KR20210085638A - Laminate and image display apparatus comprising same - Google Patents
Laminate and image display apparatus comprising same Download PDFInfo
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- KR20210085638A KR20210085638A KR1020190178909A KR20190178909A KR20210085638A KR 20210085638 A KR20210085638 A KR 20210085638A KR 1020190178909 A KR1020190178909 A KR 1020190178909A KR 20190178909 A KR20190178909 A KR 20190178909A KR 20210085638 A KR20210085638 A KR 20210085638A
- Authority
- KR
- South Korea
- Prior art keywords
- laminate
- acrylate
- meth
- active energy
- energy ray
- Prior art date
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- SLVJUZOHXPZVLR-UHFFFAOYSA-N naphthalen-2-yl prop-2-enoate Chemical class C1=CC=CC2=CC(OC(=O)C=C)=CC=C21 SLVJUZOHXPZVLR-UHFFFAOYSA-N 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
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- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
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- IOUVKUPGCMBWBT-QNDFHXLGSA-N phlorizin Chemical class O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC(O)=CC(O)=C1C(=O)CCC1=CC=C(O)C=C1 IOUVKUPGCMBWBT-QNDFHXLGSA-N 0.000 description 1
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
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- BUUPQKDIAURBJP-UHFFFAOYSA-N sulfinic acid Chemical compound OS=O BUUPQKDIAURBJP-UHFFFAOYSA-N 0.000 description 1
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- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
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- RKYSDIOEHLMYRS-UHFFFAOYSA-N triethoxy(hex-5-enyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCC=C RKYSDIOEHLMYRS-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
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- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
본 발명은 적층체 및 이를 포함하는 화상 표시 장치에 관한 것이다.The present invention relates to a laminate and an image display device including the same.
편광판은 통상 이색성 염료 또는 요오드로 염색된 폴리비닐알코올(이하, PVA라고 칭함)계 수지로 이루어진 편광자의 일면 또는 양면에 접착제를 이용하여 보호 필름을 적층한 구조로 사용되어 왔다. 종래에는 편광판 보호 필름으로서 트리아세틸셀룰로오스(이하, TAC라고 칭함)계 필름이 주로 사용되어 왔다.A polarizing plate has been used in a structure in which a protective film is laminated using an adhesive on one or both sides of a polarizer made of a polyvinyl alcohol (hereinafter referred to as PVA)-based resin dyed with a dichroic dye or iodine. Conventionally, a triacetyl cellulose (hereinafter referred to as TAC)-based film has been mainly used as a polarizing plate protective film.
상기 TAC는 투습도가 높으므로, 수계 접착제에 적용이 가능하나, 고온 또는 고습 환경에서 쉽게 변형되는 문제가 있어서 고내습성 및 고내구성을 요구하는 최근의 디스플레이에 적용하기 어려운 문제가 있었다. 그리하여, 저투습 기재를 사용하여 편광판을 보호하는 방법들이 제시되었다.Since the TAC has a high moisture permeability, it can be applied to a water-based adhesive, but there is a problem that it is easily deformed in a high temperature or high humidity environment, so it is difficult to apply it to a recent display requiring high moisture resistance and high durability. Thus, methods for protecting a polarizing plate using a low moisture permeable substrate have been proposed.
이에 적용되는 대표적인 저투습 기재로서는 폴리에틸렌 폴리프로필렌 폴리부텐이나 폴리플루오로에틸렌 염소화 폴리에틸렌 염소화 프로필렌, 또는 에틸렌 불포화 카르본산 공중합체, 사이클로올레핀 수지, 노르보르넨계 고리형 폴리올레핀 수지 등으로 대표되는 올레핀계 수지를 들 수 있다. 상기 기재는 강성을 높이거나 위상차를 부여하기 위하여 연신된 상태로 사용되는데, 이 경우 연신되지 않은 상태와 비교하여 다른 재료에 대한 접착력이 현저히 떨어지므로, 이를 개선하기 위한 다양한 방법들이 제안되어 왔다.As a representative low moisture permeability base material applied thereto, polyethylene polypropylene polybutene, polyfluoroethylene chlorinated polyethylene chlorinated propylene, ethylenically unsaturated carboxylic acid copolymer, cycloolefin resin, norbornene-based cyclic polyolefin resin, etc. can be heard The substrate is used in a stretched state to increase rigidity or to impart a phase difference. In this case, compared to an unstretched state, the adhesion to other materials is significantly reduced, and various methods for improving this have been proposed.
예를 들면, 공정 과정에서 기재 표면에 코로나 방전 처리 등에 의해 표면 처리를 실시하거나 폴리올레핀 수지에 양호한 밀착성을 가지는 염소화 폴리올레핀 수지 폴리우레탄 수지 등을 아크릴 수지 염소화 폴리에틸렌 수지 크롤 푸렌 고무 등의 열가소성 수지를 접착제 또는 도제에 혼합함으로써, 올레핀계 수지 기재로의 접착성이나 도장성을 향상시키는 방법이 알려져 있다.For example, in the process, the surface of the substrate is subjected to surface treatment by corona discharge treatment, etc., or a chlorinated polyolefin resin, polyurethane resin, etc. having good adhesion to the polyolefin resin, an acrylic resin, a chlorinated polyethylene resin, a thermoplastic resin such as a chlorprene rubber, an adhesive or By mixing with a coating agent, the method of improving the adhesiveness to an olefin resin base material, and paintability is known.
그렇지만 코로나 방전 등에 의한 표면 처리는 일정한 효과는 얻어지지만 특수한 정비의 도입이 불가피하고 실용상의 제한이 크고 범용성이 부족하다. 또한 열가소성 수지를 접착제 또는 도제에 혼합, 혹은 그라프트시키는 방법도 어느 정도의 접착성 향상은 기대할 수 있지만, 충분한 접착성이 얻지 못하고 있는 것이 현상이었다. However, the surface treatment by corona discharge or the like achieves a certain effect, but the introduction of special maintenance is inevitable, and the practical limitations are large and the versatility is insufficient. In addition, although the method of mixing or grafting a thermoplastic resin with an adhesive agent or a coating agent to a certain extent can expect the improvement of adhesiveness, it is the present situation that sufficient adhesiveness is not obtained.
한편, 기재 표면에 프라이머를 사용함으로써 접착력을 향상시키는 기술이 개발되어 왔으며, 폴리우레탄 또는 폴리에스터 등의 프라이머를 사용하는 기술이 일반적으로 사용되어 왔다. On the other hand, a technique for improving adhesion by using a primer on the surface of a substrate has been developed, and a technique using a primer such as polyurethane or polyester has been generally used.
상기 프라이머는 접착제층과의 부분적인 침식성(용해성)을 부여함으로써 접착력을 발현한다. 그러나, 제조 공정 상에서 발생하는 열로 인하여 기재 표면의 온도가 상승하게 되고 프라이머층의 과도한 침식이 발생되어 오히려 접착력이 감소하는 문제가 있었다.The primer expresses adhesive force by imparting partial erosion (solubility) with the adhesive layer. However, due to the heat generated during the manufacturing process, the temperature of the surface of the substrate rises and excessive erosion of the primer layer occurs, resulting in rather reduced adhesion.
공정 상에서 발생하는 열을 제어하는 것은 어려움이 있으므로, 고온에서도 프라이머층에 대한 접착력이 유지될 수 있는 접착제의 개발이 요구된다.Since it is difficult to control the heat generated during the process, development of an adhesive capable of maintaining adhesion to the primer layer even at high temperatures is required.
본 발명은 적층체 및 이를 포함하는 화상 표시 장치에 관한 것이다.The present invention relates to a laminate and an image display device including the same.
본 발명은 보호 기재; 상기 보호 기재의 일면에 구비된 접착제층; 및 상기 보호 기재와 접착제층 사이에 구비된 프라이머층을 포함하고, 상기 접착제층은 활성 에너지선 경화형 조성물의 경화물을 포함하고, 상기 활성 에너지선 경화형 조성물은 수산기 함유 아크릴계 모노머를 전체 조성물 100 중량부를 기준으로 18 중량부 이하로 포함하는 것인 적층체를 제공한다.The present invention provides a protective substrate; an adhesive layer provided on one surface of the protective substrate; and a primer layer provided between the protective substrate and the adhesive layer, wherein the adhesive layer includes a cured product of an active energy ray-curable composition, and the active energy ray-curable composition contains a hydroxyl group-containing acrylic monomer 100 parts by weight of the total composition It provides a laminate that contains 18 parts by weight or less as a basis.
또한, 본 발명은 상술한 적층체를 포함하는 화상 표시 장치를 제공한다.Further, the present invention provides an image display device including the above-described laminate.
본 발명의 적층체는 고온에서도 프라이머층과 접착제층 사이의 접착력이 우수하게 유지될 수 있다.The laminate of the present invention may maintain excellent adhesion between the primer layer and the adhesive layer even at a high temperature.
도 1은 본 발명의 적층체의 구조를 나타낸 것이다.1 shows the structure of the laminate of the present invention.
이하, 본 명세서에 대해 더욱 상세히 설명한다.Hereinafter, the present specification will be described in more detail.
본 발명의 적층체는 접착제층과 프라이머층 사이의 접착력이 고온에서도 우수하게 유지될 수 있는 효과를 갖는다. 상기 적층체는 광학 필름에 적용될 수 있으며, 상기 광학 필름의 예로는 편광판, 반사 방지 필름, 위상차 필름, 프리즘 렌즈 시트 등이 있다. 또한, 상기 적층체는 액정 디스플레이 등의 화상 표시 장치에 적용될 수 있다.The laminate of the present invention has the effect that the adhesive force between the adhesive layer and the primer layer can be maintained excellently even at high temperatures. The laminate may be applied to an optical film, and examples of the optical film include a polarizing plate, an antireflection film, a retardation film, and a prism lens sheet. In addition, the laminate can be applied to an image display device such as a liquid crystal display.
본 발명은 보호 기재(101); 상기 보호 기재의 일면에 구비된 접착제층(103); 및 상기 보호 기재(101)와 접착제층(103) 사이에 구비된 프라이머층(102)을 포함하고, 상기 접착제층은 활성 에너지선 경화형 조성물의 경화물을 포함하고, 상기 활성 에너지선 경화형 조성물은 수산기 함유 아크릴계 모노머를 전체 조성물 100 중량부를 기준으로 18 중량부 이하로 포함하는 것인 적층체를 제공한다. 상기 괄호 안에 부호는 도 1의 적층체 구조의 각 층의 부호를 나타낸 것이다.The present invention is a
상기 적층체는 고온에서도 프라이머층과 접착제층 사이의 접착력이 우수하게 유지될 수 있다. 구체적으로, 상기 적층체를 제조할 때 기기에서 발생되는 열에 의하여, 또는 상기 적층체를 화상 표시 장치 등에 적용하여 사용하는 경우 사용상에 따른 열에 의하여 기재의 온도가 상승하는 경우가 있다. 이때, 접착제층과 프라이머층이 서로 지나치게 용해되어 접착력이 저하되는 경우가 발생한다.The laminate may maintain excellent adhesion between the primer layer and the adhesive layer even at a high temperature. Specifically, the temperature of the base material may increase due to heat generated by a device when manufacturing the laminate, or heat according to usage when the laminate is applied to an image display device or the like. At this time, the adhesive layer and the primer layer are dissolved to each other too much, there is a case where the adhesive strength is reduced.
본 발명자들은 상기 활성 에너지선 경화형 조성물에 포함되는 수산기 함유 아크릴계 모노머의 함량을 조절함으로써, 넓은 공정 온도에 걸쳐 적절한 침식성을 유지하여 접착력을 발현하는 것을 발견하고 본 발명을 완성하였다. 상기 수산기 함유 아크릴계 모노머는 프라이머층에 대한 침식성이 우수하여, 충분한 접착력을 발현할 수 있다.The present inventors have found that by controlling the content of the hydroxyl group-containing acrylic monomer included in the active energy ray-curable composition, the adhesive strength is maintained by maintaining appropriate erosion properties over a wide process temperature, and thus completed the present invention. The hydroxyl group-containing acrylic monomer has excellent erosion properties to the primer layer, and may exhibit sufficient adhesion.
구체적으로, 상기 활성 에너지선 경화형 조성물은 수산기 함유 아크릴계 모노머를 전체 조성물 100 중량부를 기준으로 18 중량부 이하, 바람직하게는 1 중량부 이상 18 중량부 이하, 더욱 바람직하게는 5 중량부 이상 15 중량부 이하, 또는 10 중량부 이상 15 중량부 이하로 포함할 수 있다.Specifically, the active energy ray-curable composition contains 18 parts by weight or less of the hydroxyl group-containing acrylic monomer based on 100 parts by weight of the total composition, preferably 1 part by weight or more and 18 parts by weight or less, more preferably 5 parts by weight or more and 15 parts by weight or more. or less, or 10 parts by weight or more and 15 parts by weight or less.
상기 수산기 함유 아크릴계 모노머는 그 구조 중에 수산기(히드록실기)를 포함하고, 또한 (메트)아크릴로일기, 비닐기 등의 중합성 불포화 이중 결합을 포함하는 화합물이고, 더 바람직하게는 히드록실기 함유 (메트)아크릴계 모노머를 사용하는 것이다. 상기 히드록실기 함유 모노머의 구체예로서는, 예를 들어 2-히드록시에틸(메트)아크릴레이트, 3-히드록시프로필(메트)아크릴레이트, 4-히드록시부틸(메트)아크릴레이트, 6-히드록시헥실(메트)아크릴레이트, 8-히드록시옥틸(메트)아크릴레이트, 10-히드록시데실(메트)아크릴레이트, 12-히드록시라우릴(메트)아크릴레이트 등의, 히드록시알킬(메트)아크릴레이트나 (4-히드록시메틸시클로헥실)-메틸아크릴레이트 등을 들 수 있다. 상기 히드록실기 함유 모노머 중에서도 내구성의 관점에서, 2-히드록시에틸(메트)아크릴레이트, 4-히드록시부틸(메트)아크릴레이트가 바람직하고, 특히 4-히드록시부틸(메트)아크릴레이트가 바람직하다.The hydroxyl group-containing acrylic monomer is a compound that contains a hydroxyl group (hydroxyl group) in its structure and also contains a polymerizable unsaturated double bond such as a (meth)acryloyl group and a vinyl group, and more preferably contains a hydroxyl group A (meth)acrylic monomer is used. As a specific example of the said hydroxyl-group containing monomer, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxy Hydroxyalkyl (meth)acrylics, such as hexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, and 12-hydroxylauryl (meth)acrylate and (4-hydroxymethylcyclohexyl)-methyl acrylate. Among the above-mentioned hydroxyl group-containing monomers, from the viewpoint of durability, 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate are preferable, and 4-hydroxybutyl (meth)acrylate is particularly preferable. Do.
상기 수산기 함유 아크릴계 모노머는 다른 작용기를 갖는 아크릴계 모노머와 비교하여, 프라이머층을 구성하는 폴리에스테르 또는 폴리우레탄 성분에 대한 침식성이 우수하여 충분한 접착력을 구현할 수 있는 기능을 하는데, 함량이 너무 많은 경우 과도한 침식으로 프라이머층이 손상되므로 기재의 표면이 노출되어 접착력이 감소하는 문제가 있다. 본 발명에서는 상기 수산화기를 갖는 아크릴레이트의 함량을 낮게 조절함으로써, 프라이머층과 접착제층이 지나치게 접착하는 것을 방지하고자 하였다.The hydroxyl group-containing acrylic monomer has an excellent erosion property to the polyester or polyurethane component constituting the primer layer, compared to the acrylic monomer having other functional groups, and thus has a function to implement sufficient adhesion. If the content is too large, excessive erosion Since the primer layer is damaged, there is a problem in that the surface of the substrate is exposed and adhesive strength is reduced. In the present invention, by controlling the content of the acrylate having a hydroxyl group to be low, it was intended to prevent excessive adhesion of the primer layer and the adhesive layer.
상술한 수산기 함유 아크릴계 모노머를 "고침식성 아크릴계 모노머"라고 명명하고, 추가로 포함될 수 있는 아크릴계 모노머 중 침식성이 낮은 아크릴계 모노머를 "저침식성 아크릴계 모노머"라고 명명할 수 있다.The above-described hydroxyl group-containing acrylic monomer may be referred to as a “highly erosion acrylic monomer”, and an acrylic monomer having low erosion among acrylic monomers that may be additionally included may be referred to as a “low erosion acrylic monomer”.
상기 활성 에너지선 경화형 조성물은 상기 수산기 함유 아크릴계 모노머 외에 저침식성 아크릴계 모노머를 더 포함할 수 있다. 상기 저침식성 아크릴계 모노머는 상기 수산기 함유 아크릴계 모노머에 비하여, 프라이머층에 대한 침식성이 낮은 성분을 의미한다. 상기 "고침식성 아크릴계 모노머"와 "저침식성 아크릴계 모노머"의 함량 비율을 조절함으로써, 프라이머층에 대한 접착제층의 침식성을 더욱 용이하게 조절할 수 있다.The active energy ray-curable composition may further include a low-erosion acrylic monomer in addition to the hydroxyl group-containing acrylic monomer. The low-erosion acrylic monomer refers to a component having a lower erosion property to the primer layer than the hydroxyl group-containing acrylic monomer. By adjusting the content ratio of the "high erosion acrylic monomer" and the "low erosion acrylic monomer", the erosion of the adhesive layer to the primer layer can be more easily controlled.
구체적으로, 상기 수산기 함유 아크릴계 모노머와 저침식성 아크릴계 모노머의 함량비는 1:1 내지 1:10, 바람직하게는 1:2 내지 1:8, 더욱 바람직하게는 1:2 내지 1:6일 수 있다.Specifically, the content ratio of the hydroxyl group-containing acrylic monomer to the low-erosion acrylic monomer may be 1:1 to 1:10, preferably 1:2 to 1:8, more preferably 1:2 to 1:6. .
상기 저침식성 아크릴계 모노머의 예로는 디프로필렌 글리콜디아크릴레이트, 트리프로필렌 글리콜디아크릴레이트, 하이드록시피발릭산네오펜틸 글리콜디아크릴레이트, 트리에틸렌 글리콜디아크릴레이트, 트리메틸올프로판 트리아크릴레이트, 테트라에틸렌글루콜 디아크릴레이트 등을 들 수 있으며, 접착력 및 무침식성 측면에서 디프로필렌 글리콜디아크릴레이트가 바람직하다.Examples of the low-erosion acrylic monomer include dipropylene glycol diacrylate, tripropylene glycol diacrylate, hydroxypivalic acid neopentyl glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, tetraethylene glue and cold diacrylate, and dipropylene glycol diacrylate is preferable in terms of adhesion and non-erosion.
상기 저침식성 아크릴계 모노머의 함량은 전체 조성물 100 중량부를 기준으로 40 중량부 이상 50 중량부 이하일 수 있다.The content of the low-erosion acrylic monomer may be 40 parts by weight or more and 50 parts by weight or less based on 100 parts by weight of the total composition.
그 외 상기 활성 에너지선 경화형 조성물에 포함될 수 있는 물질에 대해서는 후술하기로 한다.Other materials that may be included in the active energy ray-curable composition will be described later.
접착제층adhesive layer
상기 접착제층은 보호 기재와 다른 광학 부재를 서로 접착하는 기능을 한다.The adhesive layer serves to bond the protective substrate and the other optical member to each other.
상기 접착제층의 상기 프라이머층에 대향하는 면의 반대면에 공정용 보호 필름 등의 광학 부재가 추가로 구비될 수 있다.An optical member such as a protective film for a process may be additionally provided on the opposite surface of the adhesive layer opposite to the primer layer.
상기 접착제층은 활성 에너지선 경화형 조성물의 경화물을 포함한다. 즉, 상기 접착제층은 활성 에너지선 경화형 조성물을 프라이머층 상에 도포한 후 경화시킴으로써 형성될 수 있다.The adhesive layer includes a cured product of an active energy ray-curable composition. That is, the adhesive layer may be formed by applying an active energy ray-curable composition on the primer layer and then curing.
상기 활성에너지선 경화성 수지 조성물을 경화시키는 활성 에너지선으로서는 자외선, 근자외선, 적외선, X선, γ선, 전자선, 프로톤선, 중성자 선 등을 이용할 수 있지만, 경화 속도, 가격, 생산성 관점에서 일반적으로 자외선이나 전자선이 이용된다. 여기서 활성 에너지선으로서 자외선을 이용할 경우에는 활성 에너지선 경화형 조성물 중에 광중합 개시제를 필수 성분으로 한다. 또한 필요하면 또한 광증감제를 첨가해도 좋다.As active energy rays for curing the active energy ray-curable resin composition, ultraviolet rays, near ultraviolet rays, infrared rays, X rays, γ rays, electron rays, proton rays, neutron rays, etc. can be used, but in general from the viewpoint of curing speed, price, and productivity Ultraviolet rays or electron beams are used. Here, when using an ultraviolet-ray as an active energy ray, let a photoinitiator be an essential component in an active-energy-ray-curable composition. Moreover, you may add a photosensitizer further if necessary.
상기 전자선을 조사할 경우에는 주사형 혹은 커튼형 전자선 가속기를 이용해 가속 전압 1000 keV 이하, 바람직하게는 100~300 keV의 에너지를 가지며, 자외선을 조사할 경우에는 초고압 수은 등, 고압 수은등, 저압 수은등, 카본 아크, 메탈 할라이드 램프, UV-LED 등을 이용해 100~400 nm, 바람직하게는 200~400 nm의 파장 영역으로 100~2000 mJ/cm2의 에너지를 가지는 자외선을 조사하는 것이 바람직하다. 또한 경화시킬 때는 불활성 가스 환경 하에서 실시해도 좋다.When irradiating the electron beam, it has an acceleration voltage of 1000 keV or less, preferably 100-300 keV using a scanning or curtain electron beam accelerator, and when irradiating with ultraviolet rays, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, It is preferable to irradiate ultraviolet rays having an energy of 100 to 2000 mJ/cm 2 in a wavelength range of 100 to 400 nm, preferably 200 to 400 nm, using a carbon arc, a metal halide lamp, or UV-LED. Moreover, when hardening, you may carry out in an inert gas environment.
상기 활성 에너지선 경화형 조성물을 도포하는 방법은 특별히 제한은 없고, 접착제를 직접 적하하는 방법, 롤 코트법, 분무법, 침지법 등의 각종 수단을 채용할 수 있다.The method for applying the active energy ray-curable composition is not particularly limited, and various means such as a method of directly dropping an adhesive, a roll coating method, a spraying method, and an immersion method can be employed.
본 발명의 활성 에너지선 경화형 조성물은 상기 수산기 함유 아크릴계 모노머 외에 카르복실기, 아미노기 및 아미드기 등의 극성 관능기를 함유하는 모노머를 더 포함할 수 있다.The active energy ray-curable composition of the present invention may further include a monomer containing a polar functional group such as a carboxyl group, an amino group and an amide group in addition to the hydroxyl group-containing acrylic monomer.
상기 카르복실기 함유 모노머는, 그 구조 중에 카르복실기를 포함하고, 또한 (메트)아크릴로일기, 비닐기 등의 중합성 불포화 이중 결합을 포함하는 화합물이다. 카르복실기 함유 모노머의 구체예로서는, 예를 들어 (메트)아크릴산, 카르복시에틸(메트)아크릴레이트, 카르복시펜틸(메트)아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산 등을 들 수 있다. 상기 카르복실기 함유 모노머 중에서도 공중합성, 가격 및 접착 특성(접착력 등)의 관점에서 아크릴산이 바람직하다.The said carboxyl group containing monomer is a compound which contains a carboxyl group in the structure, and also contains polymerizable unsaturated double bonds, such as a (meth)acryloyl group and a vinyl group. Specific examples of the carboxyl group-containing monomer include (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Among the carboxyl group-containing monomers, acrylic acid is preferable from the viewpoints of copolymerizability, price, and adhesive properties (adhesive strength, etc.).
상기 아미노기 함유 모노머는, 그 구조 중에 아미노기를 포함하고, 또한 (메트)아크릴로일기, 비닐기 등의 중합성 불포화 이중 결합을 포함하는 화합물이다. 아미노기 함유 모노머의 구체예로서는, 예를 들어 아미노에틸(메트)아크릴레이트, N,N-디메틸아미노에틸(메트)아크릴레이트, N,N-디메틸아미노프로필(메트)아크릴레이트 등을 들 수 있다.The said amino-group containing monomer is a compound which contains an amino group in the structure, and also contains polymerizable unsaturated double bonds, such as a (meth)acryloyl group and a vinyl group. Specific examples of the amino group-containing monomer include aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and N,N-dimethylaminopropyl (meth)acrylate.
상기 아미드기 함유 모노머는, 그 구조 중에 아미드기를 포함하고, 또한 (메트)아크릴로일기, 비닐기 등의 중합성 불포화 이중 결합을 포함하는 화합물이다. 아미드기 함유 모노머의 구체예로서는, (메트)아크릴아미드, N,N-디메틸(메트)아크릴아미드, N,N-디에틸(메트)아크릴아미드, N-이소프로필아크릴아미드, N-메틸(메트)아크릴아미드, N-부틸(메트)아크릴아미드, N-헥실(메트)아크릴아미드, N-메틸올(메트)아크릴아미드, N-메틸올-N-프로판(메트)아크릴아미드, 아미노메틸(메트)아크릴아미드, 아미노에틸(메트)아크릴아미드, 머캅토메틸(메트)아크릴아미드, 머캅토에틸(메트)아크릴아미드 등의 아크릴아미드계 모노머; N-(메트)아크릴로일모르폴린, N-(메트)아크릴로일피페리딘, N-(메트)아크릴로일피롤리딘 등의 N-아크릴로일 복소환 모노머; N-비닐-피롤리돈, N- 비닐-ε-카프로락탐 등의 N-비닐기 함유 락탐계 모노머 등을 들 수 있다. 아미드기 함유 모노머는, 내구성을 만족시키는 면에서 바람직하고, 아미드기 함유 모노머 중에서도, 특히 N-비닐기 함유 락탐계 모노머가 바람직하다.The said amide group containing monomer is a compound which contains an amide group in the structure, and also contains polymerizable unsaturated double bonds, such as a (meth)acryloyl group and a vinyl group. Specific examples of the amide group-containing monomer include (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-isopropylacrylamide, N-methyl (meth) Acrylamide, N-butyl (meth) acrylamide, N-hexyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methylol-N-propane (meth) acrylamide, aminomethyl (meth) acrylamide-based monomers such as acrylamide, aminoethyl (meth)acrylamide, mercaptomethyl (meth)acrylamide, and mercaptoethyl (meth)acrylamide; N-acryloyl heterocyclic monomers, such as N-(meth)acryloylmorpholine, N-(meth)acryloylpiperidine, and N-(meth)acryloylpyrrolidine; and N-vinyl group-containing lactam monomers such as N-vinyl-pyrrolidone and N-vinyl-ε-caprolactam. The amide group-containing monomer is preferable from the viewpoint of satisfying durability, and among the amide group-containing monomers, an N-vinyl group-containing lactam-based monomer is particularly preferable.
본 발명의 활성 에너지선 경화형 조성물은 방향환 함유 (메트)아크릴레이트를 더 포함할 수 있다. 상기 방향환 함유 (메트)아크릴레이트는, 그 구조 중에 방향환 구조를 포함하고, 또한 (메트)아크릴로일기를 포함하는 화합물이다. 방향환으로서는, 벤젠환, 나프탈렌환, 또는 비페닐환을 들 수 있다. 방향환 함유 (메트)아크릴레이트는, 내구성을 만족시키고, 또한 주변부의 백화에 의한 표시 불균일을 개선할 수 있다. 방향환 함유 (메트)아크릴레이트의 구체예로서는, 예를 들어 벤질(메트)아크릴레이트, 페닐(메트)아크릴레이트, o-페닐페놀(메트)아크릴레이트, 페녹시(메트)아크릴레이트, 페녹시에틸(메트)아크릴레이트, 페녹시프로필(메트)아크릴레이트, 페녹시디에틸렌글리콜(메트)아크릴레이트, 에틸렌옥시드 변성 노닐페놀(메트)아크릴레이트, 에틸렌옥시드 변성 크레졸(메트)아크릴레이트, 페놀에틸렌옥시드 변성(메트)아크릴레이트, 2-히드록시-3-페녹시 프로필(메트)아크릴레이트, 메톡시 벤질(메트)아크릴레이트, 클로로벤질(메트)아크릴레이트, 크레실(메트)아크릴레이트, 폴리스티릴(메트)아크릴레이트 등의 벤젠환을 갖는 것; 히드록시에틸화β나프톨 아크릴레이트, 2-나프토에틸(메트)아크릴레이트, 2-나프톡시에틸아크릴레이트, 2-(4-메톡시-1-나프톡시)에틸(메트)아크릴레이트 등의 나프탈렌환을 갖는 것; 비페닐(메트)아크릴레이트 등의 비페닐환을 갖는 것을 들 수 있다. 특히, 상기 방향환 함유 (메트)아크릴레이트로서는, 접착 특성이나 내구성의 관점에서, 벤질(메트)아크릴레이트, 페녹시에틸(메트)아크릴레이트가 바람직하고, 특히 페녹시에틸(메트)아크릴레이트가 바람직하다.The active energy ray-curable composition of the present invention may further include an aromatic ring-containing (meth)acrylate. The said aromatic ring containing (meth)acrylate is a compound containing an aromatic ring structure in the structure, and also containing a (meth)acryloyl group. As an aromatic ring, a benzene ring, a naphthalene ring, or a biphenyl ring is mentioned. An aromatic ring containing (meth)acrylate can satisfy durability and can improve the display nonuniformity by whitening of a peripheral part. As a specific example of aromatic ring containing (meth)acrylate, For example, benzyl (meth)acrylate, phenyl (meth)acrylate, o-phenylphenol (meth)acrylate, phenoxy (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxypropyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, ethylene oxide-modified nonylphenol (meth)acrylate, ethylene oxide-modified cresol (meth)acrylate, phenol ethylene Oxide-modified (meth) acrylate, 2-hydroxy-3-phenoxy propyl (meth) acrylate, methoxy benzyl (meth) acrylate, chlorobenzyl (meth) acrylate, cresyl (meth) acrylate, What has a benzene ring, such as polystyryl (meth)acrylate; Naphthalenes such as hydroxyethylated β-naphthol acrylate, 2-naphthoethyl (meth) acrylate, 2-naphthoxyethyl acrylate, and 2-(4-methoxy-1-naphthoxy) ethyl (meth) acrylate having a ring; What has a biphenyl ring, such as biphenyl (meth)acrylate, is mentioned. In particular, as the aromatic ring-containing (meth)acrylate, from the viewpoint of adhesive properties and durability, benzyl (meth)acrylate and phenoxyethyl (meth)acrylate are preferable, and in particular, phenoxyethyl (meth)acrylate is desirable.
상기 활성 에너지선 경화형 조성물은 단독 중합체의 유리전이온도(Tg)가 150℃ 이상인 다관능성 (메타)아크릴레이트 모노머를 포함할 수 있다. 상기 다관능성 (메타)아크릴레이트 모노머는 방사선 조사에 의한 경화를 통하여 제2 가교 구조를 형성하고 양생을 거치는 동안 접착제를 보다 단단한(hard) 상태가 되도록 함으로써 내구성 저하 문제를 개선하는 동시에 원하는 저장탄성률(G')을 확보할 수 있다. 또한, 활성 에너지선 경화형 조성물을 희석하여 점도를 조절함으로써 도공이 용이하도록 하는 성분이다. 즉, 상기 다관능성 (메타)아크릴레이트 모노머는 경화된 접착제층에 내구성을 부여하는 동시에 점탄성을 유지하며, 점도를 조절하여 활성 에너지선 경화형 조성물의 작업성을 향상시키는 역할을 한다.The active energy ray-curable composition may include a polyfunctional (meth)acrylate monomer having a glass transition temperature (Tg) of 150° C. or higher of the homopolymer. The polyfunctional (meth)acrylate monomer forms a second cross-linked structure through curing by irradiation with radiation and makes the adhesive more hard during curing, thereby improving the problem of durability degradation and at the same time improving the desired storage modulus ( G') can be obtained. In addition, it is a component for easy coating by diluting the active energy ray-curable composition to adjust the viscosity. That is, the multifunctional (meth)acrylate monomer serves to improve the workability of the active energy ray-curable composition by imparting durability to the cured adhesive layer, maintaining viscoelasticity, and controlling the viscosity.
상기 단독 중합체의 유리전이온도(Tg)가 150℃ 이상인 다관능성 (메타)아크릴레이트 모노머로는, 예를 들면, 디메틸올트리시클로데칸 디아크릴레이트 (Tg: 214℃), (트리스히드록시에틸이소시아누레이트)트리아크릴레이트 (Tg: 225℃), [2-[1,1-디메틸-2[(1-옥소알릴)옥시]에틸]-5-에틸-1,3-디옥산-5일]메틸 아크릴레이트 (Tg: 180℃), 9,9-비스[4-(2-아크릴로옥시에톡시) 페닐플로렌 (Tg: 179℃) 및 (트리스히드록시에틸이소시아누레이트)트리아크릴레이트 (Tg: 275℃) 등이 예시될 수 있으나, 이에 제한되는 것은 아니다.As a polyfunctional (meth)acrylate monomer having a glass transition temperature (Tg) of 150° C. or higher of the homopolymer, for example, dimethyloltricyclodecane diacrylate (Tg: 214° C.), (trishydroxyethyl Socyanurate) triacrylate (Tg: 225° C.), [2-[1,1-dimethyl-2[(1-oxoallyl)oxy]ethyl]-5-ethyl-1,3-dioxan-5yl ]methyl acrylate (Tg: 180°C), 9,9-bis[4-(2-acrylooxyethoxy)phenylfluorene (Tg: 179°C) and (trishydroxyethylisocyanurate)triacrylic The rate (Tg: 275° C.) may be exemplified, but is not limited thereto.
본 발명의 활성 에너지선 경화형 조성물은 개질 모노머를 더 포함할 수 있다. 상기 개질 모노머는, 아세트산 비닐, 프로피온산 비닐 등의 비닐계 모노머; 아크릴로니트릴, 메타크릴로니트릴 등의 시아노아크릴레이트계 모노머; 글리시딜(메트)아크릴레이트 등의 에폭시기 함유 (메트)아크릴레이트; 폴리에틸렌글리콜(메트)아크릴레이트, 폴리프로필렌글리콜(메트)아크릴레이트, 메톡시에틸렌글리콜(메트)아크릴레이트, 메톡시폴리프로필렌글리콜(메트)아크릴레이트 등의 글리콜계(메트)아크릴레이트; 테트라히드로푸르푸릴(메트)아크릴레이트, 불소(메트)아크릴레이트, 실리콘(메트)아크릴레이트나 2-메톡시에틸아크릴레이트 등의 (메트)아크릴레이트 모노머 등도 사용할 수 있다. 게다가, 이소프렌, 부타디엔, 이소부틸렌, 비닐에테르 등을 들 수 있다.The active energy ray-curable composition of the present invention may further include a modifying monomer. The modifying monomer may be a vinyl-based monomer such as vinyl acetate or vinyl propionate; cyanoacrylate-based monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing (meth)acrylates such as glycidyl (meth)acrylate; glycol-based (meth)acrylates such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, and methoxy polypropylene glycol (meth) acrylate; (meth)acrylate monomers, such as tetrahydrofurfuryl (meth)acrylate, a fluorine (meth)acrylate, silicone (meth)acrylate, and 2-methoxyethyl acrylate, etc. can also be used. Moreover, isoprene, butadiene, isobutylene, vinyl ether, etc. are mentioned.
본 발명의 활성 에너지선 경화형 조성물은 규소 원자를 함유하는 실란계 모노머를 더 포함할 수 있다. 상기 실란계 모노머로서는, 예를 들어 3-아크릴옥시프로필트리에톡시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 4-비닐부틸트리메톡시실란, 4-비닐부틸트리에톡시실란, 8-비닐옥틸트리메톡시실란, 8-비닐옥틸트리에톡시실란, 10-메타크릴로일옥시데실트리메톡시실란, 10-아크릴로일옥시데실트리메톡시실란, 10-메타크릴로일옥시데실트리에톡시실란, 10-아크릴로일옥시데실트리에톡시실란 등을 들 수 있다.The active energy ray-curable composition of the present invention may further include a silane-based monomer containing a silicon atom. Examples of the silane-based monomer include 3-acryloxypropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 4-vinylbutyltrimethoxysilane, 4-vinylbutyltriethoxysilane, 8 -Vinyloctyltrimethoxysilane, 8-vinyloctyltriethoxysilane, 10-methacryloyloxydecyltrimethoxysilane, 10-acryloyloxydecyltrimethoxysilane, 10-methacryloyloxydecyl Triethoxysilane, 10-acryloyloxydecyl triethoxysilane, etc. are mentioned.
또한, 기타의 모노머로서는, 트리프로필렌글리콜디(메트)아크릴레이트, 테트라에틸렌글리콜디(메트)아크릴레이트, 1,6-헥산디올디(메트)아크릴레이트, 비스페놀A디글리시딜에테르디(메트)아크릴레이트, 네오펜틸글리콜디(메트)아크릴레이트, 트리메틸올프로판트리(메트)아크릴레이트, 펜타에리트리톨트리(메트)아크릴레이트, 펜타에리트리톨테트라(메트)아크릴레이트, 디펜타에리트리톨펜타(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트, 카프로락톤 변성 디펜타에리트리톨 헥사(메트)아크릴레이트 등의 (메트)아크릴산과 다가 알코올의 에스테르화물 등의 (메트)아크릴로일기, 비닐기 등의 불포화 이중 결합을 2개 이상 갖는 다관능성 모노머나, 폴리에스테르, 에폭시, 우레탄 등의 골격에 모노머 성분과 마찬가지의 관능기로서 (메트)아크릴로일기, 비닐기 등의 불포화 이중 결합을 2개 이상 부가한 폴리에스테르(메트)아크릴레이트, 에폭시(메트)아크릴레이트, 우레탄(메트)아크릴레이트 등을 사용할 수도 있다.In addition, as other monomers, tripropylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A diglycidyl ether di(meth) ) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta ( (meth)acryloyl groups such as esters of (meth)acrylic acid and polyhydric alcohols such as meth)acrylate, dipentaerythritol hexa(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, A polyfunctional monomer having two or more unsaturated double bonds such as a vinyl group, or a (meth)acryloyl group, an unsaturated double bond such as a vinyl group as the same functional group as the monomer component in the skeleton such as polyester, epoxy, urethane Polyester (meth)acrylate, epoxy (meth)acrylate, urethane (meth)acrylate, etc. added more than one can also be used.
본 발명의 활성 에너지선 경화형 조성물은 상술한 아크릴계 모노머로부터 형성된 (메트)아크릴계 폴리머를 포함할 수 있다. 이때, 중량 평균 분자량(Mw)이 50만∼300만인 것이 바람직하게 사용된다. 내구성, 특히 내열성을 고려하면, 중량 평균 분자량(Mw)은 100만∼250만인 것이 보다 바람직하고, 110만∼200만이 더욱 바람직하다. 중량 평균 분자량(Mw)이 50만보다 작으면, 내열성의 점에서 바람직하지 않다. 또한, 중량 평균 분자량(Mw)이 300만보다 커지면 접착제층이 단단해지기 쉬운 경향이 있어, 박리가 발생하기 쉬워진다. 또한, 중량 평균 분자량(Mw)은 GPC(겔 투과 크로마토그래피)에 의해 측정하고, 폴리스티렌 환산에 의해 산출된 값으로부터 구해진다.The active energy ray-curable composition of the present invention may include a (meth)acrylic polymer formed from the above-described acrylic monomer. At this time, those having a weight average molecular weight (Mw) of 500,000 to 3,000,000 are preferably used. When durability, especially heat resistance is considered, it is more preferable that it is 1 million - 2.5 million, and, as for a weight average molecular weight (Mw), 1.1 million - 2 million are still more preferable. When the weight average molecular weight (Mw) is smaller than 500,000, it is not preferable from the viewpoint of heat resistance. Moreover, when a weight average molecular weight (Mw) becomes larger than 3 million, there exists a tendency for an adhesive bond layer to become hard easily, and it will become easy to generate|occur|produce peeling. In addition, a weight average molecular weight (Mw) is measured by GPC (gel permeation chromatography), and is calculated|required from the value computed by polystyrene conversion.
본 발명의 활성 에너지선 경화형 조성물은 폴리에스테르계 우레탄 아크릴레이트 올리고머를 포함할 수 있다. 이 경우, 조성물의 전체 유리전이온도(Tg)가 떨어지는 경우에도, 폴리에스테르기에 의한 리타데이션(Relaxation)을 부여함으로써 내열성 및 내수성이 우수한 장점을 갖는다. 또한, 다른 부재에 대한 접착력이 우수하여, 코로나 처리 등의 별도의 처리 없이도 필름에 대한 접착력이 우수한 장점을 갖는다. 특히, 상기 폴리에스테르계 우레탄 아크릴레이트 올리고머는, 에폭시계 우레탄 아크릴레이트 올리고머 등과 같은 다른 올리고머에 비하여 전처리되지 않은 보호 필름에 대한 접착력이 우수한 효과를 갖는다. 상술한 활성 에너지선 경화형 조성물이 보호 기재에 도포되는 경우, 산가를 갖는 에스테르기에 의하여 보호 필름의 접착제와의 접합면이 침식되게 되어, 조성물이 보호 필름 표면에 잘 스며들 수 있는 물리적 구조를 갖게 된다. 즉, 에스테르기에 의한 물리적 효과와 화학적 효과 동시에 구현하여 접착력을 증가시킬 수 있다.The active energy ray-curable composition of the present invention may include a polyester-based urethane acrylate oligomer. In this case, even when the total glass transition temperature (Tg) of the composition falls, it has excellent heat resistance and water resistance by imparting retardation by a polyester group. In addition, since it has excellent adhesion to other members, it has an advantage of excellent adhesion to the film without a separate treatment such as corona treatment. In particular, the polyester-based urethane acrylate oligomer has an excellent adhesion to the non-pretreated protective film compared to other oligomers such as epoxy-based urethane acrylate oligomer. When the above-described active energy ray-curable composition is applied to a protective substrate, the bonding surface of the protective film with the adhesive is eroded by the ester group having an acid value, so that the composition has a physical structure that can easily penetrate the protective film surface. . That is, it is possible to increase the adhesion by simultaneously implementing the physical and chemical effects of the ester group.
상기 폴리에스테르계 우레탄 아크릴레이트 올리고머의 산가를 조절하여, 활성 에너지선 경화형 조성물의 기재 필름에 대한 접착력을 더욱 향상시킬 수 있다. 구체적으로, 상기 폴리에스테르계 우레탄 아크릴레이트 올리고머의 산가가 90 mgKOH/g 내지 180 mgKOH/g, 바람직하게는 산가가 95 mgKOH/g 내지 175 mgKOH/g, 더욱 `바람직하게는 산가가 100 mgKOH/g 내지 170 mgKOH/g일 수 있다. 상기 범위를 만족할 때, 활성 에너지선 경화형 조성물이 기재 필름을 효과적으로 침식(식각)함으로써 기재 필름에 대한 접착력이 우수하게 확보될 수 있다. 또한, 상기 범위에 미달하는 경우 보호 필름을 식각하는 정도가 적으므로 접착력이 떨어지고, 상기 범위를 초과하는 경우 기재 필름을 과도하게 식각하는 문제가 있으므로, 산가의 범위를 상기 범위로 조절하는 것이 바람직하다.By controlling the acid value of the polyester-based urethane acrylate oligomer, it is possible to further improve the adhesion of the active energy ray-curable composition to the base film. Specifically, the polyester-based urethane acrylate oligomer has an acid value of 90 mgKOH/g to 180 mgKOH/g, preferably an acid value of 95 mgKOH/g to 175 mgKOH/g, more `preferably an acid value of 100 mgKOH/g to 170 mgKOH/g. When the above range is satisfied, the active energy ray-curable composition effectively erodes (etches) the base film, thereby ensuring excellent adhesion to the base film. In addition, when the range is less than the above range, the degree of etching the protective film is small, so the adhesive strength is lowered, and when it exceeds the range, there is a problem of excessive etching of the base film, so it is preferable to adjust the range of the acid value to the range .
상기 산가란, 시료 1kg에 포함되어 있는 다가산 또는 그 에스테르의 산성분(다가산의 카복실기)을 중화하는 데 소요되는 KOH의 당량을 측정하는 것으로, 시료 1kg에 있는 산성분과 동일한 양의 KOH 밀리당량에 해당하는 양을 의미한다. 상기 산가는 하기 방법에 의해 구할 수 있다.The acid value is to measure the equivalent of KOH required to neutralize the acid component (carboxyl group of the polyhydric acid) of the polyhydric acid or its ester contained in 1 kg of the sample, and the same amount of KOH as the acid content in 1 kg of the sample is measured. It means the amount corresponding to the equivalent weight. The said acid value can be calculated|required by the following method.
먼저, 합성한 아크릴레이트 올리고머의 산가를 측정하기 위하여 적정에 사용할 0.1 N 수산화칼륨 용액을 제조한다. 1 L 플라스크에 95 wt% 시약급 수산화칼륨 5.9 g을 넣은 다음 소량의 물을 첨가하여 완전히 녹인다. 여기에 메탄올을 투입하여 전체 부피가 1 L가 되도록 혼합한다.First, in order to measure the acid value of the synthesized acrylate oligomer, a 0.1 N potassium hydroxide solution to be used for titration is prepared. Put 5.9 g of 95 wt% reagent grade potassium hydroxide in a 1 L flask, and then add a small amount of water to dissolve it completely. Methanol is added here and mixed so that the total volume is 1 L.
만들어진 적정액의 보정 factor를 구하기 위해 35 wt% HCl 용액 10 mL를 비커에 넣고, 페놀프탈레인 지시약 2∼3 방울을 투입한다. 여기에 앞서 제조한 0.1 N 수산화칼륨 적정용액이 옅은 적색으로 변할 때까지 투입한 후 사용된 부피를 구한다. 이와 같은 실험을 3회 반복하여 구한 값 중, 최대값과 최소값을 제외한 나머지 3개의 값을 평균하여 평균값 A (mL)를 구한 후 다음 식을 사용하여 보정 factor f를 구한다.To obtain the correction factor of the prepared titrant, 10 mL of 35 wt% HCl solution is placed in a beaker, and 2-3 drops of phenolphthalein indicator are added. Here, the 0.1 N potassium hydroxide titration solution prepared above is added until it turns pale red, and then the volume used is calculated. Among the values obtained by repeating this experiment three times, the average value A (mL) is obtained by averaging the remaining three values excluding the maximum and minimum values, and then the correction factor f is obtained using the following formula.
f = 5.611 / Af = 5.611 / A
시료 1 g 정도를 취하여 질량(M)을 정확하게 측정한 후, 톨루엔 42.8 g(50 mL)에 용해시킨다. 1 wt% 페놀프탈레인 지시약을 2∼3 방울 넣고 교반하면서 0.1 N 수산화칼륨 용액으로 적정하고 이때 소비된 양(B)을 mL 단위로 측정한 후 다음 식을 이용하여 산가를 계산한다.Take about 1 g of the sample, measure the mass (M) accurately, and then dissolve it in 42.8 g (50 mL) of toluene. Add 2-3 drops of 1 wt% phenolphthalein indicator and titrate with 0.1 N potassium hydroxide solution while stirring. At this time, measure the consumed amount (B) in mL, and then calculate the acid value using the following formula.
Acid Value = 5.611 x N x f x B / MAcid Value = 5.611 x N x f x B / M
여기서 N : 수산화칼륨 표준용액의 농도, where N: concentration of potassium hydroxide standard solution,
f : 수산화칼륨 용액의 보정f: Calibration of potassium hydroxide solution
factor, B : 수산화칼륨 용액의 소비량(mL), factor, B: consumption of potassium hydroxide solution (mL),
M : 시료의 질량(g)M : mass of sample (g)
상기 산가를 구하는 방법은 다가산 또는 이의 에스테르의 카복실기를 염기인 KOH로 적정하는 산/염기 적정법의 일 예이며, 미반응 산성분 또는 이의 에스테르성분을 분석하는 공지된 방법들을 사용할 수도 있다. 예를 들어 다가산의 에스테르성분의 경우 가스크로마토그래피 분석 등을 사용하여 시료 1kg중의 미반응 에스테르성분을 분석한 후 이에 해당하는 KOH의 양을 계산하여 상기 산가를 구할 수도 있다.The method for obtaining the acid value is an example of an acid/base titration method in which a carboxyl group of a polyhydric acid or an ester thereof is titrated with KOH as a base, and known methods for analyzing an unreacted acid component or an ester component thereof may also be used. For example, in the case of an ester component of a polyhydric acid, the acid value may be obtained by analyzing the unreacted ester component in 1 kg of the sample using gas chromatography analysis, etc., and then calculating the amount of KOH corresponding thereto.
상기 폴리에스테르계 우레탄 아크릴레이트 올리고머는 (메타)아크릴레이트계 반응성 모노머와 가교구조를 형성하여 경화된 수지의 물성(예, 경도, 밀착력, 유연성 등)을 제어하는 성분으로, 활성 에너지선 경화형 조성물에 적용 시, 성형 가공성, 탄성 및 접착성을 향상시킬 수 있다.The polyester-based urethane acrylate oligomer is a component that controls the physical properties (eg, hardness, adhesion, flexibility, etc.) of a cured resin by forming a cross-linked structure with a (meth)acrylate-based reactive monomer, and is used in an active energy ray-curable composition. When applied, it can improve moldability, elasticity and adhesion.
상기 우레탄 아크릴레이트 올리고머는 올리고머의 구조 내 양 말단에 아크릴레이트기를 갖는 화학적 구조를 갖는다. 구체적으로, 상기 우레탄 아크릴레이트 올리고머는 폴리에스테르계 폴리올 화합물; 이소시아네이트계 화합물; 및 아크릴레이트계 화합물을 포함하는 조성물로부터 형성될 수 있다.The urethane acrylate oligomer has a chemical structure having acrylate groups at both ends in the structure of the oligomer. Specifically, the urethane acrylate oligomer is a polyester-based polyol compound; isocyanate-based compounds; And it may be formed from a composition comprising an acrylate-based compound.
상기 폴리에스테르계 우레탄 아크릴레이트 올리고머는 아래 합성 과정을 통해 합성될 수 있다. 즉, 에스테르기(R1)를 갖는 폴리에스테르계 폴리올 화합물 (P)과 디이소시아네이트계 화합물(I)를 반응시켜 말단이 이소시아네이트기를 갖도록 1차 합성한 후, 여기에 히드록시기를 갖는 아크릴레이트계 화합물(A)를 이소시아네이트와 반응시켜 최종 폴리에스테르계 우레탄 아크릴레이트 올리고머를 제조할 수 있다. 또는, 아래와 같은 반응식에 의해 합성된 중합체(co-polymer)일 수도 있으나, 단순 혼합된 혼합물 형태(mixture)일 수도 있다.The polyester-based urethane acrylate oligomer may be synthesized through the following synthesis process. That is, a polyester-based polyol compound (P) having an ester group (R1) is reacted with a diisocyanate-based compound (I) to first synthesize an isocyanate group at the terminal, and then an acrylate-based compound having a hydroxyl group (A) ) can be reacted with isocyanate to prepare a final polyester-based urethane acrylate oligomer. Alternatively, it may be a polymer (co-polymer) synthesized by the following reaction scheme, but may be in the form of a simple mixed mixture.
상기 폴리에스테르계 폴리올 화합물에 의하여, 상기 올리고머는 주쇄에 폴리에스터 화학 구조를 포함하게 되며, 그 결과, 동일한 경화도를 가질 때, 폴리에스터 화학 구조를 포함하지 않는 올리고머에 비하여 단차 흡수성이 좋고 경화 반응의 효율이 높아 신뢰성을 확보하기에 유리할 수 있다.Due to the polyester-based polyol compound, the oligomer includes a polyester chemical structure in the main chain, and as a result, when it has the same degree of curing, it has better step absorption compared to an oligomer that does not contain a polyester chemical structure, and the curing reaction It may be advantageous for securing reliability due to high efficiency.
상기 이소시아네이트 화합물은, 구체적으로, 1,6-헥사메틸렌디이소시아네이트(HDI), 톨루엔디이소시아네이트(TDI), 이소포론디이소시아네이트(IPDI), 크실렌디이소시아네이트(XDI) 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있다. 구체적으로, 상기 이소시아네이트 화합물은 이소포론디이소시아네이트(IPDI)를 포함할 수 있고, 이 경우, 상기 올리고머는 주쇄에 시클로알킬렌 구조의 화학 구조를 포함하게 되며, 그 결과, 이러한 화학 구조를 포함하지 않는 경우에 비하여 고온 고습 신뢰성 확보에 이점을 얻을 수 있다.The isocyanate compound is specifically selected from the group consisting of 1,6-hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), isophorone diisocyanate (IPDI), xylene diisocyanate (XDI) and combinations thereof may contain one. Specifically, the isocyanate compound may include isophorone diisocyanate (IPDI), and in this case, the oligomer contains a chemical structure of a cycloalkylene structure in the main chain, and as a result, does not contain this chemical structure An advantage can be obtained in securing the reliability of high temperature and high humidity compared to the case.
상기 아크릴레이트계 화합물은 상기 올리고머의 양 말단에 아크릴레이트기를 부여하기 위한 화합물로서, 히드록시기를 갖는 아크릴레이트 화합물을 포함할 수 있다. 구체적으로, 상기 아크릴레이트계 화합물은 히드록시에틸아크릴레이트(HEA), 히드록시프로필아크릴레이트(HPA), 히드록시부틸아크릴레이트(HBA) 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있다.The acrylate-based compound is a compound for providing acrylate groups to both ends of the oligomer, and may include an acrylate compound having a hydroxyl group. Specifically, the acrylate-based compound may include one selected from the group consisting of hydroxyethyl acrylate (HEA), hydroxypropyl acrylate (HPA), hydroxybutyl acrylate (HBA), and combinations thereof. .
상기 폴리에스테르계 우레탄 아크릴레이트 올리고머의 수평균 분자량이 1,000 내지 50,000, 바람직하게는 1,000 내지 35,000, 더욱 바람직하게는 1,000 내지 20,000일 수 있다. 상기 우레탄 아크릴레이트 올리고머의 수평균 분자량이 1000 미만인 경우, 경화된 접착제층의 내마모성, 밀착 성 및 내약품성이 저하될 수 있다. 상기 우레탄 아크릴레이트 올리고머의 수평균 분자량이 50,000을 초과하는 경우, 경화된 접착제층의 연필 경도, 내마모성, 밀착성 및 내약품성이 저하될 수 있다.The number average molecular weight of the polyester-based urethane acrylate oligomer may be 1,000 to 50,000, preferably 1,000 to 35,000, and more preferably 1,000 to 20,000. When the number average molecular weight of the urethane acrylate oligomer is less than 1000, the abrasion resistance, adhesion, and chemical resistance of the cured adhesive layer may be reduced. When the number average molecular weight of the urethane acrylate oligomer exceeds 50,000, pencil hardness, abrasion resistance, adhesion and chemical resistance of the cured adhesive layer may be reduced.
상기 폴리에스테르계 우레탄 아크릴레이트 올리고머의 관능기수가 1 내지 10일 수 있다. 광경화 속도 및 내수성 등을 고려했을 때, 상기 우레탄 아크릴레이트는 1 내지 8 관능기, 바람직하게는 2 내지 6의 관능기를 가질 수 있다. 이 때, 특정 개수의 관능기를 갖는 우레탄 아크릴레이트 올리고머는, 실질적으로 상기 특정 개수의 관능기를 갖는 우레탄 아크릴레이트 올리고머의 역할을 수행하는 다른 우레탄 아크릴레이트 올리고머를 포함하는 개념일 수 있다. 예를 들어, 10 관능기를 갖는 우레탄 아크릴레이트 올리고머에서, 관능기 중 1개의 관능기가 실질적으로 활성을 갖지 못하는 경우, 이러한 10 관능기를 갖는 우레탄 아크릴레이트 올리고머는 9 관능기를 갖는 우레탄 아크릴레이트 올리고머에 포함될 수 있다.The number of functional groups of the polyester-based urethane acrylate oligomer may be 1 to 10. Considering the photocuring rate and water resistance, the urethane acrylate may have 1 to 8 functional groups, preferably 2 to 6 functional groups. In this case, the urethane acrylate oligomer having a specific number of functional groups may be a concept including other urethane acrylate oligomers substantially performing the role of the urethane acrylate oligomer having the specific number of functional groups. For example, in a urethane acrylate oligomer having a 10-functional group, when one functional group among the functional groups has substantially no activity, the urethane acrylate oligomer having a 10-functional group may be included in the urethane acrylate oligomer having a 9 functional group. .
상기 폴리에스테르계 우레탄 아크릴레이트 올리고머의 25℃에서의 점도가 1,000 cPs 이상 50,000 cPs 이하, 바람직하게는 2,000 cPs 이상 50,000 cPs 이하, 더욱 바람직하게는 2,500 cPs 이상 50,000 cPs 이하일 수 있다. 전술한 점도와 분자량 범위에서 경화물의 제조시 성형 가공성이 우수하고, 탄성 및 접착성 등이 우수하다.The polyester-based urethane acrylate oligomer may have a viscosity at 25° C. of 1,000 cPs or more and 50,000 cPs or less, preferably 2,000 cPs or more and 50,000 cPs or less, and more preferably 2,500 cPs or more and 50,000 cPs or less. In the above-mentioned viscosity and molecular weight range, when the cured product is manufactured, the molding processability is excellent, and the elasticity and adhesiveness are excellent.
상기 활성 에너지선 경화형 조성물은 광개시제를 포함할 수 있다. 상기 광개시제로서는 종래 공지의 광개시제를 특별히 제한 없이 사용할 수 있다. 구체적으로는 예를 들면, 방향족 다이아조늄염, 방향족 아이오도늄염이나 방향족 설포늄염 등의 오늄염, 철-알렌 착체 등을 들 수 있다. 이들은 단독으로도 또는 2종 이상을 조합시켜서 사용해도 된다.The active energy ray-curable composition may include a photoinitiator. As the photoinitiator, a conventionally known photoinitiator may be used without particular limitation. Specific examples thereof include onium salts such as aromatic diazonium salts, aromatic iodonium salts and aromatic sulfonium salts, and iron-allene complexes. These may be used individually or in combination of 2 or more types.
상기 방향족 다이아조늄염으로서는 예를 들면, 벤젠다이아조늄 헥사플루오로안티모네이트, 벤젠다이아조늄 헥사플루오로포스페이트, 벤젠다이아조늄 헥사플루오로보레이트 등을 들 수 있다.Examples of the aromatic diazonium salt include benzenediazonium hexafluoroantimonate, benzenediazonium hexafluorophosphate, and benzenediazonium hexafluoroborate.
상기 방향족 아이오도늄염으로서는 예를 들면, 다이페닐아이오도늄테트라키스(펜타플루오로페닐)보레이트, 다이페닐아이오도늄 헥사플루오로포스페이트, 다이페닐아이오도늄 헥사플루오로안티모네이트, 다이(4-노닐페닐)아이오도늄 헥사플루오로포스페이트 등을 들 수 있다.Examples of the aromatic iodonium salt include diphenyliodoniumtetrakis(pentafluorophenyl)borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, and di(4 -Nonylphenyl) iodonium hexafluorophosphate, etc. are mentioned.
상기 방향족 설포늄염으로서는 예를 들면, 트라이페닐설포늄 헥사플루오로포스페이트, 트라이페닐설포늄 헥사플루오로안티모네이트, 트라이페닐설포늄 테트라키스(펜타플루오로페닐)보레이트, 다이페닐[4-(페닐티오)페닐]설포늄헥사플루오로안티모네이트, 다이페닐[4-(페닐티오)페닐]설포늄 헥사플루오로포스페이트, 4,4'-비스[다이페닐설포니오]다이페닐설파이드 비스헥사플루오로포스페이트, 4,4'-비스[다이(β-하이드록시에톡시)페닐설포니오]다이페닐설파이드 비스헥사플루오로안티모네이트, 4,4'-비스[다이(β-하이드록시에톡시)페닐설포니오]다이페닐설파이드 비스헥사플루오로포스페이트, 7-[다이(p-톨루일)설포니오]-2-아이소프로필티옥산톤 헥사플루오로안티모네이트, 7-[다이(p-톨루일)설포니오]-2-아이소프로필티옥산톤 테트라키스(펜타플루오로페닐)보레이트, 4-페닐카보 닐-4'-다이페닐설포니오-다이페닐설파이드 헥사플루오로포스페이트, 4-(p-tert-부틸페닐카보닐)-4'-다이페닐설포니오-다이페닐설파이드 헥사플루오로안티모네이트, 4-(p-tert-부틸페닐카보닐)-4'-다이(p-톨루일)설포니오-다이페닐설파이드 테트라키스(펜타플루오로페닐)보레이트, 다이페닐[4-(페닐티오)페닐]설포늄의 인산염 등을 들 수 있다.Examples of the aromatic sulfonium salt include triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis(pentafluorophenyl)borate, diphenyl[4-(phenyl) Thio) phenyl] sulfonium hexafluoroantimonate, diphenyl [4- (phenylthio) phenyl] sulfonium hexafluorophosphate, 4,4'-bis [diphenylsulfonio] diphenyl sulfide bis hexafluoro Rhophosphate, 4,4'-bis[di(β-hydroxyethoxy)phenylsulfonio]diphenylsulfide bishexafluoroantimonate, 4,4'-bis[di(β-hydroxyethoxy) ) Phenylsulfonio] diphenyl sulfide bishexafluorophosphate, 7- [di (p-toluyl) sulfonio] -2-isopropylthioxanthone hexafluoroantimonate, 7- [di (p) -Toluyl)sulfonio]-2-isopropylthioxanthone tetrakis(pentafluorophenyl)borate, 4-phenylcarbonyl-4'-diphenylsulfonio-diphenylsulfide hexafluorophosphate, 4 -(p-tert-butylphenylcarbonyl)-4'-diphenylsulfonio-diphenylsulfide hexafluoroantimonate, 4-(p-tert-butylphenylcarbonyl)-4'-di(p -toluyl)sulfonio-diphenylsulfide tetrakis(pentafluorophenyl)borate, the phosphate of diphenyl[4-(phenylthio)phenyl]sulfonium, etc. are mentioned.
상기 철-알렌 착체로서는 예를 들면, 자일렌-사이클로펜타다이에닐철(II) 헥사플루오로안티모네이트, 큐멘-사이클로펜타다이에닐철(II) 헥사플루오로포스페이트, 자일렌-사이클로펜타다이에닐철(II)-트리스(트라이플루오로메틸설포닐)메타나이드 등을 들 수 있다.Examples of the iron-allene complex include xylene-cyclopentadienyl iron (II) hexafluoroantimonate, cumene-cyclopentadienyl iron (II) hexafluorophosphate, and xylene-cyclopentadiene. and nyliron(II)-tris(trifluoromethylsulfonyl)methanide.
상기 광개시제는 시판품을 이용해도 되고, 예를 들면, CPI-100P, 101A, 200K, 210S(이상, 산아프로(サンアプロ)주식회사 제품), 카야라드(등록상표) PCI-220, PCI-620(이상, 니혼카야쿠 주식회사 제품), UVI-6990(이상, 유니언 카바이드(ユニオンカ-バイド)사 제품), 아데카옵토머(Adekaoptomer)(등록상표) SP-150, SP-170(이상, 주식회사 ADEKA 제품), CI-5102, CIT-1370, 1682, CIP-1866S, 2048S, 2064S(이상, 니혼소다(日本曹達) 주식회사 제품), DPI-101, 102, 103, 105, MPI-103, 105, BBI-101, 102, 103, 105, TPS-101, 102, 103, 105, MDS-103,105, DTS-102, 103(이상, 미도리카가쿠(みどり化學) 주식회사 제품), PI-2074(로디아재팬(ロ-ディアジャパン) 주식회사 제품) 등을 들 수 있다.The photoinitiator may use a commercially available product, for example, CPI-100P, 101A, 200K, 210S (above, San Apro Co., Ltd. product), Kayarad (registered trademark) PCI-220, PCI-620 (above, Nihon Kayaku Co., Ltd.), UVI-6990 (above, Union Carbide (Yunionka-Bide)), Adekaoptomer (registered trademark) SP-150, SP-170 (above, ADEKA Co., Ltd.), CI-5102, CIT-1370, 1682, CIP-1866S, 2048S, 2064S (above, manufactured by Nippon Soda Co., Ltd.), DPI-101, 102, 103, 105, MPI-103, 105, BBI-101, 102, 103, 105, TPS-101, 102, 103, 105, MDS-103,105, DTS-102, 103 (above, Midori Chemical Co., Ltd.), PI-2074 (Rhodia Japan) ) Co., Ltd. products) and the like.
상기 광개시제의 종류는 특별히 제한은 없고, 종래 공지의 광개시제를 바람직하게 사용할 수 있다. 광개시제는 단독, 또는 2종 이상을 조합시켜서 사용해도 된다.The type of the photoinitiator is not particularly limited, and a conventionally known photoinitiator can be preferably used. A photoinitiator may be used individually or in combination of 2 or more types.
상기 광개시제는 구체적으로 과산화수소, 과황산칼륨이나 과황산암모늄 등의 무기 과산화물, t-부틸하이드로퍼옥사이드, 과산화t-다이부틸, 큐멘하이드로퍼옥사이드, 과산화아세틸, 과산화벤조일 및 과산화라우로일 등의 유기 과산화물, 아조비스아이소부티로나이트릴, 아조비스-2,4-다이메틸발레로나이트릴, 아조비스사이클로헥산카보나이트릴, 아조비스아이소부티르산메틸, 아조비스아이소부틸아미딘 염산염 및 아조비스사이아노발레르산 등의 아조화합물, 아세토페논류, 벤조인류, 벤조페논류, 포스핀 옥사이드류, 케탈류, 안트라퀴논류, 티옥산톤류, 2,3-다이알킬다이온 화합물류, 다이설파이드화합물류, 플루오로아민 화합물류, 방향족 설포늄류, 로핀다이머류, 오늄염류, 보레이트 염류, 활성 에스터류, 활성 할로겐류, 무기 착체, 쿠마린류 등을 들 수 있다. 보다 구체적으로는 아세토페논, 3-메틸아세토페논, 벤질다이메틸케탈, 1-(4-아이소프로필페닐)-2-하이드록시-2-메틸프로판-1-온, 2-메틸-1-[4-(메틸티오)페닐]-2-몰폴리노프로판-1-온, 2-하이드록시-2-메틸-1-페닐프로판-1-온 등의 아세토페논류; 벤조페논, 4-클로로벤조페논, 4,4'-다이아미노벤조페논을 비롯한 벤조페논류; 벤조인 프로필에테르, 벤조인에틸에테르 등의 벤조인에테르류; 4-아이소프로필티옥산톤 등의 티옥산톤류; 1-하이드록시사이클로헥실페닐케톤, 잔톤, 플루오레논, 캠퍼퀴논, 벤즈알데하이드, 안트라퀴논 등을 들 수 있다.The photoinitiator is specifically hydrogen peroxide, an inorganic peroxide such as potassium persulfate or ammonium persulfate, t-butyl hydroperoxide, t-dibutyl peroxide, cumene hydroperoxide, acetyl peroxide, organic such as benzoyl peroxide and lauroyl peroxide Peroxide, azobisisobutyronitrile, azobis-2,4-dimethylvaleronitrile, azobiscyclohexanecarbonitrile, methyl azobisisobutyrate, azobisisobutylamidine hydrochloride and azobiscyanovaler Azo compounds such as acids, acetophenones, benzoins, benzophenones, phosphine oxides, ketals, anthraquinones, thioxanthones, 2,3-dialkyldione compounds, disulfide compounds, fluorine and loamine compounds, aromatic sulfoniums, lopin dimers, onium salts, borate salts, active esters, active halogens, inorganic complexes, and coumarins. More specifically, acetophenone, 3-methylacetophenone, benzyldimethyl ketal, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 2-methyl-1-[4 acetophenones such as -(methylthio)phenyl]-2-morpholinopropan-1-one and 2-hydroxy-2-methyl-1-phenylpropan-1-one; benzophenones including benzophenone, 4-chlorobenzophenone, and 4,4'-diaminobenzophenone; benzoin ethers such as benzoin propyl ether and benzoin ethyl ether; thioxanthone such as 4-isopropylthioxanthone; 1-hydroxycyclohexylphenyl ketone, xanthone, fluorenone, camphorquinone, benzaldehyde, anthraquinone, etc. are mentioned.
상기 광개시제는 시판품을 이용해도 되고, 예를 들면 이르가큐어(IRGACURE)(등록상표) 184, 819, 907, 651, 1700, 1800, 819, 369, 261, 다로큐어(DAROCUR)(등록상표) TPO, 다로큐어(등록상표) 1173(이상, BASF 재팬 주식회사 제품), 에자큐어(Esacure)(등록상표) KIP150, TZT(이상, DKSH 재팬 주식회사 제품), 카야큐어(KAYACURE)(등록상표) BMS, DMBI(이상, 니혼카야쿠 주식회사 제품) 등을 들 수 있다.The photoinitiator may use a commercially available product, for example, IRGACURE (registered trademark) 184, 819, 907, 651, 1700, 1800, 819, 369, 261, DAROCUR (registered trademark) TPO , Darocure (registered trademark) 1173 (above, BASF Japan Co., Ltd. product), Esacure (registered trademark) KIP150, TZT (above, DKSH Japan Co., Ltd. product), KAYACURE (registered trademark) BMS, DMBI (above, Nippon Kayaku Co., Ltd. product) etc. are mentioned.
또한, 상기 광개시제는 에틸 아민, 트라이에탄올아민 및 다이메틸아닐린 등의 아민, 폴리아민, 2가철염 화합물, 암모니아, 트라이에틸알루미늄, 트라이에틸붕소, 다이에틸아연 등의 유기 금속 화합물, 아황산나트륨, 아황산수소 나트륨, 나프텐산 코발트, 설핀산, 머캅탄 등의 적절한 환원제를 병용해도 된다.In addition, the photoinitiator is an amine such as ethylamine, triethanolamine and dimethylaniline, polyamine, a ferric salt compound, ammonia, triethylaluminum, triethylboron, an organometallic compound such as diethylzinc, sodium sulfite, hydrogen sulfite You may use together appropriate reducing agents, such as sodium, cobalt naphthenate, a sulfinic acid, and a mercaptan.
상기 활성 에너지선 경화형 조성물은 광증감제를 포함할 수 있다. 광증감제의 종류는 특별히 제한은 없고, 종래 공지의 광증감제를 바람직하게 사용할 수 있다. 광증감제는 단독으로도 또는 2종 이상을 조합시켜서 사용해도 된다.The active energy ray-curable composition may include a photosensitizer. There is no restriction|limiting in particular in the kind of photosensitizer, A conventionally well-known photosensitizer can be used preferably. A photosensitizer may be used individually or in combination of 2 or more types.
상기 광증감제의 구체예로서는 예를 들면, 피렌; 벤조인메틸에테르, 벤조인이소프로필에테르, α,α다이메톡시-α-페닐아세토페논 등의 벤조인 유도체; 벤조페논, 2,4-다이클로로벤조페논, o-벤조일벤조산메틸, 4,4'-비스(다 이메틸아미노)벤조페논, 4,4'-비스(다이에틸아미노)벤조페논 등의 벤조페논 유도체; 2-클로로티옥산톤, 2-아이소프로필티옥산톤, 2,4-다이에틸티옥산톤 등의 티옥산톤 유도체; 2-클로로안트라퀴논, 2-메틸안트라퀴논 등의 안트라퀴논 유도체; N-메틸아크리돈, N-부틸아크리돈 등의 아크리돈 유도체; 그 외, α,α-다이에톡시아세토페논, 벤질, 플루오레논, 잔톤, 우라닐 화합물, 할로겐 화합물 등을 들 수 있다.As a specific example of the said photosensitizer, For example, pyrene; benzoin derivatives such as benzoin methyl ether, benzoin isopropyl ether, and α,α dimethoxy-α-phenylacetophenone; Benzophenones such as benzophenone, 2,4-dichlorobenzophenone, methyl o-benzoylbenzoate, 4,4'-bis(dimethylamino)benzophenone, and 4,4'-bis(diethylamino)benzophenone derivative; thioxanthone derivatives such as 2-chlorothioxanthone, 2-isopropylthioxanthone, and 2,4-diethylthioxanthone; anthraquinone derivatives such as 2-chloroanthraquinone and 2-methylanthraquinone; acridone derivatives such as N-methylacridone and N-butylacridone; In addition, (alpha), (alpha)- diethoxy acetophenone, benzyl, fluorenone, xanthone, a uranyl compound, a halogen compound, etc. are mentioned.
상기 광증감제는 합성물을 이용해도 되고 시판품을 이용해도 된다. 시판품의 예로서는, 예를 들면, 카야쿠어(등록상표) DMBI, BDMK, BP-100, BMBI, DETX-S, EPA(이상, 니혼카야쿠 주식회사 제품), 안트라큐어(등록상표) UVS-1331, UVS-1221(이상, 가와사키카세이코교(川崎化成工業) 주식회사 제품), 유베크릴 P102, 103, 104, 105(이상, UCB사 제품), TPO 등을 들 수 있다.A compound may be used for the said photosensitizer, and a commercial item may be used for it. As an example of a commercial item, For example, Kayacur (trademark) DMBI, BDMK, BP-100, BMBI, DETX-S, EPA (above, Nippon Kayaku Co., Ltd. product), Anthracure (trademark) UVS-1331, UVS are, for example, -1221 (above, Kawasaki Kasei Kogyo Co., Ltd. product), Uvecryl P102, 103, 104, 105 (above, UCB company product), TPO, etc. are mentioned.
상기 광개시제 및 광증감제 중 적어도 한쪽의 사용량(광개시제와 광증감제를 병용할 경우에 있어서는 그 합계의 사용량)은 활성 에너지선 경화형 조성물 중 광개시제 및 광증감제를 제외한 나머지 성분의 중량부의 총합에 대하여 바람직하게는 0.1 중량부 이상 7 중량부 이하이며, 보다 바람직하게는 0.2 중량부 이상 3.5 중량부, 0.2 중량부 이상 2.5 중량부 이하이다. 상기 범위에서 자외선 조사에 의해 경화 효율이 우수하므로, 블리드 아웃에 의한 접착성이나 내구성의 저하를 억제할 수 있다.The amount of at least one of the photoinitiator and the photosensitizer (when the photoinitiator and the photosensitizer are used together, the amount of the total amount used) is based on the total weight of the remaining components except for the photoinitiator and the photosensitizer in the active energy ray-curable composition. Preferably it is 0.1 weight part or more and 7 weight part or less, More preferably, it is 0.2 weight part or more and 3.5 weight part, 0.2 weight part or more and 2.5 weight part or less. Since it is excellent in curing efficiency by ultraviolet irradiation in the said range, the fall of adhesiveness and durability by bleed-out can be suppressed.
상기 활성 에너지선 경화형 조성물은 실란 커플링제를 포함할 수 있다.The active energy ray-curable composition may include a silane coupling agent.
상기 실란 커플링제의 종류는 특별히 한정되지 않으며, 예컨대 비닐클로로실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 2-(3,4-에폭시시클로헥실)에틸트리메톡시실란, 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필메틸디에톡시실란, 3-글리시독시프로필디에톡시실란, 3-글리시독시프로필트리에톡시실란, p-스티릴트리메톡시실란, 3-메타크릴옥시프로필트리에톡시실란, 3-메타크릴옥시프로필트리메톡시실란, 3-메타크릴옥시프로필메틸디메톡시실란, 3-메타크릴옥시프로필메틸디에톡시실란, 3-아크릴옥시프로필트리메톡시실란, N-2-(아미노에틸)-3-아미노프로필메틸디메톡시실란, N-2-(아미노에틸)-3-아미노프로필트리메톡시실란, N-2-(아미노에틸)-3-아미노프로필메틸트리에톡시실란, 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 3-트리에톡시실릴-N-(1,3-디메틸부틸리덴)프로필아민, N-페닐-3-아미노프로필트리메톡시실란, 3-클로로프로필트리메톡시실란, 3-머캅토프로필메틸디메톡시실란, 3-머캅토프로필트리메톡시실란, 비스(트리에톡시실릴프로필)테트라설파이드, 3-이소시아네이토프로필트리에톡시실란 등을 들 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The type of the silane coupling agent is not particularly limited, for example, vinylchlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycy Doxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3- Methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxy Silane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-amino Propylmethyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl -3-Aminopropyltrimethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3-isocyanatopropyltriethoxysilane etc. are mentioned. These can be used individually or in mixture of 2 or more types.
상기 활성 에너지선 경화형 조성물은 필요에 따라서 상기 성분 이외에, 본 발명의 효과를 현저하게 감소시키지 않는 정도에 있어서 첨가제를 포함해도 된다.The said active energy ray-curable composition may contain additives other than the said component as needed in the grade which does not significantly reduce the effect of this invention.
상기 첨가제는 예를 들면 상기 이외의 다른 중합성 성분, 자외선흡수제, 산화 방지제, 열안정제, 무기충전제, 연화제, 산화 방지제, 노화 방지제, 안정제, 점착 부여 수지, 개질 수지(폴리올 수지, 페놀수지, 아크릴 수지, 폴리에스터 수지, 폴리올레핀 수지 등), 레벨링제, 소포제, 가소제, 염료, 안료(착색 안료, 체질안료 등), 처리제, 자외선차단제, 형광증백제, 분산제, 광안정제, 대전 방지제, 윤활제 등을 들 수 있다.The additives include, for example, other polymerizable components other than the above, ultraviolet absorbers, antioxidants, heat stabilizers, inorganic fillers, softeners, antioxidants, antioxidants, stabilizers, tackifying resins, modified resins (polyol resins, phenolic resins, acrylics) resins, polyester resins, polyolefin resins, etc.), leveling agents, defoamers, plasticizers, dyes, pigments (colored pigments, extenders, etc.), treatment agents, sunscreens, optical brighteners, dispersants, light stabilizers, antistatic agents, lubricants, etc. can be heard
상기 첨가제의 함유량은 상기 첨가제를 제외한 활성 에너지선 경화형 조성물 전체 100 중량부에 대하여 0.01 중량부 이상 20 중량부 이하인 것이 바람직하고, 0.02 중량부 이상 10 중량부 이하인 것이 보다 바람직하며, 0.05 중량부 이상 5 중량부 이하인 것이 더욱 바람직하다. 첨가제의 함유량을 상기 범위로 함으로써, 본 발명의 접착제의 효과를 충분히 발휘시킬 수 있다.The content of the additive is preferably 0.01 parts by weight or more and 20 parts by weight or less, more preferably 0.02 parts by weight or more and 10 parts by weight or less, and 0.05 parts by weight or more, based on 100 parts by weight of the total active energy ray-curable composition excluding the additive. It is more preferable that it is below weight part. By making content of an additive into the said range, the effect of the adhesive agent of this invention can fully be exhibited.
상기 접착제층의 두께는 접착력을 발휘하는 범위 내에서 조절될 수 있으며, 구체적으로, 0㎛ 초과 20㎛ 이하일 수 있다.The thickness of the adhesive layer may be adjusted within a range exhibiting adhesive force, and specifically, may be greater than 0 μm and less than or equal to 20 μm.
프라이머층primer layer
상기 프라이머층은 우레탄 수지 또는 아크릴 수지를 포함할 수 있고, 바람직하게는 우레탄 수지를 포함할 수 있다. 또한, 폴리에스테르 수지를 포함할 수 있다.The primer layer may include a urethane resin or an acrylic resin, preferably a urethane resin. In addition, it may include a polyester resin.
상기 우레탄 수지로서는 예를 들면 폴리올과 폴리이소시아네이트와 필요에 따라 사슬 연장제를 반응시킴으로써 얻어진 것을 들 수 있어 상기 폴리올의 일부에 설폰산기 또는 설폰산기의 금속염을 가지는 폴리올을 이용함으로써 우레탄 수지 중에 설폰산기를 도입할 수 있다. 이때, 산가를 포함하는 것이 충분한 경화 밀도와 경도를 갖는 데 유리하다.Examples of the urethane resin include those obtained by reacting a polyol, a polyisocyanate, and, if necessary, a chain extender. By using a polyol having a sulfonic acid group or a metal salt of a sulfonic acid group in a part of the polyol, a sulfonic acid group in the urethane resin is used. can be introduced In this case, it is advantageous to include an acid value to have sufficient curing density and hardness.
상기 설폰산기를 가지는 폴리올로서는 예를 들면 설폰산기 또는 설폰산기의 금속염을 가지는 디카르복실산 또는 이들의 염과 저분자량의 폴리올을 반응시켜 얻어진 폴리에스테르 폴리올,2-부텐-1,4-디올 등의 불포화기를 가지는 폴리올을 설폰화함으로써 얻어진 설폰산기를 가지는 폴리올 등을 들 수 있다.As the polyol having a sulfonic acid group, for example, a polyester polyol obtained by reacting a dicarboxylic acid having a sulfonic acid group or a metal salt of a sulfonic acid group or a salt thereof with a low molecular weight polyol, 2-butene-1,4-diol, etc. and polyols having a sulfonic acid group obtained by sulfonating a polyol having an unsaturated group of
상기 설폰산기를 가지는 디카르복실산으로서는 예를 들면4-술포이소프탈산,5-술포이소프탈산, 설포 테레프탈산,4-설포 나프탈렌-2,7-디카르복실산 및 이들의 디알킬에스테르 등을 들 수 있다. 또한 이들의 화합물이 가지는 설폰산기가 금속염이 되어 있는 것도 이용할 수 있다. 이들 중(안)에서도 장기간에 걸친 저장 안정성을 유지할 수 있고보다 우수한 내수성이나 내용제성을 부여할 수 있기 때문에5-나트륨 술포이소프탈산,5-나트륨 술포이소프탈산 디메틸이 바람직하다.Examples of the dicarboxylic acid having a sulfonic acid group include 4-sulfoisophthalic acid, 5-sulfoisophthalic acid, sulfoterephthalic acid, 4-sulfonaphthalene-2,7-dicarboxylic acid and dialkyl esters thereof. can be heard Moreover, those in which the sulfonic acid group which these compounds have is a metal salt can be used. Among these, 5-sodium sulfoisophthalate and 5-sodium dimethyl sulfoisophthalate are preferable because long-term storage stability can be maintained and more excellent water resistance and solvent resistance can be provided.
또한 상기 설폰산기를 가지는 폴리올은 상기 우레탄 수지 전체 질량을 기준으로 50~90질량%의 범위에서 이용하는 것이, 양호한 수분산성을 부여할 수 있는 것에서 바람직하다.In addition, it is preferable to use the polyol having a sulfonic acid group in an amount of 50 to 90% by mass based on the total mass of the urethane resin, since good water dispersibility can be imparted.
박리 특성peel properties
일반적으로, 접착제층은 고온에서 프라이머층에 대한 침식성이 과도하여, 고온 접착력이 감소하는 특성을 갖는다. 그러나, 본 발명의 접착제층은 고온에서 프라이머층에 대한 침식성이 적절히 조절되어, 고온에서도 프라이머층에 대한 접착력이 낮은 특성을 갖는다.In general, the adhesive layer has excessive erosion to the primer layer at a high temperature, so that the high temperature adhesive strength is reduced. However, the adhesive layer of the present invention has a characteristic that the erosion property to the primer layer is appropriately adjusted at a high temperature, and the adhesive force to the primer layer is low even at a high temperature.
구체적으로, 상기 적층체는 고온에서도 접착제층과 프라이머층 사이의 접착력이 우수하게 유지되는 것을 특징으로 한다.Specifically, the laminate is characterized in that excellent adhesion between the adhesive layer and the primer layer is maintained even at a high temperature.
상기 적층체의 상기 접착제층과 상기 프라이머층 사이의 접착력 유지율(고온 접착력/저온 접착력)이 40% 이상일 수 있다.An adhesive force retention ratio (high temperature adhesive force/low temperature adhesive force) between the adhesive layer and the primer layer of the laminate may be 40% or more.
상기 고온 접착력은 상기 적층체를 50℃에서 20초 동안 열처리한 후, 상기 기재를 25℃의 환경에서 30m/min의 박리 속도 및 90도의 박리 각도로 박리할 때의 박리력이다.The high-temperature adhesive strength is the peel force when the laminate is heat treated at 50° C. for 20 seconds, and then the substrate is peeled off at a peeling rate of 30 m/min and a peel angle of 90 degrees in an environment of 25° C.
상기 저온 접착력은 상기 기재를 25℃의 환경에서 30m/min의 박리 속도 및 90도의 박리 각도로 박리할 때의 박리력이다.The low-temperature adhesive strength is the peeling force when the substrate is peeled at a peeling rate of 30 m/min and a peeling angle of 90 degrees in an environment of 25°C.
또한, 상기 적층체를 50℃에서 20초 동안 열처리한 후, 상기 기재를 25℃의 환경에서 30m/min의 박리 속도 및 90도의 박리 각도로 박리할 때의 고온 접착력이 200 gf/20mm 이상, 250 gf/20mm 이상, 더욱 바람직하게는 300 gf/20mm 이상일 수 있다.In addition, after the laminate was heat-treated at 50° C. for 20 seconds, the high-temperature adhesive strength when the substrate was peeled at a peel rate of 30 m/min and a peel angle of 90 degrees in an environment of 25° C. was 200 gf/20 mm or more, 250 gf/20mm or more, more preferably 300 gf/20mm or more.
보호 필름protective film
상기 보호 기재는 폴리올레핀계 기재 또는 아크릴계 기재일 수 있다. 구체적으로, 폴리에틸렌테레프탈레이트(PET, polyethylene terephthalate) 필름, 싸이클로올레핀 폴리머(COP, cycloolefin polymer) 필름, 아크릴계 필름 등이 사용될 수 있다. 이 중에서도 광학 특성, 내구성, 경제성 등을 고려할 때, 폴리에틸렌테레프탈레이트 또는 트리아세틸셀룰로오스계 필름을 사용하는 것이 특히 바람직하다.The protective substrate may be a polyolefin-based substrate or an acrylic substrate. Specifically, a polyethylene terephthalate (PET, polyethylene terephthalate) film, a cycloolefin polymer (COP, cycloolefin polymer) film, an acrylic film, etc. may be used. Among them, in consideration of optical properties, durability, economical efficiency, etc., it is particularly preferable to use a polyethylene terephthalate or triacetyl cellulose-based film.
화상 표시 장치image display device
본 발명은 상술한 적층체를 포함하는 화상 표시 장치를 제공한다.The present invention provides an image display device including the above-described laminate.
상기 적층체는 표시 패널을 더 포함할 수 있다.The laminate may further include a display panel.
상기 표시 패널은 액정 패널, 플라즈마 패널 및 유기발광 패널일 수 있다. 이에 따라, 상기 화상표시장치는 액정표시장치(LCD), 플라즈마 표시장치(PDP) 및 유기전계발광 표시장치(OLED)일 수 있다. 보다 구체적으로, 상기 화상표시장치는 액정 패널 및 이 액정 패널의 양면에 각각 구비된 편광판들을 포함하는 액정표시장치일 수 있다.The display panel may be a liquid crystal panel, a plasma panel, and an organic light emitting panel. Accordingly, the image display device may be a liquid crystal display device (LCD), a plasma display device (PDP), and an organic light emitting display device (OLED). More specifically, the image display device may be a liquid crystal display device including a liquid crystal panel and polarizing plates respectively provided on both surfaces of the liquid crystal panel.
이때, 상기 액정표시장치에 포함되는 액정 패널의 종류는 특별히 한정되지 않는다. 예를 들면, 그 종류에 제한되지 않고, TN(twisted nematic)형, STN(super twisted nematic)형, F(ferroelectic)형 또는 PD(polymer dispersed)형과 같은 수동 행렬 방식의 패널; 2단자형(two terminal) 또는 3단자형(three terminal)과 같은 능동 행렬 방식의 패널; 횡전계형(IPS; In Plane Switching) 패널 및 수직배향형(VA; Vertical Alignment) 패널 등의 공지의 패널이 모두 적용될 수 있다. 또한, 액정표시장치를 구성하는 기타 구성, 예를 들면, 상부 및 하부 기판(예를 들어, 컬러 필터 기판 또는 어레이 기판) 등의 종류 역시 특별히 제한되지 않고, 이 분야에 공지되어 있는 구성이 제한 없이 채용될 수 있다.In this case, the type of the liquid crystal panel included in the liquid crystal display is not particularly limited. For example, it is not limited to the type, TN (twisted nematic) type, STN (super twisted nematic) type, F (ferroelectic) type or PD (polymer dispersed) type panels such as passive matrix type; an active matrix type panel such as a two terminal type or a three terminal type; All known panels such as an In Plane Switching (IPS) panel and a Vertical Alignment (VA) panel may be applied. In addition, other components constituting the liquid crystal display device, for example, the types of upper and lower substrates (eg, color filter substrates or array substrates), etc. are not particularly limited, and configurations known in this field are not limited. can be employed
이하, 본 명세서를 구체적으로 설명하기 위해 실시예를 들어 상세하게 설명 하기로 한다. 그러나, 본 명세서에 따른 실시예들은 여러 가지 다른 형태로 변형될 수 있으며, 본 명세서의 범위가 아래에서 기술하는 실시예들에 한정되는 것으로 해석되지 않는다. 본 명세서의 실시예들은 당업계에서 평균적인 지식을 가진 자에게 본 명세서를 보다 완전하게 설명하기 위해 제공되는 것이다.Hereinafter, examples will be given to describe the present specification in detail. However, the embodiments according to the present specification may be modified in various other forms, and the scope of the present specification is not to be construed as being limited to the embodiments described below. The embodiments of the present specification are provided to more completely explain the present specification to those of ordinary skill in the art.
<접착제층용 활성 에너지선 경화성 조성물의 제조><Production of active energy ray-curable composition for adhesive layer>
하기 표 1의 조성에 따른 활성 에너지선 경화형 조성물을 준비하였다.An active energy ray-curable composition according to the composition of Table 1 was prepared.
4-HBA: 4-히드록시부틸아크릴레이트
2-HEA: 4-히드록시에틸아크릴레이트
(B): 기타 아크릴 모노머
DPGDA: 디프로필렌 글리콜디아크릴레이트
ACMO: N-아크릴로일모르폴린
M370: 트리스(2-히드록시에틸)이소시아누레이트 트리아크릴레이트
(C): 우레탄 아크릴레이트 올리고머
BNU5347(BNTM사 제조)
(D): 실란 커플링제
KBM403: (3-글리시독시프로필) 트리메톡시실란
(E): 광개시제
I250: (4-메틸페닐)[4-(2-메틸프로필)페닐]요오드늄 헥사플루오로포스페이트
(F): 광증감제
TPO: 2,4-디에틸티옥산톤 디페닐(2,4,6-트리메틸벤조일)-포스핀옥사이드
DETX: 2,4-디에틸티옥산톤(A): hydroxyl group-containing acrylic monomer
4-HBA: 4-hydroxybutyl acrylate
2-HEA: 4-hydroxyethyl acrylate
(B): other acrylic monomers
DPGDA: dipropylene glycol diacrylate
ACMO: N-acryloylmorpholine
M370: tris (2-hydroxyethyl) isocyanurate triacrylate
(C): Urethane acrylate oligomer
BNU5347 (manufactured by BNTM)
(D): Silane coupling agent
KBM403: (3-glycidoxypropyl) trimethoxysilane
(E): photoinitiator
I250: (4-methylphenyl)[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate
(F): photosensitizer
TPO: 2,4-diethylthioxanthone diphenyl (2,4,6-trimethylbenzoyl)-phosphine oxide
DETX: 2,4-diethylthioxanthone
<프라이머 조성물 1 제조><Preparation of Primer Composition 1>
폴리우레탄 성분의 프라이머 조성물을 제조하였다. 폴리우레탄계 수지(IPDI의 이소시아네이트 화합물과 1,6-헥산디올, 카프록탐디올, 테레프탈릭산, 이소프탈릭 산의 디올 화합물로 구성) 20 pt 및 가교제로서 옥사졸린 화합물 5pt를 혼합하여 프라이머 조성물 1을 제조하였다.A primer composition of a polyurethane component was prepared. A primer composition 1 was prepared by mixing 20 pt of a polyurethane-based resin (composed of an isocyanate compound of IPDI and a diol compound of 1,6-hexanediol, caproctamdiol, terephthalic acid, and isophthalic acid) and 5 pt of an oxazoline compound as a crosslinking agent. .
<프라이머 조성물 2 제조><Preparation of Primer Composition 2>
폴리에스테르 성분의 프라이머 조성물을 제조하였다. 폴리에스테르계 수지(A-645GH: Takamatsu oil; 고형분의 함량이 30 wt%) 20 pt와 가교제로서 IPDI의 이소시아네이트 화합물 5pt을 혼합하여 프라이머 조성물 2를 제조하였다.A primer composition of a polyester component was prepared. A primer composition 2 was prepared by mixing 20 pt of a polyester-based resin (A-645GH: Takamatsu oil; solid content of 30 wt %) and 5 pt of an isocyanate compound of IPDI as a crosslinking agent.
<실시예 1: 적층체 제조><Example 1: Preparation of laminate>
아크릴 필름 상에 상기 프라이머 조성물 1 또는 2를 도포 및 건조함으로써 프라이머층을 형성하였다. 이후, 상기 프라이머층 표면에 상기 제조예 1의 활성 에너지선 경화형 조성물을 도포하고, 폴리비닐알코올계 편광자를 적층한 다음, Metal halide lamp를 이용하여 1,000 mJ/cm2의 자외선을 조사하여 이를 경화시킴으로써, 접착제층을 형성하여 적층체를 제조하였다.A primer layer was formed by applying and drying the primer composition 1 or 2 on the acrylic film. Thereafter, the active energy ray-curable composition of Preparation Example 1 is applied to the surface of the primer layer, a polyvinyl alcohol-based polarizer is laminated, and then the UV light of 1,000 mJ/cm 2 is irradiated using a metal halide lamp to cure it. , an adhesive layer was formed to prepare a laminate.
<실시예 2: 적층체 제조><Example 2: Preparation of laminate>
상기 제조예 1의 활성 에너지선 경화형 조성물 대신 상기 제조예 2의 활성 에너지선 경화형 조성물을 사용한 것 외에는 상기 실시예 1과 동일한 방법으로 적층체를 제조하였다.A laminate was prepared in the same manner as in Example 1, except that the active energy ray-curable composition of Preparation Example 2 was used instead of the active energy ray-curable composition of Preparation Example 1.
<실시예 3: 적층체 제조><Example 3: Preparation of laminate>
상기 제조예 1의 활성 에너지선 경화형 조성물 대신 상기 제조예 3의 활성 에너지선 경화형 조성물을 사용한 것 외에는 상기 실시예 1과 동일한 방법으로 적층체를 제조하였다.A laminate was prepared in the same manner as in Example 1, except that the active energy ray-curable composition of Preparation Example 3 was used instead of the active energy ray-curable composition of Preparation Example 1.
<비교예 1: 적층체 제조><Comparative Example 1: Preparation of laminate>
상기 제조예 1의 활성 에너지선 경화형 조성물 대신 상기 제조예 4의 활성 에너지선 경화형 조성물을 사용한 것 외에는 상기 실시예 1과 동일한 방법으로 적층체를 제조하였다.A laminate was prepared in the same manner as in Example 1, except that the active energy ray-curable composition of Preparation Example 4 was used instead of the active energy ray-curable composition of Preparation Example 1.
<비교예 2: 적층체 제조><Comparative Example 2: Preparation of laminate>
상기 제조예 1의 활성 에너지선 경화형 조성물 대신 상기 제조예 5의 활성 에너지선 경화형 조성물을 사용한 것 외에는 상기 실시예 1과 동일한 방법으로 적층체를 제조하였다.A laminate was prepared in the same manner as in Example 1, except that the active energy ray-curable composition of Preparation Example 5 was used instead of the active energy ray-curable composition of Preparation Example 1.
<비교예 3: 적층체 제조><Comparative Example 3: Preparation of laminate>
상기 제조예 1의 활성 에너지선 경화형 조성물 대신 상기 제조예 6의 활성 에너지선 경화형 조성물을 사용한 것 외에는 상기 실시예 1과 동일한 방법으로 적층체를 제조하였다.A laminate was prepared in the same manner as in Example 1, except that the active energy ray-curable composition of Preparation Example 6 was used instead of the active energy ray-curable composition of Preparation Example 1.
<실험예: 접착력 테스트><Experimental example: adhesion test>
실시예 및 비교예의 적층체에 대하여, 상기 활성 에너지선 경화형 조성물을 경화하기 전에 열처리 조건을 변화시키면서 적층체를 제조하였다. 이후, 상기 접착제층과 프라이머층을 서로 박리할 때의 박리력을 측정하여 비교하였다.For the laminates of Examples and Comparative Examples, laminates were prepared while changing heat treatment conditions before curing the active energy ray-curable composition. Thereafter, the peeling force when the adhesive layer and the primer layer were peeled from each other were measured and compared.
프라이머층에 대하여 적절한 침식성을 갖는 경우에는 높은 접착력을 나타내나, 프라이머층이 과침식되는 경우에는 박리력이 낮아지므로 낮은 접착력을 나타낸다.When the primer layer has an appropriate erosion property, high adhesion is exhibited, but when the primer layer is over-eroded, the peeling force is lowered, thereby exhibiting low adhesion.
상기 결과로부터, 프라이머층을 포함하지 않는 경우 아크릴 기재의 접착력이 현저히 떨어지므로, 프라이머층의 도입이 필요한 것을 확인할 수 있었다.From the above results, when the primer layer is not included, the adhesion of the acrylic substrate is significantly lowered, and thus it can be confirmed that the introduction of the primer layer is necessary.
한편, 실시예 1 내지 실시예 3의 적층체는 프라이머층에 대한 침식성이 우수한 수산기를 갖는 아크릴레이트의 함량이 적게 포함되었으므로, 열처리를 하더라도 프라이머층에 대한 침식성이 조절되어 접착력이 우수하게 유지된다.On the other hand, since the laminates of Examples 1 to 3 contained a small amount of acrylate having a hydroxyl group having excellent erosion property to the primer layer, the erosion property to the primer layer was controlled even after heat treatment, and the adhesion was maintained excellently.
반면에, 비교예 1의 적층체는 열처리시 프라이머층이 과도하게 침식되므로 접착력이 현저히 떨어지는 것을 확인하였다.On the other hand, in the laminate of Comparative Example 1, it was confirmed that the adhesive strength was significantly reduced because the primer layer was excessively eroded during heat treatment.
비교예 2의 적층체의 접착제층은 수산기를 갖는 아크릴레이트 대신에 ACMO를 포함하는데, ACMO가 4-HBA보다 높은 용해도 파라미터를 가지나, 프라이머층에 대해서는 침식성이 낮으므로 접착력이 현저히 떨어지는 것을 확인하였다.The adhesive layer of the laminate of Comparative Example 2 contains ACMO instead of an acrylate having a hydroxyl group, and ACMO has a higher solubility parameter than 4-HBA, but has low erosion to the primer layer, so it was confirmed that the adhesive force was significantly lowered.
한편, 비교예 3의 적층체의 접착제층은 수산기를 갖는 아크릴레이트를 적은 양으로 포함하여 프라이머층에 대한 침식성이 떨어지므로, 수산기를 갖는 아크릴레이트를 일정 함량 이상 포함하여야 함을 확인할 수 있었다.On the other hand, since the adhesive layer of the laminate of Comparative Example 3 contains a small amount of the acrylate having a hydroxyl group, and has poor erosion to the primer layer, it can be confirmed that the acrylate having a hydroxyl group must be included in a certain amount or more.
상기 결과를 통해, 프라이머층에 대한 침식성이 일정 수준으로 유지된 실시예 1 내지 실시예 3의 적층체가 열처리시에도 접착력이 우수하게 유지되는 것을 확인하였다.Through the above results, it was confirmed that the laminates of Examples 1 to 3, in which the erosion to the primer layer was maintained at a certain level, maintained excellent adhesion even during heat treatment.
Claims (13)
상기 보호 기재의 일면에 구비된 접착제층; 및
상기 보호 기재와 접착제층 사이에 구비된 프라이머층을 포함하고,
상기 접착제층은 활성 에너지선 경화형 조성물의 경화물을 포함하고,
상기 활성 에너지선 경화형 조성물은 수산기 함유 아크릴계 모노머를 전체 조성물 100 중량부를 기준으로 18 중량부 이하로 포함하는 것인 적층체.protective substrate;
an adhesive layer provided on one surface of the protective substrate; and
A primer layer provided between the protective substrate and the adhesive layer,
The adhesive layer includes a cured product of an active energy ray-curable composition,
The active energy ray-curable composition is a laminate comprising 18 parts by weight or less of the hydroxyl group-containing acrylic monomer based on 100 parts by weight of the total composition.
상기 적층체의 상기 접착제층과 상기 프라이머층 사이의 접착력 유지율(고온 접착력/저온 접착력)이 40% 이상인 것인 적층체:
상기 고온 접착력은 상기 적층체를 50℃에서 20초 동안 열처리한 후, 상기 기재를 25℃의 환경에서 30m/min의 박리 속도 및 90도의 박리 각도로 박리할 때의 박리력이고,
상기 저온 접착력은 상기 기재를 열처리를 하지 않은 조건에서 25℃의 환경에서 30m/min의 박리 속도 및 90도의 박리 각도로 박리할 때의 박리력이다.The method according to claim 1,
A laminate in which the adhesive force retention rate (high temperature adhesion / low temperature adhesion) between the adhesive layer and the primer layer of the laminate is 40% or more:
The high temperature adhesive strength is the peel force when the laminate is heat treated at 50° C. for 20 seconds, and then the substrate is peeled at a peeling rate of 30 m/min and a peeling angle of 90 degrees in an environment of 25° C.,
The low-temperature adhesive force is the peeling force when the substrate is peeled at a peeling rate of 30 m/min and a peeling angle of 90 degrees in an environment of 25° C. under conditions of not heat-treating the substrate.
상기 적층체를 50℃에서 20초 동안 열처리한 후, 상기 기재를 25℃의 환경에서 30m/min의 박리 속도 및 90도의 박리 각도로 박리할 때의 고온 접착력이 200 gf/20mm 이상인 것인 적층체.The method according to claim 1,
After the laminate is heat-treated at 50° C. for 20 seconds, the high-temperature adhesive strength when the substrate is peeled at a peel rate of 30 m/min and a peel angle of 90 degrees in an environment of 25° C. is 200 gf/20 mm or more. .
상기 수산기 함유 아크릴계 모노머는 2-히드록시에틸(메트)아크릴레이트 또는 4-히드록시부틸(메트)아크릴레이트인 것인 적층체.The method according to claim 1,
The hydroxyl group-containing acrylic monomer is a laminate of 2-hydroxyethyl (meth) acrylate or 4-hydroxybutyl (meth) acrylate.
상기 활성 에너지선 경화형 조성물은 저침식성 아크릴계 모노머를 더 포함하는 것인 적층체.The method according to claim 1,
The active energy ray-curable composition is a laminate that further comprises a low-erosion acrylic monomer.
상기 수산기 함유 아크릴계 모노머와 저침식성 아크릴계 모노머의 함량비는 1:1 내지 1:10인 것인 적층체.6. The method of claim 5,
The content ratio of the hydroxyl group-containing acrylic monomer to the low erosion acrylic monomer is 1:1 to 1:10 in a laminate.
상기 활성 에너지선 경화형 조성물은 단독 중합체의 유리전이온도(Tg)가 150℃ 이상인 다관능성 (메타)아크릴레이트 모노머를 더 포함하는 것인 적층체.The method according to claim 1,
The active energy ray-curable composition further comprises a polyfunctional (meth)acrylate monomer having a glass transition temperature (Tg) of 150° C. or higher of the homopolymer.
상기 활성 에너지선 경화형 조성물은 폴리에스테르계 우레탄 아크릴레이트 올리고머를 더 포함하는 것인 적층체.The method according to claim 1,
The active energy ray-curable composition is a laminate further comprising a polyester-based urethane acrylate oligomer.
상기 활성 에너지선 경화형 조성물은 실란 커플링제를 포함하는 것인 적층체.The method according to claim 1,
The active energy ray-curable composition is a laminate comprising a silane coupling agent.
상기 접착제층의 두께가 0㎛ 초과 20㎛ 이하인 것인 적층체.The method according to claim 1,
The thickness of the adhesive layer is more than 0㎛ 20㎛ the laminate.
상기 프라이머층은 우레탄 수지 또는 아크릴 수지를 포함하는 것인 적층체. The method according to claim 1,
The primer layer is a laminate comprising a urethane resin or an acrylic resin.
상기 보호 기재는 폴리올레핀계 기재 또는 아크릴계 기재인 것인 적층체.The method according to claim 1,
The protective substrate may be a polyolefin-based substrate or an acrylic substrate.
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