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KR20190102996A - 가공 장치 - Google Patents

가공 장치 Download PDF

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Publication number
KR20190102996A
KR20190102996A KR1020190012859A KR20190012859A KR20190102996A KR 20190102996 A KR20190102996 A KR 20190102996A KR 1020190012859 A KR1020190012859 A KR 1020190012859A KR 20190012859 A KR20190012859 A KR 20190012859A KR 20190102996 A KR20190102996 A KR 20190102996A
Authority
KR
South Korea
Prior art keywords
wafer
chuck table
polishing
processing
thickness
Prior art date
Application number
KR1020190012859A
Other languages
English (en)
Korean (ko)
Inventor
사토시 야마나카
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190102996A publication Critical patent/KR20190102996A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020190012859A 2018-02-27 2019-01-31 가공 장치 KR20190102996A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018033389A JP2019149461A (ja) 2018-02-27 2018-02-27 加工装置
JPJP-P-2018-033389 2018-02-27

Publications (1)

Publication Number Publication Date
KR20190102996A true KR20190102996A (ko) 2019-09-04

Family

ID=67751458

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190012859A KR20190102996A (ko) 2018-02-27 2019-01-31 가공 장치

Country Status (4)

Country Link
JP (1) JP2019149461A (ja)
KR (1) KR20190102996A (ja)
CN (1) CN110193774A (ja)
TW (1) TW201937647A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0899265A (ja) 1994-09-30 1996-04-16 Disco Abrasive Syst Ltd 研磨装置
JP2005246491A (ja) 2004-03-01 2005-09-15 Disco Abrasive Syst Ltd 研削装置及びウェーハの研削方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5867026A (ja) * 1981-10-19 1983-04-21 Hitachi Ltd ステップアンドリピート方式の露光装置
JPH07335592A (ja) * 1994-06-14 1995-12-22 Toshiba Corp ダイシング装置とその方法およびダイシング用チャッキング装置
JPH1015815A (ja) * 1996-07-01 1998-01-20 Canon Inc 基板矯正装置および方法
JPH10308367A (ja) * 1997-04-30 1998-11-17 Canon Inc デバイスの製造方法
JPH1174242A (ja) * 1997-06-30 1999-03-16 Hitachi Ltd 半導体装置の製造方法
JP5081490B2 (ja) * 2007-04-19 2012-11-28 不二越機械工業株式会社 ワークの片面研磨装置および片面研磨方法
US8298041B2 (en) * 2010-10-08 2012-10-30 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for wafer back-grinding control
JP2012205258A (ja) * 2011-03-28 2012-10-22 Seiko Instruments Inc 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計
JP2014075408A (ja) * 2012-10-03 2014-04-24 Disco Abrasive Syst Ltd 保持テーブル及び保持方法
JP6727069B2 (ja) * 2016-08-09 2020-07-22 東京エレクトロン株式会社 接合装置および接合システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0899265A (ja) 1994-09-30 1996-04-16 Disco Abrasive Syst Ltd 研磨装置
JP2005246491A (ja) 2004-03-01 2005-09-15 Disco Abrasive Syst Ltd 研削装置及びウェーハの研削方法

Also Published As

Publication number Publication date
CN110193774A (zh) 2019-09-03
TW201937647A (zh) 2019-09-16
JP2019149461A (ja) 2019-09-05

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