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KR20160033910A - Retainer and wafer carrier including the same - Google Patents

Retainer and wafer carrier including the same Download PDF

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Publication number
KR20160033910A
KR20160033910A KR1020140124723A KR20140124723A KR20160033910A KR 20160033910 A KR20160033910 A KR 20160033910A KR 1020140124723 A KR1020140124723 A KR 1020140124723A KR 20140124723 A KR20140124723 A KR 20140124723A KR 20160033910 A KR20160033910 A KR 20160033910A
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KR
South Korea
Prior art keywords
wafer
carrier
retainer
support structure
wafers
Prior art date
Application number
KR1020140124723A
Other languages
Korean (ko)
Inventor
배상현
정규동
김일환
김정환
이혁재
조태제
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020140124723A priority Critical patent/KR20160033910A/en
Priority to US14/729,030 priority patent/US20160082569A1/en
Priority to CN201510589858.0A priority patent/CN105448789A/en
Publication of KR20160033910A publication Critical patent/KR20160033910A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

A retainer for a wafer carrier comprises a body and a support structure. The body can be arranged on the inner surface of the wafer carrier. The support structure is vertically formed on the inner surface of the body to contact with the side surface of each of the multiple wafers stored in the wafer carrier. The support structure is separated from the upper edge of the side surface of the wafer. Therefore, the support structure does not contact with the side edge of the wafer, thereby preventing the side edge of the wafer from being damaged by contact with the support structure.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a retainer,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a retainer and a wafer carrier including the same, and more particularly to a retainer for supporting wafers disposed in a wafer carrier accommodating a plurality of wafers, and a wafer carrier including such a retainer.

Generally, wafers can be housed in a wafer carrier. The wafer carrier may include a front open unified pod (FOUP). The FOUP may include a retainer to support the wafers.

According to the related art, the side edges of the wafer may often be damaged by contact with the retainer. In particular, the side edges of a wafer having a thin thickness can be more severely damaged.

The present invention provides a wafer carrier retainer capable of preventing breakage of side edges of a wafer.

The present invention also provides a wafer carrier comprising the retainer described above.

A retainer for a wafer carrier according to one aspect of the present invention may include a body and a support structure. The body may be disposed on the inner side of the wafer carrier housing a plurality of wafers. The body may have a plurality of slots to accommodate the sides of the wafers. A support structure may be formed on the sidewalls of each of the slots to contact the sides of each of the wafers. The support structure may be spaced from the upper edge of the side of the wafer.

In exemplary embodiments, the support structure may be spaced from the bottom edge of the side of the wafer.

In exemplary embodiments, the support structure may include a round surface that is in point contact with a side surface of the wafer.

In exemplary embodiments, the support structure may include at least one embossing having the rounded surface.

In exemplary embodiments, the embossing may have a hollow structure.

In exemplary embodiments, the support structure may include a support surface that is in partial surface contact with a side surface of the wafer.

In exemplary embodiments, the support surface may be parallel to the side of the wafer.

In exemplary embodiments, the support surface may have a thickness that is thinner than the thickness of the wafer.

In exemplary embodiments, the body may include a first receiving groove communicating with the slot to expose an upper edge of the wafer and an upper end of the supporting surface.

In exemplary embodiments, the body may further include a second receiving groove communicating with the slot to expose a lower edge of the wafer and a lower end of the supporting surface.

In exemplary embodiments, the support structure may comprise an elastic material.

In exemplary embodiments, the support structure may be integrally formed with the body.

In exemplary embodiments, the wafer may include a carrier wafer, and a device wafer attached onto the carrier wafer and having plugs embedded therein.

In exemplary embodiments, the device wafer may have a side surface that is coplanar with a side surface of the carrier wafer.

In exemplary embodiments, the device wafer may have a side located inwardly toward the center of the carrier wafer than a side of the carrier wafer.

A retainer for a wafer carrier according to another aspect of the present invention may include a body and an embossing. The body may be disposed on an inner surface of the wafer carrier that houses carrier wafers, and device wafers attached to each of the carrier wafers and with plugs embedded therein. The body may have a plurality of slots to accommodate the carrier wafers and the sides of the device wafers. Embossing may be formed in the sidewalls of each of the slots to make point contact with the sides of each of the carrier wafers. The embossing may be spaced from the upper edge of the device wafer.

In exemplary embodiments, the device wafer may have a side surface that is coplanar with a side surface of the carrier wafer.

In exemplary embodiments, the embossing may be spaced from the bottom edge of the side of the carrier wafer.

In exemplary embodiments, the embossing may comprise an elastic material.

In exemplary embodiments, the embossing may be integrally formed with the body.

In exemplary embodiments, the embossing may have a hollow structure.

A wafer carrier according to another aspect of the present invention may include a case, a door and retainers. The case may have an inlet for receiving a plurality of wafers, a first inner side facing the inlet, and second and third inner side surfaces extending from the first inner side to the inlet. The door may be installed at the entrance. The retainers include a body having a plurality of slots disposed on the inner side of the door and the first to third inner sides of the case and receiving the sides of the wafers, And a support structure that is in contact with the side of the wafer and spaced from the top edge of the side of the wafer.

In exemplary embodiments, the support structure may be spaced from the bottom edge of the side of the wafer.

In exemplary embodiments, the support structure may include at least one embossing that is in point contact with a side of the wafer.

In exemplary embodiments, the support structure may include a support surface that is in partial surface contact with a side surface of the wafer.

In the exemplary embodiments, the body includes a first receiving groove communicating with the slot to expose an upper edge of the wafer and an upper end of the supporting surface, and a second receiving groove communicating with the slot, And a second receiving groove that exposes a lower end of the second receiving groove.

In the exemplary embodiments, the retainers disposed on the second and third inner sides may have a rounded shape protruding toward the second and third inner sides of the case.

In exemplary embodiments, the wafer may comprise a carrier wafer, and a device wafer having plugs mounted on the carrier wafer and having sides that are coplanar with the sides of the carrier wafer.

A wafer carrier according to another aspect of the present invention may include a case, a door, a first retainer, and a second retainer. The case may have an inlet for receiving a plurality of wafers, a first inner side facing the inlet, and second and third inner side surfaces extending from the first inner side to the inlet. The door may be installed at the entrance. A first retainer is disposed on an inner surface of the door and a first inner surface of the case and has a body having a plurality of first slots for receiving the sides of the wafers, And a support structure that contacts each side and is spaced from the top edge of the side of the wafer. A second retainer is disposed on the second and third inner sides of the case and may have a plurality of second slots to receive the sides of the wafers.

In exemplary embodiments, the second retainer may include a support surface formed in a sidewall of the second slots and partially in surface contact with a side surface of the wafer.

In an exemplary embodiment, the second retainer has a first receiving groove communicating with the second slot to expose an upper edge of the wafer and an upper end of the supporting surface, and a second receiving groove communicating with the second slot, And a second receiving groove exposing the lower edge of the lower surface and the lower surface of the supporting surface.

In exemplary embodiments, the second retainer may have a rounded shape protruding toward the second and third inner sides of the case.

In exemplary embodiments, the wafer may comprise a carrier wafer, and a device wafer having plugs mounted on the carrier wafer and having sides that are coplanar with the sides of the carrier wafer.

According to the present invention described above, since the support structure is spaced from the side upper and lower edges of the wafer, the support structure may not contact the side edges of the wafer. Thus, the side edges of the wafer may not be damaged by contact with the support structure. In particular, since the contact between the side edge of the thin device wafer with the plug and the supporting structure can be fundamentally prevented, breakage of the side edge of the thin wafer can be prevented. As a result, in order to prevent breakage of the side edge of the thin device wafer, it is possible to eliminate the step of removing the side surface of the device wafer partly.

1 is an exploded perspective view showing a wafer carrier according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view showing that the retainer of the wafer carrier shown in Fig. 1 supports the wafer.
3 is a cross-sectional view taken along the line III-III in Fig.
4 is a cross-sectional view taken along the line IV-IV in Fig.
5 is a cross-sectional view showing a retainer according to another embodiment of the present invention.
Fig. 6 is a cross-sectional view showing that the retainer shown in Fig. 2 supports another wafer.
7 is a cross-sectional view showing that the retainer shown in Fig. 2 supports another wafer.
8 is a cross-sectional view showing that a retainer of a wafer carrier according to another embodiment of the present invention supports a wafer.
9 is a cross-sectional view showing that the retainer shown in Fig. 8 supports another wafer.
10 is a cross-sectional view showing that the retainer of the wafer carrier shown in Fig. 8 supports another wafer.
11 is a cross-sectional view showing that a retainer of a wafer carrier according to another embodiment of the present invention supports a wafer.
12 is a cross-sectional view taken along the line XII-XII in Fig.
13 is a cross-sectional view taken along the line XIII-XIII in Fig.
14 is a cross-sectional view showing that a retainer of a wafer carrier according to another embodiment of the present invention supports a wafer.
15 is a cross-sectional view taken along the line XV-XV in Fig.
16 is a cross-sectional view taken along the line XVI-XVI of Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

FIG. 1 is an exploded perspective view showing a wafer carrier according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing that a wafer carrier is supported by a retainer of the wafer carrier shown in FIG. 1, and FIG. 3 is a cross- 4 is a cross-sectional view taken along the line IV-IV in Fig. 2, Fig. 5 is a sectional view showing a retainer according to another embodiment of the present invention, Fig. 6 is a cross- Fig. 7 is a cross-sectional view showing that the retainer of the wafer carrier shown in Fig. 2 supports another wafer. Fig.

Referring to FIG. 1, the wafer carrier 100 according to the present embodiment may include a case 110, first retainers 120, second retainers 130, and a door 140.

The case 110 may have an inner space horizontally accommodating a plurality of wafers W. The case 110 may have an inlet 112 in which the wafers W are received. The case 110 may have a substantially rectangular parallelepiped shape. Thus, the case 110 includes a first inner side 114 facing the open inlet 112, a second inner side 116 extending from the first inner side 114 to the inlet and a third inner side 118 ). The second inner side surface 116 and the third inner side surface 118 may have a round shape protruding outward from the center of the case 110. However, the case 110 is not limited to a rectangular parallelepiped shape and may have various other shapes.

The door 140 may be installed at the entrance of the case 110. The case 110 and the door 140 can be formed into a rectangular parallelepiped shape by closing the door 140 after the wafers W are received in the inner space of the case 110. [

The first retainers 120 may be disposed on an inner side surface of the door 140 and a first inner side surface 114 of the case 110. The second retainers 130 may be disposed on the second inner side surface 116 and the third inner side surface 118 of the case 110. Therefore, as shown in Fig. 2, the first retainers 120 can be opposed to each other. The second retainers 130 can also be opposed to each other. As a result, four side surfaces of the wafer W can be supported by the first retainers 120 and the second retainers 130.

Referring to FIG. 3, the first retainer 120 may include a first body 122 and a first support structure 124. The first body 122 may be disposed on an inner surface of the door 140 and a first inner surface 114 of the case 110. That is, the outer surface of the first body 122 may be fixed to the inner surface of the door 140 and the first inner surface 114 of the case 110. The first body 122 may have a plurality of first slots 126 for receiving a side S of the wafer W. [

The first support structure 124 may be formed on the inner surface of the first body 122. The first support structure 124 may be integrally formed with the first body 122. The first body 122 and the first support structure 124 may include an elastic material such as plastic, rubber, or the like.

The first support structure 124 can be brought into close contact with the side surface S of the wafer W to support the wafer W. [ In this embodiment, the first support structure 124 may comprise a first embossing arranged equidistantly along the vertical direction. The first embossing 124 may have a structure protruding in a semicircular shape from the inner side of the first body 122 toward the horizontal direction. Accordingly, the first embossing 124 may have a rounded surface that makes point contact with the side surface S of the wafer W. [ The first embossing 124 of the elastic material in contact with the side surface S of the wafer W can be slightly retracted and smoothly support the side surface S of the wafer W. [

In addition, since the first embossing 124 has a semicircular shape, the upper edge UC of the side S of the wafer W can be spaced from the first embossing 124. [ In addition, the lower edge (DC) of the side S of the wafer W may also be spaced from the first embossing 124. That is, only one point S of the side surface S of the wafer W is in point contact with the first embossing 124, and the upper edge UC and the lower edge DC are not in contact with the first embossing 124 have. The upper edge UC and the lower edge DC of the wafer W are prevented from contacting the first emboss 124 so that the upper edge UC and the lower edge DC of the wafer W It may not be damaged.

Additionally, the wafer W enters the interior space of the case 110 in a misaligned state and the upper edge UC and the lower edge DC of the wafer W contact the first embossment 124 The first embossing 124 may have a thickness substantially equal to the thickness of the wafer W. [ However, the thickness of the first embossing 124 is not limited to the thickness of the wafer W, and may be any thickness that prevents contact between the upper edge UC and the lower edge DC of the wafer W and the embossing 124 It can be changed within limits.

Referring to FIG. 4, the second retainer 130 may have substantially the same structure as that of the first retainer 120. The second inner side surface 116 and the third inner side surface 118 of the case 110 have a round shape protruding outward from the center of the case 110 so that the second retainer 130 also has the second inner side surface 116 and the third inner side surface 118, as shown in Fig.

The second retainer 130 may include a second body 132 and a second support structure 134. The second body 132 may be disposed on the second inner side surface 116 and the third inner side surface 118 of the case 110. The second body 132 may have a plurality of second slots 136 for receiving the side S of the wafer W. [

The second support structure 134 may include a second embossing formed on an inner surface of the second body 132. The second support structure 134 may be integrally formed with the second body 132. The second body 132 and the second support structure 134 may include elastic materials such as plastic, rubber, and the like. The second embossing 134 may have substantially the same shape and function as the first embossing 124. Therefore, the repetitive description of the second embossing 134 is omitted.

As another example, referring to FIG. 5, the first embossing 124 may have a hollow portion 128. That is, the first embossing 124 may have an empty hollow structure inside. The first embossing 124 of elastic material having the hollow portion 128 in contact with the side surface S of the wafer W is slightly contracted into the hollow portion 128 and the side surface S of the wafer W is slightly contracted It can be supported smoothly. The second embossing 134 may also have a hollow.

The first and second retainers 120 and 130 may support the wafer shown in Fig. The wafer of Fig. 6 may include a carrier wafer CW1 and a device wafer DW1. The device wafer DW1 may be attached to the upper surface of the carrier wafer CW1 via an adhesive. The carrier wafer CW1 may comprise a bare wafer without electronic devices. On the other hand, the device wafer DW1 may include electronic components. The device wafer DW1 may have a side surface DS1 located on the substantially same plane as the side surface CS1 of the carrier wafer CW1.

For example, the device wafer DW1 may include a plurality of plugs P. [ The plugs P can be embedded along the vertical direction in the device wafer DW1. The plugs P may have a function of electrically connecting semiconductor chips in a multi-chip package having a structure in which a plurality of semiconductor chips are stacked. The plugs P can be electrically contacted with the conductive bumps of the semiconductor chip located on the upper side. Thus, the upper ends of the plugs P can be exposed through the upper surface of the device wafer DW1. To this end, the upper surface of the device wafer DW1 can be removed until the upper ends of the plugs P are exposed through the grinding process. During this grinding process, the carrier wafer CW1 can support the device wafer DW1. As a result, the device wafer DW1 can have a relatively thin thickness relative to the thickness of the carrier wafer CW1. As a result, the side edge UC1 of the device wafer DW1 can be very easily broken. A trimming process for partially removing the side surface DS1 of the device wafer DW1 may be required to prevent breakage of the side edge UC1 of the device wafer DW1.

In this embodiment, the first embossing 124 may be in point contact only with the side surface CS1 of the carrier wafer CW1. The first embossing 124 may be spaced from the upper edge UC1 of the side DS1 of the device wafer DW1. Also, the first embossing 124 may be spaced from the lower edge DC1 of the side surface CS1 of the carrier wafer CW1. The sharp top edge UC1 of the device wafer DW1 and the sharp bottom edge DC1 of the carrier wafer CW1 are prevented from contacting the first embossing 124 so that the upper edge of the device wafer DW1 UC1 and the lower edge DC1 of the carrier wafer CW1 may not be broken. As a result, a trim process for partially removing the side surface DS1 of the device wafer DW1 may not be necessary.

The first and second retainers 120, 130 may support the wafer shown in Fig. The wafer of Fig. 7 may include a carrier wafer CW2 and a device wafer DW2. The carrier wafer CW2 and the device wafer DW2 in Fig. 7 have substantially the same structure as the carrier wafer CW1 and the device wafer DW1 in Fig. 6 except for the side face DS2 of the device wafer DW2 Lt; / RTI > Therefore, repeated descriptions of the carrier wafer CW2 and the device wafer DW2 in Fig. 7 are omitted.

The device wafer DW2 may have a side face DS2 located on the inner side toward the center of the carrier wafer CW2 than the side face CS2 of the carrier wafer CW2. That is, the above-mentioned trim process is performed on the side surface DS2 of the device wafer DW2, so that the side surface DS2 of the device wafer DW2 is located on the side of the carrier wafer CW2 rather than the side surface CS2 of the carrier wafer CW2. It can be positioned inward toward the center. As such, the sharp top edge UC2 of the device wafer DW2 and the sharp bottom edge DC2 of the carrier wafer CW2 are prevented from contacting the first embossing 124, so that the upper edge of the device wafer DW2 The lower edge UC2 of the carrier wafer CW2 and the lower edge DC2 of the carrier wafer CW2 may not be broken.

FIG. 8 is a cross-sectional view showing a retainer of a wafer carrier according to another embodiment of the present invention, FIG. 9 is a cross-sectional view showing that the retainer shown in FIG. 8 supports another wafer, And another wafer is supported.

Referring to FIG. 8, the retainer 220 of the present embodiment may include a body 222 and a support structure 224. The body 222 may have a plurality of slots 226 for receiving the side S of the wafer W. [

In this embodiment, the support structure 224 may include a support surface. The support surface 224 can be partially in surface contact with the side surface S of the wafer W. [ That is, the thickness of the support surface 224 may be thinner than the thickness of the wafer W. [ The support surface 224 may be substantially parallel to the side surface S of the wafer W. [ The support surface 224 may be in surface contact with a portion of the side surface S of the wafer W and may not be in contact with the upper edge UC and the lower edge DC of the wafer W.

Additionally, the body 222 includes a first receiving groove 227 extending from the slot 226 to expose the upper edge UC of the wafer W, and a second receiving groove 228 extending from the slot 226, And a second receiving groove 228 exposing the bottom edge DC. The upper edge UC of the wafer W is exposed through the first receiving groove 227 and the lower edge DC of the wafer W is exposed through the second receiving groove 228, It is possible to more reliably prevent the upper edge UC and the lower edge DC from contacting the support surface 224. In this embodiment, the first receiving groove 227 and the second receiving groove 228 may have a substantially circular shape. However, the first receiving groove 227 and the second receiving groove 228 are formed in such a manner as to prevent contact between the upper edge UC and the lower edge DC of the wafer W and the supporting surface 224 , And may have various other shapes.

The retainer 220 may support the wafer shown in Fig. The wafer of FIG. 9 may be substantially the same as the wafer of FIG. 6 including carrier wafer CW1 and device wafer DW1. Therefore, repeated description of the wafer of Fig. 9 is omitted.

The support surface 224 can be in partial surface contact with the side surface CS1 of the carrier wafer CW1. The support surface 224 may be substantially parallel to the side surface CS1 of the carrier wafer CW1. The support surface 224 is in surface contact with a part of the side surface CS1 of the carrier wafer CW1 but may not be in contact with the side surface DS1 of the device wafer DW1. The support surface 224 may not contact the upper edge UC1 of the device wafer DW1 and the lower edge DC1 of the carrier wafer CW1.

The upper edge UC1 of the device wafer DW1 may be exposed through the first receiving groove 227 and the lower edge DC1 of the carrier wafer CW1 may be exposed through the second receiving groove 228. [ Therefore, the upper edge UC1 of the device wafer DW1 and the lower edge DC1 of the carrier wafer CW1 can more reliably be prevented from coming into contact with the support surface 224.

The retainer 220 may support the wafer shown in Fig. The wafer of Fig. 10 may be substantially the same as the wafer of Fig. 7 including the carrier wafer CW2 and the device wafer DW2. Therefore, repeated description of the wafer of Fig. 10 is omitted.

The support surface 224 can be partially in surface contact with the side surface CS2 of the carrier wafer CW2. The support surface 224 may be substantially parallel to the side surface CS2 of the carrier wafer CW2. The support surface 224 is in surface contact with a part of the side surface CS2 of the carrier wafer CW2 but may not be in contact with the side surface DS2 of the device wafer DW2. The support surface 224 may not contact the upper edge UC2 of the device wafer DW2 and the lower edge DC2 of the carrier wafer CW2.

The upper edge UC2 of the device wafer DW2 may be exposed through the first receiving groove 227 and the lower edge DC2 of the carrier wafer CW2 may be exposed through the second receiving groove 228. [ Therefore, it is possible to more reliably prevent the upper edge UC2 of the device wafer DW2 and the lower edge DC2 of the carrier wafer CW2 from contacting the supporting surface 224.

Fig. 11 is a cross-sectional view showing the retainer of the wafer carrier according to another embodiment of the present invention, Fig. 12 is a cross-sectional view taken along the line XII-XII in Fig. 11, Sectional view taken along the line XIII-XIII.

Referring to FIG. 11, the first retainers 320 may be disposed on the inner surface of the door and the first inner surface of the case. The second retainers 330 may be disposed on the second inner side surface and the third inner side surface of the case. Accordingly, four side surfaces of the wafer W can be supported by the first retainers 320 and the second retainers 330.

Referring to FIG. 12, the first retainer 320 may have substantially the same structure as the first retainer 120 shown in FIG. The first retainer 320 may include a first body 322 and an embossing 324. The first body 322 may have a plurality of first slots 326 for receiving the side S of the wafer W. [ The embossing 324 protrudes in a semicircular shape from the inner side of the first body 322 toward the horizontal direction and can make point contact with the side surface S of the wafer W. [

Referring to FIG. 13, the second retainer 330 may include a second body 332 and a support surface 334. The second body 332 may have a plurality of second slots 336 for receiving the side S of the wafer W. [

The support surface 334 can be in partial surface contact with the side surface S of the wafer W. [ That is, the thickness of the support surface 334 may be thinner than the thickness of the wafer W. [ The support surface 334 may be substantially parallel to the side surface S of the wafer W. [ The support surface 334 may be in surface contact with a portion of the side surface S of the wafer W and may not be in contact with the upper edge UC and the lower edge DC of the wafer W.

The second body 332 includes a first receiving groove 337 extending from the second slot 336 to expose the upper edge UC of the wafer W and a second receiving groove 337 extending from the second slot 336 And a second receiving groove 338 for exposing the lower edge DC of the wafer W. [ The upper edge UC of the wafer W is exposed through the first receiving groove 337 and the lower edge DC of the wafer W is exposed through the second receiving groove 338, It is possible to more reliably prevent the upper edge UC and the lower edge DC from contacting the supporting surface 334. [

In another embodiment, the first retainer 320 includes a support surface 334 and the second retainer 330 may include an embossing 324. Further, the first retainer 320 and the second retainer 330 may support the wafer shown in Fig. 6 or the wafer shown in Fig.

FIG. 14 is a cross-sectional view showing a wafer carrier supported by a wafer carrier according to another embodiment of the present invention, FIG. 15 is a sectional view taken along the line XV-XV in FIG. 14, Sectional view taken along the line -XVI.

Referring to FIG. 14, the first retainers 420 may be disposed on the inner side surface of the door and the first inner side surface of the case. The second retainers 430 may be disposed on the second inner side surface and the third inner side surface of the case. Accordingly, four side surfaces of the wafer W can be supported by the first retainers 420 and the second retainers 430.

Referring to Fig. 15, the first retainer 420 may have substantially the same structure as the first retainer 120 shown in Fig. The first retainer 420 may include a first body 422 and an embossing 424. The first body 422 may have a plurality of first slots 426 for receiving the side S of the wafer W. [ The embossing 424 protrudes in a semicircular shape horizontally from the inner side of the first body 422 and can make point contact with the side surface S of the wafer W. [

16, the second retainer 330 may include a second body 432 having a plurality of second slots 436 for receiving a side S of the wafer W. [ That is, the side walls of the second slot 436 are not provided with embossing or support surfaces.

As another example, the first retainer 420 and the second retainer 430 may support the wafer shown in Fig. 6 or the wafer shown in Fig.

According to these embodiments described above, since the support structure is spaced from the side top and bottom edges of the wafer, the support structure may not contact the side edges of the wafer. Thus, the side edges of the wafer may not be damaged by contact with the support structure. In particular, since the contact between the side edge of the thin device wafer with the plug and the supporting structure can be fundamentally prevented, breakage of the side edge of the thin wafer can be prevented. As a result, in order to prevent breakage of the side edge of the thin device wafer, it is possible to eliminate the step of removing the side surface of the device wafer partly.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. And changes may be made without departing from the spirit and scope of the invention.

110; Case 112; Entrance
114; A first inner surface 116; The second inner side
118; A third inner side 120; The first retainer
122; A first body 124; First embossing
130; A second retainer 132; The second body
134; A second embossing 140; door
W; Wafer CW; Carrier wafer
DW; Device wafer S; Side of the wafer
CS1, CS2; The side surfaces DS1 and DS2 of the carrier wafer; Side of the device wafer
DC; Lower edge of wafer UC upper edge of wafer
DC1, DC2; The bottom edge of the carrier wafer
UC1, UC2; The upper edge of the device wafer

Claims (20)

A body disposed on an inner surface of a wafer carrier housing a plurality of wafers, the body having a plurality of slots for receiving the sides of the wafers; And
A support structure formed on a sidewall of each of the slots to contact a side of each of the wafers and spaced from a top edge of a side of the wafer. 2. The retainer of claim 1, wherein the support structure is spaced from the bottom edge of the side of the wafer. 2. The retainer of claim 1, wherein the support structure comprises an embossing point-to-point contact with a side surface of the wafer. 4. The retainer of claim 3, wherein the embossing has a hollow structure. 2. The retainer of claim 1, wherein the support structure includes a support surface that is partially in surface-to-surface contact with a side surface of the wafer. The retainer for a wafer carrier as claimed in claim 5, wherein the supporting surface has a thickness thinner than the thickness of the wafer. 6. The apparatus of claim 5, wherein the body
And a first receiving groove communicating with the slot to expose an upper edge of the wafer. 8. The apparatus of claim 7, wherein the body
And a second receiving groove communicating with the slot to expose the lower edge of the wafer. 2. The retainer of claim 1, wherein the support structure comprises an elastic material. The retainer of claim 1, wherein the support structure is integrally formed on the body. The method of claim 1, wherein the wafer
Carrier wafer; And
And a device wafer attached to the carrier wafer, the device wafer having plugs embedded therein. The retainer of claim 11, wherein the device wafer has a side surface coplanar with a side surface of the carrier wafer. 12. The wafer carrier retainer according to claim 11, wherein the device wafer has a side surface located inward toward a center of the carrier wafer than a side surface of the carrier wafer. Carrier wafers and a body having a plurality of slots disposed on an inner surface of a wafer carrier for receiving device wafers attached to each of the carrier wafers and with plugs therein and for receiving the carrier wafers and the side surfaces of the device wafers, ; And
And an embossment formed in a sidewall of each of the slots and in point contact with a side surface of each of the carrier wafers and spaced from an upper edge of the device wafer. 15. The retainer of claim 14, wherein the embossing is spaced from the bottom edge of the side of the carrier wafer. A case having an inlet for receiving a plurality of wafers, a first inner side opposite to the inlet, and second and third inner side surfaces extending from the first inner side to the inlet;
A door installed at the entrance; And
A body disposed on the inner side of the door and the first to third inner sides of the case and having a plurality of slots for receiving the sides of the wafers, And retainers comprising a support structure in contact with the wafer and spaced from the top edge of the side of the wafer. 17. The wafer carrier of claim 16, wherein the support structure is spaced from a lower edge of a side of the wafer. 17. The wafer carrier of claim 16, wherein the support structure comprises an embossing point-to-point contact with a side surface of the wafer. 17. The wafer carrier of claim 16, wherein the support structure comprises a support surface that is partially in surface-to-surface contact with a side surface of the wafer. 20. The method of claim 19, wherein the body
A first receiving groove communicating with the slot to expose an upper edge of the wafer and an upper end of the supporting surface; And
And a second receiving groove communicating with the slot to expose a lower edge of the wafer and a lower end of the supporting surface.
KR1020140124723A 2014-09-19 2014-09-19 Retainer and wafer carrier including the same KR20160033910A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020140124723A KR20160033910A (en) 2014-09-19 2014-09-19 Retainer and wafer carrier including the same
US14/729,030 US20160082569A1 (en) 2014-09-19 2015-06-02 Retainer and wafer carrier including the same
CN201510589858.0A CN105448789A (en) 2014-09-19 2015-09-16 Retainer and wafer carrier including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140124723A KR20160033910A (en) 2014-09-19 2014-09-19 Retainer and wafer carrier including the same

Publications (1)

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US (1) US20160082569A1 (en)
KR (1) KR20160033910A (en)
CN (1) CN105448789A (en)

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CN105448789A (en) 2016-03-30

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