KR20200126113A - Gas pressure type valve for by-product collecting apparatus of semiconductor manufacturing process - Google Patents

Abstract

The present invention relates to a gas pressure type valve for a by-product collecting apparatus of a semiconductor manufacturing process. An object of the present invention is to provide a gas pressure type valve to seal an inside of a device to be sealed by using an inert gas supply structure, and provide a stable sealing force even under conditions that rapidly switched to any of vacuum, atmospheric pressure, and water pressure. According to the configuration, the gas pressure type valve for a by-product collecting apparatus of a semiconductor manufacturing process includes: a valve body (1) formed with a first flow path (1a) and a second flow path (1b) that are not formed on the same axis, a piston groove (1c) into which a piston is inserted, and a gas supply path (1d) for sealing; a first piston (2) inserted into the piston groove, having an upper end fastened and fixed to the piston groove, and having an inner space into which a second piston (3) is inserted; a second piston (3) inserted into the inner side of the first piston and seated on a valve seat formed in a first flow path inside the valve body while elevating and descending so as to provide a sealing force; a handle part (4) for raising and lowering the second piston; and a gas injection port (5) having one side inserted into the sealing gas supply path (1d) and the other side connected to a gas supply pipe.

Description

Gas pressure type valve for by-product collecting apparatus of semiconductor manufacturing process

The present invention relates to a gas pressurized valve for a reaction by-product collecting device in a semiconductor process, and in detail, the gas pressure can be used to provide a reliable sealing force even when various pressure fluctuations occur during operation of the collecting device collecting reaction by-products during the semiconductor process. It relates to a valve that can.

In general, a large amount of ignitable gases, corrosive foreign substances, and harmful gases containing toxic components are generated inside a process chamber during a semiconductor manufacturing process.

In order to purify and release these harmful gases, semiconductor manufacturing equipment includes a vacuum pump that makes the process chamber continuously operated in a vacuum state, and a scrubber that purifies the exhaust gas discharged from the process chamber after the vacuum pump and discharges it to the atmosphere. ) Is installed.

However, since the scrubber only purifies and processes gaseous reaction by-products, when the reaction by-products are discharged to the outside of the process chamber and then solidified, the exhaust pressure rises due to sticking to the exhaust pipe, flows into the vacuum pump and causes the pump to malfunction, and the process There is another problem, such as polluting the wafer due to the noxious gas flowing back into the chamber.

For this reason, in semiconductor manufacturing equipment, generally, one reaction by-product collecting device per process chamber is installed between the process chamber and the vacuum pump to coagulate the exhaust gas discharged from the process chamber into a powder state.

On the other hand, the amount of reaction gas used in the process chamber is increasing with the recent high quality and high efficiency of semiconductor devices of semiconductor manufacturing companies.

As a result, as the amount of exhaust gas exhausted after the reaction in the process chamber increases, the amount of reaction by-products to be agglomerated in the collection device also increases, and a high-efficiency collection device with a larger capacity for processing reaction by-products than before is required.

If the collection device does not smoothly process the large amount of exhaust gas that has flowed from the process chamber, it flows into the vacuum pump and the scrubber, causing the pump to fail, and the harmful gas flows back into the process chamber. Because of contamination, a high-efficiency, large-capacity collection device is a very important device in the semiconductor production process.

At this time, the collecting device must satisfy the condition that it is not enough that only the processing capacity is increased to a large capacity, and that the cleaning cycle should not be shorter than before. Otherwise, as the amount of collected reaction by-products is increased, the cleaning process may be more frequent than before, because in this case, the operation of the process chamber must be stopped frequently.

The reason for stopping the operation is to remove the collecting device after removing the exhaust pipe (or vacuum pipe) connected to the process chamber in the front and the vacuum pump in the rear while the operation of the process chamber and the vacuum pump are stopped for cleaning the collection device. Because.

In addition, the removed collection device separates the internal collection tower installed inside, and then cleans the reaction by-products collected or fixed inside the internal collection tower and the collection device housing, and the cleaned collection device is again used in the process chamber at the front and the vacuum at the rear end. It goes through the process of remounting by connecting with the pump.

At this time, if the process chamber is operated as soon as the collection device is connected to the process chamber and the vacuum pump, the vacuum condition, the presence of foreign substances, or various conditions may not meet the conditions for optimal semiconductor production. The collection process begins.

As described above, it can be seen that it takes a lot of time to restart the process chamber in which the operation was stopped after cleaning of the collection device.

However, in the conventional semiconductor production process, since the system is composed of a structure in which one collecting device is connected per one process chamber, for preventive maintenance of semiconductor production facilities, after operating the process chamber for a certain period of time, the collecting device is inside. The cleaning process of the reaction by-products collected in the by-products and the process of removing and re-installing the collection device are essentially performed.

In order to solve the above problems, it is possible to clean the collecting device without removing the collecting device.For this operation, the process chamber can be cleaned directly inside the collecting device and under vacuum, normal pressure, and water pressure that occur during the drying process. A valve that can provide a strong sealing force so as not to affect the exhaust gas piping connected to the vacuum pump is required.

However, there is still no valve that can provide a reliable sealing force even under such rapid pressure fluctuations, so the need for technology development to solve this problem is emerging.

Korean Registered Patent Publication Registration No. 10-0595010 (2006.06.22.) Korean Registered Patent Publication No. 10-0717837 (2007.05.07.) Korean Patent Publication No. 10-0862684 (2008.10.02.) Korean Registered Patent Publication No. 10-1447629 (2014.09.29.)

An object of the present invention for solving the above problems is a gas that can provide a stable sealing force even under conditions in which the interior of the device to be sealed is rapidly switched to one of vacuum, normal pressure, and water pressure by sealing using an inert gas supply structure. It is to provide a pressurized valve.

The present invention, which achieves the above object and performs a task to eliminate the conventional defects, provides a first flow path and a second flow path not formed on the same axis, a piston groove into which a piston is inserted, and a gas supply flow path for sealing. A valve body formed therein;

A first piston that is inserted into the piston groove and has an upper end fastened to and fixed to the piston groove, and a second piston is inserted into the inner space;

A second piston inserted into the inner side of the first piston and mounted on a valve seat formed in a first flow path inside the valve body while elevating and descending to provide a sealing force;

A handle part for raising and lowering the second piston;

It is achieved by providing a gas pressurized valve for a reaction by-product collection device of a semiconductor process, characterized in that it comprises a; gas injection port that is inserted into the gas supply passage for sealing and the other side is fastened to the gas supply pipe.

In a preferred embodiment, a valve seat is formed at the end by forming a flow path inclined so as to meet the end section of the first flow path with the axis of the piston groove, and the opening of the first flow path is formed in the valve seat so that the second piston It may be configured to pressurize by supplying an inert gas between the two O-rings fitted on the bottom surface.

In a preferred embodiment, in the valve body, the first flow path and the second flow path formed therein are extended and protruded to the outside in the form of a pipe, and a flange is formed around each pipe end to be used for fastening with the exhaust gas pipe connected to the valve body. It can be configured to be.

In a preferred embodiment, the first piston has a plurality of holes formed in the upper valve body of the piston groove while the support part protrudes around the upper end and is supported by the valve body, so that some holes are formed in the upper valve body of the piston groove. It is fixed by fastening means such as the back, and the remaining holes are configured to be fixed by fastening means such as a handle part and a bolt, and the support part is configured so that a support jaw protrudes from the upper end to be fitted and supported by the handle part, and an O-ring groove is formed on the lower inner surface. O-ring can be installed.

In a preferred embodiment, the second piston is inserted into the inner side of the first piston and the outer diameter surface is configured to contact the inner diameter surface of the first piston;

A sealing portion formed at the lower end of the piston housing to provide a sealing force by making surface contact with the valve seat;

It may be composed of; a fastening portion formed on the upper surface of the sealing portion at the lower end of the piston housing and coupled to the handle portion.

In a preferred embodiment, the sealing portion has a size of about the inner diameter of the piston groove in the shape of a disk having a predetermined thickness, and two O-ring grooves are formed at regular intervals in the circumferential direction on the surface contacting the valve seat on the bottom surface. It can be configured by fitting.

In a preferred embodiment, the handle portion and a handle body portion fastened to the first piston; A rod portion inserted into the handle body and fastened with the second piston; It may consist of; a dial unit that rotates for elevating the rod unit.

In a preferred embodiment, the handle body part has a fixing part that is fixedly supported by being fitted to a support jaw formed in the support part of the first piston at an upper portion, and extending to a length near the second piston under the fixing part and receiving a rod part therein. A guide portion may be formed.

In a preferred embodiment, the rod portion may be composed of a fastening portion having a hexagonal or polygonal column structure with a screw formed at the bottom, and a rod having one side coupled to the fastening portion and the other side being fastened to the dial portion and having a threaded circumference formed thereon; have.

In the present invention having the above characteristics, the upper and lower exhaust pipes of the collecting device used in the semiconductor process are sealed with a gas pressurized valve having an inert gas supply structure, so that the interior of the collecting device is rapidly reduced to one of vacuum, normal pressure, and water pressure. It is a useful invention that has the advantage of not affecting the process chamber and vacuum pump even under conditions that are changed so that it is an invention that is highly expected to be used in the industry.

1 is an exploded perspective view showing a gas pressurized valve according to an embodiment of the present invention,
2 is a perspective view of a valve body according to an embodiment of the present invention,
3 is a perspective view showing a bottom surface of a second piston according to an embodiment of the present invention,
4 is an exemplary view showing a cross section of a gas pressurized valve according to an embodiment of the present invention,
5 is a cross-sectional view showing an open state of a gas pressurized valve according to an embodiment of the present invention,
6 is a cross-sectional view showing a closed state of a gas pressurized valve according to an embodiment of the present invention,
7 is an exemplary view showing a state in which a gas pressure type valve according to the present invention is installed in a collecting device.

Hereinafter, the configuration and operation of the embodiments of the present invention will be described in detail in connection with the accompanying drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted.

1 is an exploded perspective view showing a gas pressurized valve according to an embodiment of the present invention, FIG. 2 is a perspective view of a valve body according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the bottom of the piston, Fig. 4 is an exemplary view showing a cross section of a gas pressurized valve according to an embodiment of the present invention, and Fig. 5 is an open state of the gas pressurized valve according to an embodiment of the present invention 6 is a cross-sectional view showing a closed state of a gas pressurized valve according to an embodiment of the present invention.

As shown, the gas pressurized valve according to the present invention is composed of a valve body 1, a first piston 2, a second piston 3, a handle part 4, and a gas injection port 5.

The valve body 1 has a first flow path 1a and a second flow path 1b that are not formed on the same axis, a piston groove 1c into which a piston is inserted, and a gas supply flow path 1d for sealing. .

The first piston (2) is inserted into the piston groove, the upper end is fastened to the piston groove and fixed, and the second piston (3) is inserted into the inner space.

The second piston 3 is inserted into the inner side of the first piston and is mounted on the valve seat formed in the inner first flow path of the valve body while elevating and descending to provide a sealing force.

The handle part 4 is configured to lift and lower the second piston.

One side of the gas fitting 5 is inserted into the sealing gas supply passage 1d and the other side is connected to an external gas supply pipe, not shown.

It will be described in detail below.

In the valve body 1, the first flow path 1a and the second flow path 1b formed therein are extended and protruded to the outside in a pipe shape, and a flange is formed around the ends of each pipe to form an exhaust gas pipe connected to the valve body. It is configured to be used when fastening.

The first flow path 1a and the second flow path 1b are not directly connected to each other on the same axis, but are formed to be connected through the piston groove 1c.

Because of this connection structure, the fluid (liquid, gas) or vacuum introduced through the first flow path 1a or the second flow path 1b is configured to flow into each other after the flow is changed to the space portion of the piston groove.

The first flow path 1a and the second flow path 1b are not directly connected to each other on the same axis, so that the end section of the first flow path 1a meets the axis of the piston groove 1c. The valve seat 1a-1 is formed.

The valve seat (1a-1) is configured to be in contact with the surface when the second piston (3) is lowered and seated to be sealed.

When such a surface contact occurs, the sealing force provided by the supply of the O-ring and the inert gas provides a reliable sealing force even if the internal space of an object such as a collection device connected to the first flow path, for example, a rapid pressure fluctuation occurs. . This sealing force eventually protects the object connected to the second flow path, for example a process chamber.

Therefore, when the second piston 3 descends and comes into contact with the surface, a sealing action occurs, blocking the fluid or vacuum condition between the first flow path 1a or the second flow path 1b and sealing it, and the second piston 3 rises. When the valve seat 1a-1 and the sealing force are released, a fluid flow or vacuum condition is formed equally between the first flow path 1a and the second flow path 1b.

The piston groove (1c) is in the form of a cylinder having an inclination angle so that the partial section is perpendicular to the valve seat (1a-1) formed at the end of the first flow path (1a) formed by bending toward the piston groove (1c). It is configured inside the valve body 1 to be configured.

The sealing gas supply passage 1d is formed by processing a hole to supply an inert gas injected from the outside of the valve body 1 to the valve seat 1a-1 formed at the end of the first passage 1a.

An opening 1d-1 is formed between the two O-ring grooves formed on the bottom surface of the second piston 3 in an interview with the valve seat 1a-1 in the path of the gas supply passage 1d for sealing.

The position of the opening 1d-1 of the sealing gas supply flow path 1d is important, because when the opening is positioned between the O-ring and the O-ring, the second piston 3 descends and the valve seat 1a-1 During an interview, the O-ring is in contact with the interview to provide a strong sealing force.At this time, the gas injected from the sealing gas supply flow path (1d) is injected into the space between the O-ring and the O-ring and is pressurized and charged, as if the high-pressure air filled inside a car tire. This is because it provides sealing power by supporting the O-ring while playing the same role as.

Therefore, even if the pressure conditions in the space of the collection device during the semiconductor process are alternately switched to various pressure conditions such as vacuum, normal pressure, and water pressure, the two O-rings are supported by the pressure of the supplied inert gas, It provides a reliable sealing force.

Even if one of the two O-rings is damaged, the pressure of the supplied inert gas protects the other O-ring, so that the sealing force does not decrease momentarily.

The first piston 2 is configured to have a cylindrical shape with an empty inside so that the second piston 3 that moves up and down so as to make surface contact with the valve seat 1a-1 is guided while in contact with the inner diameter portion.

A support part 2a protrudes around the upper end of the first piston 2 and is supported by the valve body 1, and a plurality of holes penetrating up and down the surface of the support part 2a are formed, and some of the holes are the piston groove 1c. The hole formed in the upper valve body (1) and is fixed by fastening means such as bolts, and the remaining holes are fixed by fastening means such as handle and bolts.

In addition, the support portion is configured such that the support jaw (2b) protrudes from the top and the handle portion is fitted and supported. The size of the support portion has a size that can be supported without falling into the piston groove 1c.

It goes without saying that the shape of the support part is formed in a quadrangular shape in the drawing according to an embodiment, but may be formed in a circular or polygonal shape.

In addition, an O-ring groove 2c is formed on the lower inner diameter surface of the first piston 2 to provide an O-ring 2d. The O-ring 2d fitted in the O-ring groove 2c is in contact with the outer diameter of the second piston 3 to provide a sealing force.

The second piston (3) is inserted into the inner side of the first piston (2) and a piston housing (3a) configured such that the outer diameter surface is in contact with the inner diameter surface of the first piston (2); A sealing portion (3b) formed at the lower end of the piston housing to provide a sealing force by making surface contact with the valve seat (1a-1); It consists of a fastening part 3c formed on the upper surface of the sealing part 3b of the inner lower end of the piston housing 3a and coupled to the handle part 4.

The sealing portion (3b) has a size of about the inner diameter of the piston groove (1c) in the shape of a disk having a predetermined thickness, the bottom surface of the O-ring groove (in the circumferential direction) on the surface contacting the valve seat (1a-1) 3d) Two are formed at regular intervals.

Each O-ring groove (3d) is fitted with an O-ring (3e) serves to increase the sealing force of the sealing portion (3b) in surface contact with the valve seat (1a-1).

In particular, at a point between the adjacent O-ring groove 3d and the O-ring groove 3d, a gas supply flow path 1d for sealing is formed so that the inert gas is inserted into the two O-ring grooves 3d, the O-ring 3e and the O-ring ( It is supplied to the gap between 3e) and is configured to press the O-ring 3e.

The fastening part 3c is fixed by screwing with the lower rod part 4b of the handle part 4, and by being combined in this way, when the rod part 4b is raised or lowered according to the rotation direction of the handle part, it is linked to rise and fall. .

The handle part 4 includes a handle body part 4a fastened to the first piston 2; A rod part (4b) inserted into the handle body part (4a) and fastened with the second piston (3); It consists of a; dial portion (4c) that rotates for the elevating and descending of the rod portion (4b).

In one embodiment of the present invention, the handle portion is configured to be operated by rotation of the dial portion for an opening or closing action, and is shown as being manually opened and closed, but the rotation of the dial portion is not only manual, but also for the rotation of the dial portion. The motor can be directly connected or configured to be controlled remotely using a connection means such as a belt connected to the motor and configured to rotate automatically.

In addition, it goes without saying that it is also possible to configure the handle unit to operate by remote control after configuring the rod unit to directly elevate and lower by operating means such as a pneumatic cylinder or various actuators as well as a rotation method.

It is important that the handle part is operated manually or automatically so that the second piston is seated on the valve seat formed in the inner first flow path of the valve body.

The handle body (4a) has a fixing part (4a-1) that is fixedly supported by being fitted to a support jaw (2b) formed on the support part (2a) of the first piston (2) at the top, and the fixing part (4a- 1) In the lower portion, a guide portion 4a-2 is formed that extends to the vicinity of the second piston 3 and accommodates the rod portion 4b therein.

A thread (not shown) is formed inside the guide part 4a-2, and a thread (not shown) formed around a section of the rod part 4b is configured to be screwed.

It is sufficient if the unillustrated screw thread is mainly formed on the upper portion to provide the required elevation height of the second piston 3.

The rod part (4b) has a hexagonal or polygonal column structure with a screw formed at the lower end (4b-1), one side is coupled with the fastening portion (4b-1) and the other side is coupled with the dial portion (4c) And a rod (4b-2) having a thread (not shown) formed around it.

The fastening part 4b-1 and the rod 4b-2 are axially coupled to freely rotate with each other.

Therefore, while the rod 4b-2 rotates while being screwed inside the guide part 4a-2, the fastening part 4b-1 moves up and down while not rotating when lifting and lowering. Since such an operating principle is a known technique, a detailed description will be omitted.

The dial part 4c is connected to the upper part of the rod 4b-2 to provide a rotational force.

Therefore, when the dial part 4c rotates, the rod 4b-2 that rotates in connection with it rotates, and the thread formed around it rotates with the thread inside the guide part 4a-2 so that it moves up or down according to the direction of rotation. do.

The gas supplied to the gas injection port 5 is an inert gas, and the gas supplied by a gas supply means, not shown, is configured to be controlled according to the opening and closing of the gas opening/closing valve.

7 is an exemplary view showing a state in which a gas pressurized valve according to the present invention is installed in a collecting device

It goes without saying that the illustrated embodiment is one of various embodiments, and the present invention is not limited to only the upper and lower ends of the collecting device of such a semiconductor process, and can be connected to objects with various pressure fluctuations.

Each collecting device 100 configured in parallel basically collects the reaction by-products contained in the exhaust gas introduced from the process chamber using the internal collecting tower (not shown) installed therein, and the exhaust gas flowing into the internal collecting tower and the internal wall of the collecting device It cools while in contact with the surface and aggregates to collect reaction by-products. Such a configuration is a known configuration constituting a general collection device, and a detailed description thereof will be omitted.

The illustrated collecting device is configured to be connected with an exhaust gas pipe 200 so that each collecting device 100 configured in parallel is connected to one process chamber (not shown) and a vacuum pump (not shown), and the gas pressure type according to the present invention The upper and lower ends are selectively sealed and blocked by the first flow path 1a and the second flow path 1b formed on both sides of the valve body 1 constituting the valve, so that any one collecting device is always connected to the process chamber. Is operated, and the rest of the collection device is configured to perform a cleaning process.

Hereinafter, a method of operating the gas pressurized valve according to the present invention configured as described above will be described. At this time, for convenience of explanation, the description is based on a state in which the gas pressure type valve according to the present invention is installed and connected to the upper and lower exhaust pipes of the collecting device for semiconductor processing as in the above embodiment. An exhaust pipe connected to a process chamber (not shown) is configured on the upper side of the collecting device, and an exhaust pipe connected to a vacuum pump (not shown) is connected on the lower side. In addition, the collection device will be described based on a case in which washing and drying processes are performed after collecting the reaction by-product.

The embodiment used in the description of the above and the operation method is an example of one of several embodiments, and the present invention is not limited to the upper and lower ends of the collecting device of such a semiconductor process, and can be connected to objects with various pressure fluctuations. Of course.

First, the connection target, for example, is installed at the top and bottom of the collecting device of the semiconductor process so that it does not open and close at the same time when opening and closing, and when opening a gas pressurized valve, first open the one installed at the lower end and then open the one installed at the upper end. When closing the type valve, close the one installed on the upper part and then close the one installed on the lower part.

The reason why the order of opening/closing is determined in this way is to optimize so that the internal condition of the collecting device connected to the first flow path, for example, during a semiconductor process, does not affect a target connected to the second flow path, for example, a process chamber.

That is, when opening the gas pressurized valve, if the upper end is closed and the lower end is opened, the exhaust gas or residual washing water present in the internal space of the collection device is discharged to the vacuum pump and then the upper end is opened according to an embodiment. To prevent damage due to reverse flow to

On the contrary, when the gas pressurized valve is closed, the upper end is closed first, so if the remaining exhaust gas is discharged to the vacuum pump in a state where there is no new exhaust gas, and the lower end is closed, the exhaust gas present in the internal space of the collecting device is removed from the vacuum pump. This is because it is possible to prevent damage by flowing back into the process chamber by closing the top after being discharged to the side.

In the present invention, there is provided a gas pressurized valve that is configured as described above and provides a sealing force while pressing the O-rings 2d located on both sides of the end opening 1d-1 of the sealing gas supply passage 1d with the pressure of an inert gas. The reason for use is that in the conventional valve structure with only O-rings, the material of the O-ring is corroded or deteriorated as the material of the O-ring is corroded or deteriorated while the collection device alternates between the collection process, the cleaning process, and the drying process as in one embodiment of the present invention. This is because this decreases and it is difficult to exhibit a stable sealing force.

If the O-ring is damaged, the sealing power of the corresponding valve decreases, and some of the reaction by-products or harmful gases collected by the collecting device flow into the process chamber or vacuum pump in continuous operation, or a pressure fluctuation occurs, causing mechanical failure of the process chamber or vacuum pump. It may generate or contaminate the semiconductor product being manufactured, and eventually the operation of the process chamber, collection device, vacuum pump and scrubber in operation will be stopped.

Therefore, if this problem is not solved, the process chamber using the collecting device according to the present invention cannot be stably operated.

However, in the present invention, by providing a gas pressurized valve having a structure in which an inert gas is supplied, the O-ring can maintain the sealing force while supporting the pressure applied to the O-ring from the outside, thereby sealing the exhaust pipe connected to the process chamber or the vacuum pump. The sealing force of is maintained without deterioration.

The present invention is not limited to the specific preferred embodiments described above, and any person having ordinary knowledge in the technical field to which the present invention pertains without departing from the gist of the present invention claimed in the claims can implement various modifications Of course, such changes are within the scope of the claims.

(1): valve body (1a): first flow path
(1a-1): valve seat (1b): second flow path
(1c): Piston groove (1d): Gas supply flow path for sealing
(1d-1): opening (2): first piston
(2a): support part (2b): support jaw
(2c): O-ring groove (2d): O-ring
(3): second piston (3a): piston housing
(3b): sealing part (3c): fastening part
(3d): O-ring groove (3e): O-ring
(4): Handle part (4a): Handle body part
(4a-1): fixed part (4a-2): guide part
(4b): rod part (4b-1): fastening part
(4b-2): rod (4c): dial
(5): Gas inlet

Claims (9)

A valve body 1 having a first flow path 1a and a second flow path 1b not formed on the same axis, a piston groove 1c into which a piston is inserted, and a gas supply flow path 1d for sealing;
A first piston (2) that is inserted into the piston groove and has an upper end fastened to and fixed to the piston groove, and a second piston (3) is inserted into the inner space;
A second piston (3) inserted into the inner side of the first piston and mounted on a valve seat formed in a first flow path inside the valve body while elevating and descending to provide a sealing force;
A handle unit 4 for raising and lowering the second piston;
A gas pressurized valve for a reaction by-product collection device of a semiconductor process, comprising: a gas inlet (5) having one side inserted into the sealing gas supply passage (1d) and the other side connected to the gas supply pipe.
The method according to claim 1,
A valve seat 1a-1 is formed at the end by forming a flow path inclined so that the end section of the first flow path 1a meets the axis of the piston groove 1c, and the valve seat 1a-1 has a first For a reaction by-product collecting device of a semiconductor process, characterized in that an opening (1d-1) of the flow path (1a) is formed so that an inert gas is supplied and pressurized between two O-rings fitted on the bottom of the second piston (3). Gas pressurized valve.
The method according to claim 1,
In the valve body 1, the first flow path 1a and the second flow path 1b formed therein are extended and protruded to the outside in a pipe shape, and a flange is formed around the ends of each pipe to form an exhaust gas pipe connected to the valve body. Gas pressurized valve for a reaction by-product collection device of a semiconductor process, characterized in that configured to be used when fastening of.
The method according to claim 1,
The first piston 2 has a plurality of holes extending up and down on the surface of the support 2a while the support 2a protrudes around the upper end and is supported by the valve body 1, and some of the holes are formed in the piston groove 1c ) Is fixed with a fastening means such as a hole and a bolt formed in the upper valve body 1, and the remaining holes are configured to be fixed with a fastening means such as a handle part and a bolt, and the support part has a support jaw (2b) protruding from the top. A gas-pressurized valve for a reaction by-product collection device of a semiconductor process, characterized in that the handle part is fitted and supported, and an O-ring groove (2c) is formed on the lower inner diameter surface, and an O-ring (2d) is installed.
The method according to claim 1,
The second piston (3) is inserted into the inner side of the first piston (2) and a piston housing (3a) configured such that the outer diameter surface is in contact with the inner diameter surface of the first piston (2);
A sealing portion (3b) formed at the lower end of the piston housing to provide a sealing force by making surface contact with the valve seat (1a-1);
A gas-pressurized valve for a reaction by-product collecting device in a semiconductor process, characterized in that consisting of a fastening part (3c) formed on the upper surface of the sealing part (3b) at the inner bottom of the piston housing (3a) and coupled to the handle part (4). .
The method of claim 5,
The sealing portion (3b) has a size of about the inner diameter of the piston groove (1c) in the shape of a disk having a predetermined thickness, the bottom surface of the O-ring groove (in the circumferential direction) on the surface contacting the valve seat (1a-1) 3d) A gas pressurized valve for a reaction by-product collecting device of a semiconductor process, characterized in that two are formed at regular intervals and formed by inserting O-rings (3e).
The method according to claim 1,
The handle part 4 includes a handle body part 4a fastened to the first piston 2;
A rod part (4b) inserted into the handle body part (4a) and fastened with the second piston (3);
A gas pressurized valve for a reaction by-product collecting device in a semiconductor process, characterized in that consisting of; a dial part (4c) that rotates to elevate and descend the rod part (4b).
The method of claim 7,
The handle body (4a) has a fixing part (4a-1) that is fixedly supported by being fitted to a support jaw (2b) formed on the support part (2a) of the first piston (2) at the top, and the fixing part (4a- 1) Gas pressurized type for a reaction by-product collecting device of a semiconductor process, characterized in that a guide part 4a-2 is formed in the lower part to extend to the vicinity of the second piston 3 and accommodates the rod part 4b therein. valve.
The method of claim 7,
The rod part (4b) has a hexagonal or polygonal column structure with a screw formed at the lower end (4b-1), one side is coupled with the fastening portion (4b-1) and the other side is coupled with the dial portion (4c) A gas pressurized valve for a reaction by-product collecting device of a semiconductor process, characterized in that consisting of a rod (4b-2) having a threaded circumference.

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