KR20200015022A - Handler for testing electronic component - Google Patents

Abstract

The present invention relates to a handler for testing an electronic component. According to the present invention, the handler for testing an electronic component provides a test supporting device for supporting a specific function performed by one surface of an electronic component separately from a moving device pressing the electronic component and connecting an electric terminal on the other surface of the electronic component to an electric terminal of a test socket and a mover capable of moving at least a part of the test supporting device. According to the present invention, testing of a specific function for the electronic component can be properly performed so that the reliability of the electrical connection between the electronic component and a tester is also increased.

Description

Handler for testing electronic components {HANDLER FOR TESTING ELECTRONIC COMPONENT}

The present invention relates to a handler for testing electronic components.

The semiconductor devices produced are tested by a tester, and are divided into good and defective products, and only good products are shipped.

The electrical connection between the tester and the semiconductor device is made by an electronic component test handler. The handler is manufactured in various forms depending on the various kinds of electronic components to be tested. Among such handlers, the present invention relates to supporting testing of electronic components having a wide plate shape.

Applicants of the present invention have proposed Korean Patent Application Nos. 10-2016-0080126 and 10-2016-0125683 (hereinafter referred to as 'prior art') for a handler for supporting testing of an electronic component having a plate shape. have.

In recent years, electronic components for fingerprint recognition have been adopted for security of electronic devices, such as smartphones and locks that require security.

Fingerprint recognition electronic parts have one side as a fingerprint recognition side and the other side has electrical terminals on the other side. The electrical property test of the fingerprint electronic components may be performed by electrically connecting electrical terminals on the other side of the electronic component with the test socket. However, the electrical characteristics test alone cannot fully determine whether the fingerprint electronic components are defective, and the fingerprint recognition function should also be performed.

However, the above-described prior art cannot be properly used to support test for fingerprint recognition electronic components because only the electrical characteristic test is considered.

On the other hand, it is necessary to make intimate contact between the electrical terminal of the electronic component and the electrical terminal of the test socket without excessive. Proper contact between the electrical terminals must take into account manufacturing tolerances, since too much pressurization can cause damage to the terminals, and too light pressurization can result in poor contact between some electrical terminals, resulting in test errors. In particular, this point needs to be considered more when the electrical terminals are distributed in a large area, where an error in the position or angle of the electronic component may occur during the bending or movement of the electronic component itself.

The present invention has the following object.

First, to further develop the prior art to provide a handler for testing a fingerprint recognition electronic component.

Second, to provide a technology that can prevent the error of the electrical contact between the electronic component and the tester.

An electronic component test handler according to a first aspect of the present invention includes a moving device for moving an electronic component on a plate from a loading position to an unloading position; A loading device which allows the electronic component to be moved toward the unloading position by the moving device by loading the electronic component to be tested into the loading position; An unloading device for unloading the tested electronic part from the unloading position when the electronic component tested by the moving device comes to the unloading position; The electronic component to be tested between the loading position and the unloading position is supplied to a test region so that a test on the electronic component can be performed, and the loading and unloading of the tested electronic component from the test region. A transfer device for recovering between the positions so that the recovered electronic parts can be moved to the unloading position by the moving device; A support device for supporting an electronic component brought into the test area by the transfer device and having a test supporter for supporting a test of a specific function performed through one surface of the electronic component; By moving the support device to the test board side having a test socket for contacting the electrical terminals on the other side of the electronic part for checking the electrical characteristics of the electronic part supported by the support device, A mobile device capable of contacting an electric terminal; And a controller for controlling each of the above components. The support device includes a support frame for supporting an electronic component brought to the test area by the transfer device; And a mover capable of moving at least a portion of the test support to the electronic component so that a test for a specific function can be performed by contacting at least a portion of the test support with one surface of the electronic component supported by the support frame. It includes more. Here, one surface of the electronic component is a fingerprint recognition surface for recognizing a fingerprint, and the test supporter includes an artificial fingerprint member for contacting an artificial fingerprint with a fingerprint recognition surface of the electronic component, and the mover moves the artificial fingerprint member by The artificial fingerprint member is brought into contact with the electronic component.

There are a plurality of artificial fingerprint members, each provided to prevent movement interference between each other.

An electronic component test handler according to a second aspect of the present invention includes a moving device for moving an electronic component on a plate from a loading position to an unloading position; A loading device which allows the electronic component to be moved toward the unloading position by the moving device by loading the electronic component to be tested into the loading position; An unloading device for unloading the tested electronic part from the unloading position when the electronic component tested by the moving device comes to the unloading position; The electronic component to be tested between the loading position and the unloading position is supplied to a test region so that a test on the electronic component can be performed, and the loading and unloading of the tested electronic component from the test region. A transfer device for recovering between the positions so that the recovered electronic parts can be moved to the unloading position by the moving device; A support device for supporting the electronic component brought to the test area by the transfer device; A contact device which electrically contacts the electronic component supported by the support device with a test socket on a test board so that electrical characteristics of the electronic component can be inspected; And a controller for controlling each of the above components. The support device includes a support frame for supporting the electronic component brought to the test area by the transfer device; And a test supporter which is in contact with one surface of the electronic component by moving and has a pressing member capable of pressing and supporting the electronic component toward the test board. And an electrical connection between the electrical terminal on the other side of the electronic component and the test socket of the test board by the contact device by moving the pressing member toward the test board to enable the pressing member to press the electronic component toward the test board. A mover that additionally solidifies and operates independently of the contact device; It includes.

The pressure member is a plurality, each provided to prevent movement interference between each other.

The pressing member is formed of a material capable of elastically compressing and restoring at least a contact portion where the electronic component is in contact with one surface thereof, and when the electrical connection operation between the electronic component and the test socket is performed, The moving direction and the moving direction of the pressing member by the mover are the same.

The handler according to the present invention includes a rotating device for rotating the support device with a vertical axis as the rotating axis; A horizontal moving device for moving the support device in a horizontal direction; And a first camera photographing the test board side. Further, the control device analyzes the image taken by the first camera to set the correct position of the support device, and then controlled by the support device by controlling the rotating device and the horizontal moving device It allows electronic components to be accurately matched to the test board.

The handler according to the present invention includes a second camera for photographing the other surface of the electronic component to be tested held by the transfer device; Further, the control device analyzes the image photographed by the second camera to determine the position of the electronic component, and then control the rotating device and the horizontal moving device to accurately place the electronic component on the support device. When the electronic component is placed on the supporting device, the rotating device and the horizontal moving device are controlled so that the electronic component supported by the supporting device can be exactly corresponded to the test board.

The handler according to the present invention includes a vacuum device for providing a vacuum force for vacuum suction of the electronic component to prevent the position change of the electronic component supported by the support device; It is preferable to further include.

According to the present invention has the following effects.

First, the electrical characteristics of the electronic component is applied because the pressurization method is performed simultaneously with the pressurization of the electronic component by the test supporter and the pressurization of the electronic component by the test support device, even though a specific test such as the electrical characteristic test and the fingerprint recognition is performed together. Both testing and testing of specific functions can be done properly. Of course, although the description of the electrical characteristics of the electronic component and the test for a specific function is described here, it also means that the test under different conditions.

Second, since a plurality of artificial fingerprint members are modularized and the movement of each artificial fingerprint member is performed without interfering with each other, electrical connection between the electronic component and the tester and proper contact between the artificial fingerprint member and the electronic component are ensured. .

Third, it is possible to ensure a faster and more accurate reaction rate because the artificial fingerprint members provided by the plurality of pressure chambers divided by the elevating. If any one of the parts is defective, since only the pressurized chamber side can be repaired or maintained, it is possible to reduce post-cost.

Fourth, by installing the vacuum adsorption member in the space between the module and the module except the space in which the artificial fingerprint member is in contact, it is possible to prevent the occurrence of the problem that the plate-shaped electronic components are bent or only a part of the adsorption, so that the reliability of the product Is improved.

Fifth, since the contact portion (including the contact surface) in which the artificial fingerprint member, which also functions as a pressing member for pressing the electronic component, is provided with a material capable of elastic compression and restoration, it is provided in the electronic component and the test sockets. Damage to the electrical terminals can be minimized.

Sixth, since the position of the electronic component is corrected by changing the position of the camera and the supporting apparatus, the supply process of the electronic component is simplified, and a separate guide means for setting the position of the electronic component is not required for the supporting apparatus. Therefore, it is suitable for testing a thin plate-shaped electronic component, and there is no fear of interference between the test board and a separate guide means omitted during the electrical connection operation, the design of the test board becomes easy.

Seventh, two-level alignment enables precise positional correspondence between electronic components and testers, ultimately improving the reliability of the electrical connections between the electronic components and the testers.

Sixth, the position correction operation of the electronic component can be precisely performed by absorbing the electronic component by the vacuum and fixing the electronic component to the support device.

1 is a schematic perspective view of an electronic component processed in an electronic component test handler according to the present invention.
2 is a conceptual plan view of an electronic component test handler according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of a main portion of the handler for testing electronic components of FIG. 2.
4 and 5 are perspective views of a support device applied to the handler of FIG.
6 is a schematic perspective view of a support frame applied to the support device of FIG. 4.
FIG. 7 is a perspective view of a part of a test supporter applied to the supporting device of FIG. 4. FIG.
8 is a perspective view of a main part applied to the test supporter of FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments according to the present invention will be described with reference to the accompanying drawings, but for the sake of brevity, descriptions of technical contents, overlapping or substantially identical configurations presented through prior art or existing patent documents will be omitted or compressed if possible. .

<Description of Electronic Components>

1A and 1B illustrate an example of an electronic component ED handled in an electronic component test handler (hereinafter, abbreviated as “handler”) according to an embodiment of the present invention.

The produced electronic component ED has one surface S ₁ to perform a fingerprint recognition function, and the other surface S _{2 is} provided with electrical terminals T. There is an identification mark M (eg, a crosshair) for identifying a position around the edge of the other surface of the electronic component ED.

In the handler according to the embodiment to be described later, the electronic component ED is disposed below, and a test board which is one component of the tester coupled to the handler is disposed above. Here, the test board includes test sockets electrically connected to the electronic component ED. Therefore, in order for the electronic component ED and the tester to be electrically connected, the other surface of the electronic component ED should face upward. Therefore, the electronic component D is preferably supplied to the handler such that the other surface faces upward.

For reference, the electronic component ED of FIG. 1 is an intermediate product after initial production and before being divided into individual components. So, in the future, it is necessary to cut out the portions indicated by the dotted lines in the drawings and divide them into individual pieces, and the test board is provided with the same number of test pieces as the number of individual pieces.

<Overview of handlers>

FIG. 2 is a conceptual plan view of a handler ETH according to the present invention for supporting a test of a plate-like electronic component ED as shown in FIG. 1.

The handler ETH according to the present embodiment includes a moving device 100, a loading device 200, an unloading device 300, a transfer device 400, a support device 500, a moving device 600, and a rotating device ( 700, a horizontal moving device 800, a second camera 900, a vacuum device VA, and a control device CA.

The moving device 100 moves the electronic component ED in the loading position LP toward the unloading position UP.

The loading device 200 loads the electronic parts mounted in the magazine to the loading position LP, thereby allowing the electronic parts ED to be moved in the right direction by the moving device 100.

The unloading device 300 unloads the electronic component ED brought to the unloading position UP by the moving device 100 and mounts it in the magazine. The unloading device 300 may be provided symmetrically with the loading device 200 or may be provided in different structures.

The transfer device 400 moves the electronic component ED to be tested at the supply position SP adjacent between the loading position LP and the unloading position UP to the test region TS. The electronic component ED collected from the test area TS is recovered from the test area TS to the recovery position RP adjacent to the unloading position UP while being between the loading position LP and the unloading position UP. The component ED can be moved to the unloading position UP by the moving device 100. The transfer device 400 may be divided into a supply transfer 410 and a recovery transfer 420 in order to speed up the supply and recovery of the electronic component ED. Here, when the transfer device 400 sucks and holds the electronic component ED, when the upper second camera 900 photographs the electronic component ED, the identification mark M at the edge of the electronic component ED may be used. Since must be stamped, the vertical length of the adsorption plate provided in the transfer device 400 will be shorter than the horizontal length of each of the electronic component (ED).

The support device 500 supports the electronic component ED brought into the test area TS by the transfer apparatus 400, and supports a test for supporting a test of a fingerprint recognition function performed through one surface of the electronic component ED. And a first camera for photographing the test board above. Since the support device 500 is a characteristic configuration of the present invention, it will be described later with different contents.

The moving device 600 may be provided as a motor or a cylinder and is provided to move the support device 500 up and down as shown in the schematic view of FIG. 3. At this time, when the moving device 600 lifts the support device 500, the other surface (upper surface) of the electronic component ED supported by the support device 500 contacts the test board located above and the electronic component ED. The electrical terminal of the test socket provided on the test board and the electrical terminal of the) is electrically connected to each other, the electronic device (ED) that is supported by the support device 500 when the mobile device 600 lowers the support device 500 The electrical connection between the and the test socket is broken. The moving device 600 may be referred to as a contact device from the viewpoint of pressing the electronic component ED upward to contact the electrical terminal of the electronic component ED with the electrical terminal of the test socket.

The rotating device 700 rotates the support device 500 with the vertical axis PS as the rotating axis.

The horizontal moving device 800 moves the support device 500 in the horizontal, front and rear directions. Of course, the horizontal moving device 800 may be divided into a front and rear mover 810 and a left and right mover 820.

The second camera 900 photographs the other surface of the electronic component ED to be tested held by the transfer device 400. Since the image photographed by the second camera 900 includes the identification mark M on the electronic component ED, the control device CA is currently held by the transfer apparatus 400. ) Can be checked whether it is biased back and forth or left and right and the state of rotation on the horizontal plane. Of course, the second camera 900 may be provided in plurality in order to ensure accuracy. Here, the second camera 900 may be implemented to recognize the state of the terminal of the electronic component (ED), compare the existing data with the existing data, and check the alignment state. By recognizing identification marks such as patterns and markers on the surface, the alignment status of electronic components can be known based on them. Of course, as shown in the present embodiment, it is preferable to display the + magnetic line at the correct position of the electronic component ED and to recognize the position and thereby achieve the position alignment quickly and accurately.

The vacuum apparatus VA provides a vacuum force for vacuum-suctioning and fixing the electronic component ED in order to prevent the positional change of the electronic component ED supported by the supporting apparatus 500, which will be described later. do.

The controller CA controls each of the above components.

<Description of the support device>

4 is a perspective view of a support device 500 having characteristic features of the present invention applied to the handler ETH of FIG. 2, and FIG. 5 is a partially exploded perspective view of the support device 500 of FIG. 4.

As shown in FIGS. 4 and 5, the support apparatus 500 includes a support frame 510, a test supporter 520, a mover 530, and a first camera 540.

The support frame 510 supports the electronic component ED brought into the test area TS by the transfer device 400, and is provided to fix the electronic components ED by vacuum suction. That is, the lower surface of the electronic component ED is supported in contact with the upper surface of the support frame 510. The support frame 510 has support holes 511 and up and down suction grooves 512 penetrated in the vertical direction as shown in FIG. 6. In the suction grooves 512, a vacuum suction member VE which is one component of the vacuum apparatus VA for vacuum suction of the electronic component ED is inserted. Here, the vacuum flow passages 513 are formed in the support frame 510 to supply the vacuum force from the vacuum pump VP forming the rest of the vacuum apparatus VA to supply the vacuum force to the vacuum suction members VE. It is.

The test supporter 520 is provided to support a test of a fingerprint recognition function performed through one surface of the electronic component ED. To this end, the test supporter 520 has as many artificial fingerprint members 522 as the individual parts when the electronic parts ED are divided, and the artificial fingerprint members 522 correspond to the support holes 511. It is arrange | positioned at the position, and it moves up and down in the state inserted in the support hole 511. As shown in FIG. And the test support 520, as shown in the excerpt of FIG. 7 additionally has a pressurizing chamber 524 for supplying pressurized air. In the present embodiment, a plurality of artificial fingerprint members 522 are divided into six groups and modularized, and one pressure chamber 524 is provided for each group. 7 is an exploded perspective view of one of the modules extracted.

That is, as shown in the excerpt of FIG. 8, the test supporter 520 has a fixed column 521, an artificial fingerprint member 522, and a restoring spring 523 coupled together as a single part, and modularized as shown in FIG. 7. And a pressure chamber 524 for raising the plurality of artificial fingerprint members 522. This test supporter 520 will be described in more detail.

As described above, although several artificial fingerprint members 522 are modularized and driven in one pressurizing chamber 524, artificial fingerprint members 522 are individually lifted. Therefore, even when the electronic component (ED) is gripped by the vacuum adsorption force, the artificial fingerprint members 522 are implemented in such a manner that none of the artificial fingerprint members 522 are in close contact with each other, so that the lifting movement is not interrupted.

The fixing column 521 is a part fixed to the bottom surface of the pressurizing chamber 524.

Artificial fingerprint member 522 is an artificial fingerprint is formed on the upper surface for testing the fingerprint recognition function, and is separated from the fixed column 521. In addition, the artificial fingerprint member 522 is a contact portion 522a including an upper surface on which an artificial fingerprint in contact with the electronic component ED is formed of a material that is elastically compressed and restored by mixing a soft material such as silicon or rubber. It is preferable. In this embodiment, the contact portion 522a is implemented to be detachably mounted to the support portion 522b.

The restoring spring 523 pulls the artificial fingerprint member 522 toward the fixed pillar 521 with its elastic force. Therefore, the artificial fingerprint member 522 is normally maintained in a downward state.

The pressurizing chamber 524 is provided to upwardly move the artificial fingerprint members 522 by injecting pressurized air therein.

 The mover 530 provides pressurized air into the pressurizing chamber 524 to move the artificial fingerprint members 522 upward. Therefore, the mover 530 in the present embodiment is provided with a supply pipe 531 and a pressure pump 532, and operates independently from the mover 600. Of course, depending on the implementation, the mover 530 may be provided as a cylinder or other driving means. The upward movement direction of the artificial fingerprint member 522 by the mover 530 and the upward movement direction of the support device 500 by the movement device 600 are the same.

According to the above-mentioned configuration, it can be seen that each of the artificial fingerprint members 522 has a structure in which moving interference between each other is prevented. That is, the rising height of another artificial fingerprint member 522 does not interfere with the rising height of any one of the artificial fingerprint members 522. This allows the artificial fingerprint members 522 to be individually raised appropriately despite various tolerances such as the artificial fingerprint member 522 or furthermore, the manufacture of the test socket or the support frame 510. In addition, since the artificial fingerprint member 522 is a material that can be elastically compressed and deformed, the artificial fingerprint member 522 also has a function of pressing the electronic component ED toward the test socket. It also serves as a pressing member for additionally strengthening the electrical connection between the electrical terminal of the electronic component (ED) and the electrical terminal of the test socket.

The first camera 540 is provided to photograph the test board above. Through the image photographed by the first camera 540, the control device CA may know the exact position of the test board. In this embodiment, the first camera 540 is implemented in a configuration that is included in the support device 500 to move with the support device 500, but according to the embodiment is configured separately from the support device 500 It can also be fully considered.

<Description of the operation of the handler>

First, the first camera 540 photographs an upper test board prior to performing the full operation of the handler ETH.

The control device CA analyzes the image photographed by the first camera 540 and sets the correct position of the support device 500 to correspond to the test board.

When the correct position of the support apparatus 500 is set, the loading apparatus 200 loads the electronic component ED to the loading position LP, and the moving apparatus 100 operates to supply the electronic component ED to the supply position SP. Move to). Subsequently, when the transfer device 400 sucks and grasps the electronic component ED at the supply position SP and moves it to the test area TS, the second camera 900 photographs the other surface of the electronic component ED. do. The control device CA analyzes the position of the identification mark M on the image captured by the second camera 900 to determine the position of the electronic component ED currently held by the transfer apparatus 400.

When the position of the electronic component ED is determined, the control device CA controls the rotating device 700 and the horizontal moving device 800 to determine the position of the supporting device 500 by the transfer device 400. Change to correspond exactly to the position of the component (E). In addition, the transfer apparatus 400 lowers the electronic component ED to the support frame 510 of the support apparatus 500 in a state where the support apparatus 500 is changed. As the vacuum pump VP operates, the vacuum force is transferred to the vacuum adsorption member VE through the vacuum flow path 513 of the support frame 510, so that the electronic component ED is attracted to the upper surface of the support frame 510. Is fixed. In this state, this time the control device CA controls the rotating device 700 and the horizontal moving device 800 to support the device to a predetermined position by the corresponding relationship with the test board using the first camera 540 in advance. Return the position of 500. Of course, since the electronic component ED is already fixed to the upper surface of the support frame 510, the position thereof is not changed by an operation shock or the like in the process of returning the position of the support device 500.

Subsequently, in the state in which the position of the supporting device 500 is returned, the moving device 600 operates to raise and lower the supporting device 500 so that the electronic component ED contacts the test board above. Accordingly, the electronic component ED is electrically connected to the test sockets of the test board.

On the other hand, the pressure pump 532 constituting the mobile unit 530 injects the pressure air into the interior of the pressure chamber 524 to raise the artificial fingerprint member 522, accordingly the The upper surface is in close contact with the lower surface of the electronic component ED. The process of raising the artificial fingerprint member 522 by operating the mobile unit 530 is sufficient if the electronic component ED is made between the time when the electronic component ED is fixed to the support frame 510 and the time when the fingerprint recognition test is performed. It may be considered that the electronic component ED is made after contacting the test board.

When both the fingerprint test and other electrical characteristics test (or fingerprint test may be performed only) are completed, the mobile device 600 operates to move the support device 500 downward, and the operation of the pressure pump 532 is also performed. While being stopped, the fingerprint recognition member 522 moves downward by the elastic force of the restoring spring 523, and the operation of the vacuum pump VP is also stopped to release the fixed state of the electronic component ED. In this state, when the transfer device 400 sucks and grasps the electronic component ED and recovers the electronic component ED to the recovery position RP, the moving apparatus 100 operates to unload the electronic component ED. Move to (UP). Then, the unloading device 300 unloads the electronic component ED at the unloading position UP and mounts it in the magazine.

On the other hand, the above embodiment has been described as an example in which one surface of the electronic component (ED) is used for fingerprint recognition, but according to the implementation specific other such as additionally provided with an electrical terminal on one surface of the electronic component (ED) Even when utilized for the performance of the function, the present invention may be sufficiently applied through a simple configuration change of the test supporter 520.

As described above, although the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, the above embodiments have been described only by way of examples of the present invention. It should not be understood to be limited, and the scope of the present invention should be understood as the following claims and their equivalents.

ETH: Handler for Testing Electronic Components
100: moving device 200: loading device
300: unloading device 400: transfer device
500: support device
510: support frame
520: test support device
530: mover
540: first camera
600: moving device 700: rotating device
800: horizontal moving device 900: second camera
VA: Vacuum Unit CA: Control Unit

Claims (9)

A moving device for moving the plate-shaped electronic component from the loading position to the unloading position;
A loading device which allows the electronic component to be moved toward the unloading position by the moving device by loading the electronic component to be tested into the loading position;
An unloading device for unloading the tested electronic part from the unloading position when the electronic component tested by the moving device comes to the unloading position;
The electronic component to be tested between the loading position and the unloading position is supplied to a test region to test the electronic component, and the loaded electronic component is unloaded from the test region. A transfer device for recovering between the positions so that the recovered electronic parts can be moved to the unloading position by the moving device;
A support device for supporting the electronic component brought to the test area by the transfer device and having a test supporter for supporting a test of a specific function performed through one surface of the electronic component;
By moving the support device to the test board side having a test socket for contacting the electrical terminals on the other side of the electronic part for checking the electrical characteristics of the electronic part supported by the support device, A mobile device capable of contacting an electric terminal; And
A controller for controlling each of the above components; Including;
The support device,
A support frame for supporting the electronic component brought to the test area by the transfer device; And
A mover capable of moving at least a portion of the test support to the electronic component side so that a test for a specific function can be performed by contacting at least a portion of the test supporter with one surface of the electronic component supported by the support frame Containing
Handler for testing electronic components. According to claim 1,
One side of the electronic component is a fingerprint recognition surface for recognizing a fingerprint,
The test supporter includes an artificial fingerprint member for contacting the artificial fingerprint on the fingerprint recognition surface of the electronic component,
The mover moves the artificial fingerprint member to contact the artificial fingerprint member with an electronic component.
Handler for testing electronic components. The method of claim 2,
There are a plurality of artificial fingerprint members, each provided to prevent movement interference between each other
Handler for testing electronic components. A moving device for moving the plate-shaped electronic component from the loading position to the unloading position;
A loading device which allows the electronic component to be moved toward the unloading position by the moving device by loading the electronic component to be tested into the loading position;
An unloading device for unloading the tested electronic part from the unloading position when the electronic component tested by the moving device comes to the unloading position;
The electronic component to be tested between the loading position and the unloading position is supplied to a test region to test the electronic component, and the loaded electronic component is unloaded from the test region. A transfer device for recovering between the positions so that the recovered electronic parts can be moved to the unloading position by the moving device;
A support device for supporting the electronic component brought to the test area by the transfer device;
A contact device which electrically contacts the electronic component supported by the support device with a test socket on a test board so that electrical characteristics of the electronic component can be inspected; And
A controller for controlling each of the above components; Including,
The support device,
A support frame for supporting the electronic component brought to the test area by the transfer device; And
A test supporter having a pressing member which may be in contact with one surface of the electronic component by moving and which may pressurize and support the electronic component toward the test board; And
By moving the pressing member in the direction of the test board to enable the pressing member to press the electronic component to the test board side, electrical contact between the electrical terminal on the other surface of the electronic component and the test socket of the test board is made by the contact device. A mover additionally rigid and operating independently of the contact device; Containing
Handler for testing electronic components. The method of claim 4, wherein
The pressure member is a plurality, each provided to be prevented from interfering with each other
Handler for testing electronic components. The method of claim 4, wherein
The pressing member is provided with a material that can at least elastically compress and restore the contact portion in contact with one surface of the electronic component,
When the electrical connection work between the electronic component and the test socket is performed, the moving direction of the support device by the contact device and the moving direction of the pressing member by the mover are the same.
Handler for testing electronic components. The method according to claim 1 or 4,
A rotating device for rotating the support device with a vertical axis as the rotating axis;
A horizontal moving device for moving the support device in a horizontal direction; And
A first camera photographing the test board side; More,
The control device analyzes the image photographed by the first camera, sets the correct position of the support device, and then controls the rotating device and the horizontal moving device so that the electronic component supported by the support device is tested. To ensure that
Handler for testing electronic components. The method of claim 7, wherein
A second camera for photographing the other surface of the electronic component to be tested held by the transfer device; More,
The control device analyzes the image photographed by the second camera to determine the position of the electronic component, and then controls the rotating device and the horizontal moving device so that the electronic component can be accurately placed on the support device. When the electronic component is placed on the device, the rotating device and the horizontal moving device are controlled so that the electronic component supported by the support device can be exactly corresponded to the test board.
Handler for testing electronic components. The method of claim 8,
A vacuum apparatus for providing a vacuum force for vacuum suction of the electronic component to prevent the positional change of the electronic component supported by the support apparatus; Containing more
Handler for testing electronic components.

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