KR20190032851A - Multilayered electronic component and board having the same mounted thereon - Google Patents

Abstract

The present invention relates to a capacitor body comprising a first surface which is a mounting surface and a second surface opposite to the first surface, a capacitor body including third and fourth surfaces connected to the first and second surfaces and facing each other; External electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; And a connection portion having a vertical portion disposed on the external electrode, a horizontal portion spaced apart from the first surface of the capacitor body, and a connection portion connecting the lower end of the vertical portion and the inner end portion of the horizontal portion and having a slope; And a plurality of electronic components.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a multi-

The present invention relates to a multilayer electronic component and a mounting substrate thereof.

As one of the multilayer electronic components, the stacked capacitor is made of a dielectric material, and since the dielectric material has piezoelectricity, it can be deformed in synchronization with the applied voltage.

When the period of the applied voltage is in the audible frequency band, the displacement is oscillated and transmitted to the substrate through the solder, and the vibration of the substrate is audible. These sounds are called acoustic noise.

If the operating environment of the device is quiet, the acoustic noise may be perceived by the user as a strange sound and may be felt as a failure of the device.

Further, in an apparatus having an audio circuit, the acoustic noise may be superimposed on the audio output, thereby deteriorating the quality of the apparatus.

In addition, apart from the acoustic noise recognized by the human ear, when the piezoelectric vibrations of the stacked capacitors occur in a high frequency range of 20 kHz or more, it may cause malfunction of various sensors used in IT and industrial / electric fields.

On the other hand, the external electrodes of the stacked capacitor and the substrate are connected to the solder by solder. At this time, the solder may be inclined at a predetermined height along the surface of the external electrode at both sides or both ends of the capacitor body.

At this time, as the volume and the height of the solder become larger, the vibration of the stacked capacitor is more easily transmitted to the substrate, and the magnitude of the generated acoustic noise is increased.

Korean Patent Publication No. 2005-0093878 Korean Patent Publication No. 2016-0091651 Japanese Patent No. 4962533

[0003] In recent electronic devices, acoustic noise generated in such a stacked electronic component may appear more conspicuously due to low noise of the component.

It is an object of the present invention to provide a multilayer electronic component capable of effectively reducing acoustic noise and high frequency vibrations of 20 KHz or more and a mounting substrate thereof.

One aspect of the invention is a capacitor body comprising a first surface, a mounting surface, and a second surface opposite the first surface, the capacitor body including third and fourth surfaces connected to the first and second surfaces and facing each other; External electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; And a connection portion having a vertical portion disposed on the external electrode, a horizontal portion spaced apart from the first surface of the capacitor body, and a connection portion connecting the lower end of the vertical portion and the inner end portion of the horizontal portion and having a slope; And a plurality of electronic components.

In one embodiment of the present invention, the metal frame is composed of first and second metal frames, and the first and second metal frames are connected to each other in a direction connecting the third and fourth surfaces of the capacitor body And a groove portion formed so as to be opposed to each other.

In an embodiment of the present invention, the capacitor body may include first and second internal electrodes, one end of which is alternately exposed through the third and fourth surfaces.

In an embodiment of the present invention, the capacitor body includes fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other, 2 external electrodes may extend to portions of the first, second, fifth, and sixth surfaces of the capacitor body, respectively.

In one embodiment of the present invention, the metal frame may have a cutout at a portion connecting the connection portion and the horizontal portion.

In one embodiment of the present invention, the metal frame may have a groove portion in the vertical portion.

In an embodiment of the present invention, the groove portion may be formed to open in the direction of the second surface of the capacitor body.

According to another aspect of the present invention, there is provided a plasma display panel comprising: a substrate having a plurality of electrode pads on an upper surface thereof; And the plurality of electrode pads are mounted such that the horizontal portions of the metal frames are mounted one by one on the plurality of electrode pads; And a mounting substrate for mounting the electronic component.

According to an embodiment of the present invention, a bump terminal is formed so as to be spaced apart from a mounting surface of a capacitor body so as to form an empty space. When the multilayer electronic component is mounted on a board, the bump terminal is transferred from the external electrode to the board And the height of the solder is limited so that the acoustic noise of the laminated electronic component and the high frequency vibration of 20 KHz or more can be reduced.

1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention.
FIG. 2 is a perspective view showing the metal frame removed from FIG. 1; FIG.
3 is a sectional view taken along the line I-I 'in Fig.
FIGS. 4 and 5 are perspective views illustrating that a cutout is formed in the metal frame of FIG. 1. FIG.
FIG. 6 is a perspective view showing that a groove is formed in the metal frame of FIG. 1. FIG.
7 is a front view schematically showing a multilayer electronic component according to an embodiment of the present invention mounted on a substrate.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.

Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

The shape and size of elements in the drawings may be exaggerated for clarity.

In the drawings, like reference numerals are used to designate like elements that are functionally equivalent to the same reference numerals in the drawings.

FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view showing a metal frame removed from FIG. 1, and FIG. 3 is a sectional view taken along line I-I 'of FIG.

X, Y, and Z shown in the figure represent the longitudinal direction, the width direction, and the thickness direction of the capacitor body 110, respectively, when defining directions for clearly explaining the embodiment of the present invention.

1 to 3, a multilayer electronic component 100 according to the present embodiment includes a capacitor body 110, a plurality of external electrodes 131 and 132, and a plurality of metal frames 140 and 150.

The capacitor body 110 of the present embodiment is formed by laminating a plurality of dielectric layers 111 in the Z direction and then firing, and adjacent dielectric layers 111 can be integrated so that the boundaries thereof can not be confirmed.

The capacitor body 110 includes an active region serving as a portion contributing to capacitance formation of the capacitor and upper and lower cover regions 112 and 113 formed on both sides of the active region in the Z direction, respectively, as upper and lower margin portions.

The upper and lower cover regions 112 and 113 may have the same material and configuration as the dielectric layer 111 of the active region except that they do not include internal electrodes.

The upper and lower cover regions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers on the upper and lower surfaces in the Z direction of the active region and preventing damage to the internal electrodes in the active region due to physical or chemical stress Can play a role.

Also, the capacitor body 110 may have a hexahedral shape. The first and second surfaces 1 and 2 and the first and second surfaces 1 and 2 facing each other in the Z direction in which the dielectric layer 111 is stacked in the capacitor body 110, 2 and the third and fourth surfaces 3 and 4 in the X direction facing each other and the third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2, And fifth and sixth surfaces 5 and 6 connected and facing each other in the W direction. At this time, the first surface 1 may be a mounting surface.

The dielectric layer 111 may include a ceramic material having a high dielectric constant, for example, a ceramic powder such as barium titanate (BaTiO ₃ ). However, the present invention is not limited thereto as long as a sufficient capacitance can be obtained no.

Further, a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant and the like may be further added to the dielectric layer 111 together with the ceramic powder.

The ceramic additive may be, for example, a transition metal oxide or a carbide, a rare earth element, magnesium (Mg), or aluminum (Al).

The first and second internal electrodes 121 and 122 are formed on at least one surface of the ceramic sheet forming the dielectric layer 111 and are stacked and laminated alternately in the capacitor body 110 with the respective dielectric layers 111 therebetween. .

The first and second internal electrodes 121 and 122 are electrodes having different polarities and one end is exposed through the third and fourth faces 3 and 4 of the capacitor body 110, respectively.

The end portions of the first and second internal electrodes 121 and 122 alternately exposed through the third and fourth surfaces 3 and 4 of the capacitor body 110 are connected to the third and fourth surfaces of the capacitor body 110, May be connected to the first and second external electrodes 131 and 132 and electrically connected to the first and second external electrodes 3 and 4, respectively.

The first and second internal electrodes 121 and 122 may be formed of a conductive metal such as Ni or Ni alloy. However, the present invention is not limited thereto .

When a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122, which are opposed to each other.

At this time, the electrostatic capacity of the multilayer electronic component 100 is proportional to the overlapping area of the first and second internal electrodes 121 and 122 overlapping each other along the stacking direction of the dielectric layers 111 in the active area.

In the present embodiment, the capacitor body is illustrated as a structure in which the dielectric layer and the first and second internal electrodes are stacked in the Z direction. However, the present invention is not limited to this structure, and the capacitor body of the present invention may include a dielectric layer, 2 internal electrodes are stacked in the Y direction.

The first and second external electrodes 131 and 132 are formed of a conductive metal and may be formed of one of silver (Ag), palladium (Pd), platinum (Pt), nickel (Ni), and copper And the like, and the present invention is not limited thereto.

The first and second external electrodes 131 and 132 are electrically connected to the first and second internal electrodes 121 and 122 and are electrically connected to each other through the first and second connection portions 131a and 132a, And two band portions 131b and 132b, respectively.

The first and second connection portions 131a and 132a are respectively formed on the third and fourth surfaces 3 and 4 of the capacitor body 110 and the exposed ends of the first and second internal electrodes 121 and 122 And are electrically connected to each other.

The first and second band portions 131b and 132b are formed on the first, second, fifth, and sixth surfaces (first and second surfaces) of the capacitor body 110 in the first and second connection portions 131a and 132a 1, 2, 5, 6).

A plating layer (not shown) may be formed on the first and second external electrodes 131 and 132 if necessary.

The plating layer may include a nickel (Ni) plating layer formed on the first and second external electrodes 131 and 132, and a tin (Sn) plating layer formed on the nickel plating layer.

The first and second plating layers are used to increase the bonding strength between the stacked electronic components 100 when soldered to a substrate or the like. The plating treatment can be performed by a known method. In consideration of environmentally friendly factors, - Pre-plating is preferably performed, but the present invention is not limited thereto.

The first and second metal frames 140 and 150 are spaced a predetermined distance from the substrate on which the capacitor body 110 is mounted and include first and second vertical portions 141 and 151, 154, and first and second connection portions 142, 152, respectively.

At this time, the first and second metal frames 140 and 150 may be plated with a metal having good soldering.

The first and second vertical portions 141 and 151 are electrically connected to the first and second connection portions 131a and 132a of the first and second external electrodes 131 and 132, respectively.

In the present embodiment, the first and second vertical portions 141 and 151 are formed by first and second conductive adhesive layers 161 and 162 made of a conductive adhesive such as a high melting point solder or an electroconductive paste, (131a, 132a).

The first and second horizontal portions 143 and 153 are spaced apart from the first surface 1 of the capacitor body 110 by a predetermined distance.

The first and second horizontal portions 143 and 153 may be disposed to face each other in the Z direction with respect to the first and second band portions 131b and 132b and the first and second band portions 131b and 132b, Respectively.

The first connection part 142 connects the lower end of the first vertical part 141 and the inner end of the first horizontal part 143 and has an inclination. The first connection part 142 extends inward in the X direction of the capacitor body 110 from the lower end of the first vertical part 141.

The second connection part 152 connects the lower end of the second vertical part 151 and the inner end of the second horizontal part 153 and has an inclination. The second connection part 152 extends inward in the X direction of the capacitor body 110 from the lower end of the second vertical part 151.

That is, the first and second connection portions 142 and 152 are formed to have a predetermined angle with respect to the first and second horizontal portions 143 and 153.

The first and second metal frames 140 and 150 are connected to the first and second groove portions 144 and 144 in such a manner that the first and second metal frames 140 and 150 are opposed to each other along the X direction by the first and second connecting portions 142 and 152, And 154, respectively.

The first and second trenches 144 and 145 serve as solder pockets to reduce the height of the solder fillets.

4 and 5, a first cutout 145 may be formed in a portion of the first metal frame 140 'that connects the first vertical portion 141 and the first horizontal portion 143 .

The second metal frame 150 'may have a second cutout 155 at a portion connecting the second vertical portion 151 and the second horizontal portion 153.

The first and second cutouts 145 and 155 prevent the solder fillet from being formed on the inside of the metal frames 140 'and 150' when mounted on the board, thereby reducing the acoustic noise.

Referring to FIG. 6, a first groove 141a may be formed in the first vertical part 141 'of the first metal frame 140' '.

At this time, the first trench 141a may be formed to be opened in a direction toward the second surface 2 of the capacitor body 110.

The second metal frame 150 '' may have a second groove 151a formed in the second vertical portion 151 '.

At this time, the second trench 151a may be formed to open in a direction toward the second surface 20 of the capacitor body 110.

The first and second trenches 151a and 152a are formed at the center in the W direction so that the first vertical portion 141 'includes two portions 141a and 142b spaced in the Y direction, (142 ') may include two portions (151a, 152b) spaced in the Y direction.

According to this structure, it is possible to reduce the contact area between the maximum displacement point of the capacitor body 110 and the first and second metal frames 140 " and 150 ", thereby minimizing the transmission of piezoelectric vibrations, The occurrence can be reduced.

6, the first and second grooves are formed in the first and second metal frames, respectively. However, two or more of the first and second grooves may be formed if necessary.

7 is a front view schematically showing a multilayer electronic component according to an embodiment of the present invention mounted on a substrate.

7, the mounting substrate of the multilayer electronic component 100 according to the present embodiment includes a substrate 210 on which the multilayer electronic component 100 is mounted, a first substrate 210 on the upper surface of the substrate 210, And second electrode pads 221 and 222, respectively.

When a voltage having a different polarity is applied to the first and second external electrodes 131 and 132 in a state where the multilayer electronic component 100 is mounted on the substrate 210, an inverse piezoelectric effect of the dielectric layer 111, The capacitor body 110 expands and contracts in the Z direction and both ends of the first and second external electrodes 131 and 132 are electrically connected to each other in the Z direction of the capacitor body 110 by the Poisson effect Contraction and swelling as opposed to expansion and contraction of the liquid.

Such contraction and expansion cause vibration. In addition, the vibration is transmitted from the first and second external electrodes 131 and 132 to the substrate 210, so that sound is radiated from the substrate 210 to become acoustic noise.

The piezoelectric vibrations transmitted to the substrate 210 through the first and second external electrodes 131 and 132 of the stacked electronic component 100 are transmitted to the first and second metal frames 140 and 150 The acoustic noise can be reduced by absorbing the elasticity of the first and second vertical portions 141 and 151 and the first and second connection portions 142 and 152. [

The solder 231 and 232 are received in the first and second trenches 144 and 154 formed by the inclined first and second connection portions 142 and 152 so that the solders 231 and 232 are formed in the Z direction Can be minimized.

As a result, the amount of vibration is reduced and acoustic noise is reduced.

Further, even when a plurality of stacked electronic components are mounted on the substrate at a narrow pitch, there is no solder bridge connecting the stacked electronic components, thereby improving the reliability of the components.

The first and second metal frames 140 and 150 absorb mechanical stress and external impact generated by the bending of the substrate 210 and prevent stress from being transmitted to the multilayer electronic component 100, 100 can be prevented from being cracked.

The piezoelectric vibrations of the capacitor body 110 are arranged in a direction perpendicular to the substrate 210 through the first and second connection portions 131a and 132a of the first and second external electrodes 131 and 132 To the first and second vertical portions 141 and 151 of the first and second metal frames 140 and 150, respectively.

The piezoelectric vibrations transmitted to the first and second vertical portions 141 and 151 are transmitted to the substrate through the first and second connection portions 142 and 152 arranged at a predetermined angle in the diagonal direction with respect to the substrate 210 The direction of the transmission of vibration and stress is converted to the inside of the capacitor body 110 in the X direction so that the price of the point of action of the force on the substrate 210 is reduced and the length of the absorption path of the piezoelectric vibration is increased, Thus, the magnitude of vibration can be reduced to reduce the acoustic noise.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and that various changes and modifications may be made therein without departing from the scope of the invention. It will be obvious to those of ordinary skill in the art.

100: Multilayer electronic component
110: Capacitor body
111: dielectric layer
121 and 122: first and second inner electrodes
131, 132: first and second outer electrodes
131a, 132a: first and second connection portions
1131b and 132b: first and second band portions
140, 150: first and second metal frames
141, 151: first and second vertical portions
141a, 151a: first and second grooves
142, 152: first and second connection portions
143 and 153: first and second horizontal portions
144, 154: first and second grooves
145, 155: first and second incisions
161, 162: first and second conductive adhesive layers
210: substrate
221, 222: first and second electrode pads
231, 232: Solder

Claims (8)

A capacitor body including a first surface that is a mounting surface and a second surface that faces the first surface, and third and fourth surfaces that are connected to the first and second surfaces and face each other;
External electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; And
A metal frame including a vertical portion disposed on the external electrode, a horizontal portion spaced apart from the first surface of the capacitor body, and a connection portion connecting the lower end of the vertical portion and the inner end portion of the horizontal portion and having a slope; Wherein the electronic device is a multilayer electronic device.
The method according to claim 1,
The metal frame comprises first and second metal frames, and the first and second metal frames are connected to each other by a connection portion in a direction connecting the third and fourth surfaces of the capacitor body, Respectively.
The method according to claim 1,
Wherein the capacitor body includes first and second internal electrodes alternately exposed through the third and fourth surfaces.
The method according to claim 1,
Wherein the capacitor body includes fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other,
And the first and second external electrodes extend to a portion of the first, second, fifth, and sixth surfaces of the capacitor body, respectively.
The method according to claim 1,
Wherein the metal frame has a cut portion formed at a portion connecting the connection portion and the horizontal portion.
The method according to claim 1,
Wherein the metal frame has the groove portion in the vertical portion.
The method according to claim 6,
And the groove portion is formed to be opened in the direction of the second surface of the capacitor body.
A substrate having a plurality of electrode pads on an upper surface thereof; And
The multilayer electronic component according to any one of claims 1 to 7, wherein the multilayer electronic component is provided so that the horizontal portions of the metal frame are mounted one by one on the plurality of electrode pads. And a mounting board for mounting the electronic component.

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