KR20190073919A - Organic light emitting display device - Google Patents

Abstract

According to the present specification, disclosed is an organic light emitting display device. The organic light emitting display device can comprise: an encapsulation layer covering an organic light emitting element; a touch electrode disposed on the encapsulation layer; a routing wiring connecting the touch electrode and a touch driving circuit; and a connection structure provided on the encapsulation layer for connecting the routing wiring and the touch driving circuit. Therefore, an objective of the present invention is to provide a display device having a thin thickness and a small width of a bezel by embedding a touch sensor.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light-

The present invention relates to an organic light emitting display.

The image display device that realizes various information on the screen is a core technology of the information communication age and it is becoming thinner, lighter, more portable and higher performance. Accordingly, an organic light emitting display device for displaying an image by controlling the amount of light emitted from the organic light emitting device has attracted attention.

The organic light emitting device is advantageous in that it can be made thin as a self-luminous device using a thin light emitting layer between electrodes. A general organic light emitting display has a structure in which a pixel driving circuit and an organic light emitting element are formed on a substrate, and light emitted from the organic light emitting element passes through a substrate or a barrier layer to display an image.

2. Description of the Related Art [0002] An organic light emitting diode (OLED) display device can accept a user's commands through various input devices. Among them, a touch input device that allows a user to input commands intuitively and conveniently by touching a display device is widely used. The touch input device may be referred to as a touch sensor because it senses coordinates in which a touch is performed. When the touch input device is included in the organic light emitting display device, the number of wires, connection points, and the like for transmitting touch driving and / or sensing signals may increase, and the thickness and size of the display device may increase.

Recently, attempts have been made to reduce the width of the bezel area of the display device for reasons such as aesthetics. In addition, even in the organic light emitting display device incorporating the touch input device, research is underway to construct an organic light emitting display device without increasing the space due to the touch input device. Accordingly, the inventors of the present invention have attempted to satisfy the functionality and aesthetics of the organic light emitting display device by minimizing the bezel by improving the connection structure of the touch input device. The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an embodiment of the present invention, an organic light emitting display is provided. The OLED display includes a sealing layer covering an organic light emitting diode; A touch electrode disposed on the sealing layer; A routing wiring connecting the touch electrode and the touch driving circuit; And a connection structure provided on the sealing layer for connecting the routing wiring and the touch driving circuit.

The connection structure may overlap the outer end portion of the sealing layer.

The connection structure may include a connection electrode in contact with the touch driving circuit and a contact hole in an upper portion of the connection electrode, and the contact hole may be provided through the sealing layer covering the connection electrode.

The sealing layer may include a first inorganic film, an organic film, and a second inorganic film which are sequentially stacked, and the contact hole may be provided through at least one of the first inorganic film and the second inorganic film.

The connection structure may be outside the blocking structure for controlling the flow of the organic film. In particular, the connection structure may be between the bending section bent at a predetermined angle and the blocking structure. Further, the connection structure may be within the deposition margin range of the first inorganic film or the second inorganic film.

The organic light emitting display includes a touch buffer layer under the touch electrode; A protective layer covering the touch electrode; A bridge in a layer different from the touch electrode; And an insulating layer between the bridge and the touch electrode. The connection structure may include a touch buffer, the insulating layer, and a contact hole formed through the sealing layer.

The details of other embodiments are included in the detailed description and drawings.

Embodiments of the present invention can provide a display device having a small thickness and a small width of a bezel by incorporating a touch sensor. Therefore, the embodiments of the present invention can provide an organic light emitting display having a favorable appearance while enhancing user's convenience. The effects according to the embodiments of the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

Figure 1 illustrates an exemplary display device that may be included in an electronic device.
2 is a schematic view of a touch sensor which can be applied to a display device.
3A and 3B are views schematically showing a display region and a part of a non-display region of the display device.
4A and 4B are views showing the outer frame structure of the display device according to the embodiment of the present invention.

Brief Description of the Drawings The advantages and features of the present disclosure, and how to accomplish them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise. In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions. An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening "or that each component may be" connected, "" coupled, "or " connected" through other components.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown. Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Figure 1 illustrates an exemplary display device that may be included in an electronic device.

Referring to FIG. 1, the display device 100 includes at least one active area, and an array of pixels is formed in the display area. One or more inactive areas may be disposed around the display area. That is, the non-display area may be adjacent to one or more sides of the display area. In Fig. 1, the non-display area surrounds a display area of a rectangular shape. However, the shape of the display region and the shape / arrangement of the non-display region adjacent to the display region are not limited to the example shown in Fig. The display area and the non-display area may be in a form suitable for the design of the electronic device on which the display device 100 is mounted. Illustrative forms of the display area are pentagonal, hexagonal, circular, oval, and the like.

Each pixel in the display area can be associated with a pixel circuit. The pixel circuit may include at least one switching transistor and at least one driving transistor on a backplane. Each pixel circuit may be electrically connected to a gate line and a data line to communicate with one or more driving circuits such as a gate driver and a data driver located in the non-display area.

The driving circuit may be implemented with a thin film transistor (TFT) in the non-display region, as shown in FIG. This driving circuit may be referred to as a gate-in-panel (GIP). In addition, some components, such as a data driver IC, are mounted on a separate printed circuit board, and circuit films such as flexible printed circuit boards (FPCB), chip-on-film (COF), tape- (Pad / bump, pin, etc.) disposed in the non-display area. The non-display area may be bent together with the connection interface so that the printed circuit (COF, PCB, etc.) may be positioned behind the display device 100.

The display device 100 may further include various additional elements for generating various signals or driving pixels in the display area. An additional element for driving the pixel may be an inverter circuit, a multiplexer, an electrostatic discharge circuit, or the like. The display device 100 may also include additional elements associated with functions other than pixel driving. For example, the display device 100 may include additional elements that provide a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, a tactile feedback function, and the like. The above-mentioned additional elements may be located in the non-display area and / or an external circuit connected to the connection interface.

One or more edges of the display device 100 may be bent away from the central portion. Since at least one portion of the display device 100 can be bent, the display device 100 can be defined as a substantially flat portion and a bended portion. That is, a part of the display device 100 (for example, the wiring part between the pad PAD and the display area) is bent at a predetermined angle, and this part can be referred to as a bent part. The bending portion includes a bended section that is actually bent at a predetermined bending radius. Although not always, the central portion of the display device 100 may be substantially flat and the corner portions may be curved portions.

When the non-display area is bent, the non-display area is not visible on the front surface of the display device, or is at least visible. A part of the non-display area seen from the front side of the display device may be covered with a bezel. The bezel may be formed of a unique structure, or a housing or other suitable element. A portion of the non-display area seen on the front side of the display device may be hidden under an opaque mask layer such as black ink (e.g., a polymer filled with carbon black). This opaque mask layer may be provided on the various layers (touch sensor layer, polarizing layer, cover layer, etc.) included in the display device 100.

The bending portion can bend outward from the center portion with a bending angle? And a bending radius R with respect to the bending axis. The size of each bent portion need not be the same. Further, the bending angle? Around the bending axis and the radius of curvature R from the bending axis may be different for each bent portion.

2 is a schematic view of a touch sensor which can be applied to a display device.

The touch sensor may be coupled to the display device in a separate panel form, or may be embedded in the display device. When the touch sensor is built in a display device, the touch sensor may be implemented as one of electrodes used for driving the device, or may be separately disposed for touch input sensing. In the organic light emitting display, the touch sensor may be disposed on an encapsulation layer. In this case, it is possible to overcome the problem that it is difficult to form a touch sensor, which is a metal material, in the display panel due to organic substances.

The touch sensor may be a transparent electrode, a mesh electrode, or the like, and may be arranged in various structures according to a touch sensing method. For example, the touch sensors may be disposed on the display device separately from each other, and each touch sensor may be connected to one touch wiring. In addition, a touch input can be sensed by measuring a change in self capacitance caused by a user's touch (self-capacitance sensing). As another example, as shown in FIG. 2, the touch sensor may include a first touch sensor TS1 and a second touch sensor TS2 to which voltages of different levels are applied. The mutual capacitance sensing may be performed by measuring a change in mutual capacitance between the first touch sensor TS1 and the second touch sensor TS2 that occurs when a touch is input.

When touch input is sensed by the mutual capacitance sensing method, the first touch sensor TS1 may be connected and arranged in one direction. The second touch sensor TS2 may be connected to the first touch sensor TS1 in a direction crossing the first touch sensor TS1. The first touch sensor TS1 may be connected to the first touch wiring TL1 and the second touch sensor TS2 may be connected to the second touch wiring TL2. Voltages of different levels are applied through the first touch wiring TL1 and the second touch wiring TL2 in the touch sensing period. When the first touch sensor TS1 and the second touch sensor TS2 are turned on at the time of touch input by the user, A capacitance change may occur. The touch driving circuit 200 drives the first touch sensor TS1 and the second touch sensor in the touch sensing period and senses a change in capacitance between the first touch sensor TS1 and the second touch sensor TS2 . The touch driving circuit 200 converts the sensed value into digital data, and detects the presence or absence of touch and the touch position using the converted digital data. The touch driving circuit 200 may be configured separately from the driving circuit for driving the display device, or may be integrated with the display driving circuit on one chip.

3A and 3B are views schematically showing a display region and a part of a non-display region of the display device.

FIG. 3A is an enlarged view of the area A in FIG. 1, in which only data lines (source lines) are shown, and other lines (power lines, etc.) are omitted. Further, the wiring shape of the area LA through which the data lines pass is not shown. On the other hand, in Figs. 3A and 3B, a bending section BA which can be bent is illustrated, and only data lines in the bending section BA are shown. 3B is a cross-sectional view taken along line a-a '. Hereinafter, the display device will be described by taking an organic light emitting display as an example.

In the case of the organic light emitting diode display, thin film transistors 102, 104 and 108, organic light emitting elements 112, 114 and 116 and various functional layers are formed on the base layer 101 in the display area A / . On the other hand, various driving circuits (for example, GIP), electrodes, wires, functional structures, and the like may be disposed on the base layer 101 in the non-display area.

The base layer 101 supports various components of the organic light emitting diode display 100. The base layer 101 may be formed of a transparent insulating material, for example, an insulating material such as glass, plastic, or the like. The substrate (array substrate) may also be referred to as a concept including an element and a functional layer formed on the base layer 101, for example, a switching TFT, a driving TFT, an organic light emitting element, a protective film and the like.

The buffer layer 103 may be located on the base layer 101. [ The buffer layer is a functional layer for protecting a thin film transistor (TFT) from impurities such as alkaline ions or the like flowing out from the base layer 101 or the lower layers. The buffer layer may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof. The buffer layer 103 may include a multi-buffer and / or an active buffer.

A thin film transistor is placed on the base layer 101 or the buffer layer. The thin film transistor has a structure in which a semiconductor layer (active layer), a gate insulator, a gate electrode, an interlayer dielectric layer (ILD), a source and a drain electrode are sequentially stacked Alternatively, the thin film transistor may have a structure in which the gate electrode 104, the gate insulating layer 105, the semiconductor layer 102, and the source and drain electrodes 108 are sequentially arranged as shown in FIG.

The semiconductor layer 102 may be made of polysilicon (p-Si), in which case a predetermined region may be doped with an impurity. Further, the semiconductor layer 102 may be made of amorphous silicon (a-Si), or may be made of various organic semiconductor materials such as pentacene. Further, the semiconductor layer 102 may be made of oxide.

The gate electrode 104 may be formed of various conductive materials such as Mg, Al, Ni, Cr, Mo, W, Au, Or the like.

The gate insulating layer 105 and the interlayer insulating layer ILD may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material or the like. A contact hole through which the source and drain regions are exposed may be formed by selective removal of the gate insulating layer 105 and the interlayer insulating layer.

The source and drain electrodes 108 are formed in the form of a single layer or a multi-layered material for the electrodes on the gate insulating layer 105 or the interlayer insulating layer (ILD). A protective layer 109 composed of an inorganic insulating material may cover the source and drain electrodes 108 as needed.

The planarizing layer 107 may be located on the thin film transistor. The planarizing layer 107 protects the thin film transistor and flattenes the top surface thereof. The planarization layer 107 may be formed in various shapes and may be formed of an organic insulating film such as BCB (benzocyclobutene) or acrylic or an inorganic insulating film such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx) It may be formed as a single layer, or it may be composed of a double layer or a multi layer.

The organic light emitting device may have a structure in which a first electrode 112, an organic light emitting layer 114, and a second electrode 116 are sequentially arranged. That is, the organic light emitting device includes a first electrode 112 formed on the planarization layer 107, an organic light emitting layer 114 disposed on the first electrode 112, and a second electrode (not shown) disposed on the organic light emitting layer 114 116).

The first electrode 112 is electrically connected to the drain electrode 108 of the driving thin film transistor through the contact hole. When the organic light emitting display 100 is a top emission type, the first electrode 112 may be made of an opaque conductive material having high reflectance. For example, the first electrode 112 may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) . The first electrode 112 may be an anode of an organic light emitting diode.

The bank 110 is formed in the remaining region except for the light emitting region. Accordingly, the bank 110 has a bank hole for exposing the first electrode 112 corresponding to the light emitting region. The bank 110 may be made of an inorganic insulating material such as a silicon nitride film (SiNx), a silicon oxide film (SiOx), or an organic insulating material such as BCB, acrylic resin or imide resin.

The organic light emitting layer 114 is positioned on the first electrode 112 exposed by the bank 110. [ The organic light emitting layer 114 may include a light emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like. The organic light emitting layer may have a single light emitting layer structure that emits a single light or may include a plurality of light emitting layers to emit white light.

And the second electrode 116 is located on the organic light emitting layer 114. When the OLED display 100 is a top emission type, the second electrode 116 may be a transparent conductive layer such as indium tin oxide (ITO) or indium zinc oxide (IZO) Thereby emitting the light generated in the organic light emitting layer 114 to the upper portion of the second electrode 116. The second electrode 116 may be a cathode of the organic light emitting diode.

The encapsulation layer 120 is located on the second electrode 116. The sealing layer 120 prevents oxygen and moisture penetration from the outside in order to prevent oxidation of the light emitting material and the electrode material. When the organic light emitting device is exposed to moisture or oxygen, a pixel shrinkage phenomenon in which the light emitting region is reduced or a dark spot in the light emitting region may occur. The encapsulation layer may be formed of an inorganic film made of glass, metal, aluminum oxide (AlOx) or silicon (Si) based material, or may be composed of an organic film 122 and inorganic films 121-1 and 121-2. May alternatively be stacked. At this time, the inorganic films 121-1 and 121-2 serve to block the penetration of moisture and oxygen, and the organic film 122 serves to flatten the surfaces of the inorganic films 121-1 and 121-2 do. When the encapsulation layer is formed of a plurality of thin film layers, the movement path of water or oxygen becomes long and complicated as compared with the case of a single layer, so that moisture / oxygen penetrates into the organic light emitting element becomes difficult.

The pixel circuit and the light emitting element are not disposed in the non-display area I / A, but the base layer 101 and the organic / inorganic functional layers 103, 105, 107 120 and the like may exist. In addition, the materials used in the constitution of the display area A / A may be arranged in the non-display area I / A for other purposes. For example, the same metal 104 'as the gate electrode of the display region TFT or the same metal 108' as the source / drain electrode can be arranged in the non-display region I / A for wiring or electrode. Furthermore, the same metal 112 'as the one electrode (for example, the anode) of the organic light emitting diode may be disposed in the non-display area I / A for the wiring and the electrode.

The base layer 101, the buffer layer 103, the gate insulating layer 105 and the planarization layer 107 of the non-display area I / A are the same as those described in the display area A / A. The dam 190 is a structure that controls the organic film 122 to spread too far into the non-display area I / A. Various circuits and electrodes / wires arranged in the non-display area I / A can be made of the gate metal 104 'and / or the source / drain metal 108'. At this time, the gate metal 104 'is formed in the same process with the same material as the gate electrode of the TFT, and the source / drain metal 108' is formed in the same process with the same material as the source / drain electrode of the TFT.

The source / drain metal may be used as the connecting electrode 108 ". The illustrated connecting electrode 108 " is used for connecting the touch sensor 130 and its driving circuit described below. For example, a touch driver circuit mounted on a separate circuit board is connected to a connection interface such as the pad of FIG. 1 and a connection electrode 108 " connected to the pad is connected to the touch sensor 130, So that the touch driving circuit can exchange signals with the touch sensor.

As the thickness and / or the width of the display device may increase due to the combination of the panel type touch sensor, research has been conducted to place the touch sensor inside the display device. As one of the methods, (Hereinafter referred to as a touch electrode). This type of built-in touch sensor is called Touch-on-on-Encapsulation (ToE).

Referring to FIG. 3B, the touch sensor 130 includes a touch buffer layer 131 on an encapsulation layer 120. The touch buffer layer 131 may be formed of an inorganic film (e.g., SiNx). The touch buffer layer 131 may prevent the sealing layer 120 from being damaged during the formation of the touch sensor.

A bridge 132 may be placed on the touch buffer layer 131. The bridge 132 is placed at a point where the touch electrodes arranged in different directions cross each other and used to connect the touch electrodes in one direction. A touch insulation layer 133 is disposed on the bridge 132. The touch insulation layer 133 insulates the bridge 132 from the touch electrode 134.

The touch electrode 134, the routing wiring 135, and the like may be positioned on the touch insulation layer 133. [ The touch electrode 134 may be formed as two electrodes crossing each other as shown in FIG. That is, when the touch sensors are arranged in a mutual capacitance sensing structure, a portion where the touch electrodes in the first direction are connected to each other and a portion where the touch electrodes in the second direction are connected to each other may cross. At this time, the touch electrodes extending in one direction are connected through the bridge 132.

The routing wiring 135 is connected to a circuit that drives the touch sensor through a connection electrode 108 " and other anti-face (e.g., pad). Through the connection, the routing wiring 135 transmits a control signal or the like of the touch driving circuit to the touch electrode 134, and can transmit a signal sensed by the touch electrode to the driving circuit. A passivation may be further disposed on the touch electrode 134 and the routing wiring 135.

The sealing layer 120 of the structure illustrated in Figs. 2A and 2B covers all of the display area and a part of the non-display area. At this time, the inorganic films 121-1 and 121-2 are formed only up to a certain distance from the bending section BA. This is because the inorganic films 121-1 and 121-2 have a high risk of being damaged by bending stress. Thus, in FIG. 2A, the inorganic films 121-1 and 121-2 are designed to cover the bottom of E1 and the organic film 122 to cover the bottom of the dam 190. FIG. Since the inorganic films 121-1 and 121-2 are formed by a deposition (e.g., CVD) process using a mask, a predetermined clearance, that is, a margin, is provided at the end. This margin is shown in Fig. 3A.

The passivation layer 170 is provided with a layer to protect the wires of the bending section BA from moisture and other foreign matter. The protective layer 170 is flexible enough to be used in the bending section BA.

The inventors have found some problems in the outer structure of the display device and the touch sensor connection structure described above. One of them is that the outer area (bezel) is widened by adding a space for external connection of the touch sensor. Conventionally, in order to stably form an encapsulating layer, particularly an inorganic film, it was a common design that the routing wiring 135 and the connecting electrode 108 " are connected to each other outside the inorganic film deposition margin (Margin) However, such a design / structure requires more space than the display area of the sealing layer above the connection area 180 as compared with the display device without the touch sensor. This is in line with trends demanding a narrower bezel in recent years. Therefore, the inventors have devised a structure that can reduce the space occupied by the connection structure of the touch sensor.

4A and 4B are views showing the outer frame structure of the display device according to the embodiment of the present invention.

FIG. 4A is an enlarged view of a portion A in FIG. 1. For convenience of explanation, only specific wires (for example, data lines) are shown and other wires (power supply lines, etc.) are omitted. In Fig. 4A, a curved section BA is illustrated, and only the curved sections in the curved section BA are shown. FIG. 4B is substantially the same as FIG. 3B except for the connection structure of the touch sensor, and thus a duplicated description will be omitted.

In order to solve the problem described in FIG. 3, the inventors have devised an organic light emitting display in which the external connection structure of the touch sensor 430 placed on the sealing layer 420 is improved. The organic light emitting display includes a substrate 401 having a display area A / A and a non-display area I / A outside the display area; An encapsulating layer 420 covering the organic light emitting devices 412, 414, and 416 on the substrate 401; And a touch sensor 430 on the sealing layer 420. The display area A / A includes a pixel and a pixel circuit associated with the pixel, and a non-display area surrounds the display area.

The touch sensor 430 includes a touch electrode 434 disposed on the sealing layer 420; And a routing wiring 435 connecting the touch electrode 434 and a touch driving circuit (e.g., a touch driver IC). More specifically, the touch sensor 430 includes a touch buffer layer 431 on the sealing layer 420, a touch electrode 434 on the touch buffer layer 431, and a routing (not shown) connected to the touch electrode 434. [ routing wiring 435, an insulating layer 433 on the touch buffer layer 431, and the like.

Below the touch electrode 434 is a touch buffer layer 431. When the touch electrodes are arranged in different directions, a bridge 432 in a layer different from the touch electrode may be provided on the touch buffer layer 431 to avoid overlap at the intersections. At this time, some of the touch electrodes may be connected to each other through the bridge 432, and an insulation layer 433 may be provided between the bridge 432 and the touch electrode 434. A protective layer covering the touch electrode 434 may be disposed on the touch electrode 434.

The touch electrode 434 and the touch driving circuit are connected to each other through a connection structure provided in a non-display area. That is, the touch electrode 434 is connected to the routing wiring 435, the routing wiring 435 is connected to the connection structure, and the connection structure extends to the pad portion and is connected to the touch driving circuit.

The connection structure is provided on the sealing layer 420 for connection of the routing wiring 435 and the touch driving circuit. In the embodiment of Figures 4a and 4b, the location of the connecting region 480 in which the connecting structure is disposed is above the sealing layer, unlike the embodiment of Figure 3, which is outside the sealing layer. That is, the connection structure may overlap the outer edge of the sealing layer 420.

The connection structure includes a connection electrode 408 '' in contact with the touch driving circuit and a contact hole in the upper portion of the connection electrode 408 ''. The connection electrode 408 '' is provided to connect the routing wiring 435 and a driving circuit for driving the touch sensor 430. The connection electrode 408 '' may be formed of the same material (for example, Ti / Al / Ti) as the source electrode or the drain electrode of the thin film transistor (TFT) included in the pixel circuit of the display area. The contact hole is a region in which the connection electrode 408 '' and the routing wiring 435 are in direct contact with each other and may be provided through the encapsulation layer covering the connection electrode 408 ''. The routing wiring 435 is electrically connected to the connection electrode 408 'through the contact hole passing through the encapsulation layer 420, the touch buffer layer 431 and the insulation layer 433 in the non-display area I / ').

4B, the sealing layer 420 may include a first inorganic layer 421-1, an organic layer 422, and a second inorganic layer 421-2 which are sequentially stacked. The blocking structure 490 is a kind of dam that blocks the organic film 422 from spreading further to the outside of the display device. The first and / or second inorganic film may cover the upper portion of the blocking structure 490 and may extend to the outside of the blocking structure 490. At this time, the connection structure is outside the blocking structure 490 which controls the flow of the organic film 422. In this case, the connection structure is located between the bending section BA bent at a predetermined angle and the blocking structure 490.

In this embodiment, the connection electrode 408 '' may overlap the deposition boundary E1 of the first inorganic film 421-1 and / or the second inorganic film 421-2. That is, the connection structure may be within the deposition margin range of the first inorganic film 421-1 and / or the second inorganic film 421-2. Therefore, the contact hole formed on the connection electrode 408 " may be formed of at least one of the inorganic films (i.e., the first inorganic film 421-1 and the second inorganic film 421-2) One or more). Also, the touch buffer layer 431 and the insulating layer 433 may be formed to cover the upper portion of the connection electrode 408 ''. The connection structure may include contact holes provided not only to the sealing layer (first and second inorganic films) but also to the touch buffer layer 431 and / or the insulating layer 433. The contact holes may be formed together in the process of patterning the insulating layer 433 (for example, a dry etching process) to connect the touch electrode 434 and the bridge 432.

The protective layer 470 is provided to protect the wires of the bending section BA from moisture and other foreign matter. The protective layer 470 has sufficient flexibility to be used in the bending section BA. The protective layer 470 may be coated with a thickness determined to adjust the neutral plane at the bending section BA. More specifically, the thickness added to the protective layer 470 in the bending section BA can move the plane of the conductor and / or the wiring structure closer to the neutral plane. Further, it is preferable that the protective layer 470 is a material which is cured at a low energy within a limited time so that the parts below it are not damaged during the curing process. For example, the protective layer 470 may be formed of a light-curable acrylic resin (e.g., UV light, visible light, etc.). Also, one or more moisture-absorbing getters may be mixed in the protective layer 470 to inhibit the penetration of moisture through the protective layer 470.

As described above, the organic light emitting display according to the embodiment of the present invention allows the connection structure of the touch sensor to be overlapped with the sealing layer, thereby saving space compared to the conventional structure. Accordingly, the organic light emitting display device can suppress the increase of the bezel width due to the touch sensor, thereby maximizing the advantages of the built-in touch sensor.

While the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to these embodiments, and various modifications may be made without departing from the scope of the present invention. Therefore, the embodiments disclosed herein are for the purpose of describing rather than limiting the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, and may be technically variously interlocked and driven by one of ordinary skill in the art and that each embodiment may be implemented independently of one another, . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

Claims (15)

A sealing layer covering the organic light emitting element;
A touch electrode disposed on the sealing layer;
A routing wiring connecting the touch electrode and the touch driving circuit;
And a connection structure provided on the sealing layer for connection between the routing wiring and the touch driving circuit. The method according to claim 1,
Wherein the connection structure overlaps an outer end portion of the sealing layer. The method according to claim 1,
Wherein the connection structure includes a connection electrode in contact with the touch driving circuit and a contact hole in the upper portion of the connection electrode,
And the contact hole passes through the sealing layer covering the connection electrode. The method of claim 3,
Wherein the sealing layer comprises a first inorganic film, an organic film and a second inorganic film which are sequentially stacked,
Wherein the contact hole passes through at least one of the first inorganic film and the second inorganic film. 5. The method of claim 4,
Wherein the connection structure is located outside the blocking structure for controlling the flow of the organic film. 6. The method of claim 5,
Wherein the connection structure is between a bending section bent at a predetermined angle and the blocking structure. 5. The method of claim 4,
Wherein the connection structure is within a deposition margin range of the first inorganic film or the second inorganic film. The method according to claim 1,
A touch buffer layer below the touch electrode; And a protective layer covering the touch electrode. 9. The method of claim 8,
A bridge in a layer different from the touch electrode; And an insulating layer between the bridge and the touch electrode. 10. The method of claim 9,
Wherein the connection structure includes a touch buffer, the insulating layer, and a contact hole provided through the sealing layer. A substrate having a display region and a non-display region outside the display region;
A sealing layer covering the organic light emitting device on the substrate;
And a touch sensor on the sealing layer,
The touch sensor includes:
A touch buffer layer on the sealing layer, a touch electrode on the touch buffer layer, and a routing wiring connected to the touch electrode; / RTI >
Wherein the routing interconnection contacts the connection electrode through a contact hole passing through the encapsulation layer and the touch buffer layer in the non-display region. 12. The method of claim 11,
Wherein the connection electrode connects the routing wiring and a driving circuit for driving the touch sensor. 12. The method of claim 11,
Wherein the connection electrode is formed of the same material as the source electrode or the drain electrode of the thin film transistor (TFT) included in the pixel circuit of the display region. 12. The method of claim 11,
Wherein the contact hole is provided through at least one of the inorganic film constituting the sealing layer and the touch buffer layer. 15. The method of claim 14,
Further comprising an insulating layer on the touch buffer layer,
Wherein the contact hole is provided so as to pass through the at least one inorganic film, the touch buffer layer, and the insulating layer.

Images