KR20170095655A - Semiconductor device inspection apparatus, and device pressing tool - Google Patents

Abstract

The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting electric characteristics of an element, and to an element pressing tool used therefor. The element pressing tool of the present invention comprises: pickup heads (832, 842) for picking up an element (1) by vacuum pressure; pressing blocks (833, 843) being in surface-contact with an upper surface of the element (1) when the element (1) picked up by the pickup heads (832, 842) is pressed in a test socket (310), and pressing the element (1) toward the test socket (310); a thermoelectric module unit (710) including first and second heat exchange units (711, 712), and coupled to the pressing blocks (833, 843) to control a temperature of the pressing blocks (833, 843) through the first heat exchange unit (711); a first temperature sensing unit (731) installed on a surface which is in surface-contact with the upper surface of the element (1) to control the temperature of the pressing blocks (833, 843) so as to measure a temperature of the element (1); an auxiliary temperature control unit (720) coupled to the second heat exchange unit (712) of the thermoelectric module unit (710) to heat or cool the second heat exchange unit (712) in accordance with a temperature control condition of the pressing blocks (833, 843) through the first heat exchange unit (711); and a second temperature sensing unit (732) for measuring a temperature of the second heat exchange unit (712) to control the heating or cooling of the second heat exchange unit (712) by the auxiliary temperature control unit (720).

Description

[0001] The present invention relates to a semiconductor device inspecting apparatus and a device pressing tool,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting an electric characteristic of a element and an element pressing tool used therein.

A semiconductor device (hereinafter referred to as an "element") is subjected to various tests such as electrical characteristics, reliability test for heat and pressure by a semiconductor device inspection apparatus after completion of a packaging process.

Inspection of devices can be carried out at room temperature tests conducted at room temperature depending on kinds of devices such as memory devices, non-memory devices such as CPU (Central Processing Unit), GPU (Graphic Processing Unit), LED devices and solar devices, There are various tests such as the heating test performed.

Meanwhile, as the types of IT devices such as smart phones, smart pads, smart TVs, and the like are becoming popular, demand for non-memory devices such as CPUs, that is, LSIs (Large Scale Integration) is rapidly increasing.

In addition, the LSI is being inspected whether or not it operates smoothly in a harsh environment, that is, a high temperature environment or a low temperature environment.

In order to carry out such device inspection, various device inspection devices have been proposed in accordance with the type of devices and inspection contents.

However, due to the thinness, miniaturization, nano fabrication process, etc. of devices such as LSI, test temperature conditions also need to be precisely set.

(Patent Document 1) KR10-1169406 B

(Patent Document 2) KR10-2012-0004068 A

(Patent Document 3) KR10-1177746 B

(Patent Document 4) KR10-1216359 B

(Patent Document 5) KR10-2013-0099781 A

(Patent Document 6) 10-1417773 B

It is an object of the present invention to provide an element inspection apparatus and an element pressing tool used therein, which can recognize a problem and necessity of the above-described prior art and can form an accurate test temperature condition.

The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a loading unit 100 in which a plurality of devices 1 are loaded; A test unit 300 having a plurality of test sockets 310 for testing the device 1 transferred from the loading unit 100; An unloading unit (500) for classifying the tested device (1) in the test unit (300) according to a test result; A loading position having one or more element pressing tools 831 and 841 for picking up the element 1 by vacuum pressure to receive the element 1 directly or indirectly from the loading part 100, And a controller for controlling the test unit 300 so that the tested device 1 is directly or indirectly connected to the unloading unit 500 by the device 1 , And the element pressing tools 831 and 841 are arranged so that the pick-up head picks up the element 1 by the vacuum pressure, (832, 842); When the element 1 picked up by the pick-up heads 832 and 842 is in surface contact with the upper surface of the element 1 when the element 1 picked up by the pick-up head 832 and 842 is pressed in the test socket 310, A pressing block 833, 843 for pressing against the pressing block 833; The first heat exchanging part 711 and the second heat exchanging part 712 are connected to the press blocks 833 and 843 and the temperature of the press blocks 833 and 843 is regulated by the first heat exchanging part 711 A thermoelectric module 710 for controlling the thermoelectric module 710; A first temperature sensing unit 731 installed on a surface contacting the upper surface of the device 1 to control the temperature of the pressure blocks 833 and 843 and measuring the temperature of the device 1; The second heat exchanging part 712 is coupled to the second heat exchanging part 712 of the thermoelectric module part 710 and is connected to the second heat exchanging part 712 in accordance with the temperature control conditions of the pressing blocks 833 and 843 through the first heat exchanging part 711. [ An auxiliary temperature control unit 720 which heats or cools the refrigerant; And a second temperature sensing unit 732 for measuring the temperature of the second heat exchanging unit 712 to control the heating or cooling of the second heat exchanging unit 712 by the auxiliary temperature control unit 720 And a device inspection apparatus is provided.

The element pressing portions 830 and 840 include at least one of the element pressing tools 831 and 841; Supporting portions 832 and 842 to which the element pressing tools 831 and 841 are detachably coupled; And a tool moving portion that sequentially moves the support portions 832 and 842 to the loading position, the pressing position, and the unloading position.

The pick-up heads 832 and 842 are arranged such that when the element 1 picked up by the pick-up heads 832 and 842 is pressed in the test socket 310, Or may be inserted inside the pressing blocks 833 and 843. The pressing surfaces 833 and 843 may be inserted into the pressing surfaces 833 and 843, respectively.

The pressing blocks 833 and 843 are formed with guide portions 834 and 744 which are protruded downward corresponding to the edges of the rectangular element 1 and whose inner surfaces are inclined toward the edge of the element 1 .

The auxiliary temperature control unit 720 includes a heat sink 721 coupled to the second heat exchange unit 712; A gas spraying unit 781 for receiving a heat exchange gas from the heat exchange gas supply unit 723 and spraying the heat exchange gas to the heat sink 721; In order to control the heating or cooling of the second heat exchanging part 712 by the auxiliary temperature control part 720, depending on the temperature of the second heat exchanging part 712 measured by the second temperature sensing part 732, And a flow rate control unit 724 for controlling the flow rate of the heat exchange gas by the gas injection unit 781.

The loading unit 100 is loaded with one or more trays 2 loaded with a plurality of devices 1 and is transferred from a tray 2 of the loading unit 100 to a device 3 through a loading / The test unit 300 receives the devices 3 from the loading buffer unit 200 and performs a test. The test unit 300 receives the devices 3 from the loading buffer unit 200, An unloading buffer unit 400 installed at a position opposite to the loading buffer unit 200 and receiving the tested devices 1 by the test unit 300 is installed, The controller 500 can sort the devices 1 loaded in the unloading buffer unit 400 according to the test result of the test unit 300 through the unloading and transferring tool 820 and load them.

The device testing apparatus and the device pressurizing tool used therefor according to the embodiment of the present invention may be configured such that the device is heated to the test temperature by heating or cooling the press block through the first heat exchanger coupled to the press block that presses the element on the test socket An auxiliary temperature control unit for controlling the heating or cooling of the first heat exchanging unit through the second heat exchanging unit of the thermoelectric module and a temperature sensing unit for measuring the temperature of the second heat exchanging unit, By controlling the auxiliary temperature control unit based on the measured temperature of the second heat exchanger unit, the heating and cooling control of the heating block is precise and the test temperature environment of a more accurate temperature range is provided, thereby improving the reliability of the inspection of the device.

1 is a plan view schematically showing an element inspection apparatus according to an embodiment of the present invention.
2 is a plan view schematically showing an example of a plate member of the loading buffer unit and the unloading buffer unit in the device testing apparatus of FIG.
3 is a cross-sectional view schematically showing the first shuttle portion and the second shuttle portion in the device testing apparatus of FIG.
4A and 4B are schematic views showing a process in which, in the device testing apparatus of FIG. 1, a pair of element pressing tools are alternately moved to a pressing position.
FIGS. 5A and 5B are cross-sectional views showing the configuration of the element pressing tool of FIG. 1, respectively, wherein FIG. 5A is a device pickup state and FIG. 5B is a device pressing state.
Fig. 6 is a block diagram showing temperature control of the element pressing portion of Fig. 5A. Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an element inspection apparatus and an element inspection apparatus used therein according to an embodiment of the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, an apparatus for inspecting an element according to an embodiment of the present invention includes a loading unit 100 to which a plurality of elements 1 are loaded; A testing unit 300 for testing the elements 1 transferred from the loading unit 100; And an unloading unit 500 for sorting and loading the devices 1 according to a test result of the test unit 300. [

The device 1 to be tested can be a memory semiconductor, a non-memory device such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and a system LSI (Large Scale Integration). The element 1 may be a non-memory element, in particular, an element in which ball-shaped connecting terminals are formed on the bottom surface.

The method of transferring the elements 1 between the loading unit 100, the test unit 300, and the unloading unit 500 can be performed by various methods.

The loading unit 100 and the unloading unit 500 are configured such that one or more trays 2 loaded with a plurality of elements 1 are stacked, and various configurations are possible according to the design.

The loading unit 100 and the unloading unit 500 may be provided with a tray loading unit (not shown) on which a plurality of trays 2 can be loaded.

For example, in the loading section 100, a plurality of trays 2 are appropriately disposed so that the elements 1 can be continuously picked up and transported.

Then, the tray 2 from which the elements 1 are emptied can be replaced with the tray 2 filled with the elements 1. For example, a certain batch of trays 2 can be loaded into the tray loading section automatically or manually.

The empty tray 2 after the elements 1 are drawn out from the loading part 100 can be transferred to the unloading part 500 by a tray transfer part (not shown).

The tray 2 may be mounted on a tray reversing portion (not shown) so that the empty tray 2 can be removed from the tray 2 before the unloading portion 500 is transported to the unloading portion 500. [ (Inverted) at a predetermined position.

Meanwhile, the unloading unit 500 may be configured similar to the loading unit 100. For example, in the unloading portion 500, a plurality of empty trays 2 may be appropriately disposed according to the sorting class so that the elements 1 can be sorted and stacked in succession according to the test result .

In the unloading section 500, the tray 2 filled with the tested elements 1 can be replaced with the empty tray 2.

A tray buffer unit (not shown) in which the empty tray 2 is temporarily loaded is additionally provided between the loading unit 100 and the unloading unit 500 so that the empty tray 2 can be temporarily loaded. As shown in FIG.

In the tray 2, a plurality of receiving grooves 2a may be formed so that the plurality of elements 1 can be loaded. For example, the plurality of receiving grooves 2a may be formed on the tray 2 in a matrix of 8x16 or the like.

A loading part 100 (100) is provided between the loading part 100 and the test part 300 so that the speed at which the device 1 is transferred can be increased, and / or the plurality of devices 1 can be sufficiently preheated. A loading buffer unit 200 may be installed in which the elements 1 transferred from the tray 2 of the apparatus 1 are temporarily loaded.

Between the test unit 300 and the unloading unit 500, the devices 1 that have been tested by the test unit 300 are temporarily placed between the test unit 300 and the unloading unit 500 so that the speed at which the device 1 is transferred can be increased. An unloading buffer unit 400 may be provided.

The unloading buffer unit 400 may be installed at a position facing the loading buffer unit 200 with the test unit 300 as a center.

Therefore, the device 1 to be tested can be transferred from the loading unit 100 to be temporarily loaded in the loading buffer unit 200 and then transferred to the testing unit 300, 1 may be transferred from the test unit 300, temporarily loaded in the unloading buffer unit 400, and then transferred to the unloading unit 500.

Particularly, in the loading buffer unit 200 and the unloading buffer unit 500, a relatively large number of the elements 1 are stacked in the tray 2 as compared with the tray 2 in which a relatively small number of the elements 1 are loaded. .

As shown in FIGS. 2 and 3, the loading buffer unit 200 and the unloading buffer unit 400 may include a plurality of loading grooves 211, 411 may be formed on the plate member 210, 410.

The plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may have substantially the same structure. However, if it is necessary to heat (preheat) the element 1 in order to test the element 1, a heating means such as a heater may be added to the plate member 210 of the loading buffer unit 200.

The loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 are aligned with the intervals of the test sockets 310 of the test unit 300 Or may be arranged to match the spacing of the receiving grooves 2a of the tray 2.

The interval between the receiving grooves 2a of the tray 2 and the spacing of the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 The intervals of the test sockets 310 of the test portion 300 may be formed to be n times, for example, twice as long as the distance between the receiving grooves 2a of the tray 2.

The plate members 210 and 410 may be installed in a fixed state inside the device testing apparatus or may be installed movably in the device testing apparatus 300 as a configuration for temporarily exchanging devices with the test unit 300 by temporarily loading the devices 1. [ And so on.

As shown in FIG. 1, the test unit 300 is for testing the device 1 transferred from the loading buffer unit 200, and may have various configurations according to the type of test. The test unit 300 is provided with a plurality of test sockets 310 to which the device 1 is pressed.

For example, the plurality of test sockets 310 are provided with terminals connected to the terminals of the element 1 and connected to the test board. Through the process of pressing the element 1 to the terminals, Whether or not the device 1 is operating can be performed.

The test sockets 310 may be arranged in various matrices such as 8x2, 8x4, and so on.

The test socket 310 can be configured in various ways as a configuration for connection between the element 1 and the terminal for testing the element 1. Such a test socket 310 can be installed to be replaceable depending on the type of device, test type, and the like.

Meanwhile, the test unit 300 may be an independent configuration in which the test socket 310 and the remaining components are modularized, and may be implemented as a PCB board having a test socket 310 as a simple structure.

Particularly, when the test unit 300 is implemented as a PCB board on which the test socket 310 is mounted, the test socket 300 is characterized for each test so that the configuration cost of the test unit 300, which is relatively expensive, can do.

Meanwhile, in the test unit 300, various tests can be performed. More preferably, the test unit 300 can be configured to be capable of testing the device 1 under test temperatures such as high temperature and low temperature.

In the test related to the temperature such as the high temperature test, the test unit 300 may be provided with a chamber member surrounding the area including the test socket 310 to minimize the temperature change.

The device exchange between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400 is not directly performed, And shuttle units 610 and 620 for transferring the device 1 from the test unit 300 to the test unit 300 and transferring the device 1 from the test unit 300 to the unloading buffer unit 400.

The shuttle units 610 and 620 may be configured to exchange elements between the test unit 300 and the loading buffer unit 200 or to exchange elements between the test unit 300 and the unloading buffer unit 400. [ This is possible.

For example, as shown in FIGS. 1 and 3, the shuttle units 610 and 620 include a first element transfer position for receiving the element 1 from the loading unit 100, a test unit 300, A first shuttle part 610 which is moved between a device exchange position for exchanging the device 1 and a second device transfer position for transferring the device 1 to the unloading part 500, A first element transfer position for transferring the element 1 from the test section 300 to the device 1, a device exchange position for exchanging the element 1 with the test section 300 and a second element transfer position for transferring the element 1 to the unloading section 500, And a second shuttle portion 620 which is moved between the element transfer positions.

Here, the first element transfer position, the element exchange position, and the second element transfer position may be variously arranged according to the configuration of the apparatus, and may be arranged in a straight line.

The first shuttle 610 and the second shuttle 620 may be disposed on both sides of the test socket 310 with the test socket 310 of the test unit 300 interposed therebetween.

The first shuttle part 610 and the second shuttle part 620 include guide rails 611 and 621 disposed opposite to each other with the test part 300 as a center and guide rails 611 and 621 along the guide rails 611 and 621 A first device transfer position for receiving a device from the loading buffer unit 200, a device exchange position with the test unit 300, a second device transfer position for transferring the device to the unloading buffer unit 400, One or more shuttle plates 612 and 622 to which the elements 1 are to be loaded and a shuttle plate 612 and 622 to which the shuttle plates 612 and 622 are detachably coupled and which are adapted to move along the guide rails 611 and 621, And may include fixing portions 613 and 623.

The guide rails 611 and 621 are configured to guide movement of the shuttle plates 612 and 622, and various configurations are possible.

In order to exchange elements between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400, the shuttle plates 612, At least one element seating groove is formed.

The plate fixing portions 613 and 623 are provided for the purpose of replacing the shuttle plates 612 and 622 and may have various configurations and may include a heater for heating the element 1. [

The shuttle plates 612 and 622 are detachably mounted on the plate fixing portions 613 and 623 so that when the type of the element 1 to be inspected and particularly the size of the element 1 is changed, The shuttle plates 612 and 622 can be replaced.

The plate fixing portions 613 and 623 may be provided with plate detachable portions 614 and 624 for detachably fixing the shuttle plates 612 and 622 to the plate fixing portions 613 and 623.

The plate detachable parts 614 and 624 can be variously configured as detachable attachment / detachment of the shuttle plates 612 and 622 from the plate fixing parts 613 and 623, As shown in Fig.

One or more loading and unloading tools (not shown) for moving the loading unit 100 from the loading unit 100 to the shuttle units 610 and 620 while being moved between the loading unit 100 and the shuttle units 610 and 620, 810, and 814 may be installed.

In this case, the one loading / unloading tool 810 and 814 move between the loading unit 100 and the shuttle units 610 and 620 to pick up the devices 1 from the loading unit 100 and move the shuttle unit 610 , 620).

As described above, when the loading buffer unit 200 is installed, the loading and transporting tools 810 and 814 pick up the element 1 from the loading unit 100 and transfer the element 1 to the loading buffer unit 200 A first loading transfer tool 810 and a second loading transfer tool 814 for picking up the element 1 from the loading buffer section 200 and transferring it to the shuttle sections 610 and 620.

In addition, one or more unloading traps (610, 620) may be used to pick up the device (1) from the shuttle parts (610, 620) and transfer it to the unloading part (500) while being moved between the shuttle parts (610, 620) Tools 820 and 824 may be installed.

In this case, the one unloading / conveying tool 820, 824 moves between the shuttle portions 610, 620 and the unloading portion 500 and picks up the element 1 from the shuttle portions 610, 620 To the unloading unit (500).

When the unloading buffer unit 400 is installed as described above, the unloading and transporting tools 820 and 824 pick up the element 1 from the unloading buffer unit 400, And a second unloading / transporting tool 824 for picking up the element 1 from the shuttle units 610 and 620 and transferring it to the unloading buffer unit 400. The first unloading / .

The loading transfer tool 810, 814 and the unloading transfer tool 820, 824 may be configured to be identical or similar to each other.

The loading and conveying tools 810 and 814 and the unloading and conveying tools 820 and 824 are provided with a plurality of pickers for picking up the element 1 and a plurality of pickers for picking up the elements 1 in a vertical direction And a driving device for driving movement of the plurality of pickers in the horizontal direction (XY direction) or the like.

The picker includes a suction pad for picking up the element 1 and feeding it to a predetermined position, which can have various constructions, and which forms a vacuum pressure on the upper surface of the element 1, and a pneumatic cylinder ≪ / RTI >

The pickers are spaced from the receiving grooves 2a of the loading unit 100 and the tray 2 of the unloading unit 500 and between the loading buffer unit 200 and the plate member 210 of the unloading buffer unit 400 And 410 can be adjusted in consideration of the case where the spacing between the stacking grooves 211 and 411 is different from each other. However, in order to allow a greater number of semiconductor devices 10 to be transported, The vertical spacing can be fixed.

The driving device for moving the plurality of pickers may have various configurations according to the driving mode of the pickers, and may include a vertical moving device for moving the pickers up and down and a left and right moving device for moving in the lateral direction .

The up-and-down moving device may be configured to move the entire pickers up and down at a time, or may be separately connected to each of the pickers so that the respective pickers are independently moved up and down.

The left and right moving devices can be configured in various ways according to the moving mode of the pickers, and can be configured to move in a single direction in the X direction or the Y direction, or move in the X-Y direction.

Meanwhile, while moving between the test unit 300 and the shuttle units 610 and 620, the device 1 is picked up from the shuttle units 610 and 620 and pressed into the test socket 310, The pressing portions 830 and 840 may be provided to transmit the pressed and tested devices to the shuttle portions 610 and 620.

The element pressing portions 830 and 840 are configured to transfer the element 1 between the test portion 300 and the first shuttle portion 610 and between the test portion 300 and the second shuttle portion 620 Various configurations are possible according to the transporting mode of the element 1. [

The element pressing portions 830 and 840 move from the first shuttle portion 610 to the first shuttle portion 610 while moving between the first shuttle portion 610 and the test portion 300 as shown in FIGS. A first element for pressing the test socket 310 and pressing the test socket 310 to transfer the tested element to the first shuttle 610 and the second shuttle 610, The device 1 is picked up at the second shuttle 620 and pressed against the test socket 310 while being moved between the first and second shuttle units 620 and 620 and the test unit 300, And the second element for transferring it to the shuttle 620 may include a pressing portion 840.

In this way, when the element pressing portions 830 and 840 are formed as a pair, the pressing portions 830 and 840 can be moved in association with each other for the sake of element exchange convenience.

The element pressing portions 830 and 840 are provided with one or more element pressing tools 831 and 841 for picking up the element 1 by the vacuum pressure to directly or indirectly move the element 1 from the loading portion 100 The unloading unit 500 is provided with a loading position for receiving the test signal S 1 from the testing unit 300, a pressing position for performing the test while the device 1 is pressed against the test socket 310, And the unloading position for transferring the element 1 directly or indirectly to the unloading position sequentially. In addition to the embodiment of Figs. 4A and 4B, various configurations are possible.

By way of example, the element pressing portions 830 and 840 may include one or more element pressing tools 831 and 841; Supporting portions 832 and 842 to which the element pressing tools 831 and 841 are detachably coupled; A tool moving portion that sequentially moves the supporting portions 832 and 842 to the loading position, the pressing position, and the unloading position.

The supporting portions 832 and 842 are formed on the support structure of the element pressing tools 831 and 841 so as to have a structure in which one or more element pressing tools 831 and 841 are detachably coupled to support the element pressing tools 831 and 841 Thus, various configurations are possible.

For example, the support portions 832 and 842 may include a body 832a and 842a coupled to a moving structure (not shown) to allow a tool to be described later to move, And the buffering members 832b and 842b to which the element pressing tools 831 and 841 are detachably coupled.

The main bodies 832a and 842a are configured to be coupled to a moving structure (not shown) so that the tool can be moved by the moving part.

The buffer members 832b and 842b can be variously configured as a structure in which one or more element pressing tools 831 and 841 are detachably coupled to the main bodies 832a and 842a.

Particularly, the buffer members 832b and 842b can be detachably coupled with the element pressing tools 831 and 841, the vacuum pressure transmission to the element pressing tools 831 and 841, the sensors provided to the element pressing tools 831 and 841, For example, power supply and signal transmission / reception of signals.

The subassemblies provided in the buffer members 832b and 842b can be automatically combined with or connected to at least a part of the subassemblies provided in the element pressing tools 831 and 841 upon detachment of the element pressing tools 831 and 841 have.

The tool moving part sequentially moves the loading position, the pressing position and the unloading position of the element pressing tools 831 and 841 coupled to the supporting parts 832 and 842, that is, the supporting parts 832 and 842, Various configurations are possible depending on the structure.

Various embodiments are presented in the prior art documents presented in the background art, and detailed description will be omitted.

The element pressing tools 831 and 841 can be variously configured as a configuration for picking up the element 1 by a vacuum pressure.

Particularly, the element pressing tools 831 and 841 are provided with a pick-up head (not shown) for picking up the element 1 by the vacuum pressure so as to have a function of heating and cooling the element 1 at the time of element pick- 832 and 842; When the element 1 picked up by the pickup heads 832 and 842 is brought into surface contact with the upper surface of the element 1 and pressed against the test socket 310 when the element 1 picked up by the pickup head 832 and 842 is pressed in the test socket 310, Blocks 833 and 843; A thermoelectric conversion unit 730 having a first heat exchanging unit 711 and a second heat exchanging unit 712 and coupled to the pressurizing blocks 833 and 843 to control the temperature of the pressurizing blocks 833 and 843 through the first heat exchanging unit 711, A module unit 710; A first temperature sensing unit 731 installed on a surface contacting the upper surface of the element 1 to control the temperature of the pressure blocks 833 and 843 and measuring the temperature of the element 1; The second heat exchanging part 712 is coupled to the second heat exchanging part 712 of the thermoelectric module part 710 to heat the second heat exchanging part 712 according to the temperature control conditions of the pressure blocks 833 and 843 through the first heat exchanging part 711 An auxiliary temperature control unit 720 for cooling; And a second temperature sensing unit 732 for measuring the temperature of the second heat exchanging unit 712 in order to control heating or cooling of the second heat exchanging unit 712 by the auxiliary temperature control unit 720.

The pick-up heads 832 and 842 are configured to pick up the element 1 by the vacuum pressure through the vacuum pressure forming flow path 741 formed inside the press blocks 833 and 843 1), and so on.

On the other hand, the pick-up heads 832 and 842 protrude from the bottom surfaces of the pressing blocks 833 and 843 at the time of picking up the element 1 and the pressing blocks 833 and 843 are pressed against the upper surface of the element 1, It is preferable to be constructed so as to be located inward of the pressing blocks 833 and 843 so as to be in contact with each other.

For example, the pickup heads 832 and 842 may be formed so that at least a part such as an end portion is elastically deformable, or an elastic member (not shown) is provided on the upper side so that the pickup block 833, 843 and may be located inside the press blocks 833, 843 such that the press blocks 833, 843 are in surface contact with the upper surface of the element 1 when the element is pressurized.

The pressing blocks 833 and 843 are in contact with the upper surface of the element 1 when the element 1 picked up by the pick-up heads 832 and 842 is pressed by the test socket 310, Various configurations are possible depending on the pressing structure and the like of the element 1 as a constitution for pressing against the test socket 310. [

That is, the pick-up heads 832 and 842 are arranged such that when the element 1 picked up by the pick-up heads 832 and 842 is pressed in the test socket 310, And is configured to be inserted into the pressing blocks 833 and 843 in the same manner as the pressing surface in surface contact with the upper surface.

Particularly, the pressing blocks 833 and 843 are provided with guide portions 834 and 844 which are downwardly protruded in correspondence with the edges of the rectangular element 1 and are inclined such that the inner side faces the edge of the element 1 .

The guide portions 834 and 844 are formed in such a manner that the guide portions 834 and 844 protrude downward and correspond to the edges of the rectangular element 1 and the inner side faces the edge of the element 1, 1 are positioned at the correct positions on the bottom surfaces of the pressing blocks 833, 843.

On the other hand, the pressing blocks 833 and 843 are characterized in that the element 1 is heated or cooled by a thermoelectric module part 710 which will be described later in a state of surface contact with the upper surface of the element 1. [

The bottom surface of the pressing blocks 833 and 843, that is, the pressing surface is formed so as to make surface contact with the upper surface of the element 1.

The pressure blocks 833 and 843 are used to control the temperature of the pressure blocks 833 and 843 by measuring the temperature of the element 1 so that a test can be performed on the element 1 under a preset test temperature A first temperature sensing unit 731 may be provided on a surface of the element 1 to be in surface contact with the upper surface thereof to measure the temperature of the element 1. [

The first temperature sensing portion 731 is provided on a surface contacting the upper surface of the element 1 to measure the temperature of the element 1. The first temperature sensing portion 731 may include a temperature-measuring resistor such as PT100, This is possible.

Here, the first temperature sensing unit 731 may indirectly measure the temperature of the element 1 by measuring the temperature of the pressurizing blocks 833 and 843 using an equation or the like calculated in advance through an experiment or the like Of course.

The temperature of the element 1 measured by the first temperature sensing unit 731 is referred to as a control unit (not shown), and the thermoelectric module unit 710, which will be described later, May be controlled by a PWM (Pulse Width Modulation) method or the like.

The thermoelectric module part 710 is characterized in that it has a first heat exchanging part 711 and a second heat exchanging part 712 as a structure for heating or cooling by a plurality of thermoelectric elements (Peltier devices).

The first heat exchanger 711 is coupled to the pressure blocks 833 and 843 to control the temperature of the pressure blocks 833 and 843. [

Here, the first heat exchanging part 711 may have a structure optimized to smoothly perform heat exchange with the pressurizing blocks 833 and 843.

The second heat exchanging part 712 is configured to transfer heat to or receive heat from the first heat exchanging part 711 in accordance with the voltage applied to the plurality of thermoelectric elements and to facilitate heat exchange with the auxiliary temperature control part 720 And can be configured with an optimized structure.

The auxiliary temperature control unit 720 is coupled to the second heat exchanging unit 712 of the thermoelectric module unit 710 and is connected to the first heat exchanging unit 711 through the first heat exchanging unit 711, Various configurations are possible depending on the heat exchange type such as water-cooling type, air-cooling type, heat sink, etc., as a configuration for heating or cooling the two heat exchange portions 712.

For example, the auxiliary temperature control unit 720 includes a heat sink 721 coupled to the second heat exchange unit 712, as shown in FIGS. 5A and 5B and FIG. 6; A gas spraying portion 781 for spraying the heat exchange gas from the heat exchange gas supply device 723 to the heat sink 721; In order to control the heating or cooling of the second heat exchanging part 712 by the auxiliary temperature control part 720, the temperature of the gas discharging part 712 is controlled in accordance with the temperature of the second heat exchanging part 712 measured by the second temperature sensing part 732 781 for controlling the flow rate of the heat exchange gas.

The heat sink 721 is connected to the second heat exchanging part 712 and is configured to be heat-exchanged with the second heat exchanging part 712. The heat sink 721 is connected to the heat exchanging part for performing heat exchange with the second heat exchanging part 712, And a heat transfer portion that receives heat or receives heat by heat exchange gas injected by the gas injection portion 781,

The gas injecting section 781 can be configured in various ways as a configuration for supplying the heat exchange gas from the heat exchange gas supply device 723 and injecting the heat exchange gas to the heat sink 721.

Here, the heat exchange gas supply device 723 may be configured in various configurations as a structure for supplying heat exchange gas such as air, nitrogen, helium, etc., and may be compressed air, more specifically CDA (Clean Dyr Air) can be used.

Particularly, the heat exchange gas supply device 723 can supply the cooled CDA so that the heat sink 721 cools the second heat exchange portion 712.

The gas spraying unit 781 can have various configurations according to a heat exchange method with the heat sink 721. [

For example, when the heat transfer portion of the heat sink 721 is constituted by a plurality of fins, the gas injecting portion 781 may heat the heat exchange gas supplied from the heat exchange gas supply device 723 to a plurality of fins As shown in FIG.

The flow rate controller 724 controls the flow rate of the refrigerant to be supplied to the second heat exchanger 732 measured by the second temperature sensor 732 to control the heating or cooling of the second heat exchanger 712 by the auxiliary temperature controller 720. [ Various configurations are possible as a configuration for controlling the flow rate of the heat exchange gas by the gas jetting section 781 in accordance with the temperature of the heat exchanger 712.

The flow rate control unit 724 controls the flow rate of the heat exchange gas, for example, the flow rate of the air, by using various methods such as PID control using the temperature of the second heat exchanging unit 712 measured by the second temperature sensing unit 732 as an input value. (lpm, liter per minute) and so on.

The flow control unit 724 may be a proportional directional control valve or the like controlled by a control unit as a physical configuration.

Meanwhile, the second temperature sensing unit 732 may be configured to measure the temperature of the second heat exchanging unit 712 in order to control the heating or cooling of the second heat exchanging unit 712 by the auxiliary temperature control unit 720, Configuration is possible.

In particular, the second temperature sensing unit 732 may be disposed in contact with the second heat exchanging unit 712 to measure the temperature of the second heat exchanging unit 712.

The second temperature sensing unit 732 may include a temperature-measuring resistor such as the PT100 as in the first temperature sensing unit 731 described above.

Meanwhile, the auxiliary temperature control unit 720 may have a unidirectional structure such as injection of a heat exchange gas from the heat exchange gas supply unit 723 to the heat sink 721, heat exchange between the heat exchange gas supply unit 723 and the heat sink 721, Gas circulation structure and so on.

The auxiliary temperature control unit 720 having the above-described configuration uses the temperature of the second heat exchanging unit 712 measured by the second temperature sensing unit 732 as an input value, By controlling the heating or cooling of the second heat exchanging part 712 by the auxiliary temperature control part 720 through the flow rate of the second heat exchanging part 712 such as lpm or liter per minute, Temperature range.

The auxiliary temperature control unit 720 prevents the second heat exchanging unit 712 from rising or cooling to an excessive temperature to protect the second heat exchanging unit 712 and the second temperature sensing unit 732 The second heat exchanging part 712 is maintained within a predetermined temperature range and consequently the heat exchange between the first heat exchanging part 711 and the second heat exchanging part 712 is stably performed, It can be stably maintained at a preset temperature, i.e., a test temperature.

Thus, by minimizing the error range of the test temperature for inspecting the element 1, the reliability of the test for the element 1 can be greatly improved.

Furthermore, it is possible to prevent breakage of the element 1, the thermoelectric element, and the like, which are the object of the test, by preventing the rapid temperature change by the abnormal operation.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

1: device 310: test socket
830, 840: element pressing portion 831, 841: element pressing tool
832, 842: Press block 710: Thermoelectric module part
720: auxiliary temperature control unit 731: first temperature sensing unit
741: second temperature sensing unit

Claims (6)

A loading unit (100) in which a plurality of elements (1) are loaded;
A test unit 300 having a plurality of test sockets 310 for testing the device 1 transferred from the loading unit 100;
An unloading unit (500) for classifying the tested device (1) in the test unit (300) according to a test result;
A loading position having one or more element pressing tools 831 and 841 for picking up the element 1 by vacuum pressure to receive the element 1 directly or indirectly from the loading part 100, And a controller for controlling the test unit 300 so that the tested device 1 is directly or indirectly connected to the unloading unit 500 by the device 1 (830, 840) that sequentially move the unloading position to transmit the unloading position,
The element pressing tools 831 and 841,
Pick-up heads 832 and 842 for picking up the element 1 by vacuum pressure;
When the element 1 picked up by the pick-up heads 832 and 842 is in surface contact with the upper surface of the element 1 when the element 1 picked up by the pick-up head 832 and 842 is pressed in the test socket 310, A pressing block 833, 843 for pressing against the pressing block 833;
The first heat exchanging part 711 and the second heat exchanging part 712 are connected to the press blocks 833 and 843 and the temperature of the press blocks 833 and 843 is regulated by the first heat exchanging part 711 A thermoelectric module 710 for controlling the thermoelectric module 710;
A first temperature sensing unit 731 installed on a surface contacting the upper surface of the device 1 to control the temperature of the pressure blocks 833 and 843 and measuring the temperature of the device 1;
The second heat exchanging part 712 is coupled to the second heat exchanging part 712 of the thermoelectric module part 710 and is connected to the second heat exchanging part 712 in accordance with the temperature control conditions of the pressing blocks 833 and 843 through the first heat exchanging part 711. [ An auxiliary temperature control unit 720 which heats or cools the refrigerant;
And a second temperature sensing unit 732 for measuring the temperature of the second heat exchanging unit 712 to control the heating or cooling of the second heat exchanging unit 712 by the auxiliary temperature control unit 720 Characterized by the device. The method according to claim 1,
The element pressing portions 830 and 840,
At least one of the element pressing tools 831 and 841;
Supporting portions 832 and 842 to which the element pressing tools 831 and 841 are detachably coupled;
And a tool moving unit that sequentially moves the support portions (832, 842) to the loading position, the pressing position, and the unloading position. The method according to claim 1,
The pick-up heads 832 and 842 are arranged such that when the element 1 picked up by the pick-up heads 832 and 842 is pressed in the test socket 310, Is inserted into the same or the inside of the pressing block (833, 843). The method according to claim 1,
The pressing blocks 833 and 843 are formed with guide parts 834 and 744 which are protruded downward corresponding to the edges of the rectangular element 1 and whose inclined inner surfaces face the edge of the element 1 And the device inspection apparatus. The method according to claim 1,
The auxiliary temperature control unit 720,
A heat sink 721 coupled to the second heat exchanger 712;
A gas spraying unit 781 for receiving a heat exchange gas from the heat exchange gas supply unit 723 and spraying the heat exchange gas to the heat sink 721;
In order to control the heating or cooling of the second heat exchanging part 712 by the auxiliary temperature control part 720, depending on the temperature of the second heat exchanging part 712 measured by the second temperature sensing part 732, And a flow rate control unit (724) for controlling the flow rate of the heat exchange gas by the gas injection unit (781). The method according to any one of claims 1 to 5,
The loading unit 100 is loaded with one or more trays 2 loaded with a plurality of devices 1,
A loading buffer unit 200 for receiving the elements 3 from the tray 2 of the loading unit 100 through the loading and transporting tool 810 and temporarily loading the elements is installed,
The test unit 300 receives the elements 3 from the loading buffer unit 200 and performs a test,
An unloading buffer unit 400 installed at a position opposite to the loading buffer unit 200 around the test unit 300 and receiving the tested devices 1 by the test unit 300 is installed And,
The unloading unit 500 classifies the devices 1 loaded in the unloading buffer unit 400 according to the test result of the test unit 300 through the unloading and transferring tool 820 Characterized by the device.

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