KR20170089015A - Electromagnetic wave shielding sheet, electromagnetic wave shielding wiring circuit board, and electronic device - Google Patents

Abstract

Provided is an electromagnetic wave shielding sheet excellent in bonding property with parts and capable of maintaining good transmission characteristics even when used in high frequency applications while ensuring shielding of electromagnetic waves and the like. The electromagnetic wave shielding sheet according to the present invention comprises an adhesive layer 1, a conductive layer 2 and an insulating layer 3 which are formed of a laminate that shields at least a part of a component and are bonded to the component 20 by a bonding treatment . The adhesive layer 1 contains at least one of (I) a thermoplastic resin (A), (II) a thermosetting resin (B) and a thermosetting resin (B) The adhesive layer 1 further contains an electrically conductive filler and exhibits anisotropic conductivity. The film after the binder component is subjected to thermocompression bonding satisfies the following (i) and (ii) at a frequency of 1 GHz and 23 캜. (i) the relative dielectric constant is in the range of 1 to 3, (ii) the dielectric loss tangent is 0.0001 to 0.02

Description

ELECTROMAGNETIC WAVE SHIELDING SHEET, ELECTROMAGNETIC WAVE SHIELDING WIRING CIRCUIT BOARD, AND ELECTRONIC DEVICE, ELECTROMAGNETIC WAVE SHIELDING SHEET,

The present invention relates to an electromagnetic wave shielding sheet suitable for use in connection with a part of a component that emits electromagnetic waves. Further, the present invention relates to an electromagnetic wave shielding wiring circuit substrate and an electronic apparatus using the above-mentioned electromagnetic wave shielding sheet.

A board such as a printed wiring board is incorporated in various electronic apparatuses including a mobile terminal, a PC, a server, and the like. These boards are provided with an electromagnetic wave shielding structure in order to prevent malfunction due to external magnetic fields or radio waves and to reduce unnecessary radiation in electrical signals (Patent Documents 1 and 2).

Patent Document 1 proposes a method of manufacturing a shielding film, a shielded printed circuit board and a shielding film having a good transmission characteristic by well shielding electromagnetic waves, magnetic waves and electromagnetic waves traveling from one surface side to the other surface side of the shielding film The following configuration is disclosed as a problem. That is, the present invention discloses a shielding film comprising a conductive layer having a layer thickness of 0.5 to 12 占 퐉 and an anisotropic conductive adhesive layer in a laminated state. Disclosed is a shielded printed wiring board in which a shielding film is laminated on a printed wiring board having a base member on which a printed circuit is formed and an insulating film covering the printed circuit and provided on the base member and serving as a coverlay film. On the other hand, in Patent Document 2, an electromagnetic wave shielding sheet having a laminated structure of an insulating adhesive layer, a conductive layer and an insulating layer is disclosed, and an insulating adhesive layer of the electromagnetic wave shielding sheet is directly provided instead of a coverlay film Is disclosed.

International Publication No. 2013/077108 Japanese Laid-Open Patent Publication No. 2014-090151

However, with the recent advances in high-speed data communication technology, the transmission speed of a signal has dramatically increased. In order to perform high-speed transmission, characteristic impedance matching of the transmission path becomes important. This is because, when the incident wave reflects and the signal wave is attenuated at the mismatch point between the output impedance of the sending circuit in the signal transmission path and the input impedance of the receiving circuit, the distortion is generated and the characteristics are degraded. The reflection phenomenon becomes particularly conspicuous when high-frequency or high-speed pulse signals are transmitted.

1 is a schematic cross-sectional view of a shielding wiring board on which an electromagnetic wave shielding sheet is stuck on a printed wiring board. A capacitor component is added between the wiring 25 of the printed wiring board 20 and the conductive layer 2 of the electromagnetic wave shielding sheet 10 as shown in this figure, Impedance changes. In addition, there is a problem that transmission characteristics are deteriorated. That is, there is a problem that the electromagnetic wave shielding sheet 10 has an influence on the electrical characteristics of the printed wiring board shielded. Particularly, in the case of a high-frequency signal, reflection of a signal occurs at an inconsistency point of impedance, and noise is liable to be generated, so that the problem of characteristic deterioration is serious.

If the transmission characteristic can be improved while securing the electromagnetic wave shielding property, higher performance can be expected. It is also possible to increase the design margin of the internal electronic circuit and the like. Improvement of transmission characteristics is important to maintain and improve performance characteristics in response to recent high-speed and high-frequency signals.

Although the above has been described with reference to the example of the printed wiring board, the same problem exists in the substrate having the wiring and the electronic circuit.

An object of the present invention is to provide an electromagnetic shielding sheet capable of maintaining excellent transmission characteristics even when used for parts for high frequency use while ensuring shielding of electromagnetic waves and the like, .

DISCLOSURE OF THE INVENTION In order to solve the above problems, the inventors of the present invention have conducted intensive studies and, as a result, have found that the problems of the present invention can be solved in the following embodiments, and have completed the present invention.

An electromagnetic wave shielding sheet according to the present invention is an electromagnetic wave shielding sheet composed of a laminate that shields at least part of a component that emits an electromagnetic wave, and the laminate has an adhesive layer which is disposed on the component, A conductive layer laminated on the adhesive layer, and an insulating layer formed on the conductive layer. The adhesive layer may contain, as a binder component,

(I) a thermoplastic resin (A), and

(II) a thermosetting resin (B) and a curing compound (C) to the thermosetting resin (B)

And at least one of them,

The adhesive layer further contains an electrically conductive filler to exhibit anisotropic conductivity,

The film (X) after thermocompression bonding of the binder component satisfies the following (i) and (ii).

(i) The relative dielectric constant is 1 to 3 at 23 deg. C at a frequency of 1 GHz.

(ii) dielectric tangent (dielectric tangent) is 0.0001 to 0.02 at 23 deg. C at a frequency of 1 GHz.

The electromagnetic wave shielding interconnection circuit substrate according to the present invention is obtained by bonding the electromagnetic interference shielding sheet of the above mode on a wiring circuit substrate.

An electronic apparatus according to the present invention is an electromagnetic shielding sheet of the above-described mode.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide an electromagnetic wave shielding sheet excellent in bonding property with components and capable of maintaining good transmission characteristics even when used in high frequency applications while securing shielding properties of electromagnetic waves and the like.

1 is a schematic cross-sectional view for explaining a capacitor component of a shielding wiring board according to a conventional example,
Fig. 2 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding sheet according to the present embodiment,
3 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding wiring circuit substrate according to the present embodiment,
4 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding wiring circuit substrate according to the first modification,
5 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding interconnection circuit substrate according to a second modification,
6 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding interconnection circuit substrate according to the third modification,
7 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding wiring circuit substrate according to a fourth modification,
8 is a schematic plan view of the main surface side of the printed wiring board according to the examples and the comparative example,
9 is a schematic plan view of the back surface side of the printed wiring board according to the embodiment and the comparative example,
10 is a schematic plan view of a printed wiring board provided with an electromagnetic wave shielding sheet according to Examples and Comparative Examples,
11 is a cross-sectional view taken along line XI-XI of Fig. 10,
12 is a cross-sectional view taken along line XII-XII of Fig.

Hereinafter, an example of an embodiment to which the present invention is applied will be described. The sizes and ratios of the respective members in the following drawings are for convenience of explanation and are not limited thereto. In this specification, the description of "arbitrary number A to arbitrary number B" includes the number A as the lower limit value and the number B as the upper limit value in the corresponding range. Note that the " sheet " in the present specification includes not only " sheet " defined in JIS but also " film ". In addition, specific numerical values in this specification are values obtained by the method disclosed in the embodiment or the embodiment.

The electromagnetic wave shielding sheet 10 according to the present invention is constituted by a laminate in which an adhesive layer 1, a conductive layer 2, and an insulating layer 3 are laminated at least in this order as shown in Fig. The electromagnetic wave shielding sheet 10 can be bonded with the adhesive layer 1 by placing the adhesive layer 1 on a component (not shown). It is preferable that the bonding treatment is possible, but heat treatment or thermocompression bonding treatment is suitable. The insulating layer 3 serves to protect the electromagnetic wave shielding sheet 10 and is disposed on the surface layer side with respect to the conductive layer 2. The conductive layer 2 is a layer sandwiched between the insulating layer 3 and the adhesive layer 1 and mainly plays a role of shielding electromagnetic waves. In the printed wiring board, it plays a role of shielding electronic noises generated in signal wiring or the like inside the parts or shielding signals from the outside.

The electromagnetic wave shielding sheet 10 may be further provided with another layer. For example, another layer such as abrasion resistance, water vapor barrier property, and oxygen barrier film may be formed on the surface layer of the insulating layer 3, or the adhesive layer 1 and the conductive layer 2 and / 2 and the insulating layer 3 may be laminated with a film for strengthening magnetic field interception.

The electromagnetic shielding sheet of the present invention is suitable for preventing radiation electromagnetic waves from components that emit electromagnetic waves (electric field waves and magnetic field waves) and preventing malfunction due to magnetic fields or radio waves from the outside. Examples of the component include a hard disk, a cable, a printed wiring board and the like incorporated in a personal computer, a mobile device, a digital camera, or the like. It is also suitable for card readers and the like. Hereinafter, each layer will be described in detail.

[Conductive Layer] The conductive layer 2 may be any layer that exhibits conductivity within the layer (layer) and is not particularly limited, but a layer containing a conductive filler in the metal layer and the binder resin may be exemplified. The conductive layer may be produced by a known method. The metal layer may be formed by vacuum deposition, sputtering, CVD, MO (organic organics), plating or the like, in addition to the method using a metal foil. Among them, vacuum deposition or plating is preferable considering mass productivity. A method for producing a layer containing a conductive filler in a binder resin can be obtained, for example, by coating and drying a resin composition containing an electrically conductive filler on an insulating film. The conductive layer 2 may be a single layer or a plurality of layers of the same or different kinds.

Suitable examples of the metal foil include aluminum, copper, silver and gold. Copper, silver and aluminum are more preferable in terms of shielding property, connection reliability and cost, and copper is even more preferable. Copper is preferably used, for example, a rolled copper foil or an electrolytic copper foil, and it is more preferable to use an electrolytic copper foil since the conductive layer can be made thinner. The metal foil may be formed by plating. The lower limit of the thickness of the metal foil is preferably 0.1 탆 or more, more preferably 0.5 탆 or more. On the other hand, the upper limit of the thickness of the metal foil is preferably 10 占 퐉 or less, more preferably 5 占 퐉 or less.

Suitable examples of the metal layer obtained by vacuum deposition include aluminum, copper, silver and gold. Of these, copper and silver are more preferable. As a preferable example of the metal layer obtained by sputtering, aluminum, copper, silver, chromium, gold, iron, palladium, nickel, platinum, silver, zinc, indium oxide and antimony- have. Of these, copper and silver are more preferable. The lower limit of the thickness of the metal layer obtained by the vacuum deposition and the sputtering is preferably 0.005 탆 or more, more preferably 0.1 탆 or more, and the upper limit is preferably 3 탆 or less.

[Insulating layer] The insulating layer is an insulating sheet formed by molding an insulating resin composition, and plays a role of protecting the conductive layer and securing the insulating property of the surface layer. The insulating resin composition is preferably a thermoplastic resin or a thermosetting resin. The thermoplastic resin and the thermosetting resin are not particularly limited, but resins exemplified in the adhesive layer described later can be suitably used. As the insulating layer, resin films such as polyester, polycarbonate, polyimide, and polyphenylene sulfide may be used.

As the insulating resin composition, a silane coupling agent, an antioxidant, a pigment, a dye, a tackifier resin, a plasticizer, an ultraviolet absorber, a defoamer, a leveling regulator, a filler and a flame retardant may be added in addition to the resin.

The thickness of the insulating layer may vary depending on the application, but is preferably 2 to 10 mu m. By making the thickness of the electromagnetic shielding sheet, it becomes easy to balance various physical properties of the electromagnetic shielding sheet.

[Adhesive layer] The adhesive layer (1)

(I) a thermoplastic resin (A), and

(II) a thermosetting resin (B) and a curing compound (C) to a thermosetting resin (B), wherein the mixture of (I) The coating film X after compression has satisfies (i) and (ii) below is used.

(i) The relative dielectric constant is 1 to 3 at 23 deg. C and a frequency of 1 GHz.

(ii) The dielectric loss tangent is 0.0001 to 0.02 at 23 deg. C and a frequency of 1 GHz.

In addition, the thermosetting resin (B) is intended to include the entirety of a resin containing at least a part which undergoes a curing reaction with the curing compound (C).

The dielectric constant and dielectric loss tangent of the present specification refer to values obtained by the following methods. That is, a mixture of (I), (II) or (I) and (II) is coated on the exfoliated polyester film and uniformly coated to a thickness of 70 μm after drying to obtain a coated film. The obtained coating films were laminated, vacuum laminated and thermally cured at 180 占 폚 and 2.0 MPa for 1 hour. Subsequently, the release films on both sides were peeled off to produce evaluation test pieces (test pieces). With respect to the test piece, relative dielectric constant and dielectric loss tangent at a measurement temperature of 23 ° C and a measurement frequency of 1 GHz were determined using a relative dielectric constant measuring device (cavity resonator type ADMS01Oc) manufactured by A-E.T.

The lower limit of the relative dielectric constant is more preferably 1 or more, still more preferably 2 or more, and the upper limit is more preferably 3 or less and still more preferably 2.8 or less. In addition, although the dielectric loss tangent is preferably 0, it is technically difficult. From this viewpoint, the lower limit of the dielectric loss tangent is preferably 0.0001 or more. On the other hand, the upper limit is more preferably 0.02 or less, and still more preferably 0.01 or less.

Further, as described later, in the adhesive layer in the present invention, the conductive filler may be contained in the binder component. (I), (II), or (I) and (II), when the conductive filler is contained, the value of the dielectric constant and dielectric loss tangent becomes larger than before the conductive filler is contained. However, It is surprisingly found that the problems of the present invention can be solved even when the film (X) after thermocompression bonding of the mixture of (I) and (II) satisfies the above conditions and the conductive filler is added. This is because by controlling the dielectric properties of the mixture of (I), (II), (II) or (I) and (II) in the adhesive layer, the effect of increasing the shielding property of the conductive layer to which the conductive filler is added, It is considered that the problems of the present invention can be solved by the synergistic effect of the present invention.

In the case of an adhesive layer containing a conductive filler, that is, an adhesive layer exhibiting anisotropic conductivity, the lower limit of the relative permittivity after mixing the conductive filler into the adhesive layer is more preferably 1 or more, still more preferably 2 or more, And still more preferably 9 or less. The dielectric loss tangent after mixing the conductive filler into the adhesive layer is preferably 0, but it is technically difficult. Therefore, the lower limit of the dielectric loss tangent is preferably 0.0001 or more. On the other hand, the upper limit is more preferably 0.05 or less, and still more preferably 0.03 or less.

When the electromagnetic shielding sheet is used as a flexible printed wiring board, the thickness of the adhesive layer 1 is preferably 50 mu m or less and more preferably 20 mu m or less in order to secure flexibility. Further, from the viewpoint of ensuring the adhesive force, the thickness is preferably 3 mu m or more, more preferably 6 mu m or more.

The curable compound (C) is preferably at least 0.2 part by mass, more preferably at least 1 part by mass, further preferably at least 3 parts by mass with respect to 100 parts by mass of the thermosetting resin (B). It is more preferably 50 parts by mass or less, further preferably 30 parts by mass or less, further preferably 20 parts by mass or less. By setting the curable compound (C) in the range of 0.2 to 50 parts by mass, hygroscopicity and adhesiveness can be maintained well by appropriately setting the crosslinking density. In addition, the modulus of elasticity of the cured product can be appropriately maintained, and the folding endurance can be improved.

When the electromagnetic wave shielding sheet is bonded to a component such as a printed wiring board, it is required to be a laminate capable of withstanding heating such as a solder reflow furnace. From this point of view, the 5% weight thermal decomposition temperature of the adhesive layer 1 is preferably 240 DEG C or higher, more preferably 260 DEG C or higher, and still more preferably 280 DEG C or higher.

Examples of the thermoplastic resin (A) include polyamide resins, liquid crystal polymer resins, methacrylic resins, acrylic resins, polystyrenes, polyesters, polyurethanes, polycarbonates, butadiene rubbers, ester amides, isoprene rubbers, Vinyl acetal resin, polyimide resin and polyamideimide resin. The thermoplastic resin (A) may be used singly or in combination of several kinds.

Examples of the thermosetting resin (B) include an acrylic resin, a polyurethane resin, a polyurethaneurea resin, a polyester resin, a polyamide resin, a polyamideimide resin, a polyimide resin, a polycarbonate resin, an alicyclic olefin resin, A phenol resin, a phenylene ether resin, an epoxy resin, a phenoxy resin, a maleimide resin, a polyimide benzoxazole resin, a polybenzoxazole resin, a polyester amide resin, a polyester imide resin, a vinyl ester resin, Ketone resin, polyether ether ketone resin, polyfumarate resin, benzoxazine resin, carbodiimide resin, fluororesin, polyolefin resin and silicone resin. The thermosetting resin (B) may be used singly or in combination of several kinds.

The curable compound (C) refers to a compound capable of contributing to curing with respect to the thermosetting resin (B). The site of reaction of the thermosetting resin (B) with the curing compound (C) is not limited, and examples thereof include a carboxyl group, a phenolic hydroxyl group, a (meth) acryl group, an epoxy group, an oxetanyl group, A cyano group, an isocyanate group, an aryl group, and a vinyl group. From the viewpoints of exerting the adhesiveness with the conductive layer 2 to a satisfactory level and from the viewpoint of exhibiting the adhesion with a component such as a coverlay film (for example, a polyimide resin) of a printed wiring board, a hydroxyl group and a carboxyl group A thermosetting resin (B) containing at least one kind is preferable. The kind of the curable functional group in the thermosetting resin (B) may be one or more.

The curable compound (C) is not particularly limited as long as it has two or more sites capable of reacting with the functional group of the thermosetting resin (B). Examples of suitable curable compounds (C) include epoxy compounds, organometallic compounds (metal chelate compounds), acid anhydride group-containing compounds, isocyanate compounds, aziridine compounds, amine compounds, polyol compounds, melamine compounds, silane compounds, carbodiimide compounds Compounds, phenol compounds, benzoxazine compounds, maleimide compounds, β-hydroxyalkylamide group-containing compounds, and the like. Of these, an epoxy compound, an organometallic compound, an aziridine compound, and an isocyanate compound are preferable from the standpoint of achieving compatibility between adhesiveness and heat resistance. The curable compound (C) can be used singly or in combination of several kinds.

When the curable functional group of the thermosetting resin (B) is a hydroxyl group, the curable compound (C) is preferably an isocyanate compound, an epoxy compound, an aziridine compound, a carbodiimide compound or an organometallic compound (metal chelate compound). When the curable functional group is an amino group, the curable compound (C) is preferably an isocyanate compound, an epoxy compound, an aziridine compound, a carbodiimide compound or an organometallic compound. Further, when the curable functional group of the thermosetting resin (B) is a carboxyl group, the curing compound (C) is preferably an epoxy compound or an organometallic compound.

Among these, the adhesive layer preferably contains at least one of the thermosetting resin (B), the carboxyl group-containing resin, the epoxy compound as the curable compound (C) and also the organometallic compound and the isocyanate compound. The epoxy compound preferably has an epoxy equivalent of 0.5 to 10 times, more preferably 1 to 5 times, based on 1 equivalent of carboxylic acid. The total curing agent equivalent of the organic metal compound and isocyanate compound is preferably 0.1 to 5 times, more preferably 0.5 to 3 times, based on 1 equivalent of carboxylic acid. By using the curable compound (C) as described above, the number of unreacted functional groups after thermosetting can be suppressed and the dielectric constant and dielectric tangent are further lowered.

As a suitable combination, a combination of a thermosetting resin (B) having a carboxyl group and a curing compound (C) containing an epoxy compound and an organometallic compound, a combination of a thermosetting resin (B) having a phenolic hydroxyl group and a curing compound , A combination of a thermosetting resin (B) having an epoxy group and a curing compound (C) containing an organometallic compound.

The curable compound (C) can be used alone or in combination. In the case of using in combination, preferred examples of the combination include an epoxy compound, an organometallic compound, an epoxy compound, an aziridine compound and an organometallic compound. The crosslinking density can be increased, and it is possible to effectively improve the heat resistance and to stick out of the adhesive layer during hot pressing.

Examples of the isocyanate compound include tolylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylene diisocyanate, hydrogenated xylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, tetra Polyisocyanate compounds such as methylxylene diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, and polymethylene polyphenyl isocyanate, and adducts of these polyisocyanate compounds and polyol compounds such as trimethylolpropane, and polyisocyanate compounds of these polyisocyanate compounds And polyisocyanate compounds and known polyether polyols or polyester polyols, acrylic polyols, polybutadiene polyols, polyisobutylene polyisocyanates, It may kkopeul the air duct member, such as a polyol.

The epoxy compound may be, for example, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, bisphenol A epichlorohydrin type epoxy resin, N, (N, N-diglycidylaminomethyl) cyclohexane, N, N-diglycidyl aniline, N, N'-tetraglycidyl-m-xylenediamine, N-diglycidyltoluidine, and the like.

The polycarbodiimide is commercially available from Nisshinbo Chemical Inc. The carbodilite series of the product is one of them. Of these, carbodelites V-01, 03, 05, 07 and 09 are preferable because they have good compatibility with organic solvents.

The aziridine compound may be, for example, 2,2'-bis hydroxymethyl butanol tris [3- (1-aziridinyl) propionate], 4,4'-bis (ethyleneiminocarbonyl amino) Diphenylmethane and the like.

The organometallic compound is a compound composed of a metal and an organic compound and reacts with the functional group of the thermosetting resin (B) to form a crosslink. The kind of the organometallic compound is not particularly limited, and examples thereof include an organoaluminum compound, an organic titanium compound, and an organic zirconium compound. The bond between the metal and the organic material may be a metal-oxygen bond, and is not limited to the metal-carbon bond. In addition, the bonding between the metal and the organic material may be any of chemical bonding, coordination bonding, and ion bonding.

The organoaluminum compound is preferably an aluminum chelate compound. The aluminum chelate compound may be, for example, ethyl acetoacetate aluminum diisopropylate, aluminum tris (ethyl acetoacetate), alkyl acetylacetate aluminum diisopropylate, aluminum monoacetylacetonate bis (ethyl acetoacetate), aluminum tris Acetyl acetate), aluminum monoacetyl acetate bis (ethylacetate), aluminum di-n-butoxide monomethylacetate, aluminum diisobutoxide monomethylacetate, aluminum di-sec-butoxide monomethylacetate, aluminum Sec-butoxy aluminum diisopropylate, aluminum sec-butylate, aluminum ethylate, and the like.

The organic titanium compound is preferably a titanium chelate compound. The titanium chelate compound may be, for example, titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethylacetate, titanium octylen glycolate, titanium ethylacetate, titanium-1,3-propanedioxybis ), Polythiethylacetyl acetyl acetonate, tetraisopropyl titanate, tetranorum butyl titanate, butyl titanate dimer, tetraoctyl titanate, tertiary aluminum titanate, tetra tertiary butyl titanate, N-butoxytitanium monostearate, di-i-propoxytitanium distearate, titanium stearate, di-i-propoxytitanium diisostearate, (2 n-butoxycarbonylbenzoyloxy) tributoxytitanium, and the like.

The organic zirconium compound is preferably a zirconium chelate compound. Examples of the zirconium chelate compound include zirconium tetraacetylacetonate, zirconium tributoxyacetylacetonate, zirconium monobutoxyacetylacetonate bis (ethylacetate), zirconium dibutoxybis (ethylacetate), zirconium tetra Acetylacetonate, normal propyl zirconate, normal butyl zirconate, zirconium stearate, zirconium octylate, and the like. Among these, an organic titanium compound is preferable in terms of heat curing reactivity and heat resistance after curing.

The resin used in the above (I) or (II) is not particularly limited as long as it satisfies the above-mentioned (i) (ii), but, from the viewpoint of heat resistance, the thermosetting resin (B) and the curing compound (C) Is preferably used.

In order to provide an electromagnetic shielding sheet capable of exhibiting excellent adhesive performance while maintaining good transmission characteristics even when used in a component for high frequency use in the adhesive layer containing (II), the film Y after thermosetting of the adhesive layer It is preferable to use one satisfying at least one of the following (a) and (b).

(hereinafter also referred to as [O]) of the number of oxygen atoms relative to the number of carbon atoms is 1 to 10%, and the ratio of the number of nitrogen atoms to the number of carbon atoms (a) 3 to 20%.

(b) at least one group selected from a carboxyl group and a hydroxyl group in the coating film (Y) after thermosetting of the adhesive layer, and when it contains a carboxyl group, the ratio of the number of carboxyl groups to the number of carbon atoms (hereinafter, (Hereinafter also referred to as " COOH ") is 0.01 to 15%, and when it contains a hydroxyl group, the ratio of the number of hydroxyl groups to the number of carbon atoms (hereinafter also referred to as [OH]) is in the range of 0.5 to 20%. Here, the coating film (Y) after thermosetting of the adhesive layer means the coating film (Y) in which the thermosetting resin (B) is sufficiently cured by the curing compound (C). However, the total of [COOH] and [OH] is preferably 35% or less, more preferably 30% or less, still more preferably 25% or less.

By using the coating film (Y) in the range of (a) above, the adhesiveness can be kept better. [N] and [O] are values determined from the peak area of the 1S orbit spectrum by X-ray photoelectron spectroscopy (ESCA), and are determined by the method described in the following Examples. The lower limit of [N] is more preferably 1.5% or higher, still more preferably 2% or higher, and still more preferably 8% or lower and even more preferably 7% or lower. The lower limit of [O] is more preferably 3.5% or more, still more preferably 4% or more, and the upper limit is more preferably 18% or less and still more preferably 15% or less.

By using the coating (Y) in the range of (b) above, it is possible to reduce the water absorption while maintaining the adhesive force of the adhesive layer and to provide the adhesive layer with high moisture resistance.

The lower limit of [OH] is more preferably 0.7% or more, still more preferably 1% or more, and still more preferably 18% or less and further preferably 15% or less. The lower limit of [COOH] is more preferably 0.05% or more, still more preferably 0.1% or more, still more preferably 13% or less and still more preferably 10% or less.

The adhesive layer (1) can be an adhesive layer having anisotropic conductivity by containing a conductive filler. At this time, the anisotropic conductivity is a layer in which an electrically conductive state is ensured in the thickness direction, and the isotropic conductivity is different from that of conductivity in the in-plane direction. In the case of the isotropic conductive layer, a current flows in the horizontal direction between the signal circuit and the isotropic conductive layer when the high-frequency signal flows, and the transmission loss increases because of the isotropic conductive layer It is preferable to use an adhesive layer having anisotropic conductivity.

From the viewpoint of ensuring sufficient anisotropy, the average particle diameter of the conductive filler is preferably at least 2 mu m, more preferably at least 5 mu m, and further preferably at least 7 mu m. On the other hand, from the viewpoint of compatibility with the thinning of the adhesive layer, the thickness is preferably 30 占 퐉 or less, more preferably 20 占 퐉 or less, and further preferably 15 占 퐉 or less. The content of the conductive filler is preferably within the following range with respect to the total amount of the adhesive layer. That is, from the viewpoint of securing flexibility and adhesion, it is preferably 50% by mass or less, more preferably 30% by mass or less, of the solid content of the adhesive. From the viewpoint of ensuring conductivity, the content is preferably 1% by mass or more, more preferably 10% by mass or more.

The D50 average particle diameter was obtained by measuring the conductive fine particles with a toned dry powder sample module using a laser diffraction / scattering method particle size distribution analyzer LS13320 (manufactured by Beckman Coulter, Inc.) , And the cumulative value of the particle diameter cumulative distribution is 50%. The refractive index was set to 1.6.

The aspect ratio of the conductive filler is preferably 1 to 3. Here, aspect ratio refers to the ratio of the major axis to the minor axis of the particles of the conductive filler (long diameter / short diameter). The aspect ratio is determined by measuring the long diameter and the short diameter of the particles appearing on the cut surface in the thickness direction of the adhesive layer using an electron microscope and obtaining the ratio of the long diameter to the short diameter. In this embodiment, the mean value of the long diameter / short diameter of 100 particles is taken as the aspect ratio. The long diameter is defined as the maximum distance of the cut surface of the particle, and the short diameter is defined as the shortest distance in the direction perpendicular to the long diameter.

The conductive filler is not particularly limited, but a metal filler, a carbon filler, and a mixture thereof can be mentioned. Examples of the metal filler include metal powder such as silver, copper and nickel, alloy powder such as pewter, silver coated copper powder, gold coated copper powder, silver coated nickel powder and gold coated nickel powder. By containing silver, more excellent conductivity can be obtained. Among them, silver coated copper powder is particularly preferable in terms of cost. The coating rate of the coating layer with respect to the metal powder is preferably 80% or more of the surface.

In the conductive filler, it is preferable that at least a part of the core is covered with the coating layer when covering the core, but it is preferable that the covering ratio is higher in order to obtain better conductive characteristics. From the standpoint of satisfactorily maintaining the conductive property, it is preferable that the average coverage rate by the coating layer is 60% or more, more preferably 70% or more, and still more preferably 80% or more. In the present specification, the average coverage rate refers to a value obtained by measurement of a powder according to ESCA. The detailed conditions are as follows: AXIS-HS (Shimadzu Corporation / Kratos), X-ray source: Dual (Mg) 15 kV, 10 mA Pass energy 80 eV, Step: 0.1 eV / 8, the mass concentration of silver and copper was obtained from the peak area of Ag 3d: 2 and Cu 2P: 1, and the ratio of mass concentration of silver was determined as the coverage ratio.

From the viewpoint of effectively preventing the coating stability, that is, the cohesion between the fillers, and the occurrence of streaking or smearing on the coated surface when the conductive resin composition is coated, a method of performing metal plating on a core such as glass fiber or carbon filler desirable. These conductive fillers are used by being coated and dried in a state of being dispersed in a resin. The shape of the particles is not particularly limited as long as anisotropic conductivity can be ensured. For example, spherical, dendritic (dentrite form), needle-like, fibrous forms can be exemplified. From the viewpoint of satisfactorily securing anisotropic conductivity, spherical or dendritic (dendritic) particles are preferable.

As the resin composition forming the adhesive layer, a silane coupling agent, a rust inhibitor, a reducing agent, an antioxidant, a pigment, a dye, a tackifier resin, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling regulator, a filler, have.

The manufacturing method of the electromagnetic wave shielding sheet 10 is not particularly limited, but can be manufactured by the following manufacturing method as an example. First, the composition constituting the adhesive layer (1) can be formed on a release substrate by a known method. For example, after application of the composition by comma coating, knife coating, die coating, lip coating, roll coating, curtain coating, bar coating, gravure printing, flexographic printing, dip coating, spray coating, spin coating, Lt; RTI ID = 0.0 > 150 C. < / RTI >

The thickness of the adhesive layer after being bonded to the component may vary depending on the application, but it is preferably 3 to 50 占 퐉 in order to obtain sufficient adhesion and good anisotropic conductive properties. The lower limit of the thickness of the adhesive layer 1 is more preferably 4 탆 or more, and still more preferably 6 탆 or more. It is further preferable that the upper limit of the thickness of the adhesive layer 1 is 30 占 퐉 or less.

As a method for laminating the adhesive layer, the conductive layer and the insulating layer, a known method can be used. For example, an adhesive layer is formed on a peelable sheet, an adhesive layer is laminated on the electrolytic copper foil surface side of the electrolytic copper foil (copper foil) to which the copper carrier of the conductive layer is attached, and then the copper carrier is peeled off. There is also a method of laminating the copper carrier-peeled surface and the insulating layer formed on a separate peelable sheet so as to overlap each other. A method of forming an adhesive layer on a peelable sheet, forming a conductive layer on the surface of the sheet by electroless plating, laminating the insulating layer formed on a separate peelable sheet and the conductive layer, and the like .

Next, an electromagnetic wave shielding wiring circuit substrate in which the electromagnetic wave shielding sheet of the present invention is bonded to a wiring circuit substrate will be described. Fig. 3 shows an example of a schematic explanatory diagram in which an electromagnetic wave shielding sheet is bonded to a printed wiring board. The electromagnetic wave shielding sheet 10 is bonded to the surface layer of the printed wiring board 20 as a component. The printed wiring board 20 has a cover layer composed of a substrate 21 made of polyimide or the like, a wiring 25, a ground pattern 24, an insulating adhesive layer 22 covering the same, and a polyimide film 23 . The electromagnetic wave shielding sheet 10 is bonded to the printed wiring board 20 by bonding treatment such as thermocompression bonding. The printed wiring board 20 is provided with a contact hole penetrating from the surface of the polyimide film 23 to the surface of the ground pattern 24. The ground pattern 24 and the electromagnetic wave shielding The adhesive layer 1 exhibiting anisotropic conductivity of the sheet 10 is electrically conducted. It is possible to achieve conduction only by attaching the electromagnetic wave shielding sheet 10 to the printed wiring board 20, which is easy to manufacture and is particularly suitable for a flexible circuit board.

4 is a schematic cross-sectional view of an electromagnetic wave shielding interconnection circuit substrate according to the first modification. In this example, the bumps 32 are provided on the main surface of the conductive layer 2 on the side of the adhesive layer 1 instead of the vias 31, and the bumps 32 are electrically connected to the ground pattern 24 . The bumps 32 can be obtained, for example, by forming a conductive layer on the conductive layer 2 corresponding to the ground pattern 24 and then forming the adhesive layer 1 thereafter. According to this method, the connection between the ground pattern 24 and the conductive layer 2 can be achieved by bonding the electromagnetic shielding sheet 10 to the printed wiring board 20.

5 is a schematic cross-sectional view of an electromagnetic wave shielding interconnection circuit substrate according to a second modification. In this example, the bump 33 is formed on the ground pattern 24 in advance, and can be electrically connected to the conductive layer 2 when bonded to the electromagnetic wave shielding sheet 10.

6 is a schematic cross-sectional view of an electromagnetic wave shielding wiring circuit substrate according to a third modification. In this example, after the electromagnetic wave shielding sheet 10 is bonded to the printed wiring board 20, the ground layer of the insulating layer 3 is electrically connected to the conductive layer 2 by using an external grounding component.

7 is a schematic cross-sectional view of an electromagnetic wave shielding interconnection circuit substrate according to a fourth modification. In this example, the electromagnetic wave shielding sheet 10 and the ground pattern 24 are formed by providing a ground via 41 penetrating from the surface layer of the insulating layer 3 to the ground pattern 24, Can be conducted. The conductive paste 35 exposed on the surface layer of the insulating layer 3 may be grounded from the outside again.

However, in the case of a high-frequency circuit, the characteristic impedance (Z ₀ ) is expressed by the following equations (1) and (2).

[Equation 1]

[Equation 2]

Here, Z ₀ is a characteristic impedance, Dk is the permittivity of the coverlay of the flexible printed wiring board (hereinafter also referred to as FPC), d is the thickness of the coverlay of the FPC, S is the thickness of the electromagnetic wave shielding sheet, Area, and C is the capacitance. R is the conductor resistance (Ω / m), L is the inductance (H / m), G is the conductance of the insulation layer (Ω / m), f is the frequency and j is the imaginary symbol. And C are dominant. In general, when the shielding film is attached, the characteristic impedance (Z ₀ ) is lowered. Therefore, in order to take impedance matching, it is necessary to increase the characteristic impedance Z ₀ . Here, the value of the capacitance C is expressed by Equation 2. By decreasing the value of the capacitance C, the value of the characteristic impedance Z ₀ can be increased.

In order to reduce the value of the capacitance C in Equation 2, a method of adjusting the width w (see Fig. 1) of the wiring 25 and a method of adjusting the width of the cover layer (the insulating adhesive layer 22 + the polyimide film 23 See Fig. 1), and a method of lowering the relative dielectric constant of the coverlay layer. However, the method of thinning the circuit width is not preferable because the production efficiency is lowered and the cost is increased, and the method of thickening the coverlay layer is preferable because it is against the demand of thin and small size I do not. Particularly, in a flexible printed wiring board or the like, flexibility is deteriorated, which is not preferable. By using a material satisfying the above (i) as the adhesive layer, it is possible to reduce the cover layer of the flexible printed circuit board by reducing the Dk of the formula (2). The polyimide film 23 constituting the coverlay layer is an example, and may be a protective layer having a function of protecting the circuit board and may be replaced with another material.

If the adhesive layer is not thermally cured when the electromagnetic wave shielding sheet is heat-pressed on the component, the adhesive layer may protrude from the side of the electromagnetic wave shielding sheet, resulting in poor appearance. For this reason, it is required that there is little or no spattering property when the electromagnetic shielding sheet is adhered by the thermocompression bonding process.

According to the electromagnetic wave shielding sheet of the present invention, by using the adhesive layer satisfying the above-mentioned (i) and (ii), good transmission characteristics can be maintained even in the case of being used for components for high frequency use while ensuring shielding of electromagnetic waves and the like. This is because, by using the adhesive layer satisfying the above conditions (i) and (ii), the electric polarization of the dielectric can not follow the change of the electric field and the phenomenon that part of the energy becomes heat can be suppressed, It is thought that it can reduce. By satisfying the above (i), the characteristic impedance matching can be improved. In addition, by satisfying the above (i) and (ii), the transmission loss of the high-frequency signal can be improved. Therefore, it can be suitably used in a wide frequency band. And is particularly suitable for the use of an electromagnetic wave shielding film for a signal transmission system that transmits a signal of a high frequency (10 MHz or more, preferably 1 GHz or more) that is likely to cause impedance mismatching and transmission loss.

Further, by combining the binder component satisfying the above conditions (i) and (ii) with the conductive filler, it is possible not only to simplify the connection with the component but also to improve the transmission characteristics and lower the characteristic impedance, .

In addition, by using the electromagnetic wave shielding sheet using the materials satisfying the above conditions (i) and (ii), the characteristic impedance Z ₀ expressed by the equations (1) and (2) can be lowered so that the characteristic impedance Z ₀ can be matched The design margin of the wiring width w of the signal circuit and / or the thickness of the coverlay can be widened. As a result, the yield can be improved and the production cost can be reduced. Therefore, the productivity of the circuit can be increased.

The electromagnetic wave shielding sheet of the present invention can be widely applied not only to a wiring circuit board but also to a component or various electronic devices which emit electromagnetic waves or require shielding.

≪ Embodiment >

Hereinafter, the present invention will be described in further detail with reference to examples, but the present invention is not limited to the following examples. In the examples, "part" means "mass part" and "%" means "mass%", respectively.

The raw materials used in the first embodiment are shown below.

<Resin>

R1 (polyamide resin): thermosetting polyamide resin acid value: 20 [mgKOH / g] (manufactured by Toyochem Co., Ltd.)

R2 (polyester resin): addition type polyester resin acid value 19 [mgKOH / g] (manufactured by Toyochem Co., Ltd.)

R3 (urethane resin): urethane-urea resin acid value: 5 [mgKOH / g] (manufactured by Toyochem Co., Ltd.)

R4 (olefin resin): styrene elastomer acid value 17 [mgKOH / g] (manufactured by Toyochem Co., Ltd.)

R5 (polyimide resin): thermosetting polyimide resin acid value: 21 [mgKOH / g] (manufactured by Toyochem Co., Ltd.)

<Conductive filler>

F1 (silver-coated copper powder): "Dendritic particles using copper as a core and silver as a covering layer: average particle diameter = 11.0 占 퐉" (manufactured by Fukuda Metal Powder Co., Ltd.)

<Copper foil>

Electrolytic copper foil with a carrier: &quot; MT18SD-H (electrolytic copper foil of 3 mu m in carrier foil of 18 mu m thickness) &quot; (manufactured by Mitsui Mining Co., Ltd.)

<Curable compound>

H1 (tetraphenol ethane type epoxy curing agent): &quot; jER1031S &quot; (product of Mitsubishi Chemical Corporation)

H2 (phenol novolak type epoxy curing agent): &quot; jER152 &quot; (product of Mitsubishi Chemical Corporation)

H3 (titanium chelate compound): "TC401" (manufactured by Matsumoto Fine Chemical Co., Ltd.)

H4 (aluminum chelate compound): "ALCH" (manufactured by Kawaken Fine Chemicals Co., Ltd.)

H5 (isocyanurate type block isocyanate): &quot; BL3175 &quot; (manufactured by Sumika Bayer Urethane Co., Ltd.)

H6 (aziridine compound): "Chemitite PZ-33" (product of Nihon Shokubai Co., Ltd.)

<Fabrication of electromagnetic wave shielding sheet>

Example 1 100 parts of a resin R1 (polyamide resin) and 50 parts of an electrically conductive filler F1 (silver-coated copper powder) were put into a container and mixed with a mixed solvent of toluene and isopropyl alcohol (toluene 100 50 parts of isopropyl alcohol) was added to the mixture and mixed. Subsequently, 15 parts of a curing compound H1 (tetraphenol ethane type epoxy curing agent) and 3 parts of a curing compound H3 (titanium chelate compound) were added and mixed for 10 minutes by a disper to obtain a resin composition. Further, the obtained resin composition was coated on a peelable sheet so as to have a dry thickness of 15 占 퐉 using a bar coater and dried in an electric oven at 100 占 폚 for 2 minutes to obtain an adhesive layer.

Separately, 100 parts of a resin R3 (urethane resin), 10 parts of a curing compound H1 (tetraphenol ethane type epoxy curing agent) and 10 parts of a curing compound H6 (aziridine compound) were added and stirred for 10 minutes by a disperator to obtain an insulating resin composition. Then, the obtained insulating resin composition was coated on a peelable sheet so as to have a dry thickness of 10 mu m using a bar coater and dried in an electric oven at 100 DEG C for 2 minutes to obtain an insulating layer.

The insulating layer was stuck to the electrolytic copper foil of the electrolytic copper foil having the carrier, and then the carrier copper foil was peeled off and the electrolytic copper foil was laminated on the insulating layer. Then, an adhesive layer was adhered to the electrolytic copper foil surface to obtain an electromagnetic wave shielding sheet composed of a &quot; peelable sheet / insulating layer / electrolytic copper foil / adhesive layer / peelable sheet &quot;. The temperature of the electrolytic copper foil and the adhesive layer were 90 占 폚 and the pressure was 3 kgf / cm2, and were stuck together by a thermal laminator.

[Examples 2 to 29, Comparative Examples 1 to 6]

The electromagnetic wave shielding sheets of Examples 2 to 29 and Comparative Examples 1 to 6 were obtained in the same manner as in Example 1 except that the composition of the adhesive layer of Example 1 and the thickness of the adhesive layer after hot pressing were changed as shown in Table 1 . Examples 14 and 16 to 29 are examples in which no conductive filler is contained, and are examples of Annex 1 to be described later.

[Table 1]

(Film Thickness of the Adhesive Layer) The thickness of the electromagnetic shielding sheet was measured by the following method. First, the peelable sheet of the adhesive layer of the electromagnetic wave shielding sheet was peeled off, and the exposed adhesive layer was laminated with a polyimide film ("Kapton 200EN" manufactured by DuPont) did. An electromagnetic wave shielding sheet was adhered to the slide glass / electromagnetic wave shielding sheet / sheet by dropping 0.05 g of epoxy resin (PETROXY 154, manufactured by Maruto) on the slide glass, Thereby obtaining a laminate having a constitution of a polyimide film. The resulting laminate was cut by a cross-section polisher (SM-09010, manufactured by Nihon Denshi Co., Ltd.) on the polyimide film side by ion beam irradiation to obtain a measurement sample of the electromagnetic shielding sheet after hot pressing.

The thickness of the adhesive layer was measured from the observed enlarged image using a laser microscope (VK-X100, manufactured by Keyence Corporation) on the cross section of the obtained measurement sample. The magnification was 500 to 2000 times. Table 1 shows the thickness of the adhesive layer after coating and drying, and the thickness of the adhesive layer after hot pressing.

[Specific dielectric constant and dielectric tangent]

At least one of the thermoplastic resin (A) used in the adhesive layer and the film (X) of the thermosetting resin (B) and the curable compound (C) (hereinafter also simply referred to as "film (X)") The relative dielectric constant and dielectric tangent of one side were prepared in the following order.

&Lt; Measurement film of Example 1 >

100 parts of the resin (R1), 15 parts of the curing compound (H1) and 3 parts of the curing compound (H3) were prepared, and a mixed solvent obtained by mixing 50 parts of isopropyl alcohol with 100 parts of toluene was added to the container, 45%. Furthermore, the solution was stirred with a disper for 10 minutes, and then subjected to vacuum defoaming to obtain a sample solution. The obtained sample solution was uniformly coated on a peelable sheet so as to have a dry thickness of 30 占 퐉 and dried to obtain a prepreg film.

<Measurement Coatings of Examples 2 to 29 and Comparative Examples 1 to 6>

A prepreg film of the adhesive layers of Examples 2 to 29 and Comparative Examples 1 to 6 was obtained in the same manner as in the measurement coating film of Example 1, except that the raw materials and blending amounts shown in Table 1 were used.

The dielectric constant and dielectric loss tangent of the coating film (X) were measured in accordance with the following procedure in accordance with the material for flexible printed circuit boards and flexible printed circuit boards of the Japan Electronics and Information Technology Association -2. Integrated Standard - (JPCA-DG03)

A plurality of the coating films X prepared in Examples and Comparative Examples were stacked to have a desired thickness, vacuum laminated and thermally cured at 180 占 폚 and 2.0 MPa for 1 hour to obtain a coating film (X). The coating film (X) was cut into a size of 3 mm in width and 100 mm in length, and a release sheet on both sides was peeled off to make a cured coating having a thickness of 80 탆 as a test piece for evaluation. The relative dielectric constant and dielectric loss tangent at a measurement temperature of 23 ° C and a measurement frequency of 1 GHz were determined by a cavity resonator method with three specimens set in a relative dielectric constant measuring device "ADMS01Oc" manufactured by A & . The results are shown in Table 3.

[Quantification of [N] and [O] of the adhesive layer after curing]

Except that the container was prepared by adding 100 parts of the resin (R1), 15 parts of the curing compound (H1), 3 parts of the curing compound (H3) and 50 parts of the conductive filler. The pre-adhesive layer was obtained in the same manner and treated in an oven at 180 캜 for 60 minutes to obtain a film (Y) after heat curing. [N] and [O] were determined from the number of nitrogen atoms, the number of carbon atoms, and the number of oxygen atoms by performing ESCA analysis on the surface of the obtained coating film (Y) under the following conditions. The measurement conditions are shown below.

Device: AXIS-HS (manufactured by Shimadzu Corporation / Kratos)

Vacuum in the sample chamber: 1 × 10 ^{- 8} Torr or less

X-ray source: Dual (Mg) 15kV, 5mA Pass energy 80eV

Step: 0.1 eV / Step

Speed: 120 seconds / Element

Dell: 300, accumulation count: 5

Optoelectronic extraction angle: 90 degrees relative to the surface of the sample

Coupling energy: C1s The main peak is 284.6 eV,

C (1s) peak region: 280 to 296 eV

O (1s) peak area: 530-534 eV

N (1s) peak region: 395 to 405 eV

The peak appearing in the peak region was drawn by a straight line method, and the ratio of the number of nitrogen atoms to the number of carbon atoms in the atomic concentration "Atomic Conc" of each atom was calculated.

[N] = number of atoms of N (1s) / number of atoms of C (1s) × 100

[O] = number of atoms of O (1s) / number of atoms of C (1s) × 100

The measurement was conducted by changing the positions at three places, and the average value was determined as [N] and [O] of the adhesive layer after curing.

[Determination of residual functional groups of the adhesive layer after curing]

[OH] and [COOH] were measured on the surface of the coating film (Y) after curing of the adhesive layer. Since the resin mainly consists of carbon, hydrogen, and oxygen atoms, quantitative analysis is difficult because ESCA does not usually identify a hydroxyl group or a carboxyl group. However, by treating a fluorine reagent that selectively binds to a carboxylic acid or a hydroxyl group, only the carboxyl group or the hydroxyl group is fluorine-modified, and it becomes possible to identify the functional group by ESCA. In addition, fluorine bond has a high detection sensitivity of ESCA, so that it is possible to quantitatively analyze functional groups on the surface with good sensitivity. As a result of intensive investigations by the present inventors, it has been found that the ratio [COOH] of the number of carboxyl groups to the number of carbon atoms is 0.01 to 15%, the ratio [OH] of hydroxyl groups to the number of carbon atoms is 0.5 to 20% It has been found that good transmission characteristics can be maintained when the electromagnetic shielding sheet of the present invention is attached to a component for high frequency use such as a printed wiring board while maintaining high adhesiveness to the component.

The film (Y) obtained by the above-mentioned method was cut into a width of 30 mm and a length of 30 mm to form a sample on a glass plate. In the vial bottle, the fluoride reagent and the sample were reacted in a noncontact manner at 55 ° C for 24 hours in an airtight state. After the gas phase reaction was completed, the sample was taken out of the reaction vessel and dried in a nitrogen stream to remove the remaining reagent. The removal of the residual reagent was carried out by adjusting the temperature and time appropriately so that the peak area of N (1s) was not changed.

A fluorine-modified sample was subjected to ESCA analysis under the same conditions as those of [N] and [O] described above to quantify [OH] and [COOH] of the adhesive layer. Three measurement specimens were produced, and the average value of the calculated values was obtained.

&Lt; Measurement method of [OH]

After the reaction of the hydroxyl group of the hydroxyl group with anhydrous trifluoroacetic acid, the residual reagent was removed, and the ratio of hydroxyl groups was calculated by ESCA measurement. The reaction formula and the calculation formula are as follows.

R-OH + (CF ₃ CO) ₂ O → R-COOCF ₃ + CF ₃ OCOH

[OH] is expressed by a value calculated by the following expression.

(OH) = {[F (1s)] / (3k [C (1s)] - 2 [F (1s)]) r}

The peak area [F (1s)] of F (1s) is obtained by plotting a straight line baseline in a range of 280 to 296 eV with a peak area of C (1s) Of the total. The reaction rate (r) was set to 1. K is the sensitivity correction value of the F (1s) peak area with respect to the C (1s) peak area unique to the device, and when using AXIS-HS (manufactured by Shimadzu Corporation / Kratos) 3.6.

&Lt; Measurement method of [COOH] >

After the carboxyl group was reacted with the mixed solution of trifluoroethanol, pyridine and dicyclohexylcarbodiimide, the residual reagent was removed, and the ratio of carboxyl groups was calculated by ESCA measurement. The reaction formula and the calculation formula are as follows.

R-COOH + CF ₃ CH ₂ -OH C ₆ H ₁₁ -NCN-C ₆ H ₁₁ / C ₅ H ₅ N → R-COOCH ₂ CF ₃ + C ₆ H ₁₁ NCONC ₆ H ₁₁

[COOH] is the value calculated by the following equation.

F (1s)] / (3k [C (1s)] - (2 [F

The peak area of F (1s) [F (1s)] is in the range of 682 to 695 eV, and the peak area of F (1s) is in the range of 280 to 296 eV in the peak area of C The baseline of which was calculated. Also, the reaction rate (r) was 1 and k was 3.6 as in the above description.

[Table 2]

[Hygroscopic property] The hygroscopicity was evaluated based on the presence or absence of appearance change of the adhesive layer after bringing the electromagnetic wave shielding sheet into contact with the molten solder. A sample with low hygroscopicity does not change its appearance, but a sample with high hygroscopicity will foam or peel off.

First, the peelable sheet of the adhesive layer of the electromagnetic wave shielding sheet having a width of 25 mm and a length of 70 mm was peeled off, and the exposed adhesive layer and a gold-plated copper clad laminate (gold plating 0.3 μm / nickel plating Plated surface of 1 mu m / copper foil 18 mu m / adhesive 20 mu m / polyimide film 25 mu m) was pressed at 150 DEG C under 2.0 MPa for 30 minutes and thermally cured to obtain a laminate. The obtained laminate was cut into a size of 10 mm in width and 65 mm in length to prepare a sample. The obtained sample was allowed to stand in an atmosphere of 40 DEG C and 90% RH for 72 hours. Thereafter, the polyimide film side of the sample was placed on the molten solder at 250 DEG C for one minute, and then the sample was taken out. The appearance of the sample was visually observed to determine whether or not the adhesive layer was abnormal such as foaming, I appreciated.

Excellent: No appearance change at all.

Good: Small foaming is slightly observed.

Acceptable: less than the above good, exceeding the following nonconformity.

Poor: Severe foaming or exfoliation is observed.

[Adhesion] An electromagnetic wave shielding sheet was prepared as a sample having a width of 25 mm and a length of 70 mm. The peelable sheet provided on the adhesive layer was peeled off, and a polyimide film (Capton 200EN manufactured by Toray DuPont) having a thickness of 50 占 퐉 was bonded to the exposed adhesive layer under the conditions of 150 占 폚 and 2.0 MPa for 30 minutes to thermally cure. Subsequently, the peelable sheet on the side of the insulating layer was peeled off for the purpose of reinforcing the sample to measure the adhesive strength, and a polyimide film having a thickness of 50 占 퐉 was peeled off from the peelable sheet by using an adhesive sheet manufactured by Toyochem Co., For 30 minutes to obtain a laminate having the structure of &quot; polyimide film / adhesive sheet / electromagnetic wave shielding sheet / polyimide film &quot;. Using this tensile tester (manufactured by Shimadzu Corporation), the laminate was subjected to a heat treatment at 23 DEG C under an atmosphere of 50% RH at a peeling speed of 50 mm / min and at a peeling angle of 90 DEG to the interface between the conductive layer of the electromagnetic wave shielding sheet and the polyimide film The adhesive strength was measured by peeling. The evaluation criteria are as follows.

Excellent: 6N / 25mm or more.

Good: 4 N / 25 mm or more, less than 6 N / 25 mm, and there is no practical problem.

Poor: less than 4N / 25mm.

[Protruding property]

The properties of protruding samples were evaluated by the following samples. An electromagnetic wave shielding sheet having a width of 50 mm and a length of 50 mm was prepared and a through hole having a diameter of 5 mm was formed at the center thereof by a punching machine. Subsequently, the peelable sheet of the adhesive layer was peeled off, and the adhesive layer and a polyimide film ("Capton 200EN" manufactured by Du Pont) were hot-pressed at 150 ° C under 2 MPa for 30 minutes. After cooling to room temperature, the hole portion of the electromagnetic wave shielding sheet was observed with a magnifying glass, and the length of the adhesive layer pierced into the hole was measured. The protruding length selected the most protruding part. The evaluation criteria are as follows.

Excellent: The protruding length is less than 0.1mm.

Good: The piercing length is 0.2 mm or more and less than 2.0, and there is no practical problem.

Poor: The protruding length is more than 2mm.

[Bending resistance]

The bending resistance of the electromagnetic wave shielding sheet was evaluated by the MIT test in accordance with JIS C6471. First, an electromagnetic wave shielding sheet was prepared with a width of 15 mm and a length of 120 mm. Separately, as an adherend to which an electromagnetic wave shielding film was adhered, a shape based on JIS C6471 was formed on the basis of a two-layer CCL obtained by laminating a polyimide film (thickness: 12.5 占 퐉, "Capton 50EN" manufactured by Toray DuPont) and a copper foil , And a cover coat &quot; CISV1215 (manufactured by Nikkan Kogyo Co., Ltd.) &quot;, composed of a polyimide film having a thickness of 12.5 占 퐉 and a thermosetting adhesive agent having a thickness of 15 占 퐉, was attached to form a cover coat layer. Further, the release sheet on the conductive layer side of the electromagnetic wave shielding sheet was peeled off, and the exposed conductive layer was pressed against the cover coat layer at 150 DEG C for 30 minutes under 2.0 MPa to obtain a sample. The obtained samples were measured for their bending properties using an MIT tester under the conditions of a temperature of 25 DEG C and a humidity of 50% in a condition of a radius of curvature of 0.38 mm, a load of 500 g, and a speed of 180 revolutions per minute. The evaluation was performed by bending (bending) 3,000 times, and the number of times of bending until the wiring was broken was measured. The evaluation criteria are as follows.

Excellent: It was not broken even when the number of bends was made 3000 times.

Good: The number of times of bending to break is 2500 or more and less than 3000 times, and there is no practical problem.

Poor: Disconnection was less than 2500 times.

[Appropriate evaluation for high frequency use]

The suitability for high frequency applications was evaluated using the following measuring samples.

Fig. 8 is a schematic plan view of a main surface side of a flexible printed wiring board (hereinafter also referred to as a printed wiring board) 7 having a coplanar structure used for measurement, and Fig. 9 is a schematic plan view of the back surface side thereof. First, a double-sided CCL &quot; R-F775 &quot; (manufactured by Panasonic Corporation) in which a rolled copper foil having a thickness of 12 탆 was laminated on both sides of a polyimide film 50 having a thickness of 50 탆 was prepared. Six through-holes 51 (0.1 mm in diameter) were provided in the vicinity of the four corners in a rectangular shape. In the drawings, for convenience of illustration, only two through holes 51 are shown at each corner. Subsequently, after the electroless plating treatment, electroplating treatment was carried out to form copper plating film 52 of 10 占 퐉, and electrical continuity was secured between both main surfaces through through-hole 51. 8, two signal wirings 53 having a length of 10 cm are formed on the main surface of the polyimide film 50 and a ground wiring 54 and a ground wiring 54 in parallel with the signal wirings 53, A ground pattern 55 extending from the wiring 54 and formed in a region including the through hole 51 in the short direction of the polyimide film 50 was formed.

Thereafter, the copper foil formed on the back surface of the polyimide film 50 was etched, and the back side ground pattern 56 as shown in Fig. 9 was obtained at a position corresponding to the ground pattern 55. [ The external appearance of the circuit and inspection specifications for the tolerance were made according to the JPCA standard (JPCA-DG02). Then, a cover layer 57 "CISV1215 (manufactured by Nikkan Kogyo Co., Ltd.)" composed of a polyimide film 57a (thickness 12.5 μm) and an insulating adhesive layer 57b (thickness 15 μm) was formed on the main surface side of the polyimide film 50 (See Fig. 8). 8, the cover layer 57 is shown in a perspective view so that the structure of the signal wiring 53 and the like can be known. Thereafter, nickel plating (not shown) was performed on the copper foil pattern exposed in the coverlay 57, followed by gold plating (not shown).

Fig. 10 is a schematic plan view of a printed wiring board 8 provided with an electromagnetic wave shielding sheet with an electromagnetic wave shielding sheet on the main surface side of the printed wiring board 7. Fig. 11 is a cross-sectional view taken along a line XI-XI in FIG. 10, and FIG. 12 is a cross-sectional view taken along the line XII-XII in FIG. 10, the electromagnetic shielding sheet 61 is shown in a perspective view for convenience of explanation. Two sheets of electromagnetic wave shielding sheets 61 and 62 were prepared and a peeled sheet (not shown) provided on the adhesive layer 71 of the electromagnetic wave shielding sheets 61 and 62 was removed. The printed wiring board 7 was sandwiched between the adhesive layers 71 of the electromagnetic wave shielding sheets 61 and 62 as an inner side and pressed at 150 DEG C and 2.0 MPa for 30 minutes to form an electromagnetic wave shielding sheet A printed wiring board 8 was obtained. As the electromagnetic wave shielding sheets 61 and 62, a sheet in which an adhesive layer 71, a conductive layer 72, and an insulating layer 73 were laminated in this order was used.

The electromagnetic wave shielding sheet 61 provided on the main surface side of the printed wiring board 7 is provided with two openings 60 as shown in Fig. In each of the openings 60, the ends of the projections 58 extending from the two ground patterns 55 and the ends of the two signal lines 53 are exposed. A spectrum analyzer is connected to the exposed ground pattern 55 and the signal wiring 53 and tested. An electromagnetic wave shielding sheet 62, which has substantially the same shape as the electromagnetic wave shielding sheet 61 and is not provided with an opening, is provided on the back side of the printed wiring board 7 in a region where the electromagnetic wave shielding sheet 62 overlaps the printed wiring board 7. Signals in the range of 1 MHz to 20 GHz were sent to the signal wiring 53 using a network analyzer E5071C (manufactured by Agilent Japan), and the characteristic impedance and transmission loss of the printed wiring board 8 equipped with the electromagnetic wave shielding sheet were measured. In Examples 1 to 15 and Comparative Examples 1 to 4, when the L / S (line / space) of the signal circuit is set to 30/100 m and the characteristic impedance obtained in the formula (1) is in the range of 100 mΩ ± 5 mΩ So that the thickness of the adhesive layer of the coverlay and the shielding sheet is appropriately adjusted. On the other hand, in Comparative Example 5, the total thickness of the adhesive layer of the coverlay and the shielding sheet was 50.5 탆, and the wiring width of the signal circuit was adjusted so that the characteristic impedance was within the range of 100 mΩ ± 5 mΩ. In Examples 1 to 15 and Comparative Examples 1 to 5, the ground wiring 54 had a width of 100 m, and the distance between the ground wiring 54 and the signal wiring 53 was 1 mm.

(Thickness of the cover layer and adhesive layer) The printed wiring board 8 provided with the electromagnetic wave shielding sheet was cut into a size of about 5 mm in width and about 5 mm in length, and then epoxy resin (PETROXY 154, manufactured by Maruto Co., Ltd.) and the printed wiring board 8 provided with the electromagnetic wave shielding sheet was bonded to the slide glass to obtain a laminate of the printed wiring board 8 provided with the slide glass / electromagnetic wave shielding sheet. The resultant laminate was cut into ion beam at the side of the printed wiring board 8 using a cross-section polisher (SM-09010, manufactured by Japan Electronics Co., Ltd.) to obtain a measurement sample of the printed wiring board 8 provided with the electromagnetic shielding sheet .

Using the laser microscope (VK-X100, manufactured by KEYENCE CORPORATION), the cross section of the obtained measurement sample was observed from the observed enlarged image to the adhesive layer 71 at the position indicated by the arrow T in FIG. 12 The thickness of the polyimide film 57a and the insulating adhesive layer 57b (hereinafter, the sum of the thicknesses of the coverlay and the adhesive layer in this specification is defined as the thickness of the FPC) was measured. The thickness of the FPC was measured at a magnification of 500 to 2000 times and evaluated as follows. The results are shown in Table 3.

Excellent: The total thickness of the adhesive layer of the coverlay and the electromagnetic wave shielding sheet is less than 48.5 탆.

Good: The total thickness of the adhesive layer of the coverlay and the electromagnetic wave shielding sheet is 48.5 탆 or more and less than 52.5 탆.

Poor: The total thickness of the adhesive layer of the coverlay and the electromagnetic shielding sheet is not less than 52.5 탆.

[Transmission Loss] The transmission loss in the high frequency signal was evaluated by measuring the transmission loss at 10 GHz and 20 GHz. The evaluation criteria are as follows. The obtained results are shown in Table 3.

[10 GHz]

Excellent: Less than 4.5dB

Good: greater than 4.5 dB, less than 5.0 dB

Poor: 5.0dB or more

[20 GHz]

Excellent: less than 7dB

Good: more than 7dB, less than 7.5dB

Poor: Greater than 7.5dB

[Table 3]

It was found that the transmission loss in the high frequency signal can be effectively suppressed without narrowing the L / S of the circuit as shown in Table 3 by using the material satisfying the above (i) and (ii) as the adhesive layer. Example 14 using an adhesive layer containing no conductive filler, that is, showing no conductivity effectively suppressed the transmission loss, and used the same thermosetting resin and curing agent as in Example 14 as a binder component, Further, in Examples 12 and 13, it was found that transmission characteristics in high frequency applications can be improved (transmission loss can be effectively suppressed). The compositions of Comparative Example 2 and Comparative Example 5 are common, but in Comparative Example 5 in which the thickness of the FPC is 50.5 占 퐉 as in the case of the embodiment, L / S needs to be narrowed, and as a result, the productivity is lowered.

<Bookkeeping>

The present specification also discloses inventions of the following technical ideas that are grasped in the above embodiments.

(Note 1): An electromagnetic wave shielding sheet comprising a laminate that shields at least part of a component that emits electromagnetic waves,

In the laminate,

An adhesive layer which is disposed on the component and joining the component to the component,

A conductive layer laminated on the adhesive layer;

The adhesive layer contains, as a binder component,

(I) a thermoplastic resin (A), and

(II) the curing compound (C) to the thermosetting resin (B) and the thermosetting resin (B)

And at least one of them,

Wherein the film (X) after thermocompression bonding the binder component satisfies the following (i) and (ii).

(i) The relative dielectric constant is 1 to 3 at 23 deg. C and a frequency of 1 GHz.

(ii) The dielectric loss tangent is 0.0001 to 0.02 at 23 deg. C and a frequency of 1 GHz.

(Note 2): The thermosetting resin (B) comprises a carboxyl group-containing resin,

The electromagnetic wave shielding sheet according to Supplementary Note 1, further comprising an epoxy compound as the curable compound (C), and further containing at least one of an organometallic compound and an isocyanate compound.

(Note 3): The electromagnetic wave shielding sheet according to Appendix 1 or 2, wherein the thickness of the adhesive layer after the bonding treatment is 3 to 50 μm.

(Note 4): The electromagnetic wave shielding sheet according to any one of 1 to 3, wherein the adhesive layer further contains an electrically conductive filler and exhibits anisotropic conductivity.

(Note 5) The electromagnetic wave shielding sheet according to Supplementary note 4, wherein the conductive filler is selected from at least one of spherical particles and dendritic particles.

(Note 6): The binder component contains electricity (II)

Wherein the ratio of the number of nitrogen atoms to the number of carbon atoms in the film (Y) after thermosetting of the adhesive layer is 1 to 10%, and the ratio of the number of oxygen atoms to the number of carbon atoms is 3 to 20% The electromagnetic shielding sheet according to any one of &lt; 1 &gt;

(Note 7): The binder component includes the above (II)

The film (Y) after thermosetting of the adhesive layer contains at least one group selected from a carboxyl group and a hydroxyl group,

When the carboxyl group is contained, the ratio of the number of carboxyl groups to the number of carbon atoms ranges from 0.01 to 15%

When the hydroxyl group is included, the ratio of the number of hydroxyl groups to the number of carbon atoms is in the range of 0.5 to 20%

The electromagnetic shielding sheet according to any one of Notes 1 to 6, wherein the total of the number of carboxyl groups and the number of hydroxyl groups based on the number of carbon atoms is 35% or less.

(Note 8): An electromagnetic wave shielding sheet according to any one of Notes 1 to 7, wherein the curable compound (C) contains an organometallic compound.

(Note 9): The electromagnetic wave shielding sheet according to any one of Notes 1 to 8, wherein the conductive layer is a metal layer.

(Note 10): An electromagnetic wave shielding interconnection circuit board in which the electromagnetic wave shielding sheet described in any of App. 1 to 9 is bonded on a wiring circuit board.

(Note 11) An electronic device to which the electromagnetic wave shielding sheet according to any one of Notes 1 to 10 is bonded.

Industrial availability

The electromagnetic wave shielding sheet according to the present invention can be suitably used for an electromagnetic wave shielding wiring circuit substrate such as a flexible printed wiring board and an electronic apparatus equipped with the same.

This application claims priority based on Japanese Patent Application No. 2015-035207, filed on February 25, 2015, which is hereby incorporated by reference in its entirety.

1.71; Adhesive layer
2.72; Conductive layer
3.73; Insulating layer
7; Printed circuit board
8; A printed wiring board having an electromagnetic wave shielding sheet
10, 61, 62; Electromagnetic wave shielding sheet
20; Printed circuit boards (parts)
21; Board
22,57b; The insulating adhesive layer
23.57a; Polyimide film
24; Ground pattern
25; Wiring
31; Via
32,33; Bump
34; External earth
35; Conductive paste
41; Ground Via
50; Polyimide film
51; Through Hole
52; Copper plating film
53; Signal wiring
54; Ground wiring
55; Ground pattern
56; The back side ground pattern
57; Cover Ray
58; projection part
60; Opening

Claims (10)

An electromagnetic wave shielding sheet comprising a laminate that shields at least a part of a component that emits electromagnetic waves,
In the laminate,
An adhesive layer which is disposed on the component and which is bonded to the component by performing bonding treatment,
A conductive layer laminated on the adhesive layer;
And an insulating layer formed on the conductive layer,
The adhesive layer contains, as a binder component,
(I) a thermoplastic resin (A), and
(II) at least one of a thermosetting resin (B) and a curing compound (C) to the thermosetting resin (B)
The adhesive layer may further include an electrically conductive filler to exhibit anisotropic conductivity,
An electromagnetic wave shielding sheet in which the film (X) after thermocompression bonding the binder component satisfies the following (i) and (ii):
(i) The relative dielectric constant is 1 to 3 at 23 deg. C at a frequency of 1 GHz.
(ii) dielectric tangent (dielectric tangent) is 0.0001 to 0.02 at 23 deg. C at a frequency of 1 GHz.
The method according to claim 1,
The thermosetting resin (B) comprises a carboxyl group-containing resin,
An electromagnetic wave shielding sheet comprising an epoxy compound as the curable compound (C), and at least one of an organometallic compound and an isocyanate compound.
3. The method according to claim 1 or 2,
And the thickness of the adhesive layer after the bonding treatment is 3 to 50 占 퐉.
4. The method according to any one of claims 1 to 3,
Wherein the conductive filler is selected from at least one of spherical particles and dendritic particles.
5. The method according to any one of claims 1 to 4,
Wherein the binder component comprises (II)
Wherein the ratio of the number of nitrogen atoms to the number of carbon atoms in the film (Y) after thermosetting of the adhesive layer is 1 to 10%, and the ratio of the number of oxygen atoms to the number of carbon atoms is 3 to 20% .
6. The method according to any one of claims 1 to 5,
Wherein the binder component comprises (II)
The film (Y) after thermosetting of the adhesive layer contains at least any one group selected from a carboxyl group and a hydroxyl group,
When the carboxyl group is contained, the ratio of the number of carboxyl groups to the number of carbon atoms ranges from 0.01 to 15%
When the hydroxyl group is included, the ratio of the number of hydroxyl groups to the number of carbon atoms is in the range of 0.5 to 20%
Wherein the total of the number of carboxyl groups and the number of hydroxyl groups based on the number of carbon atoms is 35% or less.
7. The method according to any one of claims 1 to 6,
An electromagnetic wave shielding sheet wherein the curable compound (C) contains an organometallic compound.
8. The method according to any one of claims 1 to 7,
Wherein the conductive layer is a metal layer.
8. An electromagnetic wave shielding interconnection circuit board according to any one of claims 1 to 8, wherein the electromagnetic interference shielding sheet is bonded onto a wiring circuit board.
An electronic device to which the electromagnetic wave shielding sheet according to any one of claims 1 to 8 is bonded.

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