KR20170100974A - Liquid composition for removing photoresist - Google Patents

Abstract

More particularly, the present invention relates to a photoresist stripper composition comprising 1 to 10% by weight of an amine compound, 0.5 to 3% by weight of an alkali compound, 0.01 to 0.1% by weight of an azole compound, 1 to 5% (DFR) remains in the solution, and 82% to 97% by weight of water does not remain, copper (Cu) which is the surrounding metal is hardly corroded, and further, will be.

Description

Liquid composition for removing photoresist < RTI ID = 0.0 >

More particularly, the present invention relates to a photoresist stripper composition comprising 1 to 10% by weight of an amine compound, 0.5 to 3% by weight of an alkali compound, 0.01 to 0.1% by weight of an azole compound, 1 to 5% (DFR) remains in the solution, and 82% to 97% by weight of water does not remain, copper (Cu) which is the surrounding metal is hardly corroded, and further, will be.

BACKGROUND ART [0002] In recent years, a circuit line width of a printed circuit board (PCB) has gradually become finer in accordance with the trend of thin and small size of various electronic products. In a typical manufacturing process for manufacturing such a fine circuit, a conductive metal film is first plated on an insulating resin, A step of applying a photoresist uniformly, followed by exposure to UV and development processing to form a circuit, and a step of removing the unnecessary photosensitive photoresist using the release liquid composition.

At this time, the peeling liquid composition is required to have no residue of a photosensitive film (DFR) in a microcircuit after peeling off a photosensitive photoresist, and to minimize the corrosion to the surrounding metal (Cu) Various release liquid compositions have conventionally been developed to meet these requirements.

For example, Korean Patent No. 10-0324172 (Jan. 30, 2002) discloses that a mixture of 10 to 30% by weight of a water-soluble organic amine compound and 70 to 90% by weight of a mixture of diethylene glycol monoalkyl ether and N-alkylpyrrolidone Wherein the weight ratio of the diethylene glycol monoalkyl ether to the N-alkyl pyrrolidone is 1: 1.1 to 2.5.

However, in the case of the SAP (Semi-Additive Process) method in which electroless copper plating is coated on insulating resin to a thickness of 1.0 탆 or less and a photoresist is coated thereon to form a fine circuit, There is a problem that alkaline corrosion occurs in the lower electroless copper plating layer due to the compound, adversely affecting the subsequent process.

 In addition, the peeling liquid composition has a problem that the peeling member, which is finely cleaved by the peeling reaction, flows into the peeling liquid tank and blocks the spray filter, thereby lowering the pressure and decreasing the peeling force. Further, And the lifetime of the peeling solution is shortened.

In addition, Korean Patent Laid-Open No. 10-2015-0075519 (Jul. 06, 2015) discloses a process for the production of 2-amino-N, N-dimethylacetamide, Acetamide compounds such as ethyl-N-methyl-acetamide and the like; Alkaline compounds such as KOH, NaOH, carbonate and the like; Water-soluble organic solvent; A photoresist stripper composition comprising a corrosion inhibitor such as an organic acid, an organic acid amide ester, or an azole compound has been introduced.

However, such a peeling liquid composition also has a problem that it can not cleanly remove the photosensitive photoresist and corrodes copper (Cu), which is a surrounding metal.

Registration No. 10-0324172 (Jan. 30, 2002) Open Patent No. 10-2015-0075519 (Jul. 06, 2015)

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of removing a photosensitive photoresist cleanly so as not to leave a residue of a photosensitive film (DFR) on a microcircuit, minimize corrosion to copper (Cu) And to provide a photoresist stripper liquid composition which is easy to collect tear off pieces.

The photoresist stripper composition according to the present invention may contain 1 to 10% by weight of at least one amine compound selected from triethanolamine, benzylamine, monoethanolamine, dimethylethanolamine and ethylenediamine; 0.5 to 3% by weight of at least one alkaline compound selected from sodium hydroxide, tetramethylammonium hydroxide, potassium hydroxide, magnesium hydroxide and 2-hydroxyethyltrimethylammonium hydroxide; 0.01 to 0.1% by weight of at least one azole compound selected from benzotriazole, 5-methylbenzotriazole, tolyltriazole, pyrazole, tetrazole and imidazole; 1 to 5% by weight of at least one solvent selected from the group consisting of ethylene glycol phenyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, benzyl alcohol, diethylene glycol monobenzyl ether and ethylene glycol monomethyl ether; And 82-97 wt% water; .

The photoresist stripper composition according to the present invention is effective in peeling off the DFR from a microcircuit of a PCB substrate, leaving no stripping parts, having very low corrosiveness to copper (Cu) which is a peripheral metal, and furthermore, Not only is it easy to recover the peeling member, but also has a long lifetime of the peeling solution and easy maintenance, thereby reducing the processing cost.

Brief Description of the Drawings Fig. 1 is a photomicrograph of a DFR residue on a circuit surface of a PCB substrate treated with a peeling liquid according to an embodiment of the present invention and a comparative example,
FIG. 2 is a scanning electron micrograph of copper (Cu) corrosion on a CCL substrate treated with a peeling liquid according to Examples and Comparative Examples of the present invention,
Fig. 3 is a photograph showing sizes of DFR peeling pieces peeled off using the peeling solution according to Examples and Comparative Examples of the present invention.

The photoresist stripper solution composition of the present invention comprises 1 to 10% by weight of an amine compound, 0.5 to 3% by weight of an alkali compound, 0.01 to 0.1% by weight of an azole compound, 1 to 5% by weight of a solvent, .

First, the amine compound shortens the break point (BP), which is the time point at which the photoresist is peeled from the PCB substrate, through the swelling action that the peeling liquid penetrates into the polymer chain of the photoresist and swells up, And it is possible to use at least one selected from the group consisting of triethanolamine, benzylamine, monoethanolamine, dimethylethanolamine and ethylenediamine, and the most preferred amine compound is monoethanolamine.

The content of the amine compound is 1 to 10% by weight based on the total weight of the peeling liquid composition. When the content is less than 1% by weight, the peeling force on the photoresist is weak and the BP is increased. On the other hand, There is a problem that copper corrosion is increased and the swelling speed of the photoresist becomes too fast, so that the DFR is interposed in the circuit, resulting in a phenomenon of peeling off.

Next, the alkali compound functions to facilitate the recovery by increasing the size of the peeling member. The alkali compound may be at least one selected from sodium hydroxide, tetramethylammonium hydroxide, potassium hydroxide, magnesium hydroxide and 2-hydroxyethyltrimethylammonium hydroxide Of which the most preferred is potassium hydroxide.

If the content is less than 0.5% by weight, the effect of increasing the size of the stripping piece is weak. On the other hand, if the content is more than 3% by weight, the swelling rate of the photoresist becomes too high, There is a problem in that the DFR is separated from the DFR.

The azole compound has a function of inhibiting alkali corrosion to the copper (Cu) plating layer, and it is preferable to use at least one selected from benzotriazole, 5-methylbenzotriazole, tolyltriazole, pyrazole, tetrazole and imidazole And the most preferred azole compound is pyrazole.

The content of the azole compound is 0.01 to 0.1% by weight. If the content is less than 0.01% by weight, alkali corrosion may occur on the copper (Cu) plating layer. On the other hand, if the content is more than 0.1% by weight, And an unbalance occurs with other constituents, which is not preferable in terms of economy.

The solvent acts to increase the peeling force against the photoresist. Examples of the solvent include ethylene glycol phenyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, benzyl alcohol, diethylene glycol monobenzyl ether, ethylene glycol monomethyl Ether, and most preferably benzyl alcohol.

If the content is less than 1% by weight, the peeling force is weak. On the contrary, if the content is more than 5% by weight, the solvent may not dissolve, which is not preferable.

Finally, water functions to maintain the overall balance of the composition, and it contains 82 to 97% by weight of the whole peeling liquid composition. If the content of water is less than 82% by weight, the swelling speed of the photoresist is accelerated due to the concentration effect of the stripping solution composition, resulting in a problem of peeling in the circuit or copper (Cu) corrosion, , The peeling performance is decreased due to the diluting effect of the peeling liquid composition, which is not preferable.

In the method for preparing a release liquid composition according to the present invention, necessary components are firstly selected from among the amine compound, the alkali compound, the azole compound and the solvent, and then the amine compound and the solvent are sequentially added to the water . In this way, the introduction of amine compounds and solvents into water is intended to alleviate excessive heat generation during the dissolution process.

Next, a solution of an azole compound dissolved in water is added thereto. The addition of the azole compound in a state in which the azole compound is previously dissolved in water is intended to induce even dispersion of the azole compound and prevent partial un-dissolution phenomenon.

Finally, the alkali compound is added and sufficiently stirred. Since the alkaline compound has a high specific gravity and a high viscosity, the load on the agitator is high, and it is not easy to induce a uniform dispersion. Therefore, it is preferable to add the alkali compound at the end to alleviate the specific gravity and viscosity.

      The release liquid composition according to the present invention is a colorless or light pale yellow liquid with a weak amine flavor. The viscosity is 6 to 8 cp and the specific gravity is 1.1 to 1.2 g / ml.

Hereinafter, the present invention will be described in detail with reference to preferred embodiments and comparative examples. However, the scope of protection of the present invention is not limited by these examples.

[Example]

An amine compound, an alkali compound, an azole compound, a solvent and water are prepared in predetermined amounts as shown in Table 1 below. First, the amine compound and solvent are added to the water in order to fully dissolve. The azole compound solution dissolved in water is further added thereto, and the alkaline compound is further added thereto, followed by sufficiently stirring to prepare the release liquid composition according to the present invention.

Example Components and Content (Unit: wt%) Amine compound Alkaline compound Azole compound Solvent water Sum One DMEOA 5% KOH 3% Pyrazole 0.05% EGPE 3% Balance 100% 2 MEA 5% NaOH 1.5% TTZ 0.1% EGPE 2.5% Balance 100% 3 MEA 1% KOH 1.5% TTZ 0.05% BAOH 2.5% Balance 100% 4 MEA 5% KOH 1% 5MBTA 0.01% EGPE 3% Balance 100% 5 DMEOA 3% NaOH 3% TTZ 0.05% DGBE 3% Balance 100% 6 MEA 10% TMAH 3% 5MBTA 0.1% DGBE 1% Balance 100% 7 MEA 5% KOH 1.5% 5MBTA 0.05% BAOH 2.5% Balance 100% 8 MEA 10% KOH 0.5% BTA 0.1% DGBE 1% Balance 100% 9 DMEOA 3% KOH 3% BTA 0.05% EGBE 3% Balance 100% 10 TEA 10% NaOH 1% BTA 0.1% BAOH 3% Balance 100% 11 MEA 1% NaOH 1.5% 5MBTA 0.1% EGPE 2.5% Balance 100% 12 MEA 5% KOH 1.5% Pyrazole 0.05% BAOH 2.5% Balance 100% 13 TEA 5% KOH 1% Pyrazole 0.01% DGBE 5% Balance 100% 14 DMEOA 5% NaOH 3% 5MBTA 0.05% BAOH 3% Balance 100% 15 MEA 5% NaOH 1.5% BTA 0.1% EGPE 2.5% Balance 100% 16 MEA 1% NaOH 1.5% Pyrazole 0.1% EGPE 2.5% Balance 100% 17 MEA 10% TMAH 3% Pyrazole 0.1% EGBE 1% Balance 100% 18 TEA 10% NaOH 1% TTZ 0.1% EGPE 3% Balance 100% 19 MEA 1% KOH 1.5% BTA 0.05% BAOH 2.5% Balance 100% 20 MEA 10% NaOH 0.5% TTZ 0.1% EGBE 1% Balance 100%

The meanings of abbreviations shown in Table 1 are as follows.

- DMEOA: dimethylethanolamine (Di Methyl Ethanol Amine)

- MEA: Mono Ethanol Amine

- TEA: triethanolamine (Tri Ethanol Amine)

- TMAH: Tetra Methyl Ammonium Hydroxide (TMAH)

- TTZ: Tolyl Triazole

- 5MBTA: 5-Methyl Benzotriazole (5-methylbenzotriazole)

- BTA: Benzotriazole

- EGPE: ethylene glycol phenyl ether (Ethylene Glycol Phenyl Ether)

- BAOH: Benzyl Alcohol

- DGBE: Diethylene Glycol Mono Butyl Ether < RTI ID = 0.0 >

- EGBE: ethylene glycol monobutyl ether (Ethylene Glycol Mono Butyl Ether)

[Comparative Example]

An amine compound, an alkali compound, an azole compound, and a solvent are prepared in predetermined amounts as shown in Table 2 below, and a release liquid composition is prepared in the same manner as in the above Examples.

Comparative Example Components and Content (Unit: wt%) Amine compound Alkaline compound Azole compound Solvent water Sum One MEA 5% TMAH 1.5% TTZ 0.1% MDG 5% Balance 100% 2 MEA 1% NaOH 5% Pyrazole 0.1% EGPE 2.5% Balance 100% 3 MEA 5% KOH 1.5% 5MBTA 0.005% DMSO 5% Balance 100% 4 TEA 5% KOH 1% ATZ 0.1% MFTG 5% Balance 100% 5 MEA 10% NaOH 0.5% TTZ 0.005% EGBE 0.5% Balance 100% 6 DMEOA 0.5% NaOH 3% TTZ 0.05% DGBE 3% Balance 100% 7 DMEOA 5% KOH 3% Pyrazole 0.05% MFDG 5% Balance 100% 8 MEA 15% KOH 0.5% BTA 0.1% DGBE 1% Balance 100% 9 TEA 10% NaOH 0.3% BTA 0.1% BAOH 3% Balance 100% 10 DMEOA 15% NaOH 1.5% 5MBTA 0.05% BAOH 3% Balance 100% 11 MEA 5% NaOH 0.5% Triazole 0.1% EGBE 1% Balance 100% 12 MEA 1% KOH 0.3%  TTZ 0.05% BAOH 2.5% Balance 100% 13 MEA 10% KOH 0.5% 5MBTA 0.1% DGBE 0.5% Balance 100% 14 MEA 5% KOH 1.5% Pyrazole 0.005% BAOH 0.5% Balance 100% 15 MEA 0.5% KOH 1.5% BTA 0.05% BAOH 2.5% Balance 100% 16 TEA 0.5% KOH 1% 5MBTA 0.01%  EGBE 3% Balance 100% 17 DMEOA 3%  KOH 5% BTA 0.05% EGBE 3% Balance 100% 18 MEA 5% NaOH 1.5% BTA 0.005% EGPE 0.5% Balance 100% 19 MEA 5% TMAH 1.5% 5MBTA 0.1% EGPE 0.5% Balance 100% 20 TEA 15% NaOH 1% TTZ 0.1% EGPE 3% Balance 100%

The meanings of abbreviations shown in the above Table 2 are as follows. Descriptions of the same abbreviations as in Table 1 are omitted.

- ATZ: Aminotetrazole (5-Amino Tetrazole)

- Triazole: 1,2,4-Triazole

- MDG: Methyl Di Glycol

- DMSO: dimethylsulfoxide (Di Methyl Sulfoxide)

- MFTG: tripropylene glycol monomethyl ether (Tripropylene Glycol Mono Methyl Ether)

- MFDG: Dipropylene Glycol Methyl Ether

[Performance test]

The peel strength of the photoresist, the corrosion resistance of copper (Cu) and the size of the peel piece were measured by the following test methods for the peel solution composition prepared according to Examples and Comparative Examples, and the results are shown in the following Table 3 and Table 4.

One) Peel force  exam

A PCB substrate is attached inside a peeling apparatus capable of spray processing, and the temperature of the peeling liquid composition is heated to 50 DEG C and sprayed at a pressure of 0.2 MPa for 3 minutes each. The PCB substrate was taken out, washed with water, neutralized with 5% sulfuric acid, washed with water and dried. Then, it was observed whether there was DFR residue on the surface of the circuit which was not peeled off with an Olympus metal microscope. , And when there was an exfoliated DFR residue, it was evaluated as 'X'.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a comparison of photographs of a PCB substrate before peeling liquid treatment and a PCB substrate treated with a peeling liquid of Example 12 and Comparative Example 11, respectively, at 50 times magnification with a metal microscope from Olympus Corp. In the PCB substrate treated with the release solution of Comparative Example 11, the DFR residue remained partially in the microcircuit, whereas the PCB substrate treated with the release solution of Example 12 clearly showed that the microcircuit was cleanly removed without DFR residue .

2) copper (Cu) corrosion test

The CCL (Copper Clad Laminate) substrate for the sample was treated for 15 minutes in the same manner as the peeling force test. After measuring the weight change before and after the peeling solution treatment, the CCL etching amount (μm) and the CCL etching The evaluation was made by calculating the ratio (占 퐉 / min), and when no weight change was observed, it was evaluated as?, When? 0.2 占 퐉 / min? At this time, the calculation method of the CCL etching amount (占 퐉) and the CCL etching rate (占 퐉 / min) is as follows.

(1) CCL etching amount (μm) = [CCL weight before peeling liquid treatment (g) - CCL weight (g) after peeling liquid treatment] / 8.92 (copper specific gravity) × CCL width (cm) × CCL length ] × 10,000

② CCL etching rate (㎛ / min) = CCL etching amount (㎛) / chemical processing time (min)

2 is a micrograph (magnification: 10,000 times) taken by a scanning electron microscope of a CCL substrate before the peeling liquid treatment and a CCL substrate treated with the peeling liquid of Comparative Example 11 and Example 12, respectively. It can be seen that the CCL substrate treated with the exfoliation solution of Example 12 hardly suffered Cu corrosion compared to the CCL substrate treated with the exfoliation solution of Comparative Example 11. [

3) Peeling piece  Size test

After peeling off the DFR peeled piece from the PCB substrate, the size of the peeled piece was observed with the naked eye. When the size of the peeling piece was larger than that of Comparative Example 1, Quot ;, and when it is smaller than that of Comparative Example 1, it was evaluated as 'x'.

3 is a photograph of a DFR peeled piece recovered using the peeling solution of Comparative Example 1, Comparative Example 19, and Example 12 in comparison. It was confirmed that the DFR peeled-off piece was much easier to recover the peeling-off piece than the comparative example 1 and the comparative example 19 when the peeling solution of Example 12 was used.

Example Peel force Copper (Cu) corrosion Peel Size One ○ ○ ○ 2 ○ ○ ○ 3 ○ ○ ○ 4 ○ ○ ○ 5 ○ ○ ○ 6 ○ ○ ○ 7 ○ ○ ○ 8 ○ ○ ○ 9 ○ ○ ○ 10 ○ ○ ○ 11 ○ ○ ○ 12 ○ ○ ○ 13 ○ ○ ○ 14 ○ ○ ○ 15 ○ ○ ○ 16 ○ ○ ○ 17 ○ ○ ○ 18 ○ ○ ○ 19 ○ ○ ○ 20 ○ ○ ○

Comparative Example Peel force Copper (Cu) corrosion Peel Size One × ○ △ 2 × ○ ○ 3 × × △ 4 × × × 5 × × ○ 6 × ○ △ 7 × ○ ○ 8 × × × 9 ○ ○ × 10 × × △ 11 × × × 12 ○ ○ × 13 × ○ △ 14 × × ○ 15 × ○ ○ 16 × ○ △ 17 × ○ ○ 18 × × △ 19 ○ ○ × 20 × × △

Claims (6)

1 to 10% by weight of at least one amine compound selected from triethanolamine, benzylamine, monoethanolamine, dimethylethanolamine and ethylenediamine;
0.5 to 3% by weight of at least one alkali compound selected from sodium hydroxide, tetramethylammonium hydroxide, potassium hydroxide, magnesium hydroxide and 2-hydroxyethyltrimethylammonium hydroxide;
0.01 to 0.1% by weight of at least one azole compound selected from benzotriazole, 5-methylbenzotriazole, tolyltriazole, pyrazole, tetrazole and imidazole;
1 to 5% by weight of at least one solvent selected from the group consisting of ethylene glycol phenyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, benzyl alcohol, diethylene glycol monobenzyl ether and ethylene glycol monomethyl ether;
And 82-97 wt% water;
≪ / RTI >
The photoresist stripper composition according to claim 1, wherein the amine compound is monoethanolamine.
The photoresist stripper composition according to claim 1 or 2, wherein the alkaline compound is potassium hydroxide.
The photoresist stripper composition according to claim 1 or 2, wherein the azole compound is pyrazole.
The photoresist stripper composition according to claim 1 or 2, wherein the solvent is benzyl alcohol.
5% by weight of monoethanolamine, 1.5% by weight of potassium hydroxide, 0.05% by weight of pyrazole, 2.5% by weight of benzyl alcohol and 90.95% by weight of water.

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