KR20220035301A - Cooling-heating apparatus of semi-conductor liquid - Google Patents

Abstract

The present invention relates to a semiconductor processing liquid temperature maintaining device, which is the semiconductor processing liquid temperature maintaining device capable of relatively increasing heat exchange efficiency while symmetrically disposing heat exchange modules in pairs to maintain a constant temperature of the semiconductor processing liquid. The disclosed semiconductor processing liquid temperature maintaining device includes: a heat exchange body unit in which the introduced semiconductor processing liquid is temperature-controlled, maintained and discharged; and a plurality of heat exchanging module units which are symmetrically disposed in pairs on both sides of the heat exchanging body so that the semiconductor processing liquid introduced into the heat exchange body is temperature-controlled and maintained.

Description

Cooling-heating apparatus of semi-conductor liquid}

The present invention relates to a semiconductor processing liquid temperature maintenance device, and more specifically, a semiconductor processing liquid temperature maintenance device that can relatively increase heat exchange efficiency while symmetrically arranging heat exchange modules in pairs to maintain the temperature of the semiconductor processing liquid constant. It's about.

The semiconductor processing liquid temperature maintenance device known in prior patent documents KR 10-1327874 and JP 3724763 not only has a weak heat dissipation structure, resulting in poor heat exchange efficiency for the semiconductor processing liquid, but also has a long distance between the semiconductor processing liquid and the thermoelectric element, making semiconductor processing difficult. There was a problem in that the heat exchange efficiency of the liquid was poor.

In addition, KR 10-1327874, a prior patent document, uses a vortex rib to allow the semiconductor processing liquid to stay for a long time to improve heat exchange efficiency, but this has the disadvantage of causing pressure loss and taking a long time when cooling or heating.

Republic of Korea Patent Publication KR 10-1327874 (Title of invention: Semiconductor processing liquid cooling and heating device) Japanese Patent Publication JP 3724763

Therefore, the present invention was created to solve the problems described above, and provides more efficient cooling of the thermoelectric element by circulating coolant in the heat sink, and minimizes the face-to-face distance between the semiconductor processing liquid and the thermoelectric element to improve heat exchange efficiency. The purpose is to provide an invention that maximizes .

However, the objects of the present invention are not limited to the objects mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

The object of the present invention described above is to heat exchange the semiconductor processing liquid flowing into the heat exchange body by controlling and maintaining the temperature of the semiconductor processing liquid and discharging the semiconductor processing liquid by controlling and maintaining the temperature of the semiconductor processing liquid by symmetrically arranging the heat exchange body in pairs on both sides of the heat exchange body. This can be achieved by providing a semiconductor processing liquid temperature maintenance device comprising a plurality of heat exchange module units.

In addition, each of the plurality of heat exchange module parts is composed of first and second heat exchange module parts symmetrically on both sides around the heat exchange body part,

Each of the first and second heat exchange module parts is a heat sink part with a cooling water flow path formed to allow coolant to flow inside, and is disposed relatively closer to the heat exchange body part than the heat sink part to heat exchange the semiconductor processing liquid, and is in contact with one surface of the heat sink part to exchange heat. A plurality of thermoelectric element units in which the generated heat is cooled by the heat sink unit, and a flow connection connection unit that connects the first and second coolant flow paths to each other so that the coolant passing through the heat sink unit of the first heat exchange module unit flows to the heat sink unit of the second heat exchange module unit. Includes.

In addition, a first diaphragm is inserted and fixed into the first diaphragm insertion groove of the heat exchange body to move the semiconductor processing liquid flowing into the inside of the heat exchange body in the first direction, and is disposed downstream of the first diaphragm, and the first diaphragm is A second diaphragm inserted and fixed into the second diaphragm insertion groove of the heat exchange body to move the semiconductor processing liquid discharged from the second diaphragm in the second direction, disposed downstream of the second diaphragm, and semiconductor processing liquid discharged from the second diaphragm. It further includes a third plate portion inserted and fixed into the third plate insertion groove of the heat exchange body so as to move in the third direction.

In addition, each of the first, second, and third diaphragms is formed as a downstream flow narrow passage in which the width of one end region is narrower than the width of the other region of the diaphragm, and the semiconductor processing liquid flows downstream to the diaphragm disposed downstream through the downstream flow narrow passage. It includes a movable downstream discharge narrow passage, and the downstream discharge narrow passages of each of the first, second, and third diaphragms are arranged in a zigzag pattern, and the lengths of the first and third diaphragms and the lengths of the second diaphragms are formed to be different from each other.

In addition, the thermoelectric element portion of the first heat exchange module is arranged to face one side of the downstream discharge narrow passage, and the thermoelectric element portion of the second heat exchange module portion is disposed to face the other side of the downstream discharge narrow passage, so that one side and the other side of the downstream discharge narrow passage are disposed. Heat exchanges the semiconductor processing liquid moving downstream.

In addition, the heat sink unit includes a coolant tube portion through which coolant flows inward, a first heat sink body portion formed with an insertion groove on the bottom of the tube into which the bottom of the coolant tube portion is inserted and seated, and a second heat sink formed with an insertion groove on the top of the tube into which the upper surface of the coolant tube portion is inserted and seated. It includes a body part, and the coolant flows inside the coolant tube part inserted and seated in the insertion groove on the bottom of the tube and the insertion groove on the top of the tube to form a coolant flow path, and the flow connection connection part allows the coolant flowing through the coolant tube part of the first heat exchange module part to flow into the second heat exchanger. Each coolant tube part is connected to each other so that it flows to the coolant tube part of the module part.

Additionally, the coolant tube portion is corrugated to lengthen the coolant flow path.

In addition, the first heat sink body portion is made of a material with relatively better thermal conductivity than the second heat sink body portion and is in contact with one surface of the plurality of thermoelectric elements, so heat dissipation efficiency is relatively higher.

In addition, the heat sink part is a heat sink body part in which an inlet-side coolant flow path and an outlet-side coolant flow path are provided on the inside, respectively, and a louver fin flow path is formed by being disposed on the inside of the heat sink body part to move the coolant flowing in the inlet-side coolant flow path to the discharge-side coolant flow path. Including the louver fin part.

According to the present invention as described above, there is an effect of providing more efficient cooling of the thermoelectric element by circulating coolant through the heat sink and maximizing heat exchange efficiency by minimizing the face-to-face distance between the semiconductor processing liquid and the thermoelectric element.

The following drawings attached to this specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical idea of the present invention along with the detailed description of the invention. Therefore, the present invention is limited to the matters described in such drawings. It should not be interpreted in a limited way.
1 to 3 are diagrams showing the schematic structure of a semiconductor processing liquid temperature maintenance device according to an embodiment of the present invention;
Figures 4 and 5 are diagrams showing the first and second heat sink parts, the first and second thermoelectric element parts, and the first and second cover parts arranged in symmetrical pairs according to an embodiment of the present invention;
6 to 12 are diagrams showing a heat sink using a tube structure according to the first embodiment of the present invention;
Figures 13 and 14 are diagrams showing a heat sink using a louver fin structure according to a second embodiment of the present invention;
15 and 16 are diagrams showing the arrangement structure of the first thermoelectric element unit according to one embodiment of the present invention;
Figure 15 is a view showing the conduit fitting body of the secondary temperature control unit according to the first embodiment of the present invention;
17 to 19 are diagrams showing first, second and third partitions according to an embodiment of the present invention;
20 and 21 are diagrams showing a first cover portion according to an embodiment of the present invention;
Figure 22 is a diagram showing a first O-ring portion according to an embodiment of the present invention;
Figures 23 and 26 are views showing the first, second, and third diaphragms inserted into the heat exchange body according to an embodiment of the present invention;
27 and 28 are diagrams showing the flow of semiconductor processing liquid within the heat exchange body according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In addition, the embodiment described below does not unduly limit the content of the present invention described in the claims, and it cannot be said that all of the configurations described in this embodiment are essential as a solution to the present invention. In addition, descriptions of matters that are obvious to those skilled in the art and skilled in the art may be omitted, and descriptions of such omitted components (methods) and functions may be sufficiently referenced without departing from the technical spirit of the present invention.

A semiconductor processing liquid temperature maintenance device according to an embodiment of the present invention is a device that controls and keeps the temperature of the semiconductor processing liquid constant. As an example, the semiconductor processing liquid described in the present invention may be hydrofluoric acid, sulfuric acid, hydrochloric acid, etc., but is not limited thereto. The semiconductor processing liquid of the present invention is adjusted to a temperature between -50 degrees Celsius and 80 degrees Celsius, and is generally adjusted to maintain a temperature of 25 degrees Celsius. Hereinafter, a semiconductor processing liquid temperature maintenance device according to an embodiment of the present invention will be described in detail with reference to the attached drawings.

As shown in FIGS. 1 to 5, the semiconductor processing liquid temperature maintenance device according to an embodiment of the present invention is centered on the heat exchange body 500, and as shown in FIG. 4, the first part of the heat exchange body 500 The first cover part and the first heat exchange module part are sequentially arranged in one direction, and the second cover part and the second heat exchange module part are sequentially arranged in the second direction, as shown in FIG. 5. At this time, the first direction may be to the right of the heat exchange body 500 with respect to FIG. 3, and the second direction may be to the left of the heat exchange body 500. Therefore, they are arranged symmetrically in pairs with the heat exchange body 500 as the center. Accordingly, the description will be made below with a focus on the first cover part and the first heat exchange module part arranged in the first direction with the heat exchange body part 500 as the center, and the second cover part and the first heat exchange module part arranged symmetrically in pairs in the second direction. 2 The heat exchange module portion will be replaced with the description of the first cover portion and the first heat exchange module portion disposed in the first direction.

The semiconductor processing liquid flows into the heat exchange body 500 through the processing liquid inlet conduit 11. As shown in FIG. 23, one side of the processing liquid inlet conduit 11 is connected to the processing liquid injection hole 505a of the heat exchange body 500, so that the semiconductor processing liquid can flow into the inside of the heat exchange body 500. You can. In addition, the temperature of the introduced semiconductor processing liquid is adjusted inside the heat exchange body 500 and discharged to the outside through the processing liquid discharge conduit 12. At this time, the processing liquid discharge conduit 12 is connected to the processing liquid discharge hole 505b, so that the semiconductor processing liquid can be discharged to the outside of the heat exchange body 500.

In order to cool the first and second heat sink parts 100 and 600, which will be described later, cooling water flows inside the heat sink. The coolant flows through the first coolant tube part 21 as shown in FIG. 9, and the coolant flowing in through the inlet port part 21a of the first coolant tube part 21 as shown in FIG. 1 is the first coolant tube part 21. 1 After circulating through the heat sink part 100, it is discharged through the discharge port part 21b of the first coolant tube part 21. The discharged coolant flows into the flow path connecting portion 22 that communicates with the discharge port portion 21b of the first coolant tube portion 21 and the inlet port portion 23a of the second coolant tube portion 23. Accordingly, the coolant discharged from the discharge port portion 21b circulates inside the second coolant tube portion 23 to cool the second heat sink portion 600, and circulates along the second coolant tube portion 23. One coolant is discharged to the outside through the discharge port portion 23b of the second coolant tube portion 23. The coolant discharged to the outside goes through a cooling process and re-flows into the inlet port portion 21a of the first coolant tube portion 21 to cool the heat sink. As described above, in order to circulate and cool the heat sinks arranged in pairs on the left and right sides of the heat exchange body portion 500, the coolant flowing into the first heat sink portion 100 cools the first heat sink portion 100. For reuse, it is re-introduced into the second heat sink unit 600 through the flow path connecting portion 22, cools the second heat sink unit 600, and is then discharged to the outside. The above description is intended to explain the path of the coolant, and the cooling method of the heat sink may use a tube (FIGS. 6 to 12) or a louver fin (FIGS. 13 to 14). A detailed explanation will be provided below.

As shown in FIG. 4, the first cover part 300, the first thermoelectric element part 200, and the first heat sink part 100 are sequentially arranged on the right side of the heat exchange body part 500. As shown in Figures 4 and 5, the first and second O-ring parts 400 and 900 are respectively inserted into the first and second O-ring insertion grooves 500a and 500b of the heat exchange body part 500. As shown in FIG. 5, a second cover part 800, a second thermoelectric element part 700, and a second heat sink part 200 are sequentially arranged on the left side of the heat exchange body part 500. In one embodiment of the present invention, for convenience of explanation, the first thermoelectric element unit 200 and the first heat sink unit 100 are referred to as the first heat exchange module unit, and the second thermoelectric element unit 700 and the second heat sink unit ( 600) is called the second heat exchange module part.

4 and 5, the first heat exchange module portion and the first cover portion are disposed on the right side of the heat exchange body portion 500, and the second heat exchange module portion and the second cover portion are arranged in pairs on the left side of the heat exchange body portion 500. Because it is symmetrically arranged, the temperature of the semiconductor processing liquid flowing into the heat exchange body 500 located in the central area can be effectively controlled from both sides.

Meanwhile, the heat sink according to an embodiment of the present invention cools the thermoelectric element described later, and uses a tube structure or louver fin structure to cool the heat sink itself. With reference to FIGS. 6 to 12 , the heat sink portion 100a using a tube structure will first be described.

As shown in FIG. 6, the first heat sink portion 100 may include a first heat sink body portion 101, a second heat sink body portion 102, and a first coolant tube portion 21. The first coolant tube portion 21 is inserted into the space between the first heat sink body portion 101 and the second heat sink body portion 102. Therefore, the coolant flows into the inlet port portion 21a of the first coolant tube portion 21, circulates through the heat sink portion, and is discharged through the discharge port portion 21b of the first coolant tube portion 21. As described above, the coolant discharged through the discharge port portion 21b is re-introduced for reuse into the inlet port portion 23a of the second coolant tube portion 23 through the flow path connection connection portion 22.

As shown in FIG. 7 , a tube bottom insertion groove 101a is formed on one surface of the first heat sink body 101 into which the bottom of the first coolant tube 21 can be inserted and seated. As shown in FIGS. 10 and 11 , a tube top insertion groove 102a is formed on one surface of the second heat sink body 102 into which the top of the first coolant tube 21 can be inserted and seated.

The first coolant tube portion 21 is inserted and coupled to the tube bottom insertion groove 101a of the first heat sink body portion and the tube top insertion groove 102a of the second heat sink body portion 102, respectively. Accordingly, the coolant flows along the first coolant tube portion 21 fitted inside the first and second heat sink bodies 101 and 102, thereby cooling the first and second heat sink bodies 101 and 102.

Meanwhile, the first heat sink body 101 and the second heat sink body 102 are preferably made of different materials. The first heat sink body 101 may be made of a copper material with good thermal conductivity, and the second heat sink body 102 may be made of an aluminum material. That is, since the first heat sink body portion 101 directly faces the thermoelectric element, which will be described later, it is desirable to use a material with relatively good thermal conductivity to effectively dissipate heat from the thermoelectric element. As described above, the tube structure heat sink flow path has a structure that circulates inside the heat sink in a zigzag manner.

Next, the heat sink portion 100b using the louver fin structure will be described with reference to FIGS. 13 and 14. The heat sink portion of the louver fin structure includes a heat sink body portion 106 and a louver fin portion 107. The coolant flowing into the inside of the heat sink body 106 through the coolant inlet port 108a flows in the first direction (or horizontal direction) along the first body flow path 106a provided on the inside of the heat sink body 106. It flows. The coolant flowing in the first direction flows in the second direction (or vertical direction) along the louver fin flow path 107a of the louver fin portion 107 provided inside the heat sink body portion 106. The coolant flowing in the second direction flows in the third direction (or the horizontal direction opposite to the first direction) along the second body flow path 106b provided inside the heat sink body portion 106, and finally flows through the coolant discharge port portion. It is discharged through (108b). The discharged coolant flows into the second heat sink unit 600 through the flow path connection connection part 22 for recirculation.

The louver fin portion 107 is disposed in the space between the first body passage 106a and the second body passage 106b. Accordingly, based on FIG. 13, the first body passage 106a is located on the lower side of the louver fin portion 107. It is formed to communicate with the directional louver fin passage (107a), and the second body passage (106b) is formed to communicate with the upward direction louver fin passage (107a) of the louver fin portion (107).

As shown in FIG. 15, the first thermoelectric element units 200a, 200b, and 200c and the first heat sink unit 100 are fixedly disposed on one surface of the first cover unit 300. The first heat sink portion 100 is disposed to dissipate heat from the first thermoelectric element portions 200a, 200b, and 200c. The first thermoelectric elements 200a, 200b, and 200c are disposed on the side of the downstream discharge narrow passages 31a, 32a, and 33a of the diaphragm for efficient heat exchange with the semiconductor processing liquid flowing inside the heat exchange body 500. desirable. That is, as shown in FIGS. 17 to 19, first thermoelectric elements 200a, 200b, 200c and second thermoelectric elements 700a, 700b, 700c are located on both sides of the downstream discharge narrow passages 31a, 32a, and 33a. ) By arranging them in pairs, heat exchange can be performed closer to the semiconductor processing liquid, thereby increasing heat exchange efficiency. At this time, it is desirable that the width of the downstream discharge narrow passages 31a, 32a, and 33a of the diaphragm be the same as the size of the thermoelectric element to increase heat exchange efficiency.

As shown in FIGS. 15, 20, and 21, the first thermoelectric element unit 200 and the first heat sink unit 100 are fixed to the outer surface 301 of the first cover unit 300. At least a portion of the first cover portion 300 is made of a transparent sapphire material, so that it can be confirmed whether the heat conduction bond between the disk and the aluminum machined surface is properly applied.

As shown in FIG. 22, the first O-ring portion 400 is inserted into the first O-ring insertion groove 500a of the heat exchange body portion 500 to prevent the semiconductor processing liquid from leaking to the outside.

The first, second, and third plate parts 31, 32, and 33 shown in FIGS. 17 to 19 are the first, second, and third plates provided on the inner circumferential direction of the heat exchange body 500 shown in FIGS. 23 to 26. They are inserted into the diaphragm insertion grooves 501, 502, and 503, respectively. The length of the first, second, and third diaphragms (31, 32, and 33) may vary slightly depending on the formation position of the diaphragm insertion groove, and the width of the downstream discharge narrow passages (31a, 32a, and 33a) formed on each diaphragm is It is preferable that it is formed to fit the size of the thermoelectric element.

As shown in FIGS. 27 and 28, the semiconductor processing liquid flowing in through the processing liquid injection hole 505a flows in the first direction by the first diaphragm 31 and is discharged downstream provided at the end of the first diaphragm. It is discharged downstream through the narrow passage 31a, and the discharged semiconductor processing liquid flows in a second direction (opposite to the first direction) by the second diaphragm 32 disposed downstream of the first diaphragm. 2 It is discharged downstream through the downstream discharge narrow passage 32a provided at the end of the diaphragm, and the discharged semiconductor processing liquid flows again in the first direction by the third diaphragm 33 disposed downstream of the second diaphragm. is discharged downstream through the downstream discharge narrow passage 32a provided at the end of the third partition. The discharged semiconductor processing liquid is the final temperature-controlled semiconductor processing liquid and is discharged to the outside through the processing liquid discharge hole 505b.

In explaining the present invention, matters that are obvious to those skilled in the art and skilled in the art may be omitted, and descriptions of such omitted components (methods) and functions may be sufficiently referenced without departing from the technical spirit of the present invention. You will be able to. In addition, the components of the present invention described above are only described for the convenience of explaining the present invention, and components not described herein may be added without departing from the technical spirit of the present invention.

The description of the configuration and function of each part described above is explained separately from each other for convenience of explanation, and if necessary, one configuration and function may be implemented by integrating with other components, or may be implemented in further detail.

Although the present invention has been described above with reference to one embodiment, the present invention is not limited to this, and various modifications and applications are possible. That is, those skilled in the art will easily understand that many modifications are possible without departing from the gist of the present invention. In addition, it should be noted that if a specific description of the known functions and their configurations related to the present invention or the combination relationship between each component of the present invention is judged to unnecessarily obscure the gist of the present invention, the detailed description has been omitted. something to do.

11: Treatment liquid inflow conduit part
12: Treatment liquid discharge conduit part
21: first coolant tube part
21a: Inlet port part
21b: discharge port portion
22: Euro connection connection part
23: Second coolant tube part
23a: Inlet port part
23b: discharge port portion
31: first plate
31a: Downstream discharge narrow channel
32: second plate
32a: Downstream discharge narrow channel
33: third plate
33a: Downstream discharge narrow section
100, 100a, 100b: first heat sink part
100a: First heat sink fixing part
100b: Second heat sink fixing part
101: first heat sink body portion
101a: Insertion groove on the bottom of the tube
102: second heat sink body portion
102a: Insertion groove on the top of the tube
106: Heat sink body part
106a: first body flow path
106b: second body flow path
107: Louver fin part
107a: Louver pin flow path
108a: Coolant inlet port portion
108b: Coolant discharge port portion
200: first thermoelectric element unit (or first heat exchange unit)
200a, 200b, 200c: Thermoelectric element part
300: first cover part
301: outer surface
302: medial side
400: 1st O-ring part
500: Heat exchange body part
500a: 1st O-ring insertion groove
500b: 2nd O-ring insertion groove
501: First plate insertion groove
502: Second plate insertion groove
503: Third plate insertion groove
505a: Treatment liquid injection hole
505b: Treatment liquid discharge hole
600: Second heat sink part
600a: First heat sink fixing part
600b: Second heat sink fixing part
700: Second thermoelectric element unit (or second heat exchange unit)
700a, 700b, 700c: Thermoelectric element part
800: second cover part
900: 2nd O-ring part

Claims (9)

A heat exchange body where the temperature of the inflow semiconductor processing liquid is controlled and maintained and discharged,
A device for maintaining the temperature of a semiconductor processing fluid, comprising a plurality of heat exchange modules arranged symmetrically in pairs on both sides of the heat exchange body to exchange heat with the semiconductor processing fluid flowing into the heat exchange body to control and maintain the temperature.
According to claim 1,
Each of the plurality of heat exchange module units,
It is composed of first and second heat exchange module parts symmetrically on both sides around the heat exchange body part,
Each of the first and second heat exchange module units,
A heat sink portion formed with a coolant flow path to allow coolant to flow inside,
A plurality of thermoelectric element parts disposed relatively closer to the heat exchange body part than the heat sink part to heat exchange the semiconductor processing liquid, and in which heat generated during heat exchange by contacting one surface of the heat sink part is cooled by the heat sink part,
A semiconductor processing liquid temperature maintaining device comprising a flow path connecting portion connecting the first and second coolant passages to each other so that coolant passing through the heat sink portion of the first heat exchange module portion flows to the heat sink portion of the second heat exchange module portion.
According to claim 2,
A first diaphragm portion inserted and fixed into the first diaphragm insertion groove of the heat exchange body portion to move the semiconductor processing liquid flowing into the heat exchange body portion in a first direction;
A second diaphragm disposed downstream of the first diaphragm and inserted into and fixed to the second diaphragm insertion groove of the heat exchange body to move the semiconductor processing liquid discharged from the first diaphragm in a second direction;
A third diaphragm is disposed downstream of the second diaphragm and is inserted and fixed into the third diaphragm insertion groove of the heat exchange body to move the semiconductor processing liquid discharged from the second diaphragm in a third direction. A semiconductor processing liquid temperature maintenance device characterized by:
According to claim 3,
Each of the first, second, and third plates,
It is formed as a downstream flow narrow passage in which the width of one end region is narrower than the width of the other region of the diaphragm, and includes a downstream discharge narrow passage through which the semiconductor processing liquid is moved downstream to the diaphragm disposed downstream through the downstream flow narrow passage,
The downstream discharge narrow passages of each of the first, second, and third partitions are arranged in a zigzag pattern with each other,
A semiconductor processing liquid temperature maintaining device, wherein the lengths of the first and third diaphragms and the lengths of the second diaphragms are formed to be different from each other.
According to claim 4,
The thermoelectric element portion of the first heat exchange module portion is disposed to face one side of the downstream discharge narrow passage portion, and the thermoelectric element portion of the second heat exchange module portion is disposed to face the other side of the downstream discharge narrow passage portion, thereby forming one side of the downstream discharge narrow passage portion. A semiconductor processing liquid temperature maintenance device characterized in that it exchanges heat with the semiconductor processing liquid moving downstream through the other side.
According to claim 2,
The heat sink part,
Coolant tube portion through which coolant flows inside,
A first heat sink body portion formed with an insertion groove on the bottom of the tube into which the bottom of the coolant tube portion is inserted and seated,
It includes a second heat sink body portion formed with an upper surface insertion groove into which the upper surface of the coolant tube part is inserted and seated,
Coolant flows inside the coolant tube portion inserted and seated in the insertion groove on the bottom of the tube and the insertion groove on the top of the tube to form the coolant flow path,
The flow connection connection part is,
A device for maintaining the temperature of a semiconductor processing liquid, characterized in that each coolant tube part is connected to each other so that the coolant flowing from the coolant tube part of the first heat exchange module part flows to the coolant tube part of the second heat exchange module part.
According to claim 6,
The coolant tube part,
A semiconductor processing liquid temperature maintenance device characterized by corrugation to lengthen the flow path of the coolant.
According to claim 6,
A semiconductor processing liquid temperature maintaining device, wherein the first heat sink body portion is made of a material with relatively better thermal conductivity compared to the second heat sink body portion and is in contact with one surface of the plurality of thermoelectric element portions, thereby providing relatively better heat dissipation efficiency. .
According to claim 2,
The heat sink part,
A heat sink body portion with an inflow-side coolant flow path and an discharge-side coolant flow path provided on the inside, respectively;
A semiconductor processing liquid temperature maintaining device comprising a louver fin portion disposed inside the heat sink body portion and formed with a louver fin passage to move the coolant flowing in the inlet-side coolant passage to the discharge-side coolant passage.

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