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KR20160108007A - Multi-layer ceramic capacitor and manufacturing method thereof - Google Patents

Multi-layer ceramic capacitor and manufacturing method thereof Download PDF

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Publication number
KR20160108007A
KR20160108007A KR1020150031758A KR20150031758A KR20160108007A KR 20160108007 A KR20160108007 A KR 20160108007A KR 1020150031758 A KR1020150031758 A KR 1020150031758A KR 20150031758 A KR20150031758 A KR 20150031758A KR 20160108007 A KR20160108007 A KR 20160108007A
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South Korea
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multilayer ceramic
electrode
buffer
electrodes
internal
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KR1020150031758A
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Korean (ko)
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오영주
윤중락
한재성
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삼화콘덴서공업주식회사
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Priority to KR1020150031758A priority Critical patent/KR20160108007A/en
Publication of KR20160108007A publication Critical patent/KR20160108007A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the multilayer ceramic capacitor, wherein the multilayer ceramic capacitor includes: a multilayer ceramic sintered body; An internal electrode portion formed to be positioned inside the multilayer ceramic fired body; And a buffer electrode portion formed on the inner side of the multilayer ceramic fired body so as to be spaced apart from the internal electrode portion. The buffer electrode portions are spaced apart from one side of the first internal electrode, A plurality of first buffer electrodes formed to be exposed to the side ends of the first and second internal electrodes, a plurality of first buffer electrodes formed on the other side of the second internal electrodes and exposed to the other ends of the other side of the multilayer ceramic sintered body, And a buffer electrode.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a multilayer ceramic capacitor and a manufacturing method thereof,

More particularly, the present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same. More particularly, the present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same. More particularly, And a bending phenomenon of the multilayer ceramic fired body, which may occur in a region where the multilayer ceramic body is not formed, and a method of manufacturing the multilayer ceramic capacitor.

The multilayer ceramic capacitor is mounted on a printed circuit board using a surface mounting method or is pre-mounted on the inside of an embedded printed circuit board. The multilayer ceramic capacitor includes a ceramic sintered body and an external electrode. The ceramic sintered body is formed such that a plurality of internal electrode layers are alternately stacked, and the external electrodes are formed at both ends of the ceramic sintered body and are formed of a plurality of conductive layers.

Korean Patent No. 1245347 (Patent Document 1) relates to a multilayer ceramic capacitor, which comprises a multilayer ceramic sintered body and a plurality of external electrodes.

The multilayer ceramic fired body is formed so that a plurality of internal electrode layers intersect with each other, and a plurality of external electrodes are formed to surround one side or the other side of the multilayer ceramic fired body and are connected to the internal electrode layers. The plurality of conductive layers are composed of a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first conductive layer is formed so as to surround the circumferential surface and the end face of one side or the other side of the multilayer ceramic fired body and connected to the internal electrode layer, and the second conductive layer is laminated so as to surround the first conductive layer. The third conductive layer is formed to be laminated so as to surround the second conductive layer, and the fourth conductive layer is laminated so as to surround the third conductive layer.

A conventional multilayer ceramic capacitor such as Korean Patent No. 1245347 is formed so as to surround one end or the other end of the multilayer ceramic sintered body in order to connect the external electrode to the internal electrode layer. The thickness of the external electrode formed to surround the end of the multilayer ceramic sintered body in order to connect the internal electrode layers with external electrodes must be maintained to some extent as in the conventional multilayer ceramic capacitor, When the multilayer ceramic capacitor is mounted on a printed circuit board using a solder, the solder rubs up on the external electrode and is adhered thereto, thereby requiring a space for electrical insulation with other electronic components, thereby lowering the component mounting density.

Patent Document 1: Korean Patent No. 1245347 (Registered on March 23, 2013)

SUMMARY OF THE INVENTION The object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a green sheet and an internal electrode each having a thin film, Which can prevent the bending phenomenon of the multilayer ceramic sintered body which can be caused by the surface of the multilayer ceramic body, and a method of manufacturing the multilayer ceramic capacitor.

Another object of the present invention is to provide a method of manufacturing a multilayer ceramic sintered body, in which an internal electrode is formed so as to expose an internal electrode to an upper surface or a lower surface of the multilayer ceramic sintered body and the green sheet and the internal electrode are respectively formed into a thin film, And a method of manufacturing the multilayer ceramic capacitor which can prevent internal electrodes from being electrically short-circuited due to generation of a crack due to an external impact applied to the multilayer ceramic sintered body by forming external electrodes to surround the multilayer ceramic body.

It is a further object of the present invention to provide a multilayer ceramic capacitor capable of mounting a multilayer ceramic capacitor on a printed circuit board without using an excessive amount of solder because the internal electrodes are formed to expose the internal electrodes to the upper surface or the lower surface of the multilayer ceramic sintered body. Capacitor and a method of manufacturing the same.

A multilayer ceramic capacitor includes: a multilayer ceramic sintered body; An internal electrode portion formed to be positioned inside the multilayer ceramic fired body; And a buffer electrode portion formed on the inner side of the multilayer ceramic sintered body so as to be spaced apart from the internal electrode portion. The internal electrode portions are formed on the upper surface or the lower surface of the multilayer ceramic sintered body A plurality of first internal electrodes formed to expose at least one end of one end of the laminated ceramic sintered body, and a plurality of first internal electrodes formed on the upper surface of the laminated ceramic sintered body so as to be positioned between the plurality of first internal electrodes, And a plurality of second internal electrodes formed to expose at least one end of both ends of the other side with a lower surface, wherein the buffer electrode portions are spaced apart from one side of the first internal electrode, A plurality of first buffer electrodes formed to be exposed at one end of the sidewall of the sintered body, And one end of the second buffer electrode is exposed to the other end of the other side of the multilayer ceramic fired body, and one side surface and the other side of the multilayer ceramic fired body are laminated ceramic And is a surface orthogonal to an upper surface or a lower surface of the sintered body.

A method of manufacturing a multilayer ceramic capacitor of the present invention includes: preparing a plurality of green sheets; A first internal electrode, a second internal electrode, a first buffer electrode, and a second buffer electrode are formed on the upper surface of the plurality of green sheets such that a first buffer electrode or a second buffer electrode is spaced apart from the first internal electrode or the second internal electrode, Forming a buffer electrode; A plurality of green sheets having the first internal electrode, the second internal electrode, the first buffer electrode, and the second buffer electrode are sequentially stacked in the vertical direction so that the first internal electrode and the second internal electrode are symmetrical to each other, Thereby forming a pressure bonding agent; Forming a green chip by cutting the compression bonding agent so that a cross-section of the plurality of first internal electrodes, the plurality of second internal electrodes, the plurality of first buffer electrodes, and the plurality of second buffer electrodes is exposed to the outside; Forming a green chip and firing the green chip to form a multilayer ceramic sintering body; Polishing the surface of the multilayer ceramic sintered body when the multilayer ceramic sintered body is formed; Forming a first external electrode or a second external electrode by dipping the multilayer ceramic sintered body so as to surround one or both sides of the multilayer ceramic sintered body when the multilayer ceramic sintered body is polished, One or more first internal electrodes or a plurality of second internal electrodes are exposed on one or both ends of one or both of the upper and lower surfaces of the green chip and a plurality of first buffer electrodes or a plurality of second buffer electrodes So that the end of one side or the other side is exposed.

The multilayer ceramic capacitor of the present invention and the method of manufacturing the same can be produced in a region where a green sheet and an internal electrode are each formed as a thin film and a buffer electrode is formed on a green sheet when a laminate is pressed, There is an advantage that the bending phenomenon of the multilayer ceramic sintered body can be prevented.

The multilayer ceramic capacitor of the present invention and the method of manufacturing the same may further include a multilayer ceramic capacitor and a method of manufacturing the multilayer ceramic capacitor, wherein the internal electrode is formed to expose the internal electrode to the upper surface or the lower surface of the multilayer ceramic sintered body, An external electrode is formed so as to surround one side or the other side of the fired body, thereby cracking due to an external impact applied to the multilayer ceramic sintered body can be advantageously prevented from electrically shorting to each other.

1 is a side view of a multilayer ceramic capacitor according to another embodiment of the present invention;
FIG. 2 is a perspective view of the multilayer ceramic capacitor shown in FIG. 1,
FIG. 3 is an exploded perspective view of the multilayer ceramic capacitor shown in FIG. 2,
Fig. 4 is an exploded perspective view showing another embodiment of the multilayer ceramic capacitor shown in Fig. 3,
5 is a process diagram showing a method of manufacturing a multilayer ceramic capacitor according to another embodiment of the present invention.

Hereinafter, embodiments of a multilayer ceramic capacitor and a method of manufacturing the same will be described with reference to the accompanying drawings.

2 to 4, a multilayer ceramic capacitor 100 according to another embodiment of the present invention includes a multilayer ceramic sintered body 110, an internal electrode unit 120, and a buffer electrode unit 170 . The multilayer ceramic fired body 110 is formed of a known dielectric material and the internal electrode unit 120 is formed to be located inside the multilayer ceramic fired body 110. The buffer electrode unit 170 is formed inside the multilayer ceramic fired body 110 so as to be spaced apart from the internal electrode unit 120.

The structure of the multilayer ceramic capacitor 100 according to another embodiment of the present invention having the above-described structure will be described in more detail as follows.

The multilayer ceramic fired bodies 110 are formed by laminating a plurality of green sheets 110c as shown in FIGS. 2 and 3, followed by compression and firing, and the plurality of green sheets 110c are formed by a known dielectric material And is made up of at least 300 pieces. The thickness t1 of the plurality of green sheets 110c is 0.6 to 30 占 퐉, respectively. That is, the multilayer ceramic sintered body 110 is formed by stacking 300 or more green sheets 110c made of a thin film.

The internal electrode unit 120 includes a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122. A plurality of first internal electrodes 121 are formed on the lower surface 110b of the multilayer ceramic fired body 110 so as to be spaced apart from each other in a direction Z perpendicular to the multilayer ceramic fired body 110, One end is exposed. The plurality of second internal electrodes 122 are spaced apart from each other in the vertical direction Z with respect to the multilayer ceramic fired bodies 110 so as to be positioned between the plurality of first internal electrodes 121, 121d, 122c, 122d of the other side are exposed to the lower surface 110b of the lower surface 121a, 122b. For example, the plurality of first inner electrodes 121 are formed such that one end 121d of each of the two ends 121c and 121d is exposed to the outside, And one end 122d of one of the first and second electrodes 122c and 122d is exposed to the outside.

The plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 are spaced apart from each other by a distance m as shown in FIG. 2, and the distance m is 0.3 to 5 占 퐉. The plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 may be formed of the internal electrode pattern layers 121a and 122a and the exposed electrode pattern layers 121b and 122b as shown in FIGS. .

The internal electrode pattern layers 121a and 122a are formed so as to overlap with each other in a direction perpendicular to the multilayer ceramic sintered body 110, that is, in the Z-axis direction Z. The exposed electrode pattern layers 121b and 122b are formed integrally with the internal electrode pattern layers 121a and 122a and are connected to the upper surface 110a or the lower surface 110b of the multilayer ceramic fired body 110 at both ends 121c, 121d, 122c, and 122d are exposed. For example, the exposed electrode pattern layers 121a and 122b are formed to be oriented in the Z-axis direction Z toward the upper surface 110a and the lower surface 110b of the multilayer ceramic fired body 110, 121d, 122c, 122d of one of the two ends 121c, 121d, 122c, 122d on the upper surface 110a or the lower surface 110b of the body 110 is exposed to the outside. The internal electrode pattern layers 121a and 122a and the exposed electrode pattern layers 121b and 122b are formed into a plate shape using Cu or Ni, respectively.

The width of the exposed electrode pattern layers 121b and 122b is set to be 30 to 50 占 퐉 so as to be smaller than the width of the internal electrode pattern layers 121a and 122a so that the height of the exposed electrode pattern layers 121b and 122b is larger than that of the internal electrode pattern layers 121a and 122a. . Here, the internal electrode pattern layers 121a and 122a and the exposed electrode pattern layers 121b and 122b are divided into dotted lines shown in FIG. 3 and FIG. 4, respectively, and the widths are the lengths in the respective X- In the Y-axis direction.

The internal electrode pattern layers 121a and 122a and the exposed electrode pattern layers 121b and 122b are formed such that one end or the other end 121e or 122e of the exposed electrode pattern layer 121b or 122b is electrically connected to one side 110d of the multilayer ceramic sintered body 110 And the green sheet 110c is spaced apart from the end of the other side 110e by a first gap S2. The distance between the first interval S2 and the internal electrode pattern layers 121a and 122a and the exposed electrode pattern layers 121b and 122b is 5 to 1% of the total length S1 of the multilayer ceramic fired body 110, Or Ni, and has a thickness t3 of 0.8 to 1.5 mu m.

The buffer electrode unit 170 includes a plurality of first buffer electrodes 171 and a plurality of second buffer electrodes 172 as shown in FIGS. The plurality of first buffer electrodes 171 are spaced apart from one side of the first internal electrode 121 so that one end 171a of the first buffer electrode 171 is exposed to one side 110d of the multilayer ceramic fired body 110 do. The plurality of second buffer electrodes 172 are disposed on the other side of the second internal electrode 122 and the other end 172a is exposed on the other side 110e of the multilayer ceramic fired body 110 . One side face 110d and the other side face 110e of the multilayer ceramic fired body 110 respectively indicate faces perpendicular to the upper face 110a and the lower face 110b of the multilayer ceramic fired body 110. [

A plurality of first buffer electrodes 171 and a plurality of second buffer electrodes 172 may be formed on one side or the other side of the multilayer ceramic sintered body 110 such that one end or the other end 171a, And exposed to the ends 110d and 110e of the first internal electrode 121 and the exposed electrode pattern layer 121b and 122b of the second internal electrode 122 at a second gap S3 And is formed on the green sheet 110c. The plurality of first buffer electrodes 171 and the plurality of second buffer electrodes 172 are formed in a plate shape using Cu or Ni, respectively, and the thickness t3 thereof is formed to be 0.8 to 1.5 μm, The distance between the two intervals S3 is set to be 1 to 0.1% of the total length S1 of the multilayer ceramic fired body 110. [

As described above, the multilayer ceramic capacitor 100 according to the present invention is manufactured by forming the green sheet 110c, the first internal electrode 121 and the second internal electrode 122 as thin films, It is possible to prevent the bending phenomenon of the multilayer ceramic sintered body 110 that may occur in the region where the first internal electrode 121 or the second internal electrode 122 is not formed in the green sheet 110c by forming the electrode can do.

1 and 2, the plurality of first internal electrodes 121, the plurality of second internal electrodes 122, the plurality of first buffer electrodes 171, and the plurality of second buffer electrodes 172 may be formed as shown in FIGS. And is connected by the first external electrode 221 and the second external electrode 222. The first external electrode 221 and the second external electrode 222 may be formed of one or a mixture of two or more of Au, Cu, Pt, Pd, Al, Ni, and Sn.

The first external electrode 221 is formed to be positioned on one side 110d of the multilayer ceramic sintered body 110 and is connected to the first internal electrodes 121 and the plurality of first buffer electrodes 171 The second external electrode 222 is formed on the other side 110e of the multilayer ceramic sintered body 110 so as to be connected to the plurality of second internal electrodes 122 and the plurality of second buffer electrodes 172 do. The first external electrode 221 and the second external electrode 222 may be formed of a mixture of one or more of Cu, Ni, and Sn, respectively. The external electrode pattern layers 221a and 222a, And a pair of pad electrode pattern layers 221b and 222b.

The external electrode pattern layers 221a and 222a are formed on one side 110d and the other side 110e of the multilayer ceramic sintered body 110 and include a plurality of first buffer electrodes 171 and a plurality of second buffer electrodes 172 The pair of pad electrode pattern layers 221b and 222b are disposed to face each other and are connected to the external electrode pattern layers 221a and 222a and are electrically connected to the upper surface of the multilayer ceramic fired body 110 And are electrically connected to the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122, respectively, formed on the lower surface 110a or the lower surface 110b. The length S4 of each of the pair of pad electrode pattern layers 221b and 222b is formed to be 10 to 30% of the length S1 of the multilayer ceramic fired body 110. [

The multilayer ceramic capacitor 100 according to the present invention includes the first internal electrode 121 and the second internal electrode 122 in a state in which the first internal electrode 121 and the second internal electrode 122 are exposed to the outside, And the green sheet 110c are formed as a thin film, the first external electrode 221 and the second external electrode 222 are formed so as to surround one side or the other side of the multilayer ceramic fired body 110, respectively, Cracks are prevented from being generated inside the multilayer ceramic sintered body 110 due to external impact applied to the multilayer ceramic sintered body 110 by firmly supporting the sintered body 110, It is possible to prevent the second internal electrodes 122 from being electrically short-circuited to each other.

A method of manufacturing the multilayer ceramic capacitor 100 according to another embodiment of the present invention will now be described.

As shown in FIG. 5, a method of fabricating a multilayer ceramic capacitor 100 according to another embodiment of the present invention includes preparing a plurality of green sheets 110c (S110).

The first buffer electrode 171 and the second buffer electrode 172 are formed on the upper surface of the plurality of green sheets 110c when the plurality of green sheets 110c are prepared, The first internal electrode 121, the second internal electrode 122, the first buffer electrode 171, and the second buffer electrode 172 are formed to be spaced apart from the electrode 122 (S120). A method of fabricating the first internal electrode 121, the plurality of second internal electrodes 122, the first buffer electrode 171 and the second buffer electrode 172 is manufactured by a method such as vapor deposition, printing, and plating .

When the first internal electrode 121, the plurality of second internal electrodes 122, the first buffer electrode 171 and the second buffer electrode 172 are formed on the plurality of green sheets 110c, A plurality of green sheets 110 having a plurality of first internal electrodes 121, a plurality of second internal electrodes 122, a first buffer electrode 171 and a second buffer electrode 172 are formed on the first internal electrode 121, (Not shown) so as to be symmetrical with respect to each other, and then pressed to form a pressure bonding agent (not shown) (S130). The first buffer electrode 171 or the second buffer electrode 172 is formed on the green sheet 110 so that a region where the first internal electrode 121 or the second internal electrode 122 is not formed is pressed against the compression force So as to prevent the bending phenomenon due to the partially depressed bending phenomenon.

When the compression bonding agent is formed, the cross sections of the first internal electrodes 121, the second internal electrodes 122, the first buffer electrodes 171, and the second buffer electrodes 172 are exposed to the outside So that a green chip (not shown) is formed (S140). That is, a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 may have one or more ends 121c, 121d, 122c, and 122d of the two ends 121c, 121d, 122c, And a plurality of first buffer electrodes 171 and a plurality of second buffer electrodes 172 are exposed to one side or the other of the upper and lower surfaces of the first and second buffer electrodes 171 and 172, To form a green chip.

When a green chip is formed, the green chip is fired to form a multilayer ceramic sintering body 110 (S150). Description of the sintering process of the multilayer ceramic sintered body 110 will be omitted because known techniques are applied. When the multilayer ceramic fired body 110 is formed, the surface of the multilayer ceramic fired body 110 is polished (S160). Description of the surface process of the multilayer ceramic fired body 110 is omitted because a known technique is applied.

When the multilayer ceramic fired body 110 is polished, a first external electrode 221 or a second external electrode 222 is formed so as to surround one side or the other side of the multilayer ceramic fired body 110 (S170). The first external electrode 221 and the second external electrode 222 are formed by dipping a conductive material into a paste so that one side or the other side of the multilayer ceramic sintered body 110 is enclosed, A conductive material is formed on one side or the other side of the fired body 110 (S171). When a conductive material is formed so as to surround one side or the other side of the multilayer ceramic fired body 110, the conductive material is heat-treated (S172). Here, since the known technique is applied to the heat treatment method, a description thereof will be omitted. When the heat treatment is completed, the first external electrode 221 or the second external electrode 222 is formed by plating a conductive material on the surface of the conductive material formed on one side or the other side of the multilayer ceramic fired body 110 (S173) . Here, one or a mixture of two or more of Au, Cu, Pt, Pd, Al, Ni and Sn is used as the conductive material.

The first external electrode 221 and the second external electrode 222 formed by using the dipping process are formed so as to surround one side or the other side of the multilayer ceramic sintered body 110 to form external electrode pattern layers 221a and 222a, A pair of pad electrode pattern layers 221b and 222b, and a pair of external electrode connection pattern layers 221c and 222c.

The external electrode pattern layers 221a and 222a are formed on one side 110d and the other side 110e of the multilayer ceramic sintered body 110 and include a plurality of first buffer electrodes 171 and a plurality of second buffer electrodes 172 The pair of pad electrode pattern layers 221b and 222b are arranged to face each other and are perpendicular to the external electrode pattern layers 221a and 222a and are connected to the external electrode pattern layers 221a and 222a . The pair of external electrode connection pattern layers 221c and 222c are formed when the first external electrode 221 and the second external electrode 222 are formed by using the dipping process and the pad electrode pattern layers 221b and 222b are orthogonal And are formed to be opposite to each other and connected to the external electrode pattern layers 221a and 222a and the pair of pad electrode pattern layers 221b and 222b.

As described above, the multilayer ceramic fired body 110 includes external electrode pattern layers 221a and 222a, a pair of pad electrode pattern layers 221b and 222b, and a pair of external electrode connection pattern layers 221c and 222c on one side or the other side, The first external electrode 221 and the second external electrode 222 are formed to be firmly supported by the first external electrode 221 and the second external electrode 222, . The first external electrode 221 and the second external electrode 222 are connected to both ends 121c, 121d, 122c, and 122d of the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122, Is formed to be exposed to the upper surface 110a or the lower surface 110b of the multilayer ceramic fired body 110 to a thickness sufficient to support the multilayer ceramic fired body 110. [ Here, the thickness is formed to be 10 mu m or less.

A plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 are formed to be exposed to the upper surface 110a or the lower surface 110b of the multilayer ceramic fired body 110. In the multilayer ceramic capacitor of the present invention, (Not shown) can be mounted on a printed circuit board (not shown) without using an excessive amount of solder when mounted, thereby preventing the solder from narrowing the gap with other components (not shown).

As described above, the multilayer ceramic capacitor of the present invention and the method of manufacturing the same are manufactured by forming a green sheet and an internal electrode as thin films, respectively, and forming a buffer electrode on a green sheet when a laminate is pressed, It is possible to prevent bending phenomenon of the multilayer ceramic sintered body which may be generated.

The multilayer ceramic capacitor of the present invention and the method of manufacturing the same may further include a multilayer ceramic capacitor and a method of manufacturing the multilayer ceramic capacitor, wherein the internal electrode is formed to expose the internal electrode to the upper surface or the lower surface of the multilayer ceramic sintered body, An external electrode is formed to surround one side or the other side of the sintered body so that cracks due to an external impact applied to the multilayer ceramic sintered body can be prevented from being electrically shorted to each other.

The present invention is applicable to the manufacturing industry of multilayer ceramic capacitors.

100: Multilayer ceramic capacitor 110: Multilayer ceramic sintered body
120: internal electrode part 121: first internal electrode
122: second internal electrode 170: buffer electrode portion
171: first buffer electrode 172: second buffer electrode 172:
221: first outer electrode 222: second outer electrode

Claims (8)

A multilayer ceramic sintered body;
An internal electrode portion formed to be positioned inside the multilayer ceramic fired body;
And a buffer electrode portion formed inside the multilayer ceramic fired body so as to be spaced apart from the internal electrode portion,
Wherein the internal electrode portions are formed on the upper and lower surfaces of the multilayer ceramic sintered body so as to be spaced apart from each other in the multilayer ceramic sintered body so as to expose at least one end of one end of the laminated ceramic sintered body, A plurality of second internal electrodes formed so as to be spaced apart from each other between the first internal electrodes of the multilayer ceramic sintered body and exposed to one or both ends of the other side of the multilayer ceramic sintered body, Lt; / RTI >
The buffer electrode portions are spaced apart from one side of the first internal electrode, respectively, a plurality of first buffer electrodes formed on one side of the first internal electrode and exposed at one side of the multilayer ceramic sintered body, And a plurality of second buffer electrodes formed on the other side of the multilayer ceramic sintered body so as to be exposed to the other side of the multilayer ceramic sintered body,
Wherein one side surface or the other side surface of the multilayer ceramic fired body is a surface orthogonal to an upper surface or a lower surface of the multilayer ceramic fired body. The method according to claim 1,
Wherein the multilayer ceramic fired body is formed by laminating a plurality of green sheets, followed by compression and firing, wherein the plurality of green sheets is at least 300, and the thickness of the plurality of green sheets is 0.6 to 30 m Wherein said capacitor is a multilayer ceramic capacitor. The method according to claim 1,
Wherein the plurality of first internal electrodes and the plurality of second internal electrodes are formed so as to overlap each other in a direction perpendicular to the multilayer ceramic fired body;
And an exposed electrode pattern layer which is connected to the internal electrode pattern layer and is formed such that at least one of both ends is exposed on an upper surface or a lower surface of the multilayer ceramic sintered body,
Wherein the internal electrode pattern layer and the exposed electrode pattern layer are formed on a green sheet so that one end and the other end of the internal electrode pattern layer and the other end of the exposed electrode pattern layer are separated from each other by a first distance from one side or the other end of the other side of the multilayer ceramic sintered body, Wherein the internal electrode pattern layer and the exposed electrode pattern layer are formed in a plate shape using Cu or Ni respectively and have a thickness of 0.8 to 1.5 占 퐉. Ceramic capacitors. The method according to claim 1,
The plurality of first buffer electrodes and the plurality of second buffer electrodes are exposed at one side or the other end of the other side of the multilayer ceramic fired body, The first electrode layer and the second electrode layer are formed on a green sheet at a second spacing on one side or the other side of the electrode pattern layer and are each formed in a plate shape using Cu or Ni and each having a thickness of 0.8 to 1.5 μm, Is 1 to 0.1% of the total length of the multilayer ceramic fired body. The method according to claim 1,
The plurality of first inner electrodes, the plurality of second inner electrodes, the plurality of first buffer electrodes, and the plurality of first inner electrodes and the plurality of first buffer electrodes are respectively connected to the first outer electrodes A plurality of second internal electrodes and a plurality of second buffer electrodes are connected to each other by a second external electrode,
Wherein the first external electrode and the second external electrode are formed of one or more of Au, Cu, Pt, Pd, Al, Ni, and Sn, respectively. 6. The method of claim 5,
Wherein the first external electrode and the second external electrode are formed on one side or the other side of the multilayer ceramic sintered body and are connected to a plurality of first buffer electrodes or a plurality of second buffer electrodes, respectively;
And a pair of pad electrode pattern layers connected to the external electrode pattern layer and formed on an upper surface or a lower surface of the multilayer ceramic sintered body and connected to a plurality of first internal electrodes or a plurality of second internal electrodes,
Wherein the length of each of the pair of pad electrode pattern layers is 10 to 30% of the length of the multilayer ceramic fired body. Preparing a plurality of green sheets;
A first internal electrode, a second internal electrode, a first buffer electrode, and a second buffer electrode are formed on the upper surface of the plurality of green sheets such that a first buffer electrode or a second buffer electrode is spaced apart from the first internal electrode or the second internal electrode, Forming a buffer electrode;
A plurality of green sheets having the first internal electrode, the second internal electrode, the first buffer electrode, and the second buffer electrode are sequentially stacked in the vertical direction so that the first internal electrode and the second internal electrode are symmetrical to each other, Thereby forming a pressure bonding agent;
Forming a green chip by cutting the compression bonding agent so that a cross-section of the plurality of first internal electrodes, the plurality of second internal electrodes, the plurality of first buffer electrodes, and the plurality of second buffer electrodes is exposed to the outside;
Forming a green chip and firing the green chip to form a multilayer ceramic sintering body;
Polishing the surface of the multilayer ceramic sintered body when the multilayer ceramic sintered body is formed;
Forming a first external electrode or a second external electrode so as to surround one side or the other side of the multilayer ceramic sintered body when the multilayer ceramic sintered body is polished,
The step of forming the green chip may include exposing a plurality of first internal electrodes or a plurality of second internal electrodes to an upper surface or a lower surface of the green chip at one or more ends of one or both ends, Wherein the first buffer electrode and the second buffer electrode are cut to expose one end or the other end of the electrode or the plurality of second buffer electrodes. 8. The method of claim 7,
The forming of the first external electrode or the second external electrode may include dipping a conductive material into a paste so that one side or the other side of the multilayer ceramic fired body is enclosed and a conductive material is wrapped on one side or the other side of the multilayer ceramic fired body ;
A step of heat treating the conductive material when the conductive material is formed on one side or the other side of the multilayer ceramic fired body;
Forming a first external electrode or a second external electrode by plating a conductive material on a surface of a conductive material formed on one side or the other side of the multilayer ceramic fired body when the heat treatment is completed,
Wherein at least one of Au, Cu, Pt, Pd, Al, Ni, and Sn is used as the conductive material.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101245347B1 (en) 2011-12-29 2013-03-25 삼화콘덴서공업주식회사 Multi layer ceramic capacitor

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