KR20160150498A - The conductive film - Google Patents
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- KR20160150498A KR20160150498A KR1020150088575A KR20150088575A KR20160150498A KR 20160150498 A KR20160150498 A KR 20160150498A KR 1020150088575 A KR1020150088575 A KR 1020150088575A KR 20150088575 A KR20150088575 A KR 20150088575A KR 20160150498 A KR20160150498 A KR 20160150498A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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Abstract
Description
The present application relates to a conductive film, a method for producing the conductive film, and uses thereof.
A touch screen panel (TSP) is an input device of an operating system that allows a user to easily input data by simply touching the screen (screen) with a hand or an object. The touch screen panel (TSP) (Resistive), and capacitive (Capacitive).
Among them, Resistive and Capacitive are the most widely used methods. Resistive method is to detect when a potential difference occurs at a pressed point when touching with a finger or a pen. It is a principle and it is called a decompression type.
In addition, the electrostatic capacity type uses the electrostatic capacity in the human body to sense and change the direction of the current.
An indium-tin oxide (ITO) film commonly used in the structure of the resistive film type and capacitive touch screen panel is formed by depositing a transparent conductive film made of indium tin compound, which is a metal conductive material, And a transparent electrode (electric circuit, pattern) is formed on the base substrate.
Particularly, in the capacitance type, visibility of a transparent electrode (electric circuit, pattern) becomes a problem. In order to improve the visibility, an optical control layer is formed on a lower surface of a conductive layer such as an ITO layer to minimize the reflectance of a film surface that has been etched (patterning) and a surface that is not etched .
Further, in the conductive film, in addition to the optical control layer, a layer such as a transparent undercoating layer is formed under the conductive layer to improve the adhesion and transmittance between the conductive layer and the base layer. The undercoat layer can be formed by wet coating or vacuum stuttering. However, since the steps for forming each layer need to be performed separately, the manufacturing process is complicated and the cost is high.
In addition, despite the above-mentioned efforts to improve the visibility, there is still a problem that the ITO layer may be pressed on the patterned substrate portion during the heat treatment process after the patterning of the ITO layer, thereby lowering the visibility.
The present application provides a conductive film which overcomes the problem of lowering the visibility due to the bending phenomenon of the conductive film.
The present application also provides a use of a conductive film, for example, a touch panel including a conductive film.
The present application has been conceived to solve the above problems, and includes a base film; A first resin layer formed on one surface of the base film; A second resin layer formed on a surface of the base film on which the first resin layer is not formed; And a conductive film comprising an amorphous or non-patterned conductive layer in which the first resin layer is formed on the side opposite to the side in contact with the base film. The conductive film can form a curved surface structure in which the direction of the conductive layer is concave when heat-treated at 150 ° C for 1 hour, for example.
In one example, the radius of curvature of the curved surface structure may be in the range of 1 mm to 1,000 mm.
In one example, the thickness of the first resin layer may be in the range of 0.3 mu m to 1.3 mu m.
In one example, the thickness of the second resin layer may be in the range of 0.9 mu m to 1.7 mu m.
The ratio (T1 / T2) of the thickness (T1) of the first resin layer and the thickness (T2) of the second resin layer may be in the range of, for example, 0.75 to 1.30.
In one example, the absolute value of the difference between the refractive index (based on 550 nm wavelength) of the first resin layer and the refractive index (based on 550 nm wavelength) of the base film may be 0.3 or less.
The conductive film of the present application may further include, for example, a conductive layer on the first resin layer.
The present application also discloses a film comprising a substrate film; A first resin layer formed on one surface of the base film; A second resin layer formed on a surface of the base film on which the first resin layer is not formed; And a crystalline or patterned conductive layer in which the first resin layer is formed on the side opposite to the side in contact with the base film, and forms a curved surface structure in which the conductive layer direction is concave. The conductive film may have a radius of curvature of, for example, a curved surface structure within a range of 1 mm to 1,000 mm.
The present application also relates to a touch panel including a conductive film.
The present application can prevent a visibility problem due to a bending phenomenon which may be caused by heat treatment or the like, and can provide a conductive film having excellent visibility and its use.
1 (a) and 1 (b) are schematic diagrams of a known conductive film.
2 is a schematic diagram of the conductive film of the present application.
Hereinafter, the present application will be described in more detail by way of examples, but is merely an example limited to the gist of the present application. It will be apparent to those skilled in the art that the present application is not limited to the process conditions set forth in the following examples, and may be arbitrarily selected within the range necessary for achieving the object of the present application .
The present application relates to a conductive film and its use.
The present invention relates to a conductive film which is improved in heat treatment for crystallization of a conductive layer during deposition and patterning of a conductive layer or visibility due to a pattern pressing phenomenon occurring in a predetermined heat treatment process for improving durability of the film, Method can be provided.
1 is a schematic diagram of a conventional conductive film. 1 (a) and 1 (b), when a typical conductive film is subjected to a predetermined heat treatment process, the conductive film is curved in the direction of the conductive layer as shown in FIG. 1 (a) A pressing phenomenon may occur in the pattern portion of the conductive layer such as curved in the direction opposite to the direction of the conductive layer. In addition, a visibility problem in which the pattern portion of the conductive layer is visually recognized due to the pressing phenomenon of such a pattern may occur.
However, in the conductive film according to the present application, a predetermined resin layer is formed on both sides of a base film, and a thickness range between the resin layers is adjusted to form a curved surface structure in the direction of the conductive layer , The pattern visibility problem was solved.
In one example, the present application is directed to a film comprising a substrate film; A first resin layer formed on one surface of the base film; A second resin layer formed on a surface of the base film on which the first resin layer is not formed; And a conductive film comprising an amorphous or non-patterned conductive layer in which the first resin layer is formed on the side opposite to the side in contact with the base film. The conductive film is subjected to a predetermined heat treatment process, for example, heat treatment at a temperature of 150 DEG C for one hour, and then a curved surface structure in which the conductive layer direction is concave is formed.
That is, the conductive film of the present application includes a conductive layer which is not crystallized or patterned, and has a curved surface structure concaved in the direction of the conductive layer during the heat treatment process condition, for example, at a temperature of 150 ° C. for one hour Forming.
The term " amorphous conductive layer " in this application means a state in which the conductive layer formed by a deposition process is crystallized by a predetermined heat treatment process, for example, a crystallinity (%) of less than 10%, less than 9% , Less than 7%, less than 6%, or less than 5%.
The term " non-patterned conductive layer " in the present application may mean a conductive layer in a state before a conductive layer formed by a deposition process has undergone a predetermined patterning process and simultaneously includes a pattern portion and a non- have.
The material of the conductive layer is not particularly limited and includes, for example, indium tin oxide (ITO) containing antimony, gold, silver, platinum, palladium, copper, titanium oxide, cadmium oxide, copper iodide, A metal oxide of at least one metal selected from the group consisting of tin oxide, fluorinated tin oxide (FTO) and zinc oxide; Carbon nanotubes; Metal nanowires formed of a material such as silver or copper; Or a conductive polymer such as a polythiophene-based polymer or a polyaniline-based polymer including poly (styrenesulfonate) (poly (styrenesulfonate)).
The conductive layer may have a refractive index, for example, at a wavelength of 550 nm of 1.9 to 2.1.
The conductive layer may be formed to have a thickness in the range of 0.01 to 0.022 mu m. When the thickness of the conductive layer is less than 0.01 mu m, the conductivity is deteriorated. When the thickness exceeds 0.022 mu m, the transparency may be lowered.
The method for forming the conductive layer may include, for example, a step of depositing the above-described conductive layer forming material by a method such as sputtering, but is not limited thereto. Methods for forming a conductive layer are known in the art and can be used without limitation in the present application.
The conductive film of the present application comprises a base film and includes a first resin layer and a second resin layer on both sides of the base film respectively. The first resin layer and the second resin layer are for distinguishing between two resin layers having different physical properties formed on both sides of the base film. For example, the resin layer formed on the conductive layer side is referred to as a first resin layer, And the resin layer formed on the opposite surface may be referred to as a second resin layer.
The conductive film of the present application includes a base film.
In one example, the base film may be a transparent film, and a known one suitable for a conductive film having transparency and strength in an appropriate range may be employed.
Specifically, the base film may be made of polyolefin such as polyethylene or polypropylene; Polyesters such as polyethylene terephthalate and polyethylene naphthalate; Polyamides such as 6-nylon or 6,6-nylon; Polycarbonate; Polyethersulfone; Or a norbornene resin can be used, but the present invention is not limited thereto. These base films may be used alone or in combination of two or more. Further, the base film may be in the form of a single film or a laminated film.
The base film of the present application may also be one whose surface has been modified.
In one example, the substrate film may be a surface modified by a known treatment method such as a chemical treatment, a corona discharge treatment, a mechanical treatment, an ultraviolet (UV) treatment, an active plasma treatment or a glow discharge treatment.
Further, the base film may contain known additives such as an antistatic agent, an ultraviolet absorber, an infrared absorber, a plasticizer, a lubricant, a colorant, an antioxidant or a flame retardant.
The thickness of the base film may be set to a suitable thickness range in consideration of transparency, the purpose of minimizing the occurrence of thinning and the occurrence of wrinkles due to tension during processing, and the like. In one example, the substrate film may have a thickness ranging from 10 占 퐉 to 80 占 퐉, or from 20 占 퐉 to 60 占 퐉, but is not limited thereto.
The conductive film of the present application comprises a first resin layer and a second resin layer on both sides of a base film. The second resin layer is formed on a surface of the base film on which the first resin layer is not formed. The term " resin layer " in the present application means a layer containing at least 15% of a resin component, and may mean a layer having appropriate rigidity and having a predetermined refractive index.
The thermal expansion coefficient of the conductive film of the present application can be determined depending on the physical properties of the first resin layer and the second resin layer. In one example, the first resin layer may serve to reduce the thermal expansion coefficient of the conductive film to 20 ppm / 占 폚 or less by adjusting the thickness range while adding the inorganic particles in a predetermined amount.
The first resin layer may include, for example, inorganic particles. The inorganic particles may be one for adjusting the refractive index to a range similar to that of the base film as described above, and impart appropriate stiffness to the first resin layer.
In one example, the inorganic particles include, but are not limited to, ZnO, TiO 2 , CeO 2 , SiO 2 , SnO 2 , ZrO 2 , MgO, or Ta 2 O 5 .
The inorganic particles may be included in the first resin layer at an appropriate ratio in consideration of the rigidity of the first resin layer and the desired refractive index.
In one example, the first resin layer may contain the inorganic particles in an amount of 40 wt%, 50 wt%, or 60 wt% or more. The first resin layer within the above-mentioned weight range can provide a conductive film having desired refractive index and rigidity and ultimately improved pattern visibility. The content of the inorganic particles may be, for example, a value calculated using a thermogravimetric analyzer (TGA). The upper limit value of the inorganic particle content range is not particularly limited, but may be, for example, 99 wt% or less, 95 wt% or less, or 90 wt% or less.
By including the inorganic particles in the same range as described above, the first resin layer can exhibit a refractive index similar to that of the base film.
In one example, the absolute value of the difference between the refractive index (based on a wavelength of 550 nm) of the first resin layer and the refractive index (based on a wavelength of 550 nm) of the base film may be 0.3 or less. The desired optical properties of the conductive film can be achieved within the refractive index difference as described above. In another example, the absolute value of the difference between the refractive index (based on a wavelength of 550 nm) of the first resin layer and the refractive index (based on a wavelength of 550 nm) of the base film may be 0.2 or less or 0.1 or less.
Specifically, the refractive index of the first resin layer measured at a wavelength of 550 nm may be in the range of 1.5 to 1.8. In another example, the first resin layer may have a refractive index, measured at a wavelength of 550 nm, in the range of 1.5 to 1.7 or 1.6 to 1.7.
The thickness of the first resin layer may be, for example, in the range of 0.3 mu m to 1.3 mu m. The thickness of the first resin layer is a factor that allows the conductive film according to the present application to form a curved surface structure concaved in the direction of the conductive layer together with the thickness of the second resin layer to be described later. An appropriate value can be set considering the thickness of the stratum. Specifically, the thickness of the first resin layer may be in the range of 0.4 占 퐉 to 1.3 占 퐉, 0.5 占 퐉 to 1.3 占 퐉, or 0.8 占 퐉 to 1.3 占 퐉.
The second resin layer of the present application has a difference in a predetermined thickness range and a difference in thermal expansion coefficient from, for example, the first resin layer, thereby imparting overall rigidity to the conductive film, To prevent the conductive film from curving in the direction of the surface of the conductive film.
In one example, the ratio (T1 / T2) of the thickness (T1) of the first resin layer and the thickness (T2) of the second resin layer may be in the range of 0.75 to 1.30. It is possible to improve the pressing phenomenon of the pattern portion of the conductive film within such a thickness ratio range. In another example, the ratio T1 / T2 may be in the range of 0.8 to 1.2 or 0.9 to 1.1, and preferably the low heat of the conductive film when the ratio T1 / T2 is in the range of 0.9 to 1.1. The pressing force of the pattern can be minimized due to the expansion coefficient. When the ratio (T1 / T2) of the thickness (T1) of the first resin layer and the thickness (T2) of the second resin layer is less than 0.75 or more than 1.30, the conductive film has a visibility Problems can arise.
The thickness of the second resin layer may be suitably set within a range that can satisfy the thickness ratio with respect to the first resin layer, and may be in the range of 0.9 占 퐉 to 1.7 占 퐉, for example.
In another example, the thickness of the second resin layer may be in the range of 0.9 占 퐉 to 1.6 占 퐉, 0.9 占 퐉 to 1.5 占 퐉, or 0.9 占 퐉 to 1.4 占 퐉.
The first resin layer and the second resin layer may be, for example, a coating layer formed by polymerization of a radically polymerizable compound.
In one example, the first resin layer and the second resin layer may comprise polymerized units of a radically polymerizable compound, for example, a monofunctional or polyfunctional (meth) acrylate compound. The term " monofunctional or polyfunctional (meth) acrylate compound " means a (meth) acrylate monomer, oligomer or mixture thereof containing one or more polymerizable functional groups such as acryloyl group or methacryloyl group . ≪ / RTI > In addition, the above "(meth) acrylate" may mean acrylate or methacrylate.
In one example, the monofunctional (meth) acrylate compound may be an alkyl (meth) acrylate.
Specifically, the alkyl (meth) acrylate may be an alkyl (meth) acrylate having an alkyl group having 1 to 20 carbon atoms, examples of which include methyl (meth) acrylate, ethyl (meth) (Meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t- (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, (Meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, Acrylic Although the agent or the like can be illustrated, without being limited thereto.
Examples of the polyfunctional (meth) acrylate compound include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) , Neopentylglycol adipate di (meth) acrylate, hydroxyl puivalic acid neopentyl glycol di (meth) acrylate, dicyclopentanyl (meth) acrylate, ) Di (meth) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylate, ethylene oxide modified di (meth) acrylate, di (meth) acryloxyethyl isocyanurate, allyl Acrylate, trimethylolpropane dimethacrylate, cyclohexyl di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, dimethylol dicyclopentanedi (meth) acrylate, ethylene oxide modified hexahydrophthalic acid di Di (meth) acrylate, neopentyl glycol-modified trimethylpropane di (meth) acrylate, adamantane di (meth) acrylate or 9,9-bis [4- Bifunctional (meth) acrylates such as acryloyloxyethoxy) phenyl] fluorine and the like; (Meth) acrylates such as trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, propionic acid modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri Trifunctional (meth) acrylates such as modified trimethylolpropane tri (meth) acrylate, trifunctional urethane (meth) acrylate or tris (meth) acryloxyethylisocyanurate; Tetrafunctional (meth) acrylates such as diglycerin tetra (meth) acrylate or pentaerythritol tetra (meth) acrylate; Pentafunctional (meth) acrylate such as propionic acid-modified dipentaerythritol penta (meth) acrylate; Caprolactone-modified dipentaerythritol hexa (meth) acrylate or urethane (meth) acrylate (e.g., a reaction product of an isocyanate monomer or trimethylolpropane tri (meth) acrylate) (Meth) acrylate and the like can be used.
Examples of the polyfunctional (meth) acrylate include urethane (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate or polyether Methacrylate) can also be used.
In the present application, the first resin layer and the second resin layer may be formed by selecting one kind or more than one kind of the appropriate kind among the above-mentioned radical polymerizing compounds.
In one example, a method of forming the first resin layer may include, for example, coating the composition for forming the first resin layer on a base film using a known coating method and then curing.
Specifically, the first resin layer may be formed by coating a composition for forming the first resin layer containing the above-mentioned monofunctional or polyfunctional (meth) acrylate compound, inorganic particles, initiator and solvent on a base film with a known coating Coating method using a method such as gravure coating, micro gravure coating, slot die coating, spin coating, spray coating, roll coating, bar coating or dip coating, and then curing.
As the initiator contained in the composition for forming the first resin layer, for example, benzoin, hydroxy ketone, amino ketone or phosphine oxide photoinitiators may be used as the radical photoinitiator.
Specific examples of the radical photoinitiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- hydroxycyclohexyl phenyl ketone Propane-1-one, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2- propyl) Ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methyl anthraquinone, 2-ethyl anthraquinone, 2- Quinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethylketal, acetophenone dimethylketal, p - dimethylaminone (2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone] or 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide But is not limited thereto.
The content of the initiator can be adjusted within a range suitable for polymerizing the monofunctional or polyfunctional (meth) acrylate compound contained in the composition for forming the first resin layer, for example, in the range of 0.05 to 3 parts by weight But the present invention is not limited thereto.
The solvent contained in the composition for forming the first resin layer may be, for example, water, an organic solvent, or a mixture thereof.
The organic solvent may be, for example, an alcohol solvent, a halogen-containing hydrocarbon solvent, a ketone solvent, a cellosolve solvent or an amide solvent.
More specifically, the alcohol solvent is methanol, ethanol, isopropyl alcohol, n-butanol or diacetone alcohol, and the halogen-containing hydrocarbon solvent is chloroform, dichloromethane or ethylene dichloride. The ketone solvent is acetaldehyde, acetone, Ketone, or methyl isobutyl ketone, and the cellosolve solvent may be methyl cellosolve or isopropyl cellosolve, and the amide solvent may be dimethyl formamide, formamide or acetamide.
The composition for forming the first resin layer may contain, for example, 40 wt% or more, 50 wt% or more, or 60 wt% or more of inorganic particles relative to the total solid content. The upper limit value of the inorganic particle content range is not particularly limited, but may be, for example, 99 wt% or less, 95 wt% or less, or 90 wt% or less. By including the inorganic particles in the same range as described above, the first resin layer can exhibit a refractive index similar to that of the base film, and can have appropriate rigidity.
The composition for forming the first resin layer of the present application may further contain known additives in addition to the above components such as a surfactant, a plasticizer, a surface lubricant, a leveling agent, an antioxidant, a corrosion inhibitor, a light stabilizer, Or a silane coupling agent, and the like. The content of the components may be appropriately added within a range that does not impair the properties of the conductive film, and may be included in the range of 0.01 to 2 parts by weight, for example, 100 parts by weight of the composition for forming the first resin layer.
The method of curing the first resin layer is not particularly limited and includes, for example, a method of irradiating a curable (UV) light or the like under a condition that a monofunctional or polyfunctional (meth) acrylate compound can be polymerized by an initiator However, the present invention is not limited thereto.
The first resin layer to be coated and cured may have a thickness in the range of 0.3 mu m to 1.3 mu m. The desired rigidity of the first resin layer can be achieved within the above-mentioned thickness range, and the difference in refractive index between the base film and the base film can be represented by a difference of not more than 0.3 at a wavelength of 550 nm including the inorganic particles in a predetermined range.
The method of forming the second resin layer may be performed by, for example, applying a composition for forming a second resin layer containing the above-mentioned monofunctional or polyfunctional (meth) acrylate compound and an initiator, followed by curing And the specific application and curing method thereof may be the same as that mentioned in the method of forming the first resin layer.
As described above, the first resin layer and the second resin layer have appropriate stiffness and can serve to lower the thermal expansion coefficient of the conductive film.
In one example, the conductive film of the present application may have a thermal expansion coefficient of 20 ppm / DEG C or less. The lower limit of the lower limit is not particularly limited. For example, the lower limit of 1 ppm / ° C, 2 ppm / ° C, 3 ppm / ° C or more, 4 ppm / Or 5 ppm / [deg.] C or higher. The coefficient of thermal expansion can be calculated, for example, by using a thermo mechanical analyzer (TMA) at a rate of 10 占 폚 / min at a temperature range of 25 占 폚 to 150 占 폚, and calculating an average thermal expansion coefficient as a coefficient of linear thermal expansion Lt; / RTI >
As described above, the conductive film of the present application is formed by forming the first resin layer and the second resin layer, which have a predetermined thickness and a difference in thermal expansion coefficient, on both surfaces of the base film, It is possible to form a concave curved surface structure in the direction of the conductive layer.
In one example, the radius of curvature of the concave curved surface structure of the conductive film may be in the range of 1 mm to 1,000 mm.
The conductive film of the present application may further include an undercoat layer. The undercoat layer may be located, for example, between the first resin layer and the amorphous or non-patterned conductive layer.
The undercoat layer is located, for example, between the conductive layer and the first resin layer, and has a predetermined refractive index, and may reduce the reflectivity of the conductive film.
The undercoat layer may have a refractive index of, for example, within a range of 1.4 to 1.7 at a wavelength of 550 nm, but the present invention is not limited thereto, and the range may vary depending on the refractive index of the conductive layer and the first resin layer.
The undercoat layer may be an organic layer, an inorganic layer, or an organic-inorganic composite layer formed of, for example, an organic material, an inorganic material, or a composite thereof.
As the organic material, for example, a resin made of an organic material capable of being thermally or UV-curable can be used. Specifically, an acrylic type, an epoxy type, a urethane type, a thiourethane type, an alkyd type resin or a siloxane type polymer can be exemplified.
Examples of the inorganic material include CaF 2 , BaF 2 , SiO 2 , LaF 3 , CeF 3 , Al 2 O 3 , silicon oxynitride, and aluminum oxynitride.
The organic-inorganic composite may be an acrylic-based, epoxy-based, or organic-based composite containing high refractive index particles of a single composition or composite composition such as TiO 2 , Nb 2 O 5 , Ta 2 O 5 , Sb 2 O 5 , ZrO 2 , ZnO, Urethane type, thiourethane type, melamine, alkyd resin, siloxane type polymer, and an organosilane compound represented by the following general formula (1). In this case, when an organosilane compound is used, refractive index control and crosslinking should be possible by mixing with high refractive index particles.
[Chemical Formula 1]
(R 1 ) m -Si-X (4-m)
Wherein R 1 may be the same or different and is selected from the group consisting of alkyl, alkenyl, alkynyl, aryl, arylalkyl, alkylaryl, arylalkenyl, alkenylaryl, arylalkynyl, alkynylaryl, Wherein R is selected from the group consisting of halogen, substituted amino, amide, aldehyde, keto, alkylcarbonyl, carboxy, mercapto, cyano, hydroxy, alkoxy of 1 to 12 carbons, alkoxycarbonyl of 1 to 12 carbons, sulfonic acid, , Methacryloxy, epoxy or vinyl group,
X may be the same or different from each other and is selected from the group consisting of hydrogen, halogen, alkoxy of 1 to 12 carbon atoms, acyloxy, alkylcarbonyl, alkoxycarbonyl, or -N (R 2 ) 2 (wherein R 2 is H, and the 12-alkyl), wherein oxygen or -NR 2 (where R 2 is a H, or alkyl having 1 to 12 carbon atoms) is inserted between the radicals R 1 and Si - (R 1) m -O -Si-X ( 4-m) or (R 1 ) m -NR 2 -Si-X (4-m) , and m is an integer of 1 to 3.
Examples of the organosilane include methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxy A silane coupling agent such as silane, phenyl dimethoxy silane, phenyl diethoxy silane, methyl dimethoxy silane, methyl diethoxy silane, phenyl methyl dimethoxy silane, phenyl methyl diethoxy silane, trimethyl methoxy silane, Triphenylmethoxysilane, diphenylmethoxysilane, phenyldimethylethoxysilane, diphenylmethylmethoxysilane, diphenylmethylethoxysilane, dimethylethoxysilane, dimethylethoxysilane, diphenylmethoxysilane, diphenylmethoxysilane, diphenylmethoxysilane, Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, p-aminophenylsilane, allyltrimethoxysilane, n- (2-aminoethyl) Methoxysilane, 3-amine Propyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidoxypropyldiisopropylethoxysilane, (3-glycidoxypropyl) methyldiethoxysilane, 3- glycidoxypropyltrimethoxy Silane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyl Trimethoxysilane, n-phenylaminopropyltrimethoxysilane, vinylmethyldiethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, and the like.
The organic-inorganic composite may also include a compound represented by the following general formula (2), alone or in combination of two or more thereof.
(2)
M- (R 3) z
In Formula 2, M represents at least one metal selected from the group consisting of aluminum, zirconium and titanium, and R 3 may be the same or different from each other and is halogen, alkyl having 1 to 12 carbon atoms, And z is an integer of 3 or 4.
When the organic-inorganic hybrid layer is used as the undercoat layer, the content of the organic material may be 1 to 99.99% by weight, specifically 5% by weight or more. In addition, the content of the inorganic material may be 0.01 to 99 wt%, specifically, less than 95 wt%.
The undercoat layer may be a single layer or a multilayer structure of two or more layers.
In one example, the undercoat layer may be a single layer or multi-layer structure formed by wet coating such as spin coating, dip coating or spray coating, as usual.
In another example, the undercoat layer may be a single layer or a multi-layer structure formed by depositing the above-described organic, inorganic or organic-inorganic composite.
The present application also relates to a conductive film comprising a crystalline or patterned conductive layer.
The term " crystalline conductive layer " in this application means a conductive layer having a crystallinity (%) of 75% or more, 80% or more, 85% or more, or 90% or more by a predetermined heat treatment process It can mean.
The term " patterned conductive layer " in the present application may mean a conductive layer in which the conductive layer includes a pattern portion and a non-pattern portion at the same time through a predetermined patterning process.
In one example, the present application is directed to a film comprising a substrate film; A first resin layer formed on one surface of the base film; A second resin layer formed on a surface of the base film on which the first resin layer is not formed; And a conductive film formed on the opposite side of the surface of the first resin layer which is in contact with the base film, the conductive film comprising a crystalline or patterned conductive layer and forming a curved surface structure in which the conductive layer direction is concave.
The conductive film including the crystalline or patterned conductive layer may include, for example, the above-described undercoat layer.
2, the conductive film of the present application includes a
The conductive film comprising the crystallized or patterned conductive layer of the present application may be after a predetermined heat treatment process.
In one example, the heat treatment process may be for crystallizing the material of the conductive layer, or may be for patterning the conductive layer and then performing an additional heat treatment to improve the durability and the like of the film.
Specifically, the heat treatment process may be performed at a temperature of 100 ° C to 200 ° C for a time of 10 minutes to 100 minutes.
The conductive film according to the present application can improve the visibility of the pattern by forming a concave curved surface structure having a predetermined radius of curvature in the direction of the conductive layer after the above-described heat treatment process.
In one example, the curvature radius of the curved surface structure of the conductive film may be in the range of 1 mm to 1,000 mm.
The present application also relates to a touch panel including a conductive film. The conductive film of the present application may be useful as an upper substrate and / or a lower substrate of a touch panel, particularly a resistive touch panel. When the upper panel is pressed with a finger or a pen, the conductive film of the resistive film type is bent and the conductive layer of the upper substrate and the lower substrate are brought into contact with each other So that it can be a structure for detecting the position.
The conductive film according to the present application can realize a touch panel which is improved in visibility, excellent in transparency, and can be manufactured at an economical cost.
The touch panel may be mounted on a display device such as an LCD, a PDP, an LED, an OLED or an E-paper, but the present invention is not limited thereto.
Hereinafter, the conductive film according to the present application will be described in more detail with reference to Examples and Comparative Examples. However, the following Examples and Comparative Examples are merely examples according to the present application and do not limit the technical idea of the present application. It will be apparent to those of ordinary skill in the art.
The physical properties of the conductive film according to the present application were measured by the following method.
1. Measurement of thermal expansion coefficient of conductive film
The average thermal expansion coefficient measured by cooling and heating the conductive film at a rate of 10 占 폚 / min in a temperature range of 25 占 폚 to 150 占 폚 using a TMA (thermo mechanical analyzer) was calculated as a coefficient of linear thermal expansion.
2. Curvature radius measurement experiment
When the conductive film subjected to the predetermined heat treatment was cut into a plane of 10 cm x 10 cm, the maximum value (H 1 ) of the distance at which each edge or one side is spaced from the plane and the length (S 1 ) The radius of curvature (R) was calculated from the following general formula (1).
[Formula 1]
R = H 1 + R x cos (S 1 / 2R)
[ Example One]
1st Preparation of Composition (A1) for Resin Layer Formation
Dipentaerythritol hexaacrylate (DPHA), inorganic particles (ZrO 2 ) and initiator (Irgacure 184) were mixed at a ratio of 40: 60: 3 and a solvent (Methyl isobutyl ketone, MIBK) A composition A1 for forming a first resin layer having a particle content of 60 wt% and a refractive index of about 1.65 was prepared.
Second Preparation of Composition (A2) for Resin Layer Formation
A composition for forming a second resin layer having a refractive index of about 1.52 (A2) was prepared by mixing a radical polymerizable acrylate (DPHA) and an initiator (Irgacure 184) in a ratio of 100: 3 and adding a solvent (Methyl isobutyl ketone, MIBK) ).
Preparation of conductive film
The first resin layer-forming composition (A1) was coated on one side of a PET base film (UH-13 PET, refractive index of about 1.65) having a thickness of 50 탆 on both sides and subjected to mold releasing treatment and irradiated with ultraviolet rays to obtain a first (A2) was coated on the surface of the PET base film (UH-13 PET) on which the first resin layer was not formed and irradiated with ultraviolet light to form a resin layer having a thickness of about 1.0 mu m Of the second resin layer. Thereafter, a composition (A3) for forming an undercoat layer of an epoxy resin and propylene glycol monomethyl ether (PGME) was coated on the first resin layer, and then the composition was irradiated with ultraviolet rays to obtain a refractive index of 1.5 An undercoat layer having a thickness of 30 nm was formed. ITO was deposited on the undercoat layer by a vacuum sputtering method to form a conductive layer. Thereafter, the ITO conductive layer was patterned and an Ag photosensitive curing process was performed at 150 ° C for 1 hour to sequentially form a conductive film containing the second resin layer / base film / first resin layer / undercoat layer / conductive layer . The physical properties and the pattern visibility evaluation results of the conductive film of Example 1 are shown in Table 1 below.
[ Example 2]
A conductive film was produced in the same manner as in Example 1, except that the thickness of the first resin layer was 1.2 탆. The physical properties and the pattern visibility evaluation results of the conductive film of Example 2 are shown in Table 1 below.
[ Example 3]
A conductive film was produced in the same manner as in Example 1, except that the thickness of the first resin layer was 1.2 탆 and the thickness of the second resin layer was 1.3 탆. The physical properties and the pattern visibility evaluation results of the conductive film of Example 3 are shown in Table 1 below.
[ Comparative Example One]
A conductive film was produced in the same manner as in Example 1, except that the thickness of the first resin layer was 0.6 mu m. The physical properties and the pattern visibility evaluation results of the conductive film of Comparative Example 1 are shown in Table 1 below.
[ Comparative Example 2]
A conductive film was produced in the same manner as in Example 1 except that the thickness of the first resin layer was 0.6 mu m and the thickness of the second resin layer was 1.3 mu m. The physical properties and pattern visibility of the conductive film of Comparative Example 2 are shown in Table 1 below.
[ Comparative Example 3]
A conductive film was produced in the same manner as in Example 1 except that the thickness of the first resin layer was 0.9 탆 and the thickness of the second resin layer was 1.3 탆. The physical properties and the pattern visibility of the conductive film of Comparative Example 3 are shown in Table 1 below.
[ Comparative Example 4]
A conductive film was produced in the same manner as in Example 1 except that the thickness of the first resin layer was 0.6 탆 and the thickness of the second resin layer was 1.7 탆. The physical properties and the pattern visibility of the conductive film of Comparative Example 4 are shown in Table 1 below.
[ Comparative Example 5]
A conductive film was produced in the same manner as in Example 1 except that the thickness of the first resin layer was 0.9 탆 and the thickness of the second resin layer was 1.7 탆. The physical properties and pattern visibility of the conductive film of Comparative Example 5 are shown in Table 1 below.
[ Comparative Example 6]
A conductive film was produced in the same manner as in Example 1 except that the thickness of the first resin layer was 1.2 탆 and the thickness of the second resin layer was 1.7 탆. The physical properties and pattern visibility of the conductive film of Comparative Example 6 are shown in Table 1 below.
[ Experimental Example ] - Evaluation of pattern visibility
The pattern visibility of the conductive films prepared according to Examples and Comparative Examples was visually evaluated based on the following criteria.
1.0: Excellent pattern visibility
1.5: Excellent pattern visibility
2.0: Good pattern visibility
2.5: poor pattern visibility
3.0: Very bad pattern visibility
As shown in the following Table 1, in the case of the conductive film according to the embodiment of the present application, the thickness range ratio of the first resin layer to the second resin layer satisfies the range of 0.75 to 1.30, By forming a concave curved surface structure, the pattern visibility is excellent. On the other hand, in the case of the conductive film of the comparative example, a curved surface structure in which the ratio of the thicknesses of the first resin layer and the second resin layer is out of the range of 0.75 to 1.30 and is concave in the direction opposite to the direction of the conductive layer is formed, Can be confirmed.
(Curl, mm)
Spacing distance: + (direction of the conductive layer), - (direction opposite to the conductive layer)
100: conductive layer
101:
102: Non-patterned portion
200: undercoat layer
300: first resin layer
400: substrate film
500: second resin layer
Claims (13)
A first resin layer formed on one surface of the base film;
A second resin layer formed on a surface of the base film on which the first resin layer is not formed; And
And an amorphous or non-patterned conductive layer in which the first resin layer is formed on an opposite side of a surface in contact with the base film,
Treated at 150 DEG C for 1 hour to form a concave curved surface in the direction of the conductive layer.
Wherein the thickness of the base film is in the range of 10 탆 to 80 탆.
Wherein the ratio (A / B) of the thickness (A) of the first resin layer to the thickness (B) of the second resin layer is in the range of 0.75 to 1.30.
And the thickness of the first resin layer is in the range of 0.3 mu m to 1.3 mu m.
And the thickness of the second resin layer is in the range of 0.9 mu m to 1.7 mu m.
Wherein the first resin layer comprises inorganic particles.
A conductive film having a thermal expansion coefficient of 20 ppm / 占 폚 or less.
Wherein the conductive film further comprises an undercoat layer between the conductive layer and the first resin layer.
A first resin layer formed on one surface of the base film;
A second resin layer formed on a surface of the base film on which the first resin layer is not formed; And
And a crystalline or patterned conductive layer in which the first resin layer is formed on the side opposite to the side in contact with the base film,
Wherein the conductive film forms a curved surface structure in which the direction of the conductive layer is concave.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100134692A (en) | 2008-04-15 | 2010-12-23 | 린텍 가부시키가이샤 | Film for scattering prevention and process for producing the same |
| KR20130110089A (en) * | 2012-03-27 | 2013-10-08 | 히다치 막셀 가부시키가이샤 | Hard coating substrate and transparent conductive film using the same |
| KR20150013914A (en) * | 2007-10-26 | 2015-02-05 | 데이진 가부시키가이샤 | Transparent conductive laminate and touch panel |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150013914A (en) * | 2007-10-26 | 2015-02-05 | 데이진 가부시키가이샤 | Transparent conductive laminate and touch panel |
| KR20100134692A (en) | 2008-04-15 | 2010-12-23 | 린텍 가부시키가이샤 | Film for scattering prevention and process for producing the same |
| KR20130110089A (en) * | 2012-03-27 | 2013-10-08 | 히다치 막셀 가부시키가이샤 | Hard coating substrate and transparent conductive film using the same |
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