KR20170048969A - Laser processing method and laser processing apparatus using multi focusing - Google Patents
Laser processing method and laser processing apparatus using multi focusing Download PDFInfo
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- KR20170048969A KR20170048969A KR1020150149730A KR20150149730A KR20170048969A KR 20170048969 A KR20170048969 A KR 20170048969A KR 1020150149730 A KR1020150149730 A KR 1020150149730A KR 20150149730 A KR20150149730 A KR 20150149730A KR 20170048969 A KR20170048969 A KR 20170048969A
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- Prior art keywords
- laser beam
- laser
- light
- stage
- processed
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A laser processing method and a laser processing apparatus using multiple focal points are disclosed. The disclosed laser machining method comprises: machining an object to be processed placed on a stage using a laser, the method comprising: dividing a laser beam into a plurality of laser beams; Transmitting the plurality of divided laser beams to the object to form light-converging points at different depths; And processing the object by moving the laser beam relative to the stage along a line along which the object is intended to be machined, wherein the light-converging point formed at a deeper position from the surface on which the laser beam is incident, Is formed on the side of the movement of the laser beam in the line along which the laser beam is to be machined than a light-converging point formed at a shallower position.
Description
And more particularly, to a laser processing method and a laser processing apparatus for forming and cutting a plurality of light-converging points in an object to be processed.
The laser processing apparatus irradiates an object to be processed with a laser beam emitted from a laser oscillator by using an optical system. The object to be processed is exposed by such a laser beam to perform marking, exposure, etching, punching, scribing, Laser processing such as dicing is performed.
Recently, in order to prevent the surface of the object to be damaged, a method of processing the object by forming a light-converging point within the object to be processed having a laser beam transmissive to generate a crack has attracted attention. For example, when a high-power laser beam of a semiconductor wafer is focused to form a light-converging point, a modified region is formed near the light-converging point, and a crack is generated from the modified region. Then, when the laser beam is moved along the line to be machined of the semiconductor wafer, cracks are formed in the object, and then the object is cut off naturally or by an external force to expand the crack to the surface of the semiconductor wafer.
However, in the conventional laser machining method and laser machining apparatus, the light converging points are arranged in the transverse direction, and the light converging points are formed at the same depth, so that the number of processing required for cutting the object is large, have.
The present invention provides a laser machining method and a laser machining apparatus for forming and processing a plurality of light-converging points in an object to be processed.
According to another aspect of the present invention, there is provided a laser processing method for processing an object to be processed placed on a stage using a laser, comprising: dividing a laser beam into a plurality of laser beams; Transmitting the plurality of divided laser beams to the object to form light-converging points at different depths; And processing the object by moving the laser beam relative to the stage along a line along which the object is intended to be machined, wherein the light-converging point formed at a deeper position from the surface on which the laser beam is incident, Is formed on the side of the movement of the laser beam in the line along which the laser beam is to be machined than a light-converging point formed at a shallower position.
The step of dividing the laser beam into a plurality of laser beams may split the laser beam through a plurality of lenses having different focal lengths from each other.
The plurality of lenses may have a focal length greater than that of a lens positioned in a moving direction of the laser beam, the lens being positioned in a direction opposite to the moving direction of the laser beam.
The step of dividing the laser beam into a plurality of laser beams may split the laser beam by passing the laser beam through a diffractive optical element lens.
The step of moving the laser beam relative to the stage along the line to be machined to process the object may move the stage or scan the laser beam to machine the object.
The object to be processed may be a transparent medium.
A laser processing method according to an embodiment of the present invention is a laser processing method for processing an object to be processed placed on a stage by using a laser. The laser processing method includes passing a laser beam through a spherical lens having a plurality of curved surfaces, Dividing the laser beam into a plurality of laser beams; Transmitting the plurality of divided laser beams to the object to form light-converging points at different depths; And moving the laser beam relatively to the stage along a line to be machined to machine the object.
The plurality of curved surfaces of the spherical lens may have different focal lengths.
The step of moving the laser beam relative to the stage along the line to be machined to process the object may move the stage or scan the laser beam to machine the object.
A laser processing apparatus according to an embodiment of the present invention is a laser processing apparatus for processing an object to be processed placed on a stage using a laser, comprising: a laser light source for emitting a laser beam; And an optical system for dividing the laser beam into a plurality of laser beams and forming light-converging points at different depths of the object to be processed, wherein the light-converging point is formed at a position deeper from the surface on which the laser beam is incident The point is formed closer to the moving direction of the laser beam in the line along which the laser beam is intended to be machined than the light-converging point formed at a shallower position.
The optical system may include a plurality of lenses having different focal distances from each other.
The plurality of lenses may have a focal length greater than that of a lens positioned in a moving direction of the laser beam, the lens being positioned in a direction opposite to the moving direction of the laser beam.
The optical system may include a diffractive optical element lens.
And the stage moves relative to the laser beam to machine the object.
The laser beam can be moved relative to the stage along the line to be processed.
A laser processing apparatus according to an embodiment of the present invention is a laser processing apparatus for processing an object to be processed placed on a stage using a laser, comprising: a laser light source for emitting a laser beam; And a spherical lens having a plurality of curved surfaces for dividing the laser beam into a plurality of laser beams and forming light-converging points at different depths of the object, wherein the spherical lens has a plurality of curved surfaces As shown in FIG.
The plurality of curved surfaces of the spherical lens may have different focal lengths.
And the stage moves relative to the laser beam to machine the object.
And a scanner for relatively moving the laser beam along the line to be processed with respect to the stage.
According to the embodiment of the present invention, it is not necessary to form a plurality of light-converging points in the depth direction of the object within the object to be processed repeatedly in the process of cutting or the like, so that the time required can be shortened .
Further, according to the embodiment of the present invention, the light-converging point formed at a deeper position from the surface on which the laser beam is incident is formed closer to the moving direction of the laser beam than the light-converging point formed at a shallower position, It is possible to prevent interference by the modified region.
1 schematically shows a laser processing apparatus according to an exemplary embodiment of the present invention.
2A to 2C show a laser machining method according to an embodiment of the present invention.
3A to 3D illustrate a laser processing method according to another embodiment of the present invention.
4A to 4C show a laser machining method according to another embodiment of the present invention.
Figure 5 shows a processed object processed according to an exemplary embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.
Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between . Also, when an element is referred to as "comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.
1 schematically shows a laser processing apparatus according to an exemplary embodiment of the present invention.
1, the laser processing apparatus according to the present embodiment includes a
The
The laser beam L emitted from the
The laser beam L having passed through the
The
The object to be processed 150 may be formed of a transparent medium through which the laser beam L can pass.
The object to be processed 150 is seated and fixed on the stage 160. The
In addition, even when the laser beam L is scanned to a desired shape using the
Hereinafter, a process of cutting the
2A to 2C show a laser machining method according to an embodiment of the present invention.
2A shows a state in which the laser beam emitted from the laser processing apparatus is divided into a plurality of laser beams L1 and L2 to form first and second light-converging points P1 and P2 inside the object to be processed 250, 1 and the second light-converging points P1 and P2 move.
Referring to FIG. 2A, the object to be processed 250 is first prepared. The object to be processed 250 may be formed of a transparent medium through which the laser beam L can pass.
The first and
The curvature of the
The first and second laser beams L1 and L2 are transmitted through the object to be processed 250 to form first and second light-converging points P1 and P2, respectively. The focal length of the
The
As described above, as the first and second light-converging points P1 and P2 are formed in the
2B is a sectional view taken along the line I-I 'in FIG. 2A.
2B, when the first and second light-converging points P1 and P2 are formed at different depths within the object to be processed 250 as shown in FIG. 2A, the first and second light- P1 and P2 relatively move along the line along which the work is to be performed. Accordingly, the first and second light-converging points P1 and P2 move in a certain direction (i.e., the direction opposite to the moving direction of the object to be processed). The movement of the first and second light-converging points P1 and P2 can be controlled by driving the scanner (130 in FIG. 1). On the other hand, the movement of the first and second light-converging points P1 and P2 can be controlled also by the movement of the stage (160 in Fig. 1) on which the
In this process, in accordance with the movement of the first and second light-converging points P1 and P2,
In the above embodiment, the laser processing method and the laser processing apparatus are described with the two condensing points P1 and P2 having different forming depths from the two
According to the embodiment, the object to be processed 250 is formed by forming a plurality of light-converging points P1 and P2 at different depths within the object to be processed 250, Therefore, the time required can be shortened. The light-converging point P2 formed at a deeper position from the plane on which the laser beams L1 and L2 are incident is shorter than the light-converging point P1 formed at a shallower position by the laser beams L1 and L2 at the line to be processed S, The second light-converging point P2 at the time of processing the
3A to 3D illustrate a laser processing method according to another embodiment of the present invention.
3A shows a state in which the laser beam emitted from the laser processing apparatus is divided into a plurality of laser beams L1 ', L2', and L3 'to form first, second, and third light-converging points P1' The first, second and third light-converging points P1 ', P2' and P3 'move in the state where the light-converging points P2' and P3 'are formed.
Referring to FIG. 3A, the diffractive
The structure of the diffraction
Referring again to FIG. 3A, the first, second and third laser beams L1 ', L2', and L3 'having passed through the diffraction
Further, the second light-converging point P2 'is located on the side of the movement of the laser beam in the movement direction of the laser beam in the line S to be processed and the first light-converging point P1' The position and shape of the diffractive
As the first, second and third light-converging points P1 ', P2' and P3 'are formed in the
3C is a sectional view taken along line II-II 'in FIG. 3A.
Referring to FIG. 3C, the first, second and third light-converging points P1 ', P2' and P3 'are formed at different depths in the interior of the
In this process, in accordance with the movement of the first, second and third light-converging points P1 ', P2' and P3 ',
In the above embodiment, the laser beam is divided into three by using the diffraction
According to the embodiment, a plurality of light-converging points P1 'and P2' P3 'are formed at different depths within the object to be processed 350 to process the
4A to 4B show a laser processing method according to another embodiment of the present invention.
4A shows a state in which the laser beam emitted from the laser processing apparatus is divided into a plurality of laser beams L1 ", L2", and L3 ", and the first, second, and third light-converging points P1" Second, and third light-converging points P1 ", P2 ", and P3 "
Referring to FIG. 4A, the
The
The
As described above, since the first, second and third light-converging points P1 ", P2" and P3 "are formed in the
4B is a cross-sectional view taken along line III-III 'of FIG. 4A.
4B, when the first, second, and third light-converging points P1 ", P2", and P3 "are formed at different depths in the interior of the
In this process, in accordance with the movement of the first, second and third light-converging points P1 ", P2" and P3 ", the
In the above embodiment, the laser beam is divided into three parts using the
According to this embodiment, a plurality of light-converging points P1 " and P2 " P3 " are formed at different depths in the object to be processed 450 to process the
Figure 5 illustrates a processed
5, crack
It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.
The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.
110 ... Laser
130 ...
150, 150, 150, 250, 350, 450,
160 ... Stage L ... Laser beam
L1, L1 'L1 "... First laser beam L2, L2'L2" ... The second laser beam L3, L3 'L3 "... the third laser beam P1, P1'P1" ... The first light-converging point P2, P2 'P2 ", the second light-converging point P3, P3'P3" The third light-converging point S ... Line to be processed 10 ... The
211, 212, 311, 312, 313, 411, 412, 413 ... Crack heat
170 ... Diffractive
172 ... Surface of
181 ... The first
183 ... The third curved surface
Claims (19)
Dividing the laser beam into a plurality of laser beams;
Transmitting the plurality of divided laser beams to the object to form light-converging points at different depths; And
And moving the laser beam relatively to the stage along a line to be machined to machine the object,
Converging point formed at a deeper position from the surface on which the laser beam is incident is formed closer to the moving direction of the laser beam in the line along which the laser beam is to be machined than a light-converging point formed at a shallower position.
Wherein dividing the laser beam into a plurality of laser beams comprises passing the laser beams through a plurality of lenses having different focal distances from each other to divide the laser beam.
Wherein the plurality of lenses has a focal length greater than a lens positioned in a direction of movement of the laser beam, the lens being positioned in a direction opposite to the direction of movement of the laser beam.
Wherein dividing the laser beam into a plurality of laser beams comprises passing the laser beam through a diffractive optical element lens to divide the laser beam.
Wherein the step of moving the laser beam relative to the stage along the line to be machined to process the object comprises moving the stage or scanning the laser beam to process the object.
Wherein the object to be processed is a transparent medium.
Passing a laser beam through a spherical lens having a plurality of curved surfaces to divide the laser beam into a plurality of laser beams having different focal lengths;
Transmitting the plurality of divided laser beams to the object to form light-converging points at different depths; And
And moving the laser beam relative to the stage along a line to be machined to machine the object to be processed.
Wherein the plurality of curved surfaces of the spherical lens have different focal lengths.
Wherein the step of moving the laser beam relative to the stage along the line to be machined to process the object comprises moving the stage or scanning the laser beam to process the object.
A laser light source for emitting a laser beam;
And an optical system for dividing the laser beam into a plurality of laser beams and forming light-converging points at different depths of the object,
Converging point formed at a deeper position from the surface of the object to be processed on which the laser beam is incident is formed closer to the moving direction of the laser beam on a line to be processed than a light-converging point formed at a shallower position.
Wherein the optical system includes a plurality of lenses having different focal distances from each other.
Wherein the plurality of lenses has a focal length greater than that of a lens positioned in a moving direction of the laser beam, the lens being positioned in a direction opposite to the moving direction of the laser beam.
Wherein the optical system includes a diffractive optical element lens.
Wherein the stage relatively moves relative to the laser beam to machine the object.
And a scanner for moving the laser beam relative to the stage along the line to be machined.
A laser light source for emitting a laser beam;
And a spherical lens having a plurality of curved surfaces for dividing the laser beam into a plurality of laser beams and forming light-converging points at different depths of the object,
Wherein the spherical lens is formed of a plurality of curved surfaces having different focal lengths.
Wherein the plurality of curved surfaces of the spherical lens have different focal lengths.
Wherein the stage relatively moves relative to the laser beam to machine the object.
Further comprising a scanner for relatively moving the laser beam along the line to be processed with respect to the stage.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020150149730A KR20170048969A (en) | 2015-10-27 | 2015-10-27 | Laser processing method and laser processing apparatus using multi focusing |
PCT/KR2016/010232 WO2017073907A1 (en) | 2015-10-27 | 2016-09-12 | Laser processing method and laser processing device, which use multiple focuses |
TW105130261A TW201714694A (en) | 2015-10-27 | 2016-09-20 | Laser processing method and laser processing apparatus using multi focusing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150149730A KR20170048969A (en) | 2015-10-27 | 2015-10-27 | Laser processing method and laser processing apparatus using multi focusing |
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KR20170048969A true KR20170048969A (en) | 2017-05-10 |
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KR1020150149730A KR20170048969A (en) | 2015-10-27 | 2015-10-27 | Laser processing method and laser processing apparatus using multi focusing |
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KR (1) | KR20170048969A (en) |
TW (1) | TW201714694A (en) |
WO (1) | WO2017073907A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20210123634A (en) * | 2020-04-03 | 2021-10-14 | 한국기계연구원 | Cutter of flexible substrate for battery |
Families Citing this family (4)
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DE102021108505A1 (en) | 2021-02-02 | 2022-08-04 | Trumpf Laser- Und Systemtechnik Gmbh | Device and method for laser machining a workpiece |
DE102021108509A1 (en) | 2021-02-02 | 2022-08-04 | Trumpf Laser- Und Systemtechnik Gmbh | Device and method for laser machining a workpiece |
DE102022204685B3 (en) | 2022-05-13 | 2023-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Optics for generating a linear focus, device and method for machining a workpiece |
DE102022204688B3 (en) | 2022-05-13 | 2023-09-07 | Carl Zeiss Smt Gmbh | Device for focusing a beam of photons into a material, corresponding method and computer program |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2798223B2 (en) * | 1991-05-22 | 1998-09-17 | 松下電工株式会社 | Laser cutting method |
JP2000005892A (en) * | 1998-06-25 | 2000-01-11 | Advanced Materials Processing Inst Kinki Japan | Laser processing |
KR100824962B1 (en) * | 2006-10-25 | 2008-04-28 | 주식회사 코윈디에스티 | Apparatus and method for cutting substrate using ultrafast frequency laser |
KR101217698B1 (en) * | 2010-08-16 | 2013-01-02 | 주식회사 이오테크닉스 | Laser processing method and laser processing apparatus using sequential multi-focusing |
KR101232008B1 (en) * | 2010-11-29 | 2013-02-08 | 한국과학기술원 | The depth of the modified cutting device through a combination of characteristics |
-
2015
- 2015-10-27 KR KR1020150149730A patent/KR20170048969A/en not_active Application Discontinuation
-
2016
- 2016-09-12 WO PCT/KR2016/010232 patent/WO2017073907A1/en active Application Filing
- 2016-09-20 TW TW105130261A patent/TW201714694A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20210123634A (en) * | 2020-04-03 | 2021-10-14 | 한국기계연구원 | Cutter of flexible substrate for battery |
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TW201714694A (en) | 2017-05-01 |
WO2017073907A1 (en) | 2017-05-04 |
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