KR20170000244A - Spin head and Apparatus for treating substrate including the spin head - Google Patents

Abstract

The present invention relates to a spin head for supporting a substrate and a substrate processing apparatus including the same. According to an embodiment of the present invention there is provided a lithographic apparatus comprising a support plate on which a substrate is placed and a plurality of chuck pins positioned on the support plate for supporting the sides of the substrate and a chuck pin drive member for moving the chuck pin between a first position and a second position Wherein the chuck pin driving member includes a pinion rod having a driving gear, a transmission gear engaged with the driving gear, and a toothed portion that linearly moves in accordance with rotation of the driving gear and meshes with the transmission gear, And moves between the first position and the second position in accordance with the linear motion of the pin rod, wherein the first position is located closer to the center of the support plate than the second position.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a spin head and a substrate processing apparatus including the spin head,

The present invention relates to a spin head and a substrate processing apparatus including the same, and more particularly, to a spin head capable of supporting and rotating a substrate in a process of processing a substrate and a substrate processing apparatus including the same.

Generally, a semiconductor device is manufactured by depositing various materials on a substrate in a thin film form and patterning the same. Various processes such as deposition process, photolithography process, etching process and cleaning process are required for this purpose.

Among these processes, the etching process is a process for removing the film quality formed on the substrate, and the cleaning process is a process for removing contaminants remaining on the substrate surface after the progress of each unit process for manufacturing a semiconductor. The etching process and the cleaning process are classified into a wet process and a dry process according to a process progress method, and a wet process is classified into a batch process and a spin process.

In the spin type method, pin members for supporting a substrate are provided on an upper surface of a spin head, a substrate supported by the pin members rotates as the spin head rotates, a nozzle provided on the substrate and a spin head The processing liquid is supplied to the upper or lower surface of the substrate through the installed rear nozzle to process the substrate.

SUMMARY OF THE INVENTION The present invention is to provide a spin head capable of supporting a substrate and capable of rotating, and a substrate processing apparatus including the same.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and the problems not mentioned can be clearly understood by those skilled in the art from the description and the accompanying drawings will be.

The present invention provides a spin head for supporting a substrate.

According to an embodiment of the present invention, the spin head includes a support plate on which a substrate is placed, a plurality of chuck pins positioned on the support plate for supporting the sides of the substrate, and a chuck pin driving mechanism for moving the chuck pin between the first and second positions Wherein the chuck pin driving member includes a pin rod having a transmission gear engaged with the driving gear and the driving gear, and a toothed portion engaged with the transmission gear to linearly move according to the rotation of the driving gear, The first position being coupled with the pin rod and moving between the first position and the second position in accordance with the linear movement of the pin rod, the first position being located closer to the center of the support plate than the second position.

According to one embodiment, the transmission gear may include a first gear engaged with the drive gear, and a second gear provided to rotate with the first gear and meshing with the toothed portion of the pin rod.

According to an embodiment, the first gear and the second gear may be coaxially provided, and the second gear may be positioned on the first gear.

According to one embodiment, the pin rod can engage with the second gear at the top of the first gear.

According to one embodiment, the first gear may be provided with a larger diameter than the second gear.

According to an embodiment, the longitudinal direction of the pin rod may be arranged parallel to the radial direction of the transmission gear.

According to one embodiment, the first position may be a chucking position for supporting the side portion of the substrate with the chuck pin, and the second position may be an unchucking position for waiting before the substrate is placed on the support plate.

The present invention provides an apparatus for processing a substrate.

According to an embodiment of the present invention, the substrate processing apparatus includes a cup having a processing space therein, a spin head positioned in the processing space, the spin head supporting the substrate, and a processing liquid supply unit Wherein the spin head comprises a support plate on which the substrate is placed and a plurality of chuck pins positioned on the support plate for supporting the sides of the substrate and a chuck pin drive member for moving the chuck pin between the first and second positions Wherein the chuck pin driving member includes a pin rod having a transmission gear engaged with the driving gear and the driving gear, and a toothed portion engaged with the transmission gear to linearly move in accordance with rotation of the driving gear, And moves between the first position and the second position in accordance with the linear movement of the pin rod, The first position may be located closer to the center of the support plate than the second position.

According to one embodiment, the transmission gear may include a first gear engaged with the drive gear, and a second gear provided to rotate with the first gear and meshing with the toothed portion of the pin rod.

According to an embodiment, the first gear and the second gear may be coaxially provided, and the second gear may be positioned on the first gear.

According to one embodiment, the pin rod can engage with the second gear at the top of the first gear.

According to one embodiment, the first gear may be provided with a larger diameter than the second gear.

According to an embodiment, the longitudinal direction of the pin rod may be arranged parallel to the radial direction of the transmission gear.

According to one embodiment, the first position may be a chucking position for supporting the side portion of the substrate with the chuck pin, and the second position may be an unchucking position for waiting before the substrate is placed on the support plate.

According to an embodiment of the present invention, the driving of the chuck pin provided in the spin head can be realized by the driving gear and the transmission gear, thereby improving the efficiency of the chuck pin driving.

According to an embodiment of the present invention, the drive of the chuck pin provided in the spin head can be simplified to a drive gear and a transmission gear, thereby minimizing the component configuration of the spin head

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a plan view schematically showing a substrate processing apparatus provided with a substrate processing apparatus according to an embodiment of the present invention.
2 is a view showing an example of a substrate processing apparatus provided in the process chamber of FIG.
Figure 3 is a cross-sectional view showing the chuck pin drive member located inside the support plate of Figure 2;
FIGS. 4 and 5 are views showing the operation of the chucking pin driving member of FIG. 2. FIG.
Figs. 6 and 7 are views showing the positions of the chuck pin of Fig. 2. Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

1 is a plan view schematically showing a substrate processing apparatus 1 of the present invention.

Referring to FIG. 1, the substrate processing apparatus 1 has an index module 100 and a processing module 200, and the index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 200 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the processing module 200 are arranged is referred to as a first direction 12. A direction perpendicular to the first direction 12 is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction (16).

The carrier 130 in which the substrate W is accommodated is seated in the load port 140. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. In FIG. 1, four load ports 120 are shown. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process processing module 200. The carrier 130 is formed with a slot (not shown) provided to support the edge of the substrate. The slots are provided in a plurality of third directions 16, and the substrates are positioned in the carrier so as to be stacked apart from each other along the third direction 16. As the carrier 130, a front opening unified pod (FOUP) may be used.

The processing module 200 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on one side and the other side of the transfer chamber 240 along the second direction 14, respectively. The process chambers 260 located at one side of the transfer chamber 240 and the process chambers 260 located at the other side of the transfer chamber 240 are provided to be symmetrical with respect to the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B (where A and B are each at least one natural number). Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. Also, unlike the above, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16. The surface of the buffer unit 220 opposed to the transfer frame 140 and the surface of the transfer chamber 240 facing each other are opened.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142. The index robot 144 is moved linearly along the index rail 142 in the second direction 14. [

The index robot 144 includes a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. The body 144b is rotatably provided on the base 144a. The index arm 144c is coupled to the body 144b. The index arm 144c is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided. The plurality of index arms 144c individually drive. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some index arms 144c are used to transfer the substrate W from the processing module 200 to the carrier 130 while others are used to transfer the substrate W from the carrier 130 to the processing module 200. [ As shown in Fig. It is possible to prevent particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244.

The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rail 242. The main robot 244 is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 includes a base 244a, a body 244b, and a main arm 244c.

The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b. The main arm 244c is provided to be movable forward and backward relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16. A main arm 244c used when the substrate is transported from the buffer unit 220 to the process chamber 260 and a main arm 244c used when transporting the substrate from the process chamber 260 to the buffer unit 220 They may be different from each other.

In the process chamber 260, a substrate processing apparatus 300 for performing a cleaning process on the substrate W may be provided. The substrate processing apparatus 300 provided in each process chamber 260 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, and the substrate processing apparatuses 300 provided in the process chambers 260 belonging to the same group have the same structure and are provided in the process chambers 260 belonging to different groups The substrate processing apparatuses 300 may have different structures from each other. For example, if the process chambers 260 are divided into two groups, a first group of process chambers 260 is provided on one side of the transfer chamber 240 and a second group of process chambers 260 are provided on the other side of the transfer chamber 240 Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided on the lower layer and a second group of process chambers 260 may be provided on the upper and lower sides of the transfer chamber 240, respectively. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to the type of the chemical used and the type of the cleaning method.

An example of the substrate processing apparatus 300 for cleaning the substrate W by using the process liquid will be described below. However, the technical idea of the present invention is not limited to this, and can be applied to various types of apparatuses that perform a process while rotating the substrate W, such as an etching process, a developing process, and the like.

FIG. 2 is a view showing an example of a substrate processing apparatus provided in the process chamber of FIG. 1, and FIG. 3 is a cross-sectional view showing a chuck pin drive member 440 located inside the support plate 410 of FIG. 2 and 3, the substrate processing apparatus 300 includes a cup 320, a spin head 400, a lift unit 360, and a liquid supply unit 380. [

 The cup 320 provides a space in which the substrate processing process is performed. The upper portion of the cup 320 is opened. The cup 320 includes an inner recovery cylinder 322, an intermediate recovery cylinder 324, and an outer recovery cylinder 326. Each of the recovery cylinders 322, 324 and 326 recovers the different treatment liquids among the treatment liquids used in the process.

 The inner recovery cylinder 322 is provided in an annular ring shape surrounding the spin head 400. The intermediate recovery bottle 324 is provided in an annular ring shape surrounding the inner recovery bottle 322. The outer recovery cylinder 326 is provided in the form of an annular ring surrounding the intermediate recovery cylinder 324. The inner space 322a of the inner recovery cylinder 322 and the space 324a between the inner recovery cylinder 322 and the intermediate recovery cylinder 324 and the space 324 between the intermediate recovery cylinder 324 and the outer recovery cylinder 326 326a function as an inlet through which the processing liquid flows into the inner recovery cylinder 322, the intermediate recovery cylinder 324, and the outer recovery cylinder 326, respectively. Recovery passages 322b, 324b, and 326b extending vertically downward from the bottom of the recovery passages 322, 324, and 326 are connected to the recovery passages 322, 324, and 326, respectively. Each of the recovery lines 322b, 324b, and 326b discharges the processing liquid that has flowed through the respective recovery cylinders 322, 324, and 326. [ The discharged treatment liquid can be reused through an external treatment liquid recovery system (not shown).

The spin head 400 is disposed within the cup 320. The spin head 400 supports the substrate and rotates the substrate during the process. The spin head 400 has a support plate 410, a support pin 430, a chuck pin 420, a chuck pin drive member 440, a support shaft 348 and a controller 470. The support plate 410 has an upper surface that is generally circular when viewed from above. A support shaft 348 rotatable by a motor 460 is fixedly coupled to the bottom surface of the support plate 410. A plurality of support pins 430 are provided. The support pins 430 are spaced apart from the edge of the upper surface of the support plate 410 by a predetermined distance and project upward from the support plate 410. The support pins 430 are arranged so as to have a generally annular ring shape in combination with each other. The support pins 430 support the rear edge of the substrate such that the substrate is spaced from the upper surface of the support plate 410 by a certain distance. A plurality of the chuck pins 420 are provided. The chuck pin 420 is disposed farther from the center of the support plate 410 than the support pin 430. The chuck pin 420 is provided to protrude upward from the support plate 410. The chuck pin 420 supports the side of the substrate such that the substrate is not laterally displaced in place when the spin head 400 is rotated. The chuck pin 420 is provided along the radial direction of the support plate 410 so as to be linearly movable between the first position P1 and the second position P2 as shown in Figs.

The first position Pl is a chucking position for supporting the side of the substrate with the chuck pin 420. [ The second position P2 is an unchucking position in which the chuck pin 420 waits before the substrate is placed on the support plate 410. [ The first position P1 is closer to the center of the support plate 410 than the second position P2. The chuck pin 420 is positioned at the second position P2 when the substrate is loaded or unloaded to the spin head 400 and the chuck pin 420 is positioned at the first position P1 when the substrate is being processed. At the first position Pl, the chuck pin 420 contacts the side of the substrate.

The chuck pin driving member 440 drives the chuck pin 420. The chuck pin drive member 440 moves the chuck pin 420 to the first position P1 and the second position P2. The chuck pin drive member 440 includes a drive gear 441, a transmission gear 443, a pin rod 445, and a rotation drive unit 447.

The driving gear 441 is rotated by the rotation driving part 447 and transmits rotational force to the transmission gear 443. The driving gear 441 is located inside the support plate 410. The drive gear 441 is engaged with the transmission gear 443. The driving gear 441 has a disk shape and has a plurality of teeth on its outer periphery. The center of the drive gear 441 is located opposite to the center of the support plate 410. The driving gear 441 can be rotated by the rotation driving portion 447 in the first rotation direction R1 or the second rotation direction R2. The first rotation direction R1 and the second rotation direction R2 are different directions. For example, the first rotation direction R1 may be provided in a clockwise direction. And the second rotation direction R2 may be provided in the counterclockwise direction.

The transmission gear 443 receives the rotational force of the driving gear 441 and transmits rotational force to the pin rod 445. The transfer gear 443 is provided engaged with the drive gear 441. A plurality of transmission gears 443 may be provided. For example, the transmission gear 443 may be provided in a number corresponding to the number of the chuck pins 420. The transfer gear 443 is located inside the support plate 410. The plurality of transfer gears 443 are located at the same distance from the center of the support plate 410. The transfer gear 443 rotates in the opposite direction by the rotational force of the drive gear 441. [ For example, the transmission gear 443 rotates in the second rotation direction R2 when the drive gear 441 rotates in the first rotation direction R1. The transmission gear 443 rotates in the first rotation direction R1 when the drive gear 441 rotates in the second rotation direction R2. The transmission gear 443 includes a first gear 443a and a second gear 443b.

The first gear 443a is engaged with the drive gear 441 and is provided. The first gear 443a is located inside the support plate 410. The first gear 443a is spaced apart from the center of the support plate 410 by a predetermined distance. The first gear 443a is located farther from the center of the support plate 410 than the drive gear 441. The first gear 443a is provided with a smaller diameter than the drive gear 441 and is provided with a larger diameter than the second gear 443b. A plurality of first gears 443a are provided. For example, the first gear 443a is provided in a number corresponding to the number of the chuck pins 420. The first gear 443a has a disk shape and has a plurality of teeth on its outer periphery. The first gear 443a meshes with the driving gear 441, and the rotational direction of the driving gear 441 is opposite to the rotating direction. For example, when the drive gear 441 rotates clockwise, the first gear 443a rotates counterclockwise. On the other hand, when the drive gear 441 rotates counterclockwise, the first gear 443a rotates clockwise.

The second gear 443b transmits the rotational force to the pin rod 445 by the rotational force of the driving gear 441. [ The second gear 443b is provided meshing with the toothed portion 446 of the pin rod 445. The second gear 443b is located above the first gear 443a. The second gear 443b is provided with a first gear 443a and a coaxial shaft 443c. The second gear 443b is provided with a smaller diameter than the first gear 443a. The second gear 443b has a disk shape and has a plurality of teeth on its outer periphery. The second gear 443b is spaced apart from the center of the support plate 410 by a certain distance. The second gear 443b is located farther from the center of the support plate 410 than the drive gear 441. The second gear 443b is disposed in parallel with the driving gear 441. [ The second gear 443b is provided on the coaxial shaft 443c with the first gear 443a and rotates in the same direction. For example, the first gear 443a and the second gear 443b also rotate clockwise when rotated clockwise.

The pin rod 445 receives the rotational force of the driving gear 441 and the transmission gear 443 and performs linear motion. The pin rod 445 moves the chuck pin 420 in the linear motion to the first position P1 or the second position P2.

The pin rod 445 is provided engaged with the second gear 443b. The pin rod 445 is engaged with the chuck pin 420. The pin rod 445 is provided in the radial direction of the support plate 410 in its longitudinal direction. The pin rod 445 is provided so that its longitudinal direction is parallel to the radial direction of the drive gear 441. The pin rod 445 has a tooth portion 443c at a lower portion thereof. The toothed portion 443c meshes with the teeth of the second gear 443b. The pin rod 445 linearly moves in the direction toward the center of the support plate 410 or in the direction away from the support plate 410 by the rotation of the second gear 443b. The pin rod 445 is located inside the support plate 410. A plurality of pin rods 445 are provided. For example, the pin rod 445 is provided in a corresponding number of the chuck pins 420.

The rotation drive section 447 can rotate the drive gear 441 in the first rotation direction R1 or the second rotation direction R2. For example, the rotation drive portion 447 may be provided as a motor.

The controller 470 controls the chuck pin drive member 440. The controller 470 controls the chuck pin drive member 440 to move the chuck pin 420 to the first position P1 or the second position P2. The controller 470 controls the rotation drive portion 447 to rotate the drive gear 441 in the first rotation direction R1 when the chuck pin 420 is moved to the first position Pl. The controller 470 controls the rotation drive portion 447 to rotate the drive gear 441 in the second rotational direction R2 when the chuck pin 420 is moved to the second position P2.

FIGS. 4 and 5 are views showing the operation of the chucking pin driving member of FIG. 2, and FIGS. 6 and 7 are views showing the position of the chuck pin of FIG. 2. FIG. Hereinafter, the driving of the chuck will be described with reference to Figs. 3 to 7. Fig.

The chuck pin 420 is provided in combination with the pin rod 445. The chuck pin 420 is positioned at a second position P2 before the substrate is seated on the support plate 410. [ The second position P2 is the unchucking position to the standby position. When the substrate is placed on the support plate 410, the rotation drive unit 447 rotates the drive gear 441 in the first rotation direction R1 as shown in FIG. The first gear 443a and the second gear 443b of the transmission gear 443 rotate in the second rotation direction R2 when the drive gear 441 rotates in the first rotation direction R1. When the second gear 443b rotates in the second rotation direction R2, the pin rod 445 linearly moves in the direction toward the support plate 410. [ Accordingly, the chuck pin 420 coupled to the pin rod 445 moves to the first position P1 as shown in Fig. 6 or Fig. The first position Pl is a chucking position at which the chuck pin 420 supports the side of the substrate. Thereafter, the liquid supply unit 380 supplies the process liquid and processes the substrate. After the process of processing the substrate, the chuck pin 420 needs to move to the second position P2. The rotation drive unit 447 rotates the drive gear 441 in the second rotation direction R2 as shown in Fig. The first gear 443a and the second gear 443b of the transmission gear 443 rotate in the first rotation direction R1 when the drive gear 441 rotates in the second rotation direction R2. The pin rod 445 linearly moves in the radial direction of the support plate 410 when the second gear 443b rotates in the first rotation direction R1. Accordingly, the chuck pin 420 moves to the second position P2 as shown in Fig. 6 or Fig. Subsequently, the substrate is transported to the outside through the transport unit.

The chuck pin driving member 440 of the present invention drives the chuck pin 420 using the rat and pinion gear method when the chuck pin 420 is driven. Alternatively, the driving of the chuck pin 420 may drive the chuck pin 420 with a plate having a protrusion in the inner central region of the supporting plate 410 and a moving rod outside the supporting plate 410. The chuck pin 420 is coupled to the moving rod. When the plate rotates, it pushes the moving rod from the projection, and when the moving rod moves to the standby position, it is fixed by a separate fixing device. On the contrary, when moving to the process position, the fixing device is removed from the moving rod, and the moving rod is moved to the process position by the elastic restoring force. The moving rod is fixed by a separate fixing device when moving to the process position.

The above-described driving of the chuck pin 420 is driven by a cam type, so that the structure of the fixing device is additionally required as compared with the embodiment of the present invention, and the components of the spin head 400 are required more than the present invention. Also, the elastic restoring force of the moving rod has a problem that the restoring force decreases with use thereof, and the replacement period is short. But. The present invention is fixed by the engagement of the gears at the first position P1 and the second position P2 so that no separate fixing device is required. Further, the configuration of the apparatus is simplified, and the configuration of the parts is minimized. In addition, since the elastic restoring force is not utilized, the replacement period of the parts is long.

2 and 3, the lifting unit 360 linearly moves the cup 320 vertically. As the cup 320 is moved up and down, the relative height of the cup 320 to the spin head 400 is changed. The lifting unit 360 includes a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixed to the outer wall of the cup 320. A moving shaft 364, which is moved in the vertical direction by a driver 366, is fixedly coupled to the bracket 362. The cup 320 is lowered so that the spin head 400 protrudes to the upper portion of the cup 320 when the substrate W is placed on the spin head 400 or lifted from the spin head 400. In addition, the height of the cup 320 is adjusted so that the processing liquid can be introduced into the predetermined collection container 360 according to the type of the processing liquid supplied to the substrate W when the process is performed. For example, while processing the substrate with the first processing solution, the substrate is positioned at a height corresponding to the inner space 322a of the inner recovery cylinder 322. [ During the processing of the substrate with the second processing solution and the third processing solution, the substrate is separated from the space 324a between the inner recovery cylinder 322 and the intermediate recovery cylinder 324, and between the intermediate recovery cylinder 324 and the outside And may be located at a height corresponding to the space 326a of the recovery cylinder 326. [ The lift unit 360 can move the spin head 400 in the up and down direction instead of the cup 320.

The liquid supply unit 380 supplies the processing liquid to the substrate W during the substrate processing step. The liquid supply unit 380 has a nozzle support 382, a nozzle 384, a support shaft 386, and a nozzle driver 388.

The support shaft 386 is provided along its third direction 16 in its longitudinal direction. A nozzle driver 388 is coupled to the lower end of the support shaft 386. The nozzle driver 388 rotates and lifts the support shaft 386. The nozzle support 382 is coupled perpendicular to the opposite end of the support shaft 386 coupled with the nozzle driver 388. The nozzle 384 is installed at the bottom end of the nozzle support 382. The nozzle 384 is moved by the nozzle driver 388 to the process position and the standby position. The process position is that the nozzle 384 is located at the vertical upper portion of the cup 320 and the standby position is the position at which the nozzle 384 is away from the vertical upper portion of the cup 320.

One or a plurality of liquid supply units 380 may be provided. When a plurality of liquid supply units 380 are provided, the chemical, rinsing liquid, or organic solvent may be provided through mutually different liquid supply units 380. The rinsing liquid may be pure, and the organic solvent may be a mixture of an isopropyl alcohol vapor and an inert gas or an isopropyl alcohol liquid.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

300: substrate processing apparatus 320: cup
360: lift unit 380: liquid supply unit
400: spin head 410: support plate
420: Chuck pin 430: Support pin
440: chuck pin drive member 441: drive gear
443: transmission gear 443a: first gear
443b: second gear 445: pin rod
446: tooth portion 447: rotation driving portion
470: control unit

Claims (14)

A spin head for supporting a substrate,
A support plate on which the substrate is placed;
A plurality of chucks positioned on the support plate and supporting side portions of the substrate; And
And a chuck pin drive member for moving the chuck pin between a first position and a second position,
Wherein the chuck pin drive member
A drive gear;
A transmission gear engaged with the driving gear; And
And a pin rod having a toothed portion engaged with the transmission gear to linearly move in accordance with rotation of the driving gear,
Wherein the chuck pin is coupled to the pin rod and moves between the first position and the second position according to a linear movement of the pin rod,
Wherein the first position is located closer to the center of the support plate than the second position. The method according to claim 1,
The transmission gear includes:
A first gear engaged with the driving gear;
A second gear provided to rotate together with the first gear and meshed with the toothed portion of the pin rod; Includes spin head. 3. The method of claim 2,
Wherein the first gear and the second gear are provided coaxially, and the second gear is positioned on the top of the first gear. The method of claim 3,
And the pin rod engages the second gear at an upper portion of the first gear. 5. The method of claim 4,
Wherein the first gear is provided with a larger diameter than the second gear. The method according to claim 1,
And the longitudinal direction of the pin rod is disposed in parallel to the radial direction of the transmission gear. The method according to claim 1,
Wherein the first position is a chucking position for supporting a side portion of the substrate with the chuck pin,
Wherein the second position is an unchucking position in which the chuck pin waits before the substrate is placed on the support plate. An apparatus for processing a substrate,
A cup having a processing space therein;
A spin head positioned in the processing space and supporting the substrate; And
And a processing liquid supply unit for supplying the processing liquid to the upper surface of the substrate placed on the spin head,
The spin-
A support plate on which the substrate is placed;
A plurality of chucks positioned on the support plate and supporting side portions of the substrate; And
And a chuck pin drive member for moving the chuck pin between a first position and a second position,
Wherein the chuck pin drive member
A drive gear;
A transmission gear engaged with the driving gear; And
And a pin rod having a toothed portion engaged with the transmission gear to linearly move in accordance with rotation of the driving gear,
Wherein the chuck pin is coupled to the pin rod and moves between the first position and the second position according to a linear movement of the pin rod,
Wherein the first position is located closer to the center of the support plate than the second position. 9. The method of claim 8,
The transmission gear includes:
A first gear engaged with the driving gear;
A second gear provided to rotate together with the first gear and meshed with the toothed portion of the pin rod; And the substrate processing apparatus. 10. The method of claim 9,
Wherein the first gear and the second gear are provided coaxially, and the second gear is positioned on the first gear. 11. The method of claim 10,
And the pin rod engages with the second gear at an upper portion of the first gear. 12. The method of claim 11,
Wherein the first gear is provided with a larger diameter than the second gear. 9. The method of claim 8,
And the longitudinal direction of the pin rod is disposed parallel to the radial direction of the transmission gear. 9. The method of claim 8,
Wherein the first position is a chucking position for supporting a side portion of the substrate with the chuck pin,
Wherein the second position is an unchucking position in which the chuck pin waits before placing the substrate on the support plate.

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