KR20170062773A - Component connection dummy printed circuit board - Google Patents
Component connection dummy printed circuit board Download PDFInfo
- Publication number
- KR20170062773A KR20170062773A KR1020150168357A KR20150168357A KR20170062773A KR 20170062773 A KR20170062773 A KR 20170062773A KR 1020150168357 A KR1020150168357 A KR 1020150168357A KR 20150168357 A KR20150168357 A KR 20150168357A KR 20170062773 A KR20170062773 A KR 20170062773A
- Authority
- KR
- South Korea
- Prior art keywords
- terminal
- base
- piece
- soldering
- pcb
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
An object of the present invention is to provide a dummy substrate for component connection, wherein the structure of the present invention comprises a base (10); And a conductive terminal 20 provided on the base 10 and soldered to the PCB 4, wherein the terminal 20 is mounted on the PCB 4 by soldering and at the same time, The component 20 is electrically connected to the terminal 20 in a state in which the terminal 20 is supported and the base 10 is provided with a mounting groove 12 of the terminal 20, And the terminal 20 is further coupled to the mounting groove 12 and the terminal 20 is further provided with a bending portion 23 so that the terminal 20 is connected to the terminal 20 of the base 10. [ And the bottom surface of the terminal 20 and the bending portion 23 are electrically connected to the PCB 4 by the soldering portion SP.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dummy substrate for component connection, and more particularly, to a dummy substrate that can compensate for height according to the shape of components or structures mounted on a PCB. The present invention relates generally to a dummy phone for an iphone jack.
2. Description of the Related Art [0002] A mobile communication terminal is a communication device capable of carrying voice communication and wireless communication while moving on the moveable mobile communication terminal. Recently, with the development of industry, the spread of personal communication means is increasing. The mobile communication terminal is typically a smart phone or the like. The mobile communication terminal may be divided into a bar type, a flip type, a folder type, a sliding type, and the like. An earphone jack for testing the performance of the terminal or for inserting the earphone. That is, a PCB (printed circuit board) is provided inside a portable terminal such as a smart phone, and an RF connector and a DC jack for charging are used for testing a spec of an RF signal transmitted / And an earphone jack in which an earphone is inserted is connected in circuit by an electrical connection medium such as a power supply terminal, and an earphone jack is disposed on a side of a mobile communication terminal such as a smart phone. And the PC equipped with the earphone jack is mounted in an internal accommodation space between the upper case and the lower case of the mobile communication terminal.
At this time, a means for compensating the height is required according to the shape of parts or equipment mounted on the PC (i.e., the RF connector, the charging DC jack, the earphone jack, etc.).
SUMMARY OF THE INVENTION It is an object of the present invention to provide a dummy substrate that can compensate for height according to the shape of a component or an apparatus mounted on a PCB. It is also an object of the present invention to provide a dummy substrate for connecting new components with high reliability because the main terminal and the base are not separated or lifted.
According to an aspect of the present invention, And a conductive terminal provided on the base and soldered to the PCB.
The terminal is soldered to the PCB and is electrically connected to the terminal while the component (such as an earphone jack) is supported on the base.
The base is provided with a terminal seating groove, and the terminal is seated and coupled to the terminal seating groove.
The terminal further includes a bending portion, wherein the terminal is coupled to the terminal seating groove of the base, and the bottom surface of the terminal and the bending portion are electrically connected to the PCB by the soldering portion.
The bending portion is provided at one end of the terminal and is disposed obliquely on the surface of the PCB, and the terminal provided on the base bottom and the bending portion are connected to the PCB by the soldering portion.
The terminal is further provided with a fixed supporting piece at an end opposite to the one end formed with the bending portion, and the fixed supporting piece is coupled to the base.
The terminal is provided with a joint support foot embedded in the base, and the joint support foot is provided with a notched portion so that the notched portion is engaged with the inside of the base.
The terminal comprising: a soldering terminal piece connected to the PCB by a soldering portion; A bending portion provided at one end of the soldering terminal and connected to the PC by a part of the soldering portion; A component energizing connecting piece provided at the other end of the soldering terminal; And a fixed supporting piece provided on the component connecting connection piece and engaged with the base, wherein the base is formed in a block shape having an upper surface, a lower surface, and front, rear, left and right side portions, Wherein the terminal holding groove is provided with the soldering terminal piece and the component connecting connecting piece are seated and coupled to the terminal seating groove and the upper surface adjacent to the rear side portion of the base is provided with the fixing holding piece connecting groove, And the fixed support piece is engaged with the fixed support piece coupling groove of the base.
And a guide protrusion is further provided on the base.
The terminal is seated and coupled to a terminal seating groove formed on a bottom surface of the base portion, and the guide protrusion protrudes upward from the upper surface of the base.
The dummy board for component connection according to the present invention is characterized in that a terminal is mounted on a PCB as a soldering portion and a component such as an earphone jack of a cellular phone is mounted on the base so that the PCB and the component can be electrically connected to each other. The main effect is that the height can be compensated according to the shape of the lens.
Of course, the present invention has various effects in addition to the above effects, but the above-described effects are considered to be the main effects of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an upper surface of a base,
Figure 2 is a perspective view of the bottom of Figure 1;
Figure 3 is a perspective view showing an upper surface of a terminal,
Figure 4 is a perspective view of the bottom of Figure 3;
5 is a perspective view of a dummy substrate for connecting parts according to the present invention.
Fig. 6 is a bottom perspective view of Fig.
7 is a side view showing a state in which the dummy substrate for component connection of the present invention is mounted on the PCB by soldering;
8 is an enlarged view of a portion A in Fig. 7
9 is a view schematically showing a state in which the dummy substrate for component connection of the present invention is normally assembled by the guide protrusions of the base,
10 is a view schematically showing a misassembled state of the dummy substrate for connecting parts of the present invention
11 is a view conceptually showing a state in which parts are connected to a PCB via a dummy board for connecting parts of the present invention
12 is a side sectional view of a dummy substrate for connecting parts according to the present invention
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and advantages of the present invention will be more readily understood by reference to the accompanying drawings and the following detailed description. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.
In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. For example, if a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, It is to be understood that other components may be "connected "," coupled "
Referring to the drawings, a dummy board for component connection according to the present invention has a configuration in which a
The
The
The soldering
The current-carrying connecting
The terminal 20 is provided with a fixing
The terminal 20 is provided on the
When the terminal 20 is mounted on the
Also, the
The terminal 20 is accommodated in the coupling groove of each terminal 20 provided in the
On the other hand, the terminal 20 is provided with a
In addition, a notched portion 26NC is formed in each of the
In the dummy board for component connection according to the present invention having the above configuration, the terminal 20 is mounted on the
The
Therefore, in the dummy board for component connection according to the present invention, the terminal 20 is mounted on the
In the present invention, the terminal 20 is further provided with a bending
In the present invention, the terminal 20 is provided with the notch portion 26NC, which has the effect of complementing the separation between the base 10 (the injection part 2) and the terminal 20 so as not to occur. As described above, the engaging
In the present invention, since the
Further, in the present invention, since the guide protrusion 14 (boss shape) is provided on the
The terminal 20 is connected to the
The
The specific embodiments of the present invention have been described above. It is to be understood, however, that the scope and spirit of the present invention is not limited to these specific embodiments, and that various modifications and changes may be made without departing from the spirit of the present invention. If you have, you will understand.
Therefore, it should be understood that the above-described embodiments are provided so that those skilled in the art can fully understand the scope of the present invention. Therefore, it should be understood that the embodiments are to be considered in all respects as illustrative and not restrictive, The invention is only defined by the scope of the claims.
2. Parts (electronic parts) 4. PHI
10.
14.
20.
23.
25. Fixed
26NC. Notchibu SP. Soldering portion
Claims (10)
And a conductive terminal (20) provided on the base (10) and soldered to the PCB (4).
The terminal 20 is soldered to the PCB 4 and the component 2 is electrically connected to the terminal 20 while the component 2 is supported on the base 10 And the dummy substrate is connected to the dummy substrate.
Wherein the base is provided with a seating groove for the terminal and the terminal is seated in the seating groove of the terminal.
The terminal 20 is further provided with a bending portion 23 so that the terminal 20 is coupled to the seating groove 12 of the terminal 20 of the base 10, Wherein the bending portion (23) is electrically connected to the PCB (4) by a soldering portion (SP).
The bending portion 23 is provided at one end of the terminal 20 and is inclined at the surface of the PCB 4 and the terminal 20 and the bending portion 23 ) Is connected to the PCB (4) by the soldering portion (SP).
The terminal 20 further includes a fixing support piece 25 at an end opposite to the one end of the bending portion 23 so that the fixing support piece 25 is engaged with the base 10 And the dummy substrate is connected to the connecting portion.
The terminal 20 is provided with a mating support foot 26 embedded in the base 10 and a mating portion 26NC is provided on the mating support foot 26, (10). ≪ RTI ID = 0.0 > 11. < / RTI >
The terminal (20)
A soldering terminal piece 22 connected to the PCB 4 by a soldering portion SP;
A bending part 23 provided at one end of the soldering terminal piece 22 and connected to the PC part by a part of the soldering part SP;
A current connection piece 24 provided at the other end of the soldering terminal piece 22;
And a stationary supporting piece (25) provided on the energizing connection piece (24) and engaged with the base (10)
The base 10 is formed in a block shape having an upper surface, a lower surface and front, rear, left and right side portions. A terminal 20 seating groove 12 is provided on a bottom surface and a rear side portion of the base 10, The soldering terminal piece 22 and the electrification connecting piece 24 are seated and coupled to the seating groove 12 and the upper side adjacent to the rear side portion of the base 10 is provided with a fixed supporting piece engagement ham 16 Wherein the fixed support piece (25) of the terminal (20) is joined to the fixed support piece coupling (16) of the base (10) so as to be joined.
And a guide protrusion (14) is further provided on the base (10).
The terminal 20 is seated and coupled to the seating groove 12 of the terminal 20 formed on the bottom of the base 10 and the guide protrusion 14 protrudes upward from the upper surface of the base 10 And the dummy substrate is connected to the dummy substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150168357A KR20170062773A (en) | 2015-11-30 | 2015-11-30 | Component connection dummy printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150168357A KR20170062773A (en) | 2015-11-30 | 2015-11-30 | Component connection dummy printed circuit board |
Publications (1)
Publication Number | Publication Date |
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KR20170062773A true KR20170062773A (en) | 2017-06-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150168357A KR20170062773A (en) | 2015-11-30 | 2015-11-30 | Component connection dummy printed circuit board |
Country Status (1)
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KR (1) | KR20170062773A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220094235A (en) * | 2020-12-28 | 2022-07-06 | 주식회사 스위치코리아 | Power switch indicator assembly and manufacturing method thereof |
-
2015
- 2015-11-30 KR KR1020150168357A patent/KR20170062773A/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220094235A (en) * | 2020-12-28 | 2022-07-06 | 주식회사 스위치코리아 | Power switch indicator assembly and manufacturing method thereof |
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