KR20220017246A - Electronic device - Google Patents

Abstract

An electronic device supporting universal serial bus (USB) high-speed charging according to various embodiments of the present disclosure includes a charger for charging a battery, a USB interface module, a memory for storing instructions for charging the battery, and a processor. The USB interface module detects a USB type and perform a battery charging (BC) 1.2 protocol when an external charger and an electronic device are connected to each other. The processor is operatively connected to the memory to control operations of the charger and the USB interface module. The processor determines the USB type based on a result of performing the BC 1.2 protocol, performs high-speed charging when the USB type is a dedicated charging port (DCP), and performs high-speed charging even when the USB type is recognized as a charging downstream port (CDP) or a standard down stream port (SDP).

Description

Electronic device {ELECTRONIC DEVICE}

Various embodiments of the present disclosure relate to an electronic device supporting fast charging and a driving method thereof.

A universal serial bus (USB) is a standard that defines a cable, a connector, and a communication protocol for communication between electronic devices, and the USB interface is widely used in various applications. USB defines standards for power delivery as well as protocols for transmitting and receiving data. As an example, USB power delivery (PD) specifies high power delivery, such as 20V, 5A. When a short circuit in the USB port or a short circuit occurs in the USB cable, charging of the electronic device cannot be performed normally.

In order for the PD charger to have backward compatibility, it follows the Battery charging 1.2 specification. When the battery charging 1.2 protocol is in progress, there are three types that support the USB charging function through D+ and D- of the USB line. (Type) of DCP (Dedicated Charging Port), CDP (Charging Downstream Port), SDP (Standard Down Stream Port) information can be found. DCP supports only the charging function, and SDP and CDP can also transmit data. Common PD chargers support DCP, but in some cases, there may be chargers that support CDP and SDP types. Although it is a DCP PD charger, it may be mistakenly recognized as a CDP or SDP due to a physical contact issue during installation, and if recognized as a CDP or SDP, charging of the electronic device is not performed.

When an electronic device (eg, a smartphone) is connected to a PD charger, it waits for USB communication when it is recognized as a CDP or SDP. At this time, the electronic device waits for a Start of Frame (SOF) packet, and when a corresponding packet does not arrive for 3 ms, the USB device enters a suspend mode. A host having a USB device informs an electronic device that it has an SOF packet or is periodically alive. If the electronic device is connected to the PD charger and recognized as CDP or SDP, USB communication does not work, so it enters the Suspend mode. sends the Suspend IRQ to the battery driver. The battery driver receives the corresponding IRQ to buck off and/or charge off the charging mode of the charger to drain the current to 2.5mA or less. For this reason, even if the PD charger is connected to the electronic device, there is a problem in that when the PD charger is not recognized as DCP due to an implementation problem or communication malfunction, but is recognized as SDP or CPD, charging is not performed. According to various embodiments of the present disclosure, there is provided an electronic device that enables normal PD charging even when entering the USB suspend mode, and a driving method thereof.

The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

In an electronic device supporting universal serial bus (USB) fast charging, an electronic device according to various embodiments of the present disclosure includes a charger for charging a battery, a USB interface module, and an instruction for charging the battery. It may include a stored memory and a processor. The USB interface module may detect a USB type when an external charger and an electronic device are connected, and may perform a battery charging (BC) 1.2 protocol. The processor may be operatively connected to the memory to control operations of the charger and the USB interface module. The processor determines the USB type based on the execution result of the BC 1.2 protocol, and performs fast charging when the USB type is a DCP (Dedicated Charging Port), and the USB type is a CDP (Charging Downstream Port) Alternatively, fast charging can be performed even if it is recognized as a Standard Down Stream Port (SDP).

An electronic device according to various embodiments of the present disclosure is an electronic device supporting universal serial bus (USB) fast charging, in which a charger for charging a battery, a USB interface module, and an instruction for charging the battery are stored. It may include a memory, and a processor. The USB interface module may detect a USB type when an external charger and an electronic device are connected, and may perform a battery charging (BC) 1.2 protocol. The processor may be operatively connected to the memory to control operations of the charger and the USB interface module. The processor, DCP (Dedicated Charging Port), CDP (Charging Downstream Port), SDP (Standard Down Stream Port), DCD (Data contact detect) timeout (timeout) as the USB type based on the result of performing the BC 1.2 protocol ), check the Rp resistance value of the external charger, perform fast charging when the Rp resistance value is a preset value, and when the Rp resistance value is not a preset value, according to the USB type charging can be performed.

An electronic device and a driving method thereof according to various embodiments of the present disclosure receive information of a power data object (PDO) of a PD charger as well as a source capability message delivered by the PD charger to receive information about the USB of the PD charger. It can accurately determine whether communication exists and support fast charging (eg, power delivery (PD) charging) in the case of non-USB communication.

An electronic device and a method of driving the same according to various embodiments of the present disclosure are provided so that fast charging (eg, power delivery (PD) charging) can be normally performed by preventing a USB suspend entry due to a contact failure or disconnection of a USB cable. can do.

The electronic device and the driving method thereof according to various embodiments of the present disclosure may enable normal PD charging even when entering the USB suspend mode.

An electronic device and a driving method thereof according to various embodiments of the present disclosure may improve compatibility of a 3rd party charger.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a perspective view of a front surface of an electronic device according to various embodiments of the present disclosure;
3 is a perspective view of a rear surface of an electronic device according to various embodiments of the present disclosure;
4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;
5 is a diagram illustrating an electronic device according to various embodiments of the present disclosure;
6 is a diagram illustrating a fast charging method of an electronic device according to various embodiments of the present disclosure;
7 is a diagram illustrating an example of BMC (Bi-polar Modulation Communication) communication.
8A is a diagram illustrating a fast charging method of an electronic device according to various embodiments of the present disclosure;
8B is a diagram illustrating a fast charging method of an electronic device according to various embodiments of the present disclosure;
9 is a diagram illustrating an example of a protocol in a data contact detect (DCD) timeout condition.
10 is a diagram illustrating timing of signals according to performance of an adaptive fast charging (AFC) protocol.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. For convenience of description, the sizes of the components shown in the drawings may be exaggerated or reduced, and the present invention is not necessarily limited to the illustrated ones.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140 ) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor (AP)) or a secondary processor 123 (eg, a graphics processing unit, a neural network) that can be operated independently or together with the main processor 121 . It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor (CP) For example, the electronic device 101 includes the main processor 121 and the auxiliary When the processor 123 is included, the sub-processor 123 may be configured to use less power than the main processor 121 or to be specialized for a specified function. , or as part of it.

The coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 123 (eg, an image signal processor or CP) may be implemented as a part of another functionally related component (eg, the camera module 180 or the communication module 190 ). .

According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch set to detect a touch or a pressure sensor set to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support at least one designated protocol that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include at least one lens, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor) and may include at least one CP supporting direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct or IrDA (infrared data association)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and/or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from among the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a millimeter wave (mmWave) antenna module. According to one embodiment, a millimeter wave (mmWave) antenna module is disposed on or adjacent to a printed circuit board, a first surface (eg, bottom surface) of the printed circuit board, and supports a designated high frequency band (eg, mmWave band). a plurality of antennas (eg, an array) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. antenna) may be included.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . The external electronic device 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations performed by the electronic device 101 may be executed by at least one of the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, the request may be made to at least one external electronic device to perform a function or at least a part of a service thereof. At least one external electronic device that has received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), distributed computing, or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to various embodiments of the present disclosure is not limited to the aforementioned devices.

2 is a perspective view of a front surface of an electronic device according to various embodiments of the present disclosure; 3 is a perspective view of a rear surface of an electronic device according to various embodiments of the present disclosure;

2 and 3 , the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment has a first surface (or front) 210A, a second surface (or a rear surface). ) 210B, and a housing 210 including a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C.

According to an embodiment, the first surface 210A may be formed by the front plate 202 (eg, a glass plate including various coating layers or a polymer plate), at least a portion of which is substantially transparent. The second surface 210B may be formed by the substantially opaque back plate 211 . The back plate 211 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be The side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure 218 (or “side member”) including a metal and/or a polymer. In some embodiments, the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 202 includes two first regions 210D that extend seamlessly from the first surface 210A toward the rear plate 211 by bending the front plate. It can include both ends of the long edge (long edge) of (202). In the illustrated embodiment (refer to FIG. 3 ), the rear plate 211 has two second regions 210E that extend seamlessly from the second surface 210B toward the front plate 202 with long edges. It can be included at both ends. In some embodiments, the front plate 202 (or the back plate 211 ) may include only one of the first regions 210D (or the second regions 210E). In some embodiments, some of the first regions 210D or the second regions 210E may not be included. In the above embodiments, when viewed from the side of the electronic device 200 , the side bezel structure 218 is the first side bezel structure 218 on the side that does not include the first regions 210D or the second regions 210E. It may have a thickness (or width) of 1, and a second thickness that is thinner than the first thickness on the side surface including the first regions 210D or the second regions 210E.

According to an embodiment, the electronic device 200 includes a display 201 (eg, the display module 160 of FIG. 1 ), an input device 203 (eg, the input module 150 of FIG. 1 ), and a sound output. Devices 207 and 214 (eg, sound output module 155 in FIG. 1 ), sensor modules 204 and 219 (eg, sensor module 176 in FIG. 1 ), camera modules 205 , 212 , 213 ( Example: At least one of the camera module 180 of FIG. 1 ), a key input device 217 , an indicator (not shown), and connectors 208 and 209 may be included. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or an indicator) or additionally include other components.

The display 201 (eg, the display module 160 of FIG. 1 ) may be visible through, for example, an upper portion of the front plate 202 . In some embodiments, at least a portion of the display 201 may be visible through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. The display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module 204 , 219 , and/or at least a portion of the key input device 217 is located in the first area 210D and/or the second area 210E. can be placed.

In some embodiments (not shown), at least one of an audio module 214 , a sensor module 204 , a camera module 205 (eg, an image sensor), and a fingerprint sensor on a rear surface of the screen display area of the display 201 . may include more than one. In some embodiments (not shown), the display 201 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed. In some embodiments, at least a portion of the sensor module 204 , 219 , and/or at least a portion of the key input device 217 , the first area 210D, and/or the second area 210E can be placed in

The input device 203 may include a microphone. In some embodiments, the input device 203 may include a plurality of microphones disposed to detect the direction of sound. The sound output devices 207 and 214 may include speakers 207 and 214 . The speakers 207 and 214 may include an external speaker 207 and a receiver for calls (eg, the audio module 214 ). In some embodiments, an input device 203 (eg, a microphone), speakers 207 , 214 and connectors 208 , 209 are disposed in the space of the electronic device 200 , and at least one formed in the housing 210 . It can be exposed to the external environment through the hole of In some embodiments, the hole formed in the housing 210 may be commonly used for the input device 203 (eg, a microphone) and the speakers 207 and 214 . In some embodiments, the speakers 207 and 214 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 210 .

The sensor modules 204 and 219 (eg, the sensor module 176 of FIG. 1 ) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. . The sensor modules 204 and 219 include, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first side 210A of the housing 210 . ) (eg, a fingerprint sensor), and/or a third sensor module 219 (eg, an HRM sensor) disposed on the second surface 210B of the housing 210 . The fingerprint sensor may be disposed on the first surface 210A (eg, the display 201 ) and/or the second surface 210B of the housing 210 . The electronic device 200 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.

The camera modules 205 and 212 include a first camera module 205 disposed on the first side 210A of the electronic device 200, and a second camera module 212 disposed on the second side 210B of the electronic device 200, and/or flash 213 . The camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. The first camera module 205 may be disposed under the display panel in an under display camera (UDC) method. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 200 . In some embodiments, a plurality of first camera modules 205 may be disposed on a first surface (eg, a surface on which a screen is displayed) of the electronic device 200 in an under display camera (UDC) manner.

The key input device 217 may be disposed on the side surface 210C of the housing 210 . In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the not included key input devices 217 may be displayed on the display 201 as soft keys, etc. It can be implemented in the form In some embodiments, the key input device 217 may be implemented using a pressure sensor included in the display 201 .

The indicator may be disposed, for example, on the first surface 210A of the housing 210 . The indicator may provide, for example, state information of the electronic device 200 in the form of light. In another embodiment, the indicator may provide, for example, a light source that is interlocked with the operation of the camera module 205 . Indicators may include, for example, LEDs, IR LEDs and xenon lamps.

The connectors 208 and 209 may include a first connector hole 208 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole 209 (or earphone jack) that can be accommodated for a connector for transmitting and receiving audio signals. The first connector hole 208 may include a USB (Universal Serial Bus) type A port or a USB type C port. When the first connector hole 208 supports USB C type, the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) may support USB power delivery (PD) charging.

Some of the camera modules 205 and 212 , some of the camera modules 205 , some of the sensor modules 204 and 219 , or an indicator may be arranged to be visible through the display 201 . The camera module 205 may be disposed to overlap the display area, and may also display a screen in a display area corresponding to the camera module 205 . Some sensor modules 204 may be arranged to perform their functions without being visually exposed through the front plate 202 in the internal space of the electronic device.

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

Referring to FIG. 4 , according to various embodiments, the electronic device 300 (eg, the electronic device 101 of FIG. 1 or the electronic device 200 of FIG. 2 ) may include a side member 310 (eg, a side bezel). structure), a first supporting member 311 (eg, a bracket or a supporting structure), a front plate 320 (eg, a front cover), a display 400 (eg, the display module 160 of FIG. 1 or the display module 160 of FIG. 2 ) Display 201), a printed circuit board 340, a battery 350 (eg, the battery 189 of FIG. 1), a second support member 360 (eg, a rear case), an antenna 370 (eg, FIG. 1) of the antenna module 197), and a rear plate 380 (eg, a rear cover).

In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 1 or the electronic device 200 of FIG. 3 , and overlapping Description will be omitted below.

According to various embodiments, the first support member 311 may be disposed inside the electronic device 300 and connected to the side member 310 , or may be integrally formed with the side member 310 . The first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 311 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface. The printed circuit board 340 may be equipped with a processor, a memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

According to an embodiment, the printed circuit board 340 may include a plurality of printed circuit boards and at least one interposer. As an example, the plurality of printed circuit boards may include a package substrate.

According to an embodiment, the plurality of printed circuit boards are a printed circuit board formed of a material (eg, FR4) having a non-bending property, or a flexible printed circuit having a bendable property (or flexible property). It may be a substrate (FPCB).

According to an embodiment, the printed circuit board 340 may include an area (eg, a flexible area) (eg, FPCB or RFPCB) having a property of being bent or bent. In one example, the flexible region may include a base film (or substrate) and a copper foil layer. For example, the flexible region may be a flexible copper clad layer (FCCL) in which at least one copper clad is laminated on at least a portion of at least one of the top or bottom of the polyimide film. have.

According to an embodiment, the memory may include, for example, the volatile memory 132 of FIG. 1 or the non-volatile memory 134 of FIG. 1 .

According to an embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to an embodiment, the battery 350 (eg, the battery 189 of FIG. 1 ) is a device for supplying power to at least one component of the electronic device 300 , for example, non-rechargeable primary cells, or rechargeable secondary cells, or fuel cells. At least a portion of the battery 350 may be disposed on a substantially same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 . In another embodiment, the battery 350 may be detachably disposed from the electronic device 300 .

According to an embodiment, the antenna 370 may be disposed between the rear plate 380 and the battery 350 , for example. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side member 310 and/or the first support member 311 or a combination thereof.

According to an embodiment, the shielding structure (not shown) (or shield can) may be formed of a conductive material (eg, metal) and disposed on at least one region of the printed circuit board 340 , A plurality of electronic components (eg, a processor, a memory, an interface, a communication module, a sensor module, and/or a connection terminal) disposed on the printed circuit board 340 may be electromagnetically shielded.

According to various embodiments, the first support member 311 of the side member 310 may have a first surface 3101 facing the front plate 320 and a direction opposite to the first surface 3101 (eg, a rear plate direction). and a second surface 3102 facing toward According to some embodiments, the camera module 180 (eg, the camera module 180 of FIG. 1 ) may be disposed between the first support member 311 and the rear plate 380 . According to an embodiment, the camera module 180 protrudes in the direction of the front plate 320 through the through hole 301 connected from the first surface 3101 to the second surface 3102 of the first support member 311 . It may be arranged to be visible or to be visible. According to an embodiment, the portion protruding through the through hole 301 of the camera module 180 may be disposed to detect the external environment at a corresponding position of the display 400 . In another embodiment, when the camera module 180 is disposed between the display 400 and the first support member 311 , the through hole 301 may be unnecessary.

5 is a diagram illustrating an electronic device according to various embodiments of the present disclosure;

Referring to FIG. 5 , an electronic device 500 (eg, the electronic device 101 of FIG. 1 or the electronic device 200 of FIG. 2 ) according to various embodiments of the present disclosure provides over-voltage protection (OVP). IC (integrated circuit) 510, charger 520, charger (eg, battery driver, power management module 188 of FIG. 1), battery 530, battery (eg, battery 189 of FIG. 1); Configuration channel power delivery (CCPD) IC 540 (eg, processor 120 of FIG. 1 ), MUIC 550 (eg, MUX IC) (eg, processor 120 of FIG. 1 ), application processor 560 , AP ) (eg, the main processor 121 of FIG. 1 ), and communication processors 570 and CP (eg, the auxiliary processor 123 of FIG. 1 ).

The overcharge prevention IC 510 may detect the voltage supplied from the PD charger 400 to prevent the overvoltage from being supplied to the electronic device 500 .

The charger 520 may charge the battery 530 with current supplied from the PD charger 400 .

The CCPD IC 540 (eg, a USB interface module) may determine a USB type (eg, USB Type-C) when the PD charger 400 and the electronic device 500 are connected with a USB cable. The CCPD IC 540 may detect the Rp resistance value of the PD charger 400 . The application processor 560 may determine whether the Rp resistance value detected by the CCPD IC 540 is 56K ohms. The CCPD IC 540 may be connected to a CC pin.

The MUIC 550 (eg, a USB interface module) includes a 1:N switch structure, and the N terminal includes the USB of the application processor 560, UART of the communication processor 570: Universal asynchronous receiver/transmitter), and/or An audio codec may be switched. The MUIC 550 may be connected to a D+ pin and a D- pin. The MUIC 550 is a first logic circuit 552 for performing a battery charging (BC) 1.2 protocol prescribed by the battery charging working group and fast charging (eg, adaptive fast charging (AFC) for). A second logic circuit 554 may be included.

In FIG. 5, each of the CCPD IC 540 and the MUIC 550 is illustrated as an example and described as a separate module. However, the present invention is not limited thereto, and the electronic device 500 may include a USB interface module. The USB interface module may include a CCPD IC 540 and a MUIC 550 . That is, the CCPD IC 540 and the MUIC 550 may be integrated into one module to be implemented as a USB interface module. Also, the CCPD IC 540 and the MUIC 550 may be integrated into one module (eg, the MUIC 550 may be integrated into the CCPD IC 540). As an example, when the MUIC 550 is integrated into the CCPD IC 540 and configured as one module, it may be referred to as an integrated CCPD IC 540 .

The application processor 560 may include a USB PHY, and may control the operation of the charger 520 , the CCPD IC 540 , the MUIC 550 , and the CP 570 . The application processor 560 may perform fast charging when the method of the PD charger 400 is recognized as a DCP (Dedicated Charging Port). Also, the application processor 560 may perform fast charging even when the PD charger 400 is recognized as a charging downstream port (CDP) or a standard down stream port (SDP). In addition, when communicating with the PD charger 400 , the application processor 560 may perform fast charging even when it is recognized as a data contact detect (DCD) timeout.

The CCPD IC 540 uses a data connection detection current (eg, IDP_SRC) to connect the PD charger 400 and the electronic device 500 to a connection event (eg, a USB cable between the PD charger 400 and the electronic device 500 ). During connection), it is possible to detect when the data pin has been touched. If the PD charger 400 does not implement DCD, it may wait for a preset timeout period after a connection event before starting the primary detection. The CCPD IC 540 may detect a data pin contact whenever the PD charger 400 is connected to the SDP or CDP.

The PD charger 400 and the electronic device 500 (eg, the electronic device 101 of Fig. 1 ) may be connected with a USB cable 501 (eg, a USB C type cable). The first side of the USB cable 501 is an electronic device It may be connected to a connector hole (eg, the first connector hole 208 of FIG. 2 ) of 500 , and a second side of the USB cable 501 may be connected to the PD charger 400 . USB Power Delivery (PD) charging may be performed by receiving a current from the PD charger 400. The USB cable 501 connects a power line and a data line (eg, a CC line, a D+/D- line, and a GND line). may include

The overcharge protection IC 510 and the charger 520 are connected by the Vbus line 502, the PD charger 400 and the CCPD IC 540 are connected by the CC line 503, and the PD charger 400 and the MUIC ( The 550 may be connected to the data line 504 (eg, D+, D-). The charger 520 , the CCPD IC 540 , the MUIC 550 , and the application processor 560 are connected through the I2C line 505 to transmit/receive signals in an I2C manner.

6 is a diagram 600 illustrating a method of fast charging an electronic device according to various embodiments of the present disclosure. 7 is a diagram illustrating an example of BMC (Bi-polar Modulation Communication) 　 communication.

6 and 7 , when the PD charger 400 and the electronic device 500 are connected for charging, CC through the Rp resistance value of the PD charger 400 and the Rd resistance value of the electronic device 500 (configuration channel) detection may be performed.

In operation 610 , the CCPD IC 540 of the electronic device 500 may detect a USB type (eg, USB Type-C).

In operation 620 , the PD charger 400 may output a Vbus signal, and the electronic device 500 may detect a Vbus signal from the PD charger 400 . The MUIC 550 may perform a battery charging (BC) 1.2 protocol when a Vbus signal is detected. Here, the USB plug and the receptacle are designed so that, when the plug is inserted into the receptacle, the power pin first contacts the data pin before the data pin contacts. Thus, the Vbus signal can be sensed before the data pin makes contact. The contact time between the power pin and the data pin can vary depending on how quickly the plug is inserted into the outlet.

The MUIC 550 may switch to the USB side of the application processor 560 when the BC 1.2 protocol is determined to be a Standard Down Stream Port (SDP) method or a Charging Downstream Port (CDP) method as a result of performing the BC 1.2 protocol. On the other hand, when the MUIC 550 is determined to be a DCP (Dedicated Charging Port) method as a result of the BC 1.2 protocol, it may maintain an open state.

As a result of performing the BC 1.2 protocol according to operation 620, if the DCP method having only a charging function is selected, in operation 630, the PDO (Power data object) value transmitted from the PD charger 400 communicating with the CC terminal is stored. can be checked Here, PD charging may be performed by setting a desired voltage/current in the electronic device 500 based on the PDO value.

In addition, after CC detection is made, the CCPD IC 540 may start Bi-polar Modulation Communication (BMC) communication for charging the PD. When the PD charger 400 and the electronic device 500 are connected, the BC 1.2 protocol may be performed through the data line 504 and communication through the CC line 503 line may be simultaneously performed (refer to FIG. 7 ). That is, it can be seen that the operation waveform P1 according to the execution of the BC 1.2 protocol and the waveform P2 of the communication through the CC line 503 line are simultaneously generated in FIG. 7 .

As a result of performing the BC 1.2 protocol, when SDP or CDP is recognized, the electronic device 500 operates in suspend mode. In the suspend mode, the specified suspend current is prescribed to use 2.5 mA or less. Accordingly, when the electronic device 500 operates in the suspend mode, the battery 530 cannot be normally charged. In the present disclosure, even if it is recognized as SDP or CDP as a result of the BC 1.2 protocol, fast charging can be performed by performing an operation for checking a source capability message without directly entering the suspend mode.

As a result of performing the BC 1.2 protocol according to operation 620 , if it is recognized as SDP or CDP, in operation 640 , the application processor 560 , the source function message received from the charger 400 through the CCPD IC 540 . capability message) can be checked. The application processor 560 may check the source capability message from the CCPD IC 540 to check bits of information included in the source capability message.

In operation 650 , the application processor 560 may check B26 (USB communication capable) bit information and B28 (USB suspend supported) bit information among information of the source capability message of Table 1 .

In operation 650 , the application processor 560 may determine whether both the B26 (USB communication capable) and B28 (USB suspend supported) bits of the source capability message are '1'. Here, the application processor 560 may perform fast charging based on the information of the B26 (USB communication capable) and B28 (USB suspend supported) bits of the source capability message.

As a result of the determination of operation 650, the application processor 560 may determine that the suspend mode is not normal when any one of B26 (USB communication capable) and B28 (USB suspend supported) is not '1'. In operation 660, if it is determined that the application processor 560 is not in the normal suspend mode, it may proceed with normal PD charging using the checked PDO value.

As a result of the determination of operation 650, the application processor 560 determines that the PD charger 400 supports both USB communication and suspend mode when B26 (USB communication capable) and B28 (USB suspend supported) are both '1'. can do. Accordingly, the application processor 560 may transmit the USB suspend IRQ to the charger 520 (eg, a battery driver). Here, the application processor 560 may check whether USB communication is supported through the B26 (USB communication capable) bit. The application processor 560 may check whether USB suspend mode is supported through the B28 (USB suspend supported) bit.

In operation 670, an output terminal of the MUIC 550 may be switched to an AP D+ terminal and an AP D- terminal for USB communication. The application processor 560 of the USB PHY stage may wait for a packet from the USB host (eg, the PD charger 400) for 3 ms. If a packet from the USB host is not received for 3 ms, the application processor 560 may recognize the suspend mode.

In operation 680 , the application processor 560 may control the charger 520 to operate in a charger buck off mode. When the charger 520 operates in the charger buck-off mode, charging of the battery 530 may be stopped.

A contact error may occur because the USB cable 501 is old or foreign substances are caught in the connector. When the impedance of the data line 504 is changed, it may be recognized as CDP or SDP instead of DCP, and may be misrecognized as a data contact detect (DCD) timeout. If the electronic device 500 is charged in this state, it may be charged at a low speed or may not be charged. When the electronic device 500 is charged, it is recognized as a CDP or SDP or is misrecognized as a DCD timeout, thereby improving the problem of slow charging or inability to charge.

8A is a diagram 800 illustrating a fast charging method of an electronic device according to various embodiments of the present disclosure. 9 is a diagram illustrating an example of a protocol in a data contact detect (DCD) timeout condition.

5, 8A, and 9 , in operation 810 , when the PD charger 400 and the electronic device 500 are connected with the USB cable 501 , the CCPD IC 540 of the electronic device 500 is connected to the USB Type (eg USB Type-C) can be detected.

In operation 820 , the PD charger 400 may output a Vbus signal, and the electronic device 500 may detect a Vbus signal from the PD charger 400 . The MUIC 550 may perform a battery charging (BC) 1.2 protocol when a Vbus signal is detected. When the MUIC 550 is recognized as DCP as a result of the BC 1.2 protocol, operation 830 may be performed. Without being limited thereto, the MUIC 550 may perform operation 830 even when it is recognized as a CDP or SDP as a result of performing the BC 1.2 protocol, or as a data contact detect (DCD) timeout.

In operation 830 , the CCPD IC 540 may detect the Rp resistance value when the PD charger 400 and the electronic device 500 are connected with the USC cable. The application processor 560 may determine whether the Rp resistance value detected by the CCPD IC 540 is 56K ohms.

As a result of determination in operation 830, if the Rp resistance value is not 56K ohms, in operation 840, the application processor 560 controls the operation of the charger 520 to perform charging (eg, low-speed charging) according to USB Type C can do.

As a result of the determination in operation 830 , if the Rp resistance value is 56K ohms, in operation 850 , the application processor 560 may determine whether fast charging is possible. As an example, the application processor 560 may determine whether adaptive fast charging (AFC) charging is possible. Here, the application processor 560 may perform the AFC protocol with the PD charger 400 even if it is recognized as a CDP, SDP, or DCD timeout.

As a result of the determination of operation 850, if the AFC protocol is normally performed and AFC is recognized, fast charging may be performed in the AFC method. That is, when AFC charging is possible, in operation 860 , the application processor 560 may control the operation of the charger 520 to perform fast charging in the AFC method.

As shown in FIG. 9 , the MUIC 550 transmits a command to the MUIC 550 to perform the AFC protocol from the application processor 560 even if a DCD timeout is recognized when the BC 1.2 protocol is performed, and the MUIC 550 ), AFC communication handshaking may be performed.

When a response to the AFC protocol is received, the MUIC 550 performs AFC communication handshaking, and after the AFC communication handshaking, the application processor 560 controls the operation of the charger 520 to control the operation of the battery ( 530) will proceed with the fast charging.

10 is a diagram illustrating timing of signals according to performance of an adaptive fast charging (AFC) protocol.

Referring to FIG. 10 , when AFC support is confirmed through the AFC protocol, it can be recognized as DCP. In this case, D+ and D- of the data line 504 are shorted for at least 1 second to at most 1.4 seconds. and D- may be connected to the ground (GND).

Again, referring to FIGS. 5 and 8A , as a result of determination of operation 850, if AFC charging is not possible, the application processor 560 performs a protocol of qualcomm charging (QC) in operation 870 to charge Qualcomm It can be determined whether (QC: qualcomm charging) can be performed.

If it is determined in operation 870 that QC can be performed, the application processor 560 may perform fast charging of the battery 530 in the QC method in operation 880 .

If it is determined in operation 870 that QC cannot be performed, in operation 890 , the application processor 560 may perform an operation (eg, data transmission or low-speed charging) based on the recognition of USB Type-C.

The present invention is not limited thereto, and as a result of the determination of operation 870 , when QC cannot be performed, the application processor 560 may additionally check another charging protocol before performing operation 890 .

8B is a diagram 800-1 illustrating a fast charging method of an electronic device according to various embodiments of the present disclosure. In the description of the fast charging method of the electronic device according to FIG. 8B , a detailed description of the same operation as the fast charging method of the electronic device described with reference to FIG. 8A may be omitted.

Referring to FIG. 8B, as an example, if QC cannot be performed in operation 870, in operation 871, the MUIC 550 performs a Super Charging Protocol (SCP) protocol, and the application processor 560 is the SCP protocol. Based on the execution result, it can be judged whether SCP execution is possible.

When the SCP charging method is recognized as a result of the SCP protocol, in operation 872 , the application processor 560 controls the operation of the charger 520 to quickly charge the battery 530 of the electronic device 500 using the SCP charging method. can

As an example, if it is determined in operation 871 that SCP cannot be performed, in operation 873 , the MUIC 550 performs a pump express (PE) protocol, and the application processor 560 performs the PE protocol based on the result of the execution of the PE protocol. Thus, it can be determined whether PE execution is possible.

When the PE charging method is recognized as a result of the PE protocol, in operation 874 , the application processor 560 controls the operation of the charger 520 to quickly charge the battery 530 of the electronic device 500 in the PE method. have.

As an example, as a result of determination in operation 873, if PE execution is not possible, in operation 875, the MUIC 550 performs a Voltage Open Loop Multi-step Constant-Current Charging (VOOC) protocol, and the application processor 560 can determine whether VOOC execution is possible based on the execution result of the VOOC protocol.

If the VOOC charging method is recognized as a result of the VOOC protocol, in operation 876 , the application processor 560 controls the operation of the charger 520 to quickly charge the battery 530 of the electronic device 500 in the VOOC method. have.

As a result of the determination of operation 875, if VOOC is not possible, charging in AFC, QC, SCP, PE, and VOOC methods is not possible. data transfer or slow charging).

An electronic device and a driving method thereof according to various embodiments of the present disclosure receive information of a power data object (PDO) of a PD charger as well as a source capability message delivered by the PD charger to receive information about the USB of the PD charger. It is possible to accurately determine whether communication exists, and support fast charging (eg, power delivery (PD) charging in the case of non-USB communication).

An electronic device and a method of driving the same according to various embodiments of the present disclosure are provided so that fast charging (eg, power delivery (PD) charging) can be normally performed by preventing a USB suspend entry due to a contact failure or disconnection of a USB cable. can do.

The electronic device and the driving method thereof according to various embodiments of the present disclosure may enable normal PD charging even when entering the USB suspend mode

An electronic device and a driving method thereof according to various embodiments of the present disclosure may improve compatibility with a 3rd party charger.

The electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure are chargers for charging the battery 530 in the electronic devices 101 , 200 , and 500 supporting universal serial bus (USB) fast charging. (520, charger), the USB interface modules 540 and 550, and a memory (eg, the memory of FIG. 1 ) storing instructions for charging the batteries (the battery 189 in FIG. 1 and the battery 530 in FIG. 5 ). 130) and a processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5). The USB interface modules 540 and 550 detect a USB type when an external charger (eg, the PD charger 400 of FIG. 5 ) and the electronic device 101 , 200 , 500 are connected, and a battery charging (BC) 1.2 protocol can be performed. The processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) is operatively connected to the memory (eg, the memory 130 of FIG. 1 ) to the charger 520 , and the The operation of the USB interface modules 540 and 550 may be controlled. The processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ) determines the USB type based on the BC 1.2 protocol execution result, and the USB type is DCP (Dedicated Charging Port) ), fast charging is performed, and fast charging can be performed even when the USB type is recognized as a CDP (Charging Downstream Port) or SDP (Standard Down Stream Port).

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ) performs the BC 1.2 protocol As a result, even if it is recognized as a data contact detect (DCD) timeout, fast charging can be performed.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, in the processor (eg, the processor 120 of FIG. 1 , and the application processor 560 of FIG. 5 ), the USB type is the CDP Alternatively, if the SDP is recognized, a source capability message received from the USB interface modules 540 and 550 may be checked.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) checks the source function message Even when the CDP or the SDP is recognized based on the result, fast charging can be performed.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) may include information on the source function message Among them, if at least one of B26 (USB communication capable) bit information and B28 (USB suspend supported) bit is not '1', fast charging can be performed.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) may include information on the source function message Among them, if both the B26 (USB communication capable) bit information and the B28 (USB suspend supported) bit are '1', the suspend mode is recognized and the charger 520 can be bucked off.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the processor (eg, the processor 120 of FIG. 1 , and the application processor 560 of FIG. 5 ) may perform the external Waits for a packet from a charger (eg, the PD charger 400 of FIG. 5), and if a packet is not received from the external charger (eg, the PD charger 400 of FIG. 5) for the preset time, the suspend mode can recognize

The electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure are chargers for charging the battery 530 in the electronic devices 101 , 200 , and 500 supporting universal serial bus (USB) fast charging. (520, charger), the USB interface modules 540 and 550, and a memory (eg, the memory ( 130)) (memory), and a processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ). The USB interface modules 540 and 550 detect a USB type when an external charger (eg, the PD charger 400 of FIG. 5 ) and the electronic device 101 , 200 , 500 are connected, and a battery charging (BC) 1.2 protocol can be performed. The processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) is operatively connected to the memory (eg, the memory 130 of FIG. 1 ) to the charger 520 , and the The operation of the USB interface modules 540 and 550 may be controlled. The processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) uses a DCP (Dedicated Charging Port), a CDP (Charging Downstream Port) as the USB type based on a result of the BC 1.2 protocol. ), SDP (Standard Down Stream Port), DCD (Data contact detect) to detect one of the timeout (timeout), and check the Rp resistance value of the external charger (eg, PD charger 400 in FIG. 5), When the Rp resistance value is a preset value, fast charging may be performed, and when the Rp resistance value is not a preset value, charging according to the USB type may be performed.

In the electronic devices 101, 200, and 500 according to various embodiments of the present disclosure, in the application processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ), the Rp resistance value is You can check whether it is 56K ohm.

In the electronic devices 101, 200, and 500 according to various embodiments of the present disclosure, in the application processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ), the Rp resistance value is If it is not 56K ohm, charging may be performed according to the USB type.

In the electronic devices 101, 200, and 500 according to various embodiments of the present disclosure, in the application processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ), the Rp resistance value is In the case of a preset value, the first protocol for the first fast charging is performed to determine whether the first fast charging is possible, and when the first fast charging is possible, the battery (the battery in FIG. 1 ) in the first fast charging method (189), the battery 530 of FIG. 5) may be charged.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 , and the application processor 560 of FIG. 5 ) is the first protocol. An adaptive fast charging (AFC) protocol is performed, and when AFC is recognized as a result of performing the AFC protocol, fast charging may be performed in the AFC method.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) may include the first fast charging If this is not possible, it is determined whether the second fast charging is possible by performing a second protocol for the second fast charging, and if the second fast charging is possible, the battery (shown in FIG. 1 ) in the second fast charging method. The battery 189 and the battery 530 of FIG. 5 may be charged.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 , and the application processor 560 of FIG. 5 ) is the second protocol. A protocol of qualcomm charging (QC) is performed, and when the QC is recognized as a result of performing the QC protocol, fast charging can be performed in the QC method.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 , the application processor 560 of FIG. 5 ) may include the second fast charging If this is not possible, it is determined whether the third fast charging is possible by performing a third protocol for the third fast charging, and if the third fast charging is possible, the battery (shown in FIG. 1 ) in the third fast charging method. The battery 189 and the battery 530 of FIG. 5 may be charged.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ) is the third protocol. Super Charging Protocol (SCP), Pump Express (PE), or Voltage Open Loop Multi-step Constant-Current Charging (VOOC) protocols can be performed.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ) of the third protocol If the SCP is recognized as a result of the performance, fast charging can be performed in the SCP method.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ) of the third protocol If the PE is recognized as a result of the performance, fast charging can be performed in the PE method.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processor (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ) of the third protocol If the VOOC is recognized as a result of the execution, high-speed charging may be performed in the VOOC method.

In the electronic devices 101 , 200 , and 500 according to various embodiments of the present disclosure, the application processors (eg, the processor 120 of FIG. 1 and the application processor 560 of FIG. 5 ) may include the first to first 3 When fast charging is not possible, an operation based on the recognition of the USB type may be performed.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of this document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and for example, is interchangeable with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include software (eg, a program) including one or more instructions stored in a storage medium (eg, internal memory or external memory) readable by a machine (eg, an electronic device). ) can be implemented as For example, a processor (eg, processor) of a device (eg, an electronic device) may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

101, 200, 500: electronic device 400: PD charger
501: USB cable 502: Vbus line
503: CC line 504: data line
505: I2C line 510: OVP IC
520: charger 530: battery
540: CCPD IC 550: MUIC
560: application processor (AP)
570: Communication Processor (CP)

Claims (20)

In an electronic device supporting universal serial bus (USB) fast charging,
a charger for charging the battery;
a USB interface module that detects a USB type when an external charger and an electronic device are connected and performs a battery charging (BC) 1.2 protocol;
a memory storing instructions for charging the battery; and
A processor operatively connected to the memory to control operations of the charger and the USB interface module;
The processor is
Determining the USB type based on the execution result of the BC 1.2 protocol,
When the USB type is DCP (Dedicated Charging Port), fast charging is performed,
An electronic device that performs high-speed charging even when the USB type is recognized as a CDP (Charging Downstream Port) or SDP (Standard Down Stream Port). The method according to claim 1,
The processor is
An electronic device that performs fast charging even if it is recognized as a DCD (Data contact detect) timeout as a result of performing the BC 1.2 protocol. The method according to claim 1,
The processor is
and checking a source capability message received from the USB interface module when the USB type is recognized as the CDP or the SDP. 4. The method according to claim 3,
The processor is
and performing fast charging even when the CDP or the SDP is recognized based on a result of checking the source function message. 5. The method according to claim 4,
The processor is
If at least one of B26 (USB communication capable) bit information and B28 (USB suspend supported) bit among the information of the source function message is not '1', the electronic device performs fast charging. 5. The method according to claim 4,
The processor is
If both B26 (USB communication capable) bit information and B28 (USB suspend supported) bit (bit) of the information of the source function message are '1', it is recognized as a suspend mode and the charger is bucked off. Device. 7. The method of claim 6,
The processor is
The electronic device waits for a packet from the external charger for a preset time, and recognizes as the suspend mode if a packet is not received from the external charger for the preset time. In an electronic device supporting universal serial bus (USB) fast charging,
a charger for charging the battery;
a USB interface module that detects a USB type when an external charger and an electronic device are connected and performs a battery charging (BC) 1.2 protocol;
a memory storing instructions for charging the battery; and
A processor operatively connected to the memory to control operations of the charger and the USB interface module;
The processor is
DCP (Dedicated Charging Port), CDP (Charging Downstream Port), SDP (Standard Down Stream Port), DCD (Data contact detect) timeout (timeout) one of the USB type based on the execution result of the BC 1.2 protocol detect,
Check the Rp resistance value of the external charger,
Fast charging is performed when the Rp resistance value is a preset value,
When the Rp resistance value is not a preset value, the electronic device performs charging according to the USB type. 9. The method of claim 8,
The application processor is
Checking whether the Rp resistance value is 56K ohm (ohm), the electronic device. 10. The method of claim 9,
The application processor is
When the Rp resistance value is not 56K ohms, the electronic device performs charging according to the USB type. 10. The method of claim 9,
The application processor is
When the Rp resistance value is a preset value, a first protocol for the first fast charging is performed to determine whether the first fast charging is possible,
and charging the battery in the first fast charging method when the first fast charging is possible. 12. The method of claim 11,
The application processor is
performing an adaptive fast charging (AFC) protocol as the first protocol;
When AFC is recognized as a result of performing the AFC protocol, the electronic device performs fast charging in the AFC method. 12. The method of claim 11,
The application processor is
If the first fast charging is not possible, performing a second protocol for the second fast charging to determine whether the second fast charging is possible,
and charging the battery in the second fast charging method when the second fast charging is possible. 14. The method of claim 13,
The application processor is
Performing a protocol of Qualcomm charging (QC: qualcomm charging) as the second protocol,
When the QC is recognized as a result of performing the QC protocol, the electronic device performs fast charging in the QC method. 14. The method of claim 13,
The application processor is
If the second fast charging is not possible, performing a third protocol for the third fast charging to determine whether the third fast charging is possible,
and charging the battery in the third fast charging method when the third fast charging is possible. 16. The method of claim 15,
The application processor is
An electronic device that performs a Super Charging Protocol (SCP), Pump Express (PE), or Voltage Open Loop Multi-step Constant-Current Charging (VOOC) protocol as the third protocol. 17. The method of claim 16,
The application processor is
When the SCP is recognized as a result of performing the third protocol, the electronic device performs fast charging in the SCP method. 17. The method of claim 16,
The application processor is
When the PE is recognized as a result of performing the third protocol, the electronic device performs fast charging in the PE method. 17. The method of claim 16,
The application processor is
When the VOOC is recognized as a result of performing the third protocol, the electronic device performs fast charging in the VOOC method. 17. The method of claim 16,
The application processor is
When the first to third fast charging is not possible, the electronic device performs an operation based on the recognition of the USB type.

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