KR20150118312A - system and method for cutting using laser - Google Patents

Abstract

The present invention relates to an apparatus for cutting and processing a material using laser, and a method thereof. The apparatus of the present invention is configured to perform profile cutting and hole cutting operations of a work subject in a single facility by comprising: a hole cutting beam optical unit for receiving a laser beam generated from a laser, and focusing and converting the laser beam into a hole cutting beam to form a hole on the work subject; a profile cutting beam optical unit installed adjacent to the hole cutting beam optical unit to receive a laser beam generated from the laser, and to focus and convert the laser beam into a beam for profile cutting of the work subject; and an optical system selection means for selecting that the laser beam generated from the laser is outputted to an XY scanner through one among the hole cutting beam optical unit and the profile cutting beam optical unit. The profile cutting is controlled by a method for cutting the work subject as an inner crack layer is formed and inner cracks are connected to each other; and the hole cutting is configured to form a hole by cutting the red circumference and automatically separating a scratch part remaining at the center. In the profile cutting, the work speed is improved by connectively controlling an XY stage and an XY scanner according to a path plan so that the XY stage and the XY scanner move a straight section and a curved section at a constant velocity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting and processing apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting and machining apparatus and method, and more particularly, to a laser cutting and machining apparatus and a method for cutting a straight line and a curve and forming a hole using one laser.

Currently, a substrate of a display device uses a glass substrate as a base substrate, and such a glass substrate is cut by a product size and used. In order to cut the glass substrate to the size of the product, a method of cutting by applying a diamond tip or thermal shock is used. In recent years, however, an apparatus for cutting a glass substrate by using a laser is widely used.

The currently used laser cutting apparatus includes a table on which a glass substrate is placed, a cutting head having a laser irradiating device movably disposed on the table and irradiating a laser beam, and a coolant spraying device for spraying coolant.

In such a cutting apparatus, when a laser beam is irradiated to a cut portion of the glass substrate, the cut portion is heated, and then the coolant is sprayed onto the heated portion to instantaneously cool the glass substrate.

However, in the case of the tempered glass, when the surface is cut by a laser irradiation after heating and cooling, the laser beam is difficult to cut because the reinforcing layer formed on the upper and lower surfaces of the tempered glass, that is, .

Accordingly, the conventional tempered glass laser cutting apparatus generates initial cracks by physical impact at one end of a line along which the substrate is to be cut, as disclosed in Korean Patent Laid-Open Publication No. 2014-0022980 'Tempered glass laser cutting apparatus and method' A method is employed in which a laser is irradiated along the line along which the substrate is to be cut from the initial cracks after the formation of the initial crack, followed by cooling and cutting.

Therefore, in the conventional tempered glass laser cutting apparatus, a crack is generated by a physical impact using a crack-generating probe made of a material whose end portion is stronger than tempered glass, so that the equipment and the control method are complicated and the cutting time is long There are disadvantages. In addition, the round part of the corner after the square cutting is cut by a separate cutting means.

On the other hand, in a product using tempered glass, it may be necessary not only to cut a unit cell of the tempered glass, but also to form a hole in the tempered glass. However, in order to form a hole in a tempered glass by using a laser, the laser output optical system must be changed because holes must be formed by a laser having a power for generating holes differently from the laser characteristics at the time of cutting.

Therefore, in the related art, the laser cutting apparatus and the laser hole processing apparatus are configured as different apparatuses, which complicates the work and complicates the work. It is difficult to precisely cut the glass substrate due to the error of the position of the glass substrate. There is a disadvantage in that the equipment cost for machining is increased and productivity and cutting time for cutting and hole machining are increased in mass production.

Korean Patent Publication No. 10-2014-0022980 (Feb.

The present invention provides a laser cutting and machining apparatus and method, which can realize both straight and curved cutting and hole forming in a facility using one laser.

In the present invention, a multilayer inner crack is formed in a tempered glass having a reinforcing layer formed on the upper and lower surfaces of an inner elongation layer to form an inner crack by irradiating a laser to the inner elongation layer to adjust a laser candle fold so that cracks The present invention is to provide a laser cutting method for cutting and forming a laser beam.

In addition, the present invention relates to an apparatus and a method for controlling a position angle of a scanner before reaching a round portion by interlocking the laser moving stage and a scanner by interlocking the scanner with a laser on an on-the-fly method, So that cutting of the straight line and the curved line can be performed at a high speed.

Further, the present invention is to provide a hole processing method using a laser in which holes are formed by abrading a hole edge by irradiating a laser in the manner of forming multiple circles at the edge of the hole during hole processing.

In the laser cutting and processing apparatus according to the present invention,

1. A laser cutting and processing apparatus for cutting and processing a workpiece by irradiating a laser beam onto a workpiece via a scanner,

A profile cutting beam optical unit for receiving a laser beam generated by one laser and converting the laser beam into a cutting beam for cutting the workpiece;

A hole cutting optical part for receiving a laser beam generated by the laser and converting the laser beam into a hole cutting beam for forming a hole in a workpiece;

And an optical system selecting means for selecting a laser beam generated by the one laser to be output to the scanner through one of the profile cutting beam optical portion and the hole cutting beam optical portion, Thereby performing a work or a hole forming operation.

Wherein the optical system selecting means comprises:

Wherein the hole cutting beam optics and the profile cutting beam optics are arranged such that a laser beam generated from one laser is incident on the same path and is emitted to the scanner side in the same path, And a mirror up / down means for moving the mirrors up / down and moving them to the path of the laser beam or to a position out of the path.

In the laser cutting and processing apparatus of the present invention,

And an air blower capable of loading / unloading to cool the laser beam by blowing air around the laser beam irradiated point to the work position during the hole cutting operation.

In the laser cutting and processing apparatus of the present invention,

And a vacuum jig device for fixing the workpiece in a flat state on the lower surface of the workpiece, wherein the vacuum jig device is provided with a plurality of vacuum chucks for vacuum adsorption and desorption of the lower surface of the workpiece, So that the vertical height can be adjusted.

And an air blower capable of loading / unloading to cool the laser beam by blowing air around the laser beam irradiated point to the work position during the hole cutting operation.

In the laser cutting and processing apparatus according to the present invention,

A laser for generating a laser beam for cutting and machining a workpiece;

A hole cutting optical part for receiving the laser beam of the laser and converging the laser beam into a laser beam for hole cutting and outputting the laser beam;

A profile cutting beam optical unit that receives the laser beam of the laser and focuses the laser beam into a laser beam for profile cutting and outputs the laser beam;

An optical system selecting means for selecting the hole cutting beam optics during the hole cutting operation and the profile cutting beam optics during the profile cutting operation by vertically moving the mirrors of the hole cutting optical portion;

The laser beam output from the hole cutting optical section 20 or the profile cutting beam optical section 30 is received through the path lens section to control the focal point of the laser beam to irradiate the laser beam to the workpiece through the focus lens section An XY scanner;

An XY stage for moving the laser unit including the laser, the hole cutting beam optical unit, the profile cutting beam optical unit, the optical system selection unit, and the XY scanner along the working path in the XY directions; A Z stage;

A loading / unloading device for loading and unloading the workpiece to a work position on the work table;

A vacuum jig device installed at a working position on the work table and vacuum-supported by the lower surface of the loaded workpiece;

The unit cell cutting and the hole cutting operation of the work object are controlled by controlling the laser, the optical system selecting means, the XY stage, the Z stage, the XY scanner, the loading / unloading device and the vacuum jig device And a controller.

According to the present invention,

A laser cutting and cutting method for profile cutting and hole cutting of a workpiece using a laser beam,

An optical system selecting step of selecting a laser beam generated from one laser to be selectively passed through a hole cutting beam optical part or a profile cutting beam optical part and output to a workpiece through an XY scanner by receiving a hole cutting operation or a profile cutting operation, ;

In a hole cutting operation, a hole cutting beam is continuously irradiated in an arc type of diameters different from each other by a predetermined width to the inside of an outward line of a hole to be formed, and the arc-shaped cutting portion of a predetermined width is cut, A hole cutting process for forming a hole;

In the profile cutting operation, a profile cutting beam is focused on an extension layer inside the reinforced compression layer on the upper and lower surfaces of the workpiece, and an inner crack is formed by irradiating a profile cutting beam. An inner crack layer A plurality of layers are formed in at least two layers so that cracks are automatically connected to inner cracks, thereby performing a profile cutting process.

In the hole cutting process,

And air is blown in such a manner that air is blown in at least two directions on the outside of the hole cutting portion so as to cool the heat resulting from the hole cutting.

The profile cutting process includes:

Controlling the linear section movement by controlling the XY stage and linking the movement of the XY scanner to the curve section in advance according to the path plan, the profile cutting is performed by moving the rectilinear section and the curved section at constant speed by the ON THE FLY method Is performed.

Since the present invention can perform hole cutting and profile cutting using one facility, that is, one laser, it is possible to reduce facility costs and improve productivity by unifying facilities, and to perform hole cutting and profile cutting in a single facility It is possible to prevent contamination or damage of parts due to transportation and to reduce the error in re-alignment, thereby improving the quality precision. In the profile cutting work, XY stage and XY scanner are interlocked and controlled according to the route plan So that the profile cutting operation can be shortened and the straight line, curve and hole cutting can be performed in a single facility.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a laser cutting and housing apparatus according to the present invention; Fig.
Fig. 2 is an explanatory view of the hole cutting optical section and the profile cutting beam optical section selection means according to the present invention; Fig.
Fig. 3 is a schematic view showing the top surface of a vacuum adsorption apparatus according to the present invention and a vacuum chuck installed therein. Fig.
4 is a rear view of a vacuum adsorption apparatus according to the present invention.
5 is an explanatory view of a profile cutting method according to the present invention.
6 is an explanatory view of a hole cutting method according to the present invention;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a configuration diagram of a laser cutting and working apparatus according to the present invention, and Fig. 2 is an outlined explanatory diagram of an optical system selecting means according to the present invention.

In the laser cutting and processing apparatus according to the present invention,

A laser (10) for generating a laser beam for cutting and machining of the workpiece (200);

A hole cutting optical part 20 for receiving a laser beam of the laser 10 and focusing the laser beam to a laser beam for hole cutting and outputting the laser beam;

A profile cutting beam optical unit 30 for receiving a laser beam of the laser 10 and focusing the laser beam to a laser beam for profile cutting and outputting the laser beam;

Cutting optics 20 for the hole cutting operation by vertically moving the mirrors of the hole cutting beam optic portion 20 so as to select the profile cutting beam optic portion 30 during the profile cutting operation, (40);

The laser beam output from the hole cutting optical section 20 or the profile cutting beam optical section 30 is received through the path lens section 50 and the focal point of the laser beam is controlled to pass through the focus lens section 70 An XY scanner (60) for irradiating a workpiece (200) with a laser beam;

(10), the hole cutting beam optics (20), the profile cutting beam optics (30), the optical system selection means (40) and the XY scanner (60) An XY stage 90 for moving the workpiece W in the X and Y directions along the work path, and a Z stage 80 for moving up and down in the Z direction;

A loading / unloading device (120) for loading and unloading the workpiece (200) to a working position on the work table (102);

A vacuum jig device 130 installed at a working position on the work table 102 to vacuum-hold the workpiece 200 on the lower surface of the loaded workpiece 200;

The laser 10, the optical system selecting means 40, the XY stage 90, the Z stage 80, the XY scanner 60, the loading / unloading device 120 and the vacuum jig device And a controller (100) for controlling the unit cell cutting and the hole cutting operation of the work object (200) by controlling the controller (130).

The present invention also provides an air blower (110) capable of loading / unloading cooling air by blowing air around a point where the laser beam is irradiated by being loaded to a work position under the control of the controller (100) And further comprising:

As shown in FIGS. 3 and 4, the vacuum jig device 130 includes:

A vacuum sucking device 131 installed on a lower surface of the working position where the workpiece 200 is loaded and having a plurality of vacuum chuck mounting holes arranged on an upper surface thereof; Axis stage pin 133 on the upper surface of the workpiece 200 and a vacuum chuck for vacuum-chucking the lower surface of the workpiece 200, (300).

The vacuum chuck 300 includes a lower body 310 inserted into a vacuum chuck mounting hole of the vacuum chucking apparatus 131 and having an inner through hole communicating with the vacuum chucking apparatus, An upper body 320 having an inner through hole communicating with an inner through hole of the lower body and an O-ring 330 mounted on an upper surface of the upper body 320, .

The laser cutting and machining apparatus of the present invention constituted as described above is characterized in that hole processing and profile cutting of a workpiece can be performed together in a single facility equipped with one laser.

In order to perform the profile kitting and the hole cutting operation together in one facility, in the present invention, the hole cutting beam optics 20 and the profile cutting beam optics 30 are arranged adjacent to each other at the output end of one laser 10, The mirrors are placed on the laser beam path. And a mirror up / down device for up / down / down of the incident side and exit side mirrors of the hole cutting beam optical part 20, respectively, provided with the academic system selection means 40 as optical system selection means 40 will be.

According to the present invention,

The optical system selecting means 40 is controlled by the controller 100 to raise and lower the incident side and exit side mirrors of the hole cutting beam optical portion 20 so as to deviate from the laser beam path. The laser beam generated by the laser 10 bypasses the hole cutting beam optical portion 20 and is incident on the profile cutting beam optical portion 30. [ Thus, the laser beam generated by the laser 10 is converged and converted into a laser beam suitable for profile cutting via the profile cutting beam optical unit 30, is incident on the xy scanner 60 through the path lens unit 50, and xy The laser beam irradiation position is controlled by the scanner 60 and irradiated onto the workpiece 200 through the focusing lens unit 70. [

As shown in FIG. 5, the present invention is exemplified by tempered glass or ordinary glass as the workpiece 200. In particular, in the case of tempered glass, the reinforced compression layer 201 is formed on the upper and lower surfaces of the inner extended layer 202. In this case, when the laser is focused on the surface, The profile cutting becomes impossible. 5, the focus of the laser beam is controlled by the XY scanner 60 in the elongated layer 202 of the workpiece so that the inner cracks A, B, The profile cutting operation is performed in a forming manner. The inner cracks A, B and C are formed in a plane unit.

For example, a laser beam is irradiated so that the first inner crack layer 210 is formed according to the profile shape of the single cell of the workpiece. That is, by considering the thickness of the glass, the profile cutting beam characteristics, and the like, the point interval of the inner crack is determined to form a continuous inner crack. Another inner crack layer, that is, a second inner crack layer 200, and a third inner crack layer 230 are formed in this order.

As a result, a crack is automatically formed to connect the inner cracks A, B, and C, and a crack is formed in the same line in the upper and lower surfaces of the reinforced compressible layer 201, and profile cutting is performed. Herein, the inner cracks 210-230 are vertically aligned with each other. However, in the drawing, the inner cracks A, B, and C are represented by only three points. However, A plurality of inner crack layers are formed in at least two layers in accordance with the method described above, thereby automatically cutting the inner cracks while connecting the cracks.

At this time, in the normal straight profile cutting method, only the XY stage 90 is controlled to perform profile cutting while sequentially moving the laser unit 101 in the X and Y directions, but the profile cutting can not be performed with only the X and Y stages in the rounded corners. In order to cut such a round portion, that is, a curved portion, an XY scanner is absolutely necessary, and the XY scanner can cut the laser unit while moving along the cutting line rounded.

When the cutting operation is performed while moving to the curved portion by the XY stage 90 and the XY stage is controlled in the curved portion, the equal speed motion becomes impossible and the operation speed is remarkably lowered.

Accordingly, the present invention controls the control of the XY stage 90 and the XY scanner 60 in an on-the-fly (ON THR FLY) manner by an interlocking control method. That is, the controller 100 receives the information about the shape to be cut and sets up a path plan for controlling the XY stage 90 and the XY scanner 60, and performs control so as to interoperate with each other according to the path plan. That is, a path plan for control of the curved section of the XY stage 60 is set up in advance in the linear section and linked with the XY stage 90 to control the laser unit 101 so that the laser unit 101 can move at a constant speed, Can be improved.

On the other hand, in order to perform the hole cutting operation, the controller 100 controls the optical system selecting means 40 to move and fix the incident side and exit side mirrors of the hole cutting beam optical portion 20 on the laser beam path. Thus, the laser beam generated by the laser 10 is incident on the hole cutting beam optical portion 20, and the laser beam is blocked to the profile cutting beam optical portion 30. The laser beam is converged by a laser beam suitable for hole cutting in the hole cutting optical section 20 and is incident on the XY scanner 60 through the path lens section 50 and the hole cutting beam is controlled by the XY scanner 60.

As shown in FIG. 6, the hole cutting method is a method in which a laser beam is continuously irradiated in a circular arc with a predetermined width to the inside of an outer line of a hole to melt a cutting portion 241, The portion 242 is automatically separated to form a hole. That is, by continuously irradiating a laser beam to a circular rim having a predetermined inner circumferential width of the hole, the cutting portion 241 is removed to automatically separate the central scratch portion 242 to form a hole having a large diameter The hole can be formed within a short period of time.

At this time, since the hole cutting beam is a method of applying a laser beam to a workpiece to melt the cutting portion, there is a fear of failure or damage due to thermal deformation. In order to prevent this, an air blower 110 is installed in the present invention, and air is blown to the cutting position, that is, the outer periphery of the cutting portion 241 irradiated with the laser beam, under the control of the controller 100 during the hole cutting operation . At least two or more nozzles are provided on the outer portion of the hole so as to incline the nozzles so that the cooling air is blown in such a manner that the air is inclined from the outside of the hole cutting portion 241.

The present invention is configured to allow hole cutting and profile cutting with a single laser, so that hole cutting is performed first and then profile cutting is performed. Here, the present invention can be used not only for tempered glass but also for profile cutting, round cutting, and hole cutting of ordinary glass, glass having a surface coating layer, sapphire and the like.

10: laser 20: hole cutting beam optic part
30: Profile cutting beam optical section 40: Optical system selection means
50: path lens unit 60: XY scanner
70: focus lens section 80: Z stage
90: XY stage 100: controller
101: laser unit 102: work table
110: air blower 120: loading / unloading device
130: vacuum jig device 131: vacuum adsorption device
132: Cylinder
200: Workpiece 201: Reinforced compression layer
202: elongation layer 210 - 230: inner crack layer
241: cutting portion 242; Scratch portion
300: vacuum chuck 310: lower body
320: upper body 330: O-

Claims (10)

1. A laser cutting and processing apparatus for cutting and processing a workpiece by irradiating a laser beam onto a workpiece via a scanner,
A hole cutting beam optical part 20 for receiving a laser beam generated by the laser 10 and focusing and converting the laser beam into a hole cutting beam for forming a hole in the workpiece 200;
A profile cutting beam optical unit 30 installed adjacent to the hole cutting optical unit 20 to receive a laser beam generated from the laser 10 and focus the laser beam on the workpiece 200 for beam cutting for profile cutting, Wow;
An optical system selecting means (40) for selecting a laser beam generated by the laser (10) to be output to the XY scanner (50) through either the hole cutting beam optics (20) or the profile cutting beam optics ); So that the profile cutting operation and the hole cutting operation of the workpiece can be performed in a single facility.
The optical system according to claim 1, wherein the optical system selecting means (40)
And a mirror up / down means for moving up and down the mirrors provided on the laser beam incident and exit sides of the hole cutting optical section 20 to move to a path of the laser beam or to a position out of the path of the laser beam, Laser cutting and machining equipment.
The laser cutting apparatus according to claim 1,
Further comprising an air blower which can be loaded / unloaded by blowing air around the cutting area to be loaded into the working position during the hole cutting operation and irradiated with the laser beam.
The laser cutting and cutting apparatus according to claim 1,
And a vacuum jig device (130) for fixing the workpiece (200) in a flat state on the lower surface of the workpiece (200)
The vacuum jig device 130 includes a plurality of vacuum chucks 300 arranged to vacuum adsorb and desorb the lower surface of the workpiece 200 and each of the vacuum chucks 300 can be vertically adjustable Laser cutting and processing equipment.
The vacuum jig according to claim 4, wherein a plurality of cylinders (131) are provided on a lower surface of the vacuum jig device (130) to adjust a θ-axis inclination of the workpiece (200) by adjusting the height of the θ- Wherein the laser cutting and processing apparatus is configured to be capable of cutting the laser beam.
A laser (10) for generating a laser beam for cutting and machining of the workpiece (200);
A hole cutting optical part 20 for receiving a laser beam of the laser 10 and focusing the laser beam to a laser beam for hole cutting and outputting the laser beam;
A profile cutting beam optical unit 30 for receiving a laser beam of the laser 10 and focusing the laser beam to a laser beam for profile cutting and outputting the laser beam;
Cutting optics 20 for the hole cutting operation by vertically moving the mirrors of the hole cutting beam optic portion 20 so as to select the profile cutting beam optic portion 30 during the profile cutting operation, (40);
The laser beam output from the hole cutting optical section 20 or the profile cutting beam optical section 30 is received through the path lens section 50 and the focal point of the laser beam is controlled to pass through the focus lens section 70 An XY scanner (60) for irradiating a workpiece (200) with a laser beam;
(10), the hole cutting beam optics (20), the profile cutting beam optics (30), the optical system selection means (40) and the XY scanner (60) An XY stage 90 for moving the workpiece W in the X and Y directions along the work path, and a Z stage 80 for moving up and down in the Z direction;
A loading / unloading device (120) for loading and unloading the workpiece (200) to a working position on the work table (102);
A vacuum jig device 130 installed at a working position on the work table 102 to vacuum-hold the workpiece 200 on the lower surface of the loaded workpiece 200;
The laser 10, the optical system selecting means 40, the XY stage 90, the Z stage 80, the XY scanner 60, the loading / unloading device 120 and the vacuum jig device 130 for controlling the unit cell cutting and the hole cutting operation of the work object 200;
And an air blower 110 capable of loading / unloading cooling air by blowing air around a point where the laser beam is irradiated by being loaded to a working position under the control of the controller 100 Laser cutting and processing equipment.
The vacuum chucking device (130) according to claim 6, wherein the vacuum jig (130)
A vacuum sucking device 131 installed on a lower surface of the working position where the workpiece 200 is loaded and having a plurality of vacuum chuck mounting holes arranged on an upper surface thereof; And a vacuum chuck 300 inserted into the vacuum chuck mounting hole and adjustable in height up and down to vacuum adsorb the lower surface of the workpiece 200. The vacuum chuck 300 is provided with a laser cut- Device.
A laser cutting and cutting method for profile cutting and hole cutting of a workpiece using a laser beam,
An optical system selecting step of selecting a laser beam generated from one laser to be selectively passed through a hole cutting beam optical part or a profile cutting beam optical part and output to a workpiece through an XY scanner by receiving a hole cutting operation or a profile cutting operation, ;
In a hole cutting operation, a hole cutting beam is continuously irradiated in an arc type of diameters different from each other by a predetermined width to the inside of an outward line of a hole to be formed, and the arc-shaped cutting portion of a predetermined width is cut, A hole cutting process for forming a hole;
In the profile cutting operation, a profile cutting beam is focused on an extension layer inside the reinforced compression layer on the upper and lower surfaces of the workpiece, and an inner crack is formed by irradiating a profile cutting beam. An inner crack layer Wherein a profile cutting process is performed to form a plurality of layers of at least two or more layers so that inner cracks are automatically connected to each other to cut the profiles.
9. The method of claim 8,
And air is blown in at least two directions on the outside of the hole cutting portion so as to cool the heat resulting from the hole cutting.
9. The method according to claim 8,
Controlling the linear section movement by controlling the XY stage and linking the movement of the XY scanner to the curve section in advance according to the path plan, the profile cutting is performed by moving the rectilinear section and the curved section at constant speed by the ON THE FLY method Is performed to perform the laser cutting and processing.

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