KR20160137294A

KR20160137294A - RF sensor device and Sensor part provided in the same

Info

Publication number: KR20160137294A
Application number: KR1020150105034A
Authority: KR
Inventors: 이준용; 홍상진
Original assignee: 주식회사 레인보우코퍼레이션; 명지대학교 산학협력단
Priority date: 2015-05-21
Filing date: 2015-07-24
Publication date: 2016-11-30

Abstract

An RF sensor device and a sensor part included therein are provided. The disclosed RF sensor device includes an RF feedthrough for delivering an RF signal; And a sensor unit for sensing voltage and current of the RF signal using an electric field or a magnetic field generated by the RF signal, wherein the sensor unit comprises: a first board unit; A board part composed of a second board part and a third board part which are crossed and connected to one board part; A capacitor disposed on the first board and sensing a voltage of the RF signal using the electric field or the magnetic field; A first output terminal that is disposed on the third board and outputs a voltage of the sensed RF signal; A first pattern disposed on one surface of the second board and sensing a current of the RF signal using the electric field or the magnetic field; And a second output terminal disposed on the third board for outputting a current of the sensed RF signal.

Description

[0001] The present invention relates to an RF sensor device and a sensor part included therein,

Embodiments of the present invention relate to an RF sensor device and a sensor unit included therein. More particularly, the present invention relates to an RF sensor device capable of accurately detecting a phase difference between a voltage and a current of an RF signal, And a sensor unit included therein.

Generally, a sensor for measuring a high-frequency power (Large Power) signal, that is, a RF sensor device is a sensor device used for detecting a signal characteristic of a high-frequency signal, and senses and outputs the voltage and current of the RF signal. To this end, the RF sensor device comprises a component for sensing the voltage and a component for sensing the current.

However, in the case of the conventional RF sensor, the components for sensing the voltage and the components for sensing the current are separated from each other, so that the phase of voltage and current can not be accurately detected.

In order to solve the problems of the related art as described above, the present invention proposes an RF sensor device capable of accurately detecting the phase difference between voltage and current of an RF signal and a sensor part included therein.

Another object of the present invention is to provide an RF sensor device capable of adjusting the sensor output sensitivity and a sensor unit included therein.

Other objects of the invention will be apparent to those skilled in the art from the following examples.

In order to achieve the above object, according to a preferred embodiment of the present invention, there is provided an RF feedthrough for transmitting an RF signal; And a sensor unit for sensing voltage and current of the RF signal using an electric field or a magnetic field generated by the RF signal, wherein the sensor unit comprises: a first board unit; A board part composed of a second board part and a third board part which are crossed and connected to one board part; A capacitor disposed on the first board and sensing a voltage of the RF signal using the electric field or the magnetic field; A first output terminal that is disposed on the third board and outputs a voltage of the sensed RF signal; A first pattern disposed on one surface of the second board and sensing a current of the RF signal using the electric field or the magnetic field; And a second output terminal that is disposed on the third board and outputs a current of the sensed RF signal.

Each of the second board portion and the third board portion may be disposed orthogonally to the first board portion, and the second board portion and the third board portion may be disposed orthogonally.

Wherein the RF feedthrough is disposed at a lower portion of the sensor unit, the first board unit is disposed in a horizontal direction with respect to the RF feedthrough, and the second board unit and the third board unit are disposed in a direction perpendicular to the RF feedthrough .

One end of the capacitor is disposed on one surface of the first board and the other end of the capacitor is disposed on the other surface of the first board.

The second board portion and the third board portion may be positioned on one end of the capacitor.

The first pattern may have a loop shape, and at least a portion thereof may be formed along an edge of the second board portion.

A first pattern formed at a position where the first board part and the second board part are connected may be formed along an edge of the second board part among the first patterns.

A second pattern for transmitting a voltage signal sensed by the capacitor to the first output terminal; And a third pattern for transferring a current signal sensed in the first pattern to the second output terminal, wherein the third pattern may be electrically connected to the first pattern.

Each of the second pattern and the third pattern may include a resistor that performs a matching function.

And at least one gasket for adjusting the sensor output sensitivity by adjusting an interval between the RF feedthrough and the sensor unit. \

According to another embodiment of the present invention, there is provided a sensor unit included in a RF sensor device, comprising: a first board unit; a second board unit connected to the first board unit at one side thereof so as to intersect with the first board unit; A board part composed of a third board part; A capacitor disposed in the first board and sensing a voltage of the RF signal using an electric field or a magnetic field generated by an RF signal inside the RF sensor; A first output terminal that is disposed on the third board and outputs a voltage of the sensed RF signal; A first pattern disposed on one surface of the second board and sensing a current of the RF signal using the electric field or the magnetic field; And a second output terminal disposed on the third board for outputting a current of the sensed RF signal.

According to another embodiment of the present invention, there is provided an RF receiver including: a voltage sensing unit for sensing a voltage of an RF signal flowing through an RF feedthrough; And a current sensing unit for sensing a current of the RF signal, wherein the voltage sensing unit and the current sensing unit are formed in one direction of the RF feedthrough and are electrically separated from each other, A sensor device is provided.

According to another embodiment of the present invention, there is provided an RF sensor device comprising: an RF feedthrough through which an RF signal flows; A sensor unit for sensing a voltage or current of an RF signal flowing through the RF feedthrough; And at least one gasket disposed between the RF feedthrough and the sensor unit, wherein the number of the gaskets may vary depending on the power band or equipment on which the RF sensor device is installed. / RTI >

According to another embodiment of the present invention, there is provided an RF sensor device comprising: a sensor unit for sensing a voltage or current of an RF signal flowing through an RF feedthrough; And at least one gasket disposed between the RF feedthrough and the sensor, wherein the RF feedthrough is a member mounted to the RF sensor device, wherein the number of the gasket is in a power band or the RF sensor device There is provided an RF sensor device characterized in that it can be varied depending on equipment to be installed.

The RF sensor device and the sensor unit included therein can advantageously detect the phase difference between the voltage and the current of the RF signal accurately.

In addition, the RF sensor device according to the present invention and the sensor unit included therein can advantageously control the sensor output sensitivity.

1 is a perspective view of an RF sensor device according to an embodiment of the present invention.
2 is a cross-sectional view of an RF sensor device according to an embodiment of the present invention.
3 is a perspective view of an RF feedthrough according to the present invention.
4 to 10 are views showing the detailed configuration of the sensor unit according to the present invention.
11 is a diagram showing an equivalent circuit of the voltage signal detection circuit according to the present invention.
12 is a diagram showing an equivalent circuit of the current signal sensing circuit according to the present invention.
13 and 14 are views for explaining an advantage of the RF sensor device according to the present invention.
15 to 17 are diagrams showing simulation graphs for demonstrating the effect of the RF sensor device according to an embodiment of the present invention.
18 and 19 are views showing the construction of a gasket according to an embodiment of the present invention.
20 is a diagram showing an example of adjustment of sensor output sensitivity according to the number of gaskets according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing.

The terms "first "," second ", and the like can be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. The term "and / or" includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of an RF sensor apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of the RF sensor apparatus.

Referring to FIGS. 1 and 2, an RF sensor device 100 according to an embodiment of the present invention includes an RF feedthrough 110 and a sensor unit 120.

An RF feedthrough 110 transmits an RF signal. As an example, the RF feedthrough 110 is used to apply or transmit an RF signal to equipment (plasma equipment) using plasma in a thin film deposition process or a dry etching process for manufacturing a semiconductor device.

The sensor 120 senses the voltage and current of the RF signal transmitted through the RF feedthrough 110 and outputs the sensed voltage and current. At this time, the sensor unit 120 is positioned above the RF feedthrough 110.

The RF sensor device 100 may include both the RF feedthrough 110 and the sensor part 120 and may include only the sensor part 120. [ For example, in the case where an RF feedthrough is already formed in a semiconductor device, the RF sensor device 100 may not include RF feedthrough. In this case, the RF sensor device 100 including only the sensor part 120 may be mounted on the semiconductor device, and the sensor part 120 may be mounted on the upper part of the existing RF feedthrough included in the semiconductor device.

Of course, even if the semiconductor equipment has an RF feedthrough, it is possible to remove the existing RF feedthrough and to combine the RF sensor unit 100 including the RF feedthrough 110 and the sensor unit 120. [

That is, the RF sensor device 100 may include both the RF feedthrough 110 and the sensor part 120, or may include only the sensor part 120, depending on the equipment to be used. Also, when the RF sensor device 100 is fastened to a semiconductor device or the like, the RF sensor device 100 can be formed by various methods such as a screw connection and a contact method.

Hereinafter, the configuration of each component will be described in more detail.

3 is a perspective view of an RF feedthrough 110 according to the present invention.

1 to 3, the RF feedthrough 110 includes a first housing 111, an RF input terminal 112, an RF output terminal 113, and an RF tube 114.

The first housing 111 performs an RF shield function and protects and supports the RF input terminal 112, the RF output terminal 113 and the RF tube 114. For example, the first housing 111 may be made of silver coated aluminum.

The RF tube 114 connects the RF input terminal 112 and the RF output terminal 113 and transmits an RF signal. An electric field or a magnetic field is formed around the RF tube 114 according to the transmission of the RF signal, and the sensor unit 120 senses the voltage and current through the electric field or the magnetic field. For example, the RF tube 114 may be formed of copper (Cu).

4 to 10 are views showing a detailed configuration of the sensor unit 120 according to the present invention.

4 is a perspective view of the sensor unit 120 according to the present invention, and FIG. 5 is a perspective view of a portion of the sensor unit 120 excluding the second housing 121 described below 6 is a right side view of a portion of the sensor unit 120 excluding the second housing 121 and FIG. 7 is a side view of the sensor unit 120 except for the second housing 121. FIG. Fig. 8 is a front view of a portion of the sensor unit 120 excluding the second housing 121 and FIG. 9 is a rear view of a portion of the sensor unit 120 excluding the second housing 121. FIG. FIG. 10 is a bottom view of a portion of the sensor unit 120 excluding the second housing 121. FIG.

1, 2, and 4 to 10, the sensor unit 120 includes a second housing 121, a board unit 122, a capacitor 123, a first pattern 124, 125, a third pattern 126, a first output terminal 127, and a second output terminal 128.

The second housing 121 functions to protect and support the components of the sensor unit 120. For example, the first housing 111 and the second housing 121 may be made of the same material.

The capacitor 123, the first pattern 124, the second pattern 125, the third pattern 126, the first output terminal 127, and the second output terminal 128 are connected to the board portion 122 Respectively. In one example, the board portion 122 may be made of acrylic material.

At this time, the board part 122 includes the first board part 122-1 arranged in the horizontal direction, the second board part 122-2 arranged in the vertical direction, and the third board part 122-3 can do. Here, the first board portion 122-1 may be disposed to intersect with the second board portion 122-2 and the third board portion 122-3, respectively, and may be disposed orthogonally. Also, the second board portion 122-2 may be disposed to intersect with the third board portion 122-3, and may be disposed orthogonally.

Capacitor 123 senses the voltage of the RF signal passing through RF feedthrough 110. That is, an electric field is formed around the RF tube 114 in the RF feedthrough 110, and the capacitor 123 senses the voltage of the RF signal using the electric field.

The capacitor 123 is disposed on the first board portion 122-1. 5 to 10, a metal corresponding to one end of the capacitor 123 is disposed on one surface of the first board 122-1, that is, on the front surface, and the metal corresponding to the other end of the capacitor 123 The metal may be disposed on the back surface, i.e., the other surface of the first board portion 122-1. Here, the second board part 122-2 and the third board part 122-3 may be positioned on one end of the capacitor 123.

The first pattern 124 is a loop-shaped pattern that senses the current of the RF signal passing through the RF feedthrough 110. That is, an electric field is formed around the RF tube 114 in the RF feedthrough 110, and the first pattern 124 senses the current of the RF signal using the electric field.

The first pattern 124 is disposed on the second board 122-2. That is, referring to FIG. 9, the first pattern 124 is disposed on the front surface of the second board 122-2, that is, on one side. On the other hand, the back surface of the second board portion 122-2, that is, the other surface is connected to the third board portion 122-3.

According to an embodiment of the present invention, at least a portion of the first pattern 124 may be formed along the edge of the second board portion 122-2. Particularly, the first pattern 124-1 formed at a position where the first board part 122-1 and the second board part 122-2 are connected in the first pattern 124 is electrically connected to the second board part 122 -2). &Lt; / RTI >

The second pattern 125 is electrically connected to the capacitor 123 and transmits a voltage signal sensed by the capacitor 123 to the first output terminal 127 which is a voltage signal output terminal and the first output terminal 127, Outputs the voltage of the sensed RF signal.

The second pattern 125 may include a resistor 125-1 for adjusting the amplitude of the sensed voltage signal and performing a matching function. 11 shows an equivalent circuit of the voltage signal detecting circuit including the capacitor 123, the second pattern 125, and the voltage signal output terminal 127. In Fig.

The third pattern 126 is electrically connected to the first pattern 124. For example, a via hole may be formed in the second board portion 122-2 and may be connected to the first pattern 124 through a via hole. Also, the current signal sensed by the first pattern 124 is transmitted to a second output terminal 128, which is a current signal output terminal, and the second output terminal 128 outputs a current of the sensed RF signal.

In addition, the third pattern 126 may include a resistor 126-1 that performs a function of adjusting the magnitude of the sensed current signal and performs a matching function. 12 shows an equivalent circuit of the current signal detection circuit including the first pattern 124, the third pattern 126, and the second output terminal 128. In FIG.

On the other hand, in the prior art, the pattern itself did not exist. The patterns 124, 125, and 126 of the present invention may be formed in a printed manner on the corresponding boards 122-1, 122-2, and 122-3.

In summary, the RF sensor 120 in the RF sensor device 100 according to the present invention is configured such that the board part 122 composed of the first board part 122-1 to the third board part 122-3 is connected to the RF feed through The first board part 122-1 and the third board part 122-3 are connected to each other in a direction orthogonal to the first board part 122-1. The first pattern 124-1 formed at a position where the first board part 122-1 and the second board part 122-2 are connected to each other in the first pattern 124 is electrically connected to the second board part 122 -2, the capacitor 123 and the first pattern 124 are arranged close to each other. Thus, according to the present invention, there is an advantage that the voltage-current phase can be accurately detected. Hereinafter, advantages of the RF sensor device 100 according to the present invention will be described with reference to FIGS. 13 and 14. FIG.

FIG. 13 shows a schematic configuration of a semiconductor process system using an RF signal, and includes an RF signal generator, a matching device, an RF sensor device, and a rod (or chamber). The RF signal output from the RF signal generator is matched to a desired phase (for example, 0 degree or 90 degrees) by a matching device and is transmitted to the load. The RF sensor device outputs an electric field or a magnetic field corresponding to the RF signal output from the matching device. To sense the voltage and current of the RF signal.

However, in the laboratory, there is a problem that the voltage-current phase is adjusted to the desired phase, but the phase difference is different from the desired phase in actual field installation. In the case of the conventional RF sensor device, There was a problem that could not be detected.

For example, FIG. 14 illustrates a conventional RF sensor device in which a voltage sensing portion is disposed on the right side of the RF feedthrough and a current sensing portion is disposed on the left side of the RF feedthrough. In other words, the voltage-sense and the current-sense portions were physically separated completely, so that the voltage-current phase was adjusted to the desired phase (for example, 0 or 90 degrees) in the laboratory, An incompatible problem has occurred.

However, in the case of the RF sensor device 100 according to the present invention, the voltage signal sensing portion (voltage sensing portion) and the current signal sensing portion (current sensing portion) are connected to the RF feedthrough 110 in one direction And is electrically isolated, but physically integrated. Therefore, there is an advantage that the phase of the voltage-current can be accurately detected in the actual field.

15 to 17 are diagrams showing simulation graphs for demonstrating the effect of the RF sensor device 100 according to an embodiment of the present invention.

15 to 17 are simulation results for the semiconductor processing system of Fig. 13, where Fig. 15 is a graph showing the power set point (13.56 MHz) of the RF signal generator is the horizontal axis, (13.56 MHz) of the RF signal generator is the horizontal axis, and the peak-to-peak of the voltage signal of the RF sensor device 100 is the vertical axis. FIG. 17 is a simulation graph in which the power set point (13.56 MHz) of the RF signal generator is the horizontal axis and the voltage output value of the RF sensor device 100 is multiplied by the current output value, Graph. Referring to FIG. 17, it can be seen that the linear component is very good, especially the linear component is excellent even at low power, and there is no significant difference in the sensor to sensor.

18 and 19, the RF sensor device 100 according to an embodiment of the present invention is disposed between the RF feedthrough 110 and the sensor unit 120, and adjusts the distance between the RF feedthrough 110 and the sensor unit 120 And may include at least one gasket 130 for regulating sensor output sensitivity. For example, the gasket 115 may be made of the same material as the first housing 111 and the second housing 121. At this time, the gasket 130 is bolted to the RF feedthrough 110 and the sensor unit 120. Accordingly, the RF sensor device 100 according to an embodiment of the present invention has an advantage that it can cope with a wide range from a low power band to a high frequency band.

Without the gasket 115, an RF sensor device 100 is required depending on equipment to be installed or the detection band of the RF sensor device 100. For example, when the distance between the RF feedthrough 110 and the sensor unit 120 should be the first distance, and when the distance between the RF feedthrough 110 and the sensor unit 120 is the first distance, When it should be another second distance, different RF sensor devices 100 are required, resulting in increased equipment costs of the sensing system.

However, the present invention can freely adjust the distance between the RF feedthrough 110 and the sensor unit 120 through the gasket 130, and it is possible to use one RF sensor device 100 So that the equipment cost of the sensing system can be reduced considerably. In particular, since the gasket 130 can all use the same size, the installation cost of the sensing system can be further reduced.

The RF feedthrough 110 and the sensor unit 120 are separated from each other and a desired number of gaskets 130 are inserted between the RF feedthrough 110 and the sensor unit 120, The through-hole 110, the gasket 130, and the sensor unit 120 may be bolted together. Also, even if the desired distance between the RF feedthrough 110 and the sensor unit 120 is unknown, the number of gaskets 130 may be adjusted to determine the desired number of gaskets 130 in the field.

Also, according to another embodiment of the present invention, the RF sensor device 100 may include only the sensor part 120 and the gasket 130. In the case where the RF feedthrough is already installed in the semiconductor equipment, the user arranges an appropriate number of gaskets 130 between the sensor unit 120 and the RF feedthrough and then forms holes in the RF feedthrough in the field The sensor unit 120, the gasket 130, and the RF feedthrough may be bolted.

20 shows an example of adjustment of sensor output sensitivity according to the number of gaskets 130 to be inserted. 20A shows an example in which the interval between the RF feedthrough 110 and the sensor unit 120 is 5 mm by inserting the gasket 130 and FIG. The gap between the RF feedthrough 110 and the sensor unit 120 is 7 mm by inserting the gasket 130 into the RF feedthrough 110. In this case, 110 and the sensor unit 120 is 10 mm. Referring to FIG. 20, it can be confirmed that a value of V x I shows a good linear component in all power periods.

As described above, the present invention has been described with reference to particular embodiments, such as specific elements, and limited embodiments and drawings. However, it should be understood that the present invention is not limited to the above- Various modifications and variations may be made thereto by those skilled in the art to which the present invention pertains. Accordingly, the spirit of the present invention should not be construed as being limited to the embodiments described, and all of the equivalents or equivalents of the claims, as well as the following claims, belong to the scope of the present invention .

Claims

RF feedthrough for transmitting RF signals; And
And a sensor unit for sensing voltage and current of the RF signal using an electric field or a magnetic field generated by the RF signal,
The sensor unit may include a board unit including a first board unit, a second board unit connected to the first board unit at one side of the first board unit and a third board unit connected to the first board unit, A capacitor disposed on the first board and sensing a voltage of the RF signal using the electric field or the magnetic field; A first output terminal that is disposed on the third board and outputs a voltage of the sensed RF signal; A first pattern disposed on one surface of the second board and sensing a current of the RF signal using the electric field or the magnetic field; And a second output terminal that is disposed on the third board and outputs a current of the sensed RF signal.

The method according to claim 1,
Wherein each of the second board portion and the third board portion is disposed orthogonally to the first board portion, and the second board portion and the third board portion are disposed orthogonally.

The method according to claim 1,
Wherein the RF feedthrough is located below the sensor unit,
Wherein the first board portion is disposed in a horizontal direction with respect to the RF feedthrough and the second board portion and the third board portion are disposed in a direction perpendicular to the RF feedthrough.

The method according to claim 1,
Wherein one end of the capacitor is disposed on one surface of the first board and the other end of the capacitor is disposed on the other surface of the first board.

The method of claim 3,
And the second board portion and the third board portion are positioned on one end of the capacitor.

The method according to claim 1,
Wherein the first pattern is a loop shape, and at least a part of the first pattern is formed along an edge of the second board part.

The method according to claim 6,
Wherein a first pattern formed at a position where the first board part and the second board part are connected is formed along a corner of the second board part.

The method according to claim 1,
A second pattern for transmitting a voltage signal sensed by the capacitor to the first output terminal; And
And a third pattern for transmitting a current signal sensed in the first pattern to the second output terminal,
And the third pattern is electrically connected to the first pattern.

9. The method of claim 8,
Wherein each of the second pattern and the third pattern includes a resistor that performs a matching function.

The method according to claim 1,
And at least one gasket for adjusting the sensor output sensitivity by adjusting an interval between the RF feedthrough and the sensor unit.

In the sensor portion included in the RF sensor device,
A board part including a first board part, a second board part and a third board part crossing the first board part on one side of the first board part;
A capacitor disposed in the first board and sensing a voltage of the RF signal using an electric field or a magnetic field generated by an RF signal inside the RF sensor;
A first output terminal that is disposed on the third board and outputs a voltage of the sensed RF signal;
A first pattern disposed on one surface of the second board and sensing a current of the RF signal using the electric field or the magnetic field; And
And a second output terminal disposed on the third board for outputting a current of the sensed RF signal.

12. The method of claim 11,
Wherein the first pattern is a loop shape and a first pattern formed at a position where the first board part and the second board part are connected is formed along an edge of the second board part, Sensor section.

12. The method of claim 11,
A second pattern formed on the other surface of the second board to transmit a voltage signal sensed by the capacitor to the first output terminal; And
And a third pattern formed on the second board portion and transmitting a current signal sensed by the first pattern to the second output terminal,
And the third pattern is electrically connected to the first pattern.

14. The RF sensor device of claim 13, wherein the second pattern adjusts the magnitude of the voltage of the sensed RF signal, and the third pattern controls the magnitude of the sensed RF signal current.

A voltage sensing unit for sensing a voltage of an RF signal flowing through the RF feedthrough; And
And a current sensing unit for sensing a current of the RF signal,
Wherein the voltage sensing unit and the current sensing unit are formed in one direction of the RF feedthrough and electrically separated from each other but physically formed integrally.

The apparatus of claim 15, wherein the voltage sensing unit includes a second pattern for controlling a magnitude of the sensed voltage, and the current sensing unit includes a third pattern for controlling a magnitude of the sensed current,
Wherein the patterns are physically separated.

17. The method of claim 16, wherein the voltage sensing unit senses the voltage through a capacitor and a second pattern that face the RF tube of the RF feedthrough, and the current sensing unit includes a first pattern of a loop shape, And the current sensor detects the current through the third pattern electrically connected.

In the RF sensor device,
RF feed through with RF signal;
A sensor unit for sensing a voltage or current of an RF signal flowing through the RF feedthrough; And
At least one gasket disposed between the RF feedthrough and the sensor portion,
Wherein the number of the gaskets may vary depending on the power band or equipment on which the RF sensor device is installed.

The RF receiver as claimed in claim 18, wherein the gasket is made of the same material as the housing of the RF feedthrough or the housing of the sensor portion, and the RF feedthrough, the gasket and the sensor portion are coupled through a bolt connection. Sensor device.

19. The RF sensor device of claim 18, wherein when the plurality of gaskets are arranged between the RF feedthrough and the sensor unit, the gaskets have the same size.

In the RF sensor device,
A sensor unit for sensing a voltage or current of an RF signal flowing through the RF feedthrough; And
At least one gasket disposed between the RF feedthrough and the sensor portion,
Wherein the RF feedthrough is a member mounted on the RF sensor device, and the number of the gaskets may vary depending on a power band or equipment on which the RF sensor device is installed.