KR20150111865A - Resistance measuring apparatus, substrate test apparatus, test method and method of maintaining jig for test - Google Patents

Abstract

The present invention provides a resistance measurement apparatus, a substrate test apparatus, a test method and a maintenance method of a test jig which can judge quality a probe easily. According to the present invention, a first voltage (Vp) measured by voltage probes (Pv1, Pv2) is obtained when current probes (Pc1 Pc2) are contacted to a conductor pattern (M) and a first current (Ip) is made to flow in the conductor pattern (M) by the current probes. A second voltage (Vm) measured by the voltage probes (Pv1, Pv2) is obtained when a second current (Im) in a reverse direction to the first current (Ip) is made to flow in the conductor pattern (M) by the current probes (Pc1, Pc2). And a third voltage (Vo) measured by the voltage probes (Pv1, Pv2) is obtained, under the state that a current does not flow in the conductor pattern (M) by the current probes (Pc1, Pc2). Then, the quality of the probe is judged on the basis of the first voltage (Vp), the second voltage (Vm) and the third voltage (Vo).

Description

TECHNICAL FIELD [0001] The present invention relates to a resistance measuring apparatus, a substrate inspection apparatus, an inspection method, and a maintenance method of a jig for inspection. BACKGROUND OF THE INVENTION 1. Field of the Invention [0002]

The present invention relates to a resistance measurement device for performing resistance measurement, a substrate inspection device using the resistance measurement device, an inspection method related to a probe used in these devices, and a maintenance method of the inspection jig.

BACKGROUND ART Conventionally, in order to inspect a wiring pattern formed on a substrate such as a printed wiring board, a resistance value of the wiring pattern is measured. As for the inspection of the wiring pattern, it is necessary to detect not only the presence or absence of disconnection, but also defects that do not reach the disconnection that the width of the wiring pattern becomes narrow or the thickness becomes thin. In order to detect defects not reaching such disconnection, it is necessary to conduct resistance measurement with high accuracy. As such a high-precision resistance measuring method, a substrate inspecting apparatus using a four-terminal measuring method is known (see, for example, Patent Document 1).

In the 4-terminal measurement method, two current probes are used to flow a current for resistance measurement at the resistance measurement point, and two voltage probes are used to measure the voltage at the resistance measurement point. Thereby, since the resistance measurement current does not flow through the voltage probe, the voltage drop due to the resistance of the voltage probe itself is reduced, and high-precision resistance measurement becomes possible.

Japanese Laid-Open Patent Publication No. 2012-013590

However, with the lapse of time, an oxide film may be formed on the probe tip of the above-described voltage probe or on an electrode for connecting the probe tip to a voltmeter. When an oxide film is formed on a probe needle or an electrode, a rectifying action and a resistance component are generated. Therefore, when resistance measurement is performed using a voltage probe having an oxide film formed thereon, the measurement accuracy of the resistance value is lowered. If the substrate inspection is carried out based on the resistance measurement value of which the accuracy is lowered, the inspection accuracy of the substrate is lowered. Therefore, in the voltage probe having the oxide film formed thereon, it is necessary to remove the oxide film by cleaning.

As an error factor generated in the voltage probe, there is an electromotive force generated by the Seebeck effect in addition to the oxide film. The electromotive force due to the Seebeck effect and the rectification action due to the oxide film are all polarities, and it is difficult to distinguish them. Therefore, there has been a problem that it is difficult to detect that a defect in which an oxide film is formed in the voltage probe occurs.

It is an object of the present invention to provide a resistance measuring apparatus which can easily determine both sides of a probe, a substrate inspection apparatus using the resistance measurement apparatus, an inspection method relating to the probe, and a maintenance method of the inspection jig.

A resistance measuring apparatus according to the present invention is a resistance measuring apparatus for measuring a resistance value of a conductor, comprising: first and second probes for making contact with the conductor; and first and second probes A first voltage acquiring unit that acquires a first voltage generated in the conductor when the first current is caused to flow, and a second voltage acquiring unit that acquires a first voltage in a direction opposite to the first current A second voltage acquisition unit for acquiring a second voltage generated in the conductor when the first and second probes do not allow a current to flow through the conductor by the first and second probes, A third voltage acquisition unit that acquires the first and second probes, and a determination unit that determines both sides of the first and second probes based on the first, second, and third voltages.

According to another aspect of the present invention, there is provided an inspection method for inspecting defects with respect to first and second probes to be brought into contact with a conductor, the method comprising: bringing the first and second probes into contact with the conductor, A first voltage acquisition step of acquiring a first voltage measured by the first and second probes when the first current of the first and second probes is caused to flow, A second voltage acquiring step of acquiring a second voltage measured by the first and second probes when a second current in a reverse direction is caused to flow through the first and second probes; A third voltage acquisition step of acquiring a third voltage measured by the first and second probes in a state where the first and second voltage probes are connected to the first and second voltage probes based on the first, And a determination step of determining a positive part with respect to each of the plurality of parts.

A maintenance method of the inspection jig according to the present invention is a maintenance method of an inspection jig including first and second probes to be brought into contact with a conductor, wherein the first and second probes are brought into contact with the conductor, A first voltage acquiring step of acquiring a first voltage measured by the first and second probes when a predetermined first current flows through the conductor; and a second voltage acquiring step of acquiring, by the first and second probes, A second voltage acquisition step of acquiring a second voltage measured by the first and second probes when a second current flowing in a direction opposite to the first current flows through the first and second probes; A third voltage acquisition step of acquiring a third voltage measured by the first and second probes in a state in which the first and second probes do not flow, It includes a determining step for determining the necessity of the use of the cleaning jig.

According to the resistance measuring apparatus, the inspection method, and the maintenance method of the inspection jig, the first voltage generated in the conductor when the first current is caused to flow through the conductor to be measured and the second voltage generated in the conductor in the reverse direction A second voltage generated in the conductor when the second current flows and a third voltage generated in the conductor in a state in which no current flows in the conductor are acquired using the first and second probes. The first, second, and third voltages are set so that the relationship between the first voltage and the third voltage and the relationship between the second voltage and the third voltage are symmetric with each other when the oxide film is not formed on the first and second probes Respectively. On the other hand, when the oxide film is formed on the first and second probes and is in a defective state, the relationship between the first voltage and the third voltage and the symmetry of the relationship between the second voltage and the third voltage are disturbed by the rectifying action of the oxide film All. Therefore, the first and second probes can be easily determined based on the first, second, and third voltages. In addition, when the oxide film is formed on the first and second probes and becomes in a defective state, it is considered necessary to clean the inspection jig including the first and second probes. Thus, the judging section can judge whether cleaning of the inspection jig is necessary based on the first, second and third voltages.

The first probe includes a first current probe for causing a current to flow through the conductor and a first voltage probe for detecting a voltage generated in the conductor by the current, And a second voltage probe for detecting a voltage generated in the conductor by the current, wherein the first voltage acquiring unit includes: a first voltage probe for receiving a current between the first and second current probes Wherein the first voltage obtaining unit obtains the first voltage measured by the first and second voltage probes when the first current flows through the first and second current probes, Acquires the second voltage measured by the first and second voltage probes when the second current flows in a direction opposite to the first voltage, In the first and the non-flowing a current between two current probe state, it is desirable to obtain a third voltage that is measured by the first and second voltage probe.

According to this configuration, in the resistance measuring apparatus including the first and second current probes, the first and second voltage probes, and the resistance measurement by the four-terminal measuring method, Can be easily determined.

It is preferable that the judging section judges on the two-dimensional plane using the current and the voltage as the first point indicated by the first current and the first voltage and the second point indicated by the second current and the second voltage, It is preferable to determine that there is a defect with respect to the first and second probes when a point, a current value of zero, and a third point indicated by the third voltage are not arranged substantially on a straight line.

According to this configuration, the first, second, and third voltages are arranged on a straight line on a two-dimensional plane using the current and the voltage as parameters when the oxide film is not formed on the first and second probes. On the other hand, when the oxide film is formed on the first and second probes and becomes in a defective state, the first, second, and third points are not arranged on a straight line by the rectifying action of the oxide film. Thus, when the first, second, and third points are not arranged substantially in a straight line, the determination unit can easily determine that there is a defect with respect to the first and second probes.

It is preferable that the first current and the second current have the same absolute value of the current value.

According to this configuration, it is easy to simplify the determination processing of the both sides of the first and second probes by the determination section.

The determination unit may determine that the difference between the first difference value that is the difference between the first voltage and the third voltage and the second difference value that is the difference between the second voltage and the third voltage exceeds the preset determination threshold value , It may be determined that there is a defect with respect to the first and second probes.

According to this configuration, the first current and the second current become currents whose absolute values are equal to each other and whose directions are opposite to each other. In this case, if the first, second and third points are arranged on a straight line, the first difference value and the second difference value become equal. Therefore, when the difference between the first difference value and the second difference value becomes larger than a predetermined determination threshold value, it can be easily judged that there is a defect with respect to the first and second probes.

The substrate inspecting apparatus according to the present invention is characterized in that the resistance measuring apparatus described above and a wiring pattern formed on the substrate are used as conductors to inspect the substrate on the basis of the voltages measured by the first and second probes And a substrate inspecting unit for performing the inspection.

According to this configuration, it is possible to easily determine whether or not the probe used in the substrate inspection is correct.

The resistance measuring apparatus, the substrate inspecting apparatus, and the inspecting method having such a configuration can easily judge the probes.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a block diagram showing an example of the configuration of a substrate inspection apparatus provided with a resistance measurement apparatus according to an embodiment of the present invention; FIG.
2 is a flowchart showing an example of the operation of the substrate inspection apparatus using the inspection method according to one embodiment of the present invention.
3 is an equivalent circuit diagram for explaining an oxide film generated in a voltage probe.
4 is a timing chart for explaining an inspection method; (a) shows a case where the voltage probe P is good (no oxide film is formed), and (b) shows a case where the voltage probe is defective (an oxide film is formed).
5 is an explanatory diagram for explaining a determination method by a determination unit; (a) shows a case where the voltage probe P is good (no oxide film is formed), and (b) shows a case where the voltage probe is defective (an oxide film is formed).
6 is a block diagram showing another example of the substrate inspection apparatus.

Best Mode for Carrying Out the Invention Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals denote the same components, and a description thereof will be omitted. 1 is a block diagram showing an example of the configuration of a substrate inspection apparatus provided with a resistance measurement apparatus according to an embodiment of the present invention.

The substrate inspecting apparatus 1 shown in Fig. 1 includes a constant current source 2, an ammeter 3, a voltmeter 4, a current probe Pc1 (first current probe), a current probe Pc2 (second current probe) A voltage probe (Pv1 (first voltage probe)), a voltage probe (Pv2 (second voltage probe)), switches A1, A2, B1, B2, C1 and C2 and a control section 5. The substrate inspection apparatus 1 is configured to perform resistance measurement by a four-terminal measurement method.

The current probe Pc1 includes a probe needle 11, a connection electrode 12, and a cable 13. The current probe Pc2 includes a probe needle 21, a connection electrode 22, and a cable 23. The voltage probe Pv1 is provided with a probe needle 31, a connecting electrode 32, and a cable 33. The voltage probe Pv2 includes a probe needle 41, a connection electrode 42, and a cable 43. The current probes Pc1 and Pc2 and the voltage probes Pv1 and Pv2 are constituted as inspection jigs which can be detached from the substrate inspection apparatus 1 or the resistance measurement apparatus, for example.

The probe needles 11, 21, 31, and 41 are wire-like contacts having, for example, elastic (flexible) diameters of about 100 μm to 200 μm. The probes 11, 21, 31 and 41 are formed of a metal such as tungsten, high-speed steel (SKH), beryllium copper (Be-Cu) and other conductors.

The tip ends of the probe needles 11 and 31 contact the one end portion M1 of the conductor pattern M. [ The tip ends of the probe needles 21 and 41 are brought into contact with the other end portion M2 of the conductor pattern M. [ In Fig. 1, a conductor pattern M is conceptually described. The conductor pattern M may be a wiring pattern of a substrate to be inspected or may be a conductor for inspection for inspecting the voltage probes Pv1 and Pv2.

The connecting electrodes 12, 22, 32 and 42 are electrodes for connecting the probes 11, 21, 31 and 41 to the cables 13, 23, 33 and 43. The rear end portions of the probe needles 11, 21, 31 and 41 come in contact with the connection electrodes 12, 22, 32 and 42 to be in contact with the connection electrodes 12, 22, 32 and 42.

The switches A1, A2, B1, B2, C1, and C2 are various switching elements such as a semiconductor switch such as a transistor or a relay switch. The switches A1, A2, B1 and B2 are changeover switches for switching the direction of the current flowing in the conductor pattern M through the current probes Pc1 and Pc2. The switches C1 and C2 switch the presence or absence of connection of the probes 31 and 41 to the voltmeter 4. The switches A 1, A 2, B 1, B 2, C 1, and C 2 are turned on and off in accordance with a control signal from the control unit 5.

The constant current source 2 is a constant current circuit for causing a constant current to flow through the conductor pattern M. The ammeter 3 measures a current value supplied from the constant current source 2 to the conductor pattern M. [ The constant current source 2 adjusts the output current so that the current value measured by the ammeter 3 becomes a predetermined measurement current value Is to obtain a constant current value Is for measurement . The current value Is for measurement is, for example, 20 mA.

The probe needle 11 is connected to one output terminal of the constant current source 2 through the connection electrode 12, the cable 13 and the switch A1 and is connected to the connection electrode 12, the cable 13, And is connected to the other output terminal of the constant current source 2 through the switch B1 and the ammeter 3. [ The probe needle 21 is connected to one output terminal of the constant current source 2 through the connection electrode 22, the cable 23 and the switch B2 and is connected to the connection electrode 22, the cable 23, And is connected to the other output terminal of the constant current source 2 through the switch A2 and the ammeter 3. [

The probe needle 31 is connected to one input terminal of the voltmeter 4 through the connection electrode 32, the cable 33 and the switch C1. The probe needle 41 is connected to the other input terminal of the voltmeter 4 through the connection electrode 42, the cable 43 and the switch C2.

The voltmeter 4 measures the voltage detected by the voltage probes Pv1 and Pv2 and outputs the measured value to the controller 5. [

The control unit 5 includes, for example, a CPU (Central Processing Unit) for executing predetermined arithmetic processing, a RAM (Random Access Memory) for temporarily storing data, a ROM (Read Only Memory) for storing a predetermined control program, A storage unit such as a hard disk drive (HDD), and peripheral circuits thereof. The control section 5 executes the control program stored in the storage section for example so that the first voltage obtaining section 51, the second voltage obtaining section 52, the third voltage obtaining section 53, A resistance calculating section 55, and a board inspecting section 56. [0064]

The first voltage obtaining section 51 is connected to the conductor pattern M by the voltage probes Pv1 and Pv2 when the first current Ip in the direction from the current probe Pc1 to the current probe Pc2 flows And obtains the first voltage Vp to be measured. The first current Ip may be 20 mA, for example.

The second voltage obtaining section 52 has caused the second current Im to flow in the direction from the current probe Pc2 in the direction opposite to the first current Ip to the current probe Pc1 in the conductor pattern M The second voltage Vm measured by the voltage probes Pv1 and Pv2 is obtained. The second current Im can be, for example, -20 mA, which is equal in absolute value to the first current Ip and has the opposite polarity.

The third voltage acquisition section 53 acquires the third voltage Vo measured by the voltage probes Pv1 and Pv2 in a state in which no current flows between the current probes Pc1 and Pc2.

The determining section 54 determines whether or not the difference between the first difference value Vd1 that is the absolute value of the difference between the first voltage Vp and the third voltage Vo and the difference between the second voltage Vm and the third voltage Vo (Vd (= Vd1 - Vd2), which is the difference between the second differential value Vd2 that is the absolute value of the voltage value of the voltage probe Pv2 and the voltage value of the voltage probe Pv2, exceeds the predetermined threshold value Vth .

The judging unit 54 may judge whether or not cleaning of the inspection jig including the voltage probes Pv1 and Pv2 is necessary.

The resistance calculating section 55 calculates the resistance value Rx of the conductor pattern M based on the first voltage Vp, the second voltage Vm, the first current Ip and the second voltage Vm . Specifically, when the absolute value of the first current Ip and the absolute value of the second current Im are equal to each other and the current value thereof is Ia, the resistance calculating section 55 calculates, based on the following formula (1) The resistance value Rx can be calculated.

Rx = (Vp - Vm) / (Ia x 2) = (Vp - Vm) / (20 mA x 2) (One)

It is preferable that the internal resistance Ri of the voltage probes Pv1 and Pv2 is precisely measured in advance and the resistance calculating section 55 corrects the resistance value Rx based on the internal resistance Ri. Specifically, the resistance calculating section 55 may calculate the resistance value Rx based on the following equation (2). According to the expression (2), the calculation accuracy of the resistance value Rx can be improved.

Rx = {(Vp - Vm) / (Ia x 2)} - Ri ... (2)

The substrate inspecting section 56 calculates the resistance value Rx based on the resistance value Rx calculated by the resistance calculating section 55 on the basis of the first voltage Vp and the second voltage Vm measured by the voltage probes Pv1 and Pv2 And the substrate on which the conductor pattern M is formed is inspected. Specifically, the substrate inspection section 56 compares, for example, the resistance value Rx with the reference value stored in advance in the storage section, and when the resistance value Rx exceeds the reference value, .

Next, the operation of the substrate inspection apparatus 1 for executing the inspection method or the maintenance method of the inspection jig according to the embodiment of the present invention will be described. 2 is a flowchart showing an example of the operation of the substrate inspection apparatus 1 using the inspection method according to the embodiment of the present invention. Fig. 3 is an equivalent circuit for explaining an oxide film generated in the voltage probes Pv1 and Pv2. The equivalent circuit shown in Fig. 3 conceptually shows the contact portion when the oxide film is formed at the contact portion between the probe rear end X1 of the probe needle 31 and the electrode surface X2 of the connection electrode 32 Equivalent circuit.

As shown in Fig. 3, when an oxide film is formed at the contact portion between the rear end portion X1 and the electrode surface X2, the contact resistance Rc and the power source Vc) and the resistor Rvc and the series circuit of the diode Dc and the resistor Rdc generated by the rectification action of the oxide film are connected in parallel.

As described above, the rectifying action caused by the formation of the oxide film can not be canceled by the above-described equations (1) and (2), and therefore the measurement accuracy of the resistance value Rx is lowered. Further, since the oxide film is formed with the elapse of time afterwards, the resistance component generated by the oxide film is not included in the internal resistance Ri measured in advance. Therefore, the resistance calculating section 55 can not eliminate the influence of the oxide film even by the equation (2).

Thus, the substrate inspection apparatus 1 inspects whether or not there is a defect that an oxide film is formed on the voltage probes Pv1 and Pv2 by the following inspection method. Thus, if it is known that an oxide film is formed on the voltage probes Pv1 and Pv2, it is possible to remove the oxide film by cleaning.

Fig. 4 is a timing chart for explaining the inspection method and the maintenance method of the inspection jig. (a) shows a case where the voltage probes Pv1 and Pv2 are good (no oxide film is formed), (b) shows a case where the voltage probes Pv1 and Pv2 are defective (an oxide film is formed) have. The solid line indicates the potential of the probe needle 31 and the dotted line indicates the potential of the probe needle 41. [ Hereinafter, the flowchart shown in Fig. 2 will be described with reference to Fig.

The current probe Pc1 and the voltage probe Pv1 are brought into contact with the one end portion M1 of the conductor pattern M and the current probe Pc2 and the voltage probe Pv2 are brought into contact with the other end of the conductor pattern M M2.

The third voltage obtaining section 53 removes the constant current source 2 from the current probes Pc1 and Pc2 by turning off the switches A1, A2, B1 and B2, . The third voltage acquisition unit 53 turns on the switches C1 and C2 to connect the voltage probes Pv1 and Pv2 to the voltmeter 4 and adjusts the third voltage Vo by the voltmeter 4. [ (Step S1: timing T1). At this time, the electromotive force due to the Seebeck effect is measured as the third voltage Vo.

Next, the first voltage acquiring section 51 connects the constant current source 2 to the current probes Pc1 and Pc2 with the switches A1 and A2 turned on and the switches B1 and B2 off, The first current Ip flows from the circle 2 through the current probes Pc1 and Pc2 to the conductor pattern M (timing T2). Then, the first voltage acquisition section 51 turns on the switches C1 and C2 to measure the first voltage Vp by the voltmeter 4 (step S2: timing T3).

Next, the second voltage acquisition section 52 connects the constant current source 2 to the current probes Pc1 and Pc2 in the reverse direction by turning off the switches A1 and A2 and turning on the switches B1 and B2 And the second current Im in the direction opposite to the first current Ip flows from the constant current source 2 through the current probes Pc1 and Pc2 to the conductor pattern M (timing T4). Then, the second voltage acquisition section 52 turns on the switches C1 and C2 to measure the second voltage Vm by the voltmeter 4 (step S3: timing T5).

Next, the determining section 54 calculates the difference value Vd based on the following expressions (3), (4), and (5) (step S4).

Vd1 = Vp - Vo ... (3)

Vd2 = Vo - Vm ... (4)

Vd = | Vd1 - Vd2 | ... (5)

5 is an explanatory diagram for explaining the determination method by the determination unit 54. In FIG. (a) shows a case where the voltage probes Pv1 and Pv2 are good (no oxide film is formed), (b) shows a case where the voltage probes Pv1 and Pv2 are defective (an oxide film is formed) have. 5 shows a first point P1 represented by a first current Ip and a first voltage Vp and a second point P1 indicated by a first voltage Ip on a two-dimensional plane having a current I as a horizontal axis and a voltage V as a vertical axis, A second point P2 indicated by the current Im and the second voltage Vm and a third point P3 indicated by the current value zero and the third voltage Vo are plotted.

When the voltage probes Pv1 and Pv2 are good (no oxide film is formed), the first point P1, the second point P2 and the third point P3, as shown in Fig. 5 (a) Is arranged on the approximate straight line L. On the other hand, when the voltage probes Pv1 and Pv2 are defective (an oxide film is formed), as shown in Fig. 5 (b), the first point P1, the second point P2 and the third point P3 ) Are not arranged on a straight line.

Therefore, the judging section 54 confirms whether or not the first point P1, the second point P2 and the third point P3 are arranged on a substantially straight line, and judges whether or not the first point P1, It can be determined that the voltage probes Pv1 and Pv2 are in a defective state where the oxide film is formed when the two points P2 and P3 are not arranged on a straight line.

Here, when the absolute values of the first current Ip and the second current Im are equal to each other, when the first point P1, the second point P2, and the third point P3 are arranged on a straight line , The first difference value Vd1 and the second difference value Vd2 become equal as shown in Fig. 5 (a). If the first difference value Vd1 and the second difference value Vd2 are equal to each other, the differential value Vd becomes zero from the equation (5).

If the difference value Vd does not reach the determination threshold value Vth (step S5), the determination section 54 compares the difference value Vd with a predetermined determination threshold value Vth The voltage probes Pv1 and Pv2 are determined to be good products (step S6), and if the difference value Vd is not less than the judgment threshold value Vth (NO in step S5) It is determined to be defective (step S7). The determination threshold value Vth is appropriately set in consideration of the voltage measurement accuracy by the voltmeter 4 and the output current accuracy by the constant current source 2. [

Further, when it is judged that the voltage probes Pv1 and Pv2 are defective, it is considered that it is necessary to clean the voltage probes Pv1 and Pv2 to remove the oxide film. If the difference value Vd does not reach the determination threshold value Vth (step S5), the determination section 54 compares the difference value Vd with a predetermined determination threshold value Vth (Step S6). If the difference value Vd is not less than the determination threshold Vth (NO in step S5), it is determined that the cleaning jig including the voltage probes Pv1 and Pv2 is not required to be cleaned It may be determined that it is necessary to clean the voltage probes Pv1 and Pv2.

The determination unit 54 then displays the determination result on the display device (not shown) to determine whether the voltage probes Pv1 and Pv2 are defective or to clean the voltage probes Pv1 and Pv2 The user can clean the voltage probes Pv1 and Pv2 to remove the oxide film, thereby making it possible to solve the reduction in the resistance measurement accuracy by the oxide film and the reduction in the substrate inspection accuracy.

The absolute value of the first current Ip and the absolute value of the second current Im may not be equal to each other and the judging section 54 judges that the first point P1, the second point P2, It may be determined whether or not the voltage probes Pv1 and Pv2 are in a defective state in which an oxide film is formed based on whether or not the point P3 is arranged on a substantially straight line.

An example of a resistance measuring device using a four-terminal measuring method having a current probe Pc1 and a voltage probe Pv1 as a first probe and a current probe Pc2 and a voltage probe Pv2 as a second probe is shown in FIG. 6, a first probe Pr1 commonly used for current supply and voltage measurement is provided instead of the current probe Pc1 and the voltage probe Pv1, and the current probe Pc2 and the current probe Pc2 Instead of the voltage probe Pv2, the second probe Pr2 commonly used for current supply and voltage measurement may be provided.

The substrate inspecting apparatuses 1 and 1a may not be provided with the substrate inspecting unit 56 but may be configured as a resistance measuring apparatus such as a tester. The first voltage acquisition unit 51, the second voltage acquisition unit 52, the third voltage acquisition unit 53, and the determination unit 54 are embedded in the substrate inspection apparatuses 1, 1a and the resistance measurement apparatus The present invention is not limited thereto. For example, even if the voltage probes Pv1 and Pv2 and the inspection jig holding these probes can be detached from the apparatus main body and the probes and the inspection jig separated from the apparatus main body can be inspected by the inspection method described above do.

1, 1a: substrate inspection device (resistance measurement device)
2: constant current source
3: Amperemeter
4: Voltmeter
5:
11, 21, 31, 41: probe needle
12, 22, 32, 42: connecting electrodes
13, 23, 33, 43: Cable
51: first voltage obtaining section
52: second voltage obtaining section
53: Third voltage acquisition unit
54:
55:
56: Substrate inspector
A1, A2, B1, B2, C1, C2: switches
Im: second current
Ip: first current
M: Conductor pattern (conductor)
M1: one end
M2: the other end
P1: 1st point
P2: second point
P3: Third point
Pc1: current probe (first current probe)
Pc2: Current probe (second current probe)
Pr1: First probe
Pr2: second probe
Pv1: Voltage probe (first voltage probe)
Pv2: Voltage probe (second voltage probe)
Rx: resistance value
Vd: difference value
Vd1: first differential value
Vd2: second difference value
Vm: second voltage
Vo: third voltage
Vp: first voltage
Vth: Judgment threshold value

Claims (8)

A resistance measuring apparatus for measuring a resistance value of a conductor,
First and second probes for contacting the conductor,
A first voltage acquiring unit that acquires a first voltage generated in the conductor when a predetermined first current flows through the conductor by the first and second probes,
A second voltage acquisition unit that acquires a second voltage generated in the conductor when the second current flows in the direction opposite to the first current to the conductor by the first and second probes,
A third voltage acquisition unit that acquires a third voltage generated in the conductor by the first and second probes in a state in which the current is not caused to flow through the conductor by the first and second probes,
And a judging section for judging both the first and second probes based on the first, second and third voltages. The method according to claim 1,
Wherein the first probe comprises:
A first current probe for flowing a current to the conductor,
And a first voltage probe for detecting a voltage generated in the conductor by the current,
Wherein the second probe comprises:
A second current probe for passing a current through the conductor,
And a second voltage probe for detecting a voltage generated in the conductor by the current,
Wherein the first voltage acquisition unit acquires the first voltage measured by the first and second voltage probes when the first current flows between the first and second current probes,
Wherein the second voltage acquisition unit acquires the second voltage measured by the first and second voltage probes when the second current flows in a direction opposite to the first current between the first and second current probes and,
And the third voltage acquisition section acquires the third voltage measured by the first and second voltage probes in a state in which no current flows between the first and second current probes. 3. The method according to claim 1 or 2,
Wherein the determination unit determines a first point indicated by the first current and the first voltage and a second point indicated by the second current and the second voltage on a two- , A current value of zero, and a third point indicated by the third voltage are not arranged substantially on a straight line, it is determined that there is a defect with respect to the first and second probes. 4. The method according to any one of claims 1 to 3,
Wherein the first current and the second current have the same absolute value of the current value. 5. The method of claim 4,
Wherein the determination unit determines whether or not the difference between the first difference value that is the difference between the first voltage and the third voltage and the second difference value that is the difference between the second voltage and the third voltage exceeds a preset determination threshold value And judges that there is a defect with respect to the first and second probes. A resistance measuring apparatus according to any one of claims 1 to 5,
And a board inspecting section that inspects the board based on a voltage measured by the first and second probes using the wiring pattern formed on the board as the conductor. An inspection method for inspecting defects with respect to first and second probes to be brought into contact with conductors,
A first voltage acquiring step of bringing the first and second probes into contact with the conductor and acquiring a first voltage measured by the first and second probes when a predetermined first current flows through the conductor,
A second voltage acquisition step of acquiring a second voltage measured by the first and second probes when the second current flows in the direction opposite to the first current to the conductor by the first and second probes; ,
A third voltage acquisition step of acquiring a third voltage measured by the first and second probes in a state in which current is not caused to flow through the conductor by the first and second probes,
And a determination step of determining a part concerning the first and second voltage probes based on the first, second, and third voltages. 1. A maintenance method for a testing jig including first and second probes for contacting a conductor,
A first voltage acquiring step of bringing the first and second probes into contact with the conductor and acquiring a first voltage measured by the first and second probes when a predetermined first current flows through the conductor,
A second voltage acquisition step of acquiring a second voltage measured by the first and second probes when the second current flows in the direction opposite to the first current to the conductor by the first and second probes; ,
A third voltage acquisition step of acquiring a third voltage measured by the first and second probes in a state in which current is not caused to flow through the conductor by the first and second probes,
And a determining step of determining whether cleaning of the inspection jig is necessary based on the first, second, and third voltages.

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