KR20170003298A - Organic light emitting diode display and manufacturing method of the same - Google Patents

Abstract

An organic light emitting device disposed on a hybrid substrate capable of a roll-to-roll process capable of disposing a driving device including an oxide semiconductor active layer according to an embodiment of the present invention and having flexibility, An organic electroluminescent display device is provided. The common electrode of the organic light emitting device is electrically connected to the hybrid substrate to supply a uniform current to the organic light emitting device. In addition, the hybrid substrate minimizes the diffusion of residual diffusible hydrogen into the oxide semiconductor layer by the hydrogen storage metal, thereby minimizing the influence of the hydrogen of the driving element.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device and a method of manufacturing the OLED display device.

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device capable of supplying a uniform current to an organic light emitting device in order to maintain a uniform luminance in an organic light emitting device while minimizing damage to a driving device by hydrogen And a method of manufacturing the same.

The organic light emitting display device OLED is a self-emissive display device, unlike a liquid crystal display device (LCD), a separate light source is not necessary, so that it can be manufactured in a light and thin shape. In addition, the organic light emitting display device is not only advantageous in terms of power consumption due to low voltage driving, but also has excellent color rendering, response speed, viewing angle, and contrast ratio (CR) and is being studied as a next generation display.

The organic light emitting display device includes an organic light emitting device including an organic light emitting layer to constitute a pixel. The organic light emitting layer may be oxidized to moisture and oxygen, resulting in defects such as a dark spot.

In order to minimize the influence of moisture and oxygen, the organic light emitting device has a thin film protective layer using organic and inorganic materials disposed on the top. Since the organic light emitting layer is vulnerable to heat, Lt; 0 > C.

In this process, residual diffusible hydrogen remains in the organic light emitting display device, and hydrogen can diffuse into the display device over time.

The residual diffusive hydrogen can affect the driving element using the oxide semiconductor as the active layer, and can reduce the oxide semiconductor.

If the oxide semiconductor is reduced, the properties as semiconductors may be lost. As a result, the driving device can not exhibit its function, and as a result, defects such as strong spots in the organic light emitting display device may occur.

On the other hand, in the organic light emitting display device, a plurality of pixels are disposed on a substrate, and light is emitted by electrons and holes injected into the organic light emitting layer disposed in each pixel, and the organic light emitting layer includes a plurality of driving elements Lt; / RTI >

In the organic light emitting display device, it is important to supply a uniform current for uniform light emission of each pixel. However, depending on the distance to be supplied with power, and in a large display device, the central portion of the display device may not be supplied with a uniform current due to problems such as electrical resistance of the electrodes, as compared with the peripheral portion.

Each pixel of the organic light emitting display device includes, in addition to the organic light emitting device including the organic light emitting layer, data lines and gate lines crossing each other and a driving device having a connection structure with the data lines.

An oxide semiconductor having a higher electron mobility and a lower manufacturing cost than a polysilicon thin film transistor having a semiconductor layer made of polysilicon and having a relatively lower manufacturing cost than an amorphous thin film transistor having a semiconductor layer made of amorphous silicon as a driving element, Active research is being conducted on the oxide thin film transistor driving device that constitutes the organic EL device.

In addition, due to the enlargement of the organic light emitting display device, a lot of researches for supplying a uniform current are proceeding. For example, researches such as the provision of an auxiliary electrode have been going on.

[Related Technical Literature]

[Patent Literature]

1. Organic electroluminescence display device and method of manufacturing the same (Patent Application No. 10-2013-0071823)

The organic light emitting display device arranges a plurality of pixels including an organic light emitting device to display an image or the like desired by a user by emitting light from the organic light emitting device.

The organic light emitting device includes two electrodes and an organic layer. At this time, the organic layer includes an organic light emitting layer and may further include a hole injecting layer, a hole transporting layer, an electron transporting layer, an electron injecting layer, etc. for smooth excition formation.

One of the two electrodes may be a pixel electrode connected to the driving element and the other may be a common electrode.

In the upward emission type organic light emitting display device (top emission), the common electrode generally uses a transparent electrode, and since the transparent electrode has a high resistance value, the organic light emitting display device The supplied current becomes lower due to an increase in electrical resistance of the common electrode.

In order to overcome the lowered luminance in the central portion, the auxiliary electrode may be disposed in the organic light emitting display device and the common electrode and the auxiliary electrode may be connected to reduce the electrical resistance of the central portion of the panel.

However, in recent years, a display device has been required to have a high-resolution function together with a large size. Accordingly, if an auxiliary electrode is formed in an organic light emitting display device, the aperture ratio is lowered due to a restriction on the size of a pixel.

Further, in order to seal the organic light emitting element and protect it from oxygen and moisture, a technique of disposing a thin film sealing layer, which alternately laminates an inorganic layer and an organic layer, on the organic light emitting element is used. SiNx, SiOx, SiON, AlOx, etc. are mainly used in consideration of mechanical strength, moisture permeability, ease of film formation, productivity and the like. PECVD and ALD methods are mainly used for the deposition method.

In the case of a thin film deposition process using a plasma, a considerable amount of hydrogen contained in the source gas generally remains in the thin film. Particularly, in the case of materials such as SiNx, SiO (N), and AlOx, which are used as a sealing layer to block moisture penetration, PECVD and ALD processes are used. Due to the thermal damage of the organic light emitting layer, Lt; RTI ID = 0.0 > 100 C < / RTI > so that more hydrogen and impurities remain. A certain amount of hydrogen remains in the case of the sealing layer for blocking penetration of moisture as well as the driving element protecting layer for protecting the driving element.

The hydrogen remaining in the thin films may diffuse as time elapses and may reduce the oxide semiconductor when reaching the active layer of the driving device. The reduction of the oxide semiconductor eventually causes a change in the electrical behavior of the driving element and affects the image to cause a stain or a luminance deviation.

Therefore, not only the problem caused by hydrogen in the thin film is a major cause of deteriorating the reliability of the organic light emitting display panel, but also the driving device including the oxide semiconductor is used in various products. Accordingly, the inventors of the present invention invented a new structure and method of an organic light emitting display device capable of minimizing defects of a driving device including an oxide semiconductor by hydrogen while supplying a uniform current to the organic light emitting device.

A solution according to an embodiment of the present invention provides a large-sized and high-resolution organic light emitting display device and a method of manufacturing the same by connecting a conductive hybrid substrate and a common electrode of an organic light emitting diode to supply a uniform current to the organic light emitting diode will be.

Another object of the present invention is to provide an organic light emitting display device capable of minimizing the influence of an oxide semiconductor of a driving device due to residual diffusive hydrogen by using a hybrid substrate capable of storing and discharging hydrogen and a method of manufacturing the same .

The solutions according to the embodiments of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

There is provided an organic light emitting display device in which a hybrid substrate according to an embodiment of the present invention is disposed. A driving element and an organic light emitting element are disposed on a hybrid substrate having a conductive property capable of placing a driving element including an oxide semiconductor active layer and having flexibility and capable of a roll-to-roll process. The common electrode included in the organic light emitting device is electrically connected to the hybrid substrate to supply a uniform current to the organic light emitting device while minimizing the damage of the driving device due to hydrogen.

According to another aspect of the present invention, the hybrid substrate is characterized by including an insulating film.

According to another aspect of the present invention, the hybrid substrate is a functional substrate capable of maintaining semiconductor characteristics of an oxide semiconductor.

According to another aspect of the present invention, the hybrid substrate is formed of a hydrogen storage metal.

According to another aspect of the present invention, the hybrid substrate is characterized in that the hybrid substrate is made of Fe-Ni, Fe-Ti, La-Ti and Mg-Ni or an alloy thereof.

According to another aspect of the present invention, the oxide semiconductor is formed of an oxide semiconductor of the IGZO series.

According to another aspect of the present invention, the organic light emitting display device further includes a driving element protection layer and a flat layer disposed on the driving element.

According to another aspect of the present invention, the driving device protection layer and the flat layer include a connection electrode electrically connected to the hybrid substrate, a reverse taper structure is disposed on the flat layer, and the common electrode is opened by a reverse taper structure And is electrically connected to the connection electrode.

According to still another aspect of the present invention, the buffer layer, the driving device protection layer, and the flat layer include a contact hole and an undercut section for opening the hybrid substrate, and the common electrode and the hybrid substrate are connected in the contact hole and the undercut section .

According to another aspect of the present invention, the driving element includes a gate insulating film, and the contact hole is disposed including a gate insulating film.

According to another aspect of the present invention, an organic light emitting display device further includes an upper substrate facing the hybrid substrate and having a color filter and a black matrix disposed thereon.

A method of manufacturing an organic light emitting display device according to an embodiment of the present invention is provided. A method of manufacturing an organic light emitting display device includes forming a buffer layer on a hybrid substrate, forming a driving element on the buffer layer, forming a driving element protective layer and a flat layer on the driving element, Forming a structure, and forming an organic light emitting element on the flat layer, wherein forming the organic light emitting element includes forming a pixel electrode, an organic light emitting layer, and a common electrode, And each of the steps of forming the organic light emitting device includes forming a connection electrode so that the hybrid substrate and the common electrode are electrically connected to each other. Since the common electrode is electrically connected to the hybrid substrate and the hybrid substrate has conductivity, a uniform current can be supplied to the organic light emitting element by supplying a uniform current to the common electrode constituting the organic light emitting element through the hybrid substrate .

According to another aspect of the present invention, the step of forming the buffer layer includes a step of opening a part of the hybrid substrate, and the step of forming the driving element includes forming a first connecting electrode electrically connected to the hybrid substrate .

According to another aspect of the present invention, the step of forming the passivation layer and the flattening layer includes a step of opening the driving element and the first connecting electrode, and the step of forming the organic light emitting element includes connecting the driving element and the pixel electrode And forming a second connection electrode connected to the first connection electrode.

According to another aspect of the present invention, the step of forming the organic light emitting diode includes the steps of forming a common electrode so that the common electrode is electrically connected to a connection electrode defined as a first connection electrode and a second connection electrode at a lower portion of the reverse taper structure, The method comprising the steps of:

According to the embodiment of the present invention, by providing the conductive hybrid substrate, a uniform current can be supplied to the organic light emitting element to maintain the luminance of the organic light emitting display device uniformly.

Further, by using a hybrid substrate made of a hydrogen-storing metal, the driving element is protected from hydrogen, thereby improving the reliability of the organic light emitting display device.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

The scope of the claims is not limited by the matters described in the contents of the invention, as the contents of the invention described in the problems, the solutions to the problems and the effects to be solved do not specify essential features of the claims.

1 is a schematic cross-sectional view of an organic light emitting display device capable of supplying a uniform current to an organic light emitting device by connecting a conductive hybrid substrate and a common electrode according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of an organic light emitting display device according to the X region of FIG. 1 for explaining various connection relationships between a hybrid substrate and a common electrode according to an embodiment of the present invention.
3A to 3F are schematic cross-sectional views illustrating a method of manufacturing an OLED display panel having a hybrid substrate according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

In the case of a description of a temporal relationship, for example, if a temporal posterior relationship is described by 'after', 'after', 'after', 'before', etc., 'May not be contiguous unless it is used.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

Hereinafter, various configurations of an organic light emitting display device including a hybrid substrate according to an embodiment of the present invention and capable of minimizing the influence of hydrogen on a driving device while supplying a uniform current to the organic light emitting device will be described.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of an organic light emitting display device capable of supplying a uniform current to an organic light emitting device by connecting a conductive hybrid substrate and a common electrode according to an embodiment of the present invention.

1, an organic light emitting display device 100 includes a hybrid substrate 110, a buffer layer 111, a driving device 120, a connection electrode 130, a driving device protection layer 141, a flat layer 142, An organic light emitting device 150, a bank layer 160, a reverse taper structure 161, an adhesive layer 170, a color filter 181, a black matrix 182 and an upper substrate 190.

The hybrid substrate 110 may be made of Invar alloy, and the Fe-Ni based Invar material substrate may be used in electronic equipment with thermal expansion due to low thermal expansion coefficient due to heat. The hybrid substrate 110 may be made of Fe-Ti, La-Ti, Mg-Ni, or an alloy thereof, which is well known as a hydrogen-storing metal, in addition to an Fe-Ni-based alloy.

The hybrid substrate 110 further includes a buffer layer 111 for disposing the driving elements 120 on the hybrid substrate 110. The buffer layer 111 protects the organic light emitting diode 120 by minimizing penetration of oxygen and moisture into the organic light emitting diode 120 included in the organic light emitting diode display device 100, And may serve to insulate the hybrid substrate 110. The buffer layer 111 may have a multi-layered structure or a single layer of an organic material and an inorganic material.

The driving element 120 is disposed on the buffer layer 111. The driving element 120 shown in FIG. 1 includes a bottom gate type driving element in which the gate electrode 121 is located at the bottom, a top gate type driving element in which the gate electrode 121 is disposed at the top, Device.

The driving element 120 includes a gate electrode 121, a gate insulating film 122, an active layer 123, an etch stopper layer 124, and a source / drain electrode 125.

The active layer 123 may be an indium gallium zinc oxide (IGZO), a zinc tin oxide (ZTO), a zinc oxide (ZIO) oxide, or the like. ≪ / RTI >

The hybrid substrate 110 can minimize the diffusion of the residual diffusible hydrogen into the driving device 120 and thereby improve the reliability of the driving device 120. [

The driving element protection layer 141 and the flat layer 142 are disposed on the driving element 120. [ The driving element protection layer 141 and the flat layer 142 are arranged to open a part of the source / drain electrodes 125 of the driving element 120 and the driving element connection electrodes 154 are connected to the source / 125).

The organic light emitting diode 150 is disposed on the flat layer 142. The organic light emitting diode 150 emits light by injecting electrons and holes from the two electrodes into the organic light emitting layer 152 including an organic material. In order to form a smooth exciton, a hole injection layer, a hole transport layer, And may be a white organic light emitting layer or a red organic light emitting layer, a blue organic light emitting layer, and a green organic light emitting layer.

The organic light emitting diode 150 includes a pixel electrode 151 electrically connected to the driving element connection electrode 154, an organic light emitting layer 152, and a common electrode 153.

The pixel electrode 151 and the driving element connection electrode 154 may be made of the same material and the driving element connection electrode 154 may be an extended electrode of the pixel electrode 151.

The common electrode 153 may be an electrode made of a transparent conductive material such as ITO or IZO in the case of the organic light emitting display device 100 of the top emission type. In this case, since the transparent conductive material has a higher electrical resistance than the metal electrode, it is important to supply a uniform current to the common electrode 153 of the large-area organic light emitting display device 100.

The bank layer 160 is disposed on the flat layer 142 and the reverse tapered structure 161 is disposed. The reverse tapered structure 161 is disposed to open a part of the connection electrode 130 arranged to be electrically connected to the hybrid substrate 110 and the common electrode 153 and the connection electrode 130 of the organic light- Are electrically connected to each other.

The organic light emitting layer 152 and the common electrode 153 of the organic light emitting diode 150 have different step coverage so that the organic light emitting layer 152 is formed by the inverse tapered structure 161, And the common electrode 153 is connected to the connection electrode 130, which is opened in the process of being disposed.

The connection electrode 130 is arranged to be connected to the hybrid substrate 110. The buffer layer 111 and the gate insulating layer 122 disposed on the hybrid substrate 110 are arranged to open the hybrid substrate 110 and the opened hybrid substrate 110 is electrically connected to the first connection electrode 131 . The first connection electrode 131 may be an electrode having the same material as the gate electrode 121.

The driving element protection layer 141 and the flat layer 142 are arranged to open a part of the source / drain electrode 125 of the driving element 120 and to open a part of the first connection electrode 131. The second connection electrode 132 is disposed to be electrically connected to the opened first connection electrode 131 and the second connection electrode 132 is electrically connected to the pixel electrode 151 of the organic light- Lt; / RTI >

The upper substrate 190 having the color filter layer 181 and the black matrix layer 182 facing the hybrid substrate 110 may be disposed on the organic light emitting diode 150. [

The upper substrate 190 may include a touch electrode, and may be a glass or polyimide flexible substrate.

The hybrid substrate 110 is electrically connected to the connection electrode 130 and is connected to the common electrode 153 of the organic light emitting device 150 by the inverse taper structure 161 to be connected to the organic light emitting device 150 And supplies a uniform current. In addition, the hybrid substrate 110 minimizes the diffusion of the residual diffusing hydrogen into the driving device 120, thereby improving the reliability of the driving device while maintaining the uniform luminance of the organic light emitting display device 100 .

Further, it is possible to provide an organic light emitting display device 100 that can use a process such as a roll-to-roll process that can further mass-produce by using a metal-based hybrid substrate 110.

FIG. 2 is a schematic cross-sectional view of an organic light emitting display device according to the X region of FIG. 1 for explaining various connection relationships between a hybrid substrate and a common electrode according to an embodiment of the present invention.

2, a buffer layer 211, a gate insulating layer 222, a driving device protective layer 241, a flat layer 242, an organic light emitting layer 252, and a common electrode 253 are stacked on a hybrid substrate 210 And the disposed layers may be omitted if necessary or another layer may be further included.

2, the buffer layer 211, the gate insulating film 222, the driving device protection layer 241, and the flat layer 242, which are disposed on the hybrid substrate 210, The buffer layer 211 disposed adjacent to the hybrid substrate 210 and including the contact hole 233 may be arranged such that the contact hole 233 has an undercut 234 structure.

Since the organic light emitting layer 252 and the common electrode 233 have different step coverage and the common electrode 253 has higher step coverage than the organic light emitting layer 252, In the hole 233, the common electrode 253 is electrically connected to the hybrid substrate 210.

The hybrid substrate 110 and 210 may be connected to the common electrodes 153 and 253 using the reverse taper structure 161 described in FIG. 1, and the contact holes 233 The hybrid substrates 110 and 210 and the common electrodes 153 and 253 can have an electrical connection relationship. Accordingly, an organic light emitting display device 100 capable of supplying a uniform current to the common electrode 153 of the organic light emitting diode 150 through the hybrid substrates 110 and 210 can be provided.

3A to 3F are schematic cross-sectional views illustrating a method of manufacturing an OLED display panel having a hybrid substrate according to an embodiment of the present invention.

Referring to FIG. 3A, a buffer layer 311 is formed on a hybrid substrate 310. The buffer layer 311 is formed so as to open a part of the hybrid substrate 310 and the gate electrode 321 and the first connection electrode 331 are formed while the first connection electrode 331 is formed in the open region of the buffer layer 311 To be electrically connected to the hybrid substrate 310.

If the first connection electrode 331 and the gate electrode 321 are formed of the same material, the first connection electrode 331 and the gate electrode 321 can be formed at one time without any additional process.

This will be described with reference to FIG. 3B. A gate insulating film 322 is formed on the gate electrode 321 and an active layer 323, an ESL (etch stopper layer) 324 and a source / drain electrode 325 are formed to form a driving device 320.

The active layer 323 may be an oxide semiconductor layer and the ESL 324 prevents the active layer 323 from being etched together when etching the central portion of the source / drain electrode 325.

Next, referring to FIG. The driving element protection layer 341 and the flat layer 342 are formed to protect the driving element 320 from contamination or the like.

The driving element protection layer 341 and the flat layer 342 may be a single layer, and may be a plurality of layers each formed of a plurality of layers.

A part of the source / drain electrode 325 of the driving element 320 is formed to open when the driving element protection layer 341 and the flat layer 342 are formed and the first connection electrode is formed to open.

This will be described with reference to FIG. 3D. The pixel electrode 351 and the second connection electrode 322 are formed on the flat layer 342.

The pixel electrode 351 extends to be electrically connected to the source / drain electrode 325 of the driving device 320 to form a driving device connection electrode 354 and the second connection electrode 322 forms a connection electrode 333, respectively.

The connection electrode 330 including the first connection electrode 331 and the second connection electrode 332 is electrically connected to the hybrid substrate 310.

The pixel electrode 351, the driving element connection electrode 354, and the second connection electrode 332 can be formed at the same time without additional steps if they are made of the same material.

This will be described with reference to FIG. 3E. A bank layer 360 is formed on the flat layer 342 to form a reverse taper structure 361. The bank layer 360 and the reverse tapered structure 361 may be formed of the same material while the bank layer 360 is formed by opening the pixel electrode and the reverse tapered structure 361 may partially open the connection electrode 330 .

The organic light emitting layer 352 and the common electrode 353 are formed to form the organic light emitting device 350 so that the common electrode 353 is electrically connected to the connection electrode 330 from below the reverse tapered structure 361 .

Since the common electrode 353 has a higher step coverage than the organic light emitting layer 352, the organic light emitting layer 352 opens a part of the connection electrode 330 under the inverse taper structure 361, 353 are electrically connected to the connection electrode 330.

A protective layer (not shown) may be further formed on the organic light emitting diode 350. The organic light emitting diode 350 may have a single layer structure or a multi-layer structure.

This will be described with reference to FIG. 3F. An adhesive layer 370 is formed on the common electrode 353 and an upper substrate 390 opposed to the hybrid substrate 310 is bonded to form an organic light emitting display device 300.

The color filter layer 381 and the black matrix 382 are formed on the upper substrate 390 and then the color filter layer 381 and the black matrix 382 are bonded together using an adhesive layer 370 such as a resin.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be interpreted as being included in the scope of the present invention.

100: organic light emitting display device
110, 210 and 310: hybrid substrate
111, 211, 311: buffer layer
120, 320: Driving element
130, 330: connecting electrode
141, 241, 341: driving element protection layer
142, 242, 342: flat layer
150, 350: organic light emitting device
160, 360: bank layer
161, 361: Reverse tapered structure
170, 370: adhesive layer
181, 381: Color filter
182, 382: black matrix
190, 390: upper substrate

Claims (15)

An organic light emitting diode (OLED) display device including a hybrid substrate having a conductive property capable of disposing a driving element including an oxide semiconductor active layer and having flexibility characteristics and capable of a roll-to-roll process, and an organic light emitting element disposed on the hybrid substrate In this case,
Wherein the organic light emitting device includes a common electrode, and the hybrid substrate and the common electrode are electrically connected to each other to lower the electrical resistance of the common electrode. The method according to claim 1,
Wherein the hybrid substrate comprises an insulating film. The method according to claim 1,
Wherein the hybrid substrate is a functional substrate capable of maintaining semiconductor characteristics of the oxide semiconductor. The method of claim 3,
Wherein the hybrid substrate is made of a hydrogen-storing metal. The method of claim 3,
Wherein the hybrid substrate is made of Fe-Ni, Fe-Ti, La-Ti, and Mg-Ni or an alloy thereof. The method according to claim 1,
Wherein the oxide semiconductor is made of an oxide semiconductor of IGZO series. The method according to claim 1,
And a driving element protective layer and a flat layer disposed on the driving element. 8. The method of claim 7,
Wherein the driving element protection layer and the flat layer include connection electrodes electrically connected to the hybrid substrate,
A reverse taper structure is disposed on the flat layer,
Wherein the common electrode is electrically connected to the connection electrode opened by the reverse taper structure. 8. The method of claim 7,
Wherein the driving element protection layer and the flat layer include a contact hole and an undercut section for opening the hybrid substrate,
Wherein the common electrode and the hybrid substrate are connected in the contact hole and the undercut section. 10. The method of claim 9,
Wherein the driving element includes a gate insulating film,
And the contact hole is disposed to include the gate insulating layer. The method according to claim 1,
And an upper substrate facing the hybrid substrate and having a color filter and a black matrix disposed thereon. Forming a buffer layer on the hybrid substrate;
Forming a driving element on the buffer layer;
Forming a driving device protecting layer and a flat layer on the driving device;
Forming a reverse tapered structure on the planarizing layer; And
And forming an organic light emitting device on the flat layer,
The forming of the organic light emitting device includes forming a pixel electrode, an organic light emitting layer, and a common electrode,
Wherein the step of forming the driving element and the step of forming the organic light emitting element each include forming a connection electrode so that the hybrid substrate and the common electrode are electrically connected to each other. 13. The method of claim 12,
Wherein forming the buffer layer includes opening a portion of the hybrid substrate,
Wherein the step of forming the driving element includes forming a first connection electrode electrically connected to the hybrid substrate. 14. The method of claim 13,
Wherein forming the passivation layer and the flat layer includes opening the driving element and the first connection electrode,
Wherein the step of forming the organic light emitting diode comprises forming a second connection electrode connected to the driving electrode and the pixel electrode and connected to the first connection electrode. 15. The method of claim 14,
The forming of the organic light emitting diode may include forming the common electrode such that the common electrode is electrically connected to the connection electrode defined by the first connection electrode and the second connection electrode at a lower portion of the reverse taper structure Wherein the organic light emitting display device comprises a plurality of organic light emitting display devices.

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