KR20170010889A - Taking Off and Landing Approach Lighting Apparatus for Airport Flight - Google Patents

Abstract

The present invention relates to a track light, embedded in an airport runway, and, more specifically, relates to a track light using a power-saving semiconductor light source satisfying a variety of requirements for the track light for an airport runway. In order to achieve the technological objective, the present invention includes: an LED light source for visible rays; an infrared light source by a semiconductor laser element generating a beam pattern required for the track light; and a lens attached to the inside or outer upper part of the semiconductor laser element in order to accurately adjust a beam pattern range required for the track light for an airport runway. All of the components are embedded in standardized lighting equipment (PAR38 or PAR56). As such, the present invention is capable of providing the track light for an airport runway with the power-saving semiconductor light source satisfying a variety of requirements for the track light.

Description

{Taking Off and Landing Approach Lighting Apparatus for Airport Flight}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an induction lamp purchased in an airport runway to assist in taking-off and landing of an aircraft, and more particularly, to a power-saving semiconductor runway airport runway guide lamp that satisfies various requirements required for an airport runway takeoff and landing light.

A guide light is used to help take-off and landing of an aircraft during take-off and landing of an aircraft. Traditionally, a runway guide light according to the prior art uses a light source. In such a light source, visible light spectrum component and infrared light spectrum component are simultaneously emitted, When the weather conditions are good at take-off and landing, the pilot uses the visible light spectrum to try and make landing and landing adjustments while watching the pilot directly. When the weather conditions deteriorate, the pilot drives the infrared camera in the cockpit and releases The infrared ray is detected and the takeoff and landing is carried out.

In recent years, however, the need for an energy-efficient LED light source has led to the need for an induction lamp. However, energy-efficient LEDs (eg, white light LEDs, green light LEDs) The infrared wavelength band is hardly emitted and thus it is difficult to put it into practical use.

In consideration of these disadvantages, recently, in the joint research between the National Institute of the United States of America and the State University, it has succeeded in generating infrared rays that can be detected by the infrared camera by heating the new material heat source to about 600 to 900 degrees Celsius, However, many problems such as the development of high-temperature heating insulation materials and relatively high power consumption have not been solved yet, and thus, they have not been applied to the field.

SUMMARY OF THE INVENTION In view of the above problems of the prior art, the present invention provides an energy-efficient airport runway guide lamp that satisfies various requirements required for an airport runway guide lamp.

In order to accomplish the above object, the present invention provides an induction lamp for an airport runway, comprising: an LED light source for visible light; A light source for infrared rays by a semiconductor laser element which generates a beam pattern required in airport guidance and the like; And a lens attached to the inside or outside of the semiconductor laser device so as to match a beam pattern range required in an airport runway guidance or the like.

By using the present invention, it becomes possible to provide a power-saving type semiconductor light source airport runway guide lamp that satisfies various requirements required for an airport runway guide lamp.

1 shows a beam divergence form of a general side-emitting semiconductor laser.
2 shows a beam divergence pattern when a cylindrical lens is applied to a general side-emitting semiconductor laser.
Fig. 3 shows the structure of a side-emitting semiconductor laser with a lens according to the present invention.
FIG. 4 shows a beam divergence pattern of a general Vicell.
FIG. 5 shows a beam divergence pattern when a beam shaping lens is applied to a general Vicell according to the present invention.
6 shows a structure of a vicell array chip package with a lens according to the present invention.
7 is a first embodiment of a lamp structure of an airport runway guide lamp according to the present invention.
8 is a second embodiment of a lamp structure of an airport runway guide lamp according to the present invention.
9 is a third embodiment of the lamp structure of an airport runway guide lamp according to the present invention.
10 is a fourth embodiment of a lamp structure of an airport runway guide lamp according to the present invention.

First, the essential requirements required for an airport runway guide lamp using a power-saving semiconductor light source will be described.

1. The airport runway guide light must emit visible light and infrared light simultaneously as a light wavelength component.

2. The light distribution pattern when viewed from the runway in the air should be such that both the illuminated beam coverage and the optical signal intensity within the irradiated area can be detected by the control station and the cockpit coordinator in the control system.

3. Meet the energy consumption requirements (preferably less than 30 W, preferentially less than 45 W) required by the United States Federal Aviation Administration (FAA).

In addition to these essential requirements, in addition to the requirements of the luminaire, the size of the lamps for the airport runway lights (lamps) of PAR-38 (diameter 4.75 inches, about 120 mm) or PAR-56 (diameter 7 inches, about 177 mm) Lt; / RTI >

On the other hand, the US Federal Aviation Administration (FAA), when the camera sensor using 1300 ~ 2400 nm spectral range infrared sensor is required to be detectable and the eye safety problem due to laser straightness is satisfied, the laser diode is used as an infrared light source It is defined as usable.

Accordingly, the present invention provides an airport runway guide lamp that satisfies the above requirements by using a semiconductor light source for infrared rays having high energy efficiency and excellent optical characteristics, and a lens for matching a required beam pattern to the LED for visible light .

That is, in the inventive lighting device, LED light sources for visible light (for example, white light LEDs and green light LEDs) instead of the conventional light sources used for the white steady burning lamp (PAR-38) or the green threshold lamp In addition, a laser using a semiconductor is used as an infrared light source which is hardly emitted from the LED light source, and a lens is attached to the upper part of the semiconductor laser in order to precisely match a beam pattern range required in airport guidance, In order to satisfy the various conditions of the guidance light required by the user.

As the semiconductor laser light source for infrared rays usable in the present invention, for example, a surface emitting semiconductor laser or an edge emitting semiconductor laser can be used, and it is most preferably used among surface emitting semiconductor lasers A VCSEL (Vertical Cavity Surface-Emitting Laser), that is, a VCSEL array in which InAlGaAs, InGaAs, InAlAs, InGaAsP, GaInAsSb, and InSb are applied to a semiconductor InP base of a group III-V system, Emitting semiconductor laser diode chip package that uses mid-high levels using similar semiconductor materials.

As a result, in order to satisfy the optical power condition, the beam pattern, and the driving power condition in the infrared region required in the runway guidance demanded by the Federal Aviation Administration, in the case of the surface light emission, the transmission type lens Or a light source having a structure in which a lens is attached to a semiconductor laser diode is used in the case of side emission, or a light source having a structure in which a lens is attached to a semiconductor laser diode is used.

Meanwhile, a laser having a collimation lens applied to a general laser or a semiconductor laser has a high power density per unit area even at a long distance because of its good linearity. However, when a beam is shaped by applying a lens to a lateral emission laser diode, When a certain distance is propagated with FWHM (Full Width Half Maximum) of about 10 degrees, the power density is significantly lowered. For example, if the linearity is good general laser having a power density of 1 mW / cm ² il when 100 m 10 Fig semiconductor laser light source of the FWHM beam in the propagation distance, the area of the FWHM power about 1,000 m ² and the unit cm ² per Since the power density drops sharply to less than 1/10 ⁷ (10 millionths), there is no problem with eye-safe for airport officials and pilots.

Now, let's look at this in the more realistic real-world working area, ie with shorter distances and narrower beam divergence angles required by the Federal Aviation Administration. At this time, the same energy density logic will be applied when the beam divergence angles of both the side-emission laser diode and the Vicell are similar.

That is, assuming that the laser power has an FWHM beam divergence angle of +/- 8 ° to 1 W, the beam area area at a propagation distance of about 4 m is about 10,000 cm ² , Is about 0.1 mW / cm < ² >

Ultimately, this is not only a very small value of about 1/10 of the maximum permissible exposure (MPE) value defined for the visual acuity protection condition at a wavelength of 1550 nm, but also about 1 mW, is because normal 0.39 cm ² because it is the optical power entering the retina of the eye is 39% of the value (0.1 mW / cm ²⁾ calculation on the optical power actually entering the retina is even smaller, airport personnel, and the eyes of the pilot Eye-safe. ≪ / RTI > In addition, installation and maintenance of lighting apparatus at airports will ensure that the eye safety that can occur during work can be further assured by the use of protective eyewear by people with highly trained licenses .

Meanwhile, since the beam divergence angle is circular symmetric by maintaining a high optical efficiency and an appropriate optical power, particularly a surface light emitting structure, the FWHM is maintained at about 10 degrees, Or the like, and is easily sensed by an infrared camera.

In addition, if the beam pattern condition required for the control tower and the pilot is 8 degrees according to the airport conditions, the beam emitted from the big cell is circularly symmetric even if the FWHM of the beam from the general vixel is about 10 degrees, This requirement can easily be met by constructing the array under one condition and applying the appropriate transmission lens to easily control the required beam pattern.

However, depending on the structure and size of the active layer region of the chip, the side-emission laser diode generally emits infrared rays with a divergence angle of about 8 to 15 degrees in the horizontal direction and about 25 to 45 degrees in the vertical direction, When the beam pattern conditions required for the control tower and the pilot are about 8 degrees in both the vertical and horizontal directions, a cylindrical lens of a refractive optical system is attached to the front of the side-emission laser diode to perform beam shaping, It can be controlled in the form of divergence angle of about 8 degrees required by US aviation agency.

Semiconductor laser light sources such as a Vicell or a side-emission laser diode are far superior in terms of reliability, lifetime characteristics, power consumption, and size to conventional thermal light sources. Such semiconductor laser light sources are packaged in an appropriate array and chip size, (Such as white light LEDs, green light LEDs) and power supplies as well as the PAR-38 or PAR-56 luminaire, the infrared wavelength band required by the FAA Power consumption and small size are both possible.

On the other hand, documents issued by the FAA, the most widely used document in the United States, require a beam divergence angle of about 8 degrees in the case of infrared rays, but a circular symmetric beam in the case of visible light LED light sources (FWHM) should be about +/- 4 to 8 degrees for the divergence angle. The visible light LED has a Lambertian beam pattern with a half-width of about 120 degrees without a lens, but it is about 4 to 10 The half-width lens is widely known to be commercialized (Any Casting in Korea or Narrow Beam Angle lens in Taiwan's LED Link).

Therefore, in the following, a method of precisely aligning a beam pattern required for airport guidance by attaching a lens to the upper side, for example, a side-emission laser diode and a big cell array chip package, which are infrared semiconductor lasers, will be described in detail.

As shown in FIG. 1, the beam emitted from the junction 2 of the side-emitting semiconductor laser 1 is slightly different depending on the structure and size of the active layer, A beam pattern is generated at a divergence angle of about 15 degrees and a divergence angle of about 25 to 45 degrees at a half width in the vertical direction.

In order to bring it to a circular symmetry required in an airport induction and the like and to have a half width of about +/- 8 degrees in both horizontal and vertical directions, in the present invention, beam shaping is performed using a cylindrical lens 3 as shown in FIG. 2 , And the horizontal / vertical half widths are all +/- 8 degrees.

3 shows the outline of the side-emitting semiconductor laser to which the lens is attached, the cylindrical lens 3 is attached to the laser die / sub-mount upper part 4. [

4, the beam emitted from the junction 5 of the vixel 4 is a circularly symmetric beam and has a half-width divergence angle of about 10 degrees .

As shown in FIG. 5, a beam shaping lens 6 is attached to the front of the vixel 4 so as to have a half-width divergence angle of about +/- 8 degrees, Make the divergence angle. Here, since the divergence angle of about 10 degrees, which is the circular symmetry of the beam emitted from the junction 5 of the vixel 4, is made to be a divergent angle which is slightly reduced to about 4 to 8 degrees required by the airport guidance, Has a circular symmetric structure much simpler than the lens 3 for the side-emitting semiconductor laser.

Now, since the side-emitting semiconductor laser is widely used for optical communication and measurement, and a pre-used optical power applicable to the present invention is also output by a single chip, and a refracting optical system cylinder lens for shaping has already been developed and widely known, A description of a specific internal structure for a possible side light emitting semiconductor laser is omitted, and a method of making a big cell array chip package used as a big cell light source for infrared rays in the present invention will be described below with reference to the drawings.

In order to simultaneously satisfy the optical power characteristic range (eye safety + infrared camera detection) required for airport guidance and the like and the beam pattern condition, the Vicell array structure used in the present invention has the same semiconductor device fabrication And an array chip (11) for forming an array structure through a rectangular array mask formed by repeating the structure of the Vixel single chip (15) by 5 x 5 to 30 x 30 using the above process, (11) can be used in the form of a big cell array chip package which is mounted in a TO can (12).

The array chip 11 has a structure in which the same single device is repeated, and all of the semiconductor processes are manufactured through one single chip fabrication, array chip fabrication, or almost the same process, except for the mask in the process.

A glass window 13 for protecting the array chip 11 while transmitting infrared light is provided on the upper portion of the big cell array chip package and a glass window 13 and an array chip 11 (TO Can) type in which a lens (16) is attached to the upper part of the array chip (11), and cooling is performed by a TEC (Thermo Electric Cooler) However, if the optical output of the big cell array provides the necessary output for the induction, when driving without the TEC according to the airport situation, the guide lamp can be constructed with the TEC-can type package without TEC.

In building the lamp of the present invention, a hybrid type module in which an infrared semiconductor vixel array chip package is installed together with a visible light LED package is mounted on the same PCB on the same heat sink to form the same lamp mechanism (PAR-38 Or PAR-56). It is also possible to attach the adaptive heat sink separately to the Vicell array chip package using a thermal grease or a thermal pad, It is also possible to use a screw or a clamp to fix the heat sink to the same PCB or the same FR4 PCB.

In addition, the big cell array chip 11 may not be a rectangular array as shown in FIG. 6, and various structures are possible. For example, instead of a 10 x 10 square array structure, a 9 x 11 rectangular array structure is also possible.

Next, a method of arranging an LED and a semiconductor laser (for example, a side-emitting semiconductor laser or a big cell array chip package) in an airport induction lamp according to the present invention will be described.

Considering the required light output (preferably about 0.5 W of pure optical output) and the condition of the beam pattern, the LED is placed first in the metal PCB in the space of PAR-38 and PAR-56, A laser is arranged and an FR4 PCB is mounted on an upper portion of a substrate having a good thermal conductivity using an appropriate TIM (Thermal Interface Material) material, an LED package for visible light and a semiconductor laser package for infrared Will be placed within a given PAR-38, PAR-56 appliance.

For example, as shown in FIG. 7, it is also possible that the LEDs 18 for visible light are arranged in a columnar shape on the metal PCB 17 and a single infrared semiconductor laser 19 is arranged on the FR4 PCB 20 in the center 8, the LEDs 18 may be disposed on one side and the semiconductor laser 19 may be disposed on the FR4 PCB 20 on the other side. As shown in FIGS. 9 and 10, two or more but less than ten The semiconductor lasers 19 are arranged on the FR4 PCB 20 in the center (FIG. 9) or the semiconductor lasers 19 are arranged on the FR4 PCB 20 It is also possible to arrange them collectively (Fig. 10) (using two packages in Figs. 9 and 10).

While the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

For example, in the portion described for the above-mentioned Big-cell array chip package, the same applies to the case of the side-emission laser diode from the thio-can type-related substrate to the fixing-related substrate using a screw or a clamp.

Claims (13)

In the takeoff and landing light of an airport runway,
An LED package including LEDs emitting visible light;
A lens for an LED attached to an upper portion of the LED to precisely match a beam pattern range required for a visible light source in an airport runway take off and landing induction,
A semiconductor laser package including semiconductor laser elements emitting infrared rays in a range of 1300 to 2400 nm;
A lens for a semiconductor laser package attached to an upper portion of the semiconductor laser package in order to precisely match a beam pattern range required for an infrared light source in an airport runway takeoff and landing induction;
A substrate for a visible light ray on which the LED package for visible light is disposed;
An infrared ray substrate on which the infrared semiconductor laser package is disposed;
A power supply for supplying power to the LED package for visible light and the infrared semiconductor laser package;
A substrate for visible light, a substrate for infrared rays, and an apparatus in which the power supply device is disposed,
Wherein the infrared semiconductor laser package comprises: a glass window for protecting the infrared semiconductor laser package while transmitting infrared light of the infrared semiconductor package; and a lens for sealing the glass window, the lens for the semiconductor laser package, Wherein the laser package is embedded in a Tiocan-type package having a stem mounted on the upper part thereof. The method according to claim 1,
Wherein the semiconductor laser device is a side-emission laser diode. The method according to claim 1,
Wherein the semiconductor laser device is a vixel array chip package. The method according to claim 1,
Wherein the LED is a white light LED or a green light LED. The method according to claim 1,
Wherein said mechanism is a PAR-38 mechanism. The method according to claim 1,
Wherein said device is a PAR-56 device. The method according to claim 1,
Wherein the substrate for visible light is a metal PCB. The method according to claim 1,
Wherein the semiconductor laser package performs TEC cooling. The method according to claim 1,
Wherein the visible light ray substrate and the infrared ray substrate are the same PCB. The method according to claim 1,
Wherein the adaptive heat sink is separately attached to the infrared semiconductor laser package using thermal grease or a thermal pad. 8. The method of claim 7,
Wherein the substrate for infrared rays is an FR4 PCB, and the FR4 PCB is attached to an upper surface of the metal PCB. The method according to claim 1,
At least one infrared semiconductor laser package is disposed on the infrared light-emitting substrate, and the LED packages for visible light are arranged on the substrate for visible light around the infrared light-emitting substrate Of the airport runway. The method according to claim 1,
Characterized in that the infrared-use substrate is disposed on one side of the substrate for visible light, at least one infrared-ray semiconductor laser package is arranged on the infrared-ray substrate, and the LED packages for visible light are arranged on the other- Take off landing light of airport runway.

Images