KR20190042592A - Exposure Apparatus and Exposure Method - Google Patents

Abstract

The exposure apparatus includes a substrate holding portion 2 for holding a substrate W having a plurality of exposure regions E1 to E6 and a mask M having a pattern having a size substantially the same as the exposure region E, A substrate transfer section 10 capable of transferring the substrate W in a predetermined direction and a mask transfer section 40 capable of transferring the mask M in a predetermined direction, A mask drive unit 50 capable of adjusting the alignment of the substrate W with the mask M and an illumination device 3 for irradiating the exposure area E with exposure light via the mask M do.

Description

Exposure Apparatus and Exposure Method

The present invention relates to an exposure apparatus and an exposure method, and more particularly, to an exposure apparatus and an exposure method for exposing a substrate having a plurality of exposure regions using a mask smaller than a substrate.

Conventionally, a mask, which is smaller than a substrate as an object to be exposed, is held by a mask holding portion, a substrate is held by a substrate holding portion, and a substrate is moved stepwise with respect to a mask, There is known a split-stage exposure apparatus in which light for exposure is irradiated from the exposure illumination apparatus to the mask at every step, and the pattern of the mask is successively exposed and transferred onto the substrate.

It is also possible to use a small photomask arranged in a direction orthogonal to the substrate transport direction while continuously transporting the substrate and to perform alignment of the substrate and photomask during exposure with high precision, (See, for example, Patent Document 1). In this case, the image pickup apparatus photographs the light-shielding layer formed in the exposure area on the substrate to obtain the slope of the light-shielding layer with respect to the substrate transport direction, and based on this, rotates and moves the photomask, And the tilt is corrected.

Japanese Laid-Open Patent Publication No. 2012-123050

9, the substrate holding unit for holding the substrate is moved to a predetermined exposure position (Ta1), and thereafter, marks of the mask and the substrate are imaged by an alignment camera (Ta2), alignment correction is performed to align the marks of the mask and the substrate while driving the mask (Ta3). After confirming the correction result (Ta4), the alignment camera is retracted from the exposure area (Ta5), and exposure light is irradiated to the substrate via the mask to perform exposure transfer of the mask pattern (Ta6). 9, Vw is the moving speed of the substrate holding portion, Vm is the moving speed of the mask holding portion, and Vc is the moving speed of the alignment camera. In such a divided-axis exposure apparatus, since the movement and stop of the substrate holding section, the mask holding section, and the alignment camera are repeated for each exposure, the time required for one exposure is long and when a plurality of exposure is performed on a single substrate , There is a problem that the production time is increased due to an increase in the number of exposures and the production efficiency is lowered.

In addition, the scan exposure apparatus as in Patent Document 1 does not correspond to the exposure of a pattern used in the divided-axis exposure apparatus, since the pattern in the substrate carrying direction is specialized for exposure in a constant line-shaped exposure.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an exposure apparatus and an exposure method capable of efficiently performing exposure transfer to a substrate having a plurality of exposure areas by shortening a tact time.

The above object of the present invention is achieved by the following constitution.

(1) A substrate holding apparatus for holding a substrate as a substrate having a plurality of exposure regions,

A mask holding portion for holding a mask having a pattern having a size substantially equal to the exposure region;

A substrate carrying section capable of driving the substrate holding section to carry the substrate in a predetermined direction,

An alignment detection system for detecting an alignment mark formed on the mask and the substrate,

A mask driving unit for driving the mask holding unit to adjust alignment of the substrate and the mask,

A mask carrying section capable of driving the driving section table on which the mask driving section is placed and carrying the mask in the predetermined direction,

And an illumination device for irradiating the exposure region of the substrate with exposure light via the mask.

(2) a detection system driver for driving the alignment detection system is further provided,

The exposure apparatus according to (1), wherein the alignment detection system and the detection system driving unit are disposed in the mask holding unit and are transported by the mask transport unit along the predetermined direction.

(3) The exposure apparatus according to (1) or (2), further comprising an illumination device carrier section capable of carrying the illumination device in the predetermined direction.

(4) The exposure apparatus according to any one of (1) and (2), wherein the illumination device has at least a long effective irradiation area in the predetermined direction with respect to the exposure area of the substrate.

(5) a substrate holding unit for holding a substrate as a substrate having a plurality of exposure regions,

A mask holding portion for holding a mask having a pattern having a size substantially equal to the exposure region;

A substrate carrying section capable of driving the substrate holding section to carry the substrate in a predetermined direction,

An alignment detection system for detecting an alignment mark formed on the mask and the substrate,

A mask driving unit for driving the mask holding unit to adjust alignment of the substrate and the mask,

A mask carrying section for driving the driving section table on which the mask driving section is mounted and capable of carrying the mask in a predetermined direction,

And an illumination device for irradiating the exposure region of the substrate with exposure light through the mask, the exposure method comprising:

A step of transporting the substrate in a predetermined direction by the substrate transfer section;

Moving the mask in the predetermined direction and synchronizing the mask with the substrate by the mask carrying section;

Aligning the mask and the substrate by the alignment detecting system and the mask driving unit;

And a step of irradiating exposure light from the illumination device to expose and transfer the pattern of the mask to the exposure area of the substrate,

Wherein at least the alignment step is performed in a state in which the substrate and the mask are in synchronism with each other.

(6) The exposure method according to (5), wherein the exposure step is further performed in a state in which the substrate and the mask are synchronized.

(7) The apparatus according to any one of (1) to

Further comprising the step of retracting the alignment detection system from the effective irradiation area of the illumination apparatus by the detection system driving unit in a state in which the substrate and the mask are in synchronism with each other after the alignment step ) Or (6).

(8) The exposure method according to any one of (5) to (7), wherein in the irradiation step, the illumination device is moved in the predetermined direction in synchronism with the substrate and the mask.

(9) The substrate processing method according to any one of (5) to (8), wherein in the exposure step, the substrate and the mask are transported at a constant speed or decelerated and transported in a state in which the substrate and the mask are synchronized. The exposure method further comprising:

(10) The exposure method according to any one of (5) to (9), wherein the mask moves in a predetermined direction after being moved in a direction opposite to the predetermined direction and is synchronized with the substrate.

(11) The mask is moved in the predetermined direction at a speed slower than the speed at which the substrate is transported, or is moved in the predetermined direction from the stationary state, moved in synchronization with the substrate. (5) to (9).

(12) The exposure method according to (11), wherein the substrate is transported at a constant speed until exposing the exposure region and then exposing the exposure region adjacent in the predetermined direction.

According to an embodiment of the present invention, there is provided an exposure apparatus comprising: a substrate holding section for holding a substrate having a plurality of exposure areas; a mask holding section for holding a mask in which a pattern having a size substantially equivalent to that of the exposure area is formed; An alignment detecting system for detecting alignment marks formed on the mask and the substrate, a mask driving unit capable of adjusting alignment between the substrate and the mask, and a mask conveying unit capable of conveying the mask in a predetermined direction, And the illumination device that irradiates the exposure area with the exposure light through the mask. Therefore, alignment adjustment for each exposure area is at least possible while the substrate is being transported in a predetermined direction, the tact time is shortened, The pattern of the mask can be efficiently exposed.

According to the exposure method of the present invention, it is possible to carry out a process of transferring the substrate in a predetermined direction by the substrate transfer section, a process of moving the mask in synchronism with the substrate by the mask transfer section, a process of aligning the mask and the substrate, And a step of irradiating exposure light from the illumination device to expose and transfer the pattern of the mask to the exposure area of the substrate. Since at least the alignment step is performed in a state in which the substrate and the mask are synchronized, Alignment adjustment for each exposure area can be made at least while the substrate is being conveyed, the tact time can be shortened, and the pattern of the mask can be efficiently exposed to the substrate to be transported.

1 is a front view of an exposure apparatus according to a first embodiment of the present invention.
2 is a right side view of the exposure apparatus shown in Fig.
3 is a rear view of the exposure apparatus shown in Fig.
4 is an explanatory view showing a procedure for exposing a pattern of a mask to a first exposure area.
5 is an explanatory view showing a sequence of exposing a mask pattern to a second exposure area subsequent to exposure of the first exposure area.
Fig. 6 is an explanatory diagram of the exposure process in Figs. 4 and 5. Fig.
Fig. 7 is an explanatory view showing another sequence of exposing a pattern of a mask to the second exposure area, following exposure of the first exposure area. Fig.
8 is an explanatory diagram showing a procedure for exposing a pattern of a mask by an illumination device having an effective irradiation area longer than the exposure area of the substrate in the exposure apparatus according to the second embodiment of the present invention.
Fig. 9 is an explanatory view showing an exposure process of a conventional exposure apparatus. Fig.

Hereinafter, the exposure apparatus and the exposure method according to each embodiment of the present invention will be described in detail with reference to the drawings. In the following description, it is assumed that the X direction, the Y direction, and the Z direction of the exposure apparatus are in accordance with the directions shown in the drawings.

(First Embodiment)

1 to 3, the exposure apparatus PE according to the first embodiment uses a mask M smaller than the substrate W as a material to be exposed and holds the mask M in the mask holding unit 1, The substrate W is held by the substrate holder 2 and light for pattern exposure from the illumination device 3 is directed to the substrate W through the mask M and the reduction projection lens 61 And the pattern of the mask M is exposed and transferred onto the substrate W by irradiation.

The substrate W has a plurality of exposure areas E (six exposure areas E1 to E6 in the second row and third column, as shown in Fig. 4 in this embodiment) substantially the same size as the pattern of the mask M And is formed in a substantially rectangular shape. The three rows of exposure areas E1 to E3 and E4 to E6 are held on the substrate holder 2 so as to be arranged in a predetermined direction (X direction or -X direction in the embodiment shown in the drawing).

The substrate transfer section 10 capable of transferring the substrate W held by the substrate holding section 2 in the X direction in the horizontal plane, the Y direction orthogonal to the X direction, and the Z direction orthogonal to the X direction and the Y direction, Axis conveying table 11, a Y-axis conveying table 12, and a Z-axis conveying table 13. The X-

More specifically, a Z-axis conveying belt 13 supported by the up-and-down driving mechanism 14 is disposed on a base 4 provided on the ground G with a vibration-proof leg or an air suspension 5 have. The vertical drive mechanism 14 has a pair of drive blocks 14b and 14c each having an inclined surface 14a and the pair of drive blocks 14b and 14c are arranged such that their inclined surfaces 14a slide Respectively. Then, either one of the drive blocks 14b, 14c is moved by a not-shown feed screw mechanism driven by a motor 15 to drive the Z-axis feed belt 13 up and down.

The vertical drive mechanism 14 is provided with one X-axis direction transfer mechanism (X-axis direction) in the Y-axis direction and one X-axis direction transfer mechanism ), Three in total, and each of them is driven and controlled independently. Thus, the up-and-down driving mechanism 14 independently adjusts the height of the substrate holding unit 2 based on the measurement result of the top surface position of the substrate W by the laser sensor (not shown) ).

On the Z-axis feed belt 13, a Y-axis feed mechanism 16 for moving the Y-axis feed belt 12 in the Y direction is provided. The Y-axis feed mechanism 16 includes a plurality of (four in the illustrated embodiment) guide rails 17 disposed on the Z-axis feed belt 13 in the Y-axis direction, And a slider 18 is straddled on each of the guide rails 17. The slider 18 is fixed to the guide rails 17, The Y-axis feed belt 12 is reciprocally movable in the Y-axis direction along the guide rails 17 by the feed screw mechanism 20 driven by the Y-axis drive motor 19. [

An X-axis feed mechanism 30 for moving the X-axis feed table 11 in the X direction is provided on the Y-axis feed table 12. The X axis feed mechanism 30 includes a plurality of (two in the embodiment shown in the drawings) guide rails 31 arranged in the X axis direction on the Y axis feed table 12, And a slider 32 is straddled on each of the guide rails 31. The slider 32 is fixed to the lower surface of the guide rail 31. [

Between the X-axis feed belt 11 and the Y-axis feed belt 12, a linear motor 33 extending in the X-axis direction is disposed. The linear motor 33 includes a mover 34 fixed to the lower surface of the X-axis feed table 11 and a mover 34 fixed to the Y-axis feed belt 12 to face the mover 34, And has a pair of stator 35, 35 extending therefrom. The X-axis feed belt 11 is movable in the X-axis direction by the magnetic field of the stator 35 and guided by the guide rail 31 to be reciprocally movable in the X-axis direction. The movable distance of the X-axis transfer table 11 in the X-axis direction is set to be longer than the X-axis direction length of the substrate W having a plurality of exposure areas E, so that the substrate W can be continuously conveyed Do.

On the X-axis transfer table 11, a substrate holding portion 2 for holding and holding the substrate W by a work chuck or the like is fixed. Thereby, the substrate W is movable in the X, Y, and Z directions. Particularly in the X direction.

The mask support table 41 is fixed to the mask base 6 fixedly held between a pair of leg portions 4a formed vertically from the base 4 via a mask conveying portion 40 So as to be conveyable in the X direction. A mask driving section 50 for aligning the substrate W and the mask M by driving the mask holding section 1 in the XY direction and the? Direction is arranged on the driving section table 41. [

The mask transfer section 40 includes a plurality of (two in the embodiment shown in the drawings) guide rails 42 arranged in the X-axis direction on the mask base 6, And a slider 43 is straddled on each of the guide rails 42. As shown in Fig.

A linear motor 45 extending in the X direction is arranged between the mask base 6 and the drive table 41. The linear motor 45 includes a mover 46 fixed on the lower surface of the driving part mounting table 41 and a pair of mover 46 fixed on the mask base 6 and extending in the X direction And stator (47, 47). The movable member 46 is driven in the X direction by the magnetic field of the stator 47 and is guided by the guide rail 42 and reciprocally movable in the X axis direction.

The mask driving section 50 includes a plurality of motors 48 fixed on the driving section table 41 and a plurality of screw conveying mechanisms driven by the motor 48 and arranged in the X and Y directions . The mask holding portion 1 is driven in the X and Y directions and the alignment in the substrate W and the mask M is adjusted by rotating the mask holding portion 1 in the θ direction by controlling the motors 48 independently. The driving part table 41 and the mask holding part 1 are supported so as to be able to move relatively horizontally by a bearing 39 disposed therebetween.

The mask M held by the mask holding section 1 is reciprocally movable in the X axis direction together with the driving section table 41 and is driven in the X, Y, and θ directions by the mask driving section 50 So that the alignment of the substrate W and the mask M can be adjusted.

A reduced projection lens 61 for reducing the pattern of the mask M and projecting the pattern onto the exposure area E of the substrate W is provided on the lower surface of the drive table 41 corresponding to the mask M, Passes through the lens insertion hole 6a formed in the base 6 and is fixed. Therefore, the reduction projection lens 61 moves in the X direction with the movement of the driving section table 41 by the mask transfer section 40.

An alignment detection system 60 for detecting alignment marks (not shown) formed on the mask M and the substrate W and a detection system driving system 60 for driving the alignment detection system 60 are provided on the mask holding unit 1, (59) are arranged and arranged. Reference numeral 51 in Fig. 2 is an optical system for traveling observation.

The alignment detection system 60 includes a reflection mirror and a camera and picks up an alignment mark formed on the mask M and the substrate W from above the mask M by the camera. The marks for alignment of the mask M and the substrate W are not limited to the marks drawn on the mask M or the substrate W but may be a mark on the mask M or the substrate W, do. When a plurality of layers are to be exposed on the substrate W, the alignment pattern of the substrate W may be a pattern of the preceding layer.

The detection system driving section 59 retracts the alignment detection system 60 from the later-described effective irradiation area LA of the illumination device 3. [

2 and 3, the illumination apparatus 3 includes a laser light source 62 for irradiating laser light for exposure, a plurality of mirrors 63 for reflecting laser light, and a fly-eye lens 64 And the laser light irradiated from the laser light source 62 is bent by the plurality of mirrors 63 and is made into parallel light by the fly's eye lens 64 and the mask M and the reduction projection lens 61 And irradiates the exposure area E of the substrate W with the intervention.

The illumination device 3 is arranged on the illumination base 4b formed vertically from the base 4 so as to be movable in the X direction. That is to say, the guide rail 65 and the slider 66 fixed to the lower surface of the illuminating device 3, which are arranged in the X direction on the illumination base 4b (two in the illustrated embodiment, And a slider 66 is straddled so as to be freely slidable on each guide rail 65. A feed screw mechanism 67 driven by a motor 68 is disposed between the illumination base 4b and the illuminating device 3. By rotating the motor 68 to rotate the illuminating device 3 And guided by the guide rail 65 to move in the X direction. Thus, the effective irradiation area LA (see Fig. 4) of the illumination device 3 is movable in synchronization with the movement of the mask M in the X-axis direction.

The guide rail 65 and the slider 66 constituting the linear guide and the motor 68 and the feed screw mechanism 67 are connected to the illuminator transport section 69 for transporting the illuminator 3 in the X direction, .

The light source of the illumination device 3 is not limited to a laser light source, but may be arbitrarily configured as an ultra-high-pressure mercury lamp or the like.

Next, the procedure for exposing the pattern of the mask M to the exposure areas E1 to E6 of the substrate W will be described with reference to Figs. 4 to 6. Fig.

First, as shown in Fig. 4, the up-and-down driving mechanism 14 is operated to adjust the tilt as necessary, and the substrate holding portion 2 is rotated by the feed screw mechanism 20, together with the Y- Direction to align the position of the mask M with the exposure areas E1 to E3 of the substrate W in the Y direction. Then, the linear motor 33 drives the X-axis feed table 11 to move the substrate W in the X direction (step 1). At the same time, the linear motor 45 moves the drive table 41 (mask M) in the -X direction (the opposite direction to the predetermined direction).

When the mask M passes through the exposure region E1 as shown in Step 2, the moving direction of the mask M is reversed in the X direction (Step 3), and the mask M and the exposure region (Step 4). In order to align the mask M with the exposure area E1, the moving speed of the mask M after the reversal may be increased or the moving speed of the substrate W may be reduced.

Subsequently, if the position of the mask M coincides with the position of the exposure area E1 in step 4, the mask M is moved to the alignment detection system 60 while moving the mask M in synchronism with the substrate W in the X direction, And the alignment marks formed on the substrate W are detected and the mask driving unit 50 is driven based on the detection result to drive the mask holding unit 1, that is, the mask M in the X and Y directions, the alignment of the substrate W and the mask M is adjusted. In step S4, the illumination device 3 is moved by the feed screw mechanism 67 to match the positions of the effective irradiation area LA and the mask M. Thereafter, the mask M and the substrate W are moved, And the effective irradiation area LA in synchronism with each other in the X direction.

After the alignment is completed in step 5, the alignment detection system 60 is retracted from the effective irradiation area LA, and the substrate W and the mask M are moved in synchronism with the effective irradiation area LA The shutter S is opened (step 6). This allows the laser light for exposure from the illumination device 3 to be irradiated onto the substrate W through the mask M and the reduction projection lens 61 in the state in which the mask M and the substrate W are synchronously moved Thereby exposing the pattern of the mask M to the exposure area E1 (step 7).

In a state in which the substrate W and the mask M are synchronized, the substrate W and the mask M may be transported at a constant speed or may be transported at a reduced speed.

In the drawing, the slant line in the effective irradiation area LA indicates a state in which the laser light from the illumination device 3 is shielded by the shutter S, and the effective irradiation area LA, The substrate S is opened so that the exposure light is irradiated to the substrate W via the mask M. FIG.

5, the effective irradiation area LA is shielded by the shutter S and the alignment detecting system 60 is moved to the original position on the mask M by the shutter S. Then, as shown in Fig. 5, after the exposure of the exposure area E1 is completed, Return to position. While the substrate W is continuously transferred in the X direction, the effective irradiation area LA coincides with the exposure area E2 and the mask M is moved in the -X direction, After passing through the exposure area E2 (step 8), the moving direction of the mask M is reversed in the X direction (step 9), and the position of the mask M is matched with the position of the next exposure area E2 .

Then, in Step 10, after the positions of the mask M and the next exposure region E2 are matched with each other, the mask M, the substrate W, and the effective irradiation area LA are synchronously moved, The alignment mark formed on the mask M and the substrate W is detected by the system 60 and the mask drive unit 50 is driven to drive the mask holding unit 1, that is, the mask M in the X and Y directions Together with the alignment, the alignment of the substrate W and the mask M is adjusted by rotating in the? Direction.

The alignment detection system 60 is retracted from the effective irradiation area LA and the shutter S is released (step 12) after the completion of the alignment of the substrate W and the mask M in step 11. The laser light is irradiated onto the substrate W through the mask M and the reduction projection lens 61 to move the pattern of the mask M to the substrate W in a state in which the mask M and the substrate W are synchronously moved And exposes the exposure area E2 (step 13).

The synchronization timing between the effective irradiation area LA and the mask M does not necessarily have to be the timing described above. However, during irradiation of the substrate W with at least the laser light via the mask M, (Effective irradiation area LA) and the mask M move in synchronization with the substrate W.

Hereinafter, although not shown, the same operation is performed to expose the pattern of the mask M to the exposure area E3. Subsequently, the substrate holding portion 2 is moved together with the Y-axis transfer table 12 in the Y-axis direction by the feed screw mechanism 20 to move the mask M and the exposure regions E4- E6) in the Y direction.

The X axis transfer belt 11 is driven by the linear motor 33 to move the substrate W in the -X direction opposite to the previous direction and to move the effective exposure area LA and the mask M, The pattern of the mask M is successively exposed to the exposure areas E4 to E6 in the same manner as described above while moving the substrate W in synchronism with the substrate W. [

6, the substrate W is moved toward the effective irradiation area LA, and the mask M moves synchronously with the substrate W (T1), and then the synchronous movement (T2), and further exposure is performed (T3). Thereby, it is possible to eliminate or substantially reduce the stop period of the substrate W, which is essential in the conventional exposure apparatus, and shorten the tact time of exposure, thereby enabling exposure with high efficiency. 6, the movement speed Vw of the substrate holding portion indicated by the dotted line represents a case where the mask M is moved at a constant speed from the period T1 during which the mask M moves synchronously with the substrate W to the next period T1, The moving speed Vm of the mask holding portion is also a constant speed that is equal to the moving speed Vw.

As described above, according to the exposure apparatus PE of the present embodiment, the substrate holding section 2 for holding the substrate W having the plurality of exposure regions E1 to E6, the exposure region E, A mask holding section 1 for holding a mask M having a pattern of substantially equal size formed thereon, a substrate carrying section 10 capable of carrying the substrate W in a predetermined direction, a mask M, An alignment detection system 60 for detecting an alignment mark formed on the substrate W and a mask driving unit 50 for adjusting the alignment of the substrate W and the mask M, And a lighting device 3 for irradiating the exposure area E with exposure light via a mask M. The exposure device 1 of the present invention is not limited to the above- This makes it possible to carry out alignment adjustment and exposure transfer for each exposure area E while conveying the substrate W in a predetermined direction and to shorten the tact time so that the pattern of the mask M Can be efficiently exposed.

The alignment detection system 60 and the detection system drive unit 59 are disposed on the mask holding unit 1 and are provided with a detection system driving unit 59 for driving the alignment detection system 60, The alignment detection system 60 can be moved forward and backward with respect to the mask M being conveyed even when the substrate W and the mask M move synchronously because the substrate W is conveyed along the predetermined direction by the conveying unit 40. [ .

Since the illumination device 3 is further provided with the illumination device transport section 69 capable of transporting the illumination device 3 in a predetermined direction, the illumination device 3 can be moved in synchronization with the substrate W and the mask M. The substrate W can be efficiently exposed and transferred.

According to the exposure method of the present invention, the substrate transfer section 10 transfers the substrate W in a predetermined direction and the mask transfer section 40 transfers the mask M onto the substrate W Aligning the mask M and the substrate W by means of the alignment detecting system 60 and the mask driving unit 50 and a process of aligning the substrate W and the mask M with the illumination device And a step of exposing and transferring the pattern of the mask M to the exposure area E of the substrate W by irradiating the mask W with exposure light from the mask W and the mask W. In the state in which the substrate W and the mask M are synchronized, At least an alignment process is performed. This makes it possible to adjust the alignment for each exposure area E while conveying the substrate W in a predetermined direction and shorten the tact time to efficiently transfer the pattern of the mask M to the substrate W to be transported Exposure can be performed.

The mask M is synchronously moved with the substrate W by utilizing the timing of moving the exposure area E of the substrate W to be exposed next to the effective irradiation area LA of the illuminator 3 , Alignment adjustment is performed, so that the tact time can be shortened.

Further, since the exposure process is additionally performed in a state in which the substrate W and the mask M are synchronized, alignment adjustment and exposure for each exposure area E are performed while the substrate W is being transported in a predetermined direction Thus, the tact time can be greatly shortened, and the pattern of the mask M can be efficiently exposed to the substrate W to be transported.

The alignment detection system 60 is further provided with a detection system driving unit 59 for driving the alignment detection system 60. The alignment detection system 60 is provided in a state in which the substrate W and the mask M are synchronized, Since the detection system driving section 59 further includes a step of retracting from the effective irradiation area LA of the illumination device 3, the tact time can be further shortened.

In the irradiation step, since the illumination device 3 is moved in a predetermined direction in synchronism with the substrate W and the mask M, the effective irradiation area LA is at least the size for exposing the pattern of the mask M So that the lighting apparatus 3 can be configured compactly.

Since the substrate W and the mask M are transported at a constant speed or transported at a reduced speed in the state where the substrate W and the mask M are synchronized in the exposure process, The pattern of the mask M can be transferred efficiently and stably according to the conveying speed of the mask M.

Since the mask M is moved in the -X direction and then moved in the X direction to be synchronized with the substrate W, synchronous movement of the mask M and the substrate W can be reliably performed, The length of the carry section 40 can be shortened.

In the above embodiment, the mask M is once moved in the direction (-X direction) opposite to the conveying direction of the substrate W, and the mask M is moved to the downstream side in the conveying direction with respect to the exposure area to be exposed next The mask M and the exposure area E2 are aligned in the X direction. However, when the mask M is located on the upstream side in the transport direction with respect to the exposure area to be exposed next, the mask M is moved in the X direction at a speed slower than the speed at which the substrate W is transported, Alternatively, the substrate W may be accelerated in the X direction from the stopped state and moved in synchronization with the substrate W.

The mask M may be synchronized with the substrate W by increasing the transfer speed of the substrate W or may be synchronized with the substrate W by once increasing until the transfer speed of the substrate W is exceeded .

Hereinafter, the exposure of the exposure area E2 adjacent to the exposure area E1 will be described with reference to FIG. After the pattern of the mask M is exposed in the exposure area E1 (step 7), the moving speed of the mask M is reduced or slowed down so as to be slower than the speed at which the substrate W is carried, After the mask E2 passes the position of the mask M (step 9a), the mask M is accelerated and moved in the X direction to align the mask M with the exposure area E2 (step 10). The mask M and the alignment mark formed on the substrate W are detected by the alignment detection system 60 while the mask M and the substrate W are synchronously transported to the effective irradiation area LA, 50 are driven to drive the mask holding unit 1, that is, the mask M in the X and Y directions and rotate in the θ direction to adjust the alignment of the substrate W and the mask M ).

After the alignment of the substrate W and the mask M is completed, the alignment detecting system 60 is retracted from the effective irradiation area LA to release the shutter S (step 12). Thereby, the laser light is irradiated to the substrate W via the mask M and the reduction projection lens 61 to expose the pattern of the mask M to the exposure area E2 (step 13).

Therefore, in this modified example, the mask M is moved in the X direction at a speed slower than the speed at which the substrate W is carried, or is moved in the X direction from the stopped state, The mask M and the exposure area E2 can be synchronized in a short period of time without moving the mask M in the -X direction.

Also in this modified example, the substrate W is transported at a constant speed until the exposure area E adjacent to the exposure area E in the X direction is exposed after exposing the exposure area E, So that the exposure can be efficiently and stably performed.

Although the exposure of the exposure area E2 has been described with reference to Fig. 7, this modification can also be applied to the exposure of the other exposure areas E1, E3 to E6.

(Second Embodiment)

Next, the exposure method using the exposure apparatus of the second embodiment will be described in detail. The exposure apparatus of the second embodiment is different from that of the first embodiment in that it does not have a lighting device carrier section, although it is not shown. In the present embodiment, instead, the effective irradiation area LA of the illumination device 3 is longer than the first embodiment in a predetermined direction (X direction), and at least the exposure areas E1 to E3 Or E4 to E6) in the X direction (see Fig. 8).

Here, for convenience of description, the case of exposing the adjacent exposure area E2 following the exposure area E1 will be described as in the modification of the first embodiment. In the following, similarly to the modification of the first embodiment, the moving speed of the mask M is decreased after the exposure in the exposure area E1, or the mask M is temporarily stopped to stop the exposure of the exposure area E2 Position.

8, after exposing the pattern of the mask M to the exposure area E1 (step 7), the moving speed of the mask M is decelerated or temporarily stopped to expose the exposed area E2, (Step 9a), the mask M is accelerated and moved in the X direction. When the position of the mask M and the exposure area E2 are aligned in step S10, the mask M and the substrate W are transferred to the alignment detection system 60 while the mask M and the substrate W are synchronously transported. The mask holding unit 1, that is, the mask M is driven in the X and Y directions and is rotated in the? Direction Alignment of the substrate W and the mask M is adjusted.

After the alignment adjustment of the substrate W and the mask M is completed (step 11), the alignment detecting system 60 is retracted from the area above the mask M so that the exposure area to be exposed In the example, the shutter S of the exposure area E2 is opened (step 12). Thereby, the laser light is irradiated to the substrate W via the mask M and the reduction projection lens 61 to expose the pattern of the mask M to the exposure area E2 (step 13).

Further, the portion other than the exposure region E2 to be exposed is shielded by the shutter S, and only the exposure region E2 is exposed. The exposure of the exposure areas E1 and E3 to E6 can also be performed in the same manner.

Since the illuminating device 3 has a long effective irradiating area LA in a predetermined direction at least in the exposure area E of the substrate W as described above, the illuminating device 3, which does not include the illuminating device returning part, It is possible to expose a pattern of the mask M to the plurality of exposure areas E of the substrate W by irradiating exposure light from the illumination device 3 to the substrate W to be transported.

Further, the present invention is not limited to the above-described embodiments and modifications, but can be appropriately modified and improved.

For example, in the above embodiment, the alignment process and the exposure process are performed while the substrate W and the mask M are synchronously moved. However, the present invention is not limited to this, It is possible to shorten the tact time by carrying out at least an alignment process.

For example, the exposure process may be performed in a state where the substrate W and the mask M are stationary. In this case, the illumination device transport section 69 of the first embodiment and the effective The irradiation area LA can be made small.

In the above embodiment, the substrate W and the mask M are moved synchronously while the substrate W is transported at a reduced speed or while the substrate W is transported at a constant speed. However, The substrate W and the mask M may move synchronously even while the substrate W is being conveyed at an increased speed.

In the above embodiment, when a reduction projection lens 61 is disposed between the mask holding section 1 and the substrate holding section 2 to form a pattern image of the mask M on the substrate W The present invention is not limited to this but the mask holding section 1 may be disposed close to the substrate holding section 2 so that the mask M and the substrate W are brought close to each other and exposed to each other.

The present invention is based on Japanese Patent Application (Japanese Patent Application No. 2016-167193) filed on August 29, 2016, the content of which is incorporated herein by reference.

1: mask holding portion
2:
3: Lighting device
10: substrate transfer section
40:
41:
50:
59:
60: Alignment detection system
67: Feed screw mechanism (lighting device return section)
LA: Effective Survey Area
E, E1 to E6: exposure area
M: Mask
PE: Exposure device
W: substrate (substrate)

Claims (12)

A substrate holding section for holding a substrate as an exposure material having a plurality of exposure regions,
A mask holding portion for holding a mask having a pattern having a size substantially equal to the exposure region;
A substrate carrying section capable of driving the substrate holding section to carry the substrate in a predetermined direction,
An alignment detection system for detecting an alignment mark formed on the mask and the substrate,
A mask driving unit for driving the mask holding unit to adjust alignment of the substrate and the mask,
A mask carrying section capable of driving the driving section table on which the mask driving section is placed and carrying the mask in the predetermined direction,
And an illumination device for irradiating the exposure region of the substrate with exposure light via the mask. The method according to claim 1,
Further comprising a detection system driver for driving the alignment detection system,
Wherein the alignment detection system and the detection system driving unit are arranged in the mask holding unit and are conveyed by the mask conveying unit along the predetermined direction. 3. The method according to claim 1 or 2,
Further comprising an illuminator transport section capable of transporting the illuminating device in the predetermined direction. 3. The method according to claim 1 or 2,
Wherein the illumination device has a longer effective irradiation area in the predetermined direction than at least an exposure area of the substrate. A substrate holding section for holding a substrate as an exposure material having a plurality of exposure regions,
A mask holding portion for holding a mask having a pattern having a size substantially equal to the exposure region;
A substrate carrying section capable of driving the substrate holding section to carry the substrate in a predetermined direction,
An alignment detection system for detecting an alignment mark formed on the mask and the substrate,
A mask driving unit for driving the mask holding unit to adjust alignment of the substrate and the mask,
A mask carrying section for driving the driving section table on which the mask driving section is mounted and capable of carrying the mask in a predetermined direction,
And an illumination device for irradiating the exposure region of the substrate with exposure light through the mask, the exposure method comprising:
A step of transporting the substrate in a predetermined direction by the substrate transfer section;
Moving the mask in the predetermined direction and synchronizing the mask with the substrate by the mask carrying section;
Aligning the mask and the substrate by the alignment detecting system and the mask driving unit;
And a step of irradiating exposure light from the illumination device to expose and transfer the pattern of the mask to the exposure area of the substrate,
Wherein at least the alignment step is performed in a state in which the substrate and the mask are in synchronism with each other. 6. The method of claim 5,
Wherein the exposure step is further performed in a state in which the substrate and the mask are synchronized with each other. The method according to claim 5 or 6,
Further comprising a detection system driver for driving the alignment detection system,
Further comprising the step of retracting the alignment detection system from the effective irradiation area of the illumination apparatus by the detection system driving unit in a state in which the substrate and the mask are in synchronism with each other after the alignment step . 8. The method according to any one of claims 5 to 7,
Wherein in the irradiation step, the illumination device is moved in the predetermined direction in synchronism with the substrate and the mask. 9. The method according to any one of claims 5 to 8,
Wherein the substrate and the mask are transported at a constant speed or decelerated and transported in a state in which the substrate and the mask are synchronized in the exposure process. 10. The method according to any one of claims 5 to 9,
Wherein the mask is moved in a direction opposite to the predetermined direction and then moved in the predetermined direction to synchronize with the substrate. 10. The method according to any one of claims 5 to 9,
Wherein the mask is moved in the predetermined direction at a speed slower than the speed at which the substrate is transported or is moved in the predetermined direction from the stationary state to move in synchronization with the substrate . 12. The method of claim 11,
Wherein the substrate is transported at a constant speed until exposing the exposure region and then exposing the exposure region adjacent in the predetermined direction.

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