KR20170002715U

KR20170002715U - Heating device for cooking

Info

Publication number: KR20170002715U
Application number: KR2020160000324U
Authority: KR
Inventors: 류도형; 박성환; 김보민; 하정민; 김은희
Original assignee: (주)세온
Priority date: 2016-01-20
Filing date: 2016-01-20
Publication date: 2017-07-31

Abstract

The present invention relates to a cooking appliance for cooking. According to an embodiment of the present invention, there is provided a heating device for cooking, comprising: a substrate on which a cooking container is mounted; A first heating portion including at least one of a highlight heating element, an induction heating element and a hot plate type heating element located on one side of the surface of the substrate opposite to the surface contacting with the cooking container; A second heat generating unit located on the other side of the opposite surface of the substrate and generating heat by an applied power source; And a power supply control unit for controlling power supply to the first heat generating unit and the second heat generating unit, wherein the second heat generating unit is stacked on the other side of the opposite surface, layer; And electrodes electrically connected to the planar heating layer.

Description

{Heating device for cooking}

The present invention relates to a cooking appliance for cooking, and more particularly to a cooking appliance using electricity.

Generally, there are induction type, highlight type, and hot plate type as heating devices for electric cooking. The induction method is a heating method by inducing a magnetic field by applying a high voltage to an electric coil and inducing magnetic field of a magnetic metal container provided in a region where the magnetic field is applied. On the other hand, the highlight method and the hot plate method are methods in which the container is heated by the heat of the resistance coil due to the application of electricity.

Such a cooking appliance for heating using electricity is convenient to handle and can perform a stable heating function. Therefore, a home heating appliance, for example, a device having a relatively high risk of using, such as a gas range, It is used as a means.

However, there is a limitation in that the induction heating apparatus for cooking has a high power consumption and must use a metal container of a magnetic substance, and the heating system for heating of the highlight type and the hot plate heat the container by heating the resistance coil, There is a problem that it falls. Therefore, development of a heating device for cooking which is excellent in energy efficiency is demanded without minimizing power consumption and restriction of a cooking container.

The technical problem to be solved by the present invention is to provide a heating appliance for cooking which is safe and highly efficient by using a surface heating layer.

According to an aspect of the present invention, there is provided a cooking apparatus for heating a cooking chamber, A first heating portion including at least one of a highlight heating element, an induction heating element and a hot plate type heating element located on one side of the surface of the substrate opposite to the surface contacting with the cooking container; A second heat generating unit located on the other side of the opposite surface of the substrate and generating heat by an applied power source; And a power supply control unit for controlling power supply to the first heat generating unit and the second heat generating unit, wherein the second heat generating unit is stacked on the other side of the opposite surface, layer; And electrodes electrically connected to the planar heating layer.

According to an embodiment, the substrate may be divided into a heating region generated by the first heating unit and a heating region generated by the second heating unit according to the power supply control of the power control unit.

In one embodiment, the planar heat generating layer is indium oxide (InO _2); Tin oxide (SnO2); Indium tin oxide (ITO); And zinc oxide (ZnO) as a main matrix, and a material in which the matrix is doped with a nonmetal, a metal, or a metalloid, or a mixture thereof.

In one embodiment, the second heating portion may further include a dielectric buffer layer between the substrate and the planar heating layer. The second heating portion may further include a protection layer laminated on a surface to which the electrodes of the planar heating layer are connected.

In one embodiment, the planar heating layer may include at least one of a disk-shaped pattern, an annular pattern, and an annular labyrinth pattern. The planar heating layer may include a plurality of planar heating layers spaced apart from each other for differential heating of the substrate, and the electrodes may include a plurality of electrodes respectively allocated to the plurality of planar heating layers . The plane heating layer may be laminated so as to have a continuous thickness gradient on the substrate for differential heating of the substrate. The continuous thickness gradient may increase in thickness from the center of the cross section of the area heating layer to the edge direction.

In one embodiment, the sensor unit may further include a sensor unit for sensing whether the cooking container is positioned on the substrate on which the planar heating layer exists. The sensor unit may include at least one of a thermal sensor and a pressure sensor. In response to the detection result of the sensor unit, the power source control unit may apply power to the electrodes to generate heat of the second heat generating unit.

According to the embodiment of the present invention, a portion of the surface heating layer is applied to a cooking heater using electricity, so that the cooking vessel can be heated and kept at a low electric power regardless of the cooking vessel.

Further, by varying the pattern of the surface heating layer laminated on the substrate, the heating and heating effect of the cooking container according to the application can be obtained.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an upper structural view of a cooking heater according to an embodiment of the present invention; FIG.
FIG. 2 illustrates a side cross-sectional view according to one embodiment of the second heat generating portion shown in FIG.
FIGS. 3A through 3D illustrate various embodiments of a second heating unit stacked on a substrate according to the present invention. FIG.
Fig. 4 illustrates a side sectional view according to another embodiment of the second heating portion shown in Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Embodiments of the present invention are provided to more fully illustrate the present invention to those skilled in the art, and the following embodiments may be modified in various ways, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

In the following drawings, thickness and size of each layer are exaggerated for convenience and clarity of description, and the same reference numerals denote the same elements in the drawings. As used herein, the term "and / or" includes any and all combinations of any of the listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the inventive concept. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

In the following, embodiments of the present invention will be described with reference to cross-sectional views schematically illustrating ideal embodiments of the present invention. In these figures, for example, the size and shape of the members may be exaggerated for convenience and clarity of explanation, and in actual implementation, variations of the illustrated shape may be expected. Accordingly, the embodiments of the present invention should not be construed as being limited to any particular shape of the regions shown herein. Also, like reference numerals in the drawings denote like elements throughout the drawings.

FIG. 1 is a top view of a heating device for cooking according to an embodiment of the present invention and includes a substrate 100, a first heating unit 120, a second heating unit 140, a power control unit 160, (180).

The substrate 100 is a plate on which the cooking container is placed. The substrate 100 may be a thermally insulative substrate having heat resistance against the heating temperatures of the first heating unit 120 and the second heating unit 140. For example, the insulating substrate may comprise a glass or ceramic material available at high temperatures. The glass may be soda lime glass, heat-resistant glass, tempered glass, crystallized glass or two or more laminated materials thereof. The ceramic material may be quartz, aluminum oxide, calcium fluoride or yttrium oxide. Preferably, the substrate 100 may be transparent glass with heat resistance. Alternatively, the substrate 100 may be a combination such as a laminated structure of glass and ceramics. In the present specification, "transparent" means that the transmittance of visible light is within a range of 5% to 99% and is completely transparent or translucent.

In another embodiment, the substrate 100 may be a thermosetting resin having heat resistance. For example, the thermosetting resin may include a polycarbonate, a polyester, an epoxy resin or a derivative thereof. These materials are illustrative only and the present invention is not limited thereto.

The surface of the substrate 100 may have a planar structure. However, this is exemplary, and in other embodiments, the substrate 100 may be a structure having a curved surface. As such, design items such as the material, thickness, dimension, or shape of the substrate 100 can be appropriately selected according to the purpose.

The substrate 100 may be divided into a heating region and an insulating region. That is, when the high temperature heat is generated in the first heat generating unit 120 and the low temperature heat is generated in the second heat generating unit 140 according to the power supply control of the power control unit 160, The heating region may be divided into a heating region generated by the first heating unit 120 and a heating region generated by the second heating unit 140. For example, the second heating portion 140 consumes a relatively low power energy as compared with the first heating portion 120, so that the second heating portion 140 may be used for the warming of the cooking container.

The first heating unit 120 may include at least one of an induction heating element, a highlight heating element, and a hot plate heating element located on one side of the opposite surface of the substrate 100 on which the cooking vessel is contacted. The induction-type heat generating element is made of a working coil, a heater base, a heat sink, or the like, using the principle of generating heat in the cooking vessel itself by applying an electromagnetic force to the cooking vessel by an electromagnetic induction method. The working coil serves to transmit the electromagnetic force to the cooking vessel, and the heater base functions to prevent the heat generated by the working coil from being transmitted to the circuit board. Further, the heat sink is fixed along the rear side of the heater base, and plays a role of dissipating the heat generated in the heater base. The highlight type heating element may be composed of a flat heating plate and a working coil assembly. According to the power supply of the power supply control unit 160, the heating coil assembly of the highlight type heating element heats the heating plate by resistance heating, thereby heating the cooking container. Further, in a heating apparatus similar to the highlight type heating element, the hot plate type heating element has a resistance coil at the bottom of the cast iron or coated heating plate. By applying electricity to the resistance coil, the cooking container is heated by the heating of the resistance coil.

The first heat generating unit 120 may be formed of any one of a highlight type heat generating element, a hot plate type heat generating element, or an induction type heat generating element. Also, as shown in FIG. 1, the first heat generating unit 120 may be composed of two or more highlight heat generators, hot plate heat generators, or induction heat generators. Further, the first heat generating unit 120 may be formed of a combination of two or more of a highlight type heating element, a hot plate type heating element, and an induction type heating element.

The second heating unit 140 is a heating unit located on the other side of the substrate 100 opposite to the cooking vessel. Fig. 2 illustrates a side sectional view (A-A ') of the second heat generating portion 140 of Fig. Referring to FIG. 2, the second heating unit 140 may include a planar heating layer 142, electrodes 144a and 144b, a dielectric buffer layer 146, and a protective layer 148.

The area heating layer 142 is stacked on the other side of the opposite side of the substrate 100 on which the cooking container C is placed and generates heat when power is applied. The planar heating layer 142 may include a conductive thin film. The area heating layer 142 is a resistive film capable of generating heat within a range of 40 占 폚 to 600 占 폚 by current flow (I).

The planar heating layer 142 may be a conductive metal oxide. The conductive metal oxide may include indium oxide (InO _2), tin oxide (SnO _2), indium tin oxide (ITO) or zinc oxide (ZnO). The surface heat generating layer 142 may be formed of a base metal such as boron (B), fluorine (F) or chlorine (Cl) or a metal such as aluminum (Al) or magnesium (Mg) Si) may be doped.

The conductive metal oxide may include a transparent heat generating layer and fluorine-doped tin oxide (hereinafter referred to as FTO) having a low resistance and high transmittance. Since the FTO film has scratch resistance, abrasion resistance and moisture resistance, its application is preferable.

The conductive metal oxide may be deposited on the substrate 100 using spray pyrolysis deposition (SPD), chemical vapor deposition (CVD), atomic layer vapor deposition (ALD), sputtering and thermal evaporation Can be formed by the same physical vapor deposition. A conductive particle-based resistive layer, such as carbon nanotube (CNT), graphene, or fullerene, is typically formed by a wet process in which the conductive particles are immersed in a dispersion solution in which the conductive particles are dispersed or slurry coated do. However, such a wet method is difficult to mass-produce because it is difficult to coat a resist layer having a uniform thickness over a large area, so that the vapor deposition method using the conductive metal oxide is preferable.

The formation of the surface heating layer 142 can be preferably performed by the SPD capable of a large-area deposition process. The supply of the SPD may be accomplished through ultrasonic atomization, spray atomization, or vaporization, but the present invention is not limited thereto.

The SPD forms droplets containing the starting compound, and during the transfer of the droplets through the droplet transfer path, evaporation of the solvent contained in the droplet, high temperature reaction, thermal decomposition, reaction between the carrier gas and the precursor (In this specification, intermediates of each reaction step are collectively referred to as a gaseous precursor), accompanied by at least one or more of the steps of formation of a cluster, formation of a gas molecule, oxidation or reduction reaction) And is transferred onto the substrate 100 on which the transparent dielectric barrier layer, which is heated to a film forming temperature, is formed in advance, thereby forming a thin film.

When the planar heating layer 142 comprises the FTO, the precursor solution for the SPD of the FTO film comprises SnCl ₄ .5H ₂ O, (C ₄ H ₉ ) ₂ Sn (CH ₃ COO) ₂ , (CH ₃ ) ₂ SnCl ₂ , or (C ₄ H ₉ ) ₃ SnH may be used. As the dopant fluorine precursor, compounds such as NH ₄ F, CF ₃ Br, CF ₂ Cl ₂ , CH ₃ CClF ₂ , CF ₃ COOH, or CH ₃ CHF ₂ may be used. These precursors may be mixed with distilled water or alcohol so as to have a predetermined weight ratio F / Sn to prepare a liquid raw material, and droplets may be generated. The temperature of the substrate 100 to be processed is maintained at 400 to 600 ° C., and the vapor phase precursor is sprayed onto the substrate 100 to form the FTO film on the substrate 100. However, the formation of the FTO film by SPD described above is illustrative, and the present invention is not limited thereto. The planar heating layer 142 of the FTO may be formed by atmospheric pressure chemical vapor deposition.

The electrodes 144a and 144b are electrically connected to the planar heating layer 142 to supply power to the planar heating layer 142. [ Referring to FIG. 2, the electrodes 144a and 144b formed at least partially in contact with the planar heating layer 142 generate heat by supplying electric power to the planar heating layer 142. FIG. For example, the electrodes 144a and 144b may include a first electrode pattern 144a to which a positive voltage is applied and a second electrode pattern 144b to which a negative voltage is applied or grounded ). When a suitable voltage signal is applied between the first electrode pattern 144a and the second electrode pattern 144b, the current I may flow through the planar heating layer 142 to generate heat.

The electrodes 144a and 144b are formed on the planar heating layer 142 as shown in FIG. However, the present invention is not limited thereto, and the electrodes 144a and 144b may be formed between the planar heating layer 142 and the substrate 100 to supply electric power to the planar heating layer 142 have.

A metal, a metal oxide, a metal nitride, a conductive organic material, a graphite, or a carbon nano tube may be provided as a material used for the electrodes 144a and 144b. The metal oxide and the metal nitride may be at least one metal oxide or metal nitride selected from the group of the above metals.

The metal may be at least one selected from the group consisting of Ag, Au, Cu, Al, Pt, Ni, Pb, Co, Rh ), Ruthenium (Ru), tin (Sn), iridium (Ir), palladium (Pd), zinc (Zn), zirconium (Zr), niobium (Nb), vanadium Mo), tungsten (W), and titanium (Ti). The metal oxide and the metal nitride may be a metal oxide or a metal nitride of at least one metal selected from the group of the metals. The conductive organic material may be selected from the group consisting of polyacetylene, polyaniline, polypyrrole, polythiophene, and poly sulfur nitride. Silver paste or metal-carbon nanotube powder particle paste may be further used to increase the contact efficiency between the electrode 200 and the surface heating layer 142.

The dielectric buffer layer 146 may be formed between the substrate 100 and the planar heating layer 142. The dielectric buffer layer 146 can improve the bonding strength between the substrate 100 and the planar heating layer 142 and improve the bonding force between the substrate 100 and the planar heating layer 142, Lt; RTI ID = 0.0 > 142 < / RTI > For example, in the case where the substrate 100 is soda lime glass, alkali metal ions such as sodium (Na) or potassium (K) from the soda lime glass are generated on the surface heating layer 142, and cracks may occur in the area heating layer 142 or peeling may occur due to these ions. Accordingly, since the dielectric buffer layer 146 is formed between the substrate 100 and the planar heating layer 142, cracking or peeling of the planar heating layer 142 can be prevented.

In one embodiment, the dielectric buffer layer 146 is a silicon oxide (SiO _2), ceria (CeO _2), aluminum oxide (Al ₂ O ₃₎ Manganese oxide (MnO _2), iron oxide (Fe ₂ O _3), magnesium oxide (MgO), and titanium oxide (TiO ₂ ). The dielectric buffer layer 146 may be formed by, for example, a liquid phase method. For example, in the case of the liquid phase method, the transparent dielectric buffer layer 146 of the SiO ₂ can be formed using a silicon precursor such as tetraethyl silicate ((C ₂ H ₅ ) ₄ SiO ₄ ) The alcohol-based solvent may be at least one selected from the group consisting of ethyl alcohol, methyl alcohol, glycerol, propylene glycol, isopropyl alcohol, isobutyl alcohol, polyvinyl alcohol, cyclohexanol, Octyl alcohol, decanol, hexatecanol, ethylene glycol, 1,2-octanediol, 1,2-dodecanediol and 1,2-hexadecane diol, or a mixture thereof, The concentration of the silicon precursor in the liquid phase solvent may be in the range of 0.1 to 0.4 mol%. The.

In one embodiment, nitric acid (HNO ₃ ) may be further added as a catalyst in the liquid solvent. The nitric acid catalyst promotes the oxidation reaction of silicon in the liquid phase method, thereby improving the deposition rate of the SiO ₂ dielectric buffer layer 146. In one embodiment, the molar concentration of nitric acid in the liquid feedstock may be from about 0.1 mol% to 5 mol%.

The glass substrate is immersed as a substrate in the liquid raw material, the liquid raw material is coated on the glass substrate, dried and sintered to form a transparent dielectric buffer layer 146 of SiO ₂ . The rate at which the glass substrate is immersed in the liquid raw material can be performed within a range of about 1 cm / min to about 10 cm / min. The thickness of the dielectric buffer layer 146 may be achieved by adjusting the concentration of a silicon precursor, e. G., Tetraethyl silicon oxide, in the liquid phase solution. As the concentration of the silicon precursor increases, the thickness of the transparent dielectric buffer layer 146 increases. In one embodiment, the molar concentration of the silicon precursor in the liquid source can be selected within the range of about 0.1 to 0.4 mol%.

The protective layer 148 is laminated on the surface of the planar heating layer 142 to which the electrodes 144a and 144b are connected to prevent the surface heating layer 142 from being damaged. The protective layer 148 may be an insulating thin film, a glass substrate, or a polymeric resin substrate having moisture resistance, abrasion resistance, or scratch resistance. In some embodiments, if the protective layer 148 is the glass substrate, a spacing space may be provided between the protective layer 148 and the planar heating layer 142. The spacing space may be filled with a filling gas such as air or argon gas to improve the adiabatic effect, but the present invention is not limited thereto.

Figures 3A-3D illustrate various embodiments 140A, 140B, 140C, 140D of a second heat generating portion 140 stacked on a substrate 100 according to the present invention.

Referring to FIG. 3A, the second heating portion 140A may include a planar heating layer 142 and electrodes 144a and 144b having a disk-shaped pattern on one side of the substrate 100. FIG. As shown in Fig. 3A, circular-arc electrodes 144a and 144b are connected on the surface heating layer 142 having a disk-like pattern. However, the shapes of the electrodes 144a and 144b can be changed in various forms such as a bar shape as well as an arc shape. The power is applied to the electrodes 144a and 144b, and heat is generated as current flows along the planar heating layer 142. [ To this end, the power control unit 160 may convert the commercial power to AC / DC and control the converted power to be applied to the electrodes 144a and 144b.

The plane heating layer 142 may be supplied with electric power by forming electrodes 144a and 144b of different polarities to induce a current I on both ends separated from each other. The separated both ends may be formed on the upper portion, the lower portion, or the side portion of the substrate 100, although the separated both ends to which the electrodes 144a and 144b are connected are provided at the corners of the substrate 100. [ Since the partly separated surface heat generating layer 142 is regarded as one resistor, the surface heat generating layer 142 can be uniformly heated over the whole laminated part, and the power applied to the surface heat generating layer 142 can be easily .

The plane heating layer 142 may be formed by connecting two or more resistors having different resistances in parallel to each other depending on positions where two electrodes having different polarities are connected to each other Can be treated equivalently. Accordingly, in order to generate the same power in each of the resistors when the power supply signal is applied to the electrodes 144a and 144b, the resistance values of the parallel-connected resistors need to be adjusted to be equal to each other. For example, electrodes may be arranged so that the current path between the electrodes having different polarities is the same regardless of the path, or the thickness of the plane heating layer on each path of the plane heating layer 142 may be adjusted Or by adjusting the area, the resistance values on the respective paths can be made equal to each other.

Referring to FIG. 3B, the second heat generating portion 140B may include an area heating layer 142 and electrodes 144a and 144b having an annular pattern on one side of the substrate 100. FIG. As shown in FIG. 3B, electrodes 144a and 144b are connected to one end and the other end, respectively, of the planar heating layer 142 having an annular pattern, that is, a ring-shaped pattern. Heat loss tends to occur in the edge region of the cooking container in contact with the substrate 100. Therefore, with respect to the surface heating layer 142 that is in contact with the cooking vessel indirectly with the substrate 100 interposed therebetween, the substrate 100 corresponding to the edge of the cooking vessel can be laminated in an annular pattern having a constant width . As a result, power is applied to the electrodes 144a and 144b, and heat is generated while current flows along the annular patterned heat generating layer 142.

Referring to FIG. 3C, the second heat generating portion 140C may include an area heating layer 142 and electrodes 144a and 144b having an annular labyrinth pattern on one side of the substrate 100. FIG. The planar heating layer 142 laminated on the substrate 100 is connected in series to the power supply control unit 160 through the wiring in the form of an annular labyrinth pattern and is connected to the same current I Can be induced. The area heating layer 142 may generate heat at different temperatures depending on the thickness of the area where the area heating layer 142 is laminated. Unlike the case where the series-connected surface heating layers 142 are connected in parallel, the higher the resistance value, the more heat is generated. Therefore, in the region corresponding to the edge portion of the cooking vessel having a relatively high heat loss in the substrate 100, it is stacked so as to have a large resistance value, and in the region corresponding to the central portion of the cooking vessel, . Accordingly, the second heat generating portion 140C may generate heat differently on the substrate 100. [

Referring to FIG. 3D, the second heat generating portion 140D may include a plurality of planar heating layers 142a and 142b that are electrically separated from each other for differential heating of the substrate 100. FIG. 144b ', 144a', 144b 'that are respectively assigned to the plurality of the surface heating layers 142a, 142b. Here, although FIG. 3D shows two surface heating layers 142a and 142b, this is merely an illustrative example, and three or more surface heating layers may be formed, so that three or more surface heating layers are heated The number of electrodes to be used may be proportionally increased.

The partially coated surface heating layer 140 on the substrate 100 may include two or more surface heating layer patterns 142a and 142b. There is a difference in heat loss between the center portion and the edge portion of the cross section of the cooking utensil. In response to the difference in the heat loss, the surface heating layers 142a and 142b coated on the respective regions of the substrate 100 may generate heat at different temperatures and / or amounts of heat. To this end, the surface heating layers 142a and 142b may have different resistances or may be driven by different power supply signals. Each of the planar heating layers 142a and 142b shown in FIG. 3d is connected in parallel to the power source control unit 160 through wiring lines. The electrodes 144a and 144b corresponding to the planar heating layers 142a and 142b, respectively, , 144a ', 144b'). In another embodiment, the plane heating layers 142a and 142b may be individually controlled by the power supply control unit 160 via independent wirings so that they can be driven by different power supply signals.

When the same power source is applied to the plane heating layers 142a and 142b, the heating temperature may vary depending on the resistance value of the plane heating layer. For example, in the substrate 100, the surface heating layer 142a corresponding to the edge portion of the cooking vessel is provided with a resistance value for causing a relatively high heat generation, The surface heating layer 142b may be provided with a resistance value that causes relatively low heat generation.

In the embodiment shown in Figs. 3A to 3D, the planar heating layer 142 selectively coated on a certain region of the substrate has a circular pattern, but the present invention is not limited thereto. For example, the area heating layer 142 may have a polygonal pattern such as a quadrangle instead of a circle.

The resistance of the area heating layer 142 can be determined by the thickness, width, and pattern of the area heating layer. For example, when the planar heating layer 142 is manufactured using the SPD method described above, the concentration and flow rate of the precursor discharged from the nozzle, the flow rate and the hydraulic pressure of the carrier gas, the temperature and pressure of the chamber, The thickness of the area heating layer 142 can be adjusted by controlling the temperature of the window substrate or the number of times of vapor deposition.

Further, the width of the area heating layer 142 can be provided in a desired width and / or pattern by changing the mask used at the time of deposition. The pattern may be any one or a combination of two or more of continuous, discontinuous, repeating and non-repeating patterns. For example, the pattern may be a line pattern, and a plurality of line patterns may be collected. The mask may be formed by depositing a planar heating layer 142 after the masking process so that the planar heating layer 142 is deposited only on a portion except for the mask. After the planar heating layer 142 is deposited, The pattern or the width of the area heating layer 142 can be provided by etching the portion except for the area. However, the present invention is not limited thereto, and a plurality of nozzles may be used for deposition at a desired position.

The plane heating layer 142 may be laminated so as to have a continuous thickness gradient on the substrate 100 for differential heating of the substrate 100. For example, the continuous thickness gradient may be such that the thickness increases from the center of the cross section of the area heating layer 142 toward the edge direction.

Fig. 4 illustrates a side sectional view according to another embodiment of the second heating portion shown in Fig. 4, components other than the surface heat generating layer 142 are the same as those described in FIG. 2, and thus the detailed description thereof will be omitted.

Referring to FIG. 4, electrodes 142a and 144b having different polarities are connected to both ends of the planar heating layer 142, and power is supplied from the power controller 160. At this time, heat generation occurs differently depending on the thickness of the area heat generating layer 142, and heat is induced at a continuous temperature due to the resistance due to the continuous thickness of the area heat generating layer 142.

As shown in FIG. 4, by increasing the thickness of the area heating layer 142 toward the edge portion of the cooking container C in contact with the substrate 100, a thickness gradient due to the temperature deviation can be provided. That is, the thickness (Th ₂₎ of the planar heat generating layer 142 face the heat generating layer 142 corresponding to the edge portion of the container for cooking than the thickness (Th ₁₎ corresponding to the center portion of the cooking container (C) for more It is possible to minimize the temperature deviation from the central portion due to the heat loss at the edge portion of the cooking utensil (C).

The surface heating layer 142 having a continuous thickness gradient can be formed by the SPD method. The concentration and flow rate of the precursor discharged from the nozzle, the flow rate and the hydraulic pressure of the carrier gas, the temperature and pressure of the chamber, May be provided by controlling the temperature of the substrate 100 or the number of times of deposition. However, this is merely exemplary and the present invention is not limited thereto. For example, a plurality of nozzles may be used to increase the injection amount of the nozzles at positions where the area heating layer 142 is formed thick, so that the area heating layer 142 having a continuous thickness gradient may be provided. In this case, the planar heating layer 142 may be formed by the SPD method using a nozzle, resulting in cost reduction due to ease of manufacture and simplification of manufacturing steps.

The power control unit 160 controls power supply to the first heat generating unit 120 and the second heat generating unit 140. In order to supply power to the first heating unit 120 and the second heating unit 140, the power control unit 160 may include a separate independent control module. 2 and 4, the power supply controller 160 is connected to the electrodes 144a and 144b of the second heat generator 140 to control power supply to the electrodes 144a and 144b have. When the user inputs a control command for generating heat of the second heating unit 140 through the operation button, the power control unit 160 applies power to the electrodes 144a and 144b in response to the input control command, The cooking container can be heated by the heat generated by the surface heating layer 142 due to application of power to the heating plates 144a and 144b.

In one embodiment, the power source control unit 160 can operate the planar heating layer 142 for a designated period of time through a timer (not shown). In addition, the area heating layer 142 can be operated repeatedly through a predetermined period or a predetermined sequence. The power control unit 160 may further include a changeover switch (not shown), and the changeover switch may be any one of an on / off switch, a voltage control switch, a resistance control switch, Lt; / RTI >

The sensor unit 180 senses whether or not the cooking container is positioned on the second heating unit 140. That is, the sensor unit 180 can detect whether the second heating unit 140 is located on the substrate 100 on which the plane heating layer 142 exists. The sensor unit 180 may be provided at one side of the second heat generating unit 140. For example, the sensor unit 180 may be adjacent to the second heat generating unit 140 and may be disposed at a position substantially spaced from the first heat generating unit 120. The reason why the sensor unit 180 is provided at a position which is considerably spaced from the first heat generating unit 120 is to prevent malfunction due to heat generation of the first heat generating unit 120.

The sensor unit 180 may include a thermal sensor or a pressure sensor. If the heated cooking vessel is located on the second heating unit 140, the sensor unit 180 including the heat sensing sensor senses the temperature of the heated cooking vessel. The sensor unit 180 may determine that the cooking vessel is located on the second heating unit 140 when it is determined that the sensed temperature is equal to or higher than the predetermined critical temperature. In addition, if the cooking container is positioned on the second heating unit 140, the sensor unit 180 including the pressure sensor senses the pressure corresponding to the load of the cooking container. If it is determined that the sensed pressure is equal to or higher than the predetermined critical pressure, the sensor unit 180 may determine that the cooking vessel is located on the second heating unit 140. However, the thermal sensor and the pressure sensor are merely examples, and the present invention is not limited to the above-described sensors.

The power control unit 160 controls the second heating unit 140 to heat the second heating unit 140 in response to the detection of the position of the cooking container in the second heating unit 140 by the sensor unit 180, The power supply is applied to the electrodes 144a and 144b. For example, when receiving the detection result that the cooking container is located in the second heating unit 140 from the sensor unit 180, the power control unit 180 controls the voltage or current divider 140 to generate heat for keeping the cooking container warm, (Not shown) to control the voltage or current applied to the electrodes 144a and 144b of the second heating unit 140. [

The scope of the present invention should not be construed as limited to the embodiments described, but should be determined by the scope of the appended claims as well as the appended claims. It is to be understood that the above-described embodiments are illustrative and non-restrictive in all aspects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, And all changes or modifications that come within the spirit and scope of the appended claims are intended to be embraced within their scope.

100: substrate
120: first heating part
140: second heating part
160: Power control unit
180:

Claims

A substrate on which the cooking utensil is raised;
A first heating portion including at least one of a highlight heating element, an induction heating element and a hot plate type heating element located on one side of the surface of the substrate opposite to the surface contacting with the cooking container;
A second heat generating unit located on the other side of the opposite surface of the substrate and generating heat by an applied power source; And
And a power control unit for controlling power supply to the first heat generating unit and the second heat generating unit,
The second heat-
A surface heating layer which is stacked on the other side of the opposite surface and generates heat when the power is applied; And
And electrodes electrically connected to the planar heating layer.

The method according to claim 1,
Wherein the substrate is divided into a heating region generated by the first heating unit and a heating region heated by the second heating unit according to the power supply control of the power control unit.

The method according to claim 1,
The plane heat generating layer may be made of indium oxide (InO ₂ ); Tin oxide (SnO2); Indium tin oxide (ITO); And zinc oxide (ZnO) as a main matrix, and wherein the matrix contains any one of a non-metal, a metal, or a material doped with a metalloid or a mixture thereof.

The method according to claim 1,
And the second heating portion further comprises a dielectric buffer layer between the substrate and the planar heating layer.

The method according to claim 1,
Wherein the second heating portion further comprises a protective layer laminated on a surface of the planar heating layer to which the electrodes are connected.

The method according to claim 1,
Wherein the surface heating layer includes at least one of a disk-shaped pattern, an annular pattern, and an annular labyrinth pattern on a surface in contact with the substrate.

The method according to claim 1,
Wherein the planar heating layer includes a plurality of planar heating layers spaced apart from each other for differential heating of the substrate and electrically separated from each other,
Wherein the electrodes include a plurality of electrodes respectively assigned to the plurality of planar heating layers.

The method according to claim 1,
Wherein the planar heating layer is laminated so as to have a continuous thickness gradient on the substrate for differential heating of the substrate.

9. The method of claim 8,
Wherein the continuous thickness gradient increases in thickness from the center of the cross section of the area heating layer to the edge direction.

The method according to claim 1,
Further comprising a sensor portion for sensing whether the cooking container is positioned on the substrate on which the planar heating layer exists.

11. The method of claim 10,
Wherein the sensor unit includes at least one of a heat sensing sensor and a pressure sensor.

11. The method of claim 10,
And the power source control unit applies power to the electrodes to generate heat of the second heating unit corresponding to the detection result of the sensor unit.