KR20200070672A - Substrate process system and method for transfering substrates - Google Patents

Abstract

The present invention relates to a substrate processing system, and more particularly, to a substrate transfer method for transferring a substrate on a substrate processing system. The substrate processing system of the present invention comprises: a substrate processing module (100) including a processing space (S) for processing a substrate, a process chamber (110) for forming a gate (112) through which a substrate (1) is introduced or unloaded, and a substrate support unit (120) installed in the processing space (S) to support the substrate (1); a conveying module (200) including a conveying chamber (220) to which the process chamber (110) is coupled, and a conveying robot (210) which is installed in the conveying chamber (220) to convey the substrate (1) to the substrate support unit (120) in the process chamber (110) through the gate (112); and a control unit for controlling movement of the conveying robot (210) for conveying the substrate (1) between the substrate processing module (100) and the conveying module (200). The substrate processing module (100) includes a substrate position sensing unit (300) including a plurality of sensor units (310) for sensing a horizontal position at an unloading height of the substrate (1) when the substrate (1), in which the substrate processing is completed, is unloaded from the process chamber (110). When a substrate sensing signal is input from the substrate position sensing unit (300), the control unit corrects an entry path of the conveying robot (210) entering the process chamber (110) to unload the substrate (1). According to the present invention, stable substrate transfer can be performed by correcting the trajectory of the conveying robot.

Description

Substrate process system and method for transfering substrates

The present invention relates to a substrate processing system, and more particularly, to a substrate transfer method for transferring a substrate on the substrate processing system.

In general, substrates used for semiconductors, displays, etc. are manufactured through various processes such as thin film deposition and etching. To this end, a plurality of process chambers are combined in one transport module, and the substrate is processed through a transport robot installed in the transport module. By transferring to the chambers, substrate transfer is achieved.

On the other hand, in recent years, in a trend that the process for substrate processing is complicated, the process under a high temperature environment and the process for a long time are increasing, thereby causing a problem that the substrate supported by the substrate support is not positioned at the correct position on the substrate support, but is distorted.

In addition, for the substrate processing of the substrate seated on the substrate support, the lifting support of the substrate support is accompanied, so that the substrate seated in the elevating process is distorted or the substrate is distorted in the dechucking process in which the substrate support and the substrate are separated. there was.

On the other hand, if the substrate is not positioned at the correct position on the substrate support and is displaced, the substrate cannot be positioned at the center of the transfer robot, which may cause physical collisions with various valves, chambers, etc. There is a problem.

Furthermore, when the substrate is excessively twisted beyond a certain range of the transfer robot, the operation of the substrate processing system must be stopped and the entire substrate processing system must be inspected and manually operated to prevent damage to the substrate. There is a problem of deterioration.

To overcome this, the invention of correcting the trajectory of the carrier robot by determining the degree of distortion of the wafer has been disclosed, but in this case, the orbit of the carrier robot is corrected only at the initial setup of the equipment, and the orbit of the carrier robot in real time in the process Because it is not corrected, there is a problem that it is difficult to respond to individual substrates.

In order to solve the above problems, an object of the present invention is to provide a substrate processing system and a substrate transfer method capable of stable substrate transfer by correcting the trajectory of the transfer robot by measuring the distortion of the substrate located inside the process chamber.

The present invention was created to achieve the object of the present invention as described above, the present invention, the process space for forming a substrate (S), and the process of forming a gate 112 through which the substrate 1 is introduced or exported A substrate processing module 100 including a chamber 110 and a substrate support 120 installed in the processing space S and supporting the substrate 1; The substrate 1 to the substrate support 120 in the process chamber 110 through the gate 112 and the transport chamber 220 to which the process chamber 110 is coupled, and installed in the transport chamber 220 ) A transport module 200 including a transport robot 210 for transporting; It includes a control unit for controlling the movement of the transport robot 210 for transferring the substrate 1 between the substrate processing module 100 and the transport module 200, the substrate processing module 100, the process When carrying out the substrate 1 in which the substrate processing is completed in the chamber 110, the substrate position detecting unit 300 including a plurality of sensor units 310 that sense a horizontal position at the carrying height of the substrate 1 Includes, the control unit, when the substrate detection signal is input from the substrate position detecting unit 300, the entry of the transfer robot 210 entering the process chamber 110 to take out the substrate 1 Disclosed is a substrate processing system for correcting a path.

Further comprising a substrate seating position detection unit 400 for detecting a seating position seated on the transport robot 210 of the substrate 1 transferred through a sensor installed on the gate of the transport module 200 Can be.

When the seating position on the transport robot 210 of the board 1 sensed by the board seating position detecting unit 400 is out of a preset range, an alarm may occur.

The control unit, when the transport robot 210 to take out the substrate (1) from the process chamber 110, the transport path of the transport robot 210 is corrected to the entry path corrected to be the same as the entry path before correction It can be reverse calibrated.

The plurality of sensor parts 310 may be installed in at least three places around the process chamber 110 corresponding to the carrying height of the substrate 1.

The plurality of sensor units 310 may have a cross angle of each irradiation light of neighboring sensor units 310 of 60 degrees.

Each of the plurality of sensor units 310 may have a cross angle of each irradiation light of neighboring sensor units 310 of 90 degrees.

The plurality of sensor units 310 include a pair of sensors each including a light emitting unit and a light receiving unit, and the control unit receives a detection signal of the substrate 1 from at least one of the pair of sensors. When it does, the entry route of the transport robot 210 may be corrected to a preset setting route.

The plurality of sensor units 310 include a pair of sensors each including a light-emitting unit and a light-receiving unit and spaced apart from each other, and the control unit is inputted from the plurality of sensor units 310. The horizontal position of the substrate 1 to be taken out may be calculated using the detection signal of the substrate 1, and the entry path of the transport robot 210 may be corrected based on the calculated location information.

In addition, the present invention is a substrate transfer method of a substrate processing apparatus, in order to take out the substrate 1, a substrate raising step (S100) of raising the substrate 1 to a carrying height; A substrate position sensing step (S200) of sensing the horizontal position of the substrate 1 raised to the carrying height; Entry step of correcting the entry path of the transfer robot 210 entering the process chamber 110 according to the horizontal position detection signal of the substrate 1, and entering the corrected entry path of the transfer robot 210 Disclosed is a substrate transfer method including (S300).

After the entry step (S300), the return path of the transport robot 210 is reversely corrected by the entry path corrected to be the same as the entry path before the correction through the entry step (S300), from the process chamber 110. A carrying out step (S400) for carrying out the substrate 1 may be included.

After the carrying out step (S400), through the substrate seating position detecting unit 400 installed on the gate of the transfer module 200, the seating position seated on the transfer robot 210 of the substrate 1 The sensing substrate sensing position sensing step (S500) may be included.

In the step S500 of detecting the substrate seating position, when the seating position of the board 1 is outside a preset range, the driving of the transport robot 210 may be stopped, and an alarm may be generated.

The substrate position detection step (S200), the light emitting unit and the light receiving unit, each of the plurality of sensor units consisting of a pair of sensors 310, through at least one of the light blocking whether the substrate 1 Position detection, the entry step (S300), in accordance with the detection signal input of the substrate (1) through the substrate position detection step (S200), the entry path of the carrier robot 210 is a preset path Can be corrected.

The substrate position sensing step (S200), each of which includes a light emitting unit and a light receiving unit, and at least one of the plurality of sensor units 310 composed of a pair of sensors spaced apart from each other are blocked. The horizontal position of the substrate 1 to be taken out is calculated through, and the entry step (S300) is based on the position information calculated through the substrate position detection step (S200). Can be corrected.

The substrate processing system and the substrate transfer method according to the present invention have an advantage of stably transferring the substrate through the transportation robot by correcting the entry path of the transportation robot by grasping the distortion information of the substrate in the process chamber.

In addition, the substrate processing system and the substrate transfer method according to the present invention, by first correcting the entry path of the transportation robot by grasping the misalignment information of the substrate in the process chamber, the number of equipment stops due to the automatic correction device installed on the side of the transportation chamber It has the advantage of decreasing productivity.

In addition, the substrate processing system and the substrate transfer method according to the present invention, there is an advantage of reducing the occurrence of particles due to abnormal contact with the transport robot due to the substrate distortion, by stably transporting the substrate by correcting the entry path of the transport robot.

1 is a conceptual diagram showing a schematic view of a substrate processing system according to the present invention.
2 is a cross-sectional view showing a state of the substrate processing system according to FIG. 1.
3 is a plan view of a state in which the upper portion of the process chamber is removed in order to show the state of the substrate position detecting unit in the substrate processing system according to FIG. 1.
4A and 4B are plan views showing a state in which a transport robot enters a corrected entry path according to a substrate that is displaced in a process chamber of the substrate processing system according to FIG. 1.
5 is a front view showing a state of the substrate seating position detecting unit in the substrate processing system according to FIG. 1.
6 is a flow chart showing a substrate transfer method of the substrate processing system according to FIG. 1.
7A and 7B are flowcharts illustrating an embodiment of each entry step in the substrate transfer method of the substrate processing system according to FIG. 6.
8 is a flow chart showing a substrate seating position detection step of the substrate transfer method of the substrate processing system according to FIG. 6.

Hereinafter, a substrate processing system and a substrate transfer method according to the present invention will be described with reference to the accompanying drawings.

In the substrate processing system according to the present invention, as shown in FIGS. 1 to 5, a processing chamber (S) for processing a substrate and a process chamber for forming a gate 112 through which the substrate 1 is introduced or removed ( 110) and a substrate processing module 100 including a substrate support 120 installed in the processing space S and supporting the substrate 1; The substrate 1 to the substrate support 120 in the process chamber 110 through the gate 112 and the transport chamber 220 to which the process chamber 110 is coupled, and installed in the transport chamber 220 ) A transport module 200 including a transport robot 210 for transporting; It includes a control unit for controlling the movement of the transport robot 210 for transferring the substrate 1 between the substrate processing module 100 and the transport module 200, the substrate processing module 100, the process When carrying out the substrate 1 in which the substrate processing is completed in the chamber 110, the substrate position detecting unit 300 including a plurality of sensor units 310 that sense a horizontal position at the carrying height of the substrate 1 Includes, the control unit, when the substrate detection signal is input from the substrate position detecting unit 300, the entry of the transfer robot 210 entering the process chamber 110 to take out the substrate 1 Correct the path.

In addition, the substrate processing system according to the present invention, as shown in Figures 1 and 2, is installed between the process chamber 110 and the transfer chamber 220, to form a transfer path of the substrate 1, the substrate For the transfer of (1), it may include a gate valve 500 for opening and closing the gate 112 of the process chamber 110.

In addition, the substrate processing system according to the present invention, a substrate seating position detecting unit for detecting a seating position seated on the transport robot 210 of the board 1 transferred through a sensor installed at the gate of the transport module 200 ( 400) may be further included.

Here, the substrate 1 is a structure in which substrate processing such as deposition and etching is performed, and any substrate such as a semiconductor manufacturing substrate, an LCD manufacturing substrate, an OLED manufacturing substrate, a solar cell manufacturing substrate, and a transparent glass substrate may be used.

The substrate processing module 100 is a configuration in which substrate processing is performed on the substrate 1, and various configurations are possible.

For example, the substrate processing module 100 includes a process chamber 110 for forming a processing space S for processing a substrate, and a substrate support unit installed in the processing space S to support the substrate 1 ( 120).

In addition, the substrate processing module 100 may be subjected to a substrate processing process under various conditions, for example, substrate processing such as CVD and ALD may be performed.

In addition, the substrate processing module 100 is provided with a plurality of the transport module 200, it is also possible to process a plurality of substrates (1) for a variety of processes at the same time.

The process chamber 110 is configured to form a processing space S for processing a substrate, and various configurations are possible.

In the process chamber 110, a gate 112 may be formed on the sidewall so that the substrate 1 can be introduced or removed from the transfer chamber 220 through the transfer robot 210.

In addition, the process chamber 110, in order to obtain the position information of the substrate 1 through the substrate position detecting unit 300 to be described later, the viewport 111 may be formed on at least one of the top, bottom or side surfaces. .

The substrate support unit 120 is installed in the processing space S of the process chamber 110 and supports the substrate 1, and various configurations are possible.

For example, the substrate support unit 120 may be provided with a heater unit for a substrate processing process performed in a high temperature environment, or may be composed of a heater itself.

In addition, the substrate support unit 120 may include an electrostatic chuck, a vacuum chuck, and the like to fix and secure the substrate 1 to the substrate mounting surface, through which the substrate 1 is subjected to a substrate processing process or substrate processing. In the lifting process for can be fixed to the substrate support 120 to be seated.

On the other hand, in this case, the transfer of the substrate 1 is accompanied by a dechucking process in which the substrate 1 is separated from the substrate support 120, and the substrate 1 is supported in place from the substrate support 120. It does not, there is a problem that is supported by deviating from the fixed position.

The substrate support part 120 supports a lift pin 130 for supporting the substrate 1 spaced apart from the substrate support for the transfer of the substrate 1 through the substrate 1 transfer to the transport robot 210. It may further include.

The lift pin 130 supports the substrate 1 by being spaced apart from the substrate support 120 through elevation, whereby the transfer robot 210 enters between the substrate 1 and the substrate support 120 to enter the substrate 1 ) Can be placed on the transfer robot 210.

In this case, at least three lift pins 130 may be provided to support the more stable substrate 1, and when the substrate 1 is not positioned at the correct position of the substrate support 120, but is distorted, Even in a situation supported by the lift pin 130, the substrate 1 is not positioned in the correct position and is displaced.

The transport module 200 is a configuration for transporting the substrate 1 in the substrate processing system, and various configurations are possible.

That is, the transfer module 200 is located in the middle of a plurality of substrate processing modules 100, the substrate 1 is introduced into or taken out of each process chamber 110 or the substrate 1 of the substrate processing system The substrate 1 can be transferred between the load lock chambers 10.

For example, the transfer module 200 is a substrate (1) to the transfer chamber 220, the process chamber 110 is coupled, and is installed in the transfer chamber 220, the substrate support 120 in the process chamber 110 ) May include a transport robot 210 for transporting.

Thus, the transfer module 200 can transfer the substrate 1 between the plurality of process chambers 110 and between the load lock chamber 10 and the process chamber 110.

The transport chamber 220 is a configuration in which the process chamber 110 is coupled, and may be a configuration in which the transport robot 210 is installed.

Meanwhile, the transfer chamber 220 may include a plurality of gates 221 for exchanging the substrate 1 with the process chambers 110 and the load lock chamber 10, and each gate 221 will be described later. The substrate seating position detecting unit 400 may be installed.

The transport robot 210 is installed in the transport chamber 220 to transport the substrate 1 to the substrate support 120 in the process chamber 110, and various configurations are possible.

For example, the transfer robot 210, the end effector 211 is seated for the substrate 1 to be transferred, and the substrate 1 is seated on the end effector 211 is contracted or extended in the horizontal direction The robot arm part 212 and the robot arm part 212 for transferring to a position are combined to set the trajectory of the robot arm part 212 through rotation, the robot arm part 212 and the robot body 213 ) May include an elevator driving unit for moving upward and downward for moving in the vertical direction.

More specifically, the end effector 211 may support a part of the bottom surface of the substrate 1 through a plurality of fingers formed spaced apart from each other so that the substrate 1 can be stably seated. In order to prevent slippage during the transfer process of the substrate 1 and minimize the contact area with the bottom surface of the substrate 1, an anti-slip member may be additionally installed on the upper surface.

The robot arm portion 212, one or more links are formed so as to be contracted or stretched in the horizontal direction, it is possible to transfer the end effector 211 a desired distance.

In particular, the robot arm 212, the transfer path of the substrate 1 may be determined according to the robot body 213, preferably the center of the gate 112, 221 of the transfer chamber 220 and the process chamber 110 It can be set to pass.

That is, the robot arm 212, the center of the substrate 1 when the substrate 1 is taken out of the process chamber 110 or introduced into the process chamber 110 according to the elongation or contraction, the gate 112 It can be set to pass through the center of.

The robot body 213, as a base of the transport robot 210, may be installed in a central portion in the transport chamber 220, and may be driven so that the robot arm 212 can rotate.

Meanwhile, the transport robot 210 may be provided with a pair of robot arm parts 212, and the pair of robot arm parts 212 may be provided to be vertically overlapped.

The gate valve 500 is a configuration that serves as a passage for the transfer of the substrate 1 between the substrate processing module 100 and the transport module 200, and various configurations are possible.

For example, the gate valve 500 includes a valve body 510 and a valve body (between the gate 112 formed in the process chamber 110 and the gate 221 formed in the transfer chamber 220). By opening or closing the opening formed in 510 through horizontal movement or vertical movement, the blade 520 that opens and closes the valve and the rod 530 connected to the driving unit to move the blade 520 in the vertical or horizontal direction. It may include.

The substrate position detecting unit 300 is a configuration for determining whether or not the substrate 1 supported by the substrate support unit 120 is in the correct position, and various configurations are possible.

The substrate position detecting unit 300, when carrying out the substrate 1, the substrate processing is completed in the process chamber 110, a plurality of sensor units 310 for sensing the horizontal position at the carrying height of the substrate 1 It can contain.

That is, the substrate position detecting unit 300 is a configuration for determining whether or not the substrate 1 in the fixed position of the substrate 1 in a state supported by the lift pin 130 of the substrate supporting unit 120, the substrate (1) The position of the substrate 1 may be determined by measuring the position of, and simply the presence or absence of the substrate 1 may be determined.

For example, the substrate position detecting unit 300, as a first embodiment, determines whether the substrate 1 is in the correct position by measuring the position of the substrate 1 supported by the substrate supporting unit 120. In this case, an accurate position in a state supported by the substrate support 120 of the substrate 1 may be measured using a vision camera installed at the top of the process chamber 110.

More specifically, by using a vision camera installed on top of the process chamber 110, a part of the substrate 1, in particular, the edge portion is photographed, and compared to a predetermined position of the substrate 1, the substrate 1 Support position on the substrate support 120 of the can be measured.

In this case, since it is possible to accurately measure the position of the substrate 1, by correcting the trajectory of the transport robot 210 by the position variation value of the substrate 1 through the control unit 500 to be described later, the substrate 1 is transported by the transport robot The end effector 211 of 210 may be seated in the center.

At this time, the controller compares a part of the substrate 1 photographed through the vision camera with the correct position of the substrate 1, and the center of gravity C1 of the substrate 1 and the center of gravity of the wrong substrate 1 (C2) ), the trajectory of the transport robot 210 can be corrected by the positional change value d1.

On the other hand, the substrate position detecting unit 300, as a second embodiment, may determine whether the substrate 1 is in the correct position through whether the optical sensor is blocked using an optical sensor.

In this case, although the exact position of the substrate 1 cannot be determined, the wrong direction and position range of the substrate 1 can be grasped through a plurality of optical sensors, and the relatively simple sensor members allow It has the advantage of being able to locate location information.

For example, the substrate position detecting unit 300 includes a plurality of sensor units 310 installed so that the optical path of the irradiated light is spaced a predetermined distance in a horizontal direction from a fixed position of the substrate 1, and irradiated It is possible to determine whether or not the substrate 1 is in the correct position through the blocking of light.

In addition, the substrate position detecting unit 300 further includes a plurality of reflective members 320 installed at positions opposite to the plurality of sensor units 310 according to types of the plurality of sensor units 310. Can be.

The plurality of sensor units 310 may include light-emitting sensors and light-receiving sensors that receive irradiation light irradiated by the light-emitting sensors.

In this case, the plurality of sensor units 310 are installed so that irradiated light penetrates the inside of the process chamber 110 or outside the process chamber 110 or the process chamber 110 so that each light emitting sensor and the light receiving sensor face each other. Can be.

For example, the plurality of sensor units 310 are installed in the viewport 111 formed on at least one of the upper, lower, and side surfaces of the process chamber 110, or irradiated light from the outside of the process chamber 110. It may be installed to penetrate the interior of the process chamber 110 through the viewport 111.

The plurality of sensor parts 310 are installed to penetrate the inside of the process chamber 110 through the viewport 111, and more specifically, a predetermined distance in which the optical path of the irradiated light is set in the horizontal direction from the fixed position of the substrate 1 As much as possible.

Through this, the optical path of the irradiated light emitted through the light emitting sensor is formed to be spaced apart in a horizontal direction by a predetermined distance from a fixed position of the substrate 1, and when the substrate 1 is deviated without being positioned at a fixed position, the substrate Since the irradiated light is blocked by (1) and the irradiated light is not received by the light-receiving sensor, it is possible to determine whether or not the substrate 1 has deviated from the correct position through the light-receiving light.

On the other hand, as another example, by installing the sensor unit 310 capable of emitting and receiving light outside the viewport 111 or the process chamber 110 formed in the process chamber 110, the irradiated light passes through the process chamber through the viewport 111. (110) can be irradiated therein, and the reflective member 320 is installed on the opposite surface of the sensor unit 310, so that the position of the substrate 1 is received or not as the received light of the irradiated light irradiated through the sensor unit 310. Can determine whether

The plurality of sensor units 310 and the plurality of reflective members 320 may be installed on the outer upper, lower, and side surfaces of the process chamber 110, and more preferably, on a plurality of side surfaces of the process chamber 110. Can be installed.

More specifically, the plurality of sensor parts 310 may be respectively installed in at least three places around the process chamber 110 corresponding to the carrying height of the substrate 1.

In addition, when the plurality of sensor units 310 and the plurality of reflective members 320 are installed on the side of the process chamber 110, a gate 112 may be formed on the opposite surface, so a part of the gate valve It may be installed on the blade 520 surface to close the opening of the (500).

The plurality of sensor units 310 are installed so that each of the irradiated light paths are spaced apart from each other, and thus it is possible to determine the degree of departure from the fixed position of the substrate 1 through each irradiated light blocking or not. .

For example, the plurality of sensor parts 310 are installed such that the fixed position of the substrate 1 on a plane is located inside a rectangle formed by four light paths as a reference, thereby defining the substrate 1 Whether it deviates from the position and the direction can be grasped together.

In addition, by installing a plurality of sensor units 310 so that irradiated light paths irradiated to one side from a fixed position of the substrate 1 are formed at a distance from each other, the degree of deviation from the fixed position of the substrate 1 may be determined. have.

More specifically, the sensor unit 310 is installed so that the optical path is formed spaced apart from the edge of the substrate 1, and a plurality of sensor units 310 are formed such that different optical paths are formed at intervals from the optical path. By sequentially installing them, it is possible to grasp the deviation range from the correct position of the substrate 1 through the distance to the optical path of the outermost sensor unit 310, which is irradiated.

In this case, as the separation distance of the plurality of sensor units 310 is narrowed, the deviation range from the fixed position of the substrate 1 can be narrowed, so that the position of the substrate 1 can be grasped more precisely.

For example, when the optical path of the shortest distance from the fixed position of the substrate 1 is spaced 1 mm and the separation distance between the optical paths is 1 mm, the deviation range from the fixed position of the substrate 1 within the 1 mm error range Can grasp.

On the other hand, the plurality of sensor units 310, each of the irradiated light crossing angle of the sensor unit 310 may be 60 degrees or 90 degrees.

The substrate seating position detecting unit 400 is configured to measure the position of the substrate 1 transferred through the transport robot 210, and various configurations are possible.

For example, the substrate seating position detecting unit 400 includes a plurality of light emitting sensors 410 installed on one side of the top and bottom of the path through which the substrate 1 is transferred, and the other side of the top and bottom of the path through which the substrate 1 is transferred. It may include a plurality of light-receiving sensors 420 installed opposite to the plurality of light-emitting sensors 410 in.

Accordingly, the substrate seating position detecting unit 400 measures the light transmission conversion state when passing between the plurality of light emitting sensors 410 and the plurality of light receiving sensors 420 of the substrate 1 to position the substrate 1 Can be measured.

That is, the substrate seating position detecting unit 400 may be a part of active wafer centering (AWC) for correcting distortion when the substrate 1 is distorted and transferred outside a predetermined trajectory.

The substrate seating position detecting unit 400 is applicable to any type of AWC system disclosed in the prior art, and the plurality of light emitting sensors 410 and the plurality of light receiving sensors 420 are gates 221 of the transfer chamber 220. It may be installed on, it may be installed on the upper and lower surfaces of the transfer chamber 220 side of the gate valve 500 as another example.

In addition, the substrate seating position detecting unit 400, within the radius length of the substrate 1 from the center of the gate 221, respectively, in order to determine by measuring the light transmission conversion state whether the substrate 1 is transported at a fixed position, respectively Can be installed.

On the other hand, in this case, in order to accurately grasp the center coordinates of the distorted substrate 1, the light emitting sensors 410 installed on both sides based on the center of the horizontal side of the gate 221 may be installed to have different separation distances. .

The control unit corrects an entry path of the transfer robot 210 to the substrate support unit 120 according to the position of the substrate 1 through the substrate position detection unit 300, and transfers it through the transfer robot 210 As a configuration for correcting the transport path of the transport robot 210 according to the measurement position of the substrate 1, various configurations are possible.

The control unit may receive a signal according to the position of the substrate 1 through the substrate position detecting unit 300 to correct the entry path of the transport robot 210 to the substrate support unit 120.

In addition, after the substrate 1 is seated on the carrier robot 210 that has entered the modified entry path, the control unit can unload the substrate 1 by re-correcting the export path as much as the modified value so that it is exported to the normal track. have.

In addition, the control unit may correct the transport path of the transport robot 210 according to the measurement position of the substrate 1 transferred through the transport robot 210.

In this case, the control unit receives the wrong degree according to the measured value of the substrate seating position detecting unit 400 of the substrate 1 transferred through the transport robot 210, calculates the coordinates of the variation, and calculates the variable coordinates of the transport robot 210. Correct the transfer path.

On the other hand, the control unit, when the degree of misalignment according to the measured value of the substrate seating position detecting unit 400 of the substrate 1 transferred through the transport robot 210 is outside a preset range, damage due to physical collision of the substrate 1 In order to prevent the operation of the transport robot 210 and the substrate processing system may be emergencyly stopped, and an alarm may be turned on.

At this time, the preset range may be set to a maximum range in which the degree of misalignment of the substrate 1 does not interfere with the internal spaces of the process chamber 110 and the transfer chamber 220.

Hereinafter, a substrate transfer method of the substrate processing system according to the present invention will be described with reference to the accompanying drawings.

The substrate transfer method according to the present invention, as shown in Figures 6 to 8, in order to take out the substrate (1), the substrate rising step (S100) of raising the substrate 1 to the carrying height; A substrate position sensing step (S200) of sensing the horizontal position of the substrate 1 raised to the carrying height; Entry step of correcting the entry path of the transfer robot 210 entering the process chamber 110 according to the horizontal position detection signal of the substrate 1, and entering the corrected entry path of the transfer robot 210 (S300).

In addition, the substrate transfer method, after the entry step (S300), the return path of the transport robot 210 is corrected to the same as the entry path corrected to be the same as the entry path before correction through the entry step (S300), And a carrying-out step (S400) for carrying out the substrate 1 from the process chamber 110.

In addition, the substrate transfer method, after the carrying out step (S400), through the substrate seating position detection unit 400 installed on the gate of the transfer module 200, the transfer robot 210 of the substrate 1 It includes a substrate seating position sensing step (S500) for sensing the seating position seated on the image.

The substrate raising step S100 is a step of raising the substrate 1 to a carrying height in order to carry out the substrate 1, and may be performed by various methods.

For example, in the step of raising the substrate (S100), the substrate 1 may be spaced apart from the substrate support 120 to a carrying height by using a lift pin, through which the transfer robot 210 can move the substrate 1 ) And the substrate support unit 120 to enter the substrate 1.

The substrate position detecting step (S200) is a step of determining whether a position of the substrate 1 supported by the substrate supporter 120 through the substrate position detecting unit 300 is in a correct position, and can be performed by various methods.

When it is determined that the substrate 1 is supported on the substrate support part 120 through the substrate position detecting step S200, correction of the entry path of the transport robot 210 in the entry step S300, which will be described later, will be omitted. Can be.

More specifically, if the substrate position detecting step (S200) determines whether the substrate 1 is in the correct position by measuring the correct position of the substrate 1, if it is determined that the substrate 1 is in the correct position, it enters. The step of correcting the entry path of the transport robot 210 in step S300 and the step of detecting the substrate seating position S500 may be omitted.

However, more preferably, in order to confirm the misalignment in the transfer process by the transport robot 210 of the substrate 1, it is measured that the substrate 1 is present in the correct position through the substrate position sensing step (S200). Edo may be subjected to the substrate seating position detection step (S500).

On the other hand, when it is determined that the substrate 1 is deviated from the predetermined position of the substrate support unit 120 through the substrate position detecting step S200, an entry step S300 may be performed.

The entry step (S300) is a step of correcting the entry path of the transport robot 210, and may be performed by various methods.

As an example, the entry step (S300), the first position for calculating the first position change value from the fixed position of the substrate 1 based on the position of the substrate 1 measured through the substrate position detecting unit 300 It may include a variable value calculating step (S310) and a path correction step (S320) for correcting the entry path of the transport robot 210 based on the calculated first position variation value.

That is, by measuring the position of the substrate 1 supported by the substrate support unit 120 through the substrate position detecting step (S200), the first position change value is calculated, and the transport robot is based on the calculated first position change value ( 210) can be corrected.

On the other hand, in this case, in the path correction step (S320), if the first position variation value is within a preset first maximum variation value, the entry path of the transport robot 310 is corrected by the first position variation value, and the first When the position variation value exceeds the first maximum variation value, the entry path of the transport robot 310 may be corrected by the first maximum variation value.

This is because the size of the gate 112 of the process chamber 110 is limited by the transport robot 310, and the transport robot 210 is based on the first maximum fluctuation value set to enter the process chamber 110. The correction of the entry path can be different.

On the other hand, as another example of the entry step (S300), the substrate position detection step (S200) determines whether or not the departure from the fixed position of the substrate 1 through whether or not to block the irradiation light of each of the plurality of sensor units (310). In the case, a separation distance deriving step (S330) of deriving a separation distance from a fixed position of the substrate 1 of the outermost irradiation light among the at least one blocked light; It may include an entry path correction step (S340) for correcting the entry path of the carrier robot 210 by the derived separation distance.

The separation distance deriving step (S330) is a step of deriving the separation distance from the fixed position of the substrate 1 of the outermost irradiation light among at least one of the blocked light, it may be by a variety of methods.

That is, in the separation distance deriving step (S330), the shortest distance from the fixed position of the substrate 1 to the optical path of the outermost irradiated light from which the irradiation light is blocked can be derived, and more specifically, the optical path is spaced 1 mm apart. It is confirmed that the N-th sensor unit 310 of the plurality of sensor units 310 sequentially installed from the fixed position of the substrate 1 is formed so as to be formed, and the N+1-th sensor unit 310 is not blocked. If it is, the substrate 1 can be considered to be displaced by N+1 mm from N from the fixed position.

Thus, it is possible to correct the entry path by N mm by deriving the N mm as a separation distance and performing an entry path correction step (S340).

On the other hand, the entry path correction step (S340), it is possible to correct the entry path of the carrier robot 210 by the separation distance derived through the above-described separation distance deriving step (S330).

The export step (S400), the entry path (S300) and the substrate seating position detection step (S500) between the transfer path of the transport robot 210, the entry path (S300) is corrected to the same entry path before correction As the step of carrying out the reverse correction by the path and taking out the substrate 1, it can be performed by various methods.

The carrying-out step (S400), by carrying out the substrate (1) to the entry path before the correction through the entry step (S300), after the entry step (S300) of the substrate seating position detection step (S500) of the transport robot 210 The correction range of the transfer path can be reduced.

The substrate seating position detecting step (S500) is a step of measuring the position of the substrate 1 transferred through the transfer robot 210 by the board seating position detecting unit 400 after the entry step (S300), It can be done in various ways.

That is, in the substrate seating position detecting step (S500), unlike the boarding position detecting step (S200), by measuring the position of the substrate 1, the substrate 1 is displaced from the predetermined position on the transport robot 210 by digitization. Can be measured.

On the other hand, in this case, if it is determined that the substrate 1 is positioned in the correct position through the substrate seating position detecting step (S500), the correction may be ended as it is.

The substrate seating position detecting step (S500) calculates a second position shift value for calculating the second position shift value of the substrate 1 based on the position of the board 1 detected through the board seat position detecting unit 400. Step (S510) and, based on the calculated second position change value may include a transfer path correction step (S520) for correcting the transfer path of the transfer robot 210.

In the second position variation value calculation step (S510), in order to correct the transfer path of the transfer robot 210, the second position variation value may be calculated as the degree to which the substrate 1 is distorted from a predetermined path.

In the transfer path correction step (S520), when the second position variation value is within a preset second maximum variation value, the transfer path of the transfer robot 210 is corrected by the second position variation value, and the second position variation When the value exceeds the second maximum fluctuation value, as a step of stopping the operation of the transport robot 210 through the control unit 500, it can be by a variety of methods.

In this case, the transfer path of the transfer robot 210 should be changed under the space in the transfer chamber 220. If excessively wrong, the transfer path of the transfer robot 210 may be out of the changeable range, and the second maximum fluctuation value This can be set in advance.

Therefore, when the second position fluctuation value is within the second maximum fluctuation value based on the second maximum fluctuation value, the transfer path of the conveying robot 210 is corrected by the second position fluctuation value, and the second position fluctuation value is second. 2 If the maximum fluctuation value is exceeded, there is a risk of damage to the substrate 1, so that the operation of the substrate processing system including the transport robot 210 can be stopped and an alarm can be turned on through the control unit.

The above is only a description of some of the preferred embodiments that can be implemented by the present invention, and as is well known, the scope of the present invention should not be construed as being limited to the above embodiments, and the present invention described above. It will be said that the technical idea and the technical idea together with the fundamental are all included in the scope of the present invention.

1: Substrate 100: Substrate processing module
200: transfer module 300: board position detection unit
400: substrate seating position detecting unit 500: gate valve

Claims (15)

The processing space S for processing the substrate, the process chamber 110 forming the gate 112 through which the substrate 1 is introduced or removed, and the processing space S are installed in the substrate S to support the substrate 1 A substrate processing module 100 including a substrate support 120 to be;
The substrate 1 to the substrate support 120 in the process chamber 110 through the gate 112 and the transport chamber 220 to which the process chamber 110 is coupled, and installed in the transport chamber 220 ) A transport module 200 including a transport robot 210 for transporting;
It includes a control unit for controlling the movement of the transfer robot 210 for transferring the substrate 1 between the substrate processing module 100 and the transfer module 200,
The substrate processing module 100,
When the substrate 1, which has been processed by the substrate in the process chamber 110, is carried out, the substrate position detecting unit (S) including a plurality of sensor units 310 that sense a horizontal position at the carrying height of the substrate 1 ( 300),
The control unit,
When the substrate detection signal is input from the substrate position detecting unit 300, it is characterized in that to correct the entry path of the transport robot 210 entering the process chamber 110 in order to take out the substrate 1 Substrate processing system. The method according to claim 1,
Further comprising a substrate seating position detecting unit 400 for detecting a seating position seated on the transport robot 210 of the substrate 1 transferred through a sensor installed at the gate of the transport module 200 Characterized in that the substrate processing system. The method according to claim 2,
A substrate processing system characterized in that an alarm is generated when the seating position on the transfer robot 210 of the board 1 sensed by the board seating position detecting unit 400 is outside a preset range. The method according to claim 1,
The control unit,
When the transport robot 210 takes out the substrate 1 from the process chamber 110, it is possible to reverse-compensate by the corrected access route such that the transport route of the transport robot 210 is the same as the pre-calibration access route. Characterized by a substrate processing system. The method according to claim 1,
The plurality of sensor units 310,
A substrate processing system characterized in that it is installed in at least three places around the process chamber 110 corresponding to the carrying height of the substrate (1). The method according to claim 1,
The plurality of sensor units 310,
Substrate processing system characterized in that the cross angle of each irradiation light of the adjacent sensor unit 310 is 60 degrees. The method according to claim 1,
The plurality of sensor units 310,
Substrate processing system characterized in that the cross angle of each irradiation light of the adjacent sensor unit 310 is 90 degrees. The method according to claim 1,
The plurality of sensor units 310,
Each of which includes a pair of sensors including a light emitting portion and a light receiving portion,
The control unit,
When the detection signal of the substrate (1) is input from at least one of the pair of sensors, the substrate processing system, characterized in that for correcting the entry path of the carrier robot 210 to a preset path. The method according to claim 1,
The plurality of sensor units 310,
Each includes a light emitting unit and a light receiving unit, and includes a pair of sensors installed at a predetermined distance from each other,
The control unit,
The horizontal position of the substrate 1 to be taken out is calculated by using the detection signal of the substrate 1 input from the plurality of sensor units 310, and based on the calculated location information, the transfer robot 210 A substrate processing system characterized by correcting an entry path. A substrate transfer method of a substrate processing apparatus according to any one of claims 1 to 9,
A substrate raising step (S100) of raising the substrate 1 to a carrying height in order to carry out the substrate 1;
A substrate position sensing step (S200) of sensing the horizontal position of the substrate 1 raised to the carrying height;
Entry step of correcting the entry path of the transfer robot 210 entering the process chamber 110 according to the horizontal position detection signal of the substrate 1, and entering the corrected entry path of the transfer robot 210 (S300), characterized in that it comprises a substrate transfer method. The method according to claim 10,
After the entry step (S300), the return path of the transport robot 210 is reversely corrected by the entry path corrected to be the same as the entry path before the correction through the entry step (S300), from the process chamber 110. And a carrying-out step (S400) of carrying out the substrate (1). The method according to claim 10,
After the carrying out step (S400), through the substrate seating position detecting unit 400 installed on the gate of the transfer module 200, the seating position seated on the transfer robot 210 of the substrate 1 And sensing the substrate seating position sensing step (S500). The method according to claim 12,
The substrate seating position detection step (S500),
When the seating position of the substrate (1) is outside a preset range, the driving of the transfer robot 210 is stopped, and a substrate transfer method characterized in that an alarm is generated. The method according to claim 10,
The substrate position detection step (S200),
The position of the substrate 1 is sensed through whether at least one of the plurality of sensor units 310 composed of a pair of sensors including a light emitting unit and a light receiving unit is blocked,
The entry step (S300),
A substrate processing system characterized in that, according to the detection signal input of the substrate (1) through the substrate position detection step (S200), the entry path of the transport robot 210 is corrected to a preset set path. The method according to claim 10,
The substrate position detection step (S200),
Horizontal level of the substrate 1 to be carried out through whether or not at least one of the plurality of sensor units 310 including a light emitting unit and a light receiving unit and a plurality of sensors installed at a predetermined distance from each other is blocked. Calculate the location,
The entry step (S300),
A substrate processing system characterized by correcting an entry path of the transport robot 210 based on the location information calculated through the substrate position detection step (S200).

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