KR20200114402A - LED package and manufacturing method of the same - Google Patents

Abstract

Disclosed is a light emitting diode (LED) package capable of maintaining a bonding strength between components even at high temperatures, increasing heat dissipation effect, and preventing deterioration. According to one aspect of the present invention, an LED packet comprises: a substrate having an electrode portion formed on one surface thereof; a conductive layer formed on one surface of the substrate to be connected to the electrode portion, and having a first concavo-convex formed on an upper surface thereof; a conductive adhesive layer bonded to the first concavo-convex of the conductive layer; and an LED element bonded to the conductive adhesive layer.

Description

LED package and manufacturing method thereof {LED package and manufacturing method of the same}

The present invention relates to an LED package and a method of manufacturing the same. In more detail, the present invention relates to an LED package that improves adhesion between a substrate, an LED device, and a resin portion and a lens, enhances heat dissipation, and prevents deterioration, and a manufacturing method thereof.

LED (Light Emitting Diode) device is a semiconductor device that converts electrical energy into light energy. By controlling the composition of a compound semiconductor, it can implement light of various wavelengths such as red, green, and blue. Various lights can be implemented by combining them.

LED devices are used in various fields such as indoor and outdoor lighting, backlights of display devices, electronic boards, automobiles, etc. as they have the advantages of low power consumption, environment-friendly, and long life compared to conventional light sources.

In a conventional LED package, an LED device is mounted on a substrate, and a resin layer and a lens are sequentially formed on the LED device.

However, recently, a high-power LED device has been used, and thus, high power is supplied to the LED device, causing a problem in that a lot of heat is emitted from the LED device. In particular, there is a problem that the LED element and the electrode of the substrate are disconnected due to contraction and expansion of the LED package due to heat, and there is a problem that the LED element is deteriorated because heat is not radiated to the outside of the package.

In addition, when the resin layer contains a phosphor or the like, there is a problem in that the adhesion between the resin layer and the lens is lowered, resulting in separation.

Korean Patent Publication No. 2011-0137277

An embodiment of the present invention is to provide an LED package and a method of manufacturing the same, which can maintain bonding strength between components even at high temperatures, increase heat dissipation effect, and prevent deterioration.

According to an aspect of the present invention, a substrate having an electrode portion formed on one surface thereof, a conductive layer formed on one surface of the substrate to be connected to the electrode portion and having first irregularities formed on the upper surface thereof, a conductive adhesive layer and a conductive adhesive layer bonded to the first irregularities of the conductive layer An LED package including an LED (Light Emitting Diode) device coupled to is provided.

According to another aspect of the present invention, preparing a substrate having an electrode portion formed on one surface thereof, forming a conductive layer having a first irregularity formed on the upper surface and connected to the electrode portion, and bonding a conductive adhesive layer to the first irregularity and the conductive adhesive layer There is provided a method of manufacturing an LED package comprising the step of coupling the LED device to the LED.

According to an exemplary embodiment of the present invention, bonding between components of an LED package may be improved even at high temperatures.

In addition, heat generated from the LED device can be effectively discharged, thereby preventing the LED device from deteriorating in light efficiency.

1 is a view showing an LED package according to an embodiment of the present invention.
2 to 7 are views illustrating a method of manufacturing an LED package according to an embodiment of the present invention.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, when a part "includes" a certain component, it means that other components may be further included rather than excluding other components unless specifically stated to the contrary. In addition, throughout the specification, the term "on" means to be positioned above or below the target portion, and does not necessarily mean to be positioned above the direction of gravity.

In addition, the term “couple” does not mean only a case in which each component is in direct physical contact with each other in the contact relationship between each component, but a different component is interposed between each component, and the component is It should be used as a concept that encompasses each contact.

In addition, terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component.

Since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to what is shown.

Hereinafter, embodiments of the LED lighting device according to the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are assigned the same reference numbers and overlapped Description will be omitted.

1 is a view showing an LED package according to an embodiment of the present invention.

The LED package 100 according to an embodiment of the present invention includes a substrate 110, conductive layers 141 and 142, conductive adhesive layers 151 and 152, and an LED device 160.

The substrate 110 is a portion on which the LED element 160 is mounted, and electrode portions 131 and 132 for supplying electricity to the LED element 160 are formed. In order to effectively dissipate heat generated from the LED device 160, the substrate 110 may be a substrate 110 made of a metal material.

For example, a metal substrate made of aluminum or an aluminum alloy may be used. Specifically, after bonding the insulating sheet to the aluminum plate, the copper foil is attached and etched to form a circuit.

Referring to FIG. 1, in the substrate 110 of the present embodiment, a pair of electrode portions 131 and 132 are formed on one surface, and an LED element is formed through the conductive layers 141 and 142 and the conductive adhesive layers 151 and 152. 160) can supply electricity. The pair of electrode portions 131 and 132 may be composed of an anode and a cathode.

The LED element 160 is a light source that can emit light using electric energy. The LED device 160 is a semiconductor device, and can implement light of various wavelengths such as red, green, and blue by controlling the composition of the compound semiconductor, and can implement various lights by using a fluorescent material or by combining colors. In addition, the LED device 160 may include an electrode to receive electric energy.

Referring to FIG. 1, in the LED device 160 of the present embodiment, a pair of electrodes is formed on the lower surface, and is electrically connected to the electrode portions 131 and 132 of the substrate 110 described below to receive power.

The conductive layers 141 and 142 are formed on one surface of the substrate 110 to be connected to the electrode portions 131 and 132 of the substrate 110. The conductive layers 141 and 142 may be formed of a material that conducts electricity, for example, a metal layer. In addition, one side of the conductive layers 141 and 142 is coupled to the electrode units 131 and 132 so that electricity can be supplied from the electrode units 131 and 132 to the LED element 160 through the conductive layers 141 and 142 And, the other side may extend toward the LED element 160.

In particular, first irregularities 141a and 142a are formed on upper surfaces of the conductive layers 141 and 142 to which the conductive adhesive layers 151 and 152 are bonded so that the conductive adhesive layers 151 and 152 can be firmly bonded.

Referring to FIG. 1, a pair of conductive layers 141 and 142 according to the present embodiment may be formed to be connected to each of the pair of electrode portions 131 and 132. Each of the conductive layers 141 and 142 may be coupled to the side surfaces of the corresponding electrode portions 131 and 132 to have a structure extending to the bottom of the LED element 160. In this case, a pair of electrodes may be formed on the lower surface of the LED element 160, and electrode portions 131 and 132 may be disposed under the electrode portions 131 and 132 corresponding to positions of the respective electrodes.

In addition, first unevenness 141a and 142a may be formed on the upper surface of the conductive layers 141 and 142 facing the LED device 160 (ie, on the upper surface to which the conductive adhesive layers 151 and 152 are bonded). The first unevenness (141a, 142a) serves to increase the surface area where the conductive layers (141, 142) and the conductive adhesive layers (151, 152) are bonded, so that the conductive adhesive layers (151, 152) are strong against the conductive layers (141, 142). Can be combined. In this case, the first irregularities 141a and 142a may have a thickness of 10 to 30 μm.

Meanwhile, an insulating portion 120 separating the pair of electrode portions 131 and 132 may be formed between the pair of conductive layers 141 and 142. The insulating part 120 is a material that does not conduct electricity, and may be formed in the form of a wall that protrudes from one surface of the substrate 110 to separate the pair of electrode parts 131 and 132. At this time, in order to prevent the pair of conductive adhesive layers 151 and 152 from contacting each other, the insulating part 120 has a width of 100 to 150 μm, which is similar to the distance between the pair of electrode layers formed on the lower surface of the LED element 160 And it is to be formed to a thickness of 20 to 40um.

The conductive adhesive layers 151 and 152 are portions to which the LED element 160 is attached to the conductive layers 141 and 142. The conductive adhesive layers 151 and 152 are made of a material that conducts electricity, and may be coupled to the first irregularities 141a and 142a of the conductive layers 141 and 142.

Referring to FIG. 1, the lower surfaces of the conductive adhesive layers 151 and 152 may be coupled to the upper surfaces of the conductive layers 141 and 142 on which the first irregularities 141a and 142a are formed. The LED device 160 may be attached to and coupled to the upper surfaces of the conductive adhesive layers 151 and 152. In particular, the conductive adhesive layers 151 and 152 are combined with the electrodes and the conductive layers 141 and 142 formed on the lower surface of the LED element 160 to electrically connect the two.

In this case, the conductive adhesive layers 151 and 152 may include metal particles, and may be disposed below and around the LED device 160. The metal particles allow the conductive adhesive layers 151 and 152 to conduct electricity and may also reflect light. Accordingly, a portion of the conductive adhesive layers 151 and 152 disposed around the LED element 160 may be a reflective layer that reflects light. That is, a portion of the conductive adhesive layers 151 and 152 interposed between the LED element 160 and the conductive layers 141 and 142 serves as an electrical path, and the portion exposed to the outside of the LED element 160 serves as a reflective layer. can do.

Meanwhile, the conductive adhesive layers 151 and 152 respectively formed on the pair of conductive layers 141 and 142 may be separated from each other by the insulating part 120 described above.

As described above, in the present embodiment, the first irregularities 141a and 142a serve to increase the surface area to which the conductive layers 141 and 142 and the conductive adhesive layers 151 and 152 are bonded, so that the conductive adhesive layers 151 and 152 By firmly bonding to the conductive layers 141 and 142, even when the LED package 100 contracts and expands due to heat emitted from the LED device 160, the conductive adhesive layers 151 and 152 It can prevent separation. In addition, heat generated from the LED device 160 and transferred to the conductive adhesive layers 151 and 152 can be quickly transferred to the substrate 110 through the conductive layers 141 and 142 through a large surface area and radiate heat. Accordingly, it is possible to prevent a phenomenon in which the LED element 160 is deteriorated because heat cannot be radiated to the outside.

The LED package 100 according to the present embodiment may further include a resin part 170 and a lens 180.

The resin part 170 is a part formed on one surface of the substrate 110 to bury the LED element 160 and is made of a resin material through which light is transmitted. The resin part 170 may include a phosphor to change characteristics of light generated from the LED device 160.

The lens 180 is a part that adjusts light generated from the LED element 160 and is installed on a path of light. The lens 180 according to the present embodiment is disposed on the resin portion 170, so that the resin portion 170 and the lens 180 may make surface contact. In this case, the second unevenness 182a is formed on the surface where the resin part 170 and the lens 180 contact each other, so that the bonding force between the resin part 170 and the lens 180 may be increased.

The second unevenness (182a) serves to increase the surface area to which the resin portion 170 and the lens 180 are coupled, thereby firmly coupling the resin portion 170 to the lens 180, Even when the LED package 100 contracts and expands due to heat, the resin part 170 may be prevented from being separated from the lens 180. In particular, it is possible to effectively prevent an interface separation phenomenon that occurs when the resin portion 170 includes a phosphor and the adhesion to the resin portion 170 is lowered. At this time, the second irregularities 182a may have a thickness of 40 to 80 μm.

Referring to FIG. 1, a concave accommodation space 182 in which the LED element 160 is accommodated is formed in the lens 180 of the present embodiment, and a second unevenness 182a may be formed at the bottom of the accommodation space 182. . In addition, the resin part 170 may have a cured form by filling a resin material between the LED element 160 and the accommodation space 182. In this case, since the resin material is also filled between the second irregularities 182a, the resin portion 170 may be firmly coupled to the second irregularities 182a of the lens 180.

2 to 7 are views illustrating a method of manufacturing an LED package according to an embodiment of the present invention.

2 to 7, a method of manufacturing an LED package according to an embodiment of the present invention includes preparing a substrate 110, forming conductive layers 141 and 142, and forming an LED device 160. And combining.

In the step of preparing the substrate 110, the substrate 110 on which the electrode portions 131 and 132 are formed on one surface is prepared. The electrode portions 131 and 132 are formed to supply electricity to the LED element 160.

Referring to FIG. 2, in the substrate 110, a pair of electrode portions 131 and 132 are formed on one surface, and the pair of electrode portions 131 and 132 may be formed of an anode and a cathode.

In addition, in order to effectively dissipate heat emitted from the LED device 160, the substrate 110 may be a substrate 110 made of a metal material. For example, a metal substrate made of aluminum or an aluminum alloy may be used. Specifically, after bonding the insulating sheet to the aluminum plate, the copper foil is attached and etched to form a circuit.

In the step of forming the conductive layers 141 and 142, first irregularities 141a and 142a are formed on the upper surface, and conductive layers 141 and 142 connected to the electrode portions 131 and 132 are formed. The conductive layers 141 and 142 may be formed of a material that conducts electricity, for example, a metal layer. In particular, first irregularities 141a and 142a are formed on upper surfaces of the conductive layers 141 and 142 to which the conductive adhesive layers 151 and 152 are bonded so that the conductive adhesive layers 151 and 152 can be firmly bonded.

Referring to FIG. 2, a pair of conductive layers 141 and 142 according to the present exemplary embodiment may be formed to be connected to each of the pair of electrode portions 131 and 132. In this case, an insulating portion 120 separating the pair of electrode portions 131 and 132 may be formed between the pair of conductive layers 141 and 142. The insulating part 120 is a material that does not conduct electricity, and may be formed in the form of a wall that protrudes from one surface of the substrate 110 to separate the pair of electrode parts 131 and 132.

In the step of bonding the LED element 160, the conductive adhesive layers 151 and 152 are coupled to the first irregularities 141a and 142a, and the LED element 160 is coupled to the conductive adhesive layers 151 and 152. The conductive adhesive layers 151 and 152 are made of a material that conducts electricity, and are coupled to the first irregularities 141a and 142a of the conductive layers 141 and 142.

Referring to FIG. 3, the lower surfaces of the conductive adhesive layers 151 and 152 may be coupled to the upper surfaces of the conductive layers 141 and 142 on which the first irregularities 141a and 142a are formed. In this case, the conductive adhesive layers 151 and 152 formed on the pair of conductive layers 141 and 142, respectively, may be separated from each other by the insulating portion 120 described above.

Next, the LED element 160 may be attached to and coupled to the upper surfaces of the conductive adhesive layers 151 and 152. In this case, the conductive adhesive layers 151 and 152 are coupled to the electrode formed on the lower surface of the LED element 160 and the conductive layers 141 and 142, so that the two can be electrically connected.

The method of manufacturing an LED package according to the present embodiment may further include disposing the lens 180 on the substrate 110.

Referring to FIG. 4, a concave accommodation space 182 in which the LED element 160 is accommodated may be formed in the lens 180.

Referring to FIG. 5, the LED device 160 is covered with a lens 180 so that the LED device 160 is disposed inside the receiving space 182 of the lens 180 so that the lens 180 is disposed on one surface of the substrate 110. Can be placed.

In addition, the method for manufacturing an LED package according to the present embodiment may further include forming the resin part 170. The resin part 170 may be formed by filling and curing a resin material between the LED element 160 and the accommodation space 182.

Referring to FIG. 4, a second unevenness 182a may be formed on the bottom of the receiving space 182 of the lens 180, so that when a resin material is filled between the LED element 160 and the receiving space 182, the second The unevenness 182a may also be filled with a water material.

Referring to FIG. 6, since the resin portion 170 made of the cured resin material is also filled between the second irregularities 182a, the resin portion 170 is firmly attached to the second irregularities 182a of the lens 180. Can be combined.

Referring to FIG. 7, a third unevenness 170a corresponding to the second unevenness 182a of the lens 180 may be formed on the upper surface of the resin part 170. In this embodiment, the second unevenness 182a and the third unevenness 170a may have a structure of a plurality of mountains and valleys formed long in one direction.

In addition, a buried space 172 in which the LED element 160 is buried may be formed on the lower surface of the resin part 170.

In the above, preferred embodiments of the present invention have been described, but those of ordinary skill in the art will add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. Various modifications and changes can be made to the present invention by means of the like, and this will also be said to be included within the scope of the present invention.

100: LED package
110: substrate
120: insulation
131, 132: electrode part
141, 142: conductive layer
141a, 142a: first irregularities
151, 152: conductive adhesive layer
160: LED element
170: resin part
180: lens
182: accommodation space
182a: second irregularities

Claims (8)

A substrate having an electrode portion formed on one surface thereof;
A conductive layer formed on one surface of the substrate to be connected to the electrode portion and having first irregularities formed on an upper surface;
A conductive adhesive layer bonded to the first irregularities of the conductive layer; And
An LED package including an LED (Light Emitting Diode) device coupled to the conductive adhesive layer.
The method of claim 1,
A pair of the electrode portions and a pair of the conductive layers are formed,
An LED package further comprising an insulating portion protruding between the pair of conductive layers on one surface of the substrate.
The method of claim 1,
The conductive adhesive layer includes metal particles, and is disposed below and around the LED device,
An LED package in which a portion of the conductive adhesive layer disposed around the LED element becomes a reflective layer that reflects light.
The method of claim 1,
A resin portion formed on one surface of the substrate to bury the LED device; And
Further comprising a lens disposed on the resin portion and controlling light generated from the LED element,
The resin part and the lens are in surface contact, and the second unevenness is formed on the surface of the resin part and the lens in contact with each other.
The method of claim 4,
A concave accommodation space in which the LED element is accommodated is formed in the lens, and the second unevenness is formed at the bottom of the accommodation space,
The resin part is filled between the LED element and the accommodation space and cured, and the LED package is combined with the second irregularities.
Preparing a substrate having an electrode portion formed on one surface thereof;
Forming a conductive layer having first irregularities formed on an upper surface and connected to the electrode portion; And
And bonding a conductive adhesive layer to the first irregularities and bonding an LED device to the conductive adhesive layer.
The method of claim 6,
The method of manufacturing an LED package further comprising the step of disposing a lens having a concave accommodation space in which the LED element is accommodated on one surface of the substrate.
The method of claim 7,
A second unevenness is formed at the bottom of the receiving space of the lens,
An LED package manufacturing method further comprising the step of forming a resin portion by filling and curing a resin material between the LED element and the accommodation space.

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