KR20210124174A - Compositions, prepregs, resin sheets, laminates, and printed wiring boards - Google Patents

Abstract

A composition for suppressing back exposure of a photosensitive composition cured with light having a wavelength of 350 to 420 nm, a compound having a naphthalene skeleton and a substituent bonded to at least the 2-position and/or 7-position of the naphthalene ring contained in the naphthalene skeleton ( A) A composition containing.

Description

Compositions, prepregs, resin sheets, laminates, and printed wiring boards

The present invention relates to a composition and to a method for manufacturing a prepreg, a resin sheet, a laminated board, a metal foil-clad laminate, a printed wiring board, and a printed wiring board using the composition.

Various processes are given to a printed wiring board in circuit formation. For example, after forming circuit grooves in the insulating layer on the surface of the printed wiring board using a laser processing machine, a method of forming a wiring circuit by selectively plating the circuit grooves, or using a laser in the insulating layer on the surface of the printed wiring board A method of forming a via hole or the like is known.

Patent Document 1 describes the use of an insulating resin sheet having an ^{absorption coefficient of the cured product of at least 355 nm and 300 cm -1} or more as a sheet suitable for forming a circuit by grooving with a laser and embedding a metal body in the groove. has been A groove can be easily formed in this insulating resin sheet with a laser.

Moreover, in patent document 2, the layer structure suitable for forming a via hole is disclosed, and when forming a via hole, in order to obtain favorable laser processability, using the resin which has high absorptivity in an ultraviolet region is disclosed.

Japanese Laid-Open Patent Publication No. 2016-037545 Japanese Laid-Open Patent Publication No. 2013-080757

Moreover, as a main final process of the processing method of a printed wiring board other than the above, the method of apply|coating a soldering resist to the printed wiring board in which the electronic circuit was formed, and forming the insulating film which protects a circuit pattern is used. Some methods are known as a method of forming a coating film with a solder resist. For example, in the method using a developing type soldering resist, the entire surface is coated with a solder resist on the circuit pattern of a printed wiring board, and a predetermined circuit pattern is obtained. It is performed by letting this produced negative film (mask) pass, exposing to a soldering resist layer, and developing a non-hardened part.

When this method is used for a printed wiring board having electronic circuits formed on both sides, the light irradiated to one side passes through the substrate of the printed wiring board and acts on the solder resist on the opposite side to be removed from the opposite side. A resist residue may be generated in the part to be processed. Thus, what the light irradiated with respect to one surface acts with respect to the soldering resist of the opposite surface is also called back exposure.

Although patent documents 1 and 2 teach using resin excellent in UV absorption performance from a viewpoint of the workability of the laser at the time of circuit formation, both teach about the material used in the process using such a soldering resist It is not a thing, and it does not describe at all also about the subject of the back exposure in the printed wiring board which provided the electronic circuit on both surfaces.

The present invention has been made in view of the above problems, and provides a composition capable of suppressing back exposure, and a method for manufacturing a prepreg, a resin sheet, a laminated board, a metal foil clad laminate, a printed wiring board, and a printed wiring board using the composition aim to do

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the present inventors earnestly examined. As a result, by using a predetermined resin, it is possible to efficiently absorb the exposed light, thereby suppressing that the light irradiated from one surface passes through the base material and acts on the other surface, The present invention has been completed.

That is, the present invention is as follows.

〔One〕

A composition for suppressing back exposure of a photosensitive composition cured with light having a wavelength of 350 to 420 nm, comprising:

A composition comprising a naphthalene skeleton and a compound (A) having a substituent bonded to at least the 2-position and/or the 7-position of the naphthalene ring contained in the naphthalene skeleton.

〔2〕

The composition according to [1], wherein the substituents are each independently represented by the following formula (3).

-OR ¹ (3)

( ^{wherein R 1} is an organic group having 1 to 20 carbon atoms)

[3]

The composition according to [2], wherein the -OR ^{1 group is a glycidyl group.}

〔4〕

The composition according to any one of [1] to [3], wherein the compound (A) is represented by the following formula (1) or (2).

[Formula 1]

(R ² each independently represents a hydrogen atom or an organic group having 1 to 20 carbon atoms)

[Formula 2]

[5]

The composition according to any one of [1] to [4], wherein the content of the compound (A) is 5 to 40 parts by mass based on 100 parts by mass of the resin solid content.

[6]

[1] to [[1] to [ 5] the composition according to any one of the above.

[7]

The composition according to any one of [1] to [6], which is for a printed wiring board.

〔8〕

description and,

A prepreg comprising the composition according to any one of [1] to [7] impregnated or applied to the substrate.

[9]

A resin sheet comprising the composition according to any one of [1] to [7].

[10]

support and

The resin sheet according to [9], having a layer containing the composition laminated on one or both surfaces of the support.

[11]

A laminate comprising at least one layer comprising the prepreg according to [8] or the resin sheet according to [9] or [10].

[12]

The prepreg according to [8] or the resin sheet according to [9] or [10];

A metal foil-clad laminate having a metal foil laminated on the prepreg or the resin sheet.

[13]

an insulating layer,

It has a conductor layer formed on the surface of the insulating layer,

The printed wiring board in which the said insulating layer contains the composition in any one of [1]-[7].

[14]

at least one insulating layer;

a conductor layer disposed on the surface of the outermost layer of the insulating layer;

The coreless printed wiring board in which the said insulating layer contains the composition in any one of [1]-[7].

[15]

A step of preparing a substrate in which at least one insulating layer comprising the composition according to any one of [1] to [7] and at least one conductor layer in contact with the insulating layer are laminated;

forming a layer of a photosensitive composition cured with light having a wavelength of 350 to 420 nm on both surfaces of the substrate;

The manufacturing method of the printed wiring board which has the process of arrange|positioning a mask pattern on the surface of at least one of the said photosensitive composition layer, letting the mask pattern pass, and exposing with the light of wavelength 350-420 nm.

[16]

a process of preparing a core substrate;

To obtain a laminate in which at least one insulating layer comprising the composition according to any one of [1] to [7] and a conductor layer disposed on the outermost surface of the insulating layer are laminated on the core substrate process and

forming a coreless substrate by removing the core substrate from the laminate;

A step of forming a layer of a photosensitive composition cured with light having a wavelength of 350 to 420 nm on both sides of the coreless substrate;

The manufacturing method of the coreless printed wiring board which has the process of arrange|positioning a mask pattern on the surface of at least one of the said photosensitive composition layer, making the mask pattern pass, and exposing with the light of wavelength 350-420 nm.

ADVANTAGE OF THE INVENTION According to this invention, the composition which can suppress back exposure, and the manufacturing method of a prepreg, a resin sheet, a laminated board, a metal foil clad laminated board, a printed wiring board, and a printed wiring board using the said composition can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing of a printed wiring board in the case where back exposure generate|occur|produced.
2 : is a schematic sectional drawing of the printed wiring board at the time of back exposure being suppressed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described in detail, but the present invention is not limited thereto, and various modifications can be made without departing from the gist thereof. .

[Composition]

The composition of this embodiment is a composition for suppressing the back exposure of the photosensitive composition hardened|cured with the light of wavelength 350-420 nm, Comprising: At least 2-position and/or 7-position of a naphthalene skeleton and the naphthalene ring contained in this naphthalene skeleton. The compound (A) which has the substituent couple|bonded with is contained, and you may contain thermosetting resin and fillers other than a compound (A) as needed.

It is for suppressing that the part which photosensitive compositions, such as a soldering resist hardened by the light of wavelength 350-420 nm, did not intend the composition of this embodiment hardening by back exposure.

The schematic sectional drawing of the printed wiring board in case back exposure generate|occur|produces in FIG. 1 is shown, and the schematic sectional drawing of the printed wiring board at the time of back exposure is suppressed in FIG. 1 : about the printed wiring board 10 in which the circuit pattern 2 was formed in both surfaces of the insulating layer 1, the soldering resist 3 is apply|coated, and the soldering resist 3 is applied through the mask 4 from both sides of the insulating layer. An example of irradiating light to In this case, the light irradiated to the surface 3a may pass through the insulating layer 1 and arrive at the side opposite to the irradiation surface (surface 3a). The light reaching the side opposite to the irradiated surface in this way generates a resist residue 5 on the masked back surface 3b side.

On the other hand, the composition of this embodiment contains the compound (A) which has ultraviolet-ray absorption ability by having a predetermined structure. By forming such an insulating layer containing the composition of the present embodiment, the light irradiated to the surface 3a is absorbed by the compound (A) in the process of passing through the insulating layer 1, and the light is transmitted to the irradiated surface (surface ( 3a)) and reaching the opposite side can be suppressed. Thereby, the composition of this embodiment can absorb the light of wavelength 350-420 nm, and can suppress the back exposure of the photosensitive composition hardened|cured.

In addition, by using the composition of this embodiment, back exposure can be suppressed also in any UV exposure using a laser processing and a mask pattern.

[Compound (A)]

The compound (A) has a naphthalene skeleton and a substituent bonded to at least the 2-position and/or the 7-position of the naphthalene ring contained in the naphthalene skeleton. Here, as a substituent, what is each independently represented by following formula (3) is preferable, and it is preferable to have a substituent whose ^{R<1>O- is a glycidyl group.} By using the compound (A) which has such a substituent, there exists a tendency for back exposure to be suppressed more. It is preferable that at least one or more substituents are bonded to the entire naphthalene ring included in the naphthalene skeleton.

-OR ¹ (3)

( ^{wherein R 1} is an organic group having 1 to 20 carbon atoms)

The naphthalene skeleton refers to a skeleton in which two or more naphthalene rings are linked. As a linking group which connects the naphthalene ring, -O-, -CH ₂ -, or a single bond is mentioned, for example. By having such a skeleton, the absorptivity of the light with a wavelength of 350-420 nm improves more, and there exists a tendency for white exposure to be suppressed more. The number of naphthalene rings which form a naphthalene skeleton becomes like this. Preferably it is 2-4, More preferably, it is 2-3, More preferably, it is 2. Moreover, it is preferable that naphthalene skeleton does not contain aryl rings other than a naphthalene ring.

The compound (A) is not particularly limited as long as it is a compound having a naphthalene skeleton and a substituent bonded to at least the 2-position and/or the 7-position of the naphthalene ring contained in the naphthalene skeleton. For example, the following formula (1) or formula The compound represented by (2) is mentioned. Here, the compound represented by the formula (1) is a compound having a naphthalene skeleton to which three naphthalene rings are linked, and a glycidyl group is bonded to the 2-position and/or 7-position of each naphthalene ring, one by one, represented by the formula (2) The compound has a naphthalene skeleton in which two naphthalene rings are linked, and is a compound in which two glycidyl groups are bonded to each of the 2-position and 7-position of each naphthalene ring. By using such a compound, the light absorption performance with a wavelength of 350-420 nm improves more, and there exists a tendency for the suppression performance of white exposure to improve more.

[Formula 3]

(R ² each independently represents a hydrogen atom or an organic group having 1 to 20 carbon atoms)

[Formula 4]

R ² is each independently a hydrogen atom or an organic group having 1 to 20 carbon atoms. Carbon number of an organic group becomes like this. Preferably it is 1-10, More preferably, it is 1-5. Moreover, although it does not restrict|limit especially as an organic group, For example, a C1-C4 alkyl group or aralkyl group is mentioned. Moreover, it is more preferable that all of ^{R<2> are hydrogen.}

To [ content of the compound (A) in the composition of this embodiment / 100 mass parts of resin solid content], Preferably it is 3-50 mass parts, More preferably, it is 5-45 mass parts, More preferably, it is 5 -40 parts by mass. When content of a compound (A) is in the said range, the light absorption performance of wavelength 350-420 nm improves more, and there exists a tendency for the suppression performance of white exposure to improve more.

In addition, in this embodiment, "resin solid content" means the component in the composition of this embodiment except a solvent and a filler, unless otherwise indicated, and "resin solid content of 100 mass parts" means this embodiment It shall say that the sum total of the components excluding the solvent and filler in the composition is 100 mass parts.

In particular, the content of the compound represented by the formula (1) (preferably the compound in ^{which all R 2} is hydrogen) is preferably 10 to 50 parts by mass, more preferably 15 to 45 parts by mass with respect to 100 parts by mass of the resin solid content. It is a mass part, More preferably, it is 30-40 mass parts. When content of the compound represented by Formula (1) is in the said range, the light absorption performance of wavelength 350-420 nm improves more, and there exists a tendency for the suppression performance of white exposure to improve more.

Moreover, with respect to 100 mass parts of resin solid content, content of the compound represented by Formula (2) becomes like this. Preferably it is 5-30 mass parts, More preferably, it is 7.5-25 mass parts, More preferably, it is 10-20 mass parts. is wealth When content of the compound represented by Formula (2) is in the said range, the light absorption performance of wavelength 350-420 nm improves more, and there exists a tendency for the suppression performance of white exposure to improve more.

[thermosetting resin]

It is preferable that the composition of this embodiment is what hardens|cures with a heat|fever, including the said compound (A) and a thermosetting resin, and forms an insulating part. Although it does not specifically limit as a thermosetting resin, For example, 1 or more types selected from the group which consists of a cyanate ester compound, a phenol compound, a maleimide compound, an alkenyl-substituted nadimide compound, and an epoxy compound are mentioned. In addition, in this embodiment, a compound (A) shall not be contained in a thermosetting resin.

Among these, it is preferable to use a thermosetting resin in combination of 2 or more types from a viewpoint of obtaining the hardened|cured material excellent in heat resistance, water absorption, insulation, copper foil peeling strength, etc. Although it does not restrict|limit especially as such an aspect, For example, Combination containing a maleimide compound, an epoxy compound, and a phenol resin; Combination containing a maleimide compound, an epoxy compound, and a cyanate ester compound; a combination comprising a maleimide compound, an epoxy compound, and an alkenyl-substituted nadimide; A combination containing a maleimide compound, a cyanate ester compound, and an alkenyl-substituted nadimide; A combination containing a maleimide compound, an epoxy compound, a cyanate ester compound, and an alkenyl-substituted nadimide; and combinations containing maleimide compounds and alkenyl-substituted nadimides.

Preferably the lower limit of content of the thermosetting resin in the composition of this embodiment is 50 mass parts or more with respect to 100 mass parts of resin solid content, More preferably, it is 60 mass parts or more, and is 70 mass parts or more. Moreover, with respect to 100 mass parts of resin solid content, the upper limit of content of a thermosetting resin becomes like this. Preferably it is 97 mass parts or less, More preferably, it is 95 mass parts or less, More preferably, it is 90 mass parts or less. When content of a thermosetting resin exists in the range of an above-described lower limit and/or an upper limit, there exists a tendency for the hardened|cured material excellent in heat resistance, water absorption, insulation, copper foil peeling strength, etc. to be obtained.

(maleimide compound)

The maleimide compound is not particularly limited as long as it is a compound having one or more maleimide groups in the molecule. For example, N-phenylmaleimide, N-hydroxyphenylmaleimide, bis(4-maleimidephenyl)methane, 2,2'-bis{4-(4-maleimidephenoxy)-phenyl}propane, bis(3,5-dimethyl-4-maleimidephenyl)methane, bis(3-ethyl-5-methyl-4- maleimidephenyl)methane, bis(3,5-diethyl-4-maleimidephenyl)methane, polyphenylmethanemaleimide compound, a prepolymer of these maleimide compounds, or a prepolymer of a maleimide compound and an amine compound. can

Among these, bis(4-maleimidephenyl)methane, 2,2'-bisb4-(4-maleimidephenoxy)-phenylbpropane, and bis(3-ethyl-5-methyl-4-maleimidephenyl) ) At least one selected from the group consisting of methane and polyphenylmethane maleimide compounds is preferable. By containing such a maleimide compound, the coefficient of thermal expansion of the hardened|cured material obtained falls more and there exists a tendency for heat resistance to improve more. A maleimide compound may be used individually by 1 type or in combination of 2 or more type.

To [ content of the maleimide compound in the composition of this embodiment / 100 mass parts of resin solid content ], Preferably it is 5-35 mass parts, More preferably, it is 10-30 mass parts, More preferably, it is 10- 25 parts by mass. When content of a maleimide compound exists in the said range, there exists a tendency for heat resistance and sclerosis|hardenability to improve more.

Moreover, with respect to 100 mass parts of compounds (A), content of a maleimide compound becomes like this. Preferably it is 20 mass parts or more, More preferably, it is 45 mass parts or more, More preferably, it is 60 mass parts or more. Moreover, to [ content of a maleimide compound / 100 mass parts of compounds (A) ], Preferably it is 100 mass parts or less, More preferably, it is 70 mass parts or less, More preferably, it is 50 mass parts or less. When content of a maleimide compound exists in the said range, there exists a tendency for heat resistance and sclerosis|hardenability to improve more.

(epoxy compound)

The epoxy compound is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule other than the compound (A). For example, bisphenol A epoxy resin, bisphenol E epoxy resin, bisphenol F epoxy resin, Bisphenol S type epoxy resin, phenol novolak type epoxy resin, bisphenol A novolak type epoxy resin, cresol novolak type epoxy resin, naphthalene novolak type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, trifunctional phenol type Epoxy resin, tetrafunctional phenol type epoxy resin, glycidyl ester type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, aralkyl novolak type epoxy resin, naphthol aralkyl type epoxy resin, dicyclo A pentadiene-type epoxy resin, a polyol-type epoxy resin, an isocyanurate ring containing epoxy resin, or these halides are mentioned. An epoxy compound may be used individually by 1 type or in combination of 2 or more type.

Among these, a naphthalene novolak-type epoxy resin and a biphenyl aralkyl-type epoxy resin are preferable. By using such an epoxy compound, there exists a tendency for heat resistance and sclerosis|hardenability to improve more.

To [ content of the epoxy compound in the composition of this embodiment / 100 mass parts of resin solid content ], Preferably it is 1-50 mass parts, More preferably, it is 3-50 mass parts, More preferably, it is 5-45 mass parts. It is a mass part, Especially preferably, it is 7.5-40 mass parts. When content of an epoxy compound exists in the said range, there exists a tendency for heat resistance and sclerosis|hardenability to improve more.

The composition of this embodiment WHEREIN: With respect to 100 mass parts of resin solid content, total content of a compound (A) and an epoxy compound becomes like this. Preferably it is 35-60 mass parts, More preferably, it is 40-55 mass parts, More Preferably it is 45-50 mass parts. When total content is in the said range, there exists a tendency for the suppression performance of back exposure, heat resistance, and sclerosis|hardenability to improve more.

Moreover, to [ content of an epoxy compound / 100 mass parts of compounds (A) ], Preferably it is 15 mass parts or more, More preferably, it is 40 mass parts or more, More preferably, it is 80 mass parts or more. Moreover, to [ content of an epoxy compound / 100 mass parts of compounds (A) ], Preferably it is 180 mass parts or less, More preferably, it is 100 mass parts or less, More preferably, it is 50 mass parts or less. When content of an epoxy compound exists in the said range, there exists a tendency for heat resistance and sclerosis|hardenability to improve more.

(phenolic resin)

As a phenol resin, a well-known thing can be used suitably, The kind in particular is not limited, For example, resin which has two or more phenolic hydroxyl groups in 1 molecule is mentioned. Although it does not specifically limit as such a phenol resin, For example, cresol novolak type phenol resin, phenol novolak resin, alkylphenol novolak resin, bisphenol A type novolak resin, dicyclopentadiene type phenol resin, xylock type|mold A phenol resin, a terpene-modified phenol resin, polyvinyl phenols, a naphthol aralkyl type phenol resin, a biphenyl aralkyl type phenol resin, a naphthalene type phenol resin, an aminotriazine novolak type phenol resin, etc. are mentioned. A phenol resin may be used individually by 1 type or in combination of 2 or more type.

Among these, at least one selected from the group consisting of cresol novolak-type phenol resins, aminotriazine novolak-type phenol resins, naphthalene-type phenol resins, naphthol aralkyl-type phenol resins, and biphenyl aralkyl-type phenol resins is preferable. do. By using such a phenol resin, the water absorption of the hardened|cured material obtained falls more and there exists a tendency for heat resistance to improve more.

To [ content of the phenol resin in the composition of this embodiment / 100 mass parts of resin solid content ], Preferably it is 10-50 mass parts, More preferably, it is 20-45 mass parts, More preferably, it is 30-40 mass parts. is the mass part. When content of a phenol resin exists in the said range, there exists a tendency for heat resistance and chemical-resistance to improve more.

(Cyanic acid ester compound)

The cyanate ester compound is not particularly limited as long as it is a compound having at least one cyanate ester group (cyanato group) directly bonded to an aromatic ring in one molecule, for example, naphthol aralkyl cyanate ester, novolac Type cyanate ester, biphenyl aralkyl type cyanate ester, bis(3,5-dimethyl4-cyanatophenyl)methane, bis(4-cyanatophenyl)methane, 1,3-dicyanatobenzene, 1, 4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-dicyanatonaphthalene, 1,4-dicyanatonaphthalene, 1,6-dicyanatonaphthalene, 1,8-dicyana Tonaphthalene, 2,6-dicyanatonaphthalene, 2,7-dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene, 4,4'-dicyanatobiphenyl, bis(4-cyanatophenyl)ether , bis(4-cyanatophenyl)thioether, bis(4-cyanatophenyl)sulfone, and 2,2'-bis(4-cyanatophenyl)propane; The prepolymer of these cyanate esters, etc. are mentioned. You may use a cyanate ester compound individually by 1 type or in combination of 2 or more type.

Among these, at least one selected from the group consisting of naphthol aralkyl cyanate esters, novolak cyanate esters, and biphenyl aralkyl cyanate esters is preferable. By using such a cyanate ester compound, it exists in the tendency for the hardened|cured material to be obtained more excellent in a flame retardance, sclerosis|hardenability is higher, and a thermal expansion coefficient lower.

To [ content of the cyanate ester compound in the composition of this embodiment / 100 mass parts of resin solid content ], Preferably it is 1-50 mass parts, More preferably, it is 5-40 mass parts, More preferably, it is 10 - 30 parts by mass. When content of a cyanate ester compound exists in the said range, there exists a tendency for heat resistance and chemical-resistance to improve more.

(alkenyl substituted nadimide compound)

The alkenyl-substituted nadimide compound is not particularly limited as long as it is a compound having one or more alkenyl-substituted nadimide groups in one molecule. Among these, the compound represented by Formula (3) is preferable. By using such an alkenyl-substituted nadimide compound, there exists a tendency for the thermal expansion coefficient of the hardened|cured material obtained to fall more and to improve heat resistance more.

[Formula 5]

(wherein, R ₂ each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ₃ is an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or a formula The group represented by (4) or (5) is shown.)

[Formula 6]

(In the formula, R ₄ represents a methylene group, an isopropylidene group, or a substituent represented by _{CO, O, S, or SO 2 .)}

[Formula 7]

(In the formula, R ₅ each independently represents an alkylene group having 1 to 4 carbon atoms or a cycloalkylene group having 5 to 8 carbon atoms.)

To [ content of the alkenyl-substituted nadimide compound in the composition of this embodiment / 100 mass parts of resin solid content], Preferably it is 10-50 mass parts, More preferably, it is 20-45 mass parts, More preferably is 30 to 40 parts by mass. When content of an alkenyl-substituted nadimide compound is in the said range, there exists a tendency for heat resistance to improve more.

〔filling〕

Although it does not specifically limit as a filler, For example, Silicas, such as natural silica, a fused silica, a synthetic silica, amorphous silica, aerosil, hollow silica; silicon compounds such as white carbon; metal oxides such as titanium white, zinc oxide, magnesium oxide, and zirconium oxide; metal nitrides such as boron nitride, agglomerated boron nitride, silicon nitride, and aluminum nitride; metal sulfates such as barium sulfate; metal hydroxides such as aluminum hydroxide, aluminum hydroxide heat-treated products (aluminum hydroxide is heat-treated to reduce a part of crystal water), and magnesium hydroxide; metal hydrates such as boehmite; molybdenum compounds such as molybdenum oxide and zinc molybdate; zinc compounds such as zinc borate and zinc stannate; Alumina, clay, kaolin, talc, calcined clay, calcined kaolin, calcined talc, mica, E-glass, A-glass, NE-glass, C-glass, L-glass, D-glass, S-glass, M-glass G20, short glass fibers (including fine glass powders such as E glass, T glass, D glass, S glass, and Q glass), hollow glass, spherical glass, and the like. A filler may be used individually by 1 type, and may use 2 or more types together.

Although content of the filler in the composition of this embodiment is not specifically limited, To 100 mass parts of resin solid content, Preferably it is 50-500 mass parts, More preferably, it is 75-350 mass parts, More preferably, It is 75-250 mass parts, More preferably, it is 100-200 mass parts. When content of a filler exists in the said range, there exists a tendency for a thermal expansion coefficient to fall more.

[Silane coupling agent and wetting and dispersing agent]

The composition of the present embodiment may further contain a silane coupling agent or a wetting and dispersing agent. By containing a silane coupling agent or a wet dispersing agent, the dispersibility of the said filler, a resin component, a filler, and the adhesive strength of a base material mentioned later tend to improve more.

The silane coupling agent is not particularly limited as long as it is a silane coupling agent generally used for surface treatment of inorganic substances. For example, γ-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyl aminosilane-based compounds such as trimethoxysilane; Epoxy silane compounds, such as (gamma)-glycidoxy propyl trimethoxysilane; acrylsilane-based compounds such as γ-acryloxypropyltrimethoxysilane; cationic silane compounds such as N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane hydrochloride; A phenylsilane type compound etc. are mentioned. A silane coupling agent may be used individually by 1 type, and may use 2 or more types together.

Although it will not specifically limit if it is a dispersion stabilizer used for paints as a wetting and dispersing agent, For example, DISPERBYK (trademark)-110, 111, 118, 180, 161, BYK-W996 manufactured by Big Chemie Japan Co., Ltd. , W9010, W903, and the like.

[curing accelerator]

The composition of this embodiment may further contain a hardening accelerator. Although it does not specifically limit as a hardening accelerator, For example, Organic peroxides, such as benzoyl peroxide, lauroyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, di-tert- butyl- di- perphthalate; azo compounds such as azobisnitrile; N,N-dimethylbenzylamine, N,N-dimethylaniline, N,N-dimethyltoluidine, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline, N-methylmorpholine, triethanolamine , tertiary amines such as triethylenediamine, tetramethylbutanediamine, and N-methylpiperidine; phenols such as phenol, xylenol, cresol, resorcin, and catechol; organic metal salts such as lead naphthenate, lead stearate, zinc naphthenate, zinc octylate, tin oleate, dibutyltin maleate, manganese naphthenate, cobalt naphthenate, and iron acetylacetone; What is formed by dissolving these organometallic salts in hydroxyl-containing compounds, such as a phenol and a bisphenol; inorganic metal salts such as tin chloride, zinc chloride, and aluminum chloride; Organotin compounds, such as a dioctyl tin oxide, other alkyl tin, and an alkyl tin oxide, etc. are mentioned.

[Method for producing composition]

Although the manufacturing method in particular of the composition of this embodiment is not specifically limited, For example, each component is mix|blended with a solvent one by one, and the method of fully stirring is mentioned. At this time, in order to melt|dissolve or disperse|distribute each component uniformly, well-known processes, such as stirring, mixing, and kneading|mixing process, can be performed. The dispersibility of the filler with respect to a composition can be improved by carrying out a stirring dispersion process using the stirring tank which specifically, attached the stirrer which has suitable stirring ability. The above-described stirring, mixing, and kneading treatment can be appropriately performed using, for example, an apparatus for the purpose of mixing such as a ball mill or a bead mill, or a known apparatus such as a revolving or autorotating mixing apparatus.

Moreover, at the time of preparation of a composition, an organic solvent can be used as needed. The kind of organic solvent will not be specifically limited if it can melt|dissolve resin in a composition.

〔purpose〕

The composition of this embodiment mentioned above can be used suitably as a prepreg, a resin sheet, a laminated board, a metal foil clad laminated board, or a printed wiring board. Hereinafter, a prepreg, a resin sheet, a laminated board, a metal foil clad laminated board, or a printed wiring board is demonstrated.

[Prepreg]

The prepreg of this embodiment has a base material and the composition of this embodiment impregnated or apply|coated to the base material. The manufacturing method of a prepreg can be performed according to a conventional method, and is not specifically limited. For example, after impregnating or apply|coating the composition in this embodiment to a base material, it heats in a 100-200 degreeC dryer for 1-30 minutes, or by semi-hardening (B-staging), the prepreg of this embodiment can be manufactured.

Content of the composition (filler is included) of this embodiment in a prepreg becomes like this with respect to the total amount of a prepreg, Preferably it is 30-90 mass %, More preferably, it is 35-85 mass %, Preferably Preferably, it is 40-80 mass %. When content of a composition exists in the said range, there exists a tendency for a moldability to improve more.

(write)

It does not specifically limit as a base material, According to the target use and performance, the well-known thing used for various printed wiring board materials can be selected and used suitably. Although it does not specifically limit as a specific example of the fiber which comprises a base material, For example, Glass fibers, such as E glass, D glass, S glass, Q glass, spherical glass, NE glass, L glass, T glass; Inorganic fibers other than glass, such as quartz; Polyparaphenylene terephthalamide (Kevlar (registered trademark), manufactured by DuPont Co., Ltd.), copolyparaphenylene 3,4'oxydiphenylene terephthalamide (Technora (registered trademark), manufactured by Teijin Techno Products Co., Ltd.) wholly aromatic polyamides, such as; polyesters such as 2,6-hydroxynaphthoic acid and parahydroxybenzoic acid (Vectran (registered trademark), manufactured by Kuraray Co., Ltd.) and Zexion (registered trademark, manufactured by KB Siren); Organic fibers, such as polyparaphenylene benzoxazole (Xylon (trademark), Toyo Spinning Co., Ltd. make) and polyimide, are mentioned. Among these, from a viewpoint of a low thermal expansion coefficient, at least 1 sort(s) chosen from the group which consists of E glass cloth, T glass cloth, S glass cloth, Q glass cloth, and organic fiber is preferable. These base materials may be used individually by 1 type, and may use 2 or more types together.

Although it does not specifically limit as a shape of a base material, For example, a woven fabric, a nonwoven fabric, roving, a chopped strand mat, a surfacing mat, etc. are mentioned. The weaving method of the woven fabric is not particularly limited, and for example, plain weave, lion weave, twill weave, etc. are known, and may be appropriately selected from these known ones depending on the intended use and performance. Moreover, the thing which carried out the fiber opening process of these, the glass woven fabric surface-treated with the silane coupling agent etc. are used preferably. Although the thickness and mass of a base material are not specifically limited, Usually, the thing of about 0.01-0.3 mm is used preferably. In particular, from the viewpoint of strength and water absorption, the substrate is preferably a glass woven fabric having a thickness of 200 μm or less and a mass of 250 g/m 2 or less, and more preferably a woven glass fabric made of glass fibers of E glass, S glass, and T glass.

[resin sheet]

The resin sheet of this embodiment contains the composition of this embodiment. Although the manufacturing method in particular of a resin sheet is not restrict|limited, For example, the method of obtaining a resin sheet by apply|coating the composition of this embodiment on a support body, drying, and peeling or etching a support body after drying, or The method of supplying a composition into the metal mold|die which has a sheet-like cavity and drying it, and shape|molding it in a sheet form is mentioned.

Moreover, the resin sheet of this embodiment may have a support body and the composition of this embodiment laminated|stacked on the single side|surface or both surfaces of this support body. Such a resin sheet is also called a resin sheet with a support body. A resin sheet with a support is used as a means of thinning, for example, it can be produced by applying and drying a thermosetting resin (containing a filler) used for a prepreg or the like directly to a support such as a metal foil or film. have.

Although it does not specifically limit as a support body, The well-known thing used for various printed wiring board materials can be used. For example, polyimide film, polyamide film, polyester film, polycarbonate film, polyethylene terephthalate (PET) film, polybutylene terephthalate (PBT) film, polypropylene (PP) film, polyethylene (PE) film, Aluminum foil, copper foil, gold foil, a glass plate, SUS plate, etc. are mentioned. Especially, an electrolytic copper foil and a PET film are preferable.

As a coating method, the method of apply|coating the solution which melt|dissolved the composition of this embodiment in the solvent on a support body with a bar coater, a die coater, a doctor blade, a baker applicator, etc. is mentioned, for example.

It is preferable that after apply|coating the composition of this embodiment to a support body, the resin sheet with a support body was made to semi-harden (B-staging). Specifically, for example, after apply|coating the composition of this embodiment to supports, such as copper foil, in a 20-200 degreeC dryer, it is made semi-hardened by the method of heating for 1-90 minutes, etc., and the resin sheet with a support body The manufacturing method etc. are mentioned. As for the adhesion amount of the composition with respect to a support body, the range of 0.1-500 micrometers is preferable with the thickness of a resin layer.

[Laminate]

The laminated board of this embodiment contains one or more layers which consist of the said prepreg or a resin sheet. A laminate will not be specifically limited if it is equipped with one or more layers of a prepreg or a resin sheet, You may have any other layer. As a manufacturing method of a laminated board, a generally well-known method can be applied suitably, and it does not specifically limit. For example, a laminated board can be obtained by laminating|stacking said prepregs, resin sheets, or a prepreg and a resin sheet, and heat-pressing-molding. Although the temperature to heat is not specifically limited at this time, 65-300 degreeC is preferable and 120-270 degreeC is more preferable. Moreover, the pressure to press is although it does not specifically limit, 2-5 Mpa is preferable and 2.5-4 Mpa is more preferable. By providing the layer which consists of metal foil, the laminated board of this embodiment can be used suitably as a metal foil-clad laminated board mentioned later.

[Metal foil clad laminate]

The metal foil-clad laminate of this embodiment has the said prepreg or the said resin sheet, and the metal foil laminated|stacked on the prepreg or the resin sheet. The insulating layer may be composed of the composition, prepreg of one layer, or a resin sheet, or may be obtained by laminating two or more layers of the composition, prepreg, or resin sheet, and the composition, prepreg, and resin sheet may be laminated.

Copper, aluminum, etc. can be used as metal foil. Although the metal foil used here will not be specifically limited if used for a printed wiring board material, Well-known copper foils, such as a rolled copper foil and an electrolytic copper foil, are preferable. Moreover, although the thickness in particular of metal foil (conductor layer) is not limited, 1-70 micrometers is preferable, More preferably, it is 1.5-35 micrometers.

The forming method of the metal foil-clad laminate and the forming conditions thereof are not particularly limited, and the methods and conditions of general laminates for printed wiring boards and multilayer boards are applicable. For example, a multistage press machine, a multistage vacuum press machine, a continuous molding machine, an autoclave molding machine, etc. can be used at the time of shaping|molding of a metal foil clad laminated board. Moreover, in shaping|molding of a metal foil clad laminated board, temperature is 100-300 degreeC, a pressure is 2-100 kgf/cm<2> of surface pressure, and the range of 0.05 to 5 hours is common for a heating time. Moreover, you can also post-cure at the temperature of 150-300 degreeC as needed. Moreover, it can also be set as a multilayer board by combining the prepreg mentioned above and the wiring board for inner layers manufactured separately and lamination|stacking.

[printed wiring board]

The printed wiring board of this embodiment has an insulating layer and the conductor layer formed in the surface of the said insulating layer, The said insulating layer contains the composition of this embodiment. The above-described metal foil-clad laminate can be preferably used as a printed wiring board by forming a predetermined wiring pattern. In addition, the above-described metal foil-clad laminate has a low coefficient of thermal expansion, good moldability and chemical resistance, and can be particularly effectively used as a material for a printed wiring board for semiconductor packages requiring such performance.

In addition, a printed wiring board having a multilayer structure has a plurality of laminated insulating layers, and one or a plurality of conductor layers disposed between the plurality of insulating layers and on the outermost layer surface, wherein the insulating layer contains the composition. thing can be heard Such a multilayer printed wiring board can have a well-known structure as a multilayer printed wiring board, such as a plating through-hole which penetrates several insulating layers as another structure.

Moreover, the multilayer printed wiring board of this embodiment does not have a core board|substrate as an insulating layer, but the coreless printed wiring board which laminated|stacked only the buildup layer as an insulating layer may be sufficient as it. As such a coreless printed wiring board, what has at least 1 insulating layer and the conductor layer arrange|positioned on the outermost layer surface of this insulating layer is mentioned. When there are two or more insulating layers, you may have a conductor layer further between several insulating layers. In this case, any one of the one or more insulating layers will contain the composition mentioned above.

A conventional build-up substrate has a structure in which an insulating layer and a conductor layer are stacked above and below a core substrate serving as a support substrate. The insulating layer and the conductor layer repeated above and below the core substrate are also called a buildup layer. From the viewpoint of forming wirings with high density, the build-up layer is constituted by lamination of thin layers. On the other hand, the core substrate also has a role as a support substrate having a certain level of strength or the like in the step of laminating the insulating layer and the conductor layer. Therefore, in general, the core substrate is thicker than the insulating layer in the buildup layer. The coreless printed wiring board in this embodiment means a printed wiring board which does not have this core board.

The manufacturing method in particular of a multilayer printed wiring board is not restrict|limited, Conventionally well-known methods, such as the method of laminating|stacking a printed wiring board, can be used.

[Method for Manufacturing Printed Wiring Board]

The printed wiring board of this embodiment can be manufactured by the following method specifically, for example. First, the above-mentioned metal foil-clad laminated board (copper-clad laminated board etc.) is prepared. The surface of the metal foil-clad laminate is etched to form an inner-layer circuit, and an inner-layer substrate is produced. The surface of the inner circuit of this inner substrate is subjected to surface treatment to increase the adhesive strength as necessary, and then the required number of prepregs described above are stacked on the surface of the inner circuit, and a metal foil for the outer circuit is further applied to the outside of the inner circuit surface. It is laminated, heat-pressed, and integrally molded. In this way, a multilayer laminate in which an insulating layer composed of a substrate and a cured product of a thermosetting composition is formed between the metal foil for the inner circuit and the outer circuit is produced. Next, after performing the drilling process for through-holes and via holes to this multilayer laminated board, in order to remove the smear which is a resin residue which originates in the resin component contained in the hardened|cured material layer, a desmear process is performed. Thereafter, a plated metal film is formed on the wall surface of the hole to conduct the inner circuit and the metal foil for the outer circuit, and the metal foil for the outer circuit is further etched to form the outer circuit, and a printed wiring board is manufactured.

For example, the above-mentioned prepreg (base material and the above-mentioned composition attached thereto) and the composition layer (layer composed of the above-mentioned composition) in the metal foil clad laminate constitute an insulating layer containing the above-mentioned composition. becomes to do

Moreover, when not using a metal foil clad laminated board, you may form the conductor layer used as a circuit on the said prepreg or the said resin sheet, and may manufacture a printed wiring board. At this time, the method of electroless plating can also be used for formation of a conductor layer.

Moreover, you may perform the process of forming the insulating film which apply|coats a soldering resist and protects a circuit pattern with respect to the printed wiring board obtained by making it above. More specifically, the step of preparing the printed wiring board as described above, the step of forming a photosensitive composition layer cured with light having a wavelength of 350 to 420 nm on both sides of the printed wiring board, and disposing a mask pattern on the surface of the photosensitive composition layer and the method of having the process of exposing with the light of wavelength 350-420 nm through the mask pattern is mentioned. After exposure, the non-hardened part of the photosensitive composition layer can be developed, and the printed wiring board in which the circuit pattern was protected can be obtained. Moreover, as a photosensitive composition layer, a soldering resist layer is mentioned, for example.

Moreover, in the manufacturing method of a coreless printed wiring board, for example, instead of the process of preparing the said printed wiring board as mentioned above, the process of preparing a core board, and containing the composition of this embodiment on a core board, A step of obtaining a laminate in which at least one insulating layer and a conductor layer disposed on the surface of the outermost layer of the insulating layer are laminated is performed. That is, by laminating|stacking one or several insulating layer and one or several conductor layer on a core board|substrate, the laminated body in which the buildup layer was formed on the core board|substrate can be obtained. Then, a coreless printed wiring board (it is also mentioned a coreless board|substrate) is formed by removing (peeling) a core board|substrate.

And the coreless printed wiring board in which the circuit pattern was formed can be obtained by performing the process of forming a photosensitive composition layer and the process of exposing similarly to what was mentioned above about this coreless board|substrate.

Example

Hereinafter, the present invention will be described in more detail using Examples and Comparative Examples. The present invention is not limited at all by the following examples.

[Example 1]

35 parts by mass of biphenyl aralkylphenol resin (KAYAHARD GPH-103, manufactured by Nippon Kayaku Co., Ltd.) 15 parts by mass of a maleimide compound (BMI-70, manufactured by Daiwa Chemical Industries, Ltd.), naphthalene novolac-type epoxy resin ( HP-9900, manufactured by DIC Corporation) 10 parts by mass, biphenyl aralkyl-type epoxy resin (NC3000H, manufactured by Nippon Kayaku Co., Ltd.) 20 parts by mass, and a naphthalene ether type epoxy resin (HP-6000, DIC Corporation) as compound (A) Manufacture) 20 parts by mass, 5 parts by mass of a silane coupling agent (Z6040, manufactured by Toray Dow Corning Co., Ltd.), 1 part by mass of a wetting and dispersing agent (DISPERBYK (registered trademark)-161, manufactured by Big Chemie Japan), and a curing accelerator ( 2,4,5-triphenylimidazole, the Tokyo Chemical Industry Co., Ltd. make) 1 mass part were mixed, and the varnish was obtained by diluting with methyl ethyl ketone. A resin plate having a thickness of 0.08 mm was molded using this varnish. In addition, the said naphthalene ether type epoxy resin was a structure shown by Formula (1), and R<^2> was all a thing of hydrogen. Further, HP-9900 does not have a naphthalene skeleton in which two or more naphthalene rings are linked.

[Example 2]

The same as in Example 1, except that no biphenyl aralkyl type epoxy resin (NC3000H, manufactured by Nippon Kayaku Co., Ltd.) was used and the amount of naphthalene ether type epoxy resin (HP-6000, manufactured by DIC Corporation) was changed to 40 parts by mass. and a resin plate was formed.

[Example 3]

35 parts by mass of a biphenyl aralkylphenol resin (KAYAHARD GPH-103, manufactured by Nippon Kayaku Co., Ltd.) 15 parts by mass of a maleimide compound (BMI-70, manufactured by Daiwa Chemical Industries, Ltd.) tetrafunctional naphthalene novolac-type epoxy Resin (HP-4710, manufactured by DIC Corporation) 10 parts by mass, biphenyl aralkyl type epoxy resin (NC3000H, manufactured by Nippon Kayaku Co., Ltd.) 40 parts by mass, and silane coupling agent (Z6040, manufactured by Toray Dow Corning) 5 parts by mass and 1 part by mass of a wetting and dispersing agent (DISPERBYK (registered trademark)-161, manufactured by Big Chemie Japan) and 1 part by mass of a curing accelerator (2,4,5-triphenylimidazole, manufactured by Tokyo Chemical Industry Co., Ltd.) , a varnish was obtained by diluting with methyl ethyl ketone. A resin plate having a thickness of 0.08 mm was molded using this varnish. In addition, the said tetrafunctional naphthalene novolak-type epoxy resin had a structure shown by Formula (2).

[Example 4]

Using 10 parts by mass of naphthalene novolac-type epoxy resin (HP-9900, manufactured by DIC Corporation), the amount of tetrafunctional naphthalene novolac-type epoxy resin (HP-4710, manufactured by DIC Corporation) was changed to 20 parts by mass, and biphenyl Except having changed the usage-amount of the aralkyl type epoxy resin (NC3000H, the Nippon Kayaku company make) into 20 mass parts, it carried out similarly to Example 3, and formed the resin plate.

[Comparative Example 1]

Same as Example 1 except that the amount of the biphenyl aralkyl type epoxy resin (NC3000H, manufactured by Nippon Kayaku Co., Ltd.) was changed to 40 parts by mass, and naphthalene ether type epoxy resin (HP-6000, manufactured by DIC Corporation) was not used. and a resin plate was formed.

[Comparative Example 2]

In the same manner as in Comparative Example 1, except that 10 parts by mass of a naphthalene novolac-type epoxy resin (HP-9900, manufactured by DIC Corporation) was used instead of 10 parts by mass of a naphthalene-type epoxy resin (EXA-4032, manufactured by DIC Corporation), the resin plate was formed. As shown below, EXA-4032 does not have a naphthalene skeleton in which two or more naphthalene rings are linked.

[Formula 8]

[Comparative Example 3]

In the same manner as in Comparative Example 1, except that 40 parts by mass of a dicyclopentadiene type epoxy resin (HP-7200L, manufactured by DIC Corporation) was used instead of 40 parts by mass of a biphenyl aralkyl type epoxy resin (NC3000H, manufactured by Nippon Kayaku Co., Ltd.) Thus, a resin plate was formed. Also, HP-7200L is a compound having no naphthalene ring.

[Comparative Example 4]

Comparative Example 1 and Comparative Example 1 except that the amount of the biphenyl aralkyl type epoxy resin (NC3000H, manufactured by Nippon Kayaku Co., Ltd.) was changed to 50 parts by mass and naphthalene novolac type epoxy resin (HP-9900, manufactured by DIC Corporation) was not used. In the same manner, a resin plate was formed.

[Exposure test]

About both surfaces of the resin board obtained as mentioned above, 15-micrometer-thick film-form resist (PSR-800 AUS SR1 manufactured by Taiyo Holdings Co., Ltd.) was laminated, and it exposed on the following conditions from one side (exposed side). Then, the resist on the surface (back surface) opposite to the exposure surface was removed. On the back side, it was confirmed whether or not a resist residue remained by back exposure from the exposure surface.

Apparatus: ORC-manufactured DI exposure machine

Light source: 3 types mixed (g line, h line, i line)

Exposure dose: 220 mJ

In the said test, the thing with no resist residue remaining in the back surface was evaluated as (circle), and the thing which resist residue remained was evaluated as x. A result is shown in Table 1.

Industrial Applicability

The composition of this invention is a composition which can suppress the effect of the soldering resist by back exposure, etc., Comprising: It has industrial applicability.

1: insulating layer;
2: copper pattern,
3: Solder resist;
3a: surface;
3b: if,
4: mask,
5: resist residue;
10: printed wiring board

Claims (16)

A composition for suppressing back exposure of a photosensitive composition cured with light having a wavelength of 350 to 420 nm, comprising:
A composition comprising a naphthalene skeleton and a compound (A) having a substituent bonded to at least the 2-position and/or the 7-position of the naphthalene ring contained in the naphthalene skeleton. The method of claim 1,
The composition in which the said substituent is each independently represented by following formula (3).
-OR ¹ (3)
( ^{wherein R 1} is an organic group having 1 to 20 carbon atoms) 3. The method of claim 2,
The -OR ¹ group is a glycidyl group, the composition. 4. The method according to any one of claims 1 to 3,
The composition, wherein the compound (A) is represented by the following formula (1) or (2).

(R ² each independently represents a hydrogen atom or an organic group having 1 to 20 carbon atoms)

5. The method according to any one of claims 1 to 4,
The composition in which content of the said compound (A) is 5-40 mass parts with respect to 100 mass parts of resin solid content. 6. The method according to any one of claims 1 to 5,
The composition which further contains 1 or more types selected from the group which consists of a cyanate ester compound, a phenol compound, a maleimide compound, an alkenyl-substituted nadimide compound, and an epoxy compound other than the said compound (A). 7. The method according to any one of claims 1 to 6,
A composition for a printed wiring board. description and,
A prepreg having the composition according to any one of claims 1 to 7 impregnated or applied to the substrate. The resin sheet containing the composition in any one of Claims 1-7. 10. The method of claim 9,
support and
A resin sheet having a layer comprising the composition laminated on one or both surfaces of the support. A laminate comprising one or more layers comprising the prepreg according to claim 8 or the resin sheet according to claim 9 or 10. The prepreg according to claim 8 or the resin sheet according to claim 9 or 10;
A metal foil-clad laminate having a metal foil laminated on the prepreg or the resin sheet. an insulating layer,
It has a conductor layer formed on the surface of the insulating layer,
The printed wiring board in which the said insulating layer contains the composition in any one of Claims 1-7. at least one insulating layer;
a conductor layer disposed on the surface of the outermost layer of the insulating layer;
The coreless printed wiring board in which the said insulating layer contains the composition in any one of Claims 1-7. A step of preparing a substrate in which at least one insulating layer comprising the composition according to any one of claims 1 to 7 and at least one conductor layer in contact with the insulating layer is laminated;
forming a layer of a photosensitive composition cured with light having a wavelength of 350 to 420 nm on both surfaces of the substrate;
The manufacturing method of the printed wiring board which has the process of arrange|positioning a mask pattern on the surface of at least one of the said photosensitive composition layer, letting the mask pattern pass, and exposing with the light of wavelength 350-420 nm. a process of preparing a core substrate;
To obtain a laminate in which at least one insulating layer comprising the composition according to any one of claims 1 to 7 and a conductor layer disposed on the outermost layer surface of the insulating layer are laminated on the core substrate process and
forming a coreless substrate by removing the core substrate from the laminate;
A step of forming a layer of a photosensitive composition cured with light having a wavelength of 350 to 420 nm on both sides of the coreless substrate;
The manufacturing method of the coreless printed wiring board which has the process of arrange|positioning a mask pattern on the at least one surface of the said photosensitive composition layer, making the mask pattern pass, and exposing with the light of wavelength 350-420 nm.

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