KR20160127598A - Apparatus preventing for electromagnetic interference of themotherapical fancy mattress - Google Patents

Abstract

The present invention relates to an electromagnetic wave eliminating device of a thermal fancy mattress which mounts a bimetal (20) on a printed circuit board (30) and bonds and fixes a first heating line (11) and a second heating line (12) of a non-magnetic field heating line (10) to a connection terminal (31) patterned on the printed circuit board (30) by welding, respectively, thereby minimizing electromagnetic wave generation in a potion to which the bimetal (20) is connected and simultaneously reducing work processes.

Description

TECHNICAL FIELD [0001] The present invention relates to an electromagnetic interference (EMI)

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electromagnetic wave removing apparatus for a hot blanket, and more particularly, to an electromagnetic wave removing apparatus for a hot blanket which prevents electromagnetic waves from being generated in a bimetal switch installed to prevent overheating of a hot wire.

Generally, a thermal head or a hot head, which is often called an electric head, is provided with a heating element arranged inside thereof to generate heat at a predetermined temperature, thereby heating and heating the body.

The temperature controller can be controlled by the user, and temperature control by the temperature controller is performed by the temperature sensor.

That is, the temperature set by the temperature controller is stored in the controller, the heating temperature of the hot wire is checked by the temperature sensor, and when the temperature checked by the temperature sensor reaches the set temperature, So that the user can maintain the desired temperature while being controlled.

Patent Application No. 0880225 (filed on January 16, 2009, entitled "Thermal Dislocation Envelope Removed Electromagnetic Waves") is a patent application filed and registered by the applicant of the present invention. In the prior art, Devices are separated and wired so that only display and control devices are provided so that electromagnetic waves are not generated from the temperature control device at the user's head.

That is, the components for generating electromagnetic waves in the temperature control device are separately separated so that electromagnetic waves are not generated from the temperature control device provided at the head, thereby protecting the user from the influence of electromagnetic waves.

On the other hand, as a practical means of generating heat in a hot material, a non-magnetic heat line for shielding electromagnetic waves is mainly used. In order to prevent overload, a bimetal is connected to the heat-

1, the second heating line 2 is twisted to the outside of the first heating line 1 at the center thereof so that electromagnetic waves are not generated due to destruction and destruction of the magnetic field. In this case, The first heating line 1 of the first cover 3 is protected by the first cover 3 and the second heating line 2 is provided in the form of a twist along the outer surface of the first cover 3, The outside of the 2 heating line (2) is covered with the second covering body (4) for insulation again.

At this time, the second heating line (2) is formed to have a relatively small thickness in order to twist the outside of the first cover body (3) in a twisted manner compared to the first heating line (1).

Therefore, the first heating line 1 can not be directly connected to the bimetal 5 due to the fear of cutting the second heating line 2, which is relatively thin compared to the bimetal 5 provided for preventing the overheat of the non- And the second heating line (2), so that one end is connected to the first heating line (1) and the second heating line (2), and the other end is connected to the bimetallic side terminal Twisted and connected.

However, since the wiring sections of the lead heating wire 6 connecting the bimetals 5 from the unshielded heating wire are provided side by side between the wires, electromagnetic waves such as the unshielded heating wire are not canceled, And one end of the lead heating wire 6 is connected to the first heating wire 1 and the second heating wire 2 which are mutually non-magnetic hot wires, while the other end is connected to the bimetal 5 by soldering There is a problem in that the connection strength is weak with the inconvenience of having to perform double work to twine and connect.

Patent No. 0880225 (Jan. 16, 2009)

Accordingly, it is an object of the present invention to solve the problems and disadvantages described above, and to provide a bimetal-type printed circuit board in which a bimetal is mounted by soldering directly to a bimetal- There is a main object of providing an electromagnetic wave removing device of a hot colector for eliminating generation of electromagnetic waves.

In addition, the present invention provides a device for removing electromagnetic waves of a hot co-worker having a bimetal mounted on a printed circuit board and having a pair of heating lines of a non-magnetic heating line fixed to the circuit board by soldering, There is another purpose.

In order to accomplish the above object, the present invention provides an apparatus for removing electromagnetic waves of a hot colector, comprising: a bimetal mounted on a printed circuit board; a first heating line And the second heating line are jointly fixed by soldering.

According to the electromagnetic wave absorber of the present invention having the above-described structure, electromagnetic radiation is prevented from being generated at a portion connected to the bimetal by connecting the electromagnetic radiation lines without forming a lead heating line by using a printed circuit board, .

In addition, the present invention makes it possible to fix the heat wire wiring work in the hot bobbins more easily and firmly by connecting the bismuth-mounted printed circuit board directly to the bismuth-free printed wiring board by soldering.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view illustrating a connection structure between a non-
FIG. 2 is a schematic view showing a structure of a recessed portion illustrating an apparatus for removing electromagnetic waves of a hot co-
FIG. 3 is a structural view illustrating a configuration in which an electromagnetic wave removing device of a hot colector according to the present invention covers the outside with a case and a rubber cap

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of an electromagnetic wave removing device for a hot colector according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 2, the bimetal 20 includes a bimetal 20 connected to a heat-resistant hot wire 10 arranged in a hot material, (10) is directly connected to the printed circuit board (30).

The first heating line 11 is covered by the first covering body 13 so that the first heating line 11 is insulated from the first heating body 11, A second heating line 12 having a smaller thickness than the first heating line 11 is wound on the outer circumferential surface of the body 13 in a twisted shape having a predetermined pitch and the second heating line 12 is wound on the second covering body 14 And the insulation is formed by wrapping the outer portion by the insulating coating structure.

That is, the non-magnetic heat line 10 has a structure in which the first heating line 11 and the second heating line 12 are constituted by a single insulation structure using a double insulation coating. I am sad.

The non-magnetic heat lines 10 are arranged so as to be substantially entirely arranged in the heat mixer. The non-magnetic heat lines 10 are connected to the bimetal 20 at the end portions of the heat-

The bimetal 20 is mounted on the printed circuit board 30 and connected to the printed circuit board 30 by a pattern printed on the printed circuit board 30 to connect the bimetal 20 with an electrical signal. .

The printed circuit board 30 of the present invention has a larger cross sectional area than the bimetal 20 and the connection terminal 31 formed through the pattern printed from the connection terminal of the bimetal 20 is connected to the printed circuit board 30, As shown in FIG.

The first heating line 11 and the second heating line 12, which are stripped from the unshielded heating line 10, are connected to the connection terminal 31 of the printed circuit board 30 by soldering.

3 shows a size including the connection ends of the first heating line 11 and the second heating line 12 connected to the printed circuit board 30 together with the printed circuit board 30 on which the bimetal 20 is mounted, So that the electromagnetic wave can be more completely removed by covering it with the case 40 made using the electromagnetic wave shielding metal plate.

At this time, it is more preferable to cover the outside of the case 40 with the protective cap 50 of the rubber material because the case 40 of the metal is sharp when the corner is sharp.

The operation of the electromagnetic wave removing device of the present invention according to the present invention will be described in more detail as follows.

The bimetal 20 is mounted on a printed circuit board 30 on which a pattern is printed so that the unmagnetic line 10 is directly connected to the printed circuit board 30 on which the bimetal 20 is mounted. .

That is, since the unshrouded hot wire 10 is directly connected to the printed circuit board 30 on which the bimetal 20 is mounted, the present invention has the same effect as connecting the unshrunk hot wire 10 directly to the bimetal 20 .

However, the first heating line 11 and the second heating line 12 of the non-magnetic heating line 10 are soldered to the printed circuit board 30 on which the bimetal 20 is mounted, So that workability and connection strength can be further improved.

In particular, the second heating line 12, which is thinner than the first heating line 11, is connected to the printed circuit board 30 by soldering, thereby preventing the first heating line 11 from being broken.

Above all, according to the present invention, since the non-magnetic hot wire 10 is directly connected to the printed circuit board 30, the formation period of the lead heating wire is omitted, thereby preventing further generation of electromagnetic waves.

In addition, the printed circuit board 30 is very easy to manufacture, and when the bimetal 20 is mounted on the printed circuit board 30, it is easier to handle the bimetal 20, Can be greatly simplified by soldering.

The entire area where the solderless soldering is performed with the printed circuit board 30 is covered with the case 40 made of a metal plate for electromagnetic shielding, It is possible to completely block the electromagnetic waves which may be partially generated through the connection end of the unshrouded hot wire 10.

Since the second heating line 12 in the unshaped heating line 10 can be protected from the outside by covering the portion where the bimetal 20 is connected to the unshaped heating line 10 by the case 40, So as to maintain a stable state.

However, the case 40 may have a sharp portion such as a corner or a bent portion at the time of manufacture, so that the outside of the case 40 is covered by the protective cap 50 of the rubber material so that the handling can be further secured.

As described above, according to the present invention, the bimetal 20 is mounted on the printed circuit board 30 so that direct connection with the unmagnified thermal line 10 is possible, thereby minimizing the electromagnetic wave generation site on the bimetal 20 side, So that it can be used.

In particular, by connecting the non-magnetic hot wire 10 directly to the bimetal 20, the connecting operation is greatly simplified and the connection strength is greatly increased.

On the other hand, if the connection is made by soldering rather than the connection between the heat wires, the work can be performed more quickly, so that the work process of connecting the bimetal 20 to the heatless wire 10 can be performed more quickly.

10: Non-magnetic heat line 11: First heating line
12: second heating line 20: bimetal
30: printed circuit board 31: connection terminal
40: Case 50: Rubber cap

Claims (3)

Wherein the bimetal is mounted on the printed circuit board, and the first heating line and the second heating line of the non-magnetic heating line are joined and fixed to each other by soldering to the connection terminal patterned on the printed circuit board.
The method according to claim 1,
Wherein the printed circuit board includes a bimetal mounted on the printed circuit board and covers a portion to which the unshielded hot wire is connected from the outside by a case made of a metal plate for removing electromagnetic waves.
The method of claim 2,
Wherein the case is covered with a protective cap of a rubber material.

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