KR20200024932A - Electronic appliance cooling system - Google Patents

Abstract

The electronics cooling system 42 has an electronics enclosure 40 that is hermetically sealed. The system 42 includes a heat exchanger 116 that exchanges heat between the first cooling fluid 108 in the electronics enclosure 40 and the second cooling fluid 118 of the vapor compression system 14. The fan 124 circulates the first cooling fluid 108 in the electronics enclosure 40. Electronic cooling system 42 directs first cooling fluid 108 through one or more electronic components 114 disposed within electronics enclosure 40 to cool one or more electronic components 114. It may also include a baffle system 126 within the device enclosure 40.

Description

Electronic appliance cooling system

Cross Reference to Related Applications

This application claims priority and benefit from US Provisional Serial No. 62 / 534,627, filed July 19, 2017, entitled “Electronic Device Cooling System,” which is hereby incorporated by reference in its entirety for all purposes. Included in

The present application relates generally to systems for cooling enclosures comprising electronic devices.

Refrigeration systems are used in a variety of environments, such as for residential, commercial and industrial cooling systems. Such a system may include various components such as motors, compressors, valves, and the like. Some or all of these components may be controlled by an electronic device. Electronic devices use electronic components such as resistors, transistors, digital signal processors, programmable logic controllers, analog-to-digital converters, inductors, transformers, IGBTs, diodes, and integrated circuits to control the flow of electrical energy and signals. Unfortunately, the operation and lifetime of these electronic components can be adversely affected by heat, moisture, industrial smoke / gas and / or dust.

In one general aspect, the electronics cooling system has an electronics enclosure that is hermetically sealed. The system includes a heat exchanger that exchanges heat between the first cooling fluid in the electronics enclosure and the second cooling fluid of the vapor compression system. The fan circulates the first cooling fluid in the electronics enclosure. The electronics cooling system may include a baffle system in the electronics enclosure that directs the first cooling fluid in a controlled manner through the one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components.

In another aspect, the system has an electronics cooling system. The electronics cooling system includes an electronics enclosure that is hermetically sealed. The system includes a heat exchanger that exchanges heat between the first cooling fluid in the electronics enclosure and the second cooling fluid of the vapor compression system. The fan circulates the first cooling fluid in the electronics enclosure. The electronics cooling system may include a baffle system in the electronics enclosure that directs the first cooling fluid through the one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components. The system includes a vapor compression system that produces a second cooling fluid. The heat exchanger exchanges heat between the first cooling fluid and the second cooling fluid. In some embodiments, the second cooling fluid is augmented by the third cooling fluid.

In another aspect, an electronics cooling system includes an electronics enclosure that stores one or more electronic components used to control a vapor compression system (eg, an electric motor). The electronics enclosure is hermetically sealed. The electronics cooling system includes a baffle system in an electronics enclosure. The baffle system directs the first cooling fluid through the one or more electronic components to cool the one or more electronic components.

1 is a perspective view of a building that may utilize a heating, ventilating, cooling and refrigeration (HVAC & R) system in accordance with an aspect of the present invention.
2 is a perspective view of a vapor compression system coupled to an electronic device cooling system in accordance with an aspect of the present invention.
3 is a schematic diagram of a vapor compression system coupled to an electronic device cooling system in accordance with an aspect of the present invention.
4 is a schematic diagram of a vapor compression system coupled to an electronic device cooling system in accordance with an aspect of the present invention.
5 is a cross-sectional view of an electronic device cooling system according to an aspect of the present invention.
6 is a cross-sectional view of an electronic device cooling system according to an aspect of the present invention.
7 is a partial cross-sectional view of an electronic device cooling system in lines 7-7 of FIG. 6 in accordance with an aspect of the present invention.
8 is a partial cross-sectional view of the electronic device cooling system in lines 7-7 of FIG. 6 in accordance with an aspect of the present invention.
9 is a cross-sectional view of an electronic device cooling system according to an aspect of the present invention.
10 is a cross-sectional view of an electronic device cooling system according to an aspect of the present invention.
11 is a front view of a baffle system of an electronic device cooling system according to an aspect of the present invention.
12 is a front view of a baffle system of an electronic device cooling system according to an aspect of the present invention.

Embodiments of the present invention include an electronics cooling system that not only cools the electronics but also protects them from moisture, industrial gases / smokes and dust. The electronics cooling system includes an electronics enclosure that is hermetically sealed (or nearly hermetically sealed) to seal a first cooling fluid circulating within the electronics enclosure from interacting with fluids surrounding the enclosure. Include. For example, the first cooling fluid may be air, and the electronics enclosure interacts with the air inside the electronics enclosure from sealing such air and interacting with wet or dirty air outside the electronics enclosure. Remove or reduce As the first cooling fluid circulates within the electronics enclosure, the first cooling fluid cools the electronics by removing heat by forced reflux. The first cooling fluid releases this energy into a second cooling fluid (eg, water, refrigerant) in the heat exchanger. The second cooling fluid may come from a vapor compression system such as a cooling device that forms part of a heating, ventilating, cooling and refrigeration (HVAC & R) system. Because electronics cooling systems are hermetically sealed and sealed, electronics cooling systems cool electronics without direct exposure to external air in a variety of environments (e.g., industrial, marine, desert, tropical, coastal areas, etc.). Will protect.

The second cooling fluid can be driven through the heat exchanger by differential pressure and / or the second cooling fluid can be driven by a pump. For example, a pressure difference can be created by fluidly coupling the electronics cooling system between opposite ends of the evaporator tube bundle. In this way, a small portion of the higher pressure second cooling fluid flowing through the evaporator is converted to the electronics cooling system. The second cooling fluid then flows through the electronics cooling system heat exchanger to cool the first cooling fluid before being drawn out of the electronics cooling system by the lower pressure second cooling fluid retracting the evaporator tube bundle. In some embodiments, the supply and return lines of the electronics cooling system can be coupled to other locations in the HVAC & R system to create a differential pressure that drives a second cooling fluid through the electronics cooling system without a pump. Therefore, the electronics cooling system may not use a pump to drive the second cooling fluid through the heat exchanger, thereby reducing potential manufacturing and / or operating costs while simultaneously increasing the reliability of the electronics cooling system. However, in some embodiments, the second cooling fluid can be driven through the electronics cooling system with a pump. In still other embodiments, the pump may be assisted by the differential pressure in the HVAC & R system.

Referring now to the drawings, FIG. 1 is a perspective view of one embodiment of an environment for a heating, ventilating, cooling, and refrigeration (HVAC & R) system 10 in a building 12. Similar configuration may be applicable to ocean lines. HVAC & R system 10 may include a vapor compression system 14 (eg, a chiller) that supplies cooled liquid that may be used to cool building 12. The HVAC & R system 10 may include a boiler 16 for supplying warm liquid to heat the building 12 and an air distribution system 18 for circulating air through the building 12. The air distribution system 18 may include an air return duct 20, an air supply duct 22, and / or an air handler 24. In some embodiments, the air handler 24 may include a heat exchanger connected to the boiler 16 and the vapor compression system 14 by conduits 26. The heat exchanger in the air handler 24 may receive heated liquid from the boiler 16 or cooled liquid from the vapor compression system 14 depending on the operating mode of the HVAC & R system 10. Although the HVAC & R system 10 is shown having a separate air handler 24 on each floor 28 of the building 12, in other embodiments, the HVAC & R system 10 is between floors 28. Or air handlers 24 and / or other components that may be shared among the layers 28.

2 and 3 show embodiments of a vapor compression system 14 that can be used in the HVAC & R system 10. In detail, FIG. 2 is a perspective view of the vapor compression system 14, and FIG. 3 is a schematic view of the vapor compression system 14. The vapor compression system 14 may circulate the refrigerant through a circulation path beginning with the compressor 32. The circuit may include a condenser 34, an expansion valve (s) or device (s) 36, and an evaporator 38. The vapor compression system 14 may further include an electronics enclosure 40 that stores various electronic devices for operating the vapor compression system 14. Some of the electronic devices that may be stored in the electronics enclosure 40 include digital (A / D) converter (s), microprocessor (s), nonvolatile memory / memories, interface board (s), and the like. As will be discussed in more detail below, the electronics enclosure 40 forms part of the electronics cooling system 42 that cools the electronics discussed above. In some embodiments, electronic device enclosure 40 is a hermetically sealed container that reduces and / or blocks exposure of electronic devices to wet and dirty environments. In some embodiments, electronics enclosure 40 may be identical to an enclosure that includes motor variable speed drive (VSD) 52 or an enclosure that includes components that control a motor magnetic bearing.

Some examples of fluids that can be used as refrigerants in the vapor compression system 14 are hydrofluorocarbon (HFC) based refrigerants, such as R-410A, R-407, R-134a, hydrofluoro olefins (HFO). ), R1233zd, R1234ze, “natural” refrigerants such as ammonia (NH ₃ ) R-717, carbon dioxide (CO ₂ ), R-744, or hydrocarbon based refrigerants, water vapor or any other suitable refrigerant. In some embodiments, vapor compression system 14 has a refrigerant having a reference boiling point of approximately 19 degrees Celsius (86 degrees Fahrenheit) at 1 atmosphere, also referred to as low pressure refrigerants, as compared to medium pressure refrigerants such as R-134a. Can be configured to utilize them efficiently. As used herein, “reference boiling point” may refer to the boiling point temperature measured at 1 atmosphere.

In some embodiments, vapor compression system 14 includes the following components: variable speed drive (s) 52, motor 50, compressor 32, condenser 34, expansion valve or device 36. And / or one or more of the evaporators 38 can be used. Motor 50 may drive compressor 32 and may be powered by variable speed drive (VSD) 52. VSD 52 receives alternating current (AC) power from an AC power supply with a specific fixed line voltage and a fixed line frequency and provides power to the motor 50 with a variable voltage and frequency. In other embodiments, motor 50 may be powered directly from an AC or direct current (DC) power source. Motor 50 is any type of electricity that can be powered by VSD 52, such as a switched magnetoresistive motor, an induction motor, an electronically rectified permanent magnet motor or other suitable motor or directly from an AC or DC power source. It may include a motor. In some embodiments, compressor 32 and / or motor 50 may use magnetic bearings 54 to reduce friction and / or noise and increase compressor / motor reliability during operation. The magnetic bearings 54 can be controlled by electronics that are housed within the electronics enclosure 40. As described above, the electronics enclosure 40 allows the electronics cooling system 42 to cool the electronics using cooling fluid (eg, water, refrigerant) supplied by the vapor compression system 14. Can protect electronic equipment from dust and moisture.

The compressor may be a bi-displacement device 32 that compresses the refrigerant vapor and delivers steam to the condenser 34 through the discharge passageway. In some embodiments, compressor 32 may be a centrifugal compressor. The refrigerant vapor delivered to the condenser 34 by the compressor 32 may transfer heat to the cooling fluid (eg, water or air) in the condenser 34. The refrigerant vapor may condense into the refrigerant liquid in the condenser 34 as a result of the thermal heat transfer with the cooling fluid. Liquid refrigerant from condenser 34 may flow through expansion device 36 to evaporator 38. In the illustrated embodiment of FIG. 3, the condenser 34 includes a tube bundle 55 connected to a cooling tower 56 (or a body of water surrounding the vessel) that is water cooled and supplies cooling fluid to the condenser 34.

The liquid refrigerant delivered to the evaporator 38 may absorb heat from other cooling fluids, which may or may not be the same cooling fluid used in the condenser 34. The liquid refrigerant in the evaporator 38 may undergo a phase change from liquid refrigerant to refrigerant vapor. As shown in the illustrated embodiment of FIG. 3, the evaporator 38 may include a tube bundle 58 coupled to the cooled fluid supply line 60S and the return line 60R. Supply line 60S and return line 60R connect cooling device 14 to cooling load 62. Cooling fluid of evaporator 38 (eg, water, ethylene glycol, calcium chloride brine, sodium chloride brine or any other suitable fluid) enters evaporator 38 via return line 60R and feed line 60S. Evaporator 38 is withdrawn. Evaporator 38 may reduce the temperature of the cooling fluid in tube bundle 58 through thermal heat transfer with the refrigerant. The tube bundle 58 in the evaporator 38 may include a plurality of tubes and / or a plurality of tube bundles. In any case, the steam refrigerant retracts the evaporator 38 and returns to the compressor 32 by the suction line to complete the circulation.

As shown, the electronics cooling system 42 may be coupled to the tube bundle 58 at the evaporator 38 to receive a flow of cooling fluid from the HVAC & R system 10. The electronics cooling system 42 uses cooling fluid (eg, water) from the HVAC & R system 10 to cool the electronics in the electronics enclosure 40. As noted above, the electronics cooling system 42 may not include a pump and instead replace the differences in pressure in the HVAC & R system 10 to drive the flow of cooling fluid through the electronics cooling system 42. It is available. For example, supply line 64 of electronics cooling system 42 may contact an end of tube bundle 58 that receives cooling fluid flowing through return line 60R. After passing through the electronics cooling system 42, as the cooling fluid absorbs energy from the electronics disposed within the electronics enclosure 40, the temperature and pressure of the cooling fluid increases. The cooling fluid is then returned via the return line 66 to the supply line side of the tube bundle 58. At this location in the evaporator 38, the pressure of the cooling fluid in the evaporator 38 will be lower than the pressure of the cooling fluid being diverted from the evaporator 38 through the feed line 64. This pressure difference drives the flow of cooling fluid through the electronics cooling system 42 without the pump.

In some embodiments, the supply and return lines 64, 66 of the electronics cooling system 42 form a vapor compression system 14 to create a differential pressure that drives a cooling fluid through the electronics cooling system 42. It can be combined at other locations in. For example, supply line 64 (ie, dashed supply line 64) passes condenser 34 after cooling fluid (eg, refrigerant) passes through expansion valve / device 68. Evaporating cooling fluid (eg, refrigerant) may be received. Supply line 64 is an electronic device in which a cooling fluid cools the first fluid or electronic device through cold / cold plates prior to retirement via return line 66 (ie, dashed return line 66). The cooling fluid is directed through the cooling system 42. Return line 66 then has a cooling fluid exiting expansion valve 68 at a higher pressure than the cooling fluid in evaporator 38 and the pressure difference of the cooling fluid through electronics cooling system 42 without a pump. By driving the flow, the cooling fluid (ie, refrigerant) can be returned to the evaporator 38.

However, in some embodiments, the cooling fluid may be driven through the electronics cooling system 42 with one or more pumps 72. In still other embodiments, the pump (s) 72 may be assisted by the differential pressure in the HVAC & R system 10.

4 is a schematic diagram of a vapor compression system 14 having an intermediate circulation path 84 included between a condenser 34 and an evaporator 38. The intermediate circuit 84 may have an inlet line 88 that is fluidly connected directly to the condenser 34. In other embodiments, inlet line 88 may be in fluid coupling indirectly to condenser 34. As shown in the illustrated embodiment of FIG. 4, the inlet line 88 includes a first expansion device 86 located upstream of the intermediate vessel 90. In some embodiments, the intermediate vessel 90 may be a flash tank (eg, flash intermediate cooler). In other embodiments, the intermediate vessel 90 may be configured as a direct expansion heat exchanger or economizer. In the illustrated embodiment of FIG. 4, the intermediate vessel 90 is used as a flash tank and the first expansion device 86 lowers the pressure of the liquid refrigerant received from the condenser 34 (eg, liquid refrigeration). To expand the agent). During the expansion process, some of the liquid may be vaporized, and therefore, the intermediate vessel 90 may be used to separate the vapor from the liquid received from the first expansion device 86. In addition, the intermediate vessel 90 is due to the pressure drop experienced by the liquid refrigerant when entering the intermediate vessel 90 (eg, due to the rapid increase in volume experienced when entering the intermediate vessel 90). It may provide for further expansion of the liquid refrigerant. Vapor in the intermediate vessel 90 may be withdrawn by the compressor 32 through the inlet line 94 to the intermediate pressure port of the compressor 32. In other embodiments, steam in the intermediate vessel 90 may be withdrawn to the middle stage of the compressor 32. The liquid collected in the intermediate vessel 90 may be at lower enthalpy than the liquid refrigerant retiring the condenser 34 because of the expansion in the expansion device 86 and / or the intermediate vessel 90. The liquid from the intermediate vessel 90 may then flow in the line 92 through the second expansion device 36 to the evaporator 38.

As shown, the electronics cooling system 42 receives cooling fluid from the vapor compression system 14. The electronics cooling system 42 uses cooling fluid to cool the electronics in the electronics enclosure 40 using a heat exchanger. As noted above, the electronics cooling system 42 may not include a pump and instead the difference in pressure in the vapor compression system 14 to drive the flow of cooling fluid through the electronics cooling system 42. Can be used. For example, the supply line 96 to the electronics cooling system 42 may contact the line 92 that delivers the liquid cooling fluid (ie, the refrigerant) from the intermediate vessel 90 to the evaporator 38. . After passing through the electronics cooling system 42, the temperature of the cooling fluid increases. Cooling fluid is returned through line 98 to evaporator 38 at a lower pressure than cooling fluid flowing through line 92. As shown, return line 98 is coupled to evaporator 38. Since the cooling fluid exiting the line 92 is at a higher pressure than the pressure in the evaporator 38, the difference in pressure drives the flow of cooling fluid through the electronics cooling system 42 without a pump. However, in some embodiments, the pump 72 assists and / or drives and returns cooling fluid (ie, liquid refrigerant from the evaporator 38) to the electronics cooling system 42 via the supply line 95. Cooling fluid can be returned to evaporator 38 via line 97.

5 is a cross-sectional view of one embodiment of an electronic device cooling system 42. As mentioned above, the electronics enclosure 40 forms part of the electronics cooling system 42. The electronics enclosure 40 is a hermetically sealed container that reduces and / or blocks the exposure of electronics to moisture, industrial fumes / gases and dust in the environment. As shown, the electronic device enclosure 40 includes a first enclosure 100 coupled to a second enclosure 102. The first and second enclosures 100, 102 are fluidly coupled with the outlet 104 and the inlet 106. In some embodiments, there may be multiple inlets 106 and outlets 104 (eg, two, three, four, five or more). The outlet 104 and inlet 106 are between the first cavity 110 in the first enclosure 100 and the second cavity 112 in the second enclosure 102 to cool the electronic device 114. Enable cooling fluid 108 (eg, air) to circulate. The electronic device 114 may include a microchip, an integrated circuit, a power supply, a transistor, a resistor, an inductor, a transformer, an IGBT, and the like. Advantageously, the electronics cooling system 42 limits and / or blocks direct interactions between the cooling fluid 108 and fluids external to the electronics enclosure 40. In this way, the electronics enclosure 40 can block and / or reduce the exposure of the electronics 114 to moisture, industrial smoke / gases and / or dust in the environment. For example, cooling fluid 108 (eg, air) may not be exposed to moist / wet air circulating around the exterior of electronics enclosure 40.

To remove heat from cooling fluid 108, electronics cooling system 42 includes a heat exchanger 116 (eg, gas to liquid heat exchanger). The heat exchanger 116 receives the second cooling fluid 118 through the supply line 120. The second cooling fluid 118 comes from the vapor compression system 14 and may be a refrigerant, water, or the like. In the heat exchanger 116, the second cooling fluid 118 exchanges energy with the first cooling fluid 108 circulating in the electronics enclosure 40. After exchanging energy in the heat exchanger 116, the second cooling fluid 118 leaves the heat exchanger 116 to a higher temperature. The second cooling fluid 118 then leaves the electronics cooling system 42 and is delivered to the HVAC & R system 10 via the return line 122.

After retiring the heat exchanger 116, the first cooling fluid 108 is driven to the second enclosure 102 using the fan 124. More specifically, fan 124 draws first cooling fluid 108 through heat exchanger 116 and then first cooling fluid 108 through outlet 104 and to inlet plenum 152. Blow). After passing through the outlet 104, the first cooling fluid 108 contacts the baffle system 126. As shown, the baffle system 126 redirects and controls the flow of cooling fluid 108 through the second enclosure 102. The baffle system 126 includes a baffle plate 128 and a separation plate 130. The separating plate 130 is coupled to the second enclosure 102 and spaces the baffle plate 128 by a distance 132 from the enclosure wall 134. In certain embodiments, distance 132 may be selected to optimize the flow and pressure drop of cooling fluid 108. In addition to spacing the baffle plate 128 away from the enclosure wall 134, the separation plate 130 also separates the outlet 104 from the inlet 106 to form the inlet and outlet plenums 152, 154. . Thus, as cooling fluid 108 exits first enclosure 100 via outlet 104, separation plate 130 does not pass first baffle plate 128 and attached electronics 114 without first cooling. Block fluid 108 from flowing directly to inlet 106.

As the first cooling fluid 108 leaves the outlet 104, the first cooling fluid 108 contacts the rear surface 136 of the baffle plate 128. Therefore, the first cooling fluid 108 is directed upward in the axial direction 138 (eg, vertically) in the inlet plenum 152. As the first cooling fluid 108 flows upward, the first cooling fluid 108 passes over the baffle plate 128. After passing the baffle plate 128, the first cooling fluid 108 flows in the axial direction 140 (eg, downward). This creates a cascading cooling effect that cools the electronic device 114 as the first cooling fluid 108 flows in the direction 140. The first cooling fluid 108 then flows around the bottom of the baffle plate 128 where the first cooling fluid 108 contacts the wall 134 of the second enclosure 102. Wall 134 and baffle plate 128 direct first cooling fluid 108 upward in axial direction 138 through outlet plenum 154. As discussed above, the separation plate 130 blocks direct fluid flow between the outlet 104 and the inlet 106. Therefore, the first cooling fluid 108 is driven through the inlet 106 and to the heat exchanger 116, where the first cooling fluid 108 is energized with the second cooling fluid 118. Replace it again.

Since the electronics enclosure 40 is sealed and sealed, the moisture in the first cooling fluid 108 may not increase. However, the original moisture in the first cooling fluid 108 may condense in the cavity 110 where the heat exchanger 116 and supply line 120 create the coldest surfaces. To facilitate the removal of liquid from the electronics enclosure 40, the electronics cooling system 42 includes a condensate vent valve 142. The condensate vent valve 142 enables liquid to exit the electronics enclosure 40 while blocking and / or reducing external (peripheral) fluid flow to the electronics enclosure 40. A condensate vent valve 142 is disposed in the first enclosure 100 to capture liquid condensed in the first cooling fluid 108 as the first cooling fluid 108 retires the heat exchanger 116. Can be. That is, as the first cooling fluid 108 exits the heat exchanger 116, the liquid condenses from the first cooling fluid 108 and in the direction 140 due to gravity to the bottom of the first enclosure 100. You can fall. Liquid may then flow to the condensate vent valve 142, where the liquid is directed out of the first enclosure 100 in the direction 140. Therefore, this process can produce dry, cool air in the cavities 110 and 112 that cool the electronic device 114 and protect it from moisture. Moreover, heat exchanger 116 is disposed within first enclosure 100 to facilitate separation as well as condensation away from any condensate formed from electronic device 114. As described above and as can be seen in FIG. 5, the first and second enclosures 100, 102 may include walls that block the minimum condensate formed in the first enclosure 100 from flowing into the second enclosure 102. 134).

In some embodiments, first enclosure 100 and second enclosure 102 are separate enclosures that are joined together. For example, the first and second enclosures 100, 102 may be coupled with the fasteners 144. When combined, the first and second enclosures 100, 102 may form a fluid sealing seal that blocks and / or reduces external (peripheral) fluid from entering the electronics enclosure 40. Fluid sealing seals may be formed using sealing elements 156 such as gaskets, welds, polymerization seals (eg, O-rings, etc.), soldering, adhesives, and the like. In some embodiments, the first and second enclosures 100, 102 may be integrated with (eg, become one with) each other. Although the shown first and second enclosures 100, 102 have different sizes, in some embodiments, the shown first and second enclosures 100, 102 may be the same size.

To facilitate access to the cavities 110 and 112, the first and second enclosures 100, 102 may have access panels. For example, the first enclosure 100 can include a fan access panel 146. The fan access panel 146 is coupled to the first enclosure 100 with one or more fasteners 148 (eg, threaded fasteners such as bolts, screws). Fan access panel 146 enables access for replacement and / or maintenance of fan 124. When coupled to the enclosure 40, the fan access panel 146 is prepared using gaskets, solders, adhesives, and the like to block and / or reduce contact with fluids around the exterior of the electronics enclosure 40. 1 forms a fluid sealing seal with the enclosure 100. The electronic device 114 may be accessed through an enclosure panel 150 coupled to the second enclosure 102. Enclosure panel 150 may likewise be coupled to second enclosure 102 with fasteners (eg, threaded fasteners such as bolts, screws, and the like). Enclosure panel 150 uses a gasket, solder, adhesive, or the like to seal fluid seal with second enclosure 102 to block and / or reduce contact with fluid around the exterior of electronics enclosure 40. It may be formed.

6 is a cross-sectional view of one embodiment of an electronic device cooling system 42. The electronics cooling system 42 in FIG. 6 circulates the first cooling fluid 108 through the first and second enclosures 100, 102 to cool the electronics 114. However, to provide additional cooling, the electronics cooling system 42 may include one or more cold (cold) plates 170. Cold (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronic device components 114 may generate more heat than others. Therefore, these electronic components 114 may increase the heat transfer requirements of the electronics cooling system 42. Therefore, the electronics cooling system 42 can include cold (cold) plates 170 that enable more direct heat transfer from the electronics to the second cooling fluid 118. The cold (cold) plates 170 may directly receive and circulate the second cooling fluid 118 as shown in FIG. 6. Supply line 120 and return line 122 may include respective T-joints 172 and 174. The T-joints 172, 174 allow the second cooling fluid 118 to flow into and out of the heat exchanger 116 and cold (cold) plates 170 as shown in FIG. 6. do. The secondary cooling fluid 118 may be water or refrigerant.

Since cold (cold) plates 170 are located in second enclosure 102, cold (cold) plates 170 may form condensate in second enclosure 102. In order to reduce the potential contact between the condensate formed by cold (cold) plates 170 and the electronics 114, the cold (cold) plate 170 baffles in the direction 140. It may be located at the bottom of the plate 128. Thus, once the condensate is formed on the cold (cold) plate 170, the condensate will fall in the direction 140 to the bottom of the second enclosure 102 without contacting any other electronic device 114. Can be. To remove the condensate, the second enclosure 102 can include second vent condensate valves 142 and 176. As noted above, the vent condensate valve 176 enables the electronics cooling system 42 to remove liquid from the first and / or second enclosures 100, 102. However, in some embodiments, the cold (cold) plate 170 may cause the heat exchanger 116 and the supply line 120 to exit the cooling fluid 108 before moisture reaches the second enclosure 102. As it condenses moisture, it may not form condensate in the second enclosure 102.

In some embodiments, electronic device cooling system 42 may include additional baffle systems 126 to receive and cool more electronic component 114. As shown in FIG. 6, the electronics cooling system 42 is a first baffle system 126 coupled to the wall 134 of the second enclosure 102 and a second baffle system coupled to the enclosure panel 150. 126. The baffle plates 128 of each of the first and second baffle systems 126 may be spaced apart by a distance 178 to facilitate the flow of the first cooling fluid 108 through the electronic device 114. Can be. Distance 178 can be optimized to facilitate the required heat transfer from electronic device 114 to cooling fluid 108.

7 is a partial cross-sectional view of one embodiment of an electronic device cooling system 42 in line 7-7 of FIG. As described above, the electronics cooling system 42 in FIG. 7 circulates the first cooling fluid 108 through the first and second enclosures 100, 102 to cool the electronics 114. . In order to provide additional cooling, electronics cooling system 42 may include one or more cold (cold) plates 170. Cold (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronic device components 114 may generate more heat than others. Therefore, the electronics cooling system 42 can include cold (cold) plates 170 that enable more direct heat transfer from the electronics to the second cooling fluid 118. However, instead of dividing the flow of the second cooling fluid 118. The electronics cooling system 42 first directs the second cooling fluid 118 to the cold (cold) plates 170 before redirecting the second cooling fluid 118 to flow through the heat exchanger 116. You can.

8 is a partial cross-sectional view of one embodiment of an electronic device cooling system 42 in line 7-7 of FIG. In order to provide additional cooling as described above, the electronics cooling system 42 may include one or more cold (cold) plates 170. Cold (cold) plates 170 may increase heat transfer from one or more electronic components 114. However, instead of first directing the second cooling fluid 118 to the cold (cold) plates 170. The electronics cooling system 42 may first direct the second cooling fluid 118 to the heat exchanger 116, after which the second cooling fluid 118 is then cooled (cold) plates 170. Is directed to). By first directing the second cooling fluid 118 through the heat exchanger 116, the electronics cooling system 42 heats the second cooling fluid 118 and cools one or more electronic components 114, Condensation in the second enclosure 102 can be reduced.

9 is a cross-sectional view of one embodiment of an electronic device cooling system 42. As noted above, the electronic device cooling system 42 may include one or more cold (cold) plates 170. Cold (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronic device components 114 may generate more heat than others. Therefore, these electronic components 114 may increase the heat transfer requirements of the electronics cooling system 42. However, cold (cold) plates 170 may be separately supplied to third cooling fluid 200. The third cooling fluid 200 flows into and out of the cold (cold) plates 170 through the respective supply and return lines 202 and 204. In some embodiments, the second cooling fluid 118 and the third cooling fluid 200 can be the same cooling fluid. For example, the second and third cooling fluids 118, 200 may be water, refrigerant, or the like. In another embodiment, the second and third cooling fluids 118, 200 may be different. For example, the second cooling fluid 118 may be water while the third cooling fluid 200 may be a refrigerant or vice versa.

10 is a cross-sectional view of one embodiment of an electronic device cooling system 42. In some embodiments, the baffle system 126 may include one or more additional guide plates 220. Induction plate 220 helps to control the flow of first cooling fluid 108 through second enclosure 102. As shown, the guide plate 220 is coupled to the inner surface 222 of the top plate 224 of the second enclosure 102. Induction plate 220 extends away from inner surface 222 in direction 140. Induction plate 220 may extend through partial baffle plate 128 or entire baffle plate 128 to direct the flow of first cooling fluid 108. As shown, the first cooling fluid 108 flows over and through the baffle plate 128. After passing the baffle plate 128, the first cooling fluid 108 contacts the surface 226 of the induction plate 220. Induction plate 220 directs first cooling fluid 108 downward in direction 140 and through electronic device 114. In this way, the induction plate 220 concentrates the flow of the first cooling fluid 108 through the electronic device 114 to facilitate heat transfer. In some embodiments, the distance 228 between the surface 226 of the induction plate 220 and the baffle plate 128 may be increased or decreased to control the properties of the fluid flow through the electronic device 114. Increased flow rate can increase turbulence causing greater heat transfer from the electronic device 114. For example, by reducing the distance 228, the induction plate 220 can increase the flow rate of the first cooling fluid 108 through the electronic device 114. Likewise, as distance 228 is increased, induction plate 220 may reduce the flow rate of first cooling fluid 108 through electronic device 114. In this manner, the electronics cooling system 42 can use the induction plate 220 to direct and customize heat transfer between the first cooling fluid 108 and the electronics 114.

As shown, the surface 226 of the induction plate 220 is flat; In some embodiments, surface 226 may be curved or otherwise shaped to facilitate heat transfer at different locations along induction plate 220. For example, the distance 230 between the induction plate 220 and the baffle plate 128 may be used to customize and / or optimize heat transfer through different electronic devices 114 (eg, different electronic devices 114). May increase and / or decrease at different points along the length 230) to increase or decrease the flow rate through. In some embodiments, instead of changing the curvature of the induction plate 220 at different points along the length 230 of the induction plate 220, the induction plate 220 is provided with protrusions 232 and / or It may include recesses 234. The protrusions 232 and recesses 234 can likewise control the flow rate and flow rate of the first cooling fluid 108 through the specific electronic components 114, and thus the heat transfer characteristics.

In order to access the electronic device 114, the induction plate 220 may be removably coupled from the second enclosure 102. For example, the guide plate 220 may be coupled to the second enclosure 102 by a snap fit connection, a bayonet connection, or the like. In some embodiments, guide plate 220 may be removably coupled using fasteners (eg, threaded fasteners).

11 is a front view of one embodiment of a baffle system 126. As shown, the baffle plate 128 may have a shape other than rectangular or square. For example, the baffle plate 128 may have an irregular shape to control the flow of the first cooling fluid 108 through the electronic device 114. In FIG. 11, plate 128 includes rectangular cutouts 250 and 252 at each end 254 and 256 of baffle plate 128. However, the cutouts 250, 252 are at different locations along the length 258 of the baffle plate 128 to customize / control the flow of the first cooling fluid 108 through the electronic device 114. And / or have different sizes and / or have different shapes (eg, semicircle, triangle, square, etc.). As shown, the cutout 252 is larger than the cutout 250, so that the baffle plate 128 passes through the electronic device 114 on or near the end 256 of the baffle plate 128. Direct more of the first cooling fluid 108. Any location on the baffle plate 128 above and / or below the separation plate 130 for the cutouts 250, 252 to control the flow of the first cooling fluid 108 through the electronic device 114. It should be noted that it can be placed in.

In some embodiments, baffle plate 128 may include openings 260. Openings 260 enable first cooling fluid 108 to pass through opening 260 instead of flowing over and through baffle plate 128. This allows for customized and / or optimized fluid flow of the first cooling fluid 108 through the particular electronic device 114. Two openings 260 are shown in FIG. 11, but in other embodiments, such as one, three, four, five, six, seven, eight, nine, ten or more There may be different numbers of openings 260. Moreover, the openings 260 may have different shapes and / or sizes to customize and / or optimize the flow of the first cooling fluid 108 through the electronic device 114.

12 is a front view of one embodiment of a baffle system 126. As shown, the baffle system 126 includes a baffle plate 128 and a separation plate 130. As can be seen in FIG. 11, instead of using the irregularly shaped baffle plate 128 and / or openings 260 to control the flow of the first cooling fluid 108, the baffle system 126 is Adjustable baffles 280. Adjustable baffles 280 are coupled to respective ends 254 and 256 of baffle plate 128. Adjustable baffles 280 may be repositioned vertically in directions 138 and 140 to customize the flow of first cooling fluid 108 through electronics 114. Although FIG. 12 uses adjustable baffles 280 to control the flow of the first cooling fluid 108, in some embodiments, the baffle system 126 is a first cooling fluid through the electronic device 114. It may include a combination of adjustable baffles 280, openings 260 and cutouts 250 and 252 to control the flow of 108.

Although only certain features and embodiments of the present invention have been illustrated and described, many changes and modifications (eg, various) may be made without departing substantially from the new teachings and advantages of the subject matter recited in the claims. The size, dimensions, structure, shape and proportions of the elements, values of parameters (eg, temperature, pressure, etc.), variations in mounting arrangements, use of materials, colors, orientations, etc.) may occur to those skilled in the art. The order or sequence of any process or method step may be varied or resequenced according to alternative embodiments. It is therefore to be understood that the appended claims are intended to cover all such alterations and modifications falling within the true scope of the invention. Moreover, in an effort to provide a concise description of exemplary embodiments, all features of an actual implementation (ie, those not related to the best mode currently contemplated for carrying out the invention, or not related to enabling the claimed invention) can be found. May not be explained. It should be understood that in the development of any such actual implementation, such as in any engineering technique or design project, many implementation specific decisions may be made. Such development efforts can be complex and time consuming, but will nevertheless be a routine undertaking of design, fabrication and manufacture for those skilled in the art without benefit of undue experimentation.

Claims (20)

As an electronics cooling system:
An electronics enclosure comprising: an electronics enclosure that is hermetically sealed;
A heat exchanger configured to exchange heat between a first cooling fluid in the electronics enclosure and a second cooling fluid of the vapor compression system;
A fan configured to circulate the first cooling fluid within the electronics enclosure; And
A baffle system in the electronic enclosure, the baffle system configured to direct the first cooling fluid through one or more electronic components disposed within the electronic enclosure to cool one or more electronic components; . The method of claim 1,
A condensate vent valve coupled to the electronics enclosure,
And the condensate vent valve is configured to discharge liquid condensed in the electronics enclosure. The method of claim 1,
The electronic device enclosure comprises a first enclosure,
The first enclosure is configured to receive the heat exchanger and the fan. The method of claim 3,
The electronic device enclosure comprises a second enclosure,
And the second enclosure is configured to support the baffle system and to receive the one or more electronic components. The method of claim 4, wherein
The first enclosure and the second enclosure are fluidly coupled together through an inlet and an outlet,
The inlet and outlet enable the first cooling fluid to circulate between the first and second enclosures. The method of claim 5,
The baffle system includes a baffle plate and a separation plate coupled to the baffle plate, the separation plate being located between the inlet and the outlet to force the first cooling fluid to flow through the baffle plate. The method of claim 6,
The baffle system includes an adjustable baffle coupled to the baffle plate,
The adjustable baffle is configured to move relative to the baffle plate to regulate the flow of the second cooling fluid through the one or more electronic components. The method of claim 1,
A plate of cold air coupled to the baffle system,
And the plate of cold air is coupled to the one or more electronic components and configured to cool them. The method of claim 8,
The cold air plate is configured to receive a third cooling fluid from the vapor compression system to cool the one or more electronic components. The method of claim 9,
And the first cooling fluid and the third cooling fluid are different. As an electronics cooling system:
An electronics enclosure comprising: an electronics enclosure that is hermetically sealed;
heat exchanger;
A fan configured to circulate a first cooling fluid within the electronic device enclosure; And
A baffle system in the electronics enclosure, the electronics cooling system including a baffle system configured to direct the first cooling fluid through the one or more electronic components to cool one or more electronic components; And
A vapor compression system configured to produce a second cooling fluid,
The heat exchanger is configured to exchange heat between the first cooling fluid and the second cooling fluid. The method of claim 11,
The vapor compression system is a cooling device. The method of claim 12,
And the second cooling fluid is water. The method of claim 12,
And the second cooling fluid is a refrigerant. The method of claim 11,
One or more electronic components,
The one or more electronic components are configured to control the operation of the vapor compression system. As an electronics cooling system:
An electronics enclosure configured to store one or more electronic components for use in controlling a vapor compression system, the electronics enclosure being hermetically sealed; And
A baffle system in the electronic enclosure, the baffle system configured to direct a first cooling fluid through the one or more electronic components to cool the one or more electronic components; The method of claim 16,
And the baffle system comprises a separating plate coupling the baffle system to the electronics enclosure. The method of claim 17,
A baffle plate coupled to the separation plate,
And the baffle plate is configured to support the electronic components. The method of claim 18,
An adjustable baffle coupled to the baffle plate,
The adjustable baffles are configured to couple to the baffle plate at different locations to control the flow of the first cooling fluid through the electronic components. The method of claim 18,
And the baffle plate defines one or more openings for directing the first cooling fluid through the electronic components.

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