KR20210033139A - Joining method of alumina and alumina-containing ceramics and joined ceramic body using it - Google Patents

Abstract

A method for bonding aluminum oxide-based ceramics according to the present invention includes: a step of preparing a bonding material in which a solid component is made of aluminum and at least one oxide; an application step of supplying the bonding material between ceramic molded bodies including aluminum oxide; and a step of heat-treating the ceramic molded bodies and the bonding material. In the heat treatment step, aluminum of the bonding material is oxidized, and the bonding material and the molded bodies are sintered. There is an advantage in that a bonding layer having excellent physical properties such as strength can be manufactured.

Description

TECHNICAL FIELD [Joining method of alumina and alumina-containing ceramics and joined ceramic body using it}

The present invention relates to a bonding method of an aluminum oxide-based ceramic bonded body having the same strength as that of the ceramic base material to be bonded.

Ceramics has high strength and excellent chemical resistance and heat resistance, making it a suitable material for processing high temperature or high concentration chemicals. However, due to these properties, there is a limit in which it is difficult to produce and process products using ceramics.

Specifically, ceramics undergoes a process of manufacturing a sintered body of a simple shape through molding and sintering of the powder constituting ceramics, and then manufacturing a product of a complex shape through post-processing, and in this case, the processing cost increases significantly due to post-processing. There is a problem that occurs. Accordingly, research for manufacturing ceramic products by bonding ceramics is continuously being conducted.

In the past, metals, glass materials, etc., which are relatively easy to bond, were used for bonding as bonding materials, but there is a problem that it is difficult to utilize the advantages of ceramics because the usage is limited due to low mechanical properties, chemical resistance, and heat resistance compared to the base material.

In order to solve this problem, studies on the manufacture of a bonded body using ceramic powder having the same composition as ceramics are being conducted, but expensive nano powders with high sinterability are used to obtain a dense bonding interface between the base material and the bonding layer. There is a problem that requires expensive equipment to apply pressure.

Korean Patent Publication No. 10-1400908

It is an object of the present invention to provide an aluminum oxide-based ceramic bonding method capable of manufacturing a ceramic product having a complex shape by a simple method.

Another object of the present invention is to provide a method for bonding aluminum oxide-based ceramics for producing a bonded body having a strength equivalent to that of a base material.

The present invention comprises the steps of preparing a bonding material in which the solid component is made of aluminum and at least one oxide;

An application step of supplying the bonding material between ceramic formed bodies including aluminum oxide; And

Including; heat-treating the ceramic formed body and the bonding material;

The heat treatment step relates to an aluminum oxide-based ceramic bonding method of oxidizing aluminum of the bonding material and sintering the bonding material and the molded body.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the at least one oxide may include aluminum oxide.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the volume ratio of oxide: aluminum included in the bonding material may be 95:5 to 60:40.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the aluminum may have a particle size of 1 μm or less.

In the method of bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the aluminum oxide particles of 100 nm or less are generated while being oxidized in the heat treatment step.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, preparing the bonding material may include ball milling by mixing aluminum, at least one oxide, and an organic solvent.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the organic solvent may be one or more selected from alcohol having 1 to 4 carbon atoms, acetone, hexane, ethyl acetate, dichloromethane, and chloroform.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, a first drying step of drying the ceramic formed body after the coating step and before the heat treatment step, a pressing step of pressing the ceramic formed body, and a first drying the ceramic formed body It may further include 2 drying steps.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the pressing step may be performed through cold isostatic pressing.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the heat treatment may be performed at 1500 to 1750° C. for 30 minutes to 5 hours.

The present invention also provides an aluminum oxide-based ceramics assembly, and the aluminum oxide-based ceramics assembly according to the present invention may be bonded by an aluminum oxide-based ceramics bonding method according to an embodiment of the present invention.

In the method of bonding aluminum oxide-based ceramics according to the present invention, a bonding material is prepared by mixing, pulverizing, drying, and mixing one or more oxides including aluminum oxide and aluminum with an organic solvent, and then coating it between the base metal molded bodies, drying, and sintering. , There is an advantage in that it is possible to manufacture a ceramic product of a complex shape by a simple method, and to manufacture a ceramic bonded body having the same level of strength as that of the base material.

FIG. 1 is a graph showing the result of measuring the average particle diameter according to the milling time during the manufacturing process of the bonding material in the manufacturing example of the present invention.
2 is a cross-sectional view of the conjugate prepared in Preparation Example of the present invention and shows it.
3 is a view showing the junction cross-section of the conjugate prepared in Preparation Example of the present invention through a microscope.

Advantages and features of the embodiments of the present invention, and a method of achieving them will become apparent with reference to the embodiments described later in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in a variety of different forms. It is provided to completely inform the scope of the invention to those who have, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same elements throughout the specification.

In describing the embodiments of the present invention, if it is determined that a detailed description of a known function or configuration may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted. In addition, terms to be described later are terms defined in consideration of functions in an embodiment of the present invention, which may vary according to the intention or custom of users or operators. Therefore, the definition should be made based on the contents throughout the present specification.

The method for bonding aluminum oxide-based ceramics according to the present invention comprises: preparing a bonding material in which a solid component is made of aluminum and at least one oxide;

An application step of supplying the bonding material between ceramic formed bodies including aluminum oxide; And

Including; heat-treating the ceramic formed body and the bonding material;

The heat treatment step is characterized in that the aluminum of the bonding material is oxidized and the bonding material and the molded body are sintered.

Conventionally, the bonding of ceramics including aluminum oxide is often performed using glass or the like, but there is a problem in that ceramic products are used due to lower heat resistance and chemical resistance than ceramics. In order to overcome this, a method of bonding ceramics using a metal oxide of a material similar to ceramics has been developed, but even in this case, there is a problem of having a lower strength than the ceramics base material.

Accordingly, research to solve the above-described low heat resistance and chemical resistance problem and to manufacture a ceramic bonded body having the same level of strength as the base material was carried out. As a result, in the bonding of aluminum oxide-based ceramics, aluminum and one kind It was confirmed that a ceramic bonded body having excellent physical properties can be manufactured by applying and heat treating the bonding material containing the above oxide.

At this time, by passing through the heat treatment step, oxidation of aluminum contained in the bonding material occurs, and as a result, the composition of the bonding material substantially contains only oxide.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the at least one oxide may preferably be an aluminum oxide or a composite oxide containing aluminum, and more preferably, aluminum oxide (Al ₂ O ₃ ), ZTA ( Al ₂ O ₃ +ZrO ₂ ), Mullite (3AlSO ₃ ·2SiO ₂ ), Al ₂ TiO _5, etc., but the present invention is not limited thereto.

In addition, the volume ratio of oxide: aluminum contained in the bonding material may be 95: 5 to 60: 40, and the optimal volume ratio may vary depending on the type or composition of the molded body, and aluminum is added in a small amount than the above-described range. In this case, there may be a problem that the bonding interface between the base material (a ceramic molded body containing aluminum oxide) and the bonding layer is not dense, and when aluminum is added in a larger amount than the above-described range, the microstructure of the bonding layer is not dense. have.

In this case, the volume ratio in the present invention is based on measuring the weight and converting it into volume.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, when the ceramic formed body is alumina, the oxide may be made of alumina. Specifically, the volume ratio of the alumina: aluminum may be 80:20 to 60:40.

In addition, when the ceramic formed body is ZTA (Zirconia Toughened Alumina), the bonding material may include 7 to 28 vol% of aluminum, 40 to 63 vol% of aluminum oxide, and 30 to 33 vol% of zirconia.

When the ceramic formed body is Mullite, the bonding material may include 10 to 20% by volume of aluminum, 30 to 40% by volume of aluminum oxide, 31 to 33% by volume of silica, and 17 to 19% by volume of Mullite powder.

By satisfying the above-described range, it is possible to manufacture a bonded body having the same strength as that of the base material.

More specifically, when the volume ratio of oxide: aluminum contained in the bonding material satisfies the above-described range, the grain size of the bonding layer after heat treatment may be distributed between 0.5 and 1 µm. It is possible to manufacture a conjugate that is bound together.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, the aluminum may have a particle size of 1 μm or less, specifically 0.1 to 1 μm. By using aluminum particles that satisfy this particle size range and satisfy the ball mill conditions and heat treatment conditions described later, reaction sintering occurs in which nano-sized aluminum oxide particles of 100 nm or less are generated during the heat treatment process of the heat treatment step, and the nano By forming a bi-modal particle size distribution in which aluminum oxide particles and one or more oxides added to the bonding material form different particle size distributions, there is an advantage that it is possible to manufacture a bonded body having the same level of strength as the base material while being tightly bound to the base material. . In detail, when the aluminum oxide-based ceramics are manufactured by the method according to the present invention using aluminum that satisfies the above-described range, the bonding layer has a strength of 90% or more, preferably 95% or more compared to the base material.

Specifically, as described above, while the aluminum is oxidized in the heat treatment step, nano aluminum oxide particles having a size of 100 nm or less, specifically 10 to 70 nm, and more specifically 20 to 60 nm are generated. These nano-scale aluminum oxide particles are distributed among particles of one or more oxides having a relatively large size, and exhibit excellent binding strength.

At this time, the at least one oxide may have an average particle diameter of 0.1 to 3 µm, preferably 0.2 to 1 µm, and in this range, the effect of improving the binding strength by the bi modal particle size distribution in relation to the oxidized nano aluminum oxide particles described above. There is an advantage that can be remarkably improved.

In the method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention, preparing the bonding material may include mixing aluminum, at least one oxide, and an organic solvent, and ball milling using zirconia balls. By mixing aluminum and one or more oxides through a ball mill, there is an advantage in that the above-described reaction sintering can be further promoted.

At this time, the organic solvent may be one or two or more selected from alcohol having 1 to 4 carbon atoms, acetone, hexane, ethyl acetate, dichloromethane, and chloroform, and the organic solvent does not cause an intense oxidation reaction with the aluminum. It can be used without restrictions.

Specifically, the above-described ball mill may be performed in a composition containing 5 to 25 vol% of a solid component in which aluminum and one or more oxides are mixed and a residual amount of an organic solvent, and the ball mill has a rotation speed of 200 to 500 rpm. The furnace may be performed for 6 to 20 hours, but this may vary depending on the concentration of the solid component, the number of zirconia balls, and the like.

After the ball mill, the milled slurry may be further dried at 30 to 70° C. for 20 to 60 hours to remove the organic solvent.

The bonding material used in the bonding method of aluminum oxide-based ceramics according to an embodiment of the present invention may be finally prepared by adding the organic solvent after passing through the ball mill. Preferably, the bonding material has a solid content of 0.5 to It may be 5% by volume, more preferably 0.7 to 3% by volume. By applying the bonding material having such a solid component content in the application step, there is an advantage that it can be applied so that the solid component is uniformly distributed on the base material.

The method for bonding aluminum oxide-based ceramics according to the present invention includes a coating step of supplying the bonding material between ceramic molded bodies including aluminum oxide. At this time, the application may be preferably carried out by a spray spraying method, preferably by spraying repeatedly 10 to 50 times, it is possible to manufacture a bonding layer having a thickness of a certain level or more. At this time, it is apparent that the number of applications may vary depending on the solid content of the bonding material, the type of ceramic molded body including aluminum oxide, and the use of the ceramics bonded body manufactured by bonding.

More specifically, the coating amount of the bonding material may vary depending on the content of the solid component contained in the bonding material, and specifically, the solid component per unit area based on the base material is 0.8 to 5 µg/cm 2, specifically 1.0 to 4 µg. May be /cm2. If a small amount of the solid component is applied than the above range, pores may occur in the bonding layer, resulting in a problem of lowering the strength.When a large amount of the solid component is applied, stress is generated due to the difference in sintering shrinkage between the base material and the bonding layer. Fractures or cracks may occur in the joint.

The method for bonding aluminum oxide-based ceramics according to an embodiment of the present invention includes a first drying step of drying the ceramic formed body after the coating step and before heat treatment, a pressing step of pressing the ceramic formed body, and a first drying step of pressing the ceramic formed body. It may further include 2 drying steps. Specifically, the step of removing the organic solvent by applying a bonding material between the ceramic molded bodies and drying the bonding material in a bonded state may be further included. Specifically, the first drying step may be performed at 80 to 150 °C for 30 minutes to 10 hours, respectively, and the second drying step may be performed at 80 to 150 °C for 20 to 60 hours.

When the drying temperature is lower than the above-described range, cracks may occur due to insufficient drying, and when the drying temperature is high, densification may be difficult in the step of heat treatment due to reduction of the Al ratio due to oxidation.

More specifically, the pressing step may be performed by cold isostatic pressing, and by pressing the ceramic formed body through cold isostatic pressing, it is possible to manufacture a more dense and excellent bonding layer with the ceramic formed body. In this case, the cold isostatic pressurization may be performed for 30 seconds to 10 minutes at a pressure of 100 to 300 MPa, and may vary depending on the area of the bonding surface and the thickness of the bonding material.

The method for bonding aluminum oxide-based ceramics according to the present invention includes a step of heat-treating the ceramic formed body and the bonding material, wherein the heat treatment step is characterized in that the aluminum of the bonding material is oxidized and the bonding material and the molded body are sintered. As described above, the aluminum contained in the bonding material is oxidized to nano-scale aluminum oxide by reaction sintering while undergoing heat treatment, and the Bi modal particle size distribution is formed by mixing with one or more types of oxides added to form a dense and strong strength. There is an advantage of being able to manufacture an excellent bonding layer.

In this case, the heat treatment may be performed at a temperature of 1500 to 1750° C. for 30 minutes to 5 hours, preferably 1 to 4 hours, but may vary depending on the size of the ceramic molded body and the area of the bonding layer. More specifically, in the heat treatment step, the temperature may be increased to 1100° C. at a rate of 0.5 to 2° C. per minute, preferably at 180 to 220° C. for 30 to 120 minutes, and at 350 to 420° C. for 30 to 120 minutes And a holding time of 60 to 180 minutes at 570 to 650°C, and heating may be performed, and through this process, there is an advantage of inducing particle rearrangement and producing fine-sized aluminum oxide particles.

In the method for manufacturing the aluminum oxide-based ceramics in the present invention, the aluminum oxide-based ceramics include not only ceramics composed of pure aluminum oxide, but also ceramics including aluminum oxide as some constituent elements. Specifically, Zirconia Toughened Alumina (ZTA), Mullite, and the like may also be included in the aluminum oxide-based ceramic used in the present invention, and the present invention is not limited thereto.

The present invention also provides an aluminum oxide-based ceramics bonded body bonded by the aluminum oxide-based ceramics bonding method according to an embodiment of the present invention. The bonding layer included in the aluminum oxide-based ceramic assembly according to the present invention is characterized by having excellent physical properties of 90% or more strength compared to the base material.

Hereinafter, the present invention will be described in detail by examples and comparative examples. The following examples are only intended to aid understanding of the present invention, and the scope of the present invention is not limited by the following examples.

[Production Example 1]

Aluminum (ALE11PB, KOJUNDO CHMICAL LABORATORY, Japan): Al ₂ O ₃ (AES-11C, SUMITOMO CHEMICAL, Japan) was mixed in a volume ratio of 20:80, and acetone was added to prepare a dispersion so that the solid content was 15% by volume. . The prepared dispersion was _{mixed with 3Y-ZrO 2} 3 mm zirconia balls (YTZ, NIKKATO, Japan), and then planetary sphere milling was performed at 300 rpm for 12 hours. The milled slurry was dried in an oven at 60° C. for 2 days, followed by mortar and 100 mesh sieving to prepare composite powder. After milling, it was confirmed that the average particle diameter of the mixed powder including aluminum and alumina was 0.551 µm.

Acetone was added to the prepared composite powder to make a solid content of 1% by volume to prepare a bonding material, and a ceramic molded body (hereinafter referred to as a base material) containing aluminum oxide to be bonded was prepared. The bonding material was sprayed 20 times through a spray on the surface to be bonded to the base material, and then covered with another base material to perform bonding. After spraying 20 times, the solid content per unit area was found to be 1.06 ㎍/㎠.

The bonded base material was first dried in an oven at 110° C. for 3 hours, then pressurized for 3 minutes at 200 MPa pressure by cold isostatic pressure, and then dried for 2 days at 110° C. The dried conjugate was heated up to 1100° C. at a rate of 1° C. per minute, and in the meantime, the temperature was raised at 200° C. for 1 hour, 400° C. for 1 hour, and 600° C. for 2 hours. The temperature was raised from 1100 °C to 1650 °C at a rate of 5 °C per minute, and the heat treatment was completed by holding at 1650 °C for 2 hours.

[Production Example 2]

It was prepared in the same manner as in Preparation Example 1, but _{the volume ratio of aluminum:Al 2} O ₃ was mixed at 30:70 to prepare a bonding material, and the base material was bonded.

[Production Example 3]

It was prepared in the same manner as in Preparation Example 1, but _{the volume ratio of aluminum:Al 2} O ₃ was mixed at 40:60 to prepare a bonding material, and the base material was bonded.

In Preparation Example 3, changes in the average particle diameter of aluminum and aluminum oxide during the milling process were measured over time, and the results are shown in FIG. 1.

[Production Example 4]

It was prepared in the same manner as in Preparation Example 1, but _{the volume ratio of aluminum:Al 2} O ₃ was mixed at 10:90 to prepare a bonding material, and the base material was bonded.

[Production Example 5]

It was prepared in the same manner as in Preparation Example 1, but _{the volume ratio of aluminum:Al 2} O ₃ was mixed at 50:50 to prepare a bonding material, and the base material was bonded.

[Production Example 6]

It was prepared in the same manner as in Preparation Example 1, but the bonding was performed by spraying the bonding material 10 times to make the solid content per unit area 0.5 µg/cm 2.

[Production Example 7]

It was prepared in the same manner as in Preparation Example 1, but the bonding was performed by spraying the bonding material 120 times so that the solid content per unit area was 6 µg/cm 2.

[Production Example 8]

It was prepared in the same manner as in Preparation Example 1, except that the secondary drying was performed at 70°C.

[Production Example 9]

It was prepared in the same manner as in Preparation Example 1, except that the secondary drying was performed at 180°C.

[Production Example 10]

It was prepared in the same manner as in Preparation Example 1, but the bonding material was prepared by mixing 20% by volume of aluminum, 48% by volume of aluminum oxide, and 32% by volume of zirconia, and the ceramic molded body was prepared by using ZTA containing 30% by volume of zirconia. Conjugation was performed.

[Production Example 11]

It was prepared in the same manner as in Preparation Example 10, but the bonding material was prepared by mixing 5% by volume of aluminum, 65% by volume of aluminum oxide, and 30% by volume of zirconia, and bonding was performed.

[Production Example 12]

It was prepared in the same manner as in Preparation Example 10, but the bonding material was prepared by mixing 30% by volume of aluminum, 38% by volume of aluminum oxide, and 32% by volume of zirconia, and bonding was performed.

[Production Example 13]

Prepared in the same manner as in Preparation Example 1, but the bonding material was prepared by mixing 15% by volume of aluminum, 35% by volume of aluminum oxide, 32.5% by volume of silica, and 17.5% by volume of Mullite, and the ceramic molded body was bonded using Mullite. Performed.

[Production Example 14]

It was prepared in the same manner as in Preparation Example 13, but the bonding material was prepared by mixing 25% by volume of aluminum, 25% by volume of aluminum oxide, 32.5% by volume of silica, and 17.5% by volume of Mullite, and bonding was performed.

[Production Example 15]

It was prepared in the same manner as in Preparation Example 13, but the bonding material was prepared by mixing 5% by volume of aluminum, 45% by volume of aluminum oxide, 32.5% by volume of silica, and 17.5% by volume of Mullite, and bonding was performed.

[Comparative Preparation Example 1]

A bonded body was prepared in the same manner as in Preparation Example 1, but the bonding material was a dispersion in _{which Al 2} O _{3 was dispersed in acetone.} At this time, Al ₂ O ₃ was prepared to be added in 1% by volume.

Conjugate Junction Confirm

2 is a cross-sectional view of the conjugate prepared in Preparation Examples 1 to 3 is observed and shows it.

Referring to FIG. 2, it can be seen that the joining layer does not have a clear boundary with the base material, and is tightly bound.

Microstructure of conjugate Junction Confirm

The bonding cross-sections of the conjugates prepared in Preparation Examples 1 to 3 were observed through a microscope, and the results are shown in FIG. 3.

Referring to FIG. 3, it can be seen that the bonding layer and the base material are closely bonded, and the average grain size of the bonding layer is distributed between 0.8 and 0.9 μm, and the average grain size increases as the content of aluminum increases.

Measurement of properties of conjugates

The biaxial strength of the bonding layer and the base material of the bonded body prepared in Preparation Example and Comparative Preparation Example were analyzed 7 times each according to ISO 6873 (Test method 7.3.2 Biaxial flexure test), and the results are shown in Table 1, and the unit is MPa.

Average maximum Ieast Base material 488 545 432 Manufacturing Example 1 495 553 456 Manufacturing Example 2 486 538 465 Manufacturing Example 3 483 522 478 Manufacturing Example 4 361 421 330 Manufacturing Example 5 345 390 327 Manufacturing Example 6 301 386 234 Manufacturing Example 7 345 423 331 Manufacturing Example 8 314 397 276 Manufacturing Example 9 337 392 279 Manufacturing Example 10 1265 1420 1155 Manufacturing Example 11 941 1215 786 Manufacturing Example 12 986 1267 802 Manufacturing Example 13 414 447 337 Manufacturing Example 14 343 378 297 Manufacturing Example 15 320 360 269 Comparative Preparation Example 1 146 183 102

Referring to Table 1, the bonding layer included in the bonded body prepared in Preparation Examples 1 to 3 has a strength of 90% or more, preferably 95% or more of the base material, and in the case of Preparation Example 1, it can be confirmed that the average strength is superior to the base material. have. On the other hand, it can be seen that in Preparation Examples 4 and 5, the strength was somewhat lower, and Comparative Preparation Example 1, in which only aluminum oxide was added, exhibited a significantly lower strength.

In addition, it can be seen that the strength decrease occurs in Preparation Examples 6 and 7 where the solid phase content of the bonding layer is too low or high, and even in the case of Preparation Examples 8 and 9 where the drying temperature is low or high, the strength is lower than that of Preparation Examples 1 to 3 It can be seen that it represents.

Claims (12)

Preparing a bonding material in which the solid component is made of aluminum and at least one oxide;
Supplying the bonding material between ceramic formed bodies including aluminum oxide; And
Including; heat-treating the ceramic formed body and the bonding material;
The heat treatment step is to oxidize the aluminum of the bonding material and sinter the bonding material and the molded aluminum oxide-based ceramics bonding method. The method of claim 1,
The at least one oxide is an aluminum oxide-based ceramics bonding method comprising aluminum oxide. The method of claim 2,
A method of bonding aluminum oxide-based ceramics in which the volume ratio of oxide: aluminum contained in the bonding material is 95: 5 to 60: 40. The method of claim 1,
The aluminum oxide-based ceramics bonding method, characterized in that the particle size of the aluminum oxide generated in the heat treatment step is smaller than the aluminum particle size in the step of preparing the bonding material. The method of claim 4,
The aluminum is a method of bonding aluminum oxide-based ceramics having a particle size of 1 μm or less. The method of claim 4,
The aluminum oxide-based ceramics bonding method, characterized in that the aluminum oxide particles of 100 nm or less are generated while being oxidized in the heat treatment step. The method of claim 1,
The step of preparing the bonding material includes mixing aluminum, at least one oxide, and an organic solvent to perform ball milling. The method of claim 7,
The organic solvent is one or two or more selected from alcohol having 1 to 4 carbon atoms, acetone, hexane, ethyl acetate, dichloromethane, and chloroform. The method of claim 1,
A method for bonding aluminum oxide-based ceramics, further comprising: a first drying step of drying the ceramic formed body after supplying a bonding material and prior to the heat treatment step, a pressing step of pressing the ceramic formed body, and a second drying step of drying the ceramic formed body . The method of claim 9,
The pressing step is an aluminum oxide-based ceramics bonding method performed through cold isostatic pressure. The method of claim 1,
The heat treatment step is performed for 30 minutes to 5 hours at 1500 to 1750 ℃ aluminum oxide-based ceramics bonding method. The aluminum oxide-based ceramics bonded body bonded by the aluminum oxide-based ceramics bonding method of any one of claims 1 to 11.

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