.3, and a more preferable upper limit is 3.0.

In addition, although there is no particularly preferable lower limit of the dielectric constant, the practical lower limit is 2.2.

In addition, the said "permittivity" can be measured using a dielectric constant measuring apparatus.

The photocurable resin composition for electronic devices of this invention can be used suitably for application|coating by the inkjet method.

As said inkjet method, the non-heating type inkjet method may be sufficient, and the heating type inkjet method may be sufficient.

In addition, in the present specification, the "non-heating inkjet method" is a method of inkjet coating at a coating head temperature of less than 28 ° C., and the "heating inkjet method" is a method of inkjet coating at a coating head temperature of 28 ° C. or higher. .

In the heating type inkjet method, an inkjet coating head equipped with a heating mechanism is used. When the inkjet coating head is equipped with a heating mechanism, when discharging the photocurable resin composition for electronic devices, a viscosity and surface tension can be reduced.

As an inkjet coating head equipped with the said heating mechanism, the KM1024 series by the Konica Minolta company, the SG1024 series by a Fujifilm Dimatix company, etc. are mentioned, for example.

When using the photocurable resin composition for electronic devices of this invention for application|coating by the said heating inkjet method, it is preferable that the range of the heating temperature of an application|coating head is 28 degreeC - 80 degreeC. When the heating temperature of the said application|coating head is this range, the increase of the viscosity with time of the photocurable resin composition for electronic devices is further suppressed, and it becomes the thing excellent in discharge stability.

As for the photocurable resin composition for electronic devices of this invention, the preferable minimum of the viscosity in 25 degreeC is 5 mPs*s, and a preferable upper limit is 50 mPs*s. When the viscosity in 25 degreeC is this range, it can apply|coat preferably by the inkjet method.

A more preferable minimum of the viscosity in 25 degreeC of the photocurable resin composition for electronic devices of this invention is 8 mPs*s, and a more preferable minimum is 10 mPs*s. Moreover, the more preferable upper limit of the viscosity in 25 degreeC of the photocurable resin composition for electronic devices of this invention is 40 mPs*s, and a more preferable upper limit is 30 mPs*s.

In addition, in this specification, the said "viscosity" means a value measured under the conditions of 25 degreeC and 100 rpm using an E-type viscometer. Examples of the E-type viscometer include VISCOMETER TV-22 (manufactured by Toki Industries, Ltd.), and a CP1-type cone plate can be used.

As for the photocurable resin composition for electronic devices of this invention, the preferable minimum of the surface tension in 25 degreeC is 15 mN/m, and a preferable upper limit is 35 mN/m. When the surface tension in said 25 degreeC is this range, it can apply|coat suitably by the inkjet method. A more preferable lower limit of the surface tension at 25°C is 20 mN/m, a more preferable upper limit is 30 mN/m, a more preferable lower limit is 22 mN/m, and a more preferable upper limit is 28 mN/m.

In addition, the surface tension means a value measured by the Wilhelmy method by a dynamic wettability tester. As said dynamic wettability testing machine, WET-6100 type (made by a Lesca company) etc. are mentioned, for example.

The photocurable resin composition for electronic devices of the present invention can be preferably cured by irradiating light with a wavelength of 300 nm or more and 400 nm or less and an accumulated light amount of 300 mJ/cm 2 or more and 3000 mJ/cm 2 or less.

Examples of the light source used for the light irradiation include a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, an excimer laser, a chemical lamp, a black light lamp, a microwave excited mercury lamp, a metal halide lamp, a sodium lamp, a halogen lamp. , a xenon lamp, an LED lamp, a fluorescent lamp, sunlight, an electron beam irradiation device, and the like. These light sources may be used independently and 2 or more types may be used together.

These light sources are suitably selected according to the absorption wavelength of the said photocationic polymerization initiator or the said radical photopolymerization initiator.

As a means of irradiating light to the photocurable resin composition for electronic devices of the present invention, for example, simultaneous irradiation of various light sources, sequential irradiation with a time difference, combination irradiation of simultaneous irradiation and sequential irradiation, etc. are mentioned, any irradiation means may be used.

The photocurable resin composition for electronic devices of this invention is used suitably as adhesive agents for electronic devices, such as an adhesive agent for touch panels, and a soldering resist for circuit boards, and a coating agent for electronic devices. Moreover, the photocurable resin composition for electronic devices of this invention is used suitably also as sealing agents for display elements, such as an organic electroluminescent display element.

ADVANTAGE OF THE INVENTION According to this invention, it is excellent in applicability|paintability and sclerosis|hardenability, and can provide the photocurable resin composition for electronic devices which has a low dielectric constant.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited only to these Examples.

(Examples 1-22, Comparative Examples 1-5)

According to the compounding ratios shown in Tables 1 to 4, each material is uniformly stirred and mixed at a stirring speed of 3000 rpm using a homodisper-type stirring mixer, whereby Examples 1-22 and Comparative Examples 1 to 5 light for electronic devices A curable resin composition was produced. As a homodisper-type stirring mixer, a homodisper L-type (manufactured by Primix Co., Ltd.) was used.

In Tables 1-4, "X-22-169", in the formula (3), R ⁶⁷ is a methyl group, R ⁶⁸ is a bond, X is a group represented by the formula (6-2) (R ⁷³ is an ethylene group) ), n is 0 (average value).

In Tables 1 to 4, "X-22-163" is a group in the formula (3) wherein R ⁶⁷ is a methyl group, R ⁶⁸ is an n-propylene group, and X is a group represented by the formula (6-1) (R ⁷³ is oxymethylene group).

In Tables 1 to 4, "X-40-2678" is a group in which two R ⁷² of R ⁷² in the formula (5) are represented by the formula (6-2) (R ⁷³ is an ethylene group), and another R ⁷² is a methyl group, and k is 4 (average value).

Each obtained photocurable resin composition for electronic devices was apply|coated to the thickness of 100 micrometers on PET film, and it was irradiated with 3000 mJ/cm<2> of ultraviolet rays of 395 nm using an LED UV lamp, and it was hardened. As the LED UV lamp, the SQ series (manufactured by Quark Technologies) was used. Then, on both surfaces of the cured film, gold electrodes were vacuum-deposited in a circular shape with a diameter of 2 cm to a thickness of 0.1 µm to face a test piece for measuring the dielectric constant. About the obtained test piece, the dielectric constant was measured on 25 degreeC and 100 MHz conditions using the dielectric constant measuring apparatus. As the dielectric constant measuring device, a type 1260 impedance analyzer (manufactured by Solartron) and a type 1296 dielectric constant measurement interface (manufactured by Solartron) were used. The results are shown in Tables 1-4.

<Evaluation>

The following evaluation was performed about each photocurable resin composition for electronic devices obtained by the Example and the comparative example. The results are shown in Tables 1-4.

(viscosity)

About each photocurable resin composition for electronic devices obtained by the Example and the comparative example, the viscosity in 25 degreeC and 100 rpm conditions was measured with the CP1-type cone plate using the E-type viscometer. As the E-type viscometer, VISCOMETER TV-22 (manufactured by Toki Industries, Ltd.) was used.

(applicability)

Each photocurable resin composition for an electronic device obtained in Examples and Comparative Examples was subjected to an inkjet printer, using an inkjet printer, to print on alkali-free glass with 10 picoliters of droplet amount in a grid pattern at a pitch of 25 µm. carried out. As the inkjet printer, material printer DMP-2831 (manufactured by Fujifilm) was used, and as the alkali free glass, AN100 (manufactured by AGC) was used.

If there is no uncoated part or unevenness in the print area, "○", when there is no uncoated part but a striped face is visible, "△", and when there is an uncoated part, "X" is applied. gender was evaluated.

(curable)

About each photocurable resin composition for electronic devices obtained by the Example and the comparative example, 3000 mJ/cm<2> of ultraviolet rays of 395 nm were irradiated using the LED UV lamp, and it was made to harden|cure. As the LED UV lamp, the SQ series (manufactured by Quark Technologies) was used. About the composition and hardened|cured material before hardening, FT-IR analysis was performed with a Fourier transform infrared spectrophotometer. As a Fourier transform infrared spectrophotometer, iS-5 (made by Nicholas Corporation) was used. In the case of an epoxy group, the decrease rate after curing of the peak at 915 cm ^-1 , and in the case of an oxetanyl group, the decrease rate after curing the peak at 980 cm ^-1 was calculated as the curing rate (reaction rate of the cationically polymerizable group).

The case where the curing rate was 90% or more was evaluated as “○”, the case where the curing rate was 70% or more and less than 90% was “Δ”, and the case where it was less than 70% was “x”, and the curability was evaluated.

(Low outgassing)

About each photocurable resin composition for electronic devices obtained by the Example and the comparative example, the outgas which generate|occur|produced at the time of heating of hardened|cured material was measured with the gas chromatograph by the headspace method shown below.

First, 100 mg of each photocurable resin composition for electronic devices was coated with an applicator to a thickness of 300 µm, and then 3000 mJ/cm 2 of ultraviolet rays having a wavelength of 365 nm were irradiated with an LED lamp to cure the photocurable resin composition for electronic devices. Next, the obtained hardened|cured material was put into the vial for headspace, the vial was sealed, it heated at 100 degreeC for 30 minute(s), and the generated gas was measured by the headspace method.

When the generated gas is less than 400 ppm, “◎”, 400 ppm or more and less than 600 ppm is “○”, 600 ppm or more and less than 800 ppm is “△”, and 800 ppm or more is “×”, and low outgas gender was evaluated.

ADVANTAGE OF THE INVENTION According to this invention, it is excellent in applicability|paintability and sclerosis|hardenability, and can provide the photocurable resin composition for electronic devices which has a low dielectric constant.

Claims (7)

A photocurable resin composition for electronic devices containing a curable resin and a polymerization initiator, comprising:
The curable resin contains a monofunctional cationically polymerizable compound and a polyfunctional cationically polymerizable compound,
The monofunctional cationically polymerizable compound contains at least any one of a monofunctional aliphatic cationically polymerizable compound and a monofunctional cationically polymerizable compound having an optionally substituted phenoxy group;
The photocurable resin composition for electronic devices characterized by the dielectric constant measured on 25 degreeC and 100 kHz conditions being 3.5 or less. The method of claim 1,
The said monofunctional cationically polymerizable compound is a compound represented by a following formula (1-1), a compound represented by a following formula (1-2), a compound represented by a following formula (1-3), a following formula (1-4) A compound represented by, a compound represented by the following formula (1-5), a compound represented by the following formula (1-6), a compound represented by the following formula (1-7), a compound represented by the following formula (1-8), and The photocurable resin composition for electronic devices containing at least 1 sort(s) chosen from the group which consists of a compound represented by Formula (1-9).

3. The method of claim 1 or 2,
The polyfunctional cationically polymerizable compound includes a polyfunctional alicyclic epoxy compound having no silicone skeleton, a polyfunctional aliphatic glycidyl ether compound having no silicone skeleton, a polyfunctional oxetane compound having no silicone skeleton, and two or more The photocurable resin composition for electronic devices containing at least 1 sort(s) selected from the group which consists of a silicone compound which has a cationically polymerizable group. 4. The method of claim 3,
The said polyfunctional cationically polymerizable compound is a compound represented by a compound represented by a following formula (2-1), a compound represented by a following formula (2-2), a compound represented by a following formula (2-3), a following formula (2-4) A photocurable resin composition for electronic devices comprising at least one selected from the group consisting of a compound represented by .

In formula (2-1), R ¹ to R ¹⁸ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may be the same as each other. , may be different.
In formula (2-2), R ¹⁹ to R ³⁰ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may be the same as each other. , may be different.
In formula (2-3), R ³¹ to R ⁴⁸ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may be the same as each other. , may be different.
In formula (2-4), R ⁴⁹ to R ⁶⁶ represent a hydrogen atom, a halogen atom, an oxygen atom, an oxygen atom or a hydrocarbon group which may have a halogen atom, or an alkoxy group which may have a substituent, and may each be the same. , may be different.

In formula (3), R ⁶⁷ each independently represents an alkyl group having 1 to 10 carbon atoms, R ⁶⁸ each independently represents a bond or an alkylene group having 1 to 6 carbon atoms, and X is an epoxy group The group containing the group, the group containing the oxetanyl group, or the group containing the vinyl ether group are shown, and n shows the integer of 0 or more and 1000 or less.

In formula (4), R ⁶⁹ each independently represents an alkyl group having 1 to 10 carbon atoms, R ⁷⁰ represents a bond or an alkylene group having 1 to 6 carbon atoms, R ⁷¹ is each independently, An alkyl group having 1 to 10 carbon atoms, a group containing an epoxy group, a group containing an oxetanyl group, or a group containing a vinyl ether group, X is a group containing an epoxy group, a group containing an oxetanyl group, or vinyl A group containing an ether group is shown. l represents an integer of 0 or more and 1000 or less, and m represents an integer of 1 or more and 100 or less. However, when R ⁷¹ is an alkyl group having 1 or more and 10 or less carbon atoms, m represents an integer of 2 or more and 100 or less.

In the formula (5), R ⁷² each independently represents an alkyl group having 1 or more and 10 or less carbon atoms, a group containing an epoxy group, a group containing an oxetanyl group, or a group containing a vinyl ether group, among 2k R ⁷² , at least two R ⁷² represents a group containing an epoxy group, a group containing an oxetanyl group, or a group containing a vinyl ether group. k represents an integer of 3 or more and 6 or less. 5. The method of claim 4,
The said polyfunctional cationically polymerizable compound contains at least 1 sort(s) selected from the group which consists of the compound represented by the said Formula (3), the compound represented by the said Formula (4), and the said Formula (5), The electron containing A photocurable resin composition for devices. 6. The method of claim 1, 2, 3, 4 or 5, wherein
The ratio of the monofunctional cationically polymerizable compound to the polyfunctional cationically polymerizable compound (monofunctional cationically polymerizable compound: polyfunctional cationically polymerizable compound) is, by weight, 1:9 to 9:1. A photocurable resin composition for devices. 7. The method of claim 1, 2, 3, 4, 5 or 6,
The photocurable resin composition for electronic devices whose viscosities in 25 degreeC are 5 mPa*s or more and 50 mPa*s or less.