KR20170135663A - Coil component - Google Patents

Abstract

Provided is a coil component with high characteristics while promoting miniaturization. The coil component according to an aspect of the present invention includes an insulator part and a coil part. The insulator part has a width direction in a first axis direction, a length direction in a second axis direction and a height direction in a third axis direction and includes a nonmagnetic material. The coil part includes a circumferential part wound around the first axis direction and is arranged inside the insulator part. A ratio of a height dimension to a length dimension of the insulator part is 1.5 times or less of a ratio of a height dimension between inner peripheral parts of the circumferential part along the third axis direction to a length dimension between the inner peripheral parts of the circumferential part along the second axis direction.

Description

Coil Components {COIL COMPONENT}

The present invention relates to a coil part having an insulator part and a coil part provided inside the insulator part.

2. Description of the Related Art Conventionally, coil parts are mounted on electronic equipment and the like. Particularly, coil parts used in portable equipment are chip-shaped and surface mounted on a circuit board embedded in a portable device or the like. As an example of the prior art, for example, Patent Document 1 discloses an insulating resin containing a cured product, which includes a spiral conductor having at least one end thereof connected to an external electrode, Plane of the chip coil. Similarly, Patent Document 2 discloses a multilayer coil component in which the axial direction of the coil-shaped conductor is parallel to the substrate surface.

Patent Document 3 discloses an insulator including a resin, a coil-shaped inner conductor provided in the insulator, and an outer electrode electrically connected to the inner conductor. The insulator has a rectangular parallelepiped shape having a length L, a width W, and a height H , And L, W, and H satisfy the relationship L > W > H, and the external electrodes are formed on the one surface perpendicular to the height direction H of the insulator, Wherein the inner conductor has a coil axis substantially parallel to the width direction W of the insulator.

Japanese Patent Application Laid-Open No. 2006-324489 Japanese Patent Application Laid-Open No. 2006-32430 Japanese Patent Application Laid-Open No. 2014-232815

In recent years, along with miniaturization and thinning of electronic devices, the coil components mounted on the electronic devices have been further miniaturized. However, with the miniaturization of the coil parts, the characteristics of the coil parts deteriorate remarkably. For this reason, there is a demand for a technique capable of satisfying the characteristics demand while reducing the size of the coil component.

SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a high-quality coil component while achieving miniaturization.

In order to achieve the above object, a coil component according to an aspect of the present invention includes an insulator portion and a coil portion.

The insulator portion has a width direction in the first axial direction, a longitudinal direction in the second axial direction, and a height direction in the third axial direction, and includes a non-magnetic material.

The coil portion has a main portion wound around the first axis direction, and is disposed inside the insulator portion.

The ratio of the height dimension to the length dimension of the insulator portion is set such that the ratio of the height dimension between the inner circumferential portions of the main turning portion along the third axial direction to the length dimension between the inner circumferential portions of the main turning portion along the second axial direction Or less.

The ratio of the height dimension between the inner peripheral portions of the main turning portion along the third axial direction to the length dimension between the inner peripheral portions of the main turning portion along the second axial direction is typically 0.6 or more and 1.0 or less.

The ratio of the area partitioned by the inner peripheral portion of the main turning portion to the area of the insulator portion seen from the first axial direction is typically 0.22 or more and 0.45 or less.

The insulator portion typically comprises ceramics or a resin material.

The ratio of the area partitioned by the inner circumferential portion of the main turning portion to the area of the insulator portion seen from the first axial direction is 0.22 or more and 0.65 or less.

The insulator portion includes ceramics or a resin material.

The insulator portion may have a rectangular parallelepiped shape. In this case, the coil component further includes an external electrode electrically connected to the coil portion, the external electrode disposed only on one surface of the insulator portion.

The coil portion and the external electrode may be electrically connected by a via conductor for connection connected to an end portion of the coil portion.

The cross section orthogonal to the third axis of the via conductor may have a cross sectional shape larger than a cross section orthogonal to the third axis of the end portion of the coil section.

The external electrode may have an inner surface portion facing the one surface of the insulator portion and a plurality of protrusions formed on the inner surface portion and immersed in the one surface.

According to the present invention, it is possible to provide a high-quality coil component while reducing the size.

1 is a schematic perspective view of an electronic part according to an embodiment of the present invention.
2 is a schematic perspective side view of the electronic component.
3 is a schematic perspective top view of the electronic component.
Fig. 4 is a schematic perspective side view showing the electronic component by reversing its top and bottom.
5 is a schematic top view of each electrode layer constituting the electronic component.
6 is a schematic sectional view of an element unit area showing a basic manufacturing flow of the electronic component.
7 is a schematic cross-sectional view of an element unit area showing a basic manufacturing flow of the electronic component.
8 is a schematic cross-sectional view of an element unit area showing a basic manufacturing flow of the electronic component.
9 is a schematic diagram for explaining the high-frequency characteristics of the coil component.
10 is a schematic side view showing the dimensions of each part of the electronic component.
11 is a schematic top view showing the dimensions of the respective parts of the electronic component.
12 is a schematic perspective view and an external perspective view showing a first configuration example of an electronic component according to another embodiment of the present invention.
13 is a schematic perspective side view and external side view of the electronic component shown in Fig.
14 is a schematic perspective top view of the electronic component shown in Fig.
Fig. 15 is a schematic perspective side view showing the electronic component shown in Fig. 12 by inverting the top and bottom. Fig.
16 is a schematic top view of each electrode layer constituting the electronic component shown in Fig.
Fig. 17 is a perspective schematic perspective view showing a second configuration example of the electronic component. Fig.
18 is a schematic perspective side view of the electronic component shown in Fig.
19 is a schematic perspective top view of the electronic component shown in Fig.
20 is a schematic perspective view showing a third configuration example of the electronic component.
21 is a schematic perspective side view of the electronic component shown in Fig.
22 is a schematic perspective top view of the electronic component shown in Fig.
23 is a schematic perspective side view of an electronic part according to an embodiment of the present invention and a modification thereof.
24 is a schematic perspective side view of an electronic part according to the first configuration example in which the side margins are made different from each other.
Fig. 25 is a diagram showing inductance (L value) characteristics of the respective electronic parts shown in Figs. 23 and 24. Fig.
Fig. 26 is a diagram showing the Q-value characteristic of each electronic component shown in Figs. 23 and 24. Fig.
Fig. 27 is a diagram for comparing areas in which the internal conductor portion can be formed due to the difference in configuration of the electronic component according to the embodiment of the present invention. Fig.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

≪ First Embodiment >

[Basic Configuration]

Fig. 1 is a schematic perspective perspective view of an electronic component according to one embodiment of the present invention, Fig. 2 is a schematic perspective side view thereof, and Fig. 3 is a schematic perspective top view thereof.

In the drawings, the X-axis, Y-axis, and Z-axis directions indicate three axial directions perpendicular to each other.

The electronic component 100 of the present embodiment is configured as a coil component for surface mounting. The electronic component 100 includes an insulator portion 10, an internal conductor portion 20, and an external electrode 30.

The insulator portion 10 has a ceiling surface 101, a bottom surface 102, a first end surface 103, a second end surface 104, a first side surface 105 and a second side surface 106, A width direction in the X-axis direction, a longitudinal direction in the Y-axis direction, and a height direction in the Z-axis direction. The insulator portion 10 is designed to have, for example, a width of 0.05 to 0.2 mm, a length of 0.1 to 0.4 mm, and a height of 0.05 to 0.4 mm. In the present embodiment, the width dimension is about 0.2 mm, the length dimension is about 0.35 mm, and the height dimension is about 0.2 mm.

The insulator section (10) has a body section (11) and a ceiling surface section (12). The main body portion 11 incorporates the internal conductor portion 20 and constitutes a main portion of the insulator portion 10. The ceiling surface portion 12 constitutes a ceiling surface 101 of the insulator portion 10. The ceiling surface portion 12 may be configured as a print layer for indicating the type number of the electronic component 100, for example.

The main body portion (11) and the ceiling surface portion (12) include an insulating material mainly made of resin. As the insulating material constituting the main body portion 11, a resin which is cured by heat, light, chemical reaction or the like is used, and examples thereof include polyimide, epoxy resin and liquid crystal polymer. On the other hand, the ceiling surface portion 12 may include a resin film or the like in addition to the above materials. Or the insulator portion 10 may include a ceramics material such as glass.

As the insulator portion 10, a composite material containing a filler in a resin may be used. Typical examples of the filler include ceramic particles such as silica, alumina, and zirconia. The shape of the ceramic particles is not particularly limited and typically spherical, but is not limited thereto and may be needle-like, scaly or the like.

The inner conductor portion 20 is provided inside the insulator portion 10. The inner conductor portion 20 has a plurality of columnar conductors 21 and a plurality of connecting conductors 22. The plurality of columnar conductors 21 and the connecting conductors 22 form a coil portion 20L, .

The plurality of columnar conductors 21 are formed in a substantially columnar shape having an axial center parallel to the Z-axis direction. The plurality of columnar conductors 21 includes two groups of conductors that are mutually opposed in the Y-axis direction. Among them, the first columnar conductors 211 constituting one conductor group are arranged at predetermined intervals in the X-axis direction, and the second columnar conductors 212 constituting the other conductor group are arranged in the X-axis direction As shown in Fig.

The substantially columnar shape includes a columnar body having a circular cross-sectional shape in an orthogonal axis direction (a direction perpendicular to the axial center), and also includes a columnar body in which the cross-sectional shape is an ellipse or a long circular shape. / Short axis ratio is 3 or less.

The first and second columnar conductors 211 and 212 have the same diameter and the same height, respectively. In the illustrated example, five first and second columnar conductors 211 and 212 are provided, respectively. As will be described later, the first and second columnar conductors 211 and 212 are formed by laminating a plurality of via conductors in the Z-axis direction.

The substantially same diameter means that the increase in resistance is suppressed and the fluctuation of the dimension seen in the same direction is within 10%, for example, and the substantially same height is intended to secure the stacking accuracy of each layer , And the variation in height is within a range of, for example, +/- 1 mu m.

The plurality of connection conductors 22 include two groups of conductors formed parallel to the XY plane and facing each other in the Z-axis direction. Among them, the first connecting conductors 221 constituting one conductor group extend along the Y-axis direction and are arranged at intervals in the X-axis direction, and the first and second columnar conductors 211 and 212 are arranged separately . The second connecting conductors 222 constituting the other conductor group are arranged so as to be inclined at a predetermined angle with respect to the Y-axis direction and spaced apart in the X-axis direction, and between the first and second columnar conductors 211 and 212 Connect individually. In the illustrated example, the first connecting conductor 221 comprises five connecting conductors and the second connecting conductor 222 comprises four connecting conductors.

1, the first connection conductor 221 is connected to the upper end of a predetermined set of columnar conductors 211 and 212 and the second connection conductor 222 is connected to a predetermined set of columnar conductors 211 And 212, respectively. More specifically, the first and second columnar conductors 211 and 212 and the first and second connecting conductors 221 and 222 constitute the main turns Cn (C1 to C5) of the coil portion 20L, These main turns Cn are connected to each other so as to form a rectangular spiral around the X-axis direction. Thus, a coil portion 20L having a rectangular opening shape and having an axis (coil axis) in the X-axis direction is formed inside the insulator portion 10.

In the present embodiment, the main turning portion Cn includes five main turning portions C1 to C5. The opening shapes of each of the main turns C1 to C5 are formed in substantially the same shape.

The inner conductor portion 20 further has a lead portion 23 and a comb block portion 24 and the coil portion 20L is connected to the outer electrodes 30 (31 and 32) through these portions.

The lead portion 23 has a first lead portion 231 and a second lead portion 232. The first lead portion 231 is connected to the lower end portion of the first columnar conductor 211 constituting one end of the coil portion 20L and the second lead portion 232 is connected to the lower end portion of the coil portion 20L And is connected to the lower end of the second columnar conductor 212 constituting the end portion. The first and second lead portions 231 and 232 are arranged on the same XY plane as the second connection conductor 222 and are formed parallel to the Y axis direction.

The comb block unit 24 has first and second comb block units 241 and 242 arranged to face each other in the Y axis direction. The first and second comb block portions 241 and 242 are disposed with their tip portions of the comb teeth portions facing upward in Fig. Portions of the comb block portions 241 and 242 are exposed on the both end surfaces 103 and 104 and the bottom surface 102 of the insulator portion 10. First and second lead portions 231 and 232 are connected between predetermined comb portions of the first and second comb block portions 241 and 242, respectively (see FIG. 3). Conductor layers 301 and 302 constituting the ground layer of the external electrode 30 are respectively formed at the bottom of each of the first and second comb block portions 241 and 242 (see FIG. 2).

The external electrodes 30 have first and second external electrodes 31 and 32 which constitute external terminals for surface mounting and are opposed to each other in the Y-axis direction. The first and second external electrodes 31 and 32 are formed on a predetermined region of the outer surface of the insulator portion 10.

More specifically, the first and second external electrodes 31 and 32 include a first portion 30A covering both ends in the Y-axis direction of the bottom surface 102 of the insulator layer 10, And a second portion 30B covering both end surfaces 103 and 104 of the insulator layer 10 over a predetermined height. The first portion 30A is electrically connected to the bottoms of the first and second comb block portions 241 and 242 through the conductor layers 301 and 302. [ The second portion 30B is formed on the end faces 103 and 104 of the insulator layer 10 so as to cover the comb portions of the first and second comb block portions 241 and 242. [

The columnar conductor 21, the connecting conductor 22, the lead portion 23, the comb block portion 24 and the conductor layers 301 and 302 are formed of, for example, Cu (copper), Al (aluminum) Nickel), and in the present embodiment all include a plating layer of copper or an alloy thereof. The first and second external electrodes 31 and 32 include, for example, Ni / Sn plating.

4 is a schematic perspective side view showing the electronic component 100 by reversing its top and bottom. The electronic component 100 includes a film layer L1 and a laminate of a plurality of electrode layers L2 to L6, as shown in Fig. This embodiment is produced by sequentially laminating the film layer L1 and the electrode layers L2 to L6 from the ceiling surface 101 toward the bottom surface 102 in the Z-axis direction. The number of layers is not particularly limited, and is described as six layers.

The film layer L1 and the electrode layers L2 to L6 include the elements of the insulator portion 10 and the internal conductor portion 20 constituting each layer. 5A to 5F are schematic top views of the film layer L1 and the electrode layers L2 to L6 in Fig. 4, respectively.

The film layer L1 includes a ceiling surface portion 12 forming a ceiling surface 101 of the insulator portion 10 (Fig. 5A). The electrode layer L2 includes an insulating layer 110 (112) constituting a part of the insulator section 10 (the main body section 11) and a first connecting conductor 221 (Fig. 5B). The electrode layer L3 includes insulating layers 110 and 113 and a via conductor V1 constituting part of the columnar conductors 211 and 212 (FIG. 5C). The electrode layer L4 includes a via conductor V2 constituting a part of the comb block portions 241 and 242 in addition to the insulating layer 110 (114) and the via conductor V1 (FIG. 5D). The electrode layer L5 includes lead portions 231 and 232 and a second connecting conductor 222 in addition to the insulating layer 110 (115) and the via conductors V1 and V2 (FIG. 5E). The electrode layer L6 includes an insulating layer 110 (116) and a via conductor V2 (FIG. 5F).

The electrode layers L2 to L6 are stacked in the height direction via the bonding surfaces S1 to S4 (Fig. 4). Therefore, each of the insulating layers 110 and the via conductors V1 and V2 has a boundary in the height direction as well. The electronic component 100 is manufactured by a build-up method in which the electrode layers L2 to L6 are stacked while being fabricated in order from the electrode layer L2.

[Basic manufacturing process]

Next, the basic manufacturing process of the electronic component 100 will be described. A plurality of electronic components 100 are fabricated simultaneously at a wafer level, and they are individualized (chip-formed) for each device after fabrication.

Figs. 6 to 8 are schematic sectional views of an element unit area for explaining a part of the manufacturing process of the electronic component 100. Fig. As a concrete manufacturing method, the resin film 12A (film layer L1) constituting the ceiling surface portion 12 is adhered on the supporting substrate S, and the electrode layers L2 to L6 are sequentially formed thereon. As the supporting substrate S, for example, a silicon, glass, or sapphire substrate is used. Typically, a step of fabricating a conductor pattern constituting the internal conductor portion 20 by an electroplating method and covering the conductor pattern with an insulating resin material to fabricate the insulating layer 110 is repeated.

6 and 7 show the manufacturing process of the electrode layer L3.

In this step, a seed layer (feed layer) SL1 for electroplating is formed on the surface of the electrode layer L2 by, for example, a sputtering method or the like (Fig. 6A). The seed layer SL1 is not particularly limited as long as it is a conductive material and includes, for example, Ti (titanium) or Cr (chromium). The electrode layer L2 includes an insulating layer 112 and a connecting conductor 221. The connection conductor 221 is provided on the lower surface of the insulating layer 112 so as to be in contact with the resin film 12A.

Subsequently, a resist film R1 is formed on the seed layer SL1 (Fig. 6B). Exposure and development of the resist film R1 are sequentially performed to form a plurality of openings P1 (corresponding to the via conductors V13) constituting part of the columnar conductors 21 (211, 212) via the seed layer SL1 (Fig. 6 (C)). Thereafter, a discus process is performed to remove the resist residue in the opening P1 (FIG. 6D).

Subsequently, the supporting substrate S is immersed in the Cu plating bath, and a plurality of via conductors V13 including a Cu plating layer are formed in the opening P1 by applying a voltage to the seed layer SL1 (FIG. 6E). After the resist film R1 and the seed layer SL1 are removed (Fig. 7A), an insulating layer 113 covering the via conductor V13 is formed (Fig. 7B). The insulating layer 113 is formed by printing, applying, or bonding a resin film onto the electrode layer L2, and then curing the resin layer. After curing, the surface of the insulating layer 113 is polished (FIG. 7C) until the tip of the via conductor V13 is exposed by using a polishing apparatus such as a CMP (chemical mechanical polishing apparatus) or a grinder. 7C shows a state in which the support substrate S is reversed upside down so as to be set on the rotatable polishing head H and the polishing process (CMP) of the insulating layer 113 is performed in the polishing pad P that is revolving Respectively.

Thus, the electrode layer L3 is formed on the electrode layer L2 (Fig. 7D).

The insulating layer 112 is also printed, applied or adhered in the same manner as the insulating layer 113, and then cured, and the CMP (chemical mechanical polishing apparatus) ), A grinder, or the like.

Thereafter, similarly, the electrode layer L4 is formed on the electrode layer L3.

First, a plurality of via conductors (second via conductors) connected to a plurality of via conductors V13 (first via conductors) are formed on the insulating layer 113 (second insulating layer) of the electrode layer L3. That is, a seed layer that covers the surface of the first via conductor is formed on the surface of the second insulating layer, and a resist pattern in which a region corresponding to the surface of the first via conductor is opened on the seed layer And the second via conductor is formed by an electroplating method using the resist pattern as a mask. Subsequently, a third insulating layer covering the second via conductor is formed on the second insulating layer. Thereafter, the surface of the third insulating layer is polished until the tip of the second via conductor is exposed.

Further, in the step of forming the second via conductor, the via conductor V2 constituting a part of the comb-tooth block portions 24 (241, 242) is also formed at the same time (see Figs. 4 and 5D). In this case, as the resist pattern, a resist pattern in which the via conductor V2 formation region is opened is formed in addition to the formation region of the second via conductor.

8A to 8D show a part of the manufacturing process of the electrode layer L5.

First, a seed layer SL3 for electroplating and a resist pattern (resist film R3) having openings P2 and P3 are formed in order on the surface of the electrode layer L4 (FIG. 8A). Thereafter, discotic treatment is performed to remove resist residues in the openings P2 and P3 (Fig. 8B).

The electrode layer L4 has an insulating layer 114 and via conductors V14 and V24. The via conductor V14 corresponds to the via V1 constituting part of the columnar conductors 21 (211 and 212), and the via conductor V24 corresponds to the via hole 24 (241 and 242) V2) (refer to C and D in Fig. 5). The opening P2 is opposed to the via conductor V14 in the electrode layer L4 via the seed layer SL3 and the opening P3 is opposed to the via conductor V24 in the electrode layer L4 via the seed layer SL3. The opening P2 is formed in a shape corresponding to each connecting conductor 222. [

Subsequently, the supporting substrate S is immersed in the Cu plating bath, and by applying a voltage to the seed layer SL3, the via conductor V25 and the connecting conductor 222 including the Cu plating layer are formed in the openings P2 and P3, respectively C). The via conductor V25 corresponds to the via V2 constituting a part of the comb block portion 24 (241, 242).

Subsequently, the resist film R3 and the seed layer SL3 are removed, and the insulating layer 115 covering the via conductor V25 and the connecting conductor 222 is formed (FIG. 8D). Thereafter, if not shown, the surface of the insulating layer 115 is polished until the tip of the via conductor V25 is exposed. Further, by repeating the steps of forming a seed layer, forming a resist pattern, and electroplating, An electrode layer L5 shown in FIG. 5E is fabricated.

After the conductor layers 301 and 302 are formed in the comb block portions 24 (241 and 242) exposed to the surface (bottom face 102) of the insulating layer 115, the first and second external electrodes 31 and 32, respectively.

[Structure of Present Embodiment]

In recent years, with the miniaturization of parts, securing coil characteristics tends to become difficult. That is, the characteristics of the coil part largely depends on the size and shape of the built-in coil part. Typically, the larger the opening of the coil part, the higher the inductance characteristics are obtained.

However, due to the miniaturization of the parts, the size of the insulator portion is restricted, and as a result, the effective area of the coil portion is reduced, resulting in deterioration of the inductance characteristic.

Therefore, in this embodiment, by optimizing the dimensional ratio of the openings of the coil part, the coil part is designed to have high characteristics while reducing the size thereof.

9A to 9C are schematic diagrams for explaining the high-frequency characteristics of coil components. The coil component 200 shown in Fig. 9A has a rectangular parallelepiped insulator portion 210 and a coil portion 220C disposed therein. Here, for ease of understanding, the main turning portion Cn of the coil portion 220C is represented by a simple rectangular annular region formed by oblique lines (hatched) (also in FIG. 10). Reference numeral 230 denotes an external electrode.

In a typical miniaturization method of a coil component, the insulator portion 210 is made low in height, so that the upper side (hereinafter referred to as A side) and the lower side (hereinafter referred to as B side) of the main lead Cn approach each other . When the A side and the B side of the main turn portion Cn approach each other, the influence between the magnetic flux (magnetic field) formed on the A side and the B side becomes large. 9B, since the magnetic flux? A formed by the current IA flowing in the A side is opposite to the? B formed by the current IB flowing in the B side, as the A side and the B side approach each other, the magnetic flux? A (Offset) of the magnetic flux? B becomes larger. As a result, the magnetic flux? T of the entire opening of the main turning portion Cn also becomes small, and the inductance as designed can not be obtained.

Therefore, in the present embodiment, by increasing the distance between the A side and the B side as shown in Fig. 9C, mutual interference of the magnetic fluxes? A and? B formed at both sides can be suppressed and the magnetic flux? Thereby increasing the inductance. Further, the fact that the inductance can be increased leads to the fact that the line length can be shortened at the same time, and as a result, the Q value can be increased in that the resistance is suppressed to be low.

The distance between the A side and the B side of the main lead portion Cn can be realized by increasing the height of the insulator portion 210. [ Thus, since the mounting area of the coil component is not increased, the coil characteristics can be improved while reducing the size of the coil component.

The dimension ratio hd / ld of the inner circumferential surface of the conductor contacting the opening (core) of the main passage portion has to be reduced in the coil component 200 using the typical miniaturization method 9 of A). On the other hand, in this embodiment, the dimension ratio (hd / ld) is increased without changing the size (component volume) of the insulator section 10 by reconsidering the external dimensions of the chip component. As a result, it is possible to efficiently increase the inductance, and as a result, a coil component having a high Q value can be obtained.

10, the ratio (Ha / La) of the height dimension Ha to the length dimension La of the insulator section 10 is expressed by the following equation 1.5 times the ratio (hd / ld) of the height dimension (hd) between the inner peripheral portions of the main turns Cn along the Z-axis direction to the length dimension ld between the inner peripheral portions of the main turns Cn along the direction of the Z- . Thus, the Q value of the coil component 100 can be efficiently increased.

Here, the "length dimension (ld) between the inner circumferential portions of the main turns Cn along the Y-axis direction" is defined as the distance between the opposing faces of the first and second columnar conductors 211, 212 constituting the main turn Cn, Refers to the length in the Y axis direction projected on the plane.

The height dimension (hd) between the inner circumferential portions of the main turns Cn along the Z-axis direction is set so that the distance between the opposing faces of the first and second connection conductors 221 and 222 constituting the main turn Cn Refers to the length in the projected Z-axis direction.

The measurement of dimensions was carried out by performing end face polishing and milling from the Z-axis direction (height direction) to the plane passing through the center of the insulator in the height direction, and by observing about 200 times by a scanning electron microscope (SEM) The interval between the columnar conductor 211 and the second columnar conductor 212 is measured to be the length dimension ld between the inner peripheral portions of the main turns Cn. Further, end face polishing and milling are performed from the X axis direction (width direction) to the plane passing through the center in the width direction of the insulator portion, and the interval between the first connection conductor 221 and the second connection conductor 222 is measured by SEM , And the height dimension (hd) between the inner peripheral portions of the main guide portion Cn. And the observation specimens are used for the dimensional measurement of the other portions, respectively.

The opening dimension ratio (hd / ld) of the main guide portion Cn is not particularly limited, and is 0.6 or more and 1.2 or less in the present embodiment. Thus, a high inductance value and a Q value can be more stably secured.

The ratio (Sd / Sa) of the area Sd divided by the inner peripheral portion of the main turning portion Cn to the area Sa of the insulator portion 12 viewed from the coil axial direction (X axis direction) is also not particularly limited, In the present embodiment, it is 0.22 or more and 0.45 or less (22% or more and 45% or less). In this way, the inductance value of the coil component 100 can be efficiently increased.

Further, according to the present embodiment, since the first and second comb block portions 241 and 242 are disposed so that the tip portions of the comb teeth portions face upward in Fig. 1, the insulator portion 10) can be compensated for. Thus, the reliability of the coil component 100 can be increased.

<Experimental Example>

Hereinafter, an experimental example performed by the present inventors will be described with reference to Figs. 10 and 11. Fig. The opening of the main guide portion Cn is referred to as a core portion.

(Experimental Example 1)

A coil part sample having an insulator part and a coil part made of glass having dimensions of each part as described below was produced.

Insulator section: length La of 370 m, width Wa of 200 m, height Ha of 215 m

A conductor dimension in the X-axis direction (wc) of 10 占 퐉, a conductor dimension in the Z-axis direction (hc) of 35 占 퐉, a distance between principal conductor portions in the X- (Inter-conductor distance g) of 20 占 퐉, a core portion dimension ld of 200 占 퐉 in the Y axis direction, a core portion dimension wd in the X axis direction in the entire main take-over portion Cn of 130 占 퐉, hd) 85 m

Side margin: dimension in the Y-axis direction lb 50 m, dimension wb in the X-axis direction 30 m, dimension in the Z-axis direction hb 30 m

The inductance (L value) (measurement frequency 500 MHz) and the Q value (measurement frequency 1.8 GHz) were measured for the fabricated sample using an RF impedance analyzer (E4991A manufactured by Agilent) 2.6 nH, and a Q value of 27.

(Experimental Example 2)

The insulator portion has a length La of 350 mu m, a width Wa of 200 mu m, a height Ha of 230 mu m, a core portion dimension of 180 mu m in the Y axis direction ld, 130 mu m in the X axis direction wd, ) Of 100 mu m, a sample was prepared under the same conditions as in Experimental Example 1. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 2.7 nH and the Q value was 28.

(Experimental Example 3)

The insulator portion has a length La of 320 mu m, a width Wa of 200 mu m, a height Ha of 250 mu m, a core portion dimension of 150 mu m in the Y axis direction ld, 130 mu m in the X axis direction wd, ) Of 120 mu m, a sample was prepared under the same conditions as in Experimental Example 1. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 2.8 nH and the Q value was 29.

(Experimental Example 4)

The insulator portion has a length La of 305 mu m, a width Wa of 200 mu m, a height Ha of 265 mu m, a core portion dimension of 135 mu m in the Y axis direction ld, a 130 mu m in the X axis direction wd, ) &Lt; / RTI &gt; of 135 mu m.

The inductance (L value) and Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 2.9 nH and the Q value was 30.

(Experimental Example 5)

The insulator portion has a length La of 275 占 퐉, a width Wa of 200 占 퐉 and a height Ha of 290 占 퐉 and a core portion size of 105 占 퐉 in the Y-axis direction ld, 130 占 퐉 in the X-axis direction wd, ) Of 160 mu m, a sample was prepared under the same conditions as in Experimental Example 1. [

The inductance (L value) and Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 2.6 nH and the Q value was 29. [

(Experimental Example 6)

The insulator portion has a length La of 265 占 퐉, a width Wa of 200 占 퐉 and a height Ha of 300 占 퐉 and a core portion dimension of 95 占 퐉 in the Y-axis direction ld, 130 占 퐉 in the X-axis direction wd, ) Of 170 mu m, a sample was prepared under the same conditions as in Experimental Example 1. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 2.3 nH and the Q value was 28.

(Experimental Example 7)

A coil part sample having an insulator part and a coil part made of resin having dimensions of each part as described below was produced.

Insulator section: length (La) 410 占 퐉, width (Wa) 200 占 퐉, height (Ha) 195 占 퐉

The conductor dimension in the Y-axis direction (hc) 35 占 퐉, the distance between conductors (g) 10 占 퐉, the Y-axis conductor dimension in the Y- The core portion dimension in the axial direction ld is 250 占 퐉, the core portion dimension in the X-axis direction (wd) is 160 占 퐉, the core portion dimension in the Z-axis direction (hd)

Side margin: dimension in the Y-axis direction (lb) 45 m, dimension in the X-axis direction (wb) 20 m, dimension in the Z-axis direction (hb) 20 m

The inductance (L value) and Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.0 nH and the Q value was 31. [

(Experimental Example 8)

The insulator portion has a length La of 380 占 퐉, a width Wa of 200 占 퐉 and a height Ha of 210 占 퐉. The core portion dimensions are 220 占 퐉 in the Y axis direction ld, 160 占 퐉 in the X axis direction wd, ) Of 100 mu m, a sample was prepared under the same conditions as in Experimental Example 7. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.2 nH and the Q value was 32.

(Experimental Example 9)

The insulator portion has a length La of 350 mu m, a width Wa of 200 mu m, a height Ha of 230 mu m, a core portion dimension of 190 mu m in the Y axis direction ld, a 160 mu m in the X axis direction wd, ) Of 120 mu m, a sample was prepared under the same conditions as in Experimental Example 7. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.3 nH and the Q value was 33.

(Experimental Example 10)

The insulator portion has a length La of 320 占 퐉, a width Wa of 200 占 퐉 and a height Ha of 250 占 퐉. The core portion dimensions are 160 占 퐉 in the Y axis direction ld, 160 占 퐉 in the X axis direction wd, ) Of 140 mu m, a sample was prepared under the same conditions as in Experimental Example 7. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.4 nH and the Q value was 34.

(Experimental Example 11)

The insulator portion has a length La of 310 mu m, a width Wa of 200 mu m, a height Ha of 260 mu m, a core portion size of 150 mu m in the Y axis direction ld, 160 mu m in the X axis direction wd, ) Of 150 mu m, a sample was prepared under the same conditions as in Experimental Example 7. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.5 nH and the Q value was 34.

(Experimental Example 12)

The insulator portion had a length La of 275 占 퐉, a width Wa of 200 占 퐉 and a height Ha of 290 占 퐉. The core portion dimensions were 115 占 퐉 in the Y-axis direction ld, 160 占 퐉 in the X-axis direction wd, ) Of 180 mu m, the sample was prepared under the same conditions as in Experimental Example 7. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.3 nH and the Q value was 32.

(Experimental Example 13)

The insulator portion has a length La of 255 mu m, a width Wa of 200 mu m, a height Ha of 315 mu m, a core portion size of 95 mu m in the Y axis direction ld, 160 mu m in the X axis direction wd, ) Was 205 mu m, a sample was prepared under the same conditions as in Experimental Example 7. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.1 nH and the Q value was 31. [

(Experimental Example 14)

A conductor dimension (lc) of 30 占 퐉 in the Y-axis direction, a conductor dimension (wc) of 24 占 퐉 in the X-axis direction, a length (Hc) of 30 mu m and the core portion dimension was 160 mu m in the Y axis direction (Id), 160 mu m in the X axis direction (Wd) and 160 mu m in the Z axis direction (hd) A sample was prepared.

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.6 nH and the Q value was 36.

(Experimental Example 15)

The insulator portion has a length La of 310 mu m, a width Wa of 200 mu m, a height Ha of 260 mu m, a conductor dimension lc of 25 mu m in the Y axis direction, a conductor dimension wc of 24 mu m in the X axis direction, Except that the conductor dimension (hc) of the core section (hc) was 25 占 퐉 and the core section dimension was 170 占 퐉 in the Y axis direction (Id), 160 占 퐉 in the X axis direction A sample was prepared.

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 3.8 nH and the Q value was 37.

(Experimental Example 16)

The insulator portion has a length La of 310 mu m, a width Wa of 200 mu m, a height Ha of 260 mu m, a conductor dimension in the Y-axis direction lc of 20 mu m, a conductor dimension in the X- (Hc) of 20 mu m and the core portion dimensions were 180 mu m in the Y axis direction ld, 160 mu m in the X axis direction wd and 180 mu m in the Z axis direction (hd). A sample was prepared.

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 4.2 nH and the Q value was 37.

(Experimental Example 17)

The insulator portion has a length La of 310 mu m, a width Wa of 200 mu m, a height Ha of 260 mu m, a conductor dimension in the Y-axis direction lc of 15 mu m, a conductor dimension in the X- Except that the conductor dimension (hc) of the core section (hc) was 15 占 퐉 and the core section dimension was 190 占 퐉 in the Y axis direction (Id), 160 占 퐉 in the X axis direction A sample was prepared.

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 4.8 nH and the Q value was 36.

(Comparative Example 1)

The insulator portion has a length La of 400 mu m, a width Wa of 200 mu m, a height Ha of 200 mu m, a core portion dimension of 230 mu m in the Y axis direction ld, 130 mu m in the X axis direction wd, ) Of 70 mu m, a sample was prepared under the same conditions as in Experimental Example 1. [

The inductance (L value) and Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 2.2 nH and the Q value was 22.

(Comparative Example 2)

The insulator portion had a length La of 407 占 퐉, a width Wa of 200 占 퐉 and a height Ha of 202 占 퐉 and a core portion dimension of 237 占 퐉 in the Y-axis direction ld, 130 占 퐉 in the X-axis direction wd, ) Of 72 mu m, a sample was prepared under the same conditions as in Experimental Example 1. [

The inductance (L value) and the Q value of the fabricated sample were measured under the same conditions as in Experimental Example 1. The L value was 2.3 nH and the Q value was 23.

The conditions, dimensional ratio, area of the insulator portion and core portion viewed from the coil axis direction (X-axis direction), area ratio thereof, and coil characteristics of the above-described respective parts of Experimental Examples 1 to 17 and Comparative Examples 1 and 2 are shown in Tables 1 to 3 .

As shown in Tables 2 and 3, according to Experimental Examples 1 to 17 in which the dimensional ratio Ha / La of the insulator portion is 1.5 times or less of the dimensional ratio hd / ld of the core portion, the dimensional ratio Ha / La of the insulator portion, It was confirmed that a Q value higher than that of Comparative Examples 1 and 2 exceeding 1.5 times the dimensional ratio (hd / ld) of the core portion was obtained.

Also, it was confirmed that Q values (29 or more) higher than those of Experimental Examples 1, 2 and 6 were obtained according to Experimental Examples 3 to 5 in which the dimensional ratio (hd / ld) of the core portion was 0.8 to 1.5. Likewise, according to Experimental Examples 9 to 11, 14 to 17 in which the dimensional ratio (hd / ld) of the core portion is not less than 0.6 and not more than 1.0, a Q value of higher than (32) higher than that of Experiments 7, 8, 12, .

Also, it was confirmed that L values (2.7 nH or more) higher than those of Experimental Examples 1, 5, and 6 were obtained according to Experimental Examples 2 to 4 in which the dimensional ratio (hd / ld) of the core portion was 0.6 or more and 1.0 or less.

According to Experimental Examples 2 to 4 and 7 to 17 in which the ratio (Sd / Sa) of the area Sd of the core portion to the area Sa of the insulator portion is 22% or more and 45% or less, a high inductance value of 2.7 nH or more can be obtained .

Hereinafter, although the core area of the core part (wd / ld) is larger than that of the comparative example 2, the Q value is higher than that of the comparative example 2 lost.

In Experimental Example 4, since the dimensional ratio (wd / ld) of the core portion was almost 1, the highest Q value was obtained in Experimental Examples 1 to 6.

In Examples 7 to 17, since the insulation property of the insulator portion is higher than that of Experimental Examples 1 to 6, the conductor dimension can be increased to the maximum limit, so that the inductance value can be increased. With this, the Q value can be increased to 31 or more.

Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications may be made.

For example, in the above embodiments, the method of sequentially laminating the insulating layer and the via conductor in the coil part from the ceiling surface side toward the bottom surface side has been described. However, the present invention is not limited to this, Conductors may be sequentially stacked.

The present invention is also applicable to a method of manufacturing a coil component in which each main portion of a coil portion is sequentially laminated in a coil axial direction.

Further, in the above embodiment, the main portion has a quadrilateral shape as viewed in the Z-axis direction. However, even if the main portion has a polygonal shape and a part of R, the same effect can be obtained if the main turn portion conductors are opposed to each other.

In the above embodiment, the coil axis of the coil component is set in the X axis direction (width direction), but the same effect can be obtained even if the coil axis direction is the Z axis direction (height direction).

Even if the material used is glass or resin, for example, even if a part of the insulator includes ferrite powder or the like, the same effect can be obtained when the permeability is 2 or less. In addition, the dielectric constant of the insulator is 5 or less, especially the high-frequency characteristic can be improved. If the dielectric constant is 4 or less, the stray capacitance generated between the insulator and the terminal electrode can be further reduced, and the Q value at high frequency can be increased.

&Lt; Second Embodiment >

In the above-described first embodiment, the electronic component having the comb-tooth block portion is described. However, as shown in Figs. 1 to 3, the electronic component may not be provided with the comb- As a modified example. The ratio Ha / La of the height dimension Ha to the length dimension La of the insulator portion is set to be larger than the length dimension ld between the inner periphery portions of the main turns Cn along the Y- 1.5 times the ratio (hd / ld) of the height dimension (hd) between the inner peripheral portions of the main turns Cn along the Z-axis direction.

The opening dimension ratio (hd / ld) of the main head portion Cn is not particularly limited, but is 0.6 or more and 1.0 or less in the present embodiment. Thus, a high inductance value and a Q value can be more stably secured.

Also, the ratio (Sd / Sa) of the area Sd divided by the inner peripheral portion of the main turning portion Cn to the area Sa of the insulator portion seen from the coil axial direction (X axis direction) is not particularly limited, 0.22 or more and 0.65 or less (22% or more and 65% or less). Thus, the inductance value of the coil component can be effectively increased.

(First Configuration Example)

In the electronic component according to the first configuration example, the comb block section is not disposed. As a result, when the inner conductor portion is arranged in the insulator portion of the same volume, the design range of the coil portion is widened as compared with the case where the comb-tooth block portion is arranged, Value can be improved.

In this configuration example, since the comb block portion is not disposed, it is possible to form the external electrode only on one surface of the rectangular parallelepiped insulator portion, thereby making it possible to provide a single-surface mounting type electronic component. The coil component of the above embodiment is a three-sided mounting type electronic component in which external electrodes are formed on three surfaces 102, 103 and 104 of a rectangular parallelepiped insulator portion. However, the present invention is not limited to this, Surface-mounted type electronic component having external electrodes only on its surface.

Further, in the above embodiment, the connection between the coil portion and the external electrode is made via the comb-tooth block portion and the lead wire. In this configuration example, however, the coil portion and the external electrode are connected via the via conductor layer for connection.

Hereinafter, the electronic component according to the first configuration example will be described with reference to Figs. 12 to 14. Fig.

Fig. 12A is a schematic perspective view of the coil component according to the first exemplary configuration of the present embodiment, Fig. 12B is an external perspective view thereof, Fig. 13A is a schematic perspective side view thereof, , And Fig. 14 is a schematic perspective top view thereof.

In the drawings, the X-axis, Y-axis, and Z-axis directions indicate three axial directions perpendicular to each other.

The electronic component 1100 of this configuration example is configured as a coil component for surface mounting. The electronic component 1100 includes an insulator portion 1010, an internal conductor portion 1020, and an external electrode 1030.

The insulator portion 1010 has a ceiling surface 1101, a bottom surface 1102, a first end surface 1103, a second end surface 1104, a first side surface 1105 and a second side surface 1106, A width direction in the X-axis direction, a longitudinal direction in the Y-axis direction, and a height direction in the Z-axis direction. And the bottom surface 1102 becomes a mounting scene.

The insulator portion 1010 has a body portion 1011 and a ceiling surface portion 12. The main body portion 1011 incorporates an internal conductor portion 1020 and constitutes a main portion of the insulator portion 1010. The ceiling surface portion 12 constitutes a ceiling surface 1101 of the insulator portion 1010. The material used for the insulator portion 1010 is the same as that of the above embodiment.

The inner conductor portion 1020 is installed inside the insulator portion 1010. The inner conductor portion 1020 has a plurality of columnar conductors 1021 and a plurality of connection conductors 1022 and a via conductor layer V1023 for connection and the plurality of columnar conductors 1021 and the connection conductors 1022 The coil portion 1020L is constituted. The via conductor layer V1023 for connection is connected to both ends of the coil portion 1020L.

The plurality of columnar conductors 1021 are formed in a substantially columnar shape having an axis center parallel to the Z-axis direction. The plurality of columnar conductors 1021 include two groups of conductors that face each other in the Y-axis direction. Among them, the first columnar conductors 10211 constituting one conductor group are arranged at a predetermined interval in the X-axis direction, and the second columnar conductor 10212 constituting the other conductor group is also arranged in the X-axis direction As shown in Fig.

The substantially columnar shape includes a columnar body having a circular cross-sectional shape in an orthogonal axis direction (a direction perpendicular to the axial center), and also includes a columnar body in which the cross-sectional shape is an ellipse or a long circular shape. / Short axis ratio is 3 or less.

The first and second columnar conductors 10211 and 10212 have the same diameter and the same height, respectively. In the illustrated example, five first and second columnar conductors 10211 and 10212 are provided. As will be described later, the first and second columnar conductors 10211 and 10212 are formed by laminating a plurality of via conductors in the Z-axis direction.

The substantially same diameter means that the increase in resistance is suppressed and the fluctuation of the dimension seen in the same direction is within 10%, for example, and the substantially same height is intended to secure the stacking accuracy of each layer , And the variation in height is within a range of, for example, +/- 10 mu m.

The plurality of connection conductors 1022 includes two groups of conductors formed parallel to the XY plane and facing each other in the Z axis direction. Among them, the first connection conductors 10221 constituting one conductor group extend along the Y-axis direction and are arranged at intervals in the X-axis direction, and the first and second columnar conductors 10211 and 10212 are arranged separately . The second connecting conductors 10222 constituting the other conductor group are arranged so as to be inclined at a predetermined angle with respect to the Y-axis direction and spaced apart in the X-axis direction, and between the first and second columnar conductors 10211 and 10212 Respectively. In the illustrated example, the first connection conductor 10221 comprises five connection conductors and the second connection conductor 10222 comprises four connection conductors.

12, the first connection conductor 10221 is connected to the upper end of a predetermined set of columnar conductors 10211 and 10212, and the second connection conductor 10222 is connected to a predetermined one set of columnar conductors 10211 And 10212, respectively. More specifically, the first and second columnar conductors 10211 and 10212 and the first and second connecting conductors 10221 and 10222 constitute the main turns Cn (C1 to C5) of the coil portion 1020L , And these main turns Cn are connected to each other so as to form a rectangular spiral around the X-axis direction. Thus, a coil portion 1020L having a rectangular opening shape and having an axis (coil axis) in the X axis direction is formed inside the insulator portion 1010. [

In the present embodiment, the main turning portion Cn includes five main turning portions C1 to C5. The opening shapes of each of the main turns C1 to C5 are formed in substantially the same shape.

The via conductor layer V1023 for connection has the first via conductor layer V10231 for connection and the second via conductor layer V10232 for connection. The first connecting via conductor layer V10231 is connected to and connected to the lower end portion of the first columnar conductor 10211 constituting one end of the coil portion 1020L and the second connecting via conductor layer V10232 is connected to the coil portion 1020L and the other end of the second columnar conductor 10212 constituting the other end. The first and second via conductor layers V10231 and V10232 for connection have substantially the same cross sectional shape perpendicular to the Z axis direction and substantially the same size and shape as the cross section perpendicular to the Z axis direction of the columnar conductor 1021 have.

The external electrode 1030 has first and second external electrodes 1031 and 1032 which constitute external terminals for surface mounting and are opposed to each other in the Y axis direction. The first and second external electrodes 1031 and 1032 are formed only on the bottom surface 1102 as one surface of the insulator portion 1010. The external electrode 1030 is formed on the outside of the insulator portion 1010.

The columnar conductor 1021, the connection conductor 1022 and the via conductor layer V1023 for connection include a metal material such as Cu (copper), Al (aluminum), Ni (nickel) All of which include a plated layer of copper or an alloy thereof. The first and second external electrodes 1031 and 1032 include, for example, Ni / Sn plating.

15 is a schematic perspective side view showing the top and bottom of the electronic component 1100 inverted. 15, the electronic component 1100 includes a film layer L1001 and a laminate of a plurality of electrode layers L1002 to L1006. In the present embodiment, the film layer L1001 and the electrode layers L1002 to L1006 are sequentially laminated in the Z-axis direction from the ceiling surface 1101 toward the bottom surface 1102. [ The number of layers is not particularly limited, and is described as six layers.

The film layer L1001 and the electrode layers L1002 to L1006 include the elements of the insulator portion 1010, the internal conductor portion 1020 and the external electrode 1030 constituting each layer. 16A to 16F are schematic top views of the film layer L1001 and the electrode layers L1002 to L1006 in Fig. 15, respectively.

The film layer L1001 includes a ceiling surface portion 12 forming a ceiling surface 1101 of the insulator portion 1010 (Fig. 16A). The electrode layer L1002 includes an insulating layer 10110 (10112) constituting a part of the insulator portion 1010 (the main portion 1011) and a first connecting conductor 10221 (Fig. 16B). The electrode layer L1003 includes an insulating layer 10110 (10113) and a via conductor V1001 constituting part of the columnar conductors 10211 and 10212 (Fig. 16C). The electrode layer L1004 includes a second connection conductor 10222 in addition to the via conductor V1001 and the insulating layer 10110 (10114) (Fig. 16D). The electrode layer L1005 includes an insulating layer 10110 (10115) and a via conductor layer V1023 for connection (first connecting via conductor layer V10231, second connecting via conductor layer V10232) (FIG. 16E). The electrode layer L1006 includes an external electrode 1030 (a first external electrode 1031 and a second external electrode 1032) (FIG. 16F).

The electrode layers L1002 to L1006 are laminated in the height direction via the bonding surfaces S1 to S4 (Fig. 15). Therefore, each of the insulating layer 10110, the via conductor V1001, the via conductor layer V1023 for connection, and the external electrode 1030 have boundary portions in the height direction as well. The electronic component 1100 is manufactured by the build-up method similar to the above embodiment in which the electrode layers L1002 to L1006 are laminated while sequentially fabricating the electrode layers L1002.

As described above, in the electronic component 1100 in the first configuration example, since the comb block portion is not disposed, the core portion dimension ld in the Y-axis direction can be enlarged. As a result, the opening area of the coil portion 1020L can be enlarged, and the L value and the Q value can be increased.

In this configuration example, since the external electrode 1030, which is an external terminal for surface mounting, is formed on only one surface of the electronic component 1100, when mounting the electronic component 1100 by soldering, The solder fillet is not formed, and high-density mounting is possible.

Further, since the coil portion 1020L and the external electrode 1030 are connected by the connecting via conductor layer V1023, the current path from the external electrode to the coil portion 1020 can be shortened I can take it. Thus, it is possible to obtain the electronic component 1100 in which the generation of noise is small and the characteristic deterioration is small.

(Second Configuration Example)

In the first configuration example, the via conductor layer V1023 for connection has a substantially circular cross-sectional shape perpendicular to the Z-axis direction, but is not limited thereto. For example, the via conductor layer V1023 may have a long circular shape. . The configuration that is different from the first configuration example will be mainly described, and the same configurations are denoted by the same reference numerals and the description thereof may be omitted. Also in the present structural example, as in the first structural example, it is possible to increase the opening area of the coil part, thereby making it possible to increase the L value and the Q value.

Hereinafter, the coil component according to the second configuration example will be described with reference to Figs. 17 to 19. Fig.

17 is a schematic perspective view of the coil part. Figure 18 is a schematic perspective side view thereof. 19 is a schematic perspective top view thereof.

The electronic component 2100 of this configuration example is configured as a coil component for surface mounting. The electronic component 2100 includes an insulator part 2010, an internal conductor part 2020, and an external electrode 1030.

The insulator part 2010 has a body part 2011 and a ceiling surface part 12. [ The main body 2011 incorporates an internal conductor portion 2020 and constitutes a main portion of the insulator portion 2010. [

The insulator portion 2010 has a ceiling surface 2101, a bottom surface 2102, a first end surface 2103, a second end surface 2104, a first side surface 2105 and a second side surface 2106, A width direction in the X-axis direction, a longitudinal direction in the Y-axis direction, and a height direction in the Z-axis direction.

The inner conductor portion 2020 is provided inside the insulator portion 2010. The inner conductor portion 2020 has a plurality of columnar conductors 1021 and a plurality of connection conductors 1022 and a via conductor layer V2023 for connection and the plurality of columnar conductors 1021 and the connection conductors 1022 The coil portion 1020L is constituted. The via conductor layer V2023 for connection is connected to both ends of the coil portion 1020L.

The via conductor layer V2023 for connection has the first via conductor layer V20231 for connection and the second via conductor layer V20232 for connection. The first connecting via conductor layer V20231 is connected to the lower end portion of the first columnar conductor 10211 constituting one end of the coil portion 1020L and the second connecting via conductor layer V20232 is connected to the lower end portion of the coil portion 1020L, And the second columnar conductor 10212 constituting the other end of the second columnar conductor 10212. The first and second via conductor layers V20231 and V20232 for connection have a circular cross section perpendicular to the Z axis direction and a larger cross section than a cross section perpendicular to the Z axis direction of the columnar conductor 1021. [ In other words, when the columnar conductor 1021 and the via conductor layer for connection V2023 are projected on the XY plane, the roughly circular projected view of the columnar conductor 1021 can be seen in all of the roughly circular projections of the via conductor layer V2023 for connection .

The external electrode 1030 has first and second external electrodes 1031 and 1032 which constitute external terminals for surface mounting and are opposed to each other in the Y axis direction. The first and second external electrodes 1031 and 1032 are formed only on the bottom surface 2102 as one surface of the insulator portion 2010.

As described above, in the present configuration example, the cross-sectional shape of the via conductor layer V2023 for connection is set to be a long circle, and the sectional shape is larger than the cross-section of the columnar conductor 1021 constituting a part of the coil portion 1020L, The contact area between the external electrode 1020L and the external electrode 1030 can be increased.

(Third Configuration Example)

A dummy via conductor layer which is the same layer as the via conductor layers V1023 and V2023 for connection and which does not electrically connect the coil portion 1020L and the external electrode 1030 may be formed in each of the above- 3 configuration example. A plurality of dummy via conductors are formed in the insulator in contact with the external electrodes 1030. By forming the dummy via conductor layer, the adhesion strength between the external electrode 1030 and the insulator portion 1010 can be improved. The formation of the dummy via conductor layer is applicable to the above configuration example and the above embodiment mode.

Fig. 20 is a perspective schematic perspective view of a coil component according to the third configuration example. Fig. 21 is a schematic perspective side view thereof. 22 is a schematic perspective top view thereof. In the third configuration example, a case where a dummy via conductor layer is formed in the first configuration example will be described as an example, and the same components as in the first configuration example will be denoted by the same reference numerals, and a description thereof will be omitted.

The electronic component 3100 of this configuration example is configured as a coil component for surface mounting. The electronic component 3100 includes an insulator portion 3010, an internal conductor portion 1020, and an external electrode 1030.

The insulator portion 3010 has a body portion 3011 and a ceiling surface portion 12. The main body portion 3011 includes an internal conductor portion 1020 and a dummy via conductor layer 3040 and constitutes a main portion of the insulator portion 3010. [

The insulator portion 3010 has a ceiling surface 3101, a bottom surface 3102, a first end surface 3103, a second end surface 3104, a first side surface 3105 and a second side surface 3106, A width direction in the X-axis direction, a longitudinal direction in the Y-axis direction, and a height direction in the Z-axis direction.

The dummy via conductor layer 3040 includes a plurality of protrusions formed on the inner surface portion of the external electrode 1030 facing the bottom surface 3102 of the rectangular parallelepiped insulator portion 3010, And is immersed in the bottom surface 3102 of the portion 3010. The tip end portion of the dummy via conductor layer 3040 is opposed to the inner conductor portion 1020 via the insulating material constituting the insulator portion 3010 and is therefore not in contact with the coil portion 1020L.

The dummy via conductor layer 3040 is formed of the same layer as the via conductor layer for connection V1023. The plurality of dummy via conductor layers 3040 include two conductor layer groups facing each other in the Y-axis direction. Of these, the first dummy via conductor layers 3041 constituting one conductor layer group are arranged in correspondence with the four corners of the first external electrode 1031 having a substantially rectangular shape in the XY plane. The second dummy via conductor layers 3042 constituting the other conductor layer group are arranged in correspondence with the four corners of the second external electrode 1032 having a substantially rectangular shape in the XY plane. The dummy via conductor layer 3040 is electrically insulated from the internal conductor portion 1020 by the insulating layer constituting the insulator portion 3011. [

In this modification, the adhesion strength between the external electrode 1030 and the insulator portion 3011 is improved by forming the dummy via conductor layer 3040.

That is, in the manufacturing method of the external electrode 1030, for example, a seed layer for electroplating is formed in the same manner as the method of manufacturing the conductor pattern constituting the internal conductor portion of the above embodiment by the electroplating method, A method of forming an external electrode by an electroplating method can be employed. Strong adhesion between the dummy via conductor layer 3040 and the external electrode 1030 is generated by manufacturing the external electrode 1030 in this manner and the adhesion strength between the insulator portion 3011 and the external electrode 1030 is improved.

<Characteristics of electronic parts>

The electronic component of the present invention is not limited to the above-described embodiments, and for example, the components shown in Figs. 23 and 24 may be employed. 23 and 24 are schematic perspective views of the electronic component according to the above embodiment. 23 show views of electronic components in which the comb-tooth block portion 24 is arranged as in the first embodiment, and each of the figures in Fig. 24 shows a state in which the comb- Fig. 5 shows a view of an electronic component which is not shown. The same reference numerals are given to the same components as those of the above-described embodiments.

The external dimensions of the respective electronic components shown in Figs. 23 and 24 are the same, and the ratio Ha / La of the height dimension Ha to the length dimension La of the insulator portion in any electronic component is the same as the ratio Ha / Of the ratio (hd / ld) of the height dimension (hd) between the inner peripheral portions of the main turns Cn along the Z-axis direction to the length dimension ld between the inner peripheral portions of the main turns Cn along the main axis Cn.

23A is a schematic perspective side view of the electronic component 100 of the first embodiment. 23B shows a state in which the lead portion 23 is not provided as compared with the electronic component 100 and the external electrode 30 and the coil portion (not shown) are connected via the via conductor layer V1023 for connection as in the second embodiment 1020L of the electronic component 4100 are connected. 23C shows that the length of the comb tooth block portion 24 in the Y axis direction is shorter than that of the electronic component 3100 of FIG. 23B and the length of the comb tooth block portion 24 in the Y- 23, which is a schematic perspective side view of the electronic component 5100 in the case where the distance is long, the side margins between the coil portion 20L and the insulator end face in the Y-axis direction The dimension 1b is all 45 占 퐉.

24 correspond to the electronic component 1100 according to the second embodiment (first configuration example), and the dimensions 1b of the side margins in the Y-axis direction are different, same. The side margin 1b of the electronic component 1100A shown in Fig. 24A is 45 mu m, the side margin 1b of the electronic component 1100B shown in Fig. 24B is 20 mu m, The side margin 1b of the electronic component 1100C shown in Fig.

Fig. 25 shows inductance (L value) characteristics of the respective electronic components shown in Figs. 23 and 24. Fig. 26 shows the Q value characteristics of the electronic components shown in Figs. 23 and 24. Fig. In FIGS. 25 and 26, A of 23 on the abscissa corresponds to the electronic component shown in A of FIG. 23, and C of 23, C of 24, A of 24, B of 24, Correspond to the electronic components shown in Fig. 23B, Fig. 23C, Fig. 24A, Fig. 24B and Fig. 24C, and the inductance and Q value of each electronic component are plotted.

As shown in Figs. 25 and 26, the L value is 3.0 nh or more and the Q value is 30 or more in any electronic component, and a high inductance value and Q value can be obtained. Further, by enlarging the opening (core) of the coil portion, it is possible to further improve the inductance characteristic and the Q value characteristic.

Fig. 27 is a diagram for comparing regions in which internal conductor portions can be formed due to a difference in configuration of electronic components. Fig. 27, each dimension is described by taking as an example the external shape of the electronic component is 200 mu m (width) x 400 mu m (width) x 200 mu m (height).

27B is a schematic external side view of the one-sided mounting type electronic component 1100 shown in the second embodiment (first configuration example). 27C shows a schematic perspective side view of the three-sided mounting type electronic component 100 according to the first embodiment. 27D shows a schematic external side view of a conventional five-sided mounting type electronic component 7100, and reference numeral 7030 denotes an external electrode. In any electronic component, the thickness of the external electrode was 10 mu m. 27A shows an example in which the external shape of the insulator portion is assumed to be equal to the external shape of the electronic component, and the volume of the insulator portion 6010 at this time is 100% The ratio of the insulator portion in the electronic component shown in Fig.

In the single-sided mounting type electronic component 1100 of Fig. 27B, the insulator portion 1010 occupies 95%. In the three-sided mounting type electronic component 100 of Fig. 27C, The ratio occupied by the insulator portion 10 is 84%. In the five-sided mounting type electronic component 7100 of Fig. 27D, the ratio of the insulator portion is 76.95%. The higher the ratio of the insulator portion in the electronic component is, the larger the region in which the internal conductor portion disposed in the insulator portion can be formed. As a result, the single-sided mounting type electronic component 1100 and the three-sided mounting type electronic component 100 all have a larger formation area of the internal conductor portion than the conventional five-sided mounting type electronic component 7100, It is possible to enlarge the openings (cores). Thus, the L value and the Q value can be increased.

10, 1010, 2010, 3010: Insulator portion
20, 1020, 2020: inner conductor portion
20L, 1020L: coil part
21, 211, 212, 1021, 10211, 10212: columnar conductor
22, 221, 222, 1022, 10221, 10222:
10000, 1100, 1100A, 1100B, 1100C, 2100, 3100, 4100, 5100: Electronic parts (coil parts)
1102, 2102, 3102:
V1023, V10231, V10232, V2023, V20231, V20232: via conductor layer for connection
3040, 3041, 3042: Dummy via conductor layer
Cn: main referent

Claims (10)

An insulator portion having a width direction in a first axis direction, a length direction in a second axis direction, and a height direction in a third axis direction,
And a coil portion (peripheral portion) wound around the first axial direction, wherein the coil portion
And,
The ratio of the height dimension to the length dimension of the insulator portion is set such that the ratio of the height dimension between the inner circumferential portions of the main turning portion along the third axial direction to the length dimension between the inner circumferential portions of the main turning portion along the second axial direction Of the coil component. The method according to claim 1,
Wherein a ratio of a height dimension between inner peripheral portions of the main turning portion along the third axial direction to a length dimension between inner peripheral portions of the main turning portion along the second axial direction is 0.6 or more and 1.0 or less. 3. The method according to claim 1 or 2,
Wherein a ratio of an area divided by an inner peripheral portion of the main turning portion to an area of the insulator portion viewed from the first axis direction is 0.22 or more and 0.45 or less. 3. The method according to claim 1 or 2,
Wherein the insulator portion comprises ceramics or a resin material. 3. The method according to claim 1 or 2,
Wherein a ratio of an area defined by an inner peripheral portion of the main turning portion to an area of the insulator portion seen from the first axis direction is 0.22 or more and 0.65 or less. 6. The method of claim 5,
Wherein the insulator portion comprises ceramics or a resin material. 3. The method according to claim 1 or 2,
Wherein the insulator portion has a rectangular parallelepiped shape,
Wherein the coil part further comprises an external electrode electrically connected to the coil part and disposed only on one surface of the insulator part. 8. The method of claim 7,
Wherein the coil portion and the external electrode are electrically connected by a via conductor for connection connected to an end portion of the coil portion. 9. The method of claim 8,
And a cross section orthogonal to the third axis of the via conductor has a cross sectional shape larger than a cross section orthogonal to the third axis at an end of the coil section. 8. The method of claim 7,
Wherein the outer electrode has an inner surface portion facing the one surface of the insulator portion and a plurality of protrusions formed in the inner surface portion and being immersed in the one surface.

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