KR20210007023A - System and method for monitoring temperature/humidity inside a wafer carrier using a temperature / humidity sensor based on short-distance wireless communication - Google Patents

Abstract

The present invention relates to a system for monitoring temperature/humidity conditions inside a wafer carrier which can improve efficiency of semiconductor production. More specifically, the system for monitoring temperature/humidity conditions inside a wafer carrier comprises: an environmental condition measurement unit mounted in each wafer carrier to measure temperature and humidity conditions therein; an environmental condition data collection unit provided at each predetermined point on a moving line of the wafer carrier to collect temperature and humidity data measured through a short-distance wireless communication connection from the environmental condition measurement unit of a nearby wafer carrier; and an environmental condition monitoring unit receiving the temperature and humidity data from each environmental condition data collection unit, and monitoring the temperature and humidity conditions inside each wafer carrier based on the temperature and humidity data.

Description

System and method for monitoring temperature/humidity inside a wafer carrier using a temperature / humidity sensor based on short-distance wireless communication}

The present invention relates to a system for monitoring a temperature/humidity condition inside a wafer carrier, and more specifically, to a system and method for monitoring a temperature/humidity condition inside a wafer carrier using a temperature/humidity sensor based on short-range wireless communication. will be.

In general, a wafer is made into a semiconductor device through several steps such as a deposition process, an etching process, a polishing process, a cleaning process, and the like, and it is necessary to transfer the wafer into each process equipment to perform these processes. Accordingly, the wafer is loaded and transported in a dedicated storage device called a wafer carrier so as to minimize the defect rate by preventing damage to the wafer as well as convenience of transport during transport.

On the other hand, since the wafer is sensitive to environmental conditions such as temperature and humidity, it is necessary to constantly maintain the surrounding environmental conditions in a suitable state. If an unstable environmental condition inside the wafer carrier on which the wafer is loaded is created, the influence may act as a stress on the wafer, which may cause product defects. Accordingly, when the wafer is stored in the wafer carrier and moved, it is essential to maintain the best quality by maintaining the environmental conditions inside the wafer carrier such as temperature and humidity in a state suitable for the wafer during movement during each process.

In order to monitor environmental conditions such as temperature and humidity inside the wafer carrier, in general, a method of attaching a sensor to the wafer carrier and checking the measured sensor value to determine the internal environmental condition was used. There is a problem that it is difficult to check whether environmental conditions such as temperature and humidity become unstable during the transfer process between specific processes. In addition, separate accessories such as a communication device for acquiring the measured sensor value and a power supply device for driving the sensor are required, and thus there is a problem in that space and volume are limited.

(Patent Document 1) Korean Patent Publication No. 2003-0005495

(Patent Document 2) Korean Patent Application Publication No. 10-2008-0009568

The present invention is to solve the above-described problem, and it is possible to monitor the internal environmental condition by collecting the temperature/humidity measurement value inside the wafer carrier loaded with the wafer from the outside based on short-range wireless communication without additional accessories. We want to provide a system that allows us to

A system that monitors changes in temperature/humidity status inside a wafer carrier moving between processes based on short-range wireless communication according to the present invention in real time consists of a single integrated structure that measures both temperature and humidity conditions, and inside each wafer carrier. The temperature and humidity sensed by the sensing unit through a short-range wireless communication connection to a sensing unit that is mounted on the bottom of the wafer carrier and senses the temperature and humidity conditions inside the wafer carrier, and an environmental state data collection unit installed in a position close to the wafer carrier. An environmental condition measuring unit configured to include an RF tag for transmitting humidity data; A plurality of wafer carriers are provided at predetermined points on the moving line, and short-range wireless communication connection with the environmental condition measuring unit mounted inside the wafer carrier close to the corresponding point among the plurality of wafer carriers moving along the moving line A measurement unit identification number for identifying the corresponding wafer carrier and an environmental condition data collection unit for collecting measured temperature and humidity data therein; Each environmental status data collection unit installed at a predetermined point on the moving line and a collection unit identification number that is connected to a wired/wireless communication network to identify the corresponding environmental status data collection unit, and each wafer in motion collected by the environmental status data collection unit The internal temperature and humidity data linked to the identification number of the corresponding measurement unit of the environmental condition measuring unit mounted in the carrier is provided, and based on this, the internal temperature and humidity conditions are determined in a certain section during the transfer process of the wafer carrier. And an environmental condition monitoring unit that detects whether an abnormal change has occurred and provides a notification.

Specifically, the RF tag of the environmental condition measurement unit receives an RF signal from an environmental condition data collection unit installed in a position close to the corresponding wafer carrier, and the RF response signal and temperature and humidity data sensed by the sensing unit are the A tag antenna for transmitting to the environmental state data collection unit; Generating the driving power of the environmental state data measuring unit from the RF signal received from the environmental state data collection unit through the tag antenna, and transmitting an RF response signal to the RF signal to the environmental state data collecting unit through the tag antenna Tag chip; A controller configured to operate the sensing unit with driving power from the tag chip, receive temperature and humidity data sensed from the sensing unit, and store the data in the tag chip; It characterized in that it is configured to include.

Here, the tag chip includes: an RF energy generator configured to generate driving power of the environmental state data measuring unit from an RF signal received from an environmental state collecting unit adjacent through the tag antenna; A first storage unit configured to store temperature and humidity data sensed by a sensing unit mounted in the wafer carrier under control of the control unit; An RF signal response unit generating an RF response signal in response to an RF signal received from an adjacent environmental state data collecting unit through the tag antenna and transmitting the generated RF response signal to a corresponding environmental state data collecting unit through the tag antenna; It characterized in that it is configured to include.

At this time, the RF signal response unit, when the received RF signal is a first RF signal requesting a unique identification code, in response thereto, transmits a first RF response signal including a unique identification code indicating a corresponding RF tag And, when the received RF signal is a second RF signal that requests reading of temperature and humidity data, a second RF response signal including temperature and humidity data inside the wafer carrier is transmitted in response thereto. Characterized in that.

Meanwhile, the control unit transmits a sensor driving signal generated by driving power from the RF energy generating unit of the tag chip to the sensing unit, and operates the sensing unit to sense the temperature and humidity conditions inside the corresponding wafer carrier. To do.

On the other hand, the environmental condition data collection unit, the RF signal transmission unit for transmitting an RF signal to the RF tag of the environmental condition measuring unit mounted inside the adjacent wafer carrier; An RF response signal receiving unit for receiving an RF response signal from an RF tag of a corresponding environmental condition measuring unit in response to the transmitted RF signal; It characterized in that it is configured to include.

In this case, the RF signal transmitter transmits a first RF signal requesting a unique identification code to an RF tag inside a nearby wafer carrier, and the RF response signal receiver transmits a corresponding RF tag in response to the first RF signal. It characterized in that the RF tag is recognized by receiving a first RF response signal including a unique identification code from.

Accordingly, the RF signal transmitter recognizes the RF tag and then transmits a second RF signal requesting reading of temperature and humidity data inside a corresponding wafer carrier, and the RF response signal receiver, the second In response to the RF signal, a second RF response signal including temperature and humidity data is received from a corresponding RF tag to obtain temperature and humidity data inside a corresponding wafer carrier.

Meanwhile, the environmental condition data collection unit may include: a second storage unit configured to store temperature and humidity data inside a corresponding wafer carrier obtained from a second RF response signal received by the RF response signal receiving unit; A first communication unit communicating with the environmental condition monitoring unit; It characterized in that it is configured to include.

On the other hand, the environmental condition monitoring unit, the second communication unit in communication with the first communication unit of the environmental condition data collection unit; A sensing data receiving unit configured to receive temperature and humidity data in each wafer carrier stored in each environmental state data collection unit provided on a moving line of the wafer carrier at a predetermined periodic interval through the second communication unit; A third storage unit for storing temperature and humidity data in each wafer carrier received by the sensing data receiving unit; A display unit for displaying temperature and humidity data in each wafer carrier stored in the third storage unit; A notification unit for providing a warning notification according to occurrence of data having a predetermined reference value or more among temperature and humidity data inside each wafer carrier; It characterized in that it is configured to include.

The present invention attaches a temperature/humidity sensor inside the wafer carrier, and collects temperature/humidity data sensed through short-range wireless communication connection with the temperature/humidity sensor at each predetermined point to determine the temperature/humidity state in the wafer carrier. Can be monitored.

Accordingly, through this, the quality of the wafer stored in the wafer carrier can be maintained in the best state, thereby minimizing the defect rate of the product, thereby improving the efficiency of semiconductor production.

In addition, it is possible to minimize the volume and manufacturing cost by configuring the temperature/humidity sensor in one integrated form including a short-range wireless communication function.

1 is a diagram schematically showing a form of collecting internal state data using a temperature/humidity sensor based on short-range wireless communication according to the present invention.
2 is a block diagram showing a system for monitoring temperature/humidity inside a wafer carrier using a temperature/humidity sensor based on short-range wireless communication according to the present invention.
3 is a block diagram schematically showing a method of monitoring a temperature/humidity state inside a wafer carrier using a temperature/humidity sensor based on short-range wireless communication according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. However, the present invention may be implemented in various forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are attached to similar parts throughout the specification.

Hereinafter, the present invention will be described in detail with reference to the drawings.

1. Temperature/humidity condition monitoring system in a wafer carrier according to the present invention

With reference to FIGS. 1 and 2, a system for monitoring a temperature/humidity state in a wafer carrier using a temperature/humidity sensor based on short-range wireless communication according to the present invention will be described.

1.1. Environmental condition measurement unit 100

The environmental condition measurement unit is mounted in a wafer carrier on which a wafer is mounted as shown in FIG. 1 to measure the temperature and humidity conditions therein, and an environmental condition data collection unit provided at each predetermined point to be described later through a short-range wireless communication connection ( 200) is a configuration that provides the measured temperature and humidity data. The environmental condition measuring unit is configured to include the following configuration.

end. Sensing unit (110)

The sensing unit is mounted at a certain position inside each wafer carrier, senses a temperature and humidity state therein, and transmits the sensed temperature and humidity data to the controller 126 to be described later.

Here, the position where the sensing unit is mounted is not limited, but the inside of the wafer carrier for a more seamless short-range wireless communication connection with the environmental state data collection unit 200, which will be described later, provided at each predetermined point on the line where the wafer carrier is moved. It may be desirable to be mounted on the bottom surface of the.

Meanwhile, the sensing unit may perform a temperature and humidity sensing operation by receiving a sensor driving signal from the controller 126 to be described later.

Meanwhile, the sensing unit 110 and the RF tag 120 to be described later according to the present invention have an integrated structure in consideration of a minimum space, volume, and weight for mounting in a wafer carrier. The sensing unit according to the present invention may be configured in the form of a single integrated sensor to measure both temperature and humidity.

I. RF Tag(120)

The RF tag is configured to transmit the temperature and humidity data sensed by the sensing unit 110 to the environmental state data collection unit 200 at a location close to a corresponding wafer carrier through a short-range wireless communication connection. Specifically, it is configured as follows.

1) Tag antenna (122)

The tag antenna receives an RF signal from the environmental state data collection unit 200 located close to the corresponding wafer carrier and transmits it to the tag chip 124 to be described later. In addition, it serves to transmit the RF response signal from the tag chip and the temperature and humidity data sensed by the sensing unit 110 to the environmental state data collection unit 200.

2) Tag chip (124)

The tag chip may communicate with the environmental state data collection unit 200 at a location close to the corresponding wafer carrier through wireless communication. In addition, driving power may be generated and driven from an RF signal received from the environmental state data collection unit 200 at a nearby location through the tag antenna 122. Specifically, it is configured to include the following configuration.

2-1) RF energy generation unit (1242)

In general, the RF energy generation unit is a configuration based on an energy harvwsting method that refers to a method of acquiring energy using the surrounding environment. Specifically, the RF energy generation unit is based on energy harvesting (hereinafter, referred to as RF energy harvesting) using a radio frequency (RF) signal, and the environmental state measurement unit 100 using a method using an RF signal as an energy source. It is possible to acquire and use the energy required for driving. In the description of RF energy harvesting, a transmitter device intended to transmit energy transmits a signal by loading a large output power on a frequency, and a specific device receives it and uses it as power. Furthermore, it is also possible to use an RF signal emitted in an everyday communication environment without using a specific RF signal for energy transfer. In the present invention, the environmental state data collection unit 200 corresponds to a transmitter device, and the environmental state measurement unit 100 corresponds to a specific device.

The RF signal may include various signals such as a mobile communication signal, a Wifi signal, a short-range communication signal, and a signal transmitted from a mobile terminal. The RF energy generator generates energy using a known technology from the RF signal received by the tag antenna 122, which is for driving the tag chip 124, the control unit 126, and the sensing unit 110. It is supplied by driving power. Through this, the environmental condition measuring unit 100 can operate without external power supply.

2-2) First storage unit (1244)

The temperature and humidity data sensed by the sensing unit 110 is stored, and the temperature and humidity data are received from the sensing unit 110 and stored by the controller 126 to be described later. The first storage unit may be, for example, an Electrically Erasable Programmable Read-Only Memory (EEPROM).

2-3) RF signal response unit (1246)

The RF signal response unit is configured to respond to an RF signal received through the tag antenna 122. First, when an RF signal (first RF signal) for requesting a unique identification number is received from the proximity environment state data collection unit 200 through the tag antenna 122, an RF response signal in response thereto is transmitted to the tag antenna 122 ) Through the corresponding environmental state data collection unit 200. Here, an RF response signal in response to an RF signal (first RF signal) requesting a unique identification number is referred to as a first RF response signal, and the first RF response signal is the corresponding environmental condition measuring unit 100 Includes a unique identification code indicating the RF tag 120. Accordingly, the environmental state data collection unit 200 may recognize the RF tag 120 by checking the unique identification code from the received first RF response signal.

In addition, when the RF signal response unit receives an RF signal (a second RF signal) requesting reading from the proximity environment state data collection unit 200 through the tag antenna 122, the second RF signal 1 An RF response signal including temperature and humidity data stored in the storage unit 1244 may be transmitted to the corresponding environmental state data collection unit 200 through the tag antenna 122. Here, an RF response signal in response to an RF signal (a second RF signal) requesting reading of temperature and humidity data is referred to as a second RF response signal, and the second RF response signal is a corresponding wafer carrier. Includes internal temperature and humidity data.

3) Control unit 126

The control unit operates by receiving driving power from the RF energy generating unit 1242, and accordingly, may transmit a sensor driving signal to the sensing unit 110 to perform sensing operation.

In addition, the controller may receive the temperature and humidity data sensed from the sensing unit 110 and store it in the first storage unit 1244 of the tag chip 124.

Here, the control unit may be configured in the form of an integrated chip integrated with the tag chip 124 as one, and in this case, the sensor driving signal may include driving power required for driving the sensing unit 110.

1.2. Environmental state data collection unit 200

The environmental condition data collection unit is an RF reader that reads temperature and humidity data of the environmental condition measuring unit 100 adjacent to each other through a short-range wireless communication connection, and is provided at each predetermined point on a line where the wafer carrier moves. Temperature and humidity data therein are collected from the environmental condition measuring unit 100 mounted in the adjacent wafer carrier. Here, the predetermined point is a point at which the movement of the wafer carrier is stopped for a predetermined period of time in the line where the wafer carrier is moved to be checked or confirmed, and specifically, may be a point at which a wafer stocker or a wafer guide is located. .

end. RF signal transmitter 210

The RF signal transmitter is configured to transmit an RF signal, and the RF signal may transmit an RF signal requesting a unique identification code to the RF tag 120 of the proximity environment state measuring unit 100, through which the corresponding RF tag After recognizing 120, an RF signal requesting reading of temperature and humidity data may be transmitted. Here, in order to distinguish the RF signals, in this specification, an RF signal requesting a unique identification code is referred to as a first RF signal, and a signal requesting reading of temperature and humidity data is referred to as a second RF signal.

I. RF response signal receiver 220

The RF response signal receiver is configured to receive a response to the RF signal transmitted from the RF signal transmitter 210 to the RF tag 120 in the adjacent wafer carrier.

As described above, as the RF signal transmitter 210 transmits the first RF signal requesting a unique identification code to the RF tag 120 in the adjacent wafer carrier, the corresponding RF tag 120 is displayed as a response thereto. It is possible to receive an RF response signal including a unique identification code. Through this, the environmental state data collection unit 200 may recognize the RF tag 120.

In addition, after recognizing through reception of an RF response signal including a unique identification code as described above, temperature and humidity for collecting temperature and humidity data stored in the RF tag 120 by the RF signal transmitting unit 210 As an RF signal for requesting data reading is transmitted, an RF response signal including temperature and humidity data may be received from the corresponding RF tag 120 as a response thereto. Through this, data on the temperature and humidity conditions inside the wafer carrier can be collected.

Here, in order to distinguish the RF response signal, an RF response signal including a unique identification code that is an RF response signal to the first RF signal is used as the first RF response signal, and temperature and humidity data that is an RF response signal to the second RF signal. The RF response signal including a is referred to as a second RF response signal.

All. Second storage unit 230

The second storage unit is configured to store temperature and humidity data included in the second RF response signal received by the RF response signal receiving unit 220. Here, the second storage unit may store temperature and humidity data in association with the unique identification number of the RF tag 120 included in the RF response signal. Therefore, it is possible to know which wafer carrier the environmental condition measuring unit 100 is mounted inside, so that the temperature/humidity state in the corresponding wafer carrier can be efficiently identified, and the wafer mounted therein can also be efficiently managed.

la. The first communication unit 240

The first communication unit is a component for communication connection with the environmental condition monitoring unit 300 to be described later, and may be communicatively connected through a wired/wireless communication network. For example, LoRa (Long Range), Zigbee, etc. can be used. Through this, the temperature and humidity data collected from the environmental condition measuring unit 100 mounted inside each wafer carrier may be provided to the environmental condition monitoring unit 300.

1.3. Environmental condition monitoring unit 300

The environmental condition monitoring unit receives temperature and humidity data measured through the environmental condition measurement unit 100 mounted inside each wafer carrier from the environmental condition data collecting unit 200 described above, and based on this, each wafer carrier It is a configuration that monitors internal temperature/humidity conditions.

end. The second communication unit 310

The second communication unit is a configuration for communication connection with the environmental state data collection unit 200, and may be connected to the first communication unit 240 through a wired/wireless communication network, for example, LoRa (Long Range) , Zigbee, etc. can be used.

I. Sensing data receiver 320

The sensing data receiving unit is configured to receive temperature and humidity data inside each wafer carrier stored in the second storage unit 230 of the environmental state data collecting unit 200 through the second communication unit 310, It can be received at regular intervals. At this time, the received temperature and humidity data is associated with a unique identification number indicating the RF tag 120. In addition, when receiving the temperature and humidity data, a reader identification number indicating the corresponding environmental state data collection unit 200 is acquired together, and when a problem occurs in the temperature and humidity state through this, the environmental state data provided at a certain point is collected. Since it is possible to know whether it is the temperature and humidity data obtained from the unit 200, it is possible to determine whether a problem has occurred in the process of moving between which processes.

All. Third storage unit 330

The third storage unit is configured to store temperature and humidity data received from the environmental state data collection unit 200 by the sensing data receiving unit 320, and stored in association with a unique identification number representing the RF tag 120 do. Accordingly, the manager can efficiently and easily grasp the temperature/humidity state inside each wafer carrier through the display unit 340 to be described later, thereby enabling efficient management of the wafers mounted therein.

la. Display unit 340

The display unit displays the temperature and humidity data of the environmental condition measuring unit 100 mounted inside each wafer carrier stored in the third storage unit 330, and through this, the manager can check the temperature/humidity status inside each wafer carrier. Can be monitored.

Here, each temperature and humidity data is displayed in association with a unique identification code representing the corresponding RF tag 120. At this time, in order to check which wafer carrier each environmental condition measurement unit 100 is mounted on, for example, It may be desirable to provide a data table in which a unique identification code representing each RF tag 120 and a carrier identification number representing a corresponding wafer carrier are linked.

hemp. Notification unit 350

A notification that generates a warning notification so that the administrator can recognize when there is temperature or humidity data that exceeds a preset reference value among temperature and humidity data inside each wafer carrier provided from each environmental state data collection unit 200 It may include a unit 350. Through this, the manager can take action by checking which wafer carrier's internal temperature and humidity conditions correspond to, using a unique identification code linked to the temperature and humidity data at which the warning notification has occurred.

In this way, through short-range wireless communication connection between the environmental condition measurement unit 100 mounted inside each wafer carrier and the environmental condition data collection unit 200 provided at a predetermined point on the line where the wafer carrier moves, You can easily monitor the temperature/humidity status inside each wafer carrier without any accessories. Accordingly, it is possible to efficiently manage wafers mounted in each wafer carrier, thereby minimizing product defect rates due to environmental influences such as temperature and humidity.

2. Method for monitoring temperature/humidity status in a wafer carrier according to the present invention (see FIG. 3)

2.1. First RF signal transmission step (S100)

This is a step of broadcasting an RF signal requesting a unique identification code from the environmental state data collection unit 200 provided at a predetermined point on the line where the wafer carrier moves. Here, in order to distinguish that the RF signal transmitted by the environmental state data collection unit 200 is a signal requesting a unique identification code, the RF signal is referred to as a first RF signal.

2.2. First RF signal response step (S200)

In this step, a unique identification code is generated from the RF tag 120 of the environmental state measuring unit 100 mounted in the wafer carrier adjacent to the environmental state data collecting unit 200 operating the first RF signal transmission step (S100). In this step, a first RF signal, which is a requested RF signal, is received and a response thereto.

Specifically, the tag antenna 122 of the RF tag 120 of the environmental state measuring unit 100 mounted in a wafer carrier close to the environmental state data collecting unit 200 is transmitted from the environmental state data collecting unit 200. It receives the first RF signal and transmits it to the tag chip 124.

Accordingly, in response to the received first RF signal, the RF signal response unit 1246 of the tag chip 124 transmits an RF response signal including a unique identification code of the corresponding RF tag 120 to the tag antenna 122 ) Through the corresponding environmental state data collection unit 200. Here, the RF response signal including the unique identification code is referred to as a first RF response signal.

2.3. RF tag recognition step (S300)

In the environmental state data collection unit 200 receiving the first RF response signal from the RF tag 120 of the environmental state measuring unit 100 mounted in the wafer carrier through the first RF signal response step (S200), This is the step of recognizing the RF tag 120 by using the unique identification code included in the first RF response signal.

2.4. Driving power supply step (S400)

In the step of supplying the driving power, the tag chip 124 of the RF tag 120 mounted in the wafer carrier generates driving power from the first RF signal received from the environmental state data collection unit 200 at a nearby location, This is the step of supplying to measure the temperature and humidity conditions of

Specifically, the RF energy generator 1242 of the tag chip 124 may generate driving power based on the RF energy harvesting method from the first RF signal received through the tag antenna 122. Driving power may be generated from the first RF signal and supplied to the sensing unit 110 and the control unit 126 to be driven. When receiving driving power from the tag chip 124 by the RF energy generating unit 1242, the control unit 126 transmits a sensor driving signal to the sensing unit 110 to sense the temperature and humidity conditions in the wafer carrier. Drive to do it. Here, the tag chip 124 and the control unit 126 may be configured in the form of a single integrated chip, and the sensor driving signal may include driving power required for driving the sensing unit 110.

2.5. Temperature and humidity sensing step (S500)

The sensing unit 100 receives power and sensor driving signals required for driving from the tag chip 124 and the control unit 126 through the driving power supply step (S400) to determine the temperature and humidity conditions inside the wafer carrier. This is the sensing step. The sensing unit 110 senses a temperature and humidity state according to a sensor driving signal from the control unit 126 and transmits the sensed temperature and humidity data to the control unit 126. Accordingly, the control unit 126 receiving the temperature and humidity data from the sensing unit 110 stores it in the first storage unit 1244 of the tag chip 124.

2.6. Second RF signal transmission step (S600)

In the second RF signal transmission step, in the environmental state data collecting unit 200 that recognizes the RF tag 120 mounted in the proximity wafer carrier, the temperature and humidity data are collected by the corresponding RF tag 120. In this step, a second RF signal, which is an RF signal for requesting reading of humidity data, is transmitted. Here, the second RF signal refers to an RF signal that requests reading of temperature and humidity data.

2.7. The second RF signal response step (S700)

In the RF tag 120 receiving a second RF signal requesting reading of temperature and humidity data from the proximity environment state data collection unit 200 through the second RF signal transmission step (S600), This is the step to respond.

Specifically, the RF signal response unit 1246 of the tag chip 124 receives a second RF signal requesting temperature and humidity data from the environmental state data collection unit 200 through the tag antenna 122 Accordingly, in response, the temperature and humidity data stored in the first storage unit 1244 is extracted and a second RF response signal including the same is transmitted to the corresponding environmental state data collection unit 200 through the tag antenna 122. .

2.8. Temperature and humidity data acquisition step (S800)

In the environmental state data collection unit 200, the second RF response signal received from the environmental state measurement unit 100 mounted in the wafer carrier through the second RF signal response step (S700) This is a step of obtaining temperature and humidity data (RF response signal receiving unit 220). The obtained temperature and humidity data is stored in the second storage unit 230, and at this time, the unique identification code of the RF tag 120 is linked and stored together.

2.9. Temperature/humidity status monitoring step (S900)

In this step, in the environmental condition monitoring unit 300 connected in communication with the environmental condition data collecting unit 200, the environmental condition measuring unit 100 mounted in each wafer carrier through the temperature and humidity data obtaining step (S800) This is a step of receiving temperature and humidity data obtained from and monitoring the temperature and humidity conditions inside each wafer carrier.

The environmental condition monitoring unit 300 may be communicatively connected with the environmental condition data collection unit 200 through the second communication unit 310 to receive temperature and humidity data. Based on the temperature and humidity data provided, the temperature and humidity conditions inside each wafer carrier may be monitored. Through this, efficient management is possible so that the wafers mounted in each wafer carrier can be maintained in the best condition, and thus an effect of minimizing product defect rates due to environmental influences such as temperature and humidity can be generated.

On the other hand, by the notification unit 340 of the environmental condition monitoring unit 300, if data exceeding a preset reference value is generated among the temperature/humidity data in each wafer carrier, a warning notification is generated to the wafer carrier that needs management. Can be easily identified by the administrator.

On the other hand, although the technical idea of the present invention has been described in detail according to the above embodiment, it should be noted that the above embodiment is for the purpose of explanation and not for the limitation thereof. In addition, those skilled in the art in the technical field of the present invention will be able to understand that various embodiments are possible within the scope of the spirit of the present invention.

100: environmental condition measurement unit
110: sensing unit
120: RF tag
122: tag antenna
124: tag chip
126: control unit
200: environmental state data collection unit
210: RF signal transmitter
220: RF response signal receiver
230: second storage unit
240: first communication unit
300: environmental condition monitoring unit
310: second communication unit
320: sensing data receiver
330: third storage unit
340: display unit
350: notification unit

Claims (10)

In a system that monitors changes in temperature/humidity status inside a wafer carrier moving between processes based on short-range wireless communication in real time,
It consists of one integrated structure that measures both temperature and humidity conditions, and is installed on the bottom of each wafer carrier to sense the temperature and humidity conditions inside the wafer carrier, and the sensing unit is installed in a position close to the wafer carrier. An environmental condition measurement unit including an RF tag for transmitting temperature and humidity data sensed by the sensing unit through a short-range wireless communication connection to an environmental condition data collection unit;
A plurality of wafer carriers are provided at predetermined points on the moving line, and short-range wireless communication connection with the environmental condition measuring unit mounted inside the wafer carrier close to the corresponding point among the plurality of wafer carriers moving along the moving line A measurement unit identification number for identifying the corresponding wafer carrier and an environmental condition data collection unit for collecting measured temperature and humidity data therein;
Each environmental status data collection unit installed at a predetermined point on the moving line and a collection unit identification number that is connected to a wired/wireless communication network to identify the corresponding environmental status data collection unit, and each wafer in motion collected by the environmental status data collection unit The internal temperature and humidity data linked to the identification number of the corresponding measurement unit of the environmental condition measuring unit mounted in the carrier is provided, and based on this, the internal temperature and humidity conditions are determined in a certain section during the transfer process An environmental condition monitoring unit that detects whether an abnormal change has occurred and provides a notification;
Wafer carrier internal temperature/humidity condition monitoring system comprising a. The method of claim 1,
The RF tag of the environmental condition measurement unit,
A tag antenna for receiving an RF signal from an environmental state data collecting unit installed in a position close to the wafer carrier, and transmitting an RF response signal and temperature and humidity data sensed by the sensing unit to the environmental state data collecting unit;
Generating the driving power of the environmental state data measuring unit from the RF signal received from the environmental state data collection unit through the tag antenna, and transmitting an RF response signal to the RF signal to the environmental state data collecting unit through the tag antenna Tag chip;
A controller configured to operate the sensing unit with driving power from the tag chip, receive temperature and humidity data sensed from the sensing unit, and store the data in the tag chip;
Wafer carrier internal temperature / humidity condition monitoring system, characterized in that configured to include. The method of claim 2,
The tag chip,
An RF energy generator generating power to drive the environmental state data measuring unit from an RF signal received from an environmental state collecting unit adjacent to the tag antenna;
A first storage unit configured to store temperature and humidity data sensed by a sensing unit mounted in the wafer carrier under control of the control unit;
An RF signal response unit generating an RF response signal in response to an RF signal received from an adjacent environmental state data collecting unit through the tag antenna and transmitting the generated RF response signal to a corresponding environmental state data collecting unit through the tag antenna;
Wafer carrier internal temperature / humidity condition monitoring system, characterized in that configured to include. The method of claim 3,
The RF signal response unit,
When the received RF signal is a first RF signal requesting a unique identification code, a first RF response signal including a unique identification code indicating a corresponding RF tag is transmitted in response thereto,
When the received RF signal is a second RF signal that requests reading of temperature and humidity data, transmitting a second RF response signal including temperature and humidity data inside the wafer carrier in response thereto. Temperature/humidity condition monitoring system inside the wafer carrier, characterized by. The method of claim 3,
The control unit,
On the inside of a wafer carrier, characterized in that the sensor driving signal generated by driving power from the RF energy generating unit of the tag chip is transmitted to the sensing unit, and the sensing unit is operated to sense the temperature and humidity conditions inside the corresponding wafer carrier. / Humidity condition monitoring system. The method of claim 4,
The environmental state data collection unit,
An RF signal transmission unit for transmitting an RF signal to an RF tag of an environmental condition measurement unit mounted inside an adjacent wafer carrier;
An RF response signal receiving unit for receiving an RF response signal from an RF tag of a corresponding environmental condition measuring unit in response to the transmitted RF signal;
Wafer carrier internal temperature / humidity condition monitoring system, characterized in that configured to include. The method of claim 6,
The RF signal transmitting unit transmits a first RF signal requesting a unique identification code to an RF tag inside a nearby wafer carrier,
The RF response signal receiving unit receives a first RF response signal including a unique identification code from a corresponding RF tag in response to the first RF signal and recognizes the RF tag. Condition monitoring system. The method of claim 7,
After recognizing the RF tag, the RF signal transmitter transmits a second RF signal requesting reading of temperature and humidity data inside a corresponding wafer carrier,
The RF response signal receiver, in response to the second RF signal, receives a second RF response signal including temperature and humidity data from a corresponding RF tag to obtain temperature and humidity data inside a corresponding wafer carrier. Temperature/humidity monitoring system inside the wafer carrier. The method of claim 8,
The environmental state data collection unit,
A second storage unit for storing temperature and humidity data obtained from the second RF response signal received by the RF response signal receiver;
A first communication unit communicating with the environmental condition monitoring unit;
Wafer carrier internal temperature / humidity condition monitoring system, characterized in that configured to include. The method of claim 9,
The environmental condition monitoring unit,
A second communication unit communicatively connected to the first communication unit of the environmental state data collection unit;
A sensing data receiving unit configured to receive temperature and humidity data in each wafer carrier stored in each environmental state data collection unit provided on a moving line of the wafer carrier at a predetermined periodic interval through the second communication unit;
A third storage unit for storing temperature and humidity data in each wafer carrier received by the sensing data receiving unit;
A display unit for displaying temperature and humidity data in each wafer carrier stored in the third storage unit;
A notification unit for providing a warning notification according to occurrence of data having a predetermined reference value or more among temperature and humidity data inside each wafer carrier;
Wafer carrier internal temperature / humidity condition monitoring system, characterized in that configured to include.

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